Material strip tool structure for improving warping of organic substrate and use method of material strip tool structure

Abstract

The invention relates to the technical field of semiconductor packaging and manufacturing, and particularly discloses a material strip tool structure for improving warping of an organic substrate and a using method thereof.The material strip tool structure comprises a magnetic plate and a pressing plate, the magnetic plate and the pressing plate are installed on the two sides of the organic substrate respectively, a plurality of magnet positioning holes are formed in the magnetic plate, and the pressing plate is arranged on the magnetic plate; a plurality of hollow windows are arranged in the middle of the pressing plate, pressing plate positioning holes are formed in the two sides of the pressing plate, a plurality of base islands are arranged in the middle of the organic substrate, substrate positioning holes are formed in the two sides of the organic substrate, and the positioning pins sequentially penetrate through the substrate positioning holes and the pressing plate positioning holes. The organic substrate is mounted on the magnetic suction plate, and the pressing plate covers the organic substrate; wherein the organic substrate is completely attached to the magnetic attraction plate through attraction of the magnetic attraction plate and the pressing plate. According to the invention, the warping condition of the organic substrate can be effectively improved, and the quality and precision of glue drawing and surface mounting are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging manufacturing, and more specifically, to a strip tooling structure for improving warping of an organic substrate and a method for using the strip tooling structure for improving warping of an organic substrate. Background Art

[0002] With the development of integrated circuit technology, the requirements for integrated circuits have become more stringent. This is because packaging technology is related to the functionality of the product, but when the frequency of the IC exceeds 100MHz, the traditional packaging method may cause the so-called "CrossTalk" phenomenon, and when the number of IC pins is greater than 208 Pins, the traditional packaging method is particularly difficult. Therefore, in addition to using QFP packaging, most of the high-pin-count chips today use BGA (Ball Grid Array Package) packaging technology.

[0003] Memory packaged with BGA technology can increase the memory capacity by two to three times without changing the volume. Once BGA appeared, it became the best choice for high-density, high-performance, multi-functional and high-I / O pin packaging of VLSI chips such as CPU, north and south bridges. Its characteristics are: although the number of I / O pins has increased, the pin spacing is much larger than QFP, thus improving the assembly yield rate; although its power consumption has increased, BGA can be welded by user-controlled collapsed chip method, thus improving its electrothermal performance; parasitic parameters are reduced, signal transmission delay is small, and the frequency of use is greatly increased; coplanar welding can be used for assembly, with high reliability; thickness is reduced by more than 1 / 2 compared with QFP, and weight is reduced by more than 3 / 4.

[0004] However, since the thickness of the organic substrate is reduced by more than 1 / 2 and the weight is reduced by more than 3 / 4 compared with QFP, the organic substrate is more easily deformed by stress. The organic substrate will warp and deform during the high-temperature dehumidification process. When the loading equipment is operating, there is vacuum conduction between the organic substrate and the equipment carrier. Any deformation of the organic substrate or the equipment carrier at the interface between the two will cause the loss of vacuum, resulting in the inability to stably adsorb the material strips, which is not conducive to the operational stability of the operation process, increases the difficulty of equipment debugging, and reduces production efficiency. The warping and deformation of the organic substrate after loading will cause the loading glue to reflow, which will lead to chip offset, voids, etc. Summary of the invention

[0005] In order to solve the deficiencies in the prior art, the present invention provides a material strip tooling structure for improving the warping of an organic substrate and a method of using the same, which can effectively improve the warping of the organic substrate and improve the quality and precision of the adhesive and the patch.

[0006] As a first aspect of the present invention, a material strip tooling structure for improving the warping of an organic substrate is provided, comprising a magnetic suction plate and a pressure plate, wherein the magnetic suction plate and the pressure plate are respectively mounted on both sides of the organic substrate, a plurality of magnet positioning holes are provided on the magnetic suction plate, magnets are arranged in the magnet positioning holes, and the magnets can attract the pressure plate, positioning pins are provided on both sides of the magnetic suction plate, a plurality of hollow windows are provided in the middle of the pressure plate, pressure plate positioning holes are provided on both sides of the pressure plate, a plurality of base islands are provided in the middle of the organic substrate, the positions of the hollow windows match the positions of the base islands, substrate positioning holes are provided on both sides of the organic substrate, the positioning pins pass through the substrate positioning holes and the pressure plate positioning holes in sequence, so that the organic substrate is mounted on the magnetic suction plate, and the pressure plate cover is on the organic substrate; wherein, through the attraction of the magnetic suction plate and the pressure plate, the organic substrate is completely attached to the magnetic suction plate.

