Cavity filter for radio frequency wireless communication, tuning method of radio frequency filter, and antenna module

Abstract

The invention relates to a cavity filter for radio frequency wireless communication, a tuning method of a radio frequency filter and an antenna module. The present invention relates to an antenna module comprising: an antenna substrate comprising an antenna; the packaging substrate is combined with the radio frequency integrated circuit chip, and a signal transmission line for transmitting a signal of the radio frequency integrated circuit chip is formed on the packaging substrate; and an interconnection component which is located between the antenna substrate and the packaging substrate so as to connect the antenna substrate and the packaging substrate, and is provided with a slot through which a radio frequency signal can pass.

Description

Technical Field

[0001] The invention relates to a cavity filter for radio frequency wireless communication, a tuning method of the radio frequency filter and an antenna module.

[0002] The present invention claims priority based on Korean Patent Application No. 10-2022-0131030 filed on October 13, 2022, with the Korean Intellectual Property Office, and Korean Patent Application No. 10-2022-0132174 and No. 10-2022-0132342 filed on October 14, 2022 with the Korean Intellectual Property Office, and the contents of each are incorporated herein by reference. Background Art

[0003] As is known to all, a radio frequency (RF) filter is a component that allows only a required frequency band among multiple frequency components of an input wireless signal to pass and attenuates or reflects the remaining frequencies. It is an indispensable component for selecting the frequency used in a radio frequency wireless communication system.

[0004] The radio frequency (RF) filters described above are provided as individual products or accessories in passive circuits, active circuits, and systems. For all forms of matching circuits, the concept of frequency filtering is an indispensable component in any form and position.

[0005] In addition, radio frequency (RF) filters can be divided into cavity filters using waveguides, ceramic filters using ceramic materials, inductor-capacitor (LC) filters using inductor and capacitor elements, and surface acoustic wave (SAW) filters using surface elastomers, according to their implementation methods and materials.

[0006] In addition, for 5G base station systems, cavity filters are mainly used because high output power characteristics are very important. In the system described above, from an electrical point of view, they are required to have characteristics such as lower loss and higher frequency selectivity, while from a mechanical point of view, they are required to have characteristics such as smaller volume and higher temperature stability.

[0007] In addition, when manufacturing filters, it is necessary to perform a process of adjusting the characteristics that have errors compared to the design due to manufacturing tolerance and assembly tolerance in accordance with specifications through band tuning. The technology that realizes the tuning method is an important factor that determines the price competitiveness of the product when it is mass-produced.

[0008] In addition, the data traffic of wireless communications is increasing rapidly, and the electronic devices related to wireless communications are also becoming more and more high-performance. With the acceleration of the development of technologies related to autonomous driving, virtual reality (VR) / augmented reality (IR), Internet of Things (IoT), telemedicine, and ultra-high-resolution image transmission, which require the rapid transmission and reception of large amounts of data in wireless networks, there is an urgent need for 5G and millimeter wave band components and related technologies that can support these technologies.

[0009] In order to increase the amount of data transmitted by wireless communication, it is necessary to increase the frequency used by the wireless communication components of the wireless transceiver system and increase its bandwidth. In addition, in the wireless transceiver system, with the increase in the frequency band used, in order to increase the power of the transceiver signal and improve the signal-to-noise ratio, it is necessary to increase the number of antennas.

[0010] Therefore, in 5G, especially in millimeter wave band wireless transceiver systems, multiple antennas must be arranged in an array form and the antenna module must be constructed in a manner that can perform a beamforming function to manipulate the beam.

[0011] The antenna module or system for performing the function of forming and adjusting the electromagnetic wave beam is generally composed of a large number of antenna elements, various integrated circuit chips, the interconnection contact parts and control circuits. The antenna module as described above also includes a variety of circuits such as antenna elements with a multi-layer structure, the radio frequency signal transmission structure, a radio frequency integrated circuit (RFIC) chip that performs functions such as beamforming, an intermediate frequency distribution circuit, a local oscillator, the related control circuit and a bias circuit.

[0012] The antenna module or system as described above is a necessary component in a wireless communication system, and is required to have characteristics such as higher output power, lower signal loss attenuation, execution of functions such as beamforming, higher receiving sensitivity, lower price, excellent compatibility and scalability.

[0013] Furthermore, in ultra-high frequency bands such as 12-18 GHz, 24 GHz, 28 GHz, 39 GHz, and 60 GHz bands, radio frequency (RF) signals are easily absorbed and lost during signal transmission, which may lead to a sharp decline in wireless communication quality.

[0014] Therefore, for UHF band antenna modules, it is particularly necessary to develop technologies such as ensuring antenna gain, minimizing the connection loss between the antenna and the radio frequency integrated circuit (RFIC), minimizing signal interference caused by configuring complex signal lines, and ensuring the spacing between antenna arrays (approximately 0.5 times the signal wavelength).

[0015] In order to realize the above-mentioned characteristics, the antenna module for high frequency bands such as millimeter waves is composed of antenna arrays of multiple arrangement forms for improving output power and performing beamforming functions, and an integrated circuit chip for realizing the above functions.

[0016] Furthermore, as the frequency used in wireless communication systems increases, the size of antennas and the width of transmission lines of corresponding frequency bands will decrease, and the integration of circuits for realizing the functions will increase.

[0017] In order to form an antenna module by connecting a millimeter wave band antenna array to an integrated circuit chip, the antenna array and the integrated circuit chip may be located on the uppermost layer of the substrate. However, in the above method, as the number of antenna elements increases, the number of routes for connecting each antenna to the integrated circuit chip will also increase. Therefore, it is difficult to correctly perform functions such as beamforming by effectively forming an antenna array.

[0018] In order to solve the above-mentioned problems, in the existing Korean registered patent 1581225, a double-sided packaging method is adopted in which an antenna element is formed on the uppermost layer of a substrate, and integrated circuit chips and ball grid arrays (BGA) for connecting the integrated circuit chips are arranged on the opposite side of the substrate. At this time, in addition to the RF integrated circuit chip that is generally directly routed to the antenna, other integrated circuit chips such as those for control and power supply are connected to other packaging substrates through ball grid arrays (BGA).

[0019] That is, multiple antenna arrays are formed on the top layer of the packaging substrate, and a radio frequency integrated circuit (RFIC) is configured face-up on the opposite side of the packaging substrate, and then the input and output lines of the RFIC chip are correspondingly connected to each antenna element.

[0020] At this time, the feed line of the antenna is formed by utilizing the dielectric layer and the metal layer inside the substrate.

[0021] Because the antenna is integrally formed in the package substrate, the antenna module structure method described above is called a package antenna (antenna in package). The structure method described above can ensure that the length of the signal transmission line between the antenna and the radio frequency integrated circuit (RFIC) is short, thereby having the advantage of reducing ultra-high frequency signal loss.

[0022] In addition, because integrated circuit chips such as radio frequency integrated circuits (RFICs) are located on the opposite side of the antenna array on the substrate, it is not necessary to configure the control and power lines of the integrated circuit on the same side as the antenna, and they can be configured using metal lines inside the package.

[0023] In contrast, in order to connect additional passive components and connectors on the control and power lines routed to the integrated circuit chip, a ball grid array (BGA) is required to connect to other packaging substrates.

[0024] In addition, in the case of implementing a multi-layer antenna structure to improve antenna performance and in the case of implementing a multi-layer structure to avoid interference of control and power supply lines in the antenna signal transmission structure, the structure described above will become more complicated and wiring will become more difficult when configuring the antenna array, and the number of layers of the packaging substrate will also increase significantly. As described above, when the number of layers of the substrate increases, it will be more difficult to discharge heat generated from high-frequency components, etc. through the packaging substrate.

[0025] In addition, because the antenna and the radio frequency integrated circuit (RFIC) chip are both constructed on a packaging substrate, the characteristics can only be evaluated in the form of combining the characteristics of the radio frequency (RF) signal line of the radio frequency integrated circuit (RFIC) chip with the characteristics of the antenna. That is, it is impossible to evaluate the characteristics of the antenna array separately, or to evaluate the characteristics of the radio frequency (RF) signal line of the radio frequency integrated circuit (RFIC) chip. In addition, because it is impossible to independently evaluate the defects in the design and manufacturing process, etc., it is difficult to grasp and improve the defect rate and increase the yield. In addition, during the use of the antenna module, when a defect occurs in a high-output power component such as a radio frequency integrated circuit (RFIC) chip and its accessories and circuits, there is no method to detect the defective part by evaluating it.

[0026] In addition, since the routing part of the control / power supply line of the antenna and the RFIC chip must be formed at the same time as described above, there are limitations in using a material substrate that meets the antenna characteristics. In other words, in the case of a packaging substrate made of a material with low dielectric loss in the ultra-high frequency band, it is very expensive and has poor rigidity, and there are limitations in forming a multi-layer substrate.

[0027] Therefore, a method of soldering a substrate equipped with an antenna and a printed circuit board (PCB) package substrate equipped with a radio frequency integrated circuit chip after they are separately manufactured is proposed.

[0028] Korean registered patent 2145219 and others propose a method of electrically connecting a printed circuit board (PCB) packaging substrate configured with a semiconductor chip such as a radio frequency integrated circuit chip and forming related circuits and an antenna substrate forming an antenna array and a part of its feeding structure by welding in order to provide an antenna module that is beneficial for improving antenna performance or achieving miniaturization when constructing an antenna module.

[0029] Generally speaking, spherical bumps are used to electrically connect and fix feed metal vias for directly connecting to each antenna and transmitting RF signals and metal vias for directly connecting to an RF integrated circuit chip and transmitting RF signals.

[0030] As described above, the antenna substrate and the packaging substrate equipped with a radio frequency integrated circuit (RFIC) chip can be connected directly through bumps, or the connection can be rewired by additionally forming an adapter board in the middle. However, in order to connect between the substrates, it is necessary to use a structure that is electrically connected and fixed by spherical bumps.

[0031] At this time, as the number of antenna elements increases, the number of bumps used for signal transmission and substrate connection will also increase. In addition, the higher the operating frequency, the smaller the size of the required bumps will be.

[0032] The method of connecting the packaging substrate above the packaging substrate as described above is a package on package method. Since the antenna substrate and the packaging substrate of the RF integrated circuit chip are made separately, it has the advantage of using different materials on the antenna substrate and the packaging substrate.

[0033] Therefore, in order to improve characteristics such as antenna gain, the antenna and antenna feeding structure can be effectively designed into multiple layers, and there is also an advantage that the substrate material can be effectively selected.

[0034] However, not only the antenna signal line feeding vias but also the grounding vias need to be fully connected through the bumps. Therefore, additional complex manufacturing processes are required on the multiple bump connection parts as described above.

[0035] In addition, the bumps used for connecting the antenna signal line may cause impedance mismatch, which may further increase the loss of ultra-high frequency signals. In addition, in the case of severe heat generation of integrated circuit chips used for high output power, the welding structure between the various package substrates may bend due to the difference in thermal expansion coefficients between the substrates, which often causes problems such as welding of bumps falling off during long-term use.

[0036] Prior art literature

[0037] 1. Korean Patent Publication No. 10-2010-0102378 (published on September 24, 2010)

[0038] 2. Korean registered patent No. 10-1581225 (registered on December 23, 2015)

[0039] 3. Korean registered patent No. 10-2145219 (registered on August 11, 2020) Summary of the invention

[0040] The object of the present invention is to provide a cavity filter for radio frequency wireless communication, which is equipped with a plurality of resonant elements arranged inside a filter housing and a printed circuit board (PCB) cover covering the upper part of the filter housing, wherein the printed circuit board (PCB) cover is equipped with a plurality of electrode patterns and is equipped with corresponding electrodes corresponding to the upper part of the resonant elements, a ground electrode electrically connected to the housing, and a plurality of split electrodes located between the corresponding electrodes and the ground electrode, and by electrically connecting at least one of the plurality of split electrodes to the corresponding electrode and one of the ground electrodes, the frequency band of the cavity filter can be finely adjusted.

[0041] In addition, an object of the present invention is to provide a method for connecting a radio frequency filter including a filter housing, multiple resonant elements and a printed circuit board (PCB) cover to a frequency measuring device and measuring the frequency characteristics, wherein at least one of a corresponding electrode arranged in a central portion of a plurality of electrode patterns and a split electrode arranged in an outer direction thereof and a split electrode and a ground electrode arranged in an outer direction thereof are electrically connected through a connecting component, a split electrode connection cover and a tuning connection cover until a target frequency characteristic is measured, and a method for tuning a radio frequency filter can be provided in which the split electrodes formed on the printed circuit board (PCB) cover are electrically connected, thereby effectively tuning the frequency band characteristics of the radio frequency filter.

[0042] Furthermore, an object of the present invention is to provide an antenna module that can have high performance in an ultra-high frequency band above 10 GHz.

[0043] In addition, an object of the present invention is to provide a transmission structure that can reduce losses when transmitting signals between an antenna and a radio frequency integrated circuit (RFIC) by applying an interconnection component with a narrow slot structure between an antenna substrate with an antenna array and a packaging substrate with a radio frequency integrated circuit (RFIC) chip.

[0044] Furthermore, an object of the present invention is to provide an antenna module that can improve heat dissipation characteristics by combining a heat dissipation component with one or more of an antenna substrate, a packaging substrate or an interconnection component.

[0045] In addition, an object of the present invention is to provide an antenna module that can remove the bump welding structure used when connecting the antenna substrate and the packaging substrate by forming an interconnection component with a narrow groove structure between the antenna substrate and the packaging substrate, thereby improving the signal loss and poor bump connection problems caused when using the bumps.

[0046] At the same time, an object of the present invention is to provide an antenna module that can improve antenna performance by applying a dielectric material with less dielectric loss on an antenna substrate and a packaging substrate.

[0047] Another object of the present invention is to provide an antenna module that can more smoothly transmit ultra-high frequency signals by arranging a ground layer and a signal transmission line to face each other.

[0048] Furthermore, an object of the present invention is to provide an antenna module that can effectively configure the routing and configuration of a substrate by forming a groove space on the lower side of an interconnection component.

[0049] In addition, the present invention aims to provide an antenna module that can not only effectively dissipate heat but also minimize the weight of the device by forming the outer portion of the interconnection part with a metal material and forming the inner portion with a material having a lower density than the outer portion.

[0050] Also, an object of the present invention is to provide an antenna module which can be bonded after respectively checking characteristics of an antenna substrate and a package substrate by bonding an interconnection part having structures that can be aligned with each other to the antenna substrate and the package substrate.

[0051] The purposes of the embodiments of the present invention are not limited to the purposes mentioned in the above content, and a person having general knowledge in the technical field to which the present invention belongs will be able to further clearly understand other purposes not mentioned through the following description.

[0052] In one embodiment of the present invention, a cavity filter for radio frequency wireless communication can be provided, comprising: a filter housing, which is formed in the form of a box with an open upper portion, including a bottom plate and a side wall plate extending upward from the outer front end portion of the bottom plate; a plurality of resonant elements arranged on the bottom plate equipped on the filter housing; and a printed circuit board (PCB) cover, which covers the upper portion of the filter housing by being coupled to the side wall plate equipped on the filter housing, and a plurality of electrode patterns are formed on the upper portion of the resonant element in order to adjust the design frequency characteristics.

