Pressing device for integrated circuit board processing

Abstract

The invention relates to the technical field of press-fit devices, and discloses a press-fit device for integrated circuit board processing, which comprises a bottom plate, the top of the bottom plate is fixedly connected with a support plate, the top of the support plate is fixedly connected with a processing plate, and the top of the bottom plate is fixedly connected with an L-shaped plate I. According to the press-fit device, when the circuit board starts to be pressed, the processing plate is fixedly connected with the L-shaped plate; the first spring can effectively absorb vibration and impact in the pressing process, damage to the circuit board is prevented, uniform pressure distribution can be achieved in the pressing process through the elasticity of the first spring, good contact between the circuit board and the surface-mounted assembly is ensured through the uniformity, and therefore the subsequent welding quality is improved, and the production efficiency is improved. And meanwhile, a first connecting rod drives a first push plate to move leftwards, so that the pressed circuit board is pushed out, and the situation that the pressed circuit board is prone to dislocation due to manual taking of the circuit board, and then the finished product effect of the circuit board is affected is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of pressing devices, in particular to a pressing device for processing integrated circuit circuit boards. Background Art

[0002] The principle of PCB lamination The main purpose of lamination is to combine PP with different inner core boards and outer copper foils through "heat and pressure", and use the outer copper foil as the base of the outer circuit. Different PP compositions with different inner board materials and surface copper can be used to formulate circuit boards of different specifications and thicknesses. The lamination process is the most important process in the manufacture of PCB multilayer boards, and the basic quality indicators of PCB must be achieved after lamination.

[0003] The patent number CN219437273U relates to a multi-layer circuit board pressing device, which belongs to the technical field of circuit board pressing, including a protective cover, a frame, a pressing assembly and a safety grating; a gas tank is fixed in the frame, and a protective cover is fixed on the upper end of the frame; the pressing assembly is arranged on the upper surface of the frame, and the pressing assembly is located in the protective cover; the protective cover is a box body structure with an open front end, and the safety grating is arranged on both sides of the front end opening of the protective cover. The pressing device of this application improves the work efficiency and the safety of the circuit board during the pressing process to prevent the circuit board from being displaced or damaged. However, when the device presses the circuit board, the circuit board is easily damaged due to excessive pressing and cannot be used, thereby affecting the yield of the circuit board during production. Therefore, a pressing device for integrated circuit circuit board processing is proposed to solve the above-mentioned problems. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a pressing device for processing integrated circuit circuit boards in view of the deficiencies in the above-mentioned prior art.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: a pressing device for processing integrated circuit circuit boards, comprising a base plate, the top of the base plate is fixedly connected to a support plate, the top of the support plate is fixedly connected to a processing plate, and the top of the base plate is fixedly connected to an L-shaped plate; the top of the L-shaped plate is provided with an extrusion device, the top of the processing plate is provided with a discharge device, and the bottom of the processing plate is provided with a heating device; the extrusion device comprises a cylinder, a fixed plate, a connecting block, a connecting rod, a limit frame, a spring, a pressure plate, a push plate, and a sliding block, the cylinder is fixedly connected to the top of the L-shaped plate, the fixed plate is fixedly connected to the output end of the cylinder, the connecting block is fixedly connected to the top of the fixed plate, the connecting rod is rotatably connected to the inner wall of the connecting block, the limit frame is fixedly connected to the top of the processing plate, the spring is fixedly connected to the bottom of the fixed plate, the pressure plate is fixedly connected to the bottom of the spring, and the push plate is rotatably connected to the connecting rod. The circumferential surface of the sliding block is fixedly connected to the bottom of the push plate, the telescopic end of the cylinder contacts the inner wall of the L-shaped plate, the rear part of the connecting rod contacts the front part of the limit frame, the circumferential surface of the connecting rod contacts the inner wall of the limit frame, the bottom of the push plate contacts the top of the inner wall of the limit frame, and the surface of the sliding block is slidably connected to the inner wall of the limit frame, so that when the circuit board starts to be pressed, the spring can effectively absorb the vibration and impact from the pressing process when the circuit board is pressed, and prevent damage to the circuit board. Through the elasticity of the spring, uniform pressure distribution can be achieved during the pressing process. This uniformity ensures good contact between the circuit board and the mounting component, thereby improving the subsequent welding quality. At the same time, the connecting rod drives the push plate to move to the left, thereby pushing out the pressed circuit board, avoiding manual picking of the circuit board, which may easily cause the circuit board that has just been pressed to be dislocated, thereby affecting the finished product effect of the circuit board.