[0007] Furthermore, the size of the hollow window is smaller than the size of the base island, and ensures the contact surface between the pressing plate and the organic substrate.

[0008] Furthermore, the material of the pressing plate is selected to be a metal or alloy material that can be adsorbed by the magnet, and the pressing plate and the magnetic attraction plate are insulated.

[0009] Furthermore, the distribution of the magnets meets the border distribution of the pressure plate, the height of the magnets is less than the thickness of the magnetic attraction plate, and after the magnets are installed in the magnet positioning holes, both ends of the magnets do not protrude.

[0010] Furthermore, the length and width of the magnetic plate are greater than or equal to the length and width of the organic substrate, the length and width of the pressing plate are greater than or equal to the length and width of the organic substrate, the total thickness of the magnetic plate and the pressing plate is less than 3 mm, and the material hardness of the magnetic plate and the material hardness of the pressing plate are both greater than the deformation stress of the organic substrate.

[0011] Furthermore, the magnet is a Sm2Co17 samarium cobalt magnet with a maximum operating temperature of 350°C; the magnet can withstand the high-temperature dehumidification process specification temperature T1 of the organic substrate; the magnet can withstand the wafer glue curing process specification temperature T2; wherein the magnetic attraction of the magnet is greater than the deformation stress of the organic substrate.

[0012] Furthermore, the positions of the positioning pins match the positions of the substrate positioning holes and the pressure plate positioning holes respectively.

[0013] Furthermore, the bottom end of the magnet positioning hole is a large hole, and the hole diameter is larger than the diameter of the magnet; the upper end of the magnet positioning hole is a small hole, and the hole diameter is smaller than half of the diameter of the magnet.

[0014] Furthermore, the thickness of the magnetic plate is 1.5 mm, and the thickness of the pressing plate is 1 mm.

[0015] As a second aspect of the present invention, a method for using a strip tooling structure for improving warping of an organic substrate is provided, and the method for using a strip tooling structure for improving warping of an organic substrate comprises: Step S1: providing an organic substrate having the same size as the strip tooling structure, wherein the distribution of the base islands on the organic substrate is consistent with the distribution of the hollow windows; Step S2: aligning the substrate positioning hole with the positioning pin and embedding it, and then aligning the pressing plate positioning hole with the positioning pin and embedding it; after the assembly is completed, performing high-temperature dehumidification on the organic substrate; Step S3: the dehumidified organic substrate and the strip tooling structure are placed on the machine together, and the chip is mounted by glue; after mounting, the organic substrate and the strip tooling structure are subjected to the step of mounting glue curing.

[0016] The material strip tooling structure for improving the warping of the organic substrate provided by the present invention and the use method thereof have the following advantages: by installing the magnetic suction plate and the pressure plate on both sides of the organic substrate, the deformation space of the organic substrate is reduced, the deformation ability of the organic substrate in a high temperature environment can be effectively curbed, the warping of the organic substrate can be effectively improved, the quality and accuracy of the painting glue and the patch can be improved, and the reflow of the mounting glue caused by the warping and deformation of the organic substrate after mounting can be avoided, thereby avoiding the occurrence of chip offset and voids. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but do not constitute a limitation of the present invention.

[0018] Figure 1 This is a schematic structural diagram of the magnetic attraction plate provided by the present invention.

[0019] Figure 2 A cross-sectional view of the magnetic attraction plate provided by the present invention.

[0020] Figure 3 This is a schematic structural diagram of the organic substrate provided by the present invention.

[0021] Figure 4 This is a schematic structural diagram of the pressing plate provided by the present invention.

[0022] Figure 5 This is a combined plan view of the magnetic attraction plate, organic substrate and pressing plate provided by the present invention.

[0023] Figure 6 This is a schematic diagram of the structure of the base island provided by the present invention.

[0024] Figure 7 This is a schematic structural diagram of the hollow window provided by the present invention.