[0053] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication can be provided, wherein the printed circuit board (PCB) cover comprises: a lower substrate, which is arranged on the upper part of the filter housing; a first corresponding electrode, which is arranged on the lower side of the lower substrate and is separated from the resonant element; a first grounding electrode, which is arranged on the lower side of the lower substrate and is separated from the outer side of the first corresponding electrode, and is electrically connected to the filter housing; a second corresponding electrode, which is arranged on the upper side of the lower substrate and is electrically connected to the first corresponding electrode; a plurality of first split electrodes, which are arranged on the upper side of the lower substrate and are separated from the outer side of the second corresponding electrode; a second grounding electrode, which is arranged on the upper side of the lower substrate and is separated from the outer side of the plurality of first split electrodes, and is electrically connected to the first grounding electrode; an upper substrate, which is arranged on the upper part of the lower substrate and is arranged on the upper side of the second grounding electrode; a third grounding electrode, which is arranged on the upper side of the upper substrate and is electrically connected to the first grounding electrode and the second grounding electrode; and a cover, which is arranged on the upper part of the third grounding electrode and covers the structure.

[0054] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication may be provided, wherein the lower substrate and the upper substrate are integrally formed on the upper portion of the filter housing.

[0055] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication can be provided, wherein the printed circuit board (PCB) cover comprises: a multi-layer substrate, which is arranged on the upper part of the filter housing; a first corresponding electrode, which is arranged on the lower side of the multi-layer substrate and is separated from the resonant element; a first grounding electrode, which is arranged on the lower side of the multi-layer substrate and is separated from the outer side of the first corresponding electrode and is electrically connected to the filter housing; a second corresponding electrode, which is arranged on the inner layer of the multi-layer substrate and is electrically connected to the first corresponding electrode; and a plurality of first segmentation electrodes, which are arranged on the inner layer of the multi-layer substrate and are separated from the outer side of the second corresponding electrode. The structure comprises: a first grounding electrode, a second grounding electrode, which is formed on the inner layer of the multi-layer substrate and is separated from the outer side of the plurality of first split electrodes and is electrically connected to the first grounding electrode; a third corresponding electrode, which is arranged on the upper side of the multi-layer substrate and is electrically connected to the second corresponding electrode; a plurality of second split electrodes, which are formed on the upper side of the multi-layer substrate and are separated from the outer side of the third corresponding electrode and are electrically connected to the plurality of first split electrodes; a third grounding electrode, which is arranged on the upper side of the multi-layer substrate and is electrically connected to the first grounding electrode and the second grounding electrode; and a cover, which is arranged on the upper part of the third grounding electrode and covers the structure.

[0056] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication may be provided, wherein at least one of the plurality of first segmented electrodes is electrically connected to the second corresponding electrode.

[0057] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication may be provided, wherein at least one of the plurality of first segmented electrodes is electrically connected to the second ground electrode.

[0058] Furthermore, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication may be provided, wherein the plurality of first segmented electrodes are formed with different sizes in order to adjust the frequency band.

[0059] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication can be provided, wherein the printed circuit board (PCB) cover forms a first interval between the second corresponding electrode and the plurality of first split electrodes and a second interval between the plurality of first split electrodes and the second ground electrode with different sizes in order to adjust the movement amplitude of the frequency band.

[0060] Furthermore, in one embodiment of the present invention, there may be provided a cavity filter for radio frequency wireless communication, wherein the printed circuit board (PCB) cover is provided with a bridge pattern electrically floating by connecting between upper regions of the plurality of resonant elements.

[0061] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication may be provided, wherein at least one of the plurality of second segmented electrodes is electrically connected to the third corresponding electrode.

[0062] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication may be provided, wherein at least one of the plurality of second segmented electrodes is electrically connected to the third ground electrode.

[0063] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication may be provided, wherein the plurality of second divided electrodes are formed to have a size different from that of the first divided electrodes for connecting electrodes.

[0064] In addition, in one embodiment of the present invention, a cavity filter for radio frequency wireless communication can be provided, wherein the printed circuit board (PCB) cover forms a first interval between the second corresponding electrode and the plurality of first split electrodes and a second interval between the plurality of first split electrodes and the second ground electrode with a size different from the third interval between the third corresponding electrode and the plurality of second split electrodes and the fourth interval between the plurality of second split electrodes and the third ground electrode in order to adjust the shift amplitude of the frequency band.

[0065] In another embodiment of the present invention, a tuning method for a radio frequency filter may be provided, comprising: preparing a radio frequency filter including a filter housing, a plurality of resonant elements, and a printed circuit board (PCB) cover, wherein the printed circuit board (PCB) cover has a plurality of electrode patterns formed on the upper portion of the resonant element for adjusting the design frequency characteristics, and is provided with an openable protective cover; connecting the prepared radio frequency filter to a frequency measuring device; measuring the frequency characteristics of the radio frequency filter; checking whether a target frequency characteristic of the radio frequency filter is measured; if the target frequency characteristic is not measured, opening the protective cover and electrically connecting at least one of a corresponding electrode provided in a central portion of the plurality of electrode patterns and a split electrode provided in an outer direction thereof, and between the split electrode and a ground electrode provided in an outer direction thereof; re-measuring the frequency characteristics after re-covering the protective cover; repeating the steps of electrically connecting at least one and re-measuring the frequency characteristics until the target frequency characteristic is measured; and fixing the protective cover if the target frequency characteristic is measured.

[0066] In addition, in one embodiment of the present invention, a tuning method for a radio frequency filter may be provided, wherein the split electrode is split into a plurality of electrodes, and at least one of the split electrodes is electrically connected to the corresponding electrode via a first connecting component.

[0067] In addition, in one embodiment of the present invention, a tuning method of a radio frequency filter may be provided, wherein in the split electrodes, at least one of the split electrodes is electrically connected to the ground electrode via a second connecting component.

[0068] In addition, in one embodiment of the present invention, a tuning method for a radio frequency filter may be provided, wherein the split electrodes are formed into electrodes of different sizes in order to adjust the frequency band.

[0069] In addition, in one embodiment of the present invention, a tuning method for a radio frequency filter can be provided, wherein the multiple electrode patterns form a first interval between the split electrode and the corresponding electrode and a second interval between the split electrode and the ground electrode with different sizes in order to adjust the movement amplitude of the frequency band.

[0070] In another embodiment of the present invention, a tuning method for a radio frequency filter may be provided, comprising: preparing a radio frequency filter including a filter housing, a plurality of resonant elements, and a printed circuit board (PCB) cover, wherein the printed circuit board (PCB) cover has a plurality of electrode patterns formed on the upper portion of the resonant element for adjusting the design frequency characteristics and is provided with an openable protective cover; connecting the prepared radio frequency filter to a frequency measuring device; measuring the frequency characteristics of the radio frequency filter; checking whether a target frequency characteristic of the radio frequency filter is measured; removing the protective cover if the target frequency characteristic is not measured; installing a split electrode connection cover for electrically connecting at least one of a corresponding electrode provided in a central portion of the plurality of electrode patterns and a split electrode provided in an outer direction thereof and a split electrode and a ground electrode provided in an outer direction thereof; re-measuring the frequency characteristics of the radio frequency filter with the split electrode connection cover installed; repeating the steps of installing the split electrode connection cover and re-measuring the frequency characteristics until the target frequency characteristics are measured; and fixing the split electrode connection cover if the target frequency characteristics are measured.

[0071] In addition, in another aspect of the present invention, a tuning method for a radio frequency filter may be provided, wherein the split electrode is split into a plurality of parts, and at least one of the split parts is electrically connected to the corresponding electrode via a first connecting portion provided on the split electrode connection cover.

[0072] In addition, in another embodiment of the present invention, a tuning method of a radio frequency filter may be provided, wherein in the split electrode, at least one of the split electrodes is electrically connected to the ground electrode via a second connecting portion provided on the split electrode connection cover.

[0073] In addition, in another embodiment of the present invention, a tuning method for a radio frequency filter may be provided, wherein the split electrodes are formed into electrodes of different sizes in order to adjust the frequency band.

[0074] In addition, in another embodiment of the present invention, a tuning method for a radio frequency filter can be provided, wherein the multiple electrode patterns form a first interval between the split electrode and the corresponding electrode and a second interval between the split electrode and the ground electrode with different sizes in order to adjust the movement amplitude of the frequency band.

[0075] In another embodiment of the present invention, a tuning method for a radio frequency filter may be provided, comprising: preparing a radio frequency filter including a filter housing, a plurality of resonant elements and a printed circuit board (PCB) cover, wherein the printed circuit board (PCB) cover has a plurality of electrode patterns formed on the upper portion of the resonant element for adjusting the design frequency characteristics and is provided with a tuning connection cover; connecting the prepared radio frequency filter to a frequency measuring device; measuring the frequency characteristics of the radio frequency filter; checking whether a target frequency characteristic of the radio frequency filter is measured; if the target frequency characteristic is not measured, electrically connecting at least one of a corresponding electrode provided in a central portion of the plurality of electrode patterns and a split electrode provided in an outer direction thereof and a split electrode and a ground electrode provided in an outer direction thereof by adjusting the position of a connection portion of the tuning connection cover; re-measuring the frequency characteristics of the radio frequency filter for which the position of the connection portion of the tuning connection cover has been adjusted; and repeating the steps of adjusting the position of the connection portion of the tuning connection cover and re-measuring the frequency characteristics until the target frequency characteristic is measured.

[0076] In addition, in another aspect of the present invention, a tuning method for a radio frequency filter can be provided, wherein the split electrode is split into multiple pieces, and at least one of the split pieces is electrically connected to the corresponding electrode by adjusting the position of a first tuning connection portion provided on the tuning connection cover.

[0077] In addition, in another embodiment of the present invention, a tuning method for a radio frequency filter may be provided, wherein in the split electrode, at least one of the split electrodes is electrically connected to the ground electrode by adjusting the position of a second tuning connection portion provided on the tuning connection cover.

[0078] In addition, in another aspect of the present invention, a tuning method for a radio frequency filter may be provided, wherein the split electrodes are formed into electrodes of different sizes in order to adjust the frequency band.

[0079] In addition, in another embodiment of the present invention, a tuning method for a radio frequency filter can be provided, wherein the multiple electrode patterns form a first interval between the split electrode and the corresponding electrode and a second interval between the split electrode and the ground electrode in different shapes in order to adjust the movement amplitude of the frequency band.

[0080] In another embodiment of the present invention, it is characterized in that: the antenna module includes: an antenna substrate 100, including an antenna 110; a packaging substrate 200, which is combined with a radio frequency integrated circuit chip 210 and forms a signal transmission line 220 for transmitting the signal of the radio frequency integrated circuit chip; and an interconnection component 300, which is located between the antenna substrate 100 and the packaging substrate 200, thereby connecting the antenna substrate 100 and the packaging substrate 200, and forming a narrow slot 310 for allowing the radio frequency signal to pass through.

[0081] In addition, in another embodiment of the present invention, it is characterized in that: a plurality of antennas 110 are arranged on the antenna substrate 100, and the plurality of antennas are arranged at a certain distance to form an antenna array.

[0082] In addition, in another embodiment of the present invention, it is characterized in that: the antenna substrate 100 includes: a first shielding portion 120 configured at the edge of the slot 310; the packaging substrate 200 includes: a second shielding portion 230 configured at the edge of the slot 310.

[0083] In addition, in another embodiment of the present invention, it is characterized in that: a first RF signal transmission part 101 is formed in the center by arranging a plurality of the first shielding parts 120 in a form surrounding the narrow slot 310, and a second RF signal transmission part 201 is formed in the center by arranging a plurality of the second shielding parts 230 in a form surrounding the narrow slot 310.

[0084] In addition, in another embodiment of the present invention, it is characterized in that: the second shielding part 230 includes: a plurality of ground layers 231, which are arranged in intervals; and a plurality of shielding vias 232, which electrically connect the ground layers 231; and a certain ground layer selected from the plurality of ground layers 231 is arranged opposite to the narrow slot 310 in a manner with the signal transmission line 220 in between.

[0085] In addition, in another embodiment of the present invention, it is characterized in that: the antenna substrate 100 includes: a first coupling portion 130, located between the antenna 110 and the slot 310, so as to transmit the radio frequency signal; the packaging substrate 200 includes: a second coupling portion 240, one side of which is connected to the signal transmission line 220 and the other side is located at a position in contact with the slot 310, so as to transmit the radio frequency signal.

[0086] In addition, in another embodiment of the present invention, the first coupling portion 131 and the second coupling portion 241 are disposed opposite to each other with the narrow slot 310 interposed therebetween.

[0087] In addition, in another embodiment of the present invention, it is characterized in that: the interconnection component 300 includes: a groove space 320 formed on the lower side facing the packaging substrate 200.

[0088] In addition, in another embodiment of the present invention, it is characterized in that the outer side of the interconnection component 300 is formed by a conductor, and the inside is a dielectric.

[0089] In addition, in another embodiment of the present invention, it is characterized in that: the interconnection component 300 includes: a slot component 330, which is provided on the slot 310; and the slot component 330 is a dielectric.

[0090] In addition, in another embodiment of the present invention, it is characterized by comprising: a heat dissipation component 400 coupled to one or more side surfaces of the antenna substrate 100 , the packaging substrate 200 and the interconnection component 300 .

[0091] In addition, in another embodiment of the present invention, it is characterized in that: the interconnection component 300 includes: a first interconnection component 300A, which is combined with the lower side of the antenna substrate 100; and a second interconnection component 300B, which is combined with the upper side of the packaging substrate 200; and an alignment portion is formed on the first interconnection component 300A and the second interconnection component 300B to align the positions fastened to each other.

[0092] In addition, in another embodiment of the present invention, it is characterized in that: the interconnection component 300 includes: a ridge forming a protrusion 340 protruding toward the narrow groove 310.

[0093] Furthermore, in another embodiment of the present invention, it is characterized in that: the ridge-forming protrusions 340 are formed in two or more numbers on the upper side and the lower side of the interconnection component 300, and each ridge-forming protrusion is formed in a different shape.

[0094] In addition, in another embodiment of the present invention, it is characterized in that: the ridge forming protrusion 340 includes: a first ridge forming protrusion 341 formed on the left side of the narrow groove 310; and a second ridge forming protrusion 342 formed on the right side of the narrow groove 310.

[0095] In addition, in another embodiment of the present invention, it is characterized in that: the first ridge forming protrusion 341 includes: a 1-1 ridge forming protrusion and a 1-2 ridge forming protrusion, which are formed in different shapes on the upper side and the lower side respectively.

[0096] In addition, in another embodiment of the present invention, it is characterized in that: the second ridge forming protrusion 342 includes: a 2-1 ridge forming protrusion and a 2-2 ridge forming protrusion, which are formed in different shapes on the upper side and the lower side respectively.

[0097] The present invention is equipped with a plurality of resonant elements arranged inside a filter housing and a printed circuit board (PCB) cover covering the upper part of the filter housing. The printed circuit board (PCB) cover is equipped with a plurality of electrode patterns and is equipped with corresponding electrodes corresponding to the upper part of the resonant elements, a ground electrode electrically connected to the housing, and a plurality of split electrodes located between the corresponding electrodes and the ground electrode. By electrically connecting at least one of the plurality of split electrodes to the corresponding electrode and one of the ground electrodes, the frequency band of the cavity filter can be finely adjusted.

[0098] In addition, the present invention connects a radio frequency filter including a filter housing, multiple resonant elements and a printed circuit board (PCB) cover to a frequency measuring device and measures the frequency characteristics, wherein the split electrodes formed on the printed circuit board (PCB) cover can be electrically connected by electrically connecting at least one of a corresponding electrode arranged in the central part of a plurality of electrode patterns and a split electrode arranged in its outer direction and between the split electrode and a ground electrode arranged in its outer direction through a connecting component, a split electrode connection cover and a tuning connection cover until the target frequency characteristics are measured, thereby effectively tuning the frequency band characteristics of the radio frequency filter.

