Semiconductor device steady-state thermal resistance testing device

Abstract

The invention belongs to the technical field of semiconductor testing, and discloses a semiconductor device steady-state thermal resistance testing device which comprises a box body, a control device is arranged on one side in the box body, an operation table is arranged on the other side of the box body, a testing plate is arranged on the top of the operation table, and supporting frames are arranged on the two sides of the operation table. A moving structure is arranged in the middle of the supporting frame, a testing sensor is arranged at the bottom of the moving structure, a testing groove is formed in the middle of the testing plate, and a semiconductor device is arranged in the testing groove. A semiconductor device is clamped and fixed through the clamping block and the moving block, meanwhile, the semiconductor device is cleaned through the cleaning structure, dust and impurities are prevented from adhering to the surface, the surface of the semiconductor device is prevented from being uneven, then the surface of the semiconductor device is evenly coated with heat conduction paste through movement of the scraper, gaps are effectively filled, and the heat conduction efficiency is improved. And meanwhile, the heat conduction effect is enhanced, so that contact thermal resistance is prevented from influencing the test effect.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor testing, and in particular relates to a semiconductor device steady-state thermal resistance testing device. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium or gallium arsenide. They can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. In order to distinguish them from integrated circuits, they are sometimes also called discrete devices. The basic structure of most two-terminal devices (i.e. crystal diodes) is a PN junction. When users test semiconductor devices, they need to use a semiconductor device steady-state thermal resistance test device, which is a device used to measure the thermal resistance of semiconductor devices in a stable state. Its main functions include measuring the steady-state thermal resistance, transient thermal impedance, thermal capacitance and other parameters of semiconductor devices, and being able to analyze the thermal structure inside the device package.

[0003] In the prior art, if there are gaps or unevenness in the contact interface between the semiconductor device and the test device, contact thermal resistance will be generated, which will cause the overall measured thermal resistance value to be larger than the actual intrinsic thermal resistance value of the device, resulting in an inability to accurately reflect the true thermal performance of the device. In addition, the contact thermal resistance may fluctuate to a certain extent due to slight differences in each installation of the device, affecting the test results. Summary of the invention

[0004] The present invention aims at solving the problems in the prior art and proposes the following technical solutions: A semiconductor device steady-state thermal resistance test device comprises a box body, a control device is arranged on one side of the box body, an operating table is arranged on the other side, a test board is arranged on the top of the operating table, support frames are arranged on both sides of the operating table, a moving structure is arranged in the middle of the support frame, a test sensor is arranged at the bottom of the moving structure, a test slot is arranged in the middle of the test board, a semiconductor device is arranged in the test slot, moving slots are arranged on both sides of the test slot and on the top of the test board, a first electric push rod is fixedly installed on the inner wall of the moving slot, a moving block is fixedly installed on one end of the first electric push rod, a clamping block is arranged on the top of the moving block, a second electric push rod is arranged in the middle of the clamping block, and the clamping blocks are close to each other. A mounting groove is provided on the side, a cleaning structure is provided inside the mounting groove, a fixed block is provided on one side of the test plate, a first motor is provided inside the fixed block, a rotating rod is transmission-connected to the output end of the first motor, the top of the rotating rod is rotationally connected to the inner wall of the fixed block, the bottom of the fixed block is rotationally connected to the top of the operating table, a connecting block is fixedly installed on one side of the fixed block, a storage box is fixedly installed on the top of one end of the connecting block, a connecting pipe is fixedly installed on the bottom of the storage box, a mounting block is fixedly installed on the other side of the fixed block, a slide groove is provided at the bottom of the mounting block, a second motor is provided inside the slide groove, a threaded rod is transmission-connected to the output end of the second motor, a scraper is threadedly connected to one end of the threaded rod, and the top of the scraper is slidingly connected to the inner wall of the slide groove.

[0005] As a preferred embodiment of the above technical solution, the first electric push rod, the moving block and the clamping block are symmetrically arranged around the center of the test slot, the moving block and the clamping block are in contact with each other on one side, the semiconductor device is located between the moving block and the clamping block, and the top of the clamping block is flush with the top of the semiconductor device.

[0006] As a preferred embodiment of the above technical solution, a plug rod is fixedly installed on one side of the left clamping block and one side of the right moving block, and a slot is opened on one side of the right clamping block and the left moving block, the plug rod is plugged into the slot, and the bottom of the moving block is slidably connected to the inner wall of the bottom of the moving groove.