[0025] In the figure: 1-magnet; 2-positioning pin; 3-base island; 4-substrate positioning hole; 5-hollow window; 6-pressing plate positioning hole; 7-pressing plate; 8-magnetic suction plate; 9-organic substrate; 10-frame. DETAILED DESCRIPTION

[0026] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following is a detailed description of the specific implementation, structure, characteristics and effects of the material strip tooling structure and the use method for improving the warping of the organic substrate proposed by the present invention in combination with the accompanying drawings and preferred embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so as to describe the embodiments of the present invention described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0028] In the interpretation of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense unless otherwise specified. For example, the connection can be a fixed connection, or it can be connected through a special interface, or it can be indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] Example 1 In this embodiment, a strip tooling structure for improving the warping of an organic substrate is provided, such as Figure 1-7As shown, the material strip tooling structure for improving the warping of the organic substrate includes a magnetic suction plate 8 and a pressing plate 7, the magnetic suction plate 8 and the pressing plate 7 are respectively installed on both sides of the organic substrate 9, the magnetic suction plate 8 is provided with a plurality of magnet positioning holes, a magnet 1 is arranged in the magnet positioning hole, the magnet 1 can attract the pressing plate 7, positioning pins 2 are arranged on both sides of the magnetic suction plate 8, a plurality of hollow windows 5 are arranged in the middle of the pressing plate 7, pressing plate positioning holes 6 are arranged on both sides of the pressing plate 7, a plurality of base islands 3 are arranged in the middle of the organic substrate 9, the position of the hollow window 5 matches the position of the base island 3, substrate positioning holes 4 are arranged on both sides of the organic substrate 9, the positioning pins 2 pass through the substrate positioning holes 4 and the pressing plate positioning holes 6 in sequence, so that the organic substrate 9 is installed on the magnetic suction plate 8, and the pressing plate 7 covers the organic substrate 9; wherein, through the attraction of the magnetic suction plate 8 and the pressing plate 7, the organic substrate 9 is completely attached to the magnetic suction plate 8.

[0030] Preferably, the size of the hollow window 5 is smaller than the size of the base island 3, but cannot touch the product bonding area, and ensures that the contact surface between the pressing plate 7 and the organic substrate 9 is Figure 7 The area between the red border and the green border.

[0031] Preferably, the material of the pressing plate 7 is a metal or alloy material that can be adsorbed by the magnet 1, and the material of the magnetic attraction plate 8 is 7075 aluminum alloy; the surfaces of the pressing plate 7 and the magnetic attraction plate 8 are insulated, and a ceramic coating is sprayed using a thermal spraying process. The coating has the advantages of high hardness, wear resistance, and good insulation.

[0032] Specifically, the material of the pressing plate 7 is an iron-nickel alloy, which has the advantage of a low thermal expansion coefficient and will not exert thermal stress on the organic substrate 9 during the heating process.

[0033] Preferably, the distribution of the magnet 1 satisfies the distribution of the frame 10 of the pressure plate 7, the height of the magnet 1 is less than the thickness of the magnetic attraction plate 8, and after the magnet 1 is installed in the magnet positioning hole, the two ends of the magnet 1 do not protrude.

[0034] Preferably, the length and width of the magnetic plate 8 are greater than or equal to the length and width of the organic substrate 9, the length and width of the pressing plate 7 are greater than or equal to the length and width of the organic substrate 9, the total thickness of the magnetic plate 8 and the pressing plate 7 is less than 3 mm, and the material hardness of the magnetic plate 8 and the material hardness of the pressing plate 7 are both greater than the deformation stress of the organic substrate 9.

[0035] Specifically, the magnet 1 is a Sm2Co17 samarium cobalt magnet with a maximum operating temperature of 350°C; the magnet 1 can withstand the standard temperature T1 of the high-temperature dehumidification process of the organic substrate to avoid high-temperature demagnetization; the magnet 1 can withstand the standard temperature T2 of the mounting glue curing process to avoid high-temperature demagnetization; wherein the magnetic attraction of the magnet 1 is greater than the deformation stress of the organic substrate 9.

[0036] Specifically, the positions of the positioning pins 2 match the positions of the substrate positioning holes 4 and the pressure plate positioning holes 6 respectively.

