Cleaning auxiliary device applied to vacuum sputter coating

Abstract

The cleaning auxiliary device comprises a process coating cavity, a transition cavity is formed in one side of the process coating cavity, a wafer or shielding plate inlet and outlet is further formed in the side, adjacent to the transition cavity, of the process coating cavity, and a working gas input channel is formed in the bottom of the process coating cavity. The transition cavity is communicated with the process coating cavity, a rotary shielding mechanism and a jacking mechanism are arranged in the process coating cavity, and when the process coating cavity needs to be cleaned, the rotating mechanism rotates the shielding plate to the upper part of the working gas input channel to shield the working gas input channel and prevent the working gas input channel from being blocked in the cleaning process; the target material or the gas material falls into the working gas input channel, and when process coating is carried out, the rotating mechanism rotates the shielding plate to the transition cavity so as to prevent the shielding plate from influencing the input of the working gas to cause non-uniform sputter coating; and when the shielding plate needs to be replaced, the wafer is output after the shielding plate is jacked up by a jacking claw of the lifting device or the shielding plate inlet and outlet is automatically replaced.

Description

Technical Field

[0001] The present invention relates to the technical field of sputtering coating, and more specifically, to a cleaning auxiliary device applied to vacuum sputtering coating. Background Art

[0002] Sputtering deposition is a physical vapor deposition (PVD) process that is widely used in thin film preparation. The principle of sputtering deposition is to bombard the target material with high-energy particles and knock out the target particles on the target material, so that the target particles are deposited to form a thin film. However, after the high-energy particles bombard the target material, the high-energy particles will adhere to the target material, resulting in the formation of a thin film doped with other particles when another particle is used to bombard the target material again, affecting the reliability of sputtering deposition.

[0003] Therefore, it is necessary to clean other particles on the target material during the next coating process. However, during the cleaning process, since the working gas input channel is always connected, the target material or gas material falls into the working gas input channel, causing contamination of the working gas input channel. Summary of the invention

[0004] In view of this, in order to solve the above problems, the present invention proposes a cleaning auxiliary device for vacuum sputtering coating, comprising a process coating chamber 10, a transition chamber 20 is provided on one side of the process coating chamber 10, a wafer or shielding plate 60 inlet and outlet is further provided on the side of the adjacent transition chamber 20 of the process coating chamber 10, a working gas input channel 30 is provided at the bottom of the process coating chamber 10, the transition chamber 20 is communicated with the process coating chamber 10, a rotating shielding mechanism 40 and a lifting mechanism 100 are provided in the process coating chamber 10, and when the process coating chamber 10 needs to be cleaned, the rotating mechanism 40 is The shield plate 60 is rotated to the upper part of the working gas input channel 30 to shield the working gas input channel 30 to prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, causing contamination of the working gas input channel 30. When the process coating is performed, the rotating mechanism 41 rotates the shield plate 60 to the transition chamber 20 to prevent the shield plate 60 from affecting the input of the working gas of the working gas input channel 30, causing uneven sputtering coating. When the shield plate 60 needs to be replaced, the shield plate 60 is lifted up by the lifting claw 103 of the lifting device 101 to output the wafer or the inlet and outlet of the shield plate 60 are automatically replaced.

[0005] A cleaning auxiliary device for vacuum sputtering coating includes a process coating chamber 10, characterized in that: a transition chamber 20 is provided on one side of the process coating chamber 10, a wafer or shielding plate 60 inlet and outlet is also provided on the side of the adjacent transition chamber 20 of the process coating chamber 10, a working gas input channel 30 is provided at the bottom of the process coating chamber 10, the transition chamber 20 is communicated with the process coating chamber 10, a rotating shielding mechanism 40 and a lifting mechanism 100 are provided in the process coating chamber 10, and the rotating shielding mechanism 40 The support plate 70 includes a shield plate 60, a supporting plate 70 and a rotating mechanism 41. The shield plate 60 is clamped with the supporting plate 70. A rotating mechanism 41 is provided at a lower part of one side of the supporting plate 70. The supporting plate 70 is rotated by the rotating mechanism 41, so that the supporting plate 70 carries the shield plate 60. The supporting plate 70 is a special-shaped structure. The supporting plate 70 includes a main bearing plate 72 and a first supporting claw 73 and a second supporting claw 74 extending outward. The first supporting claw 73 and the second supporting claw 74 are integrally formed with the main bearing plate 72. The first supporting claw 73 and the second supporting claw 74 are integrally formed with the main bearing plate 72. A relief is provided at the connection between the second supporting claw 74 and the main bearing plate 72. The lifting mechanism 100 includes a lifting device 101 and a lifting ring 102. The lifting device 101 is connected to the lower part of the lifting ring 102. The lifting ring 102 is located at the lower part of the supporting plate 70 and has a plurality of lifting claws 103 arranged at intervals on the lifting ring 102. The lifting claws 103 can pass through the relief and perform lifting and lowering movements. When the process coating chamber 10 needs to be cleaned, the rotating mechanism 41 rotates the shielding plate 60 to the upper part of the working gas input channel 30 to shield the working gas from the working gas. The working gas input channel 30 is used to prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, causing contamination of the working gas input channel 30. When the process coating is carried out, the rotating mechanism 41 rotates the shield 60 to the transition chamber 20 to prevent the shield 60 from affecting the input of the working gas into the working gas input channel 30, causing uneven sputtering coating. When the shield 60 needs to be replaced, the shield 60 is lifted up by the lifting claw 103 of the lifting device 101 and the wafer is output, or the inlet and outlet of the shield 60 are automatically replaced.