[0006] Preferably, the discharging device includes connecting block 2, connecting rod 2, push plate 2, hollow frame, spring 2, and L-shaped plate 2, the connecting block 2 is fixedly connected to the top of the fixed plate, the connecting rod 2 is rotatably connected to the inner wall of the connecting block 2, the push plate 2 is rotatably connected to the circumferential surface of the connecting rod 2, the hollow frame is fixedly connected to the top of the processing plate, the spring 2 is fixedly connected to the inner wall of the hollow frame, the L-shaped plate 2 is fixedly connected to the left side of the spring 2, and the discharging device also includes sliding block 2, inclined plate 1, limit block, movable plate, inclined plate 2, the sliding block 2 is slidably connected to the inner wall of the limit frame, the inclined plate 1 is fixedly connected to the front of the sliding block 2, the limit block is fixedly connected to the front of the sliding block 2, the movable plate is rotatably connected to the inner wall of the sliding block 2, and the inclined plate 2 is fixedly connected to the fixed On the left side of the plate, the bottom of the push plate 2 is slidably connected to the top of the processing plate, the surface of the L-shaped plate 2 is in contact with the inner wall of the hollow frame, the rear part of the inclined plate 1 is in contact with the inner wall of the limit frame, the left side of the limit block is in contact with the right side of the movable plate, and the bottom of the movable plate is in contact with the top of the inner wall of the limit frame. When the circuit board is pushed out of the limit frame, the adhesive squeezed out during the circuit board pressing process can be scraped off, so that the adhesive flows into the collection box through the gap in the limit frame. At the same time, the movement of the connecting rod 3 drives the heating rod to move, so that the adhesive flowing inside the collection box can be heated to avoid the solidification of the adhesive affecting the secondary utilization of the adhesive, and the adhesive can be stirred to reduce the solidification of the adhesive, which is convenient for the subsequent removal of the adhesive.

[0007] Preferably, the heating device comprises an inclined block, an L-shaped plate three, a connecting rod three, a collecting box, a T-shaped plate, a heating rod, a connecting plate, a rotating rod, a transmission wheel, and a stirring plate. The inclined block is rotatably connected to the circumferential surface of the connecting rod one, the L-shaped plate three is rotatably connected to the circumferential surface of the connecting rod one, the connecting rod three is fixedly connected to the bottom of the L-shaped plate three, the collecting box is fixedly connected to the top of the bottom plate, the T-shaped plate is fixedly connected to the circumferential surface of the connecting rod three, the heating rod is fixedly connected to the inner wall of the connecting rod three, the connecting plate is fixedly connected to the bottom of the T-shaped plate, the rotating rod is rotatably connected to the inner wall of the connecting plate, and the transmission wheel is fixedly connected to the circumferential surface of the rotating rod. The stirring plate is fixedly connected to the circumferential surface of the rotating rod, the surface of the inclined block is slidably connected to the inner wall of the limit frame, the circumferential surface of the transmission wheel is in contact with the top of the inner wall of the collecting box, and the rear portion of the connecting plate is in contact with the front portion of the stirring plate, so that after the pressing of the circuit boards is completed, the stacked circuit boards can be pushed out, and when the fixed plate is raised, the push plate 2 can push the circuit boards to be pressed to the processing pressing position, so that a large number of circuit boards to be pressed can be stored, avoiding manual and repeated placement work, and at the same time, the circuit boards that have not been pressed can be squeezed and aligned, avoiding the misalignment of the pressed circuit boards, which will cause the problem of scrapping the circuit boards.