[0099] The antenna module of the present invention connects the antenna substrate and the packaging substrate by forming an interconnection component with a narrow slot for radio frequency signals to pass through, so it has the advantage of being able to transmit signals with lower loss when transmitting signals between the antenna and the signal transmission line of the radio frequency integrated circuit (RFIC) chip.

[0100] The antenna module of the present invention connects the antenna substrate and the packaging substrate by forming an interconnection component with a narrow slot for the radio frequency signal to pass through, thereby having the advantage of omitting the packaging project of manufacturing multiple fine electrical connection structures between the antenna and the signal transmission line of the radio frequency integrated circuit chip.

[0101] The antenna module of the present invention connects the antenna substrate and the packaging substrate by forming an interconnection component with a narrow slot for radio frequency signals to pass through, thereby realizing the antenna module, so that the antenna substrate and the packaging substrate can be respectively constituted, and therefore have the advantage of being able to use substrate materials that are more suitable for their respective characteristics.

[0102] The antenna module of the present invention connects the antenna substrate and the packaging substrate by means of an interconnection component having a slot through which radio frequency signals can pass, thereby having the advantage of preventing the electrical connection structure between the antenna substrate and the packaging substrate from being separated due to excessive heat generation.

[0103] The antenna module of the present invention connects the antenna substrate and the packaging substrate through interconnection components composed of conductors (metal layers) on all surfaces or outer sides, so it has the advantage of being able to discharge heat more smoothly with the help of conductors, i.e., interconnection components, thereby further improving the heat dissipation characteristics.

[0104] The antenna module of the present invention connects the antenna substrate and the packaging substrate by forming an interconnection component with a narrow slot for the radio frequency signal to pass through. Therefore, it has the advantage of being able to detect defects and improve the yield by measuring and analyzing the characteristics and defects of the antenna or measuring and analyzing the characteristics and defects of the packaging substrate and each radio frequency integrated circuit chip and each signal transmission line connected thereto.

[0105] In addition, by configuring the signal transmission line of the RF integrated circuit chip inside the packaging substrate and configuring the ground layer to face one side of the packaging substrate to reflect the RF signal, it has the advantage of further improving the signal transmission efficiency.

[0106] Furthermore, by arranging the coupling portion of the antenna substrate and the coupling portion of the packaging substrate to face each other inside the interconnection component formed with the slot, electromagnetic coupling is strengthened and the radio frequency signal is transmitted, thereby having the advantage of improving signal transmission efficiency.

[0107] In addition, by forming a groove space on the interconnection component, the radio frequency integrated circuit (RFIC) chip, other integrated circuit (IC) chips, passive components and connectors coupled to the packaging substrate can be configured on the surface coupled to the interconnection component 300, thereby having the advantage of effectively constituting the routing and configuration of the packaging substrate.

[0108] Furthermore, the slot formed on the interconnection feature is filled with a dielectric having a relatively high dielectric constant, thereby having the advantage that the size of the slot can be minimized.

[0109] At the same time, a heat dissipation component with a heat sink can be combined with the edge of the antenna module, so it has the advantage of being able to discharge heat more smoothly and thereby prevent the output power from decreasing and the substrate from being deformed.

[0110] Furthermore, the interconnection member formed with the alignment portion is bonded to the antenna substrate and the package substrate, respectively, and thus there is an advantage that the antenna substrate and the package substrate having normal characteristics can be selected and bonded after the characteristics of the antenna substrate and the package substrate are respectively inspected. BRIEF DESCRIPTION OF THE DRAWINGS

[0111] Figure 1 The diagram is a schematic diagram illustrating a cavity filter for radio frequency wireless communication according to an embodiment of the present invention.

[0112] Figures 2 to 5 The diagram is a schematic diagram illustrating the structure of each layer of a cavity filter for radio frequency wireless communication according to an embodiment of the present invention.

[0113] Figures 6 to 16 The figure is a schematic diagram illustrating various embodiments of a cavity filter for radio frequency wireless communication according to one embodiment of the present invention.

[0114] Fig.17 as well as Fig.18 It is a schematic diagram illustrating a cavity filter for radio frequency wireless communication according to another embodiment of the present invention.

[0115] Fig.19 is a flow chart illustrating a process of tuning a radio frequency filter according to a first embodiment of the present invention.

[0116] Figures 20 to 28 is a schematic diagram illustrating a radio frequency filter tuned according to a first embodiment of the present invention.

[0117] Fig.29 is a flow chart illustrating a process of tuning a radio frequency filter according to a second embodiment of the present invention.

[0118] Fig.30 as well as Fig.31 is a schematic diagram illustrating a radio frequency filter tuned according to a second embodiment of the present invention.

[0119] Fig.32 is a flow chart illustrating a process of tuning a radio frequency filter according to a third embodiment of the present invention.

[0120] Figure 33 to Figure 36 is a schematic diagram illustrating a radio frequency filter tuned according to a third embodiment of the present invention.

[0121] Fig.37 It is a schematic diagram illustrating a first embodiment of the antenna module of the present invention.

[0122] Fig.38 (a) and (b) are schematic diagrams illustrating the antenna substrate and interconnection components of the antenna module of the present invention.

[0123] Fig.39 It is a schematic diagram illustrating a second embodiment of the antenna module of the present invention.

[0124] Fig.40 It is a schematic diagram illustrating a third embodiment of the antenna module of the present invention.

[0125] Fig.41 It is a schematic diagram illustrating a fourth embodiment of the antenna module of the present invention.

[0126] Fig.42 (a) and (b) are schematic diagrams illustrating a fifth embodiment of the antenna module of the present invention.

[0127] Fig.43 FIG. 6 is a schematic diagram illustrating a sixth embodiment of an antenna module according to the present invention.

[0128] Fig.44 FIG. 1 is a schematic diagram illustrating a seventh embodiment of an antenna module according to the present invention.

[0129] Fig.45 is a schematic diagram illustrating an eighth embodiment of the antenna module of the present invention.

[0130] Fig.46 as well as Fig.47 is a schematic diagram for explaining a slot structure formed on an interconnection component of an antenna module of the present invention. DETAILED DESCRIPTION

[0131] The advantages, features and methods of achieving the embodiments of the present invention will be further clarified by the subsequent embodiments described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed in the following content, but can be implemented in a variety of different forms. These embodiments are only for the purpose of more fully disclosing the present invention and more fully introducing the scope of the present invention to those with general knowledge of the technical field to which the present invention belongs. The present invention should only be defined by the scope of the claims. Throughout the specification, the same reference numerals represent the same components.

[0132] In the process of describing the embodiments of the present invention, when it is determined that the specific description of a known function or structure may make the gist of the present invention unclear, the detailed description related to it will be omitted. In addition, the terms used subsequently are defined on the premise of considering the functions in the embodiments of the present invention, and may change according to the intentions or practices of the users and users. Therefore, they should be defined based on all the contents in this specification.

[0133] Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0134] Figure 1is a schematic diagram illustrating a cavity filter for radio frequency wireless communication according to one embodiment of the present invention. Figures 2 to 5 is a schematic diagram illustrating the structure of each layer of a cavity filter for radio frequency wireless communication according to one embodiment of the present invention, and Figures 6 to 16 The figure is a schematic diagram illustrating various embodiments of a cavity filter for radio frequency wireless communication according to one embodiment of the present invention.

[0135] See also Figures 1 to 16 According to one embodiment of the present invention, a cavity filter for radio frequency wireless communication may include a filter housing 100, a plurality of resonant elements 200, and a printed circuit board (PCB) cover 300A.

[0136] The filter housing 100 is formed in the form of a box with an open upper portion, and may include a bottom plate 110 and a side wall plate 120 extending upward from an outer front end portion of the bottom plate 110 .

[0137] The filter housing 100 as described above may be provided with a partition plate 130 corresponding to the arrangement of the plurality of resonant elements 200 , and partitioning protrusions 140 may be formed on the inner side of the side wall plate 120 of each space for configuring the plurality of resonant elements 200 and on the outer side of the partition plate 130 .

[0138] The filter housing 100 can divide the space by the partition plate 130 and the dividing protrusion 140, and a resonant element 200 can be respectively configured in each space, so that the resonant frequency and the passband of the filter can be determined according to the size of each space and the configured resonant element 200.

[0139] In addition, the filter housing 100 can act as a filter that allows only electromagnetic waves of a certain frequency band to pass through by allowing electromagnetic waves to move from the input port 10 to the output port 20 in adjacent spaces connected by the partition plate 130 and the dividing protrusion 140. The electromagnetic wave signal can be input from the position of the input port 10 and output from the position of the output port 20 after moving through the shear space of the side wall plate 120 and the partition plate 130.

[0140] In addition, in one embodiment of the present invention, the input port 10 is located at the upper left side, and after the input electromagnetic wave signal moves from the upper left side to the upper right side, it moves from the upper right side to the lower right side, and then moves from the lower right side to the lower left side and is output through the output port 20 located at the lower left side in the clockwise direction. However, the positions of the input port 10 and the output port 20 may also be configured in a state where one embodiment of the present invention is reversed upside down or flipped left to right.

[0141] A plurality of resonant elements 200 are arranged on a base plate 110 provided on a filter housing 100 , and can be made of, for example, metal materials, and include a resonant element head 210 having a relatively large diameter and a cylindrical column 220 extending from the lower portion of the resonant element head 210 and mounted on the base plate 110 .

[0142] In the embodiment of the present invention, the case where six resonant elements 200 as described above are provided is used as an example for description. However, more than six or less than six resonant elements 200 may be provided according to the required electrical characteristics of the filter.

[0143] A printed circuit board (PCB) cover 300A covers the upper portion of the filter housing 100 by being coupled to a side wall plate 120 provided on the filter housing 100, and a plurality of electrode patterns may be formed on the upper portion of the plurality of resonant elements 200 in order to adjust the design frequency characteristics, and may include a lower substrate 310a, a first corresponding electrode 320a, a first ground electrode 330a, a second corresponding electrode 340a, a plurality of first segmented electrodes 350a, a second ground electrode 360a, an upper substrate 370a, a third ground electrode 380a, and a cover 390a, etc.

[0144] In which, in the area where the input port 10 and the output port 20 connected to the external terminal are located, the first corresponding electrode 320a is arranged at a predetermined interval on the upper part of the resonant element 200, and the first corresponding electrode 320a can be electrically connected to the input port 10 or the output port 20 through a plurality of first connection vias 321a.

[0145] For example, see Figures 5 and 6 The lower substrate 310a can be arranged on the upper part of the filter housing 100, the first corresponding electrode 320a can be formed on the lower side of the lower substrate 310a and separated from the resonant element 200, the first grounding electrode 330a can be arranged on the lower side of the lower substrate 310a and separated from the outer direction of the first corresponding electrode 320a and electrically connected to the filter housing 100, and the second corresponding electrode 340a can be arranged on the upper side of the lower substrate 310a and electrically connected to the first corresponding electrode 320a.

[0146] Among them, the first corresponding electrode 320a can be equipped with a size corresponding to the resonance element head 210 and a position separated by a predetermined interval from the resonance element head 210 to the upper part, and the second corresponding electrode 340a can be located on the upper surface of the lower substrate 310a, and the second corresponding electrode 340a can be electrically connected to the first corresponding electrode 320a through one or more first connecting vias 321a.

[0147] A plurality of first split electrodes 350a may be formed on the upper side of the lower substrate 310a and spaced apart from the outer side of the second corresponding electrode 340a. A second grounding electrode 360a may be formed on the upper side of the lower substrate 310a and spaced apart from the outer side of the plurality of first split electrodes 350a and electrically connected to the first grounding electrode 330a.

[0148] Among them, multiple first split electrodes 350a can be formed at a first interval 410 in the outer direction of the second corresponding electrode 340a, and can be formed at a second interval 420 in the inner direction of the second grounding electrode 360a. The first grounding electrode 330a and the second grounding electrode 360a can be electrically connected using the second connecting via 331a.

[0149] The upper substrate 370a can be arranged on the upper part of the lower substrate 310a and on the upper side of the second grounding electrode 360a, the third grounding electrode 380a can be arranged on the upper side of the upper substrate 370a and electrically connected to the first grounding electrode 330a and the second grounding electrode 360a, and the cover 390a can be arranged on the upper part of the third grounding electrode 380a and cover the structure, thereby playing a shielding role to prevent internal electromagnetic waves from leaking to the outside.

[0150] The lower substrate 310 a and the upper substrate 370 a as described above may be integrally formed on the upper portion of the filter case 100 .

[0151] In addition, the first connection vias 321a and the second connection vias 331a provided on the printed circuit board (PCB) cover 300A can electrically connect different electrode layers while playing a shielding role. In particular, the plurality of second connection vias 331a can be arranged at a certain interval, thereby playing a role in shielding electromagnetic waves.

[0152] The third ground electrode 380a may be electrically connected to the first ground electrode 330a and the second ground electrode 360a through the second connection via 331a. Figure 7 as well as Fig. 9 As shown, the inner space protected by the cover 390a may be provided with a first connecting member 400A for connecting at least one of the plurality of first segmented electrodes 350a to the second corresponding electrode 340a, and as shown in FIG. Figure 8 as well as Fig.10 As shown, a second connection member 400B for connecting at least one of the plurality of first split electrodes 30 a to the second ground electrode 360 ​​may be further provided.

[0153] For example, at least one of the multiple first split electrodes 350a can be electrically connected to the second corresponding electrode 340a, and can be split at a uniform angle (size) or at the same angle (size), and at least one of them can be electrically connected to the second corresponding electrode 340a at a first interval 420 in the inner direction through the first connecting part 400A.

[0154] In addition, at least one of the plurality of first split electrodes 350a may be electrically connected to the second ground electrode 360a, and at least one of the split electrodes may be electrically connected to the second ground electrode 360a at a second interval 420 in the outward direction through the second connecting member 400B.

[0155] The first connecting component 400A and the second connecting component 400B as described above can use conductive materials to connect the respective electrodes, for example, a metal plate or metal wire including at least one selected from copper, aluminum and stainless steel (SUS), graphene and carbon nanotube (CNT, carbon nano-tube), etc., and can be composed in the form of conductive tape and conductive paste.

[0156] in, Fig.11 This is a graph illustrating the result of connecting four of the multiple first split electrodes 350a to the second corresponding electrodes 340a respectively through the first connecting component 400A to thereby adjust the frequency band characteristics of the filter. It is the result of confirming the frequency band characteristics of the filter through electromagnetic simulation. Blue represents the pass characteristic, and red represents the reflection characteristic. It can be confirmed that the frequency characteristics of the filter can be finely adjusted according to the states of connecting 0, 1, 2, 3 and 4.

[0157] also, Fig.12 This is a graph illustrating the result of connecting four of the plurality of first segmented electrodes 350a to the second ground electrode 360a via the second connecting component 400B to thereby adjust the frequency band characteristics of the filter. It is the result of confirming the frequency band characteristics of the filter through electromagnetic simulation. Blue represents the pass characteristic, and red represents the reflection characteristic. It can be confirmed that the frequency characteristics of the filter can be finely adjusted according to the states of connecting 0, 1, 2, 3, and 4 electrodes.

[0158] In addition, the frequency characteristics of the filter, such as the size of the resonator, the size of the resonance space in which the resonator is located, the interval between the related resonator and the corresponding pattern, and the interval between the corresponding electrode and the ground, can be expressed by design variables. These can be manufactured according to the design values ​​and thereby determine the characteristics of the filter. However, since tolerances inevitably occur in the physical manufacturing values ​​and the assembly process, it is necessary to have elements that can finely adjust the frequency characteristics.