[0006] Furthermore, a position detection mechanism 21 is provided at the transition chamber 20. When the rotating mechanism 41 rotates the baffle 60 to the transition chamber 20, the position detection mechanism 21 detects the baffle 60 and is used to give the process coating chamber 10 a signal to start the coating process.

[0007] Furthermore, the area of ​​the shielding plate 60 is larger than the diameter of the working gas input channel 30 , so as to completely shield the working gas input channel 30 .

[0008] Furthermore, the top of the working gas input channel 30 is connected to the wafer carrier plate, and a plurality of vents 31 are provided on the wafer carrier plate. The working gas input channel 30 is connected to the vents 31, and when the process coating chamber 10 needs to be cleaned, the shield 60 covers the vents 31.

[0009] Furthermore, the shielding plate 60 is a disc-shaped structure, and the lower surface of the disc-shaped structure has an annular limiting boss 61 protruding from the outer circle. The upper surface of the supporting plate 70 is provided with a plurality of limiting columns 71, and the outer diameter of the circle formed by the limiting columns 71 just matches the inner diameter of the annular limiting boss 61. The outer sides of the plurality of limiting columns 71 are in contact with the inner wall of the annular limiting boss 61, so that when the supporting plate 70 rotates, the shielding plate 60 and the supporting plate 70 are in a relatively static state.

[0010] In some embodiments, the rotating mechanism 41 includes a magnetic fluid 42 and a rotating shaft 44, a connecting rod 46 and a cylinder 48 which are sleeved inside the magnetic fluid 42. One end of the rotating shaft 44 is locked to the support plate 70 through a support plate mounting column 90, and the other end is rotatably connected to one end of the connecting rod 46 through a first connecting rod shaft clamp 45. The other end of the connecting rod 46 is connected to the cylinder shaft 49 of the cylinder 48 through a second connecting rod shaft clamp 47. The body of the magnetic fluid 42 is locked to the bottom of the outer shell of the process coating chamber 10, and the rotating shaft 44 of the magnetic fluid 42 is driven by the cylinder 48 to rotate, which drives the support plate 70 to rotate.

[0011] Furthermore, a photoelectric switch mounting bracket 52 is locked to the lower part of the body of the cylinder 48, and a photoelectric switch 53 is provided at both ends of the photoelectric switch mounting bracket 52. The two photoelectric switches 53 are arranged on the outer ring of the cylinder shaft 49, and a limit block 51 is provided on one side of the cylinder shaft 49. When the limit block 51 rotates into the groove of one of the photoelectric switches 53, the photoelectric switch 53 receives the signal and transmits the signal to the cylinder 48 controller to stop the rotation of the cylinder shaft 49. The photoelectric switch 53 plays a role in precise positioning.

[0012] Furthermore, one of the photoelectric switches 53 is set at a position where the cylinder 48 can rotate with the baffle 60 to the transition chamber 20, and the other photoelectric switch 53 is set at a position where the cylinder 48 can rotate with the baffle 60 to the upper part of the working gas input channel 30.

[0013] Furthermore, a first water cooling mechanism 43 is provided on the body of the magnetic fluid 42. Since the processing technology of the process coating chamber 10 requires heating, in order to prevent the magnetic fluid 42 from being damaged by heat, the body of the magnetic fluid 42 needs to be cooled.