[0007] As a preferred embodiment of the above technical solution, a placement groove is opened at the bottom of the moving block, the second motor push rod is fixedly installed in the placement groove, one end of the second electric push rod passes through the bottom of the clamping block and extends into the installation groove, a pushing block is fixedly installed on the top of the second electric push rod, and limiting structures are provided on both sides of the pushing block and the top of the second electric push rod.

[0008] As a preferred embodiment of the above technical solution, thermal conductive paste is provided inside the storage box, one end of the connecting tube passes through the connecting block and extends to the top of the semiconductor device, the test sensor is located between the storage box and the top of the semiconductor device, the mounting block and the connecting block are vertically arranged, the bottom of the first motor is fixedly installed on the top of the operating table, the second motor is fixedly installed on the inner wall of the slide groove, and the threaded rod is rotatably connected to the inner wall of the slide groove at one end away from the second motor.

[0009] As a preferred embodiment of the above technical solution, the cleaning structure includes a first cleaning block, first racks are fixedly installed on both sides of the first cleaning block, a gear is meshed with one side of the first rack, a movable rod is fixedly installed in the middle of the gear, a second rack is meshed with one side of the gear, a connecting plate is fixedly installed on one side of the second rack, a second cleaning block is fixedly installed on one side of the connecting plate, a movable groove is provided on the side of the first rack away from the gear, an electric telescopic rod is fixedly installed inside the movable groove, and one end of the electric telescopic rod is fixedly installed to the inner wall of the mounting groove.

[0010] As a preferred embodiment of the above technical solution, the first cleaning block and the second cleaning block are located at the notch of the mounting groove, the first rack and the second rack are both slidably connected to the inner wall of the mounting groove, the movable rod is rotatably connected to the inner wall of the mounting groove inside the left clamping block, the gear and the movable rod are both located inside the left mounting groove, one end of the second rack passes through the right mounting groove and extends to the inside of the left mounting groove, the first cleaning block, the second cleaning block, the connecting plate, the first rack, the second rack, the gear, the movable rod and the electric telescopic rod are all symmetrically arranged around the center of the clamping block.

[0011] As a preferred embodiment of the above technical solution, the limiting structure includes two limiting blocks, the tops of the two limiting blocks are slidably connected to the inner wall of the mounting groove, the two limiting blocks are located on both sides of the pushing block, the two limiting blocks are fixedly installed with a connecting rod on the side away from the pushing block, a connecting spring is fixedly installed at one end of the connecting rod, and one end of the connecting spring is fixedly installed to the inner wall of the mounting groove, a limiting hole is opened at one end of the second electric push rod close to the pushing block, a limiting rod is inserted into the limiting hole, one end of the limiting rod extends through the mounting groove to the outside of the clamping block, and a movable block is fixedly installed at one end of the limiting rod.

[0012] As a preferred embodiment of the above technical solution, the two limiting blocks are fitted with the opposite side of the pushing block, and the fitted sides are both inclined surfaces, the connecting rod and the connecting spring are both located at the top of the electric telescopic rod, the limiting rod is located at the bottom of the electric telescopic rod, the movable block is located on both sides of the clamping block, the two limiting blocks, the connecting rod, the limiting rod and the connecting spring are all located on one side of the first cleaning block and the second cleaning block, and they are symmetrically arranged around the center of the mounting groove.

[0013] The beneficial effects of the present invention are: (1) The present invention clamps and fixes the semiconductor device by means of a clamping block and a moving block, and cleans the semiconductor device by means of a cleaning structure to prevent dust and impurities from adhering to the surface and making the surface of the semiconductor device uneven. The thermal conductive paste is then evenly applied to the surface of the semiconductor device by means of the movement of a scraper, effectively filling the gaps and enhancing the heat conduction effect, thereby preventing the generation of contact thermal resistance and affecting the test effect. (2) The present invention limits the second electric push rod in the installation groove inside the clamping block through the limiting structure, so that the first electric push rod can drive the moving block and the clamping block to remain stable when moving, and by pulling the movable block, the limiting rod no longer limits the second electric push rod, and then the clamping block is moved upward, so that the limiting block no longer limits the second electric push rod and the clamping block, so that the clamping block can be removed from the moving block, which is convenient for cleaning the residual thermal conductive paste and the cleaning structure, so that it is convenient for reuse, improving the cleaning effect of the semiconductor device, and facilitating improving the test effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 What is shown is a schematic diagram of the overall structure of the embodiment; Figure 2 What is shown is a structural diagram of the operating platform, the support frame and the mobile structure of the embodiment; Figure 3 Shown is a front view of the operating platform, support frame and mobile structure of the embodiment; Figure 4 What is shown is the structural diagram of the operating platform and the test board of the embodiment; Figure 5 Shown is a bottom structure diagram of a fixing block, a connecting block, and a mounting block of an embodiment; Figure 6 Shown is a structural diagram of an operating table, a test plate, a clamping block and a moving block of an embodiment; Figure 7 What is shown is a structural diagram of a clamping block and a moving block of an embodiment; Figure 8 What is shown is the structural diagram of the clamping block and the cleaning structure of the embodiment; Fig. 9 Shown is a cross-sectional view of a clamping block of an embodiment; Fig.10 Shown is a structural diagram of the cleaning mechanism and limiting structure of the embodiment.