[0037] Preferably, the bottom end of the magnet positioning hole is a large hole, the hole diameter of which is larger than the diameter of the magnet 1 ; the upper end of the magnet positioning hole is a small hole, the hole diameter of which is smaller than half of the diameter of the magnet 1 .

[0038] Preferably, the thickness of the magnetic attraction plate 8 is 1.5 mm, and the thickness of the pressing plate 7 is 1 mm.

[0039] Example 2 As another embodiment of the present invention, a method for using a strip tooling structure for improving warping of an organic substrate is provided, and the method for using a strip tooling structure for improving warping of an organic substrate comprises: Step S1: providing an organic substrate 9 of the same size as the strip tooling structure, and the distribution of the base islands 3 on the organic substrate 9 is consistent with the distribution of the hollow windows 5; Step S2: align the substrate positioning hole 4 with the positioning pin 2 and embed it, and then align the pressing plate positioning hole 6 with the positioning pin 2 and embed it; after the assembly is completed, put it into an oxygen-free oven, and perform high-temperature dehumidification on the organic substrate 9 by continuous heating. The oxygen-free oven is MOLYY216Q1-sp1N, the high-temperature dehumidification temperature is 125°C, and the high-temperature dehumidification time is 240min; Step S3: Take out the dehumidified organic substrate 9 together with the material strip tooling structure from the anaerobic oven, put them on the machine together and carry out chip mounting with glue, the chip mounting equipment is ESEC 2100hs; after mounting, put the organic substrate 9 together with the material strip tooling structure of the present invention into the anaerobic oven again to carry out the chip mounting glue curing step for the organic substrate 9 together with the material strip tooling structure, the chip mounting glue is 2100A, the curing temperature is 175°C, and the curing time is 60min.

[0040] It should be noted that the strip tooling structure can be directly put into operation after the high-temperature dehumidification process of the organic substrate 9 is completed, without the need to remove the strip tooling structure; after the chip is mounted, the strip tooling structure can directly enter the oxygen-free oven to participate in the chip mounting glue curing process.

[0041] Comparative Example 1: Step S1: providing an organic substrate 9 identical to that of Example 2, inserting two layers of RF4 boards under the organic substrate 9 and placing the substrate in a material box, and placing the substrate in an oxygen-free oven for high-temperature dehumidification of the organic substrate 9, the oxygen-free oven being MOLYY216Q1-sp1N, the high-temperature dehumidification temperature being 125°C, and the high-temperature dehumidification time being 240 min; Step S2: Take out the organic substrate 9 after high-temperature dehumidification, and directly draw glue and mount the chip. The mounting equipment is ESEC 2100hs. After mounting, put 2 layers of RF4 boards under the organic substrate 9 and place it in the material box. Put it in the oxygen-free oven again for mounting glue curing. The mounting glue is 2100A, the curing temperature is 175°C, and the curing time is 60min.

[0042] It should be noted that the organic substrates 9 used in Example 2 and Comparative Example 1 are of the same model and batch, the mounting glue is the same, the equipment used is the same, and the mounted chips are bare silicon of the same size.

[0043] Comparative Example 1 is an organic substrate that does not use the material strip tooling structure of the present invention. After the mounting adhesive is cured, the warping range of the organic substrate is 43 μm, and the proportion of single voids is 1.3%; Example 2 is an organic substrate that uses the tooling of the present invention. After the mounting adhesive is cured, the warping range of the organic substrate is 15 μm, and the proportion of single voids is 0.12%.

[0044] In summary, the material strip tooling structure for improving the warping of the organic substrate proposed in the present invention can be directly put into operation on the machine after the organic substrate is dehumidified at high temperature, and can also be heated together after loading and during the curing stage of the loading glue. The material strip tooling structure of the present invention can be matched with a variety of pressing plates for use, effectively improving the warping of the organic substrate and effectively improving the quality and accuracy of the dotting glue and the patch.