[0014] Furthermore, a second water cooling mechanism 80 is provided on the upper part of the cylinder 48. Since the processing technology of the process coating cavity 10 requires heating, the cylinder 48 is relatively close to the bottom of the process coating cavity 10. In order to avoid damage to the cylinder 48 caused by heat, it is necessary to isolate the cylinder 48 from the bottom of the process coating cavity 10 by water cooling.

[0015] Beneficial effects of the present invention: The present invention proposes a cleaning auxiliary device for vacuum sputtering coating, comprising a process coating chamber 10, a transition chamber 20 is provided on one side of the process coating chamber 10, a wafer or shielding plate 60 inlet and outlet is also provided on the side of the adjacent transition chamber 20 of the process coating chamber 10, a working gas input channel 30 is provided at the bottom of the process coating chamber 10, the transition chamber 20 is connected with the process coating chamber 10, a rotating shielding mechanism 40 and a lifting mechanism 100 are provided in the process coating chamber 10, and when the process coating chamber 10 needs to be cleaned, the rotating mechanism 41 will shield the The plate 60 rotates to the upper part of the working gas input channel 30 to shield the working gas input channel 30 to prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, causing contamination of the working gas input channel 30. When the process coating is carried out, the rotating mechanism 41 rotates the shield 60 to the transition chamber 20 to prevent the shield 60 from affecting the input of the working gas into the working gas input channel 30, causing uneven sputtering coating. When the shield 60 needs to be replaced, the shield 60 is lifted up by the lifting claw 103 of the lifting device 101 to output the wafer or the inlet and outlet of the shield 60 are automatically replaced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is the overall structural diagram of the sputtering coating machine of the present invention.

[0017] Figure 2 It is a three-dimensional diagram of the cleaning auxiliary device used for vacuum sputtering coating of the present invention.

[0018] Figure 3 It is a top view of the structure of the cleaning auxiliary device used for vacuum sputtering coating of the present invention.

[0019] Figure 4 This is a structural diagram of the connection between the support plate and the rotating mechanism of the cleaning auxiliary device for vacuum sputtering coating of the present invention.

[0020] Figure 5 It is a structural diagram of the rotating mechanism of the cleaning auxiliary device applied to vacuum sputtering coating of the present invention.

[0021] Figure 6 This is a structural diagram of the connection between the support plate and the lifting mechanism of the cleaning auxiliary device for vacuum sputtering coating of the present invention.

[0022] Figure 7 The present invention is a structural diagram of the lifting mechanism of the cleaning auxiliary device used for vacuum sputtering coating.

[0023] Figure 8 This is a connection structure diagram of the working gas input channel, the rotating shielding mechanism, and the lifting mechanism of the cleaning auxiliary device applied to vacuum sputtering coating of the present invention.

[0024] Fig. 9 This is a disassembled partial enlarged view of the working gas input channel and the rotating shielding mechanism of the cleaning auxiliary device for vacuum sputtering coating of the present invention.

[0025] Main component symbols

[0026] Process coating chamber 10, transition chamber 20, position detection mechanism 21, working gas input channel 30, vent 31, rotating shielding mechanism 40, rotating mechanism 41, magnetic fluid 42, first water cooling mechanism 43, rotating shaft 44, first connecting rod shaft clamp 45, connecting rod 46, second connecting rod shaft clamp 47, cylinder 48, cylinder shaft 49, limit block 51, photoelectric switch mounting bracket 52, photoelectric switch 53, shield plate 60, annular limit boss 61, support plate 70, limit column 71, main bearing plate 72, first supporting claw 73, second supporting claw 74, second water cooling mechanism 80, support plate mounting column 90, lifting mechanism 100, lifting device 101, lifting ring 102, lifting claw 103.

[0027] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION Embodiment 1:

[0028] like Figure 1 , Figure 2 , Figure 6 , Figure 7 , Figure 8As shown, a cleaning auxiliary device for vacuum sputtering coating includes a process coating chamber 10, characterized in that: a transition chamber 20 is provided on one side of the process coating chamber 10, and a wafer or shielding plate 60 inlet and outlet are also provided on the side of the adjacent transition chamber 20 of the process coating chamber 10, a working gas input channel 30 is provided at the bottom of the process coating chamber 10, the transition chamber 20 is communicated with the process coating chamber 10, a rotating shielding mechanism 40 and a lifting mechanism 100 are provided in the process coating chamber 10, and the rotating shielding mechanism The support plate 70 includes a shield plate 60, a support plate 70 and a rotating mechanism 41. The shield plate 60 is clamped with the support plate 70. The lower part of one side of the support plate 70 is provided with a rotating mechanism 41. The support plate 70 is rotated by the rotating mechanism 41, so that the support plate 70 carries the shield plate 60. The support plate 70 is a special-shaped structure. The support plate 70 includes a main bearing plate 72 and a first supporting claw 73 and a second supporting claw 74 extending outward. The first supporting claw 73 and the second supporting claw 74 are integrally formed with the main bearing plate 72. The first supporting claw 73 and the second supporting claw 74 are integrally formed with the main bearing plate 72. A relief is provided at the connection between the second supporting claw 74 and the main bearing plate 72. The lifting mechanism 100 includes a lifting device 101 and a lifting ring 102. The lifting device 101 is connected to the lower part of the lifting ring 102. The lifting ring 102 is located at the lower part of the supporting plate 70 and has a plurality of lifting claws 103 arranged at intervals on the lifting ring 102. The lifting claws 103 can pass through the relief and perform lifting and lowering movements. When the process coating chamber 10 needs to be cleaned, the rotating mechanism 41 rotates the shielding plate 60 to the upper part of the working gas input channel 30 to shield the working gas from the gas inlet channel 30. The working gas input channel 30 is used to prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, causing contamination of the working gas input channel 30. When the process coating is carried out, the rotating mechanism 41 rotates the shield 60 to the transition chamber 20 to prevent the shield 60 from affecting the input of the working gas into the working gas input channel 30, causing uneven sputtering coating. When the shield 60 needs to be replaced, the shield 60 is lifted up by the lifting claw 103 of the lifting device 101 and the wafer is output, or the inlet and outlet of the shield 60 are automatically replaced.

[0029] A position detection mechanism 21 is provided at the transition chamber 20. When the rotating mechanism 41 rotates the baffle 60 to the transition chamber 20, the position detection mechanism 21 detects the baffle 60, which is used to give the process coating chamber 10 a signal that can start the coating process. The area of ​​the baffle 60 is larger than the diameter of the working gas input channel 30, and is used to completely block the working gas input channel 30.

[0030] like Fig. 9As shown, the top of the working gas input channel 30 is connected to the wafer carrier plate, and a plurality of vents 31 are provided on the wafer carrier plate. The working gas input channel 30 is connected to the vents 31. When the process coating chamber 10 needs to be cleaned, the shield 60 covers the vents 31.

[0031] like Figure 3 As shown, the shielding plate 60 is a disc-shaped structure, and the lower surface of the disc-shaped structure has an annular limiting boss 61 protruding from the outer circle. The upper surface of the supporting plate 70 is provided with a plurality of limiting columns 71, and the outer diameter of the circle formed by the limiting columns 71 just matches the inner diameter of the annular limiting boss 61. The outer sides of the plurality of limiting columns 71 are in contact with the inner wall of the annular limiting boss 61, so that when the supporting plate 70 rotates, the shielding plate 60 and the supporting plate 70 are in a relatively static state.

[0032] like Figure 3-4 As shown, the rotating mechanism 41 includes a magnetic fluid 42 and a rotating shaft 44, a connecting rod 46 and a cylinder 48 which are sleeved inside the magnetic fluid 42. One end of the rotating shaft 44 is locked to the supporting plate 70 through the supporting plate mounting column 90, and the other end is rotatably connected to one end of the connecting rod 46 through the first connecting rod shaft clamp 45. The other end of the connecting rod 46 is connected to the cylinder shaft 49 of the cylinder 48 through the second connecting rod shaft clamp 47. The body of the magnetic fluid 42 is locked to the bottom of the outer shell of the process coating chamber 10, and the rotating shaft 44 of the magnetic fluid 42 is driven by the cylinder 48 to rotate, thereby driving the supporting plate 70 to rotate.

[0033] A first water cooling mechanism 43 is provided on the body of the magnetic fluid 42. Since the processing technology of the process coating cavity 10 requires heating, in order to avoid damage to the magnetic fluid 42 caused by heat, the body of the magnetic fluid 42 needs to be cooled. A second water cooling mechanism 80 is provided on the upper part of the cylinder 48. Since the processing technology of the process coating cavity 10 requires heating, the cylinder 48 is relatively close to the bottom of the process coating cavity 10. In order to avoid damage to the cylinder 48 caused by heat, the cylinder 48 needs to be water-cooled and isolated from the bottom of the process coating cavity 10.

