Grinding method and grinding equipment

Abstract

The invention discloses a grinding method and grinding equipment, and the grinding method comprises the following steps: S1, after a to-be-processed wafer on each wafer bearing table is concentrically placed on the wafer bearing table, a frame of the to-be-processed wafer is fixed through a fastening device of the wafer bearing table; s2, the wafer bearing table is driven by the indexing table to rotate to the position below the first grinding equipment mechanism; s3, a first plug assembly is controlled to be connected with a socket assembly matched with the wafer bearing table, the wafer bearing table adsorbs and fixes the to-be-machined wafer, the wafer bearing table drives the to-be-machined wafer to rotate, and first grinding equipment is started to thin the to-be-machined wafer; s4, after the first grinding equipment mechanism completes thinning, the first plug assembly is controlled to be separated from the socket assembly, and then the wafer bearing table is controlled to rotate to the position below the second grinding equipment mechanism through the indexing table; s5, a second plug assembly is controlled to be connected with a socket assembly matched with the wafer bearing table, the wafer bearing table adsorbs and fixes the to-be-machined wafer, the wafer bearing table drives the to-be-machined wafer to rotate, and second grinding equipment is started to thin the to-be-machined wafer; s6, after the second grinding equipment completes thinning, the second plug assembly is controlled to be separated from the socket assembly, and then the wafer bearing table is controlled to rotate to the feeding and discharging position through the indexing table; and S7, discharging is conducted after fixing of the fastening device to the frame is relieved. The indexing table can always operate in a single direction without interfering with a pipeline, the defect that an indexing table in an existing scheme cannot operate in a single direction is effectively overcome, and invalid idle stroke of the indexing table is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, in particular to a grinding method and a grinding device. Background Art

[0002] In the process of semiconductor wafer processing, grinding and thinning the wafer is a commonly used processing technology.

[0003] The invention patent application with application publication number CN118234597A discloses a multi-station grinding device, in which a dividing table is used to drive three wafer carriers to move between a first grinding device structure, a second grinding device structure and loading and unloading positions.

[0004] Since the processing involves power supply, air supply, water supply, etc. for each wafer holding table, and it is not convenient to install slip rings on the dividing table to achieve the above functions, in order to facilitate the installation of various pipelines, the dividing table is connected to the pipelines through a drag chain.

[0005] This structure causes the indexing table to be unable to continuously operate in a single direction and must be reset after rotating a certain angle. Summary of the invention

[0006] The purpose of the present invention is to solve the above problems existing in the prior art and to provide a grinding method and a grinding device.

[0007] The purpose of the present invention is achieved through the following technical solutions: The grinding method is to grind each wafer to be processed on the wafer stage according to the following steps: S1, after the wafer to be processed is concentrically placed on the wafer stage, the frame of the wafer to be processed is fixed by a fastening device of the wafer stage; S2, driving the wafer stage to rotate in a predetermined direction and by a predetermined angle by means of a dividing table so that the wafer stage rotates to below the first grinding device structure; S3, controlling the first plug assembly to connect to the socket assembly matched with the wafer stage, so that the wafer stage generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage drives the wafer to be processed to rotate, and the first grinding device is started to thin the wafer to be processed; S4, after the first grinding device structure completes the thinning, the first plug assembly is controlled to separate from the socket assembly, and then the wafer stage is driven by the indexing table to rotate along the predetermined direction by a predetermined angle so that the wafer stage is rotated to the bottom of the second grinding device structure; S5, controlling the second plug assembly to connect to the socket assembly matching the wafer stage, so that the wafer stage generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage drives the wafer to be processed to rotate, and the second grinding device is started to thin the wafer to be processed; S6, after the second grinding device completes the thinning, the second plug assembly is controlled to separate from the socket assembly, and then the wafer table is driven by the indexing table to rotate along the predetermined direction by a predetermined angle so that the wafer table is rotated to a loading and unloading position; S7, releasing the fixing device on the frame and then cutting the material; S08, repeat S1-S7.

[0008] Preferably, after the wafer to be processed is concentrically placed on the wafer stage at the loading and unloading position, the third plug assembly is controlled to connect to the socket assembly matching the wafer stage, and then the fastening device is controlled to magnetically fix the frame of the wafer to be processed; When the wafer table at the loading and unloading position needs to unload the material, the third plug assembly is controlled to connect to the socket assembly matching the wafer table, and then the fastening device is controlled to release the magnetic attraction of the frame. Preferably, the wafer support table is driven to rotate by a driving belt arranged around its periphery.