[0045] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A strip tooling structure for improving the warping of an organic substrate, characterized in that: The invention comprises a magnetic suction plate (8) and a pressing plate (7), wherein the magnetic suction plate (8) and the pressing plate (7) are respectively mounted on two sides of an organic substrate (9), the magnetic suction plate (8) is provided with a plurality of magnet positioning holes, a magnet (1) is arranged in the magnet positioning hole, and the magnet (1) is capable of attracting the pressing plate (7), positioning pins (2) are arranged on two sides of the magnetic suction plate (8), a plurality of hollow windows (5) are arranged in the middle of the pressing plate (7), a plurality of pressing plate positioning holes (6) are arranged on two sides of the pressing plate (7), and a plurality of The base island (3) is provided with a position of the hollow window (5) matching the position of the base island (3); substrate positioning holes (4) are provided on both sides of the organic substrate (9); the positioning pins (2) pass through the substrate positioning holes (4) and the pressure plate positioning holes (6) in sequence, so that the organic substrate (9) is mounted on the magnetic attraction plate (8), and the pressure plate (7) covers the organic substrate (9); wherein, through the attraction of the magnetic attraction plate (8) and the pressure plate (7), the organic substrate (9) is completely attached to the magnetic attraction plate (8).

2. The strip tooling structure for improving the warping of an organic substrate according to claim 1, characterized in that: The size of the hollow window (5) is smaller than the size of the base island (3), and ensures the contact surface between the pressing plate (7) and the organic substrate (9).

3. The strip tooling structure for improving the warping of an organic substrate according to claim 1, characterized in that: The material of the pressing plate (7) is a metal or alloy material that can be adsorbed by the magnet (1), and the pressing plate (7) and the magnetic attraction plate (8) are insulated.

4. The strip tooling structure for improving the warping of an organic substrate according to claim 1, characterized in that: The distribution of the magnet (1) satisfies the distribution of the frame (10) of the pressing plate (7), the height of the magnet (1) is less than the thickness of the magnetic attraction plate (8), and after the magnet (1) is installed in the magnet positioning hole, both ends of the magnet (1) do not protrude.

5. The strip tooling structure for improving the warping of an organic substrate according to claim 1, characterized in that: The length and width of the magnetic attraction plate (8) are greater than or equal to the length and width of the organic substrate (9); the length and width of the pressing plate (7) are greater than or equal to the length and width of the organic substrate (9); the total thickness of the magnetic attraction plate (8) and the pressing plate (7) is less than 3 mm; and the material hardness of the magnetic attraction plate (8) and the material hardness of the pressing plate (7) are both greater than the deformation stress of the organic substrate (9).

6. The strip tooling structure for improving the warping of an organic substrate according to claim 1, characterized in that: The magnet (1) is a Sm2Co17 samarium cobalt magnet having a maximum operating temperature of 350° C.; the magnet (1) can withstand the temperature T1 of the high-temperature dehumidification process of the organic substrate; the magnet (1) can withstand the temperature T2 of the curing process of the wafer adhesive; wherein the magnetic attraction of the magnet (1) is greater than the deformation stress of the organic substrate (9).

7. The strip tooling structure for improving the warpage of an organic substrate according to claim 1, characterized in that: The positions of the positioning pins (2) respectively match the positions of the substrate positioning holes (4) and the pressure plate positioning holes (6).

8. The strip tooling structure for improving the warping of an organic substrate according to claim 1, characterized in that: The bottom end of the magnet positioning hole is a large hole, the hole diameter of which is larger than the diameter of the magnet (1); the top end of the magnet positioning hole is a small hole, the hole diameter of which is smaller than half the diameter of the magnet (1).

9. The strip tooling structure for improving the warping of an organic substrate according to claim 1, characterized in that: The thickness of the magnetic attraction plate (8) is 1.5 mm, and the thickness of the pressing plate (7) is 1 mm.

10. A method for using the strip tooling structure for improving the warping of an organic substrate according to any one of claims 1 to 9, characterized in that: The method for using the strip tooling structure for improving the warping of the organic substrate includes: Step S1: providing an organic substrate (9) having the same size as the material strip tooling structure, wherein the distribution of the base islands (3) on the organic substrate (9) is consistent with the distribution of the hollow windows (5); Step S2: aligning the substrate positioning hole (4) with the positioning pin (2) and embedding it, and then aligning the pressure plate positioning hole (6) with the positioning pin (2) and embedding it; after the assembly is completed, performing high-temperature dehumidification on the organic substrate (9); Step S3: placing the dehumidified organic substrate (9) together with the strip tooling structure on a machine, and performing adhesive bonding on the chip; after chip bonding, performing a chip bonding adhesive curing step on the organic substrate (9) together with the strip tooling structure.

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