[0008] The present invention adopts the above technical solution to bring the following beneficial effects: 1. The pressing device for processing integrated circuit circuit boards can realize that when the circuit board starts to be pressed, the spring can effectively absorb the vibration and impact from the pressing process to prevent damage to the circuit board through the coordinated operation among the bottom plate, the support plate, the processing plate, the L-shaped plate, the extrusion device, the cylinder, the fixing plate, the connecting block, the connecting rod, the limit frame, the spring, the pressure plate, the push plate and the sliding block. Through the coordinated operation among the bottom plate, the support plate, the processing plate, the L-shaped plate, the extrusion device, the cylinder, the fixing plate, the connecting block, the connecting rod, the limiting frame, the spring, the pressure plate, the push plate and the sliding block, when the circuit board starts to be pressed, the spring can effectively absorb the vibration and impact from the pressing process to prevent damage to the circuit board. Through the elasticity of the spring, uniform pressure distribution can be achieved during the pressing process. This uniformity ensures good contact between the circuit board and the mounting component, thereby improving the subsequent welding quality. At the same time, the connecting rod drives the push plate to move to the left, thereby pushing out the pressed circuit board, avoiding the manual handling of the circuit board, which may easily cause the circuit board that has just been pressed to be misaligned, thereby affecting the finished product effect of the circuit board.

[0009] 2. The pressing device for processing integrated circuit circuit boards can achieve the following results through the coordinated operation among connecting block 2, connecting rod 2, push plate 2, hollow frame, spring 2, L-shaped plate 2, sliding block 2, inclined plate 1, limit block, movable plate and inclined plate 2. When the circuit board is pushed out of the limit frame, the adhesive squeezed out during the pressing of the circuit board can be scraped off, so that the adhesive flows into the collection box through the gap in the limit frame. At the same time, the movement of connecting rod 3 drives the heating rod to move, so that the adhesive flowing inside the collection box can be heated to avoid the solidification of the adhesive affecting the secondary use of the adhesive. The adhesive can be stirred to reduce the solidification of the adhesive, which is convenient for the subsequent removal of the adhesive.

[0010] 3. The pressing device for processing integrated circuit circuit boards can achieve the goal of pushing out the stacked circuit boards after the pressing of the circuit boards is completed through the coordinated operation of the inclined block, L-shaped plate three, connecting rod three, collecting box, T-shaped plate, heating rod, connecting plate, rotating rod, transmission wheel and stirring plate. When the fixed plate is raised, the push plate two can push the circuit boards to be pressed to the processing pressing position, so that a large number of circuit boards to be pressed can be stored to avoid repeated manual placement work. At the same time, the circuit boards that have not been pressed can be squeezed and aligned to avoid the misalignment of the pressed circuit boards, which will cause the problem of scrapping the circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the extrusion device of the present invention; Figure 3 A half-section diagram of a push plate structure of the present invention; Figure 4 For the present invention Figure 3A magnified view of the structure at center; Figure 5 It is a half-section diagram of the discharging device of the present invention; Figure 6 For the present invention Figure 5 A magnified view of the structure at B in the middle; Figure 7 For the present invention Figure 5 A magnified view of the structure at C in the middle; Figure 8 A half-section view of the movable plate structure of the present invention; Fig. 9 For the present invention Figure 8 A magnified view of the structure at D in the middle; Fig.10 A half-section diagram of the heating device of the present invention; Fig.11 For the present invention Fig.10 Enlarged view of the structure at point E in the middle.