[0015] In the figure: 1, box; 2, control equipment; 3, operating table; 4, test board; 5, support frame; 6, moving structure; 7, test sensor; 8, semiconductor device; 9, first electric push rod; 10, moving block; 11, clamping block; 12, second electric push rod; 13, cleaning structure; 131, first cleaning block; 132, first rack; 133, gear; 134, second rack; 135, connecting plate; 136, second cleaning block; 137, electric telescopic rod; 14, fixed block; 15, first motor; 16, rotating rod; 17, connecting block; 18, storage box; 19, connecting pipe; 20, mounting block; 21, second motor; 22, threaded rod; 23, scraper; 24, plug rod; 25, push block; 26, limiting block; 27, connecting rod; 28, connecting spring; 29, limiting rod; 30, movable block. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0017] The present invention provides a semiconductor device steady-state thermal resistance test device, such as Figures 1 to 7 As shown, it includes a box body 1, a control device 2 is arranged on one side of the box body 1, and an operating table 3 is arranged on the other side thereof, a test board 4 is arranged on the top of the operating table 3, support frames 5 are arranged on both sides of the operating table 3, a moving structure 6 is arranged in the middle of the support frame 5, and a test sensor 7 is arranged at the bottom of the moving structure 6, a test slot is opened in the middle of the test board 4, a semiconductor device 8 is arranged inside the test slot, and moving slots are opened on both sides of the test slot and on the top of the test board 4, a first electric push rod 9 is fixedly installed on the inner wall of the moving slot, a moving block 10 is fixedly installed at one end of the first electric push rod 9, a clamping block 11 is arranged on the top of the moving block 10, a second electric push rod 12 is arranged in the middle of the clamping block 11 and the moving block 10, an installation slot is opened on one side close to the clamping block 11, and a cleaning structure 13 is arranged inside the installation slot, a fixed block 14 is arranged on one side of the test board 4, a first motor 15 is arranged inside the fixed block 14, and a rotating rod 16 is transmission-connected to the output end of the first motor 15, and the top of the rotating rod 16 is connected to the fixed block 1 4 inner wall is rotatably connected, the bottom of the fixed block 14 is rotatably connected to the top of the operating table 3, a connecting block 17 is fixedly installed on one side of the fixed block 14, a storage box 18 is fixedly installed on the top of one end of the connecting block 17, and a connecting pipe 19 is fixedly installed on the bottom of the storage box 18. A mounting block 20 is fixedly installed on the other side of the fixed block 14. A slide groove is opened at the bottom of the mounting block 20, and a second motor 21 is arranged inside the slide groove. A threaded rod 22 is transmission-connected to the output end of the second motor 21, and a scraper 23 is threadedly connected to one end of the threaded rod 22. The top of the scraper 23 is slidably connected to the inner wall of the slide groove. Thermal conductive paste is arranged inside the storage box 18. One end of the connecting pipe 19 passes through the connecting block 17 and extends to the top of the semiconductor device 8. The test sensor 7 is located at the top of the storage box 18 and the semiconductor device 8. The mounting block 20 is vertically arranged with the connecting block 17. The bottom of the first motor 15 is fixedly installed on the top of the operating table 3, the second motor 21 is fixedly installed on the inner wall of the slide groove, and the end of the threaded rod 22 away from the second motor 21 is rotatably connected to the inner wall of the slide groove.