[0159] Therefore, if Fig.13 As shown, at least one of the plurality of first split electrodes 350a can be electrically connected to the second corresponding electrode 340a by using the first connecting member 400A and the second connecting member 400B, or at least one of the plurality of first split electrodes 350a can be electrically connected to the second grounding electrode 360a, so as to finely adjust the frequency band characteristics. According to the design and the degree of tolerance, when the frequency characteristics are accurate, the first split electrode 350a may not be electrically connected to the second corresponding electrode 340a or the second grounding electrode 360a.

[0160] In addition, the first segmented electrodes 350a may be segmented into electrodes of different sizes in order to adjust the frequency band, such as Fig.14 As shown, at least one electrode divided into different angles (sizes) can be electrically connected to the second corresponding electrode 340a, or electrically connected to the second ground electrode 360a. When an electrode with a relatively large size (area) is connected, the frequency band can be moved relatively largely, and when an electrode with a relatively small size (area) is connected, the frequency band can be moved relatively finely.

[0161] In addition, multiple first segmented electrodes 350a can adjust the number of electrodes equipped to adjust the movement amplitude of the frequency band. After being divided into different numbers such as 2, 3, 4, 5 and 6 according to the design and the movement amplitude of the frequency band to be adjusted, at least one of the segmented electrodes can be electrically connected to the second corresponding electrode 340a, or electrically connected to the second ground electrode 360a.

[0162] In this case, at least one of the plurality of first split electrodes 350a may be connected to the second corresponding electrode 340a via the first connecting component 400A, and at least one of the plurality of first split electrodes 350a may be connected to the second ground electrode 360a via the second connecting component 400B.

[0163] As described above, in order to adjust the movement amplitude of the frequency band, the first interval 410 between the second corresponding electrode 340a and the plurality of first split electrodes 350a and the second interval 420 between the plurality of first split electrodes 350a and the second ground electrode 360a can be formed in different sizes, so that when a relatively wide interval is connected, the frequency band can be moved relatively largely, and when a relatively narrow interval is connected, the frequency band can be moved relatively finely.

[0164] In addition, in the printed circuit board (PCB) cover 300A as described above, a bridge pattern 500 electrically floating by connecting between upper regions of a plurality of resonant elements 200 may be provided, and electrical characteristics may be improved by electrically connecting a corresponding electrode on a portion of a layer of the printed circuit board (PCB) cover 300A (e.g., a layer provided with the second corresponding electrode 340a, etc.) and a ground electrode.

[0165] For example, the bridge pattern 500 can be coupled to the resonant elements 200 in other spaces through the second corresponding electrode 340 a , thereby forming a transmission zero point in the passband of the filter and thereby improving the skirt characteristics of the filter.

[0166] In addition, the printed circuit board (PCB) cover 300A as described above is Fig.15 As shown, at least one of the plurality of split electrodes 350a may be electrically connected to the second ground electrode 360a by providing a second connection member 400B installed at a lower portion of the cover 390a.

[0167] In addition, the printed circuit board (PCB) cover 300A as described above is Fig.16 As shown, at least one of the plurality of segmented electrodes 350a can be electrically connected to the second corresponding electrode 340a by providing an insulator 391a and a connecting member 392a installed at the lower portion of the cover 390a. At this time, as shown in the figure, an insulator 391a needs to be provided between the cover 389a and the connecting member 392a.

[0168] In addition, if Fig.15 as well as Fig.16 The cover and the connecting member shown may be constructed in the same manner or in different manners.

[0169] Therefore, in one embodiment of the present invention, a plurality of resonant elements are arranged inside a filter housing and a printed circuit board (PCB) cover covering the upper portion of the filter housing is provided, a plurality of electrode patterns are provided on the printed circuit board (PCB) cover and corresponding electrodes corresponding to the upper portion of the resonant elements, a ground electrode electrically connected to the housing, and a plurality of split electrodes located between the corresponding electrodes and the ground electrode are provided, and by electrically connecting at least one of the plurality of split electrodes to the corresponding electrode and one of the ground electrodes, the frequency band of the cavity filter can be finely adjusted.

[0170] Fig.17 as well as Fig.18 It is a schematic diagram illustrating a cavity filter for radio frequency wireless communication according to another embodiment of the present invention.

[0171] See also Fig.17 as well as Fig.18 According to another embodiment of the present invention, a cavity filter for radio frequency wireless communication may include a filter housing 100, a plurality of resonant elements 200, and a printed circuit board (PCB) cover 300B. The filter housing 100 and the plurality of resonant elements 200 included in another embodiment of the present invention are the same as the filter housing 100 and the plurality of resonant elements 200 included in one embodiment of the present invention as described above, and therefore, detailed description thereof will be omitted below.

[0172] A printed circuit board (PCB) cover 300B covers the upper portion of the filter housing 100 by being coupled to a side wall plate 120 provided on the filter housing 100, and a plurality of electrode patterns may be formed on the upper portion of the plurality of resonant elements 200 in order to adjust the design frequency characteristics, and may include a multilayer substrate 310b, a first corresponding electrode 320b, a first ground electrode 330b, a second corresponding electrode 340b, a plurality of first segmented electrodes 350b, a second ground electrode 360b, a third corresponding electrode 371b, a second segmented electrode 372b, a third ground electrode 380b, and a cover 390b.

[0173] In which, in the area where the input port 10 and the output port 20 connected to the external terminal are located, the first corresponding electrode 320b is arranged at a predetermined interval on the upper part of the resonant element 200, and the first corresponding electrode 320b can be electrically connected to the input port 10 or the output port 20 through a plurality of first connection vias 321b.

[0174] For example, the multi-layer substrate 310b can be arranged on the upper part of the filter housing 110, the first corresponding electrode 320b can be arranged on the lower side of the multi-layer substrate 310b and separated from the resonance element 200, the first grounding electrode 330b can be arranged on the lower side of the multi-layer substrate 310b and separated from the outer direction of the first corresponding electrode 320b and electrically connected to the filter housing 100, and the second corresponding electrode 340b can be arranged on the inner layer of the multi-layer substrate and electrically connected to the first corresponding electrode.

[0175] Among them, the first corresponding electrode 320b can be configured in a size corresponding to the resonance element head 210 and at a position separated from the resonance element head 210 by a predetermined interval upward, and the second corresponding electrode 340b can be configured in a size relatively smaller than the first corresponding electrode 320b and at a position separated from the first corresponding electrode 320b by a predetermined interval upward inside the multi-layer substrate 310b, the first grounding electrode 330b can be constructed in a form separated from and surrounding the outer direction of the first corresponding electrode 320b, and the second corresponding electrode 340b can be electrically connected to the first corresponding electrode 320b through at least one first connecting via 321b.

[0176] Multiple first split electrodes 350b can be formed in the inner layer of the multi-layer substrate 310b and are separated from the outer side of the second corresponding electrode 340b. The second grounding electrode 360b can be configured in the inner layer of the multi-layer substrate 310b and are separated from the outer side of the multiple first split electrodes 350b and are electrically connected to the first grounding electrode 330b.

[0177] Among them, multiple first split electrodes 350b can be formed at a first interval 410 in the outer direction of the second corresponding electrode 340b, and can be formed at a second interval 420 in the inner direction of the second grounding electrode 360b. The first grounding electrode 330b and the second grounding electrode 360b can be electrically connected using the second connecting via 331b.

[0178] The third corresponding electrode 371b can be arranged on the upper side of the multi-layer substrate 310b and electrically connected to the second corresponding electrode 340b. The plurality of second split electrodes 372b can be arranged on the upper side of the multi-layer substrate 310b and spaced apart from each other in the outer direction of the third corresponding electrode 371b and electrically connected to the plurality of first split electrodes 350b.

[0179] The structures of the third electrode 371 b and the plurality of second split electrodes 372 b as described above are similar to those of the second corresponding electrode 330 b and the plurality of first split electrodes 340 b , and thus detailed description thereof will be omitted below.

[0180] The third grounding electrode 380b can be arranged on the upper side of the multi-layer substrate 310b and electrically connected to the first grounding electrode 330b and the second grounding electrode 360b. The cover 390b can be arranged on the upper part of the third grounding electrode 380b and cover the structure, thereby playing a shielding role in preventing internal electromagnetic waves from leaking to the outside.

[0181] The first connection vias 321 b and the second connection vias 331 b provided on the printed circuit board (PCB) cover 300B as described above can electrically connect different electrode layers.

[0182] In addition, a third connection member 400C may be provided to connect at least one of the plurality of second split electrodes 372b to the third corresponding electrode 371b, and a fourth connection member 400D may be provided to connect at least one of the plurality of second split electrodes 372b to the third ground electrode 380a.

[0183] In addition, the structure and function of the plurality of first segmentation electrodes 350b and the plurality of second segmentation electrodes 372b are similar to the structure of the plurality of first segmentation electrodes 350a in one embodiment of the present invention described above, and thus the detailed description thereof will be omitted below.

[0184] That is, at least one of the multiple first split electrodes 350b can be electrically connected to the second corresponding electrode 340b through the third corresponding electrode 371b and the second split electrode 372b, and at least one of the split electrodes can be electrically connected to the second ground electrode 360b through the third ground electrode 380b and the second split electrode 372b.

[0185] As described above, the plurality of first divided electrodes 350 b may be formed with different sizes for adjusting the frequency band, and the number of electrodes provided for adjusting the shift width of the frequency band may be adjusted.

[0186] In addition, the printed circuit board (PCB) cover 300B may form the first interval 410 between the second corresponding electrode 340a and the plurality of first split electrodes 350a and the second interval 420 between the plurality of first split electrodes 350a and the second ground electrode 360a in different sizes in order to adjust the shift amplitude of the frequency band.

[0187] The second split electrodes 372 b are used to form a connection layer that facilitates the connection of the connection components in order to solve the problem that it is difficult to connect the connection components under the conditions of the size of the first split electrodes 350 b and the first and second intervals 410 and 420 .

[0188] At this time, the size of the second split electrode 372b and the interval between the second split electrode 372b and the third corresponding electrode 371b and the interval between the second split electrode 372b and the third ground electrode 380b do not affect the frequency band shift amplitude. This is just to electrically connect the plurality of first split electrodes 350b to the second corresponding electrode 340b or to the second ground electrode 360b through the electrical connection of these electrodes 371b, 372b, and 380b. That is, because it does not affect the adjustment of the frequency band, the size and interval of the second split electrode 372b can be arbitrarily determined in order to facilitate the connection of the connecting component.

[0189] Meanwhile, the plurality of second divided electrodes 372 b may be formed in a size different from that of the plurality of first divided electrodes 350 b in order to connect electrodes.

[0190] In addition, in order to adjust the movement amplitude of the frequency band, the printed circuit board (PCB) cover 300B can form a first interval 410 between the second corresponding electrode 340b and the plurality of first split electrodes 350b and a second interval 420 between the plurality of first split electrodes 340 and the second ground electrode 260b with a size different from the third interval between the third corresponding electrode 371b and the plurality of second split electrodes 372b and the fourth interval between the plurality of second split electrodes 372b and the third ground electrode 380b.

[0191] Meanwhile, in the printed circuit board (PCB) cover 300B as described above, a bridge pattern 500 electrically floating by connecting between upper regions of a plurality of resonant elements 200 may be provided, and electrical characteristics may be improved by electrically connecting a corresponding electrode on a portion of a layer of the printed circuit board (PCB) cover 300B (e.g., a layer provided with the second corresponding electrode 340b, etc.) and a ground electrode.

[0192] For example, the bridge pattern 500 can be coupled to the resonant elements 200 in other spaces through the second corresponding electrode 340 b , thereby forming a transmission zero point in the passband of the filter and thereby improving the skirt characteristics of the filter.

[0193] Therefore, in another embodiment of the present invention, a plurality of resonant elements are arranged inside a filter housing and a printed circuit board (PCB) cover covering the upper portion of the filter housing is provided, a plurality of electrode patterns are provided on the printed circuit board (PCB) cover and corresponding electrodes corresponding to the upper portion of the resonant elements, a ground electrode electrically connected to the housing, and a plurality of split electrodes located between the corresponding electrodes and the ground electrode are provided, and by electrically connecting at least one of the plurality of split electrodes to the corresponding electrode and one of the ground electrodes, the frequency band of the cavity filter can be finely adjusted.

[0194] Fig.19is a flow chart illustrating a process of tuning a radio frequency filter according to a first embodiment of the present invention, and Figures 20 to 28 is a schematic diagram illustrating a radio frequency filter tuned according to a first embodiment of the present invention.

[0195] See also Figures 19 to 28 In step 110, a radio frequency filter including a filter housing 10, a plurality of resonant elements 20 and a printed circuit board (PCB) cover 30 can be prepared. The printed circuit board (PCB) housing 10 has a plurality of electrode patterns formed on the upper portion of the resonant element 20 in order to adjust the design frequency characteristics, and is equipped with an openable protective cover 39.

[0196] The specific structure of the RF filter as described above will be described in detail in the subsequent content with reference to the accompanying drawings.

[0197] Next, in step 120, the prepared radio frequency filter may be connected to a frequency measuring device.

[0198] Among them, the RF measuring device is a device for measuring the frequency characteristics of the RF filter, which can provide an input signal of a preset frequency to the RF filter and receive an output signal corresponding to the input signal from the RF filter, thereby measuring the frequency characteristics of the RF filter.

[0199] In the frequency measuring device as described above, measuring pins connected to the input port 1 and the output port 2 of the RF filter may be provided, so that input signal provision and output signal provision can be performed by electrically connecting the measuring pins to the frequency measuring device.

[0200] Next, in step 130, the frequency characteristics of the radio frequency filter may be measured by a frequency measuring device.

[0201] Next, in step 140, it can be checked whether the target frequency characteristic of the radio frequency filter is measured by the frequency measuring device, that is, it can be checked whether the measured frequency characteristic is the required frequency band (ie, the target frequency band).

[0202] According to the inspection result of step 140, when the target frequency characteristics are not measured due to manufacturing and assembly tolerances, etc., in step 150, the protective cover 39 can be opened and an electrical connection can be made between the corresponding electrode arranged in the central part of the multiple electrode patterns and the split electrode arranged in the outer direction thereof, and between the split electrode and the ground electrode arranged in the outer direction thereof.

[0203] The connection method described above will be described in detail in the subsequent specific content related to the radio frequency filter.

[0204] Next, in step 160, the frequency characteristic may be measured again by a frequency measuring device after the protective cover 39 is re-covered on the upper part of the radio frequency filter.

[0205] Next, in step 170, the step 150 of electrically connecting at least one and the step 160 of re-measuring the frequency characteristic may be repeatedly performed until the target frequency characteristic is measured.

[0206] According to the inspection result of step 140 , or when the target frequency characteristic is measured by the frequency measuring device in step 170 , in step 180 , the protective cover 39 provided on the upper part of the radio frequency filter may be fixed.

[0207] The protection cover 39 as described above may be fixed by a separate fixing component 50 .

[0208] In the radio frequency filter according to the first embodiment of the present invention as described above, the split electrode is split into multiple electrodes, and at least one of the split electrodes can be electrically connected to the corresponding electrode through the first connecting component 41, and at least one of the split electrodes can be electrically connected to the ground electrode through the second connecting component 42. The electrodes can be formed in different sizes in order to adjust the frequency band, and the first interval 43 between the split electrode and the corresponding electrode and the second interval 44 between the split electrode and the ground electrode can be formed in different sizes in order to adjust the movement amplitude of the frequency band.