[0012] In the figure: 1, bottom plate; 2, support plate; 3, processing plate; 4, L-shaped plate one; 5, extrusion device; 51, cylinder; 52, fixed plate; 53, connecting block one; 54, connecting rod one; 55, limit frame; 56, spring one; 57, pressure plate; 58, push plate one; 59, sliding block one; 6, discharging device; 61, connecting block two; 62, connecting rod two; 63, push plate two; 64, hollow frame; 65, spring two; 66, L-shaped plate two; 67, sliding block two; 68, inclined plate one; 69, limit block; 610, movable plate; 611, inclined plate two; 7, heating device; 71, inclined block; 72, L-shaped plate three; 73, connecting rod three; 74, collecting box; 75, T-shaped plate; 76, heating rod; 77, connecting plate; 78, rotating rod; 79, transmission wheel; 710, stirring plate. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] See also Figure 1-Figure 11An embodiment of the present invention is: a pressing device for processing integrated circuit circuit boards, comprising a bottom plate 1, a support plate 2 is fixedly connected to the top of the bottom plate 1, a processing plate 3 is fixedly connected to the top of the support plate 2, and an L-shaped plate 4 is fixedly connected to the top of the bottom plate 1; an extrusion device 5 is arranged on the top of the L-shaped plate 4, a discharging device 6 is arranged on the top of the processing plate 3, and a heating device 7 is arranged on the bottom of the processing plate 3; the extrusion device 5 comprises a cylinder 51, a fixing plate 52, a connecting block 53, a connecting rod 54, a limiting frame 55, a spring 56, a pressure plate 57, a push plate 58, and a sliding block 59, and the cylinder 51 is fixedly connected to the top of the L-shaped plate 4 , the fixed plate 52 is fixedly connected to the output end of the cylinder 51, the connecting block 53 is fixedly connected to the top of the fixed plate 52, the connecting rod 54 is rotatably connected to the inner wall of the connecting block 53, the limit frame 55 is fixedly connected to the top of the processing plate 3, and the spring 56 is fixedly connected to the bottom of the fixed plate 52. When the circuit board starts to be pressed, the cylinder 51 is started, the cylinder 51 drives the fixed plate 52 to move, the movement of the fixed plate 52 drives the spring 56 to move, and the movement of the spring 56 drives the pressure plate 57 to move, so that when the circuit board is pressed, the spring 56 can effectively absorb the vibration and impact from the pressing process to prevent damage to the circuit board. The elasticity of spring 56 can achieve uniform pressure distribution during the pressing process. This uniformity ensures good contact between the circuit board and the mounted components, thereby improving the subsequent welding quality. The pressure plate 57 is fixedly connected to the bottom of the spring 56, the push plate 58 is rotatably connected to the circumferential surface of the connecting rod 54, the sliding block 59 is fixedly connected to the bottom of the push plate 58, the telescopic end of the cylinder 51 contacts the inner wall of the L-shaped plate 4, the rear part of the connecting rod 54 contacts the front part of the limit frame 55, the circumferential surface of the connecting rod 54 contacts the inner wall of the limit frame 55, and the bottom of the push plate 58 contacts the top of the inner wall of the limit frame 55. The surface of the sliding block 59 is slidably connected to the inner wall of the limit frame 55, and at the same time, the movement of the fixed plate 52 drives the connecting block 53 to move, and the movement of the connecting block 53 drives the connecting rod 54 to press down and move, and the connecting rod 54 drives the push plate 58 to move. When the fixed plate 52 moves to the bottom, the push plate 58 is on the rightmost side of the limit frame 55, and it will not affect the downward movement of the fixed plate 52. When the cylinder 51 drives the fixed plate 52 to move upward, the connecting rod 54 drives the push plate 58 to move to the left, thereby pushing out the pressed circuit board, avoiding manual picking of the circuit board, which may easily cause the circuit board that has just been pressed to be misaligned, thereby affecting the finished product effect of the circuit board.

[0015] The heating device 7 includes an inclined block 71, an L-shaped plate 72, a connecting rod 73, a collecting box 74, a T-shaped plate 75, a heating rod 76, a connecting plate 77, a rotating rod 78, a transmission wheel 79, and a stirring plate 710. The inclined block 71 is rotatably connected to the circumferential surface of the connecting rod 54. When the circuit board is pushed out of the limit frame 55, the connecting rod 54 moves to drive the inclined block 71 to move, so that the adhesive squeezed out during the circuit board pressing process can be scraped off, so that the adhesive flows into the collecting box 74 through the gap in the limit frame 55. The L-shaped plate 3 72 is rotatably connected to the circumferential surface of the connecting rod 1 54, the connecting rod 3 73 is fixedly connected to the bottom of the L-shaped plate 3 72, the collecting box 74 is fixedly connected to the top of the bottom plate 1, the T-shaped plate 75 is fixedly connected to the circumferential surface of the connecting rod 3 73, and the heating rod 76 is fixedly connected to the inner wall of the connecting rod 3 73. At the same time, the movement of the connecting rod 1 54 drives the L-shaped plate 3 72 to move, the movement of the L-shaped plate 3 72 drives the connecting rod 3 73 to move, and the movement of the connecting rod 3 73 drives the heating rod 76 to move, so that the liquid inside the collecting box 74 can be The adhesive is heated to prevent the adhesive from solidifying and affecting the secondary use of the adhesive. The connecting plate 77 is fixedly connected to the bottom of the T-shaped plate 75, the rotating rod 78 is rotatably connected to the inner wall of the connecting plate 77, the transmission wheel 79 is fixedly connected to the circumferential surface of the rotating rod 78, the stirring plate 710 is fixedly connected to the circumferential surface of the rotating rod 78, the surface of the inclined block 71 is slidably connected to the inner wall of the limit frame 55, the circumferential surface of the transmission wheel 79 is in contact with the top of the inner wall of the collecting box 74, the rear part of the connecting plate 77 and the front part of the stirring plate 710 are in contact with each other. The contact, at the same time, the movement of connecting rod three 73 drives the T-shaped plate 75 to move, the movement of T-shaped plate 75 drives the connecting plate 77 to move, the movement of connecting plate 77 drives the rotating rod 78 to move, the movement of rotating rod 78 drives the transmission wheel 79 to move, the transmission wheel 79 rotates through the friction force generated between it and the collection box 74, the rotation of transmission wheel 79 drives the rotating rod 78 to rotate, the rotation of rotating rod 78 drives the stirring plate 710 to rotate, so that the adhesive can be stirred, the solidification of the adhesive can be reduced, and the subsequent removal of the adhesive is convenient.