[0018] The semiconductor device 8 is placed inside the test slot of the test board 4, and the first electric push rod 9 is started to drive the moving block 10 and the clamping block 11 to move, so that the moving block 10 and the clamping block 11 move closer to each other and move to both sides of the semiconductor device 8, and the semiconductor device 8 is clamped and fixed to prevent the semiconductor device 8 from moving during the test, thereby affecting the test effect. When the moving block 10 and the clamping block 11 move to both sides of the semiconductor device 8, the second electric push rod 12 is started to drive the clamping block 11 to move upward, so that the cleaning structure 13 inside the clamping block 11 moves to the top of the clamping block 11, and the cleaning structure 13 is started. The top of the semiconductor device 8 is cleaned to remove impurities and dust on the surface of the semiconductor device 8 to prevent the impurities and dust from adhering to the top of the semiconductor device 8, which may cause the top of the semiconductor device 8 to be uneven and generate a gap between the semiconductor device 8 and the test sensor 7, thereby affecting the test result. After the cleaning is completed, the clamping block 11 and the cleaning structure 13 are moved to their original positions by the second electric push rod 12, and the thermal paste in the storage box 18 is transported to the top of the semiconductor device 8 through the connecting pipe 19. The first motor 15 in the fixing block 14 is started to drive the threaded rod 22 to rotate, so that the fixing block 14 drives the connecting block 17 to rotate along the top of the operating table 3, and the fixing block 14 The connecting block 17, the storage box 18 and the connecting tube 19 are rotated 90 degrees to one side of the test board 4, so that the mounting block 20 and the scraper 23 are rotated to the top of the semiconductor device 8, and the second motor 21 is started to drive the threaded rod 22 to rotate, so that the scraper 23 moves back and forth along the threaded rod 22, and the bottom of the scraper 23 evenly applies the thermal paste on the top of the semiconductor device 8, and then the second motor 21 drives the rotating rod 16 and the fixed block 14 to rotate, so that the fixed block 14 is rotated 90 degrees again, and the connecting block 17, the storage box 18 and the connecting tube 19 are rotated to the rear side of the fixed block 14, and the mounting block 20 and the scraper 23 are rotated to the test board 4, and then apply the set electrical parameters to the semiconductor device 8 through the control device 2, so that it starts to heat up and enters the heat transfer process. At the same time, the fixed moving structure 6 is installed through the support frame 5, and the moving structure 6 drives the test sensor 7 to move to the top of the semiconductor device 8 through the control device 2, and fits it, and automatically collects temperature, power and other related data according to the sampling frequency. By cleaning the top of the semiconductor device 8 and applying evenly with thermal conductive paste, the gap between the semiconductor device 8 and the test sensor 7 can be effectively filled, and the heat conduction effect can be enhanced, thereby preventing the generation of contact thermal resistance and facilitating testing.

[0019] like Figure 3 to Figure 4 As shown, the first electric push rod 9, the moving block 10 and the clamping block 11 are symmetrically arranged around the center of the test slot, the moving block 10 and the clamping block 11 are fitted together on one side, the semiconductor device 8 is located between the moving block 10 and the clamping block 11, and the top of the clamping block 11 is flush with the top of the semiconductor device 8.

[0020] By symmetrically setting the first electric push rod 9, the moving block 10 and the clamping block 11, the first electric push rod 9 pushes the moving block 10 and the clamping block 11 to move closer to each other so that the adjacent sides fit together, thereby improving the stability of clamping the semiconductor device 8. Since the top of the clamping block 11 is flush with the top of the semiconductor device 8, it is convenient to improve the uniformity of applying the thermal paste and prevent the thermal paste from being applied to the edge of the semiconductor device 8, which is inconvenient to clean.

[0021] like Figures 7 and 8 As shown, a plug rod 24 is fixedly installed on one side of the left clamping block 11 and one side of the right moving block 10, and a slot is opened on one side of the right clamping block 11 and the left moving block 10, and the plug rod 24 is plugged into the slot, and the bottom of the moving block 10 is slidably connected to the inner wall of the bottom of the moving groove.

[0022] When the first electric push rod 9 pushes the moving block 10 and the clamping block 11 to move toward the side of the semiconductor device 8, the clamping block 11 and one side of the moving block 10 move closer to each other, and the insertion rod 24 is plugged into the slot, thereby improving the stability of the moving block 10 and the clamping block 11 on the outside of the semiconductor device 8, facilitating the limitation of the semiconductor device 8, and preventing the semiconductor device 8 from moving during testing, thereby affecting the test effect.

[0023] like Figures 9 and 10 As shown, a placement groove is opened at the bottom of the moving block 10, the push rod of the second motor 21 is fixedly installed in the placement groove, one end of the second electric push rod 12 passes through the bottom of the clamping block 11 and extends to the inside of the installation groove, and a pushing block 25 is fixedly installed on the top of the second electric push rod 12, and limiting structures are arranged on both sides of the pushing block 25 and the top of the second electric push rod 12.