[0209] Next, we will refer to Figures 20 to 28 The radio frequency filter according to the first embodiment of the present invention is described in detail. The radio frequency filter may include a filter housing 10, a plurality of resonant elements 20, and a printed circuit board (PCB) cover 30.

[0210] The filter housing 10 is formed in the form of a box with an open top, and may include a bottom plate 11 and a side wall plate 12 extending upward from an outer front end portion of the bottom plate 11 .

[0211] The filter housing 10 as described above may be provided with a partition plate 13 corresponding to the arrangement of the plurality of resonant elements 20, and dividing protrusions 14 may be formed on the inner side of the side wall plate 12 of each space for configuring the plurality of resonant elements 20 and on the outer side of the partition plate 13, respectively.

[0212] The filter housing 10 can divide the space by the partition plate 13 and the dividing protrusion 14, and a resonant element 20 can be respectively configured in each space, so that the resonant frequency and the passband of the filter can be determined according to the size of each space and the configured resonant element 20.

[0213] In addition, the filter housing 10 can act as a filter that only allows electromagnetic waves of a certain frequency band to pass through by allowing electromagnetic waves to move from input port 1 to output port 2 in adjacent spaces connected by means of partition plates 13 and dividing protrusions 14. Electromagnetic wave signals can be input from the position of input port 1 and output from the position of output port 2 after moving through the shear space of side wall plates 12 and partition plates 13.

[0214] In addition, in the first embodiment of the present invention, the input port 1 is located at the upper left side, and after the input electromagnetic wave signal moves from the upper left side to the upper right side, it moves from the upper right side to the lower right side, and then moves from the lower right side to the lower left side, and then is output through the output port 2 located at the lower left side and moves in a clockwise direction. However, the positions of the input port 1 and the output port 2 can also be constructed in a state where the first embodiment of the present invention is reversed upside down or flipped left to right.

[0215] The measuring pin of the frequency measuring device will be connected to the input port 1 and the input port 2 as described above, so that the input signal of the frequency measuring device is input to the input port 10, and the output signal that moves in the internal space and is output through the output port 2 will be input to the frequency measuring device, so that the frequency characteristics of the RF filter can be measured by the frequency measuring device.

[0216] A plurality of resonant elements 20 are arranged on a base plate 11 provided on a filter housing 10 , and can be made of, for example, metal materials, and include a resonant element head 21 having a relatively large diameter and a cylindrical column 22 extending from the lower part of the resonant element head 21 and mounted on the base plate 11 .

[0217] In the embodiment of the present invention, the case where six resonant elements 20 as described above are provided is taken as an example for explanation, but more than six or less than six may be provided depending on the required electrical characteristics of the filter.

[0218] The printed circuit board (PCB) cover 30 covers the upper portion of the filter housing 10 by being coupled to the side wall plate 12 provided on the filter housing 10, and a plurality of electrode patterns may be formed on the upper portion of the plurality of resonant elements 20 in order to adjust the design frequency characteristics, and may include a lower substrate 31, a first corresponding electrode 32, a first ground electrode 33, a second corresponding electrode 34, a plurality of first segmented electrodes 35, a second ground electrode 36, an upper substrate 37, a third ground electrode 38, and a protective cover 39, etc.

[0219] In which, in the area where the input port 1 and the output port 2 connected to the external terminals are located, the first corresponding electrode 32 is arranged at a predetermined interval on the upper part of the resonant element 20, and the first corresponding electrode 32 can be electrically connected to the input port 1 or the output port 2 through a plurality of first connecting vias 32a.

[0220] For example, the lower substrate 31 can be arranged on the upper part of the filter housing 10, the first corresponding electrode 32 can be formed on the lower side of the lower substrate 31 and separated from the resonant element 20, the first grounding electrode 33 can be arranged on the lower side of the lower substrate 31 and separated from the outer direction of the first corresponding electrode 32 and electrically connected to the filter housing 10, and the second corresponding electrode 34 can be arranged on the upper side of the lower substrate 31 and electrically connected to the first corresponding electrode 32.

[0221] Among them, the first corresponding electrode 32 can be equipped with a size corresponding to the resonance element head 21 and a position separated by a predetermined interval from the resonance element head 21 to the upper part, and the second corresponding electrode 34 can be located on the upper surface of the lower substrate 31, and the second corresponding electrode 34 can be electrically connected to the first corresponding electrode 32 through one or more first connecting vias 32a.

[0222] A plurality of first split electrodes 35 may be formed on the upper side surface of the lower substrate 31 and spaced apart from the outer side direction of the second corresponding electrode 34 , and a second grounding electrode 36 may be provided on the upper side surface of the lower substrate 31 and spaced apart from the outer side direction of the plurality of first split electrodes 35 and electrically connected to the first grounding electrode 33 .

[0223] Among them, multiple first split electrodes 35 can be formed at a first interval 43 in the outer direction of the second corresponding electrode 34, and can be formed at a second interval 44 in the inner direction of the second grounding electrode 36. The first grounding electrode 33 and the second grounding electrode 36 can be electrically connected using the second connecting via 33a.

[0224] The upper substrate 37 can be arranged on the upper part of the lower substrate 31 and on the upper side of the second grounding electrode 36, the third grounding electrode 38 can be arranged on the upper side of the upper substrate 37 and electrically connected to the first grounding electrode 33 and the second grounding electrode 36, and the protective cover 39 can be arranged on the upper part of the third grounding electrode 38 and cover the structure, thereby playing a shielding role to prevent internal electromagnetic waves from leaking to the outside.

[0225] The lower substrate 31 and the upper substrate 37 as described above may be integrally formed on the upper portion of the filter case 10 .

[0226] In addition, the first connection vias 32a and the second connection vias 33a provided on the printed circuit board (PCB) cover 30 can electrically connect different electrode layers. In particular, the plurality of second connection vias 33a can be arranged at a certain interval, thereby playing a role in shielding electromagnetic waves.

[0227] Among them, the third grounding electrode 38 can be electrically connected to the first grounding electrode 33 and the second grounding electrode 36 through the second connecting via 33a, and the internal space protected by the protective cover 39 can be equipped with a first connecting component 41 for connecting at least one of the multiple first split electrodes 35 with the second corresponding electrode 34, and can also be equipped with a second connecting component 42 for connecting at least one of the multiple first split electrodes 30a with the second grounding electrode 360.

[0228] The frequency characteristics of the RF filter can be measured with the protective cover 39 installed as described above, or the protective cover 39 can be opened and at least one of the first connecting component 41 and the second connecting component 52 is connected, and then the protective cover 39 is reinstalled and the frequency characteristics of the RF filter are measured.

[0229] For example, at least one of the multiple first split electrodes 35 can be electrically connected to the second corresponding electrode 34, and can be split at a uniform angle (size) or at the same angle (size), and at least one of them can be electrically connected to the second corresponding electrode 34 at a first interval 43 in the inner direction through the first connecting part 41.

[0230] In addition, at least one of the plurality of first split electrodes 35 may be electrically connected to the second ground electrode 36 , and at least one of the split electrodes may be electrically connected to the second ground electrode 36 at a second interval 44 in the outward direction through a second connecting component 42 .

[0231] The first connecting component 41 and the second connecting component 42 as described above can use conductive materials to connect the respective electrodes, for example, a metal plate or metal wire including at least one selected from copper, aluminum and stainless steel (SUS), graphene and carbon nanotube (CNT, carbon nano-tube), etc., and can be composed in the form of conductive tape and conductive paste.

[0232] In addition, the frequency characteristics of the filter, such as the size of the resonator, the size of the resonance space in which the resonator is located, the interval between the related resonator and the corresponding pattern, and the interval between the corresponding electrode and the ground, can be expressed by design variables. These can be manufactured according to the design values ​​and thereby determine the characteristics of the filter. However, since tolerances inevitably occur in the physical manufacturing values ​​and the assembly process, it is necessary to have elements that can finely adjust the frequency characteristics.

[0233] Therefore, the frequency band characteristics can be finely adjusted by electrically connecting at least one of the plurality of first split electrodes 35 to the second corresponding electrode 34, or electrically connecting at least one of the plurality of first split electrodes 35 to the second grounding electrode 36, respectively, by using the first connecting member 41 and the second connecting member 42. Depending on the design and the degree of tolerance, the first split electrode 35 may not be electrically connected to the second corresponding electrode 34 or the second grounding electrode 36 if the frequency characteristics are accurate.

[0234] In addition, the divided first split electrode 35 can form individual electrodes of different sizes in order to adjust the frequency band, and at least one electrode divided into different angles (sizes) can be electrically connected to the second corresponding electrode 34, or electrically connected to the second ground electrode 36. When connecting an electrode with a relatively large size (area), the frequency band can be moved relatively largely, and when connecting an electrode with a relatively small size (area), the frequency band can be moved relatively finely.

[0235] In addition, multiple first split electrodes 35 can adjust the number of electrodes equipped to adjust the movement amplitude of the frequency band. After being split into different numbers such as 2, 3, 4, 5 and 6 according to the design and the movement amplitude of the frequency band to be adjusted, at least one of the split electrodes can be electrically connected to the second corresponding electrode 340a, or electrically connected to the second ground electrode 36.

[0236] In this case, at least one of the plurality of first split electrodes 35 may be connected to the second corresponding electrode 34 via the first connecting component 41 , and at least one of the plurality of first split electrodes 35 may be connected to the second ground electrode 36 via the second connecting component 42 .

[0237] As described above, the printed circuit board (PCB) cover 30 can form the first interval 43 between the second corresponding electrode 34 and the plurality of first segmented electrodes 35 and the second interval 44 between the plurality of first segmented electrodes 35 and the second ground electrode 36 in different sizes in order to adjust the movement amplitude of the frequency band, so that when a relatively wide interval is connected, the frequency band can be moved relatively largely, and when a relatively narrow interval is connected, the frequency band can be moved relatively finely.

[0238] In addition, in the printed circuit board (PCB) cover 30 as described above, a bridge pattern 70 electrically floating by connecting between upper regions of a plurality of resonant elements 20 may be provided, and electrical characteristics may be improved by electrically connecting a corresponding electrode on a portion of a layer of the printed circuit board (PCB) cover 30 (e.g., a layer provided with the second corresponding electrode 34, etc.) to a ground electrode.

[0239] For example, the bridge pattern 70 may be coupled to other spatial resonant elements 20 through the second corresponding electrode 34 , thereby forming a transmission zero point in the passband of the filter and thereby improving the skirt characteristics of the filter.

[0240] In the RF filter according to the first embodiment of the present invention as described above, variables such as the number of split electrodes, the size of the split electrodes, the interval between the split electrodes and the corresponding electrodes, and the interval between the split electrodes and the ground electrode can be adjusted, and the amplitude of the adjustment frequency band can be predicted in advance with the help of the variables described above and applied to the tuning process.

[0241] This is because, unlike the currently proposed tuning methods using tuning screws and physical impacts, the tuning amplitude can be determined according to pre-designed variables and switched on / off by pre-determining the tuning amplitude through electrical connections.

[0242] Therefore, in a first embodiment of the present invention, a radio frequency filter including a filter housing, a plurality of resonant elements and a printed circuit board (PCB) cover is connected to a frequency measuring device and the frequency characteristics are measured, wherein the split electrodes formed on the printed circuit board (PCB) cover can be electrically connected by electrically connecting at least one of a corresponding electrode arranged in a central portion of a plurality of electrode patterns and a split electrode arranged in an outer direction thereof and a split electrode and a ground electrode arranged in an outer direction thereof through a connecting component until a target frequency characteristic is measured, thereby effectively tuning the frequency band characteristics of the radio frequency filter.

[0243] Fig.29 is a flow chart illustrating a process of tuning a radio frequency filter according to a second embodiment of the present invention, and Fig.30 as well as Fig.31 is a schematic diagram illustrating a radio frequency filter tuned according to a second embodiment of the present invention.

[0244] See also Figure 29 to Figure 31 In step 210, a radio frequency filter including a filter housing 10, a plurality of resonant elements 20 and a printed circuit board (PCB) cover 30 can be prepared. The printed circuit board (PCB) housing 10 has a plurality of electrode patterns formed on the upper portion of the resonant element 20 in order to adjust the design frequency characteristics, and is equipped with an openable protective cover 39.

[0245] The specific structure of the RF filter as described above will be described in detail in the subsequent content with reference to the accompanying drawings.

[0246] Next, in step 220, the prepared radio frequency filter may be connected to a frequency measuring device.

[0247] Among them, the RF measuring device is a device for measuring the frequency characteristics of the RF filter, which can provide an input signal of a preset frequency to the RF filter and receive an output signal corresponding to the input signal from the RF filter, thereby measuring the frequency characteristics of the RF filter.

[0248] In the frequency measuring device as described above, measuring pins connected to the input port 1 and the output port 2 of the RF filter may be provided, so that input signal provision and output signal provision can be performed by electrically connecting the measuring pins to the frequency measuring device.

[0249] Next, in step 230, the frequency characteristics of the radio frequency filter may be measured by a frequency measuring device.

[0250] Next, in step 240, it can be checked whether the target frequency characteristic of the radio frequency filter is measured by the frequency measuring device, that is, it can be checked whether the measured frequency characteristic is the required frequency band (ie, the target frequency band).

[0251] According to the inspection result of step 240 , if the target frequency characteristic is not measured due to manufacturing and assembly tolerances, etc., the protection cover 39 may be removed.

[0252] Next, in step 260 , a split electrode connection cap 60A may be installed to electrically connect at least one of the corresponding electrode disposed in the center and the split electrode disposed in the outer side thereof and the split electrode and the ground electrode disposed in the outer side thereof.

[0253] The connection method described above will be described in detail in the subsequent specific content related to the radio frequency filter.

[0254] Next, in step 270 , the frequency characteristics of the radio frequency filter having the split electrode connection cover 60A installed thereon may be re-measured by a frequency measuring device.

[0255] Next, in step 280, the step 260 of installing the split electrode connection cover 60A and the step 270 of re-measuring the frequency characteristics may be repeated until the target frequency characteristics are measured. That is, after removing the split electrode connection cover 60A having a certain connection method from the RF filter for which the frequency characteristics are measured, the split electrode connection cover 50A having another connection method may be reinstalled and the frequency characteristics may be measured.

[0256] According to the inspection result of step 240 , or when the target frequency characteristic is measured by the frequency measuring device in step 270 , the divided electrode connection cover 60A provided on the upper part of the radio frequency filter may be fixed in step 290 .

[0257] The divided electrode connection cover 60A as described above can be fixed by a separate fixing member 50 .

[0258] In the radio frequency filter according to the second embodiment of the present invention as described above, the split electrode is split into multiple electrodes, and at least one of the split electrodes can be electrically connected to the corresponding electrode through the first connecting portion 61a provided on the split electrode connecting cover 60A, and at least one of the split electrodes can be electrically connected to the ground electrode through the second connecting portion 62a provided on the split electrode connecting cover 60A. In order to adjust the frequency band, each electrode can be formed in different sizes, and in order to adjust the movement amplitude of the frequency band, the first interval 43 between the split electrode and the corresponding electrode and the second interval 44 between the split electrode and the ground electrode can be formed in different sizes.

[0259] Next, we will refer to Fig.30 as well as Fig.31 The radio frequency filter according to the first embodiment of the present invention is described in detail. The radio frequency filter may include a filter housing 10, a plurality of resonant elements 20, and a printed circuit board (PCB) cover 30.

[0260] Among them, the specific structure of the RF filter according to the second embodiment is similar to the structure of the RF filter according to the first embodiment as described above, so in the following content, the split electrode connection cover 60A installed after removing the protective cover 39 will be described as the main feature.