[0016] Working principle: When the circuit board starts to be pressed, the cylinder 51 starts, the cylinder 51 drives the fixed plate 52 to move, the fixed plate 52 moves to drive the spring 56 to move, the spring 56 moves to drive the pressure plate 57 to move, so that when the circuit board is pressed, the spring 56 can effectively absorb the vibration and impact from the pressing process to prevent damage to the circuit board. Through the elasticity of the spring 56, uniform pressure distribution can be achieved during the pressing process. This uniformity ensures good contact between the circuit board and the mounted components, thereby improving the subsequent welding quality and fixing The movement of plate 52 drives connecting block 53 to move, and the movement of connecting block 53 drives connecting rod 54 to press down and move, and connecting rod 54 drives push plate 58 to move. When fixed plate 52 moves to the bottom, push plate 58 is on the rightmost side of limit frame 55, and will not affect the downward movement of fixed plate 52. When cylinder 51 drives fixed plate 52 to move upward, connecting rod 54 drives push plate 58 to move to the left, thereby pushing out the pressed circuit board, avoiding manual picking of the circuit board, which may cause the circuit board that has just been pressed to be misaligned, thereby affecting the finished product effect of the circuit board.

[0017] When the circuit board is pushed out of the limit frame 55, the connecting rod 1 54 moves and drives the inclined block 71 to move, so that the squeezed adhesive can be scraped off during the circuit board pressing process, so that the adhesive flows into the collection box 74 through the gap in the limit frame 55. At the same time, the connecting rod 1 54 moves and drives the L-shaped plate 3 72 to move, the L-shaped plate 3 72 moves and drives the connecting rod 3 73 to move, and the connecting rod 3 73 moves and drives the heating rod 76 to move, so that the adhesive flowing inside the collection box 74 can be heated to prevent the adhesive from solidifying and affecting the secondary utilization of the adhesive. At the same time, the connecting rod 3 73 moves and drives the T-shaped plate 75 to move, the T-shaped plate 75 moves and drives the connecting plate 77 to move, the connecting plate 77 moves and drives the rotating rod 78 to move, the rotating rod 78 moves and drives the transmission wheel 79 to move, the transmission wheel 79 moves and rotates through the friction generated between the collection box 74, the transmission wheel 79 rotates and drives the rotating rod 78 to rotate, the rotating rod 78 rotates and drives the stirring plate 710 to rotate, so that the adhesive can be stirred, the solidification of the adhesive is reduced, and the subsequent removal of the adhesive is convenient.