[0024] The placement groove makes it convenient to install the second electric push rod 12 on the moving block 10, and then the pushing block 25 is limited by the limiting structure, so that the second electric push rod 12 and the pushing block 25 can be fixed to the clamping block 11, so that when the moving block 10 moves, under the action of the second electric push rod 12, the pushing block 25 and the limiting structure, the clamping block 11 can be driven to move together, which is convenient for limiting the semiconductor device 8. At the same time, by moving the limiting structure, the pushing block 25 is no longer limited. The second electric push rod 12 is started to drive the pushing block 25 to move out of the installation groove of the clamping block 11, which is convenient for removing the clamping block 11 and cleaning the cleaning structure 13 inside the installation groove, so that it is convenient for reuse, thereby improving the cleaning effect of the semiconductor device 8 and improving the testing effect.

[0025] like Figures 7 to 9As shown, the cleaning structure 13 includes a first cleaning block 131, first racks 132 are fixedly installed on both sides of the first cleaning block 131, a gear 133 is meshed on one side of the first rack 132, a movable rod is fixedly installed in the middle of the gear 133, a second rack 134 is meshed on one side of the gear 133, a connecting plate 135 is fixedly installed on one side of the second rack 134, a second cleaning block 136 is fixedly installed on one side of the connecting plate 135, a movable groove is provided on the side of the first rack 132 away from the gear 133, an electric telescopic rod 137 is fixedly installed inside the movable groove, and one end of the electric telescopic rod 137 is fixedly installed to the inner wall of the mounting groove.

[0026] When the moving block 10 and one side of the clamping block 11 are in contact with each other, the first cleaning block 131 and the second cleaning block 136 are located on both sides of the semiconductor device 8. The second electric push rod 12 is first started to drive the clamping block 11 to move above the semiconductor device 8, and then the electric telescopic rod 137 is started to push the first rack 132 to move away from the mounting groove, so that the gear 133 drives the movable rod to rotate, thereby the second rack 134 drives the connecting plate 135 and the second cleaning block 136 to move away from the mounting groove, so that the first cleaning block 131 and the second cleaning block 136 move closer to each other, and the first cleaning block 131 and the second cleaning block 136 are moved back and forth on the top of the semiconductor device 8 by the extension and retraction of the electric telescopic rod 137 to clean it, so that the dust and impurities on the top of the semiconductor device 8 can be removed to prevent the surface of the semiconductor device 8 from being uneven, so that a gap is generated between the test sensor 7 and the semiconductor device 8, affecting the heat conduction effect and making it inconvenient to detect.

[0027] like Figures 8 to 10 As shown, the first cleaning block 131 and the second cleaning block 136 are located at the notch of the mounting groove, the first rack 132 and the second rack 134 are both slidably connected to the inner wall of the mounting groove, the movable rod is rotatably connected to the inner wall of the mounting groove inside the left clamping block 11, the gear 133 and the movable rod are both located inside the left mounting groove, one end of the second rack 134 passes through the right mounting groove and extends to the inside of the left mounting groove, the first cleaning block 131, the second cleaning block 136, the connecting plate 135, the first rack 132, the second rack 134, the gear 133, the movable rod and the electric telescopic rod 137 are all symmetrically arranged around the center of the clamping block 11.

[0028] When the moving block 10 and the clamping block 11 move toward each other, the second rack 134 moves to the inside of the mounting groove on the left and meshes with the gear 133. When the electric telescopic rod 137 drives the first cleaning block 131 to move from the mounting groove to the top of the semiconductor device 8, the first rack 132 moves along the inner wall of the mounting groove, so that the gear 133 drives the movable rod to rotate along the inner wall of the mounting groove, and the second rack 134 drives the connecting plate 135 to move along the inner wall of the mounting groove, so that the second cleaning block 136 moves from the mounting groove to the top of the semiconductor device 8, thereby facilitating cleaning. The symmetrically arranged first cleaning block 131, second cleaning block 136, connecting plate 135, first rack 132, second rack 134, gear 133, movable rod and electric telescopic rod 137 can improve the stability of the movement of the first cleaning block 131 and the second cleaning block 136, improve the cleaning effect, and facilitate use.