[0261] The divided electrode connection cover 60A can be installed in the form of a cover provided with a first connection portion 61 a for connecting the divided electrode and the counter electrode and a second connection portion 62 a for connecting the divided electrode and the ground electrode on the lower side.

[0262] Among them, at least one of the first connecting part 61a and the second connecting part 62a can be provided at the corresponding position according to the number of connections required, and the whole can be composed of conductive materials, or conductive materials can be used only in the electrode connecting part and insulating materials can be used in the remaining part according to needs.

[0263] Furthermore, by forming the upper portion of the divided electrode connection cover 60A in a flat cover shape similar to the protective cover 30 and using a conductive material, it is possible to play a role in shielding the entire structure from electromagnetic waves.

[0264] For example, the frequency characteristics can be measured when a split electrode connection cover 60A, which is equipped with a first connection portion 61a and a second connection portion 62a to electrically connect the split electrode and the corresponding electrode or the split electrode and the ground electrode, is installed on a radio frequency filter. If the measured frequency characteristics of the radio frequency filter do not belong to the target frequency band, the installed split electrode connection cover 60A is removed, and then the frequency characteristics of the radio frequency filter are measured again after reinstalling the split electrode connection cover 60A with other connections.

[0265] When tuning the RF filter in the manner described above, it can be effectively tuned by predicting its error and preparing a split electrode connection cover 60A that can be tuned, thereby shortening the coordination time and easily completing the tuning by simply replacing the split electrode connection cover 60A.

[0266] Therefore, in a first embodiment of the present invention, a radio frequency filter including a filter housing, a plurality of resonant elements and a printed circuit board (PCB) cover is connected to a frequency measuring device and the frequency characteristics are measured, wherein the split electrodes formed on the printed circuit board (PCB) cover can be electrically connected by electrically connecting at least one of a corresponding electrode arranged in a central portion of a plurality of electrode patterns and a split electrode arranged in an outer direction thereof and a split electrode and a ground electrode arranged in an outer direction thereof through a split electrode connecting cover until a target frequency characteristic is measured, thereby effectively tuning the frequency band characteristics of the radio frequency filter.

[0267] Fig.32 is a flow chart illustrating a process of tuning a radio frequency filter according to a third embodiment of the present invention, and Figure 33 to Figure 36is a schematic diagram illustrating a radio frequency filter tuned according to a third embodiment of the present invention.

[0268] See also Figure 32 to Figure 36 In step 310, a radio frequency filter including a filter housing 10, a plurality of resonant elements 20 and a printed circuit board (PCB) cover 30 may be prepared. The printed circuit board (PCB) housing 10 has a plurality of electrode patterns formed on the upper portion of the resonant element 20 in order to adjust the design frequency characteristics, and is equipped with an openable tuning connection cover 60B.

[0269] The specific structure of the RF filter as described above will be described in detail in the subsequent content with reference to the accompanying drawings.

[0270] Next, in step 320, the prepared radio frequency filter may be connected to a frequency measuring device.

[0271] Among them, the RF measuring device is a device for measuring the frequency characteristics of the RF filter, which can provide an input signal of a preset frequency to the RF filter and receive an output signal corresponding to the input signal from the RF filter, thereby measuring the frequency characteristics of the RF filter.

[0272] In the frequency measuring device as described above, measuring pins connected to the input port 1 and the output port 2 of the RF filter may be provided, so that input signal provision and output signal provision can be performed by electrically connecting the measuring pins to the frequency measuring device.

[0273] Next, in step 330, the frequency characteristics of the radio frequency filter may be measured by a frequency measuring device.

[0274] Next, in step 340, it can be checked whether the target frequency characteristic of the radio frequency filter is measured by the frequency measuring device, that is, it can be checked whether the measured frequency characteristic is the required frequency band (ie, the target frequency band).

[0275] According to the inspection result of step 340, when the target frequency characteristics are not measured due to manufacturing and assembly tolerances, etc., in step 350, the connection position of the tuning connection cover 60B can be adjusted to electrically connect at least one of the corresponding electrode arranged in the central part of the multiple electrode patterns and the split electrode arranged in the outer direction thereof, and between the split electrode and the ground electrode arranged in the outer direction thereof.

[0276] The connection method described above will be described in detail in the subsequent specific content related to the radio frequency filter.

[0277] Next, in step 360, the frequency characteristic of the radio frequency filter whose connection portion position of the tuning connection cover 60B has been adjusted may be re-measured by a frequency measuring device.

[0278] Next, in step 370 , the step 350 of adjusting the position of the connection portion of the tuning connection cover 60B and the step 360 of re-measuring the frequency characteristic may be repeatedly performed until the target frequency characteristic is measured.

[0279] In the RF filter as described above, the split electrode is split into multiple electrodes, and at least one of the split electrodes can be electrically connected to the corresponding electrode through the first tuning connection part 61b equipped on the tuning connection cover 60B, and at least one of the split electrodes can be electrically connected to the ground electrode through the second tuning connection part 62b equipped on the tuning connection cover 60B. The electrodes can be formed in different sizes in order to adjust the frequency band, and the first interval 43 between the split electrode and the corresponding electrode and the second interval 44 between the split electrode and the ground electrode can be formed in different sizes in order to adjust the movement amplitude of the frequency band.

[0280] Next, we will refer to Figure 33 to Figure 36 The radio frequency filter according to the third embodiment of the present invention is described in detail. The radio frequency filter may include a filter housing 10, a plurality of resonant elements 20, and a printed circuit board (PCB) cover 30.

[0281] The specific structure of the RF filter according to the second embodiment is similar to that of the RF filter according to the first embodiment as described above, so the tuning connection cover 60B used to replace the protective cover 39 will be described as the main feature in the following content.

[0282] The adjustment connection cover 60B can be installed in the form of a cover equipped with a first tuning connection part 61b whose position can be adjusted by pressing to connect the split electrode with the corresponding electrode, and a second tuning connection part 62bb whose position can be adjusted by pressing to connect the split electrode with the ground electrode.

[0283] Among them, the number of first tuning connection parts 61b and second tuning connection parts 62b can respectively correspond to the maximum number of connections required, and the electrical connection between the split electrode and the corresponding electrode or between the split electrode and the ground electrode can be made at the corresponding position by pressing a tuning connection part located at the part where electrical connection is required.

[0284] The first tuning connection portion 61 b ​​and the second tuning connection portion 62 as described above may be entirely formed of a conductive material, or, if necessary, a conductive material may be used only in the electrode connection portion and an insulating material may be used in the remaining portion.

[0285] Furthermore, by forming the upper portion of the tuning connection cover 60B in a flat cover shape similar to the protective cover 30 and using a conductive material, it is possible to play a role in shielding the entire structure from electromagnetic waves.

[0286] For example, the frequency can be measured in a state where the RF filter is equipped with a tuning connection cover 60B that electrically connects the split electrode and the corresponding electrode or the split electrode and the ground electrode by being equipped with one of the first tuning connection part 61b and the second tuning connection part 62b, and when the measured frequency characteristics of the RF filter do not belong to the target frequency band, in order to have a different connection, the frequency characteristics of the RF filter are measured again after electrically connecting one of the split electrode and the corresponding electrode or the split electrode and the ground electrode by pressing one of the first tuning connection part 61b and the second tuning connection part 62b.

[0287] When tuning the RF filter in the manner described above, the tuning can be effectively performed by predicting its error and preparing multiple tuning connection covers 60B that can be used to tune it. Therefore, the coordination time can be shortened and the tuning can be easily completed by simply pressing one of the first tuning connection part 61b and the second tuning connection part 62b equipped on the tuning connection cover 60B.

[0288] That is, in the RF filter according to the third embodiment, it is not necessary to perform the steps of removing the protective cover 39 of the first embodiment or removing the split electrode connection cover 60A of the second embodiment and then reinstalling other covers. The connection status of the split electrode can be easily changed by only installing the tuning connection cover 60B once.

[0289] In addition, in order to restore the first tuning connection part 61b and the second tuning connection part 62b equipped on the tuning connection cover 60B as described above to their original positions, the RF filter can be tuned again and reused by adjusting each position by means of a screw or the like.

[0290] Therefore, in the third embodiment of the present invention, a radio frequency filter including a filter housing, a plurality of resonant elements and a printed circuit board (PCB) cover is connected to a frequency measuring device and the frequency characteristics are measured, wherein the split electrodes formed on the printed circuit board (PCB) cover can be electrically connected by electrically connecting at least one of the corresponding electrode arranged in the central part of the plurality of electrode patterns and the split electrode arranged in the outer direction thereof and the split electrode and the ground electrode arranged in the outer direction thereof through a tuning connection cover until the target frequency characteristics are measured, thereby effectively tuning the frequency band characteristics of the radio frequency filter.

[0291] Fig.37 is a schematic diagram illustrating a first embodiment of an antenna module of the present invention, Fig.38 (a) and (b) are schematic diagrams illustrating the antenna substrate and interconnection components of the antenna module of the present invention. Fig.39 is a schematic diagram illustrating a second embodiment of the antenna module of the present invention, Fig.40 is a schematic diagram illustrating a third embodiment of the antenna module of the present invention, Fig.41 is a schematic diagram illustrating a fourth embodiment of the antenna module of the present invention, Fig.42 (a) and (b) are schematic diagrams illustrating a fifth embodiment of the antenna module of the present invention. Fig.43 is a schematic diagram illustrating a sixth embodiment of the antenna module of the present invention, Fig.44 is a schematic diagram illustrating a seventh embodiment of the antenna module of the present invention, Fig.45 is a schematic diagram illustrating an eighth embodiment of the antenna module of the present invention, and Fig.46 as well as Fig.47 is a schematic diagram for explaining a slot structure formed on an interconnection component of an antenna module of the present invention.

[0292] See also Fig.37 According to the first embodiment, the antenna module 1000 may include: an antenna substrate 100, including an antenna 110; a packaging substrate 200, which is combined with a radio frequency integrated circuit chip 210 and forms a signal transmission line 220 for transmitting the signal of the radio frequency integrated circuit chip; and an interconnection component 300, which is located between the antenna substrate 100 and the packaging substrate 200, so as to connect the antenna substrate 100 and the packaging substrate 200, and form a narrow slot 310 for allowing the radio frequency signal to pass through.

[0293] Specifically, the antenna transmits in the form of radiating electromagnetic waves having characteristics such as a pre-designed frequency band and beam width from the antenna 110 when a high-frequency signal in the radio frequency band is transmitted from the radio frequency integrated circuit chip 210 coupled to the packaging substrate 200 through the signal transmission line, while the antenna receives in the form of transmitting the received signal to the radio frequency integrated circuit chip 210 when the electromagnetic wave is received from the antenna 110.

[0294] At this time, the less signal loss occurs during the transmission of the RF signal between the antenna 110 and the RF integrated circuit chip 210, the better the performance of the antenna module, such as the receiving and transmitting output power. Fig.37 As shown, an interconnection component 300 having a narrow slot 310 is arranged between the antenna substrate 100 and the packaging substrate 200 to form a channel through which the RF signal can pass with low loss, so that the RF signal can be transmitted more smoothly between the antenna 110 and the signal transmission line 220 of the RF integrated circuit chip.

[0295] In addition, by connecting the interconnection component having the narrow slot 310 through which the radio frequency signal can pass to the antenna substrate 100 and the packaging substrate 200, the existing antenna module packaging connection method, i.e., the packaging process of making multiple fine electrical connection structures between the antenna 110 and the signal transmission line 220 of the radio frequency integrated circuit chip, can be omitted.

[0296] In addition, the antenna module of the present invention connects the antenna substrate 100 and the packaging substrate 200 by forming an interconnection component 300 with the narrow groove 310 for the radio frequency signal to pass through, thereby preventing the problem of separation of electrical connection structures such as fine spherical bumps of the antenna substrate and the packaging substrate due to the heat generated when the module is driven for a long time in the antenna module of the prior invention.

[0297] In addition, the antenna substrate 100 and the packaging substrate 200 are connected by an interconnection component having the slot 310 through which the radio frequency signal can pass, thereby realizing an antenna module, so that the antenna substrate and the packaging substrate can be respectively constituted, so that substrate materials more suitable for their respective characteristics can be used respectively.

[0298] In addition, the interconnection component 300 of the present invention can be formed of all surfaces or outer surfaces using conductors (metal layers), so that the heat generated on the substrate can be smoothly discharged through the interconnection component and the heat dissipation characteristics can be further improved.

[0299] In addition, the antenna module of the present invention connects the antenna substrate 100 and the package substrate 200 through the interconnecting member 300 formed with slots through which radio frequency signals can pass. Therefore, it is possible to detect defects and improve the yield by measuring and analyzing the characteristics and defects of the antenna, or by separately measuring and analyzing the characteristics and defects of the package substrate, each radio frequency integrated circuit (RFIC) chip, and each signal transmission line connected thereto.

[0300] At this time, as shown in (a) of Fig.38 , the antenna 110 can be formed into an antenna array by arranging a plurality of them on the antenna substrate 100, and the antenna array as described above can be composed of multiple layers.

[0301] The antenna 100 can be manufactured by forming (patterning) a metal layer on the upper side or inside of the antenna substrate 100, or by being combined to the upper side after being separately manufactured.

[0302] In addition, the number of slots 310 formed on the interconnecting member 300 can be the same as the number of antennas 110, and when the interconnecting member 300 is combined with the antenna substrate 100, it can be arranged in a one-to-one correspondence with the antennas 110.

[0303] The interconnecting member 300 forms one or more slots 310 inside. It is advisable to use a conductor to form the surface of the slot in order to transmit electromagnetic waves without loss, and by adopting a hollow shape that penetrates the upper and lower sides, it is ensured that electromagnetic waves can be transmitted smoothly up and down. That is, the slot can be formed in a rectangular shape similar to the inner hollow and long shape of a waveguide, a "匚" shape, and an "H" shape, and can be formed in a plurality of ridge shapes in order to set the passband.

[0304] When forming an antenna array using a plurality of antennas 110, the configuration period L1 between the antennas 110 is preferably formed as half the wavelength (0.5 times the wavelength) of the main used frequency band in consideration of the gain of the antenna array and the adjustment of the beam angle, etc. However, it can also be formed at different intervals such as 0.55 times and 0.6 times according to needs, and the interval can also be adjusted according to the configuration space of the radio frequency integrated circuit chip 210 and related circuits.

[0305] In addition, when manufacturing the antenna substrate 100 using a substrate with a low dielectric loss rate, it has the advantage of reducing the transmission loss of radio frequency signals. Therefore, it is preferably manufactured in a form laminated with a plurality of dielectric layers with low dielectric loss. As an embodiment, as the dielectric for forming the dielectric layer, it is advisable to use a very high frequency polytetrafluoroethylene material with a low dielectric loss rate in the millimeter wave frequency band. However, low-temperature fired ceramics, high-temperature fired ceramics, and alumina, etc. that are conducive to forming a multi-layer structure can also be used.

[0306] The antenna substrate 100 may include a plurality of metal layers and vias for vertically connecting the metal layers in addition to the plurality of dielectric layers.

[0307] In addition, the package substrate 200 on which the RFIC chip is mounted may be manufactured by stacking a plurality of dielectric layers, or may be formed by a multi-type bonding form in which a plurality of materials are combined instead of a single material as required.

[0308] At the same time, in addition to the RF integrated circuit chip 210 and the signal transmission line 220, the packaging substrate 200 can also include various integrated circuit (IC) chips such as power amplifiers and mixers, various passive components such as inductors, capacitors, and resistors, and connectors for connection.

[0309] The packaging substrate is provided with metal layers and connection vias, and may be provided with signal transmission wiring for transmitting radio frequency signals, power supplies, metal wiring for routing control signals, ground layers, and shielding structures utilizing the metal layers and connection vias.