[0018] See also Figure 1-Figure 11On the basis of the above embodiment, in another embodiment of the present invention, the discharging device 6 includes a second connecting block 61, a second connecting rod 62, a second pushing plate 63, a hollow frame 64, a second spring 65, and a second L-shaped plate 66. The second connecting block 61 is fixedly connected to the top of the fixed plate 52, the second connecting rod 62 is rotatably connected to the inner wall of the second connecting block 61, the second pushing plate 63 is rotatably connected to the circumferential surface of the second connecting rod 62, the hollow frame 64 is fixedly connected to the top of the processing plate 3, the second spring 65 is fixedly connected to the inner wall of the hollow frame 64, and the second L-shaped plate 66 is fixedly connected to the left side of the second spring 65. After the boards are pressed, the fixed plate 52 moves to drive the connecting block 61 to move, the connecting block 61 moves to drive the connecting rod 62 to move upward, and the connecting rod 62 moves to drive the push plate 63 to move leftward, so that the stacked circuit boards can be pushed out. When the fixed plate 52 falls to the bottom, the push plate 63 will contact the L-shaped plate 66, so that the L-shaped plate 66 drives the spring 65 to compress, so that the L-shaped plate 66 no longer limits the circuit board to be pressed, so that the circuit board falls. When the fixed plate 52 rises, the push plate 63 can push the circuit board to be pressed to the processing pressing position, so that the large The discharging device 6 further comprises a sliding block 67, an inclined plate 68, a limiting block 69, a movable plate 610 and an inclined plate 611. The sliding block 67 is slidably connected to the inner wall of the limiting frame 55, the inclined plate 68 is fixedly connected to the front of the sliding block 67, the limiting block 69 is fixedly connected to the front of the sliding block 67, the movable plate 610 is rotatably connected to the inner wall of the sliding block 67, the inclined plate 611 is fixedly connected to the left side of the fixed plate 52, the bottom of the push plate 63 is slidably connected to the top of the processing plate 3, and the L-shaped plate 66 is The surface contacts the inner wall of the hollow frame 64, the rear part of the inclined plate 1 68 contacts the inner wall of the limit frame 55, the left side of the limit block 69 contacts the right side of the movable plate 610, and the bottom of the movable plate 610 contacts the top of the inner wall of the limit frame 55. At the same time, the fixed plate 52 moves downward to drive the inclined plate 2 611 to move downward. The inclined plate 2 611 moves downward and contacts with the inclined plate 1 68. The downward pressure generated by the inclined surface of the inclined plate 2 611 pushes the inclined plate 1 68 to move, so that the circuit boards that have not been pressed together can be squeezed and aligned to avoid the misalignment of the pressed circuit boards, which will cause the circuit boards to be scrapped.

[0019] Working principle: After the circuit board is pressed, the fixed plate 52 moves to drive the connecting block 61 to move, the connecting block 61 moves to drive the connecting rod 62 to move upward, and the connecting rod 62 moves to drive the push plate 63 to move leftward, so that the stacked circuit boards can be pushed out. When the fixed plate 52 falls to the bottom, the push plate 63 will contact the L-shaped plate 66, so that the L-shaped plate 66 drives the spring 65 to compress, so that the L-shaped plate 66 no longer limits the circuit board to be pressed, so that the circuit board falls and the fixed plate 52 When raised, the push plate 2 63 can push the circuit board to be pressed to the processing and pressing position, so that a large number of circuit boards to be pressed can be stored, avoiding repeated manual placement work. At the same time, the fixed plate 52 moves downward to drive the inclined plate 2 611 to move downward. The inclined plate 2 611 moves downward and contacts with the inclined plate 1 68. The downward pressure generated by the inclined surface of the inclined plate 2 611 pushes the inclined plate 1 68 to move, so that the circuit boards that have not been pressed can be squeezed and aligned, avoiding the misalignment of the pressed circuit boards, which will cause the circuit boards to be scrapped.

[0020] The present invention provides a pressing device for processing integrated circuit circuit boards. There are many methods and ways to implement the technical solution. The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention. All components not specified in this embodiment can be implemented by existing technologies.

Claims

1. A pressing device for processing an integrated circuit circuit board, comprising a base plate (1), characterized in that: The top of the bottom plate (1) is fixedly connected to a support plate (2), the top of the support plate (2) is fixedly connected to a processing plate (3), and the top of the bottom plate (1) is fixedly connected to an L-shaped plate 1 (4); The top of the L-shaped plate (4) is provided with an extrusion device (5), the top of the processing plate (3) is provided with a discharge device (6), and the bottom of the processing plate (3) is provided with a heating device (7); The extrusion device (5) comprises a cylinder (51), a fixed plate (52), a connecting block (53), a connecting rod (54), a limit frame (55), a spring (56), a pressure plate (57), a push plate (58), and a sliding block (59). The cylinder (51) is fixedly connected to the top of the L-shaped plate (4), the fixed plate (52) is fixedly connected to the output end of the cylinder (51), and the connecting block (53) is fixedly connected to the fixed plate (52). The top of the processing plate (3), the connecting rod 1 (54) is rotatably connected to the inner wall of the connecting block 1 (53), the limit frame (55) is fixedly connected to the top of the processing plate (3), the spring 1 (56) is fixedly connected to the bottom of the fixed plate (52), the pressure plate (57) is fixedly connected to the bottom of the spring 1 (56), the push plate 1 (58) is rotatably connected to the circumferential surface of the connecting rod 1 (54), and the sliding block 1 (59) is fixedly connected to the bottom of the push plate 1 (58).