[0009] Preferably, the driving motor for driving the wafer stage is provided with a multi-turn absolute encoder, and the rotation angle of the dividing table is determined according to the multi-turn absolute encoder.

[0010] Preferably, the first plug assembly and / or the second plug assembly includes a plug-in drive, which is connected to a fixed block and drives the fixed block to translate radially along the dividing table, and the fixed block is provided with a gas connector and / or a liquid connector whose axis is parallel to the moving direction of the fixed block, and the fixed block is also provided with at least a plug for power supply.

[0011] Preferably, the gas connector and / or the liquid connector can be connected to the fixed block movably along their respective axial directions, and baffles are respectively provided on the gas connector and / or the liquid connector, an elastic member is connected between the baffle and the fixed block, and a detection sensor for detecting the position of the gas connector and / or the liquid connector is provided on the fixed block. When the detection sensor detects the baffle of the gas connector and / or the liquid connector, it is determined that the first plug assembly and the second plug assembly are not plugged into place with the socket assembly, and an alarm is issued.

[0012] Preferably, the dividing table is provided with labels corresponding to each of the dividing tables and evenly distributed around the circumference, and at least one label reading mechanism is provided on the outer side of the dividing table. When the two wafer carriers are in the first grinding device structure and the second grinding device structure, the label corresponding to one of the dividing tables can be read by the label reading mechanism.

[0013] Preferably, the number of the tag reading mechanisms is the same as the number of the tags and they are evenly distributed around the circumference.

[0014] The grinding method is to grind each wafer to be processed on the wafer stage according to the following steps: S10, placing the wafer to be processed concentrically on a wafer holding table at a loading and unloading position; S20, driving the wafer stage to rotate in a predetermined direction and by a predetermined angle by means of a dividing table so that the wafer stage rotates to below the first grinding device structure; S30, controlling the first plug assembly to connect to the socket assembly matching the wafer stage, so that the wafer stage generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage drives the wafer to be processed to rotate, and the first grinding device is started to thin the wafer to be processed; S40, after the first grinding device structure completes the thinning, the first plug assembly is controlled to separate from the socket assembly, and then the wafer stage is driven by the indexing table to rotate along the predetermined direction by a predetermined angle so that the wafer stage is rotated to below the second grinding device structure; S50, controlling the second plug assembly to connect to the socket assembly matched with the wafer stage, so that the wafer stage generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage drives the wafer to be processed to rotate, and the second grinding device is started to thin the wafer to be processed; S60, after the second grinding device completes the thinning, the second plug assembly is controlled to separate from the socket assembly, and then the wafer table is driven by the indexing table to rotate along the predetermined direction by a predetermined angle so that the wafer table is rotated to a loading and unloading position; S70, unloading the processed wafer from the wafer loading table at the loading and unloading position; S80, repeat S10-S70.

[0015] A grinding device comprises a first grinding device structure, a second grinding device structure and a carrier assembly, wherein the carrier assembly comprises a dividing table, a plurality of wafer carriers equally divided into circular portions are arranged on the dividing table, a socket assembly for communication and / or power supply and / or ventilation and / or liquid supply to each wafer carrier or on the dividing table is arranged, a first plug assembly and a second plug assembly matching with at least the socket assemblies on the two wafer carriers located at the first grinding device structure and the second grinding device structure are arranged below the dividing table, when the dividing table rotates, the first plug assembly and the second plug assembly are separated from the socket assembly, and when the dividing table rotates until the socket assembly corresponds to the first plug assembly and the second plug assembly, the first plug assembly and the second plug assembly can be connected to the socket assembly.

[0016] The advantages of the technical solution of the present invention are mainly reflected in: The present invention enables the indexing table to always run in a single direction without interfering with the pipeline, effectively overcoming the disadvantage that the indexing table of the existing scheme cannot run in one direction, and avoiding the invalid idle stroke of the indexing table and the frequent forward and reverse rotation of the motor.

[0017] The wafer stage of the present invention is provided with a fixing device which can fix the frame of