[0310] The packaging substrate not only transmits high-frequency wireless communication band signals, but also transmits various analog signals such as power and control signals. It can be composed of radio frequency integrated circuit chips, various integrated circuit chips, passive components and connectors. Therefore, in order to reduce the signal attenuation of the wireless communication band, it is necessary to ensure a low dielectric loss rate, and to prevent the substrate from bending due to various processes and the heat generated, it is necessary to ensure excellent mechanical rigidity. In addition, because the substrate needs to be made into a multi-layer structure, its material price is required to be low. In addition, because the higher the frequency band of wireless communication, the higher the integration of its components, and the difficulty of wiring will also increase, it is more necessary to meet the above-mentioned characteristics.

[0311] However, materials such as polytetrafluoroethylene, which are mainly used due to their low dielectric loss at ultra-high frequencies, have poor mechanical rigidity and are expensive when actively made into multiple layers. Materials such as FR5, which are cheap at low frequencies, have relatively excellent mechanical rigidity and can be easily made into multiple layers, but are difficult to use due to their very large dielectric loss at ultra-high frequencies.

[0312] Therefore, it is difficult to simultaneously meet the above-mentioned multiple requirements when using one dielectric material. Therefore, substrates with multiple types of bonding structures are manufactured by using different types of dielectrics. However, this has the problem of being difficult to realize a multi-layer structure and significantly increasing the manufacturing unit price.

[0313] See also Fig.37 The antenna substrate 100 may include: a first shielding portion 120 configured at an edge of the slot 310 ; and the packaging substrate 200 may include: a second shielding portion 230 configured at an edge of the slot 310 .

[0314] Specifically, by utilizing the first shielding portion 120 and the second shielding portion 230 to form a radio frequency signal transmission structure between the antenna 110 and the signal transmission line 200 that are arranged opposite to each other, it is possible to minimize the transmission loss of the radio frequency signal R while shielding signal interference with wireless communication signals transmitted between other antennas 200 and signal transmission lines and analog signals used during the operation of the device.

[0315] At this time, it is preferable that a first RF signal transmission part 101 for shielding the inflow of external signals is formed in the center by arranging a plurality of the first shielding parts 120 in a form surrounding the narrow slot 310, and a second RF signal transmission part 201 for shielding the inflow of external signals is formed in the center by arranging a plurality of the second shielding parts 230 in a form surrounding the narrow slot 310.

[0316] That is, a first RF signal transmission part 101 and a second RF signal transmission part 201 that can eliminate interference from external signals are formed on each antenna substrate 100 and a packaging substrate 200 using a first shielding part 120 and a second shielding part 230 having a material or structure that can shield electromagnetic waves in the transmitting and receiving frequency bands.

[0317] The first RF signal transmitting part 101 and the second RF signal transmitting part 201 may refer to a specific area of ​​the antenna substrate 100 and a specific area of ​​the packaging substrate 200 surrounded by the first shielding part 120 and the second shielding part 230, and may form a plurality of input and output ports corresponding to the number of the antenna 110 and the RF integrated circuit chip 210.

[0318] At the same time, the first shielding part 120 may include: multiple metal layers 121, which are configured to be separated from each other; and multiple first shielding vias 122, which connect the multiple metal layers 121; and the second shielding part 230 may include: multiple grounding layers 231, which are configured to be separated from each other; and multiple second shielding vias 232, which electrically connect the grounding layers 231.

[0319] See also Fig.39 In the antenna module 1000 according to the second embodiment, one ground layer selected from the plurality of ground layers 231 constituting the second shielding portion 230 may be disposed opposite to the slot 310 with the signal transmission line 220 interposed therebetween.

[0320] Specifically, the signal transmission line connected to the RF integrated circuit chip is configured inside the packaging substrate 220, and the ground layer 231 is configured on the rear side of the signal transmission line 220, so that the ground layer 231 configured on the rear side reflects the applied RF signal, thereby improving the RF signal transmission efficiency.

[0321] At this time, the configuration and connection of the ground layer 231, the second shielding via 232, the power supply and the control signal line 202 should be configured in an optimized form so as not to interfere with each other.

[0322] See also Fig.40 According to the third embodiment, the antenna substrate 100 of the antenna module 1000 may include: a first coupling portion 130, located between the antenna 110 and the slot 310, so as to transmit the radio frequency signal; the packaging substrate 200 includes: a second coupling portion 240, one side of which is connected to the signal transmission line 220 and the other side is located at a position in contact with the slot 310, so as to transmit the radio frequency signal.

[0323] Specifically, the transmission efficiency of the wireless signal can be maximized by transmitting the radio frequency signal using the first coupling portion 130 and the second coupling portion 240 having higher signal transmission capabilities than the antenna substrate 100 and the packaging substrate 200. That is, the electromagnetic coupling is strengthened and the radio frequency signal is transmitted by arranging the first coupling portion 130 of the antenna substrate and the second coupling portion 240 of the packaging substrate facing each other inside the interconnection component formed with the slot, thereby improving the signal transmission efficiency.

[0324] At this time, it is preferable that the ends of the first coupling portion 130 and the second coupling portion 240 are disposed facing each other inside the first RF signal transmitting portion 101 and the second RF signal transmitting portion 201 with the slot 310 interposed therebetween.

[0325] In addition, the first coupling portion 130 may include: a first coupling pattern 131, radiating a radio frequency signal; and a first connecting via 132, forming a channel for transmitting the radio frequency signal; the second coupling portion 240 may include: a second coupling pattern 241, radiating a radio frequency signal; and a second connecting via 142, forming a channel for transmitting the radio frequency signal.

[0326] See also Fig.41 According to the interconnection component 300 of the antenna module 1000 of the fourth embodiment, a groove space 320 may be formed on the lower side facing the packaging substrate 200 .

[0327] Specifically, a radio frequency integrated circuit chip 210, other integrated circuit chips, passive components, connectors, and signal transmission lines are formed on the packaging substrate 200. When the components as described above are formed on the lower side, the connection wiring on the lower side becomes complicated and the number of wiring layers inside the packaging substrate 200 for electrical connection increases. Therefore, by forming a groove space 320 on the lower side of the interconnection component 300 facing the packaging substrate 200, components such as a radio frequency integrated circuit chip 210, passive components, connectors, and signal transmission lines can be arranged on the upper side of the packaging substrate 200 adjacent to the packaging substrate 100.

[0328] When components are freely configured through the groove space 320 as described above, since the power supply and control signal lines 202 can be formed on the lower side of the packaging substrate 200, the analog signal routing wiring can be kept away from the signal transmission line 220, thereby achieving the effect of preventing the analog signals of the power supply and control signal lines 202 from interfering with the radio frequency signals.

[0329] In the case where the channel for transmitting RF signals is adjacent to the analog signal routing wiring, signal interference will occur, making it difficult to implement an ultra-high frequency, i.e., millimeter wave band antenna module. Therefore, the groove space as described above can solve the problem of needing to construct the antenna module 1000 in multiple layers in order to ensure appropriate configuration space. That is, by utilizing the groove space on the interconnection component, a portion of the radio frequency integrated circuit (RFIC) chip, other integrated circuit chips, passive components, and connectors coupled to the packaging substrate can be configured as needed on the surface coupled to the interconnection component 300 inside the groove space, thereby having the advantage of being able to effectively construct the routing and configuration of the packaging substrate.

[0330] See also Fig.42 (a) and (b) of the interconnection component 300 of the antenna module 1000 according to the fifth embodiment may have its outer side formed by a conductor and its inner side formed by a different type of material having a lower density than that of the conductor.

[0331] Specifically, the interconnection component 300 needs to shield the radio frequency signal passing through the slot 310, and therefore needs to be formed of a conductor (metal) material that can fencing electromagnetic waves. However, when the interconnection component 300 is formed as a whole using a conductive material, it will lead to an increase in the weight of the antenna module. Therefore, its weight can be minimized by using conductive materials only in specific parts that need to fencing electromagnetic waves and using other types of substances (such as insulators such as dielectrics, foamed metals, and flexible materials) in the interior 304 that does not need to fencing electromagnetic waves.

[0332] In addition, the outer side surface of the interconnection component 300 can also be formed entirely of multiple materials instead of the same material. As an example, Figure 6 As shown in (b) of FIG. 3 , the inner outer side surface 301 separated from the slot 310 can be formed of a metal with high electrical conductivity, and the upper surface 302 and the lower surface 303 can be formed of a metal with high thermal conductivity, thereby effectively achieving heat dissipation. Generally speaking, since the thermal conductivity of metal is much higher than that of dielectrics, heat dissipation can be effectively achieved through the interconnection component 300.

[0333] At this time, the metal with high electrical conductivity and the metal with high thermal conductivity may include Al, Cu, Ag or alloys of the metals, but may also include other metals, and the present invention is not limited thereto.

[0334] See also Fig.43 According to the sixth embodiment, the interconnection component 300 of the antenna module 1000 may include a slot component 330 provided in the slot 310, and the slot component 330 may be a dielectric.

[0335] Specifically, as described above with reference to the first embodiment, the antenna module 1000 of the present invention can have directionality when the RF signal passes through the slot 310, thereby minimizing the transmission loss occurring during the transmission of the RF signal between the antenna 110 or the signal transmission line 220.

[0336] At this time, the air located on the slot 310 will be used as a medium for transmitting radio frequency signals. However, when air is used as a medium, the slot 310 is required to reach a certain size. Therefore, in the present invention, a slot component 330 having a dielectric constant greater than that of air is filled into the slot 310. Even when the size of the slot 310 is reduced, the same radio frequency signal transmission capability can be achieved.

[0337] The structure and size of the slot need to be designed according to the frequency band of the antenna module, but for a slot using air with a dielectric constant of 1, it needs to be relatively large in size compared to the case where a material with a higher dielectric constant is filled inside the slot. In the case of reducing the slot, the configuration can be made easier by more effectively utilizing the groove space, or the heat dissipation characteristics can be improved by forming a wider thermal conductive layer. Therefore, filling the slot as described above with a dielectric with a higher dielectric constant has the advantage of minimizing the size of the slot. As the slot component as described above, a variety of materials such as FR4 and polytetrafluoroethylene, which are commonly used dielectric materials of the substrate, can be used.

[0338] See also Fig.44According to the seventh embodiment, the antenna module 1000 may include a heat dissipation assembly 400 coupled to one or more side surfaces of the antenna substrate 100 , the packaging substrate 200 , and the interconnection component 300 .

[0339] Specifically, the antenna module 1000 of the present invention uses a high-output signal generating element for communication, so heat is generated from the high-output element. When the heat generated from the high-output element as described above rises to a certain value or more, the characteristics of the element may change, and the module such as the package substrate and the antenna substrate may be physically deformed. Therefore, in the present invention, heat is effectively dissipated through the heat dissipation component 400.

[0340] In other words, the lower the dielectric loss of the antenna substrate 100 and the packaging substrate 200, the less the loss of the RF signal will be. However, materials with lower dielectric loss, such as polytetrafluoroethylene, are more expensive and are easily deformed by heat due to their low thermal conductivity and mechanical properties. Therefore, heat dissipation can be performed by the heat dissipation component 400 to prevent the output power of the antenna module from decreasing and the deformation of the antenna substrate 100 and the packaging substrate 200 due to heat.

[0341] At this time, the heat dissipation assembly 400 may include: a heat dissipation plate 410, which is combined in a form surrounding the side of the antenna module 1000 combined with the antenna substrate 100, the packaging substrate 200 and the interconnection component 300; and a plurality of heat sinks 420, which are formed apart from the outer side of the heat dissipation plate 410.

[0342] In addition, when the outer side surface of the interconnection component 300 is formed by using a metal with high thermal conductivity, heat can be transferred to the heat dissipation assembly 400 more effectively.

[0343] See also Fig.45 According to the eighth embodiment, the antenna module 1000 may include: a first interconnection component 300A, which is coupled to the lower side of the antenna substrate 100; and a second interconnection component 300B, which is coupled to the upper side of the packaging substrate 200; and alignment parts 305 and 306 for aligning the positions at which they are fastened to each other may be formed on the first interconnection component 300A and the second interconnection component 300B.

[0344] Specifically, for the existing antenna packaging module with integrated antenna, because it is manufactured in the form of an antenna pattern formed integrally on the upper part of the packaging substrate, although the overall characteristics (state) of the antenna module can be grasped, the characteristics of the antenna, the signal connection part of the antenna, the RF integrated circuit chip, and the signal connection part connected to the RF integrated circuit chip cannot be grasped separately. Therefore, when the characteristic inspection result is poor, the entire antenna module needs to be discarded, resulting in the inability to individually confirm and improve the defects, high unit price and low mass production yield.

[0345] Therefore, in the present invention, a first assembly module 10 is formed by combining the first interconnect component 300A to the lower side of the antenna substrate 100, and a second assembly module 10 is formed by combining the second interconnect component 300B to the upper side of the packaging substrate 200. Subsequently, the characteristics of the antenna substrate 100 and the packaging substrate 200 are respectively inspected, and the antenna substrate 100 and the packaging substrate 200 that are determined to be in a normal state in the characteristic inspection are combined with each other, thereby improving the mass production yield of the antenna module.

[0346] In particular, the measuring device can be used to analyze the output characteristics of the RFIC chip 210 and its signal connection line 220 and the signal transmission unit 232, respectively, so as to easily confirm the defect of the RFIC chip or the defect of the signal transmission unit. In addition, the output power reduction of the wireless communication chip after long-term operation can be grasped, so that only the corresponding RFIC chip can be replaced.

[0347] It is also possible to evaluate and analyze the characteristics of the antenna substrate and the packaging substrate separately in the antenna module structure of the present invention without using the interconnection component, depending on the needs and the convenience of the solution.

[0348] At this time, it is preferable to form alignment parts 305 and 306 on the first interconnection component 300A and the interconnection component 300B so that they can be easily aligned and combined after the characteristic inspection is completed.

[0349] The alignment portion may include various components that can align the combined positions. As an embodiment, the alignment portion may include an alignment protrusion formed on one of the first interconnection component 300A and the second interconnection component 300B and an alignment groove formed at a position facing the alignment protrusion.

[0350] As an example, in the case where an alignment protrusion is formed on the lower side of the first interconnection member 300A and an alignment groove is formed on the upper side of the second interconnection member 300B, the fastening positions thereof can be aligned by fitting the alignment protrusion into the alignment groove.

[0351] See also Fig.46 as well as Fig.47 The interconnection component 300 may include: a ridge-forming protrusion 340 protruding toward the narrow groove 310.

[0352] Specifically, the thickness of a portion of the slot 310 may be reduced by forming the protrusion 340 on the ridge, thereby adjusting the frequency band of the electromagnetic wave passing through the slot 310 or improving the transmission characteristics.

[0353] At this time, the ridge forms a protrusion 340 such as Fig.46 As shown in (a) in FIG. 1 , it can be formed only on one side of the left side and the right side of the narrow slot 310, or as shown in FIG. Fig.46 As shown in (b) in FIG. 1 , it may also include a first ridge forming protrusion 341 formed on the left side and a second ridge forming protrusion 342 formed on the right side.

[0354] exist Fig.46 as well as Fig.47 The narrow slot 310 shown in the middle part is enlarged for the purpose of specific description and is displayed in reverse order. Fig.47 As shown, when a plurality of ridge grooves are formed along the height direction of the narrow groove 310 , the height of the ridge grooves can be arbitrarily changed, and the present invention is not limited thereto.