[0029] like Figures 9 and 10 As shown, the limiting structure includes two limiting blocks 26, the tops of the two limiting blocks 26 are slidably connected to the inner wall of the mounting groove, the two limiting blocks 26 are located on both sides of the pushing block 25, and a connecting rod 27 is fixedly installed on the side of the two limiting blocks 26 away from the pushing block 25, a connecting spring 28 is fixedly installed at one end of the connecting rod 27, and one end of the connecting spring 28 is fixedly installed to the inner wall of the mounting groove, a limiting hole is opened at one end of the second electric push rod 12 close to the pushing block 25, a limiting rod 29 is inserted into the limiting hole, one end of the limiting rod 29 passes through the mounting groove and extends to the outside of the clamping block 11, and a movable block 30 is fixedly installed at one end of the limiting rod 29.

[0030] When the movable block 30 is moved to both sides of the clamping block 11, the movable block 30 drives the limiting rod 29 to move away from each other and no longer connect with the limiting hole. Then the second electric push rod 12 is started to drive the pushing block 25 to move downward, so that the pushing block 25 is no longer in contact with one side of the two limiting blocks 26, and no longer squeezes the limiting block 26. The connecting spring 28 is no longer squeezed, and the connecting rod 27 and the limiting block 26 are pushed to move, so that the limiting blocks 26 move closer to each other, so that the clamping block 11 and the second electric push rod 12 and the pushing block 25 are no longer limited, and the clamping block 11 is moved upward, so that the clamping block 11 is removed and replaced, and the thermal conductive paste remaining in the clamping block 11 is cleaned, so that the first cleaning block 131 and the second cleaning block 136 inside the mounting groove can be cleaned and replaced, thereby facilitating the cleaning effect of the first cleaning block 131 and the second cleaning block 136.

[0031] like Fig.10As shown, the two limiting blocks 26 are fitted with the opposite side of the pushing block 25, and the fitted sides are both inclined, the connecting rod 27 and the connecting spring 28 are both located at the top of the electric telescopic rod 137, the limiting rod 29 is located at the bottom of the electric telescopic rod 137, the movable block 30 is located on both sides of the clamping block 11, the two limiting blocks 26, the connecting rod 27, the limiting rod 29 and the connecting spring 28 are all located on one side of the first cleaning block 131 and the second cleaning block 136, and they are symmetrically arranged around the center of the mounting groove.

[0032] By fitting the inclined surfaces of the two limiting blocks 26 with the inclined surface on one side of the pushing block 25, and by the action of the connecting spring 28 and the connecting rod 27, the stability is improved, so that the pushing block 25 and the second electric push rod 12 can be fixed inside the mounting groove and connected to the clamping block 11. Since the connecting rod 27 and the connecting spring 28 are both located at the top of the electric telescopic rod 137, and the limiting rod 29 is located at the bottom of the electric telescopic rod 137, the limiting rod 29 and the connecting rod 27 will not block the movement of the electric telescopic rod 137, thereby affecting the movement of the first cleaning block 131 and the second cleaning block 136. The stability of the limitation of the second electric push rod 12 and the pushing block 25 is improved by the two symmetrically arranged limiting blocks 26, the connecting rod 27, the limiting rod 29 and the connecting spring 28.

[0033] Working principle: When in use, the semiconductor device 8 is placed inside the test slot of the test board 4, and the first electric push rod 9 is started to drive the moving block 10 and the clamping block 11 to move, so that the moving block 10 and the clamping block 11 move closer to each other and move to both sides of the semiconductor device 8. The semiconductor device 8 is clamped and fixed by plugging the slot and the jack. When the moving block 10 and the clamping block 11 move to both sides of the semiconductor device 8, the second rack 134 moves to the inside of the mounting slot on the left and meshes with the gear 133. Then the second electric push rod 12 is started to drive the clamping block 11 to move upward, so that the clamping block 11 moves to the top of the semiconductor device 8, and then the electric telescopic rod 137 is started to push the first gear The rack 132 moves in a direction away from the mounting groove, so that the gear 133 drives the movable rod to rotate along the inner wall of the mounting groove, thereby driving the second rack 134 to drive the connecting plate 135 and the second cleaning block 136 to move in a direction away from the mounting groove, so that the first cleaning block 131 and the second cleaning block 136 move closer to each other, and the first cleaning block 131 and the second cleaning block 136 move back and forth on the top of the semiconductor device 8 through the extension and contraction of the electric telescopic rod 137 to clean it, so that the dust and impurities on the top of the semiconductor device 8 can be removed. After the cleaning is completed, the first cleaning block 131 is moved back and forth through the action of the electric telescopic rod 137, the first rack 132, the gear 133 and the second rack 134. 1 and the second cleaning block 136 are moved to the original position, and then the clamping block 11 is moved downward to the state flush with the semiconductor device 8 by the second electric push rod 12, and then the thermal paste in the storage box 18 is transported to the top of the semiconductor device 8 through the connecting pipe 19, and the first motor 15 in the fixing block 14 is started to drive the threaded rod 22 to rotate, so that the fixing block 14 drives the connecting block 17 to rotate along the top of the operating table 3, and the fixing block 14 is rotated ninety degrees, so that the connecting block 17, the storage box 18, and the connecting pipe 19 are rotated to one side of the test board 4, so that the mounting block 20 and the scraper 23 are rotated to the top of the semiconductor device 8, and the second motor 21 is started to drive the threaded rod 22 to rotate, so that the scraper 23 moves back and forth along the threaded rod 22, and its bottom evenly applies the thermal paste on the top of the semiconductor device 8, and then the second motor 21 drives the rotating rod 16 and the fixed block 14 to rotate, so that the fixed block 14 rotates ninety degrees again, and the connecting block 17, the storage box 18, and the connecting pipe 19 are rotated to the back side of the fixed block 14, and the mounting block 20 and the scraper 23 are rotated to one side of the test board 4, and then the set electrical parameters are applied to the semiconductor device 8 through the control device 2, so that it starts to heat up and enters the heat transfer process, and the mobile structure 6 drives the test sensor 7 to move to the top of the semiconductor device 8 through the control device 2, and fits with it, and automatically collects temperature, power and other related data according to the sampling frequency.