[0034] like Figure 5As shown, the lower part of the body of the cylinder 48 is locked with a photoelectric switch mounting bracket 52, and a photoelectric switch 53 is provided at both ends of the photoelectric switch mounting bracket 52. The two photoelectric switches 53 are arranged on the outer ring of the cylinder shaft 49, and a limit block 51 is provided on one side of the cylinder shaft 49. When the limit block 51 rotates into the groove of one of the photoelectric switches 53, the photoelectric switch 53 receives the signal and transmits the signal to the cylinder 48 controller to stop the rotation of the cylinder shaft 49. The photoelectric switch 53 plays a role in precise positioning. The position where one of the photoelectric switches 53 is set is the position where the cylinder 48 can rotate with the baffle 60 to the transition cavity 20, and the position where the other photoelectric switch 53 is set is the position where the cylinder 48 can rotate with the baffle 60 to the upper part of the working gas input channel 30.

[0035] Beneficial effects of the present invention: The present invention proposes a cleaning auxiliary device for vacuum sputtering coating, comprising a process coating chamber 10, a transition chamber 20 is provided on one side of the process coating chamber 10, a wafer or shielding plate 60 inlet and outlet is also provided on the side of the adjacent transition chamber 20 of the process coating chamber 10, a working gas input channel 30 is provided at the bottom of the process coating chamber 10, the transition chamber 20 is connected with the process coating chamber 10, a rotating shielding mechanism 40 and a lifting mechanism 100 are provided in the process coating chamber 10, and when the process coating chamber 10 needs to be cleaned, the rotating mechanism 41 will shield the The plate 60 rotates to the upper part of the working gas input channel 30 to shield the working gas input channel 30 to prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, causing contamination of the working gas input channel 30. When the process coating is carried out, the rotating mechanism 41 rotates the shield 60 to the transition chamber 20 to prevent the shield 60 from affecting the input of the working gas into the working gas input channel 30, causing uneven sputtering coating. When the shield 60 needs to be replaced, the shield 60 is lifted up by the lifting claw 103 of the lifting device 101 to output the wafer or the inlet and outlet of the shield 60 are automatically replaced.

[0036] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A cleaning auxiliary device for vacuum sputtering coating, comprising a process coating chamber (10), characterized in that: A transition chamber (20) is provided on one side of the process coating chamber (10); a wafer or shielding plate (60) inlet and outlet are also provided on one side of the process coating chamber (10) adjacent to the transition chamber (20); a working gas input channel (30) is provided at the bottom of the process coating chamber (10); the transition chamber (20) is in communication with the process coating chamber (10); a rotating shielding mechanism (40) and a lifting mechanism (100) are provided in the process coating chamber (10); the rotating shielding mechanism (40) comprises a shielding plate (60), a supporting plate (70) and a rotating mechanism (41); the shielding plate ( The support plate (60) is clamped with a support plate (70), a rotating mechanism (41) is provided at a lower part of one side of the support plate (70), and the support plate (70) is rotated by the rotating mechanism (41), so that the support plate (70) carries the shielding plate (60), the support plate (70) is a special-shaped structure, the support plate (70) comprises a main bearing plate (72) and a first supporting claw (73) and a second supporting claw (74) extending outwardly, the first supporting claw (73) and the second supporting claw (74) are integrally formed with the main bearing plate (72), and the first supporting claw (73) and the second supporting claw (74) are integrally formed with the main bearing plate (72), and the first supporting claw (73) and the second supporting claw (74) are integrally formed with the main bearing plate (72). 2), the lifting mechanism (100) comprises a lifting device (101) and a lifting ring (102), the lifting device (101) is connected to the lower part of the lifting ring (102), the lifting ring (102) is located at the lower part of the supporting plate (70), and a plurality of lifting claws (103) are arranged at intervals on the lifting ring (102), the lifting claws (103) can pass through the avoiding position and perform lifting and lowering movements, when it is necessary to clean the process coating chamber (10), the rotating mechanism (41) rotates the shielding plate (60) to the upper part of the working gas input channel (30) to shield the working gas input channel (30). The shield (60) is placed in the working gas input channel (30) to prevent the target material or gas material from falling into the working gas input channel (30) during the cleaning process, thereby causing contamination of the working gas input channel (30). When the coating process is performed, the rotating mechanism (41) rotates the shield (60) to the transition chamber (20) to prevent the shield (60) from affecting the input of the working gas into the working gas input channel (30), thereby causing uneven sputtering coating. When the shield (60) needs to be replaced, the shield (60) is lifted up by the lifting claw (103) of the lifting device (101) to output the wafer, or the inlet and outlet of the shield (60) are automatically replaced.