[0355] In addition, the ridge forms a protrusion 340 such as Fig.47 As shown in (a) and (b), it may include a plurality of protrusions formed in different shapes in sequence along the length direction of the narrow groove 340. Specifically, the first ridge forming protrusion 341 may include a 1-1 ridge forming protrusion and a 1-2 ridge forming protrusion formed in different shapes on the upper side and the lower side, and the second ridge forming protrusion 342 may include a 2-1 ridge forming protrusion and a 2-2 ridge forming protrusion formed in different shapes on the upper side and the lower side.

[0356] At the same time, a ridge groove may be formed on the slot 310 by the ridge forming protrusion 340 described above. Fig.46 As shown, it may include a first ridge groove 311 formed by means of the first ridge forming protrusion 341 and a second ridge groove 312 formed by means of the second ridge forming protrusion 342, or as shown in FIG. Fig.47 As shown, it can include a 1-1 ridge groove 311-1 formed by means of a convexity formed by the 1-1 ridge, a 1-2 ridge groove 311-2 formed by means of a convexity formed by the 102 ridge, a 2-1 ridge groove 312-1 formed by means of a convexity formed by the 2-1 ridge, and a 2-2 ridge groove formed by means of a convexity formed by the 2-2 ridge.

[0357] In the drawings, the case where the ridge-forming protrusion 340 has a rectangular cross-sectional shape is illustrated as an example, but the ridge-forming protrusion may also have various shapes such as elliptical, semicircular, and polygonal, and the present invention is not limited thereto.

[0358] The present invention is not limited to the embodiments described above, but can be applied to a variety of different scopes. Personnel with general knowledge in the technical field to which the present invention belongs can make various modifications without departing from the scope of the present invention as claimed in the claims.

Claims

1. A cavity filter for radio frequency wireless communication, in, include: The filter housing is in the form of a box body with an open top, and includes a bottom plate and a side wall plate extending upward from the outer front end of the bottom plate; a plurality of resonant elements arranged on the bottom plate provided on the filter housing; and The printed circuit board cover covers the upper portion of the filter housing by being bonded to the side wall plate provided on the filter housing, and a plurality of electrode patterns are formed on the upper portion of the resonance element in order to adjust the design frequency characteristics.

2. The cavity filter for radio frequency wireless communication according to claim 1, wherein: The printed circuit board cover comprises: A lower substrate, arranged on the upper part of the filter housing; A first corresponding electrode is disposed on the lower side of the lower substrate and is spaced apart from the resonant element; A first grounding electrode is disposed on the lower side of the lower substrate and in an outer direction of the first corresponding electrode, and is electrically connected to the filter housing; a second corresponding electrode disposed on the upper side of the lower substrate and electrically connected to the first corresponding electrode; A plurality of first split electrodes are arranged on the upper side of the lower substrate and spaced apart from each other in the outer direction of the second corresponding electrodes; A second grounding electrode is disposed on the upper side of the lower substrate and spaced apart from the plurality of first segmented electrodes, and is electrically connected to the first grounding electrode; an upper substrate, disposed on the upper portion of the lower substrate and disposed on the upper side surface of the second ground electrode; a third grounding electrode disposed on the upper side of the upper substrate and electrically connected to the first grounding electrode and the second grounding electrode; and The cover is disposed on the upper portion of the third ground electrode and covers the structure.

3. The cavity filter for radio frequency wireless communication according to claim 2, wherein: The lower substrate and the upper substrate are integrally formed on the upper portion of the filter case.

4. The cavity filter for radio frequency wireless communication according to claim 1, wherein: The printed circuit board cover comprises: A multi-layer substrate is provided on the upper part of the filter housing; A first corresponding electrode is disposed on the lower side of the multi-layer substrate and is spaced apart from the resonant element; A first grounding electrode is disposed on the lower side of the multi-layer substrate and in an outer direction of the first corresponding electrode, and is electrically connected to the filter housing; a second corresponding electrode disposed on an inner layer of the multi-layer substrate and electrically connected to the first corresponding electrode; A plurality of first split electrodes are arranged in an inner layer of the multi-layer substrate and spaced apart from each other in an outer direction of the second corresponding electrode; A second grounding electrode is disposed in an inner layer of the multi-layer substrate and spaced apart from the plurality of first segmenting electrodes in an outer direction, and is electrically connected to the first grounding electrode; a third corresponding electrode, disposed on the upper side of the multi-layer substrate and electrically connected to the second corresponding electrode; A plurality of second split electrodes are arranged on the upper side of the multi-layer substrate and in an outer direction of the third corresponding electrode, and are electrically connected to the plurality of first split electrodes; a third grounding electrode disposed on the upper side of the multi-layer substrate and electrically connected to the first grounding electrode and the second grounding electrode; and The cover is disposed on the upper portion of the third ground electrode and covers the structure.

5. The cavity filter for radio frequency wireless communication according to any one of claims 2 to 4, wherein: Among the plurality of first segmented electrodes, at least one segmented electrode is electrically connected to the second corresponding electrode.

6. The cavity filter for radio frequency wireless communication according to any one of claims 2 to 4, wherein: Among the plurality of first split electrodes, at least one split electrode is electrically connected to the second ground electrode.

7. The cavity filter for radio frequency wireless communication according to any one of claims 2 to 4, wherein: The plurality of first divided electrodes are formed to have respective sizes in order to adjust a frequency band.

8. The cavity filter for radio frequency wireless communication according to any one of claims 2 to 4, wherein: In order to adjust the shift range of the frequency band, the printed circuit board cover forms a first interval between the second corresponding electrode and the plurality of first split electrodes and a second interval between the plurality of first split electrodes and the second ground electrode in different sizes.

9. The cavity filter for radio frequency wireless communication according to any one of claims 2 to 4, wherein: The printed circuit board cover is provided with a bridge pattern electrically floating by connecting between upper regions of the plurality of resonant elements.

10. The cavity filter for radio frequency wireless communication according to claim 4, wherein: Among the plurality of second divided electrodes, at least one divided one is electrically connected to the third corresponding electrode.

11. The cavity filter for radio frequency wireless communication according to claim 4, wherein: Among the plurality of second divided electrodes, at least one divided one is electrically connected to the third ground electrode.

12. The cavity filter for radio frequency wireless communication according to claim 4, wherein: The plurality of second divided electrodes are formed to have a size different from that of the first divided electrodes in order to connect electrodes.

13. The cavity filter for radio frequency wireless communication according to claim 4, wherein: In order to adjust the movement amplitude of the frequency band, the printed circuit board cover forms a third interval between the third corresponding electrode and the plurality of second split electrodes and a fourth interval between the plurality of second split electrodes and the third ground electrode, which are different in size from the first interval between the second corresponding electrode and the plurality of first split electrodes and the second interval between the plurality of first split electrodes and the second ground electrode.

14. A method for tuning a radio frequency filter, in, include: The step of preparing a radio frequency filter, wherein the radio frequency filter comprises a filter housing, a plurality of resonant elements, and a printed circuit board cover, wherein the printed circuit board cover has a plurality of electrode patterns formed on the upper portion of the resonant element in order to adjust the design frequency characteristics, and is provided with an openable protective cover; The step of connecting the prepared radio frequency filter to a frequency measuring device; The step of measuring the frequency characteristics of the radio frequency filter; A step of checking whether a target frequency characteristic of the radio frequency filter is measured; In the case where the target frequency characteristic is not measured, the protective cover is opened to electrically connect at least one of a corresponding electrode provided in the center and a split electrode provided in an outer direction thereof, and a split electrode and a ground electrode provided in an outer direction thereof; The step of re-measuring the frequency characteristic after re-applying the protective cover; Repeating the steps of electrically connecting at least one and re-measuring the frequency characteristic until the target frequency characteristic is measured; and The step of fixing the protective cover when the target frequency characteristic is measured.

15. The method for tuning a radio frequency filter according to claim 14, wherein: The split electrode is split into a plurality of electrodes, and at least one of the split electrodes is electrically connected to the corresponding electrode via a first connecting component.

16. The method for tuning a radio frequency filter according to claim 15, wherein: In the split electrodes, at least one of the split electrodes is electrically connected to the ground electrode via a second connecting member.

17. The method for tuning a radio frequency filter according to claim 16, wherein: The split electrodes are formed to have different sizes in order to adjust the frequency band.

18. The method for tuning a radio frequency filter according to claim 17, wherein: In order to adjust the shift width of the frequency band, the plurality of electrode patterns form a first interval between the split electrode and the corresponding electrode and a second interval between the split electrode and the ground electrode with different sizes.

19. A method for tuning a radio frequency filter, in, include: The step of preparing a radio frequency filter, wherein the radio frequency filter comprises a filter housing, a plurality of resonant elements, and a printed circuit board cover, wherein the printed circuit board cover has a plurality of electrode patterns formed on the upper portion of the resonant element in order to adjust the design frequency characteristics, and is provided with an openable protective cover; The step of connecting the prepared radio frequency filter to a frequency measuring device; The step of measuring the frequency characteristics of the radio frequency filter; A step of checking whether a target frequency characteristic of the radio frequency filter is measured; If the target frequency characteristic is not measured, removing the protective cover; A step of installing a split electrode connection cover for electrically connecting at least one of a corresponding electrode provided in a central portion of the plurality of electrode patterns and a split electrode provided in an outer direction thereof and a split electrode and a ground electrode provided in an outer direction thereof; The step of re-measuring the frequency characteristics of the radio frequency filter equipped with the split electrode connection cover; Repeating the steps of installing the split electrode connection cover and re-measuring the frequency characteristic until the target frequency characteristic is measured; and A step of fixing the divided electrode connection cover when the target frequency characteristic is measured.

20. The method for tuning a radio frequency filter according to claim 19, wherein: The split electrode is split into a plurality of electrodes, and at least one of the split electrodes is electrically connected to the corresponding electrode via a first connecting portion provided on the split electrode connecting cover.

21. The method for tuning a radio frequency filter according to claim 20, wherein: In the split electrode, at least one of the split electrodes is electrically connected to the ground electrode via a second connection portion provided on the split electrode connection cover.

22. The method for tuning a radio frequency filter according to claim 21, wherein: The split electrodes are formed to have different sizes in order to adjust the frequency band.

23. The method for tuning a radio frequency filter according to claim 22, wherein: In order to adjust the shift width of the frequency band, the plurality of electrode patterns form a first interval between the split electrode and the corresponding electrode and a second interval between the split electrode and the ground electrode with different sizes.

24. A method for tuning a radio frequency filter, in, include: The step of preparing a radio frequency filter, wherein the radio frequency filter comprises a filter housing, a plurality of resonant elements and a printed circuit board cover, wherein the printed circuit board cover has a plurality of electrode patterns formed on the upper portion of the resonant element in order to adjust the design frequency characteristics and is equipped with a tuning connection cover; The step of connecting the prepared radio frequency filter to a frequency measuring device; The step of measuring the frequency characteristics of the radio frequency filter; A step of checking whether a target frequency characteristic of the radio frequency filter is measured; In the case where the target frequency characteristic is not measured, a step of electrically connecting at least one of a corresponding electrode provided in the center and a split electrode provided in an outer direction thereof, and a split electrode and a ground electrode provided in an outer direction thereof, by adjusting the position of the connection portion of the tuning connection cover; The step of re-measuring the frequency characteristics of the radio frequency filter whose connection position of the tuning connection cover has been adjusted; and The step of adjusting the position of the connection portion of the tuning connection cover and the step of re-measuring the frequency characteristic are repeatedly performed until the target frequency characteristic is measured.

25. The method for tuning a radio frequency filter according to claim 24, wherein: The split electrode is split into a plurality of electrodes, and at least one of the split electrodes is electrically connected to the corresponding electrode by adjusting the position of a first tuning connection portion provided on the tuning connection cover.

26. The method for tuning a radio frequency filter according to claim 25, wherein: In the split electrodes, at least one of the split electrodes is electrically connected to the ground electrode by adjusting the position of a second tuning connection portion provided on the tuning connection cover.

27. The method for tuning a radio frequency filter according to claim 26, wherein: The split electrodes are formed to have different sizes in order to adjust the frequency band.

28. The method for tuning a radio frequency filter according to claim 27, wherein: In order to adjust the shift width of the frequency band, the plurality of electrode patterns form a first interval between the split electrode and the corresponding electrode and a second interval between the split electrode and the ground electrode with different sizes.

29. An antenna module, in, include: An antenna substrate (100) includes an antenna (110); A packaging substrate (200) is combined with a radio frequency integrated circuit chip (210) and is formed with a signal transmission line (220) for transmitting signals of the radio frequency integrated circuit chip; and The interconnection component (300) is located between the antenna substrate (100) and the packaging substrate (200), connects the antenna substrate (100) and the packaging substrate (200), and forms a narrow slot (310) for radio frequency signals to pass through.

30. The antenna module according to claim 29, characterized in that: The antenna substrate (100) comprises a plurality of antennas (110), and the plurality of antennas are arranged at a certain distance to form an antenna array.

31. The antenna module according to claim 29, wherein: The antenna substrate (100) comprises a first shielding portion (120) arranged at an edge of the slot (310), The packaging substrate (200) comprises a second shielding portion (230) arranged at an edge of the narrow slot (310).

32. The antenna module according to claim 31, wherein: A first radio frequency signal transmission part (101) is formed in the center by arranging a plurality of the first shielding parts (120) in a form surrounding the narrow slot (310). A second radio frequency signal transmission part (201) is formed in the center by arranging a plurality of the second shielding parts (230) in a form surrounding the narrow slot (310).

33. The antenna module according to claim 31, wherein: The second shielding portion (230) comprises: a plurality of grounding layers (231) arranged in a spaced relationship; and a plurality of shielding vias (232) electrically connecting the grounding layers (231). Any one ground layer selected from the plurality of ground layers (231) is arranged to face the slot (310) with the signal transmission line (220) interposed therebetween.

34. The antenna module according to claim 31, wherein: The antenna substrate (100) comprises a first coupling portion (130) located between the antenna (110) and the slot (310) for transmitting a radio frequency signal; The packaging substrate (200) comprises a second coupling portion (240) having one side connected to the signal transmission line (220) and the other side located at a position in contact with the narrow slot (310) so as to transmit a radio frequency signal.

35. The antenna module according to claim 34, wherein: The ends of the first coupling portion (130) and the second coupling portion (240) are arranged to face each other with the narrow slot (310) interposed therebetween.

36. The antenna module according to claim 29, wherein: The interconnection component (300) includes a groove space (320) formed on a lower side facing the packaging substrate (200).

37. The antenna module according to claim 29, wherein: The interconnection component (300) has an outer side formed with a conductor and an inner side formed with a different type of material having a lower density than the conductor.

38. The antenna module according to claim 29, wherein: The interconnection component (300) includes a slot component (330) provided in the slot (310), The slot member (330) is a dielectric.

39. The antenna module according to claim 29, wherein: include: The heat dissipation component (400) is bonded to any one or more side surfaces of the antenna substrate (100), the packaging substrate (200) and the interconnection component (300).

40. The antenna module according to claim 29, wherein: The interconnection component (300) comprises: a first interconnection member (300A) bonded to the underside of the antenna substrate (100); and a second interconnection component (300B) bonded to the upper side of the package substrate (200), The first interconnection member (300A) and the second interconnection member (300B) are formed with alignment portions for aligning positions at which they are fastened to each other.

41. The antenna module according to claim 29, wherein: The interconnection member (300) includes a ridge-forming protrusion (340) formed to protrude toward the slot (310).

42. The antenna module according to claim 41, wherein: The ridge-forming protrusion (340) is formed in plurality, and the plurality of ridge-forming protrusions (340) are constructed in different sizes and shapes.

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