[0034] When it is necessary to replace the cleaning clamping block 11, the first cleaning block 131 and the second cleaning block 136, the movable block 30 is moved to both sides of the clamping block 11, and the movable block 30 drives the limiting rod 29 to move away from each other and no longer plugs into the limiting hole, and then the second electric push rod 12 is started to drive the pushing block 25 to move downward, so that the pushing block 25 is no longer in contact with one side of the two limiting blocks 26, and no longer squeezes the limiting block 26. The connecting spring 28 is no longer squeezed, and the connecting rod 27 and the limiting block 26 are pushed to move, so that the limiting blocks 26 move closer to each other, so that the clamping block 11 and the second electric push rod 12 and the pushing block 25 are no longer limited, and the clamping block 11 is moved upward so that the clamping block 11 is removed and replaced, and the thermal conductive paste remaining in the clamping block 11 is cleaned, and the first cleaning block 131 and the second cleaning block 136 inside the mounting groove can be cleaned and replaced, thereby facilitating the cleaning effect of the first cleaning block 131 and the second cleaning block 136.

[0035] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. A semiconductor device steady-state thermal resistance test device, comprising a box (1), characterized in that: A control device (2) is arranged on one side of the box body (1), and an operating table (3) is arranged on the other side thereof; a test board (4) is arranged on the top of the operating table (3); support frames (5) are arranged on both sides of the operating table (3); a moving structure (6) is arranged in the middle of the support frame (5); a test sensor (7) is arranged at the bottom of the moving structure (6); a test slot is arranged in the middle of the test board (4); a semiconductor device (8) is arranged inside the test slot; moving slots are arranged on both sides of the test slot and on the top of the test board (4); a first electric push rod (9) is fixedly installed on the inner wall of the moving slot; a moving block (10) is fixedly installed at one end of the first electric push rod (9); a clamping block (11) is arranged on the top of the moving block (10); a second electric push rod (12) is arranged between the clamping block (11) and the moving block (10); a mounting slot is arranged on the side close to the clamping block (11); a cleaning structure (13) is arranged inside the mounting slot A fixed block (14) is provided on one side of the test plate (4), a first motor (15) is provided inside the fixed block (14), an output end of the first motor (15) is connected to a rotating rod (16), a top of the rotating rod (16) is connected to the inner wall of the fixed block (14), a bottom of the fixed block (14) is connected to the top of the operating table (3), a connecting block (17) is fixedly installed on one side of the fixed block (14), a storage box (18) is fixedly installed on the top of one end of the connecting block (17), a connecting pipe (19) is fixedly installed on the bottom of the storage box (18), a mounting block (20) is fixedly installed on the other side of the fixed block (14), a sliding groove is provided at the bottom of the mounting block (20), a second motor (21) is provided inside the sliding groove, an output end of the second motor (21) is connected to a threaded rod (22), one end of the threaded rod (22) is threadedly connected to a scraper (23), and the top of the scraper (23) is connected to the inner wall of the sliding groove.

2. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: The first electric push rod (9), the moving block (10) and the clamping block (11) are symmetrically arranged around the center of the test slot; the moving block (10) and the clamping block (11) are in contact with each other on one side; the semiconductor device (8) is located between the moving block (10) and the clamping block (11); and the top of the clamping block (11) is flush with the top of the semiconductor device (8).

3. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: An insertion rod (24) is fixedly mounted on one side of the left clamping block (11) and one side of the right moving block (10). A slot is provided on one side of the right clamping block (11) and one side of the left moving block (10). The insertion rod (24) is plugged into the slot. The bottom of the moving block (10) is slidably connected to the inner wall of the bottom of the moving groove.

4. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: A placement groove is provided at the bottom of the moving block (10); a push rod of the second motor (21) is fixedly mounted in the placement groove; one end of the second electric push rod (12) passes through the bottom of the clamping block (11) and extends into the installation groove; a push block (25) is fixedly mounted on the top of the second electric push rod (12); and limiting structures are provided on both sides of the top of the push block (25) and the second electric push rod (12).

5. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: The storage box (18) is provided with thermal conductive paste inside, one end of the connecting tube (19) passes through the connecting block (17) and extends to the top of the semiconductor device (8), the test sensor (7) is located between the storage box (18) and the top of the semiconductor device (8), the mounting block (20) and the connecting block (17) are arranged vertically, the bottom of the first motor (15) is fixedly mounted on the top of the operating table (3), the second motor (21) is fixedly mounted on the inner wall of the slide groove, and the end of the threaded rod (22) away from the second motor (21) is rotatably connected to the inner wall of the slide groove.

6. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: The cleaning structure (13) comprises a first cleaning block (131), first racks (132) are fixedly mounted on both sides of the first cleaning block (131), a gear (133) is meshed on one side of the first rack (132), a movable rod is fixedly mounted in the middle of the gear (133), a second rack (134) is meshed on one side of the gear (133), a connecting plate (135) is fixedly mounted on one side of the second rack (134), a second cleaning block (136) is fixedly mounted on one side of the connecting plate (135), a movable groove is formed on the side of the first rack (132) away from the gear (133), an electric telescopic rod (137) is fixedly mounted inside the movable groove, and one end of the electric telescopic rod (137) is fixedly mounted to the inner wall of the mounting groove.

7. The semiconductor device steady-state thermal resistance testing device according to claim 6, characterized in that: The first cleaning block (131) and the second cleaning block (136) are located at the notch of the mounting groove, the first rack (132) and the second rack (134) are both slidably connected to the inner wall of the mounting groove, the movable rod is rotatably connected to the inner wall of the mounting groove inside the left clamping block (11), the gear (133) and the movable rod are both located inside the left mounting groove, one end of the second rack (134) passes through the right mounting groove and extends to the inside of the left mounting groove, and the first cleaning block (131), the second cleaning block (136), the connecting plate (135), the first rack (132), the second rack (134), the gear (133), the movable rod and the electric telescopic rod (137) are all symmetrically arranged around the center of the clamping block (11).

8. The semiconductor device steady-state thermal resistance testing device according to claim 4, characterized in that: The limiting structure comprises two limiting blocks (26), the tops of the two limiting blocks (26) are slidably connected to the inner wall of the installation groove, the two limiting blocks (26) are located on both sides of the pushing block (25), a connecting rod (27) is fixedly installed on the side of the two limiting blocks (26) away from the pushing block (25), a connecting spring (28) is fixedly installed on one end of the connecting rod (27), and one end of the connecting spring (28) is fixedly installed on the inner wall of the installation groove, and a limiting hole is opened at one end of the second electric push rod (12) close to the pushing block (25), a limiting rod (29) is inserted into the limiting hole, one end of the limiting rod (29) passes through the installation groove and extends to the outside of the clamping block (11), and one end of the limiting rod (29) is fixedly installed with a movable block (30).

9. The semiconductor device steady-state thermal resistance testing device according to claim 8, characterized in that: The two limiting blocks (26) are fitted with one side opposite to the pushing block (25), and the fitting sides are both inclined surfaces. The connecting rod (27) and the connecting spring (28) are both located at the top of the electric telescopic rod (137). The limiting rod (29) is located at the bottom of the electric telescopic rod (137). The movable block (30) is located at both sides of the clamping block (11). The two limiting blocks (26), the connecting rod (27), the limiting rod (29) and the connecting spring (28) are all located at one side of the first cleaning block (131) and the second cleaning block (136), and are symmetrically arranged around the center of the mounting groove.

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