2. The cleaning auxiliary device for vacuum sputtering coating according to claim 1, characterized in that: A position detection mechanism (21) is provided at the transition chamber (20); when the rotating mechanism (41) rotates the baffle (60) to the transition chamber (20), the position detection mechanism (21) detects the baffle (60) and is used to give the process coating chamber (10) a signal capable of starting a coating process.

3. The cleaning auxiliary device for vacuum sputtering coating according to claim 1, characterized in that: The area of ​​the shielding plate (60) is larger than the diameter of the working gas input channel (30), and is used to completely shield the working gas input channel (30).

4. The cleaning auxiliary device for vacuum sputtering coating according to claim 1, characterized in that: The top of the working gas input channel (30) is connected to a wafer carrier plate, and a plurality of vent holes (31) are provided on the wafer carrier plate. The working gas input channel (30) is connected to the vent holes (31), and when the process coating chamber (10) needs to be cleaned, the shielding plate (60) covers the top of the vent holes (31).

5. The cleaning auxiliary device for vacuum sputtering coating according to claim 1, characterized in that: The shielding plate (60) is a disc-shaped structure, and an annular limiting boss (61) protrudes from the outer circle of the lower surface of the disc-shaped structure. The upper surface of the supporting plate (70) is provided with a plurality of limiting columns (71), and the outer diameter of the circle formed by the limiting columns (71) just matches the inner diameter of the annular limiting boss (61). The outer sides of the plurality of limiting columns (71) are in contact with the inner wall of the annular limiting boss (61), so that when the supporting plate (70) rotates, the shielding plate (60) and the supporting plate (70) are in a relatively static state.

6. The cleaning auxiliary device for vacuum sputtering coating according to claim 1, characterized in that: The rotating mechanism (41) includes a magnetic fluid (42) and a rotating shaft (44), a connecting rod (46) and a cylinder (48) which are sleeved inside the magnetic fluid (42). One end of the rotating shaft (44) is locked to the support plate (70) through a support plate mounting column (90), and the other end is rotatably connected to one end of the connecting rod (46) through a first connecting rod shaft clamp (45). The other end of the connecting rod (46) is connected to the cylinder shaft (49) of the cylinder (48) through a second connecting rod shaft clamp (47). The body of the magnetic fluid (42) is locked to the bottom of the outer shell of the process coating chamber (10), and the rotating shaft (44) of the magnetic fluid (42) is driven to rotate by the cylinder (48), thereby driving the support plate (70) to rotate.

7. The cleaning auxiliary device for vacuum sputtering coating according to claim 6, characterized in that: A photoelectric switch mounting bracket (52) is locked to the lower part of the body of the cylinder (48), and a photoelectric switch (53) is provided at both ends of the photoelectric switch mounting bracket (52). The two photoelectric switches (53) are arranged on the outer ring of the cylinder shaft (49), and a limit block (51) is provided on one side of the cylinder shaft (49). When the limit block (51) rotates into a groove of one of the photoelectric switches (53), the photoelectric switch (53) receives a signal and transmits the signal to the cylinder controller, thereby stopping the rotation of the cylinder shaft (49). The photoelectric switch (53) plays a role in precise positioning.

8. The cleaning auxiliary device for vacuum sputtering coating according to claim 7, characterized in that: One of them The photoelectric switch (53) is arranged at a position where the cylinder (48) can rotate with the baffle (60) to the transition chamber (20), and the other photoelectric switch (53) is arranged at a position where the cylinder (48) can rotate with the baffle (60) to the upper part of the working gas input channel (30).

9. The cleaning auxiliary device for vacuum sputtering coating according to claim 6, characterized in that: A first water cooling mechanism (43) is provided on the body of the magnetic fluid (42). Since the processing technology of the process coating cavity (10) requires heating, in order to prevent the magnetic fluid (42) from being damaged by heat, the body of the magnetic fluid (42) needs to be cooled.

10. The cleaning auxiliary device for vacuum sputtering coating according to claim 6, characterized in that: A second water cooling mechanism (80) is provided on the upper portion of the cylinder (48). Since the processing technology of the process coating cavity (10) requires heating, the cylinder (48) is relatively close to the bottom of the process coating cavity (10). In order to prevent the cylinder (48) from being damaged by heat, it is necessary to isolate the cylinder (48) from the bottom of the process coating cavity (10) by water cooling.

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