2. The pressing device for processing integrated circuit circuit boards according to claim 1, characterized in that: The telescopic end of the cylinder (51) contacts the inner wall of the L-shaped plate (4), and the rear portion of the connecting rod (54) contacts the front portion of the limiting frame (55).

3. The pressing device for processing integrated circuit circuit boards according to claim 2, characterized in that: The circumferential surface of the connecting rod 1 (54) contacts the inner wall of the limit frame (55), the bottom of the push plate 1 (58) contacts the top of the inner wall of the limit frame (55), and the surface of the sliding block 1 (59) is slidably connected to the inner wall of the limit frame (55).

4. The pressing device for processing integrated circuit circuit boards according to claim 3, characterized in that: The discharging device (6) comprises a second connecting block (61), a second connecting rod (62), a second pushing plate (63), a hollow frame (64), a second spring (65), and a second L-shaped plate (66). The second connecting block (61) is fixedly connected to the top of the fixed plate (52), the second connecting rod (62) is rotatably connected to the inner wall of the second connecting block (61), the second pushing plate (63) is rotatably connected to the circumferential surface of the second connecting rod (62), the hollow frame (64) is fixedly connected to the top of the processing plate (3), the second spring (65) is fixedly connected to the inner wall of the hollow frame (64), and the second L-shaped plate (66) is fixedly connected to the left side of the second spring (65).

5. The pressing device for processing integrated circuit circuit boards according to claim 4, characterized in that: The discharging device (6) further comprises a second sliding block (67), a first inclined plate (68), a limiting block (69), a movable plate (610), and a second inclined plate (611); the second sliding block (67) is slidably connected to the inner wall of the limiting frame (55); the first inclined plate (68) is fixedly connected to the front of the second sliding block (67); the limiting block (69) is fixedly connected to the front of the second sliding block (67); the movable plate (610) is rotatably connected to the inner wall of the second sliding block (67); and the second inclined plate (611) is fixedly connected to the left side of the fixed plate (52).

6. The pressing device for processing integrated circuit circuit boards according to claim 5, characterized in that: The bottom of the push plate 2 (63) is slidably connected to the top of the processing plate (3), the surface of the L-shaped plate 2 (66) is in contact with the inner wall of the hollow frame (64), the rear of the inclined plate 1 (68) is in contact with the inner wall of the limit frame (55), the left side of the limit block (69) is in contact with the right side of the movable plate (610), and the bottom of the movable plate (610) is in contact with the top of the inner wall of the limit frame (55).

7. The pressing device for processing an integrated circuit circuit board according to claim 6, characterized in that: The heating device (7) comprises an inclined block (71), an L-shaped plate three (72), a connecting rod three (73), a collecting box (74), a T-shaped plate (75), a heating rod (76), a connecting plate (77), a rotating rod (78), a transmission wheel (79), and a stirring plate (710). The inclined block (71) is rotatably connected to the circumferential surface of the connecting rod one (54), the L-shaped plate three (72) is rotatably connected to the circumferential surface of the connecting rod one (54), the connecting rod three (73) is fixedly connected to the bottom of the L-shaped plate three (72), and the The collecting box (74) is fixedly connected to the top of the bottom plate (1), the T-shaped plate (75) is fixedly connected to the circumferential surface of the connecting rod three (73), the heating rod (76) is fixedly connected to the inner wall of the connecting rod three (73), the connecting plate (77) is fixedly connected to the bottom of the T-shaped plate (75), the rotating rod (78) is rotatably connected to the inner wall of the connecting plate (77), the transmission wheel (79) is fixedly connected to the circumferential surface of the rotating rod (78), and the stirring plate (710) is fixedly connected to the circumferential surface of the rotating rod (78).

8. The pressing device for processing integrated circuit circuit boards according to claim 7, characterized in that: The surface of the inclined block (71) is slidably connected to the inner wall of the limiting frame (55), the circumferential surface of the driving wheel (79) is in contact with the top of the inner wall of the collecting box (74), and the rear portion of the connecting plate (77) is in contact with the front portion of the stirring plate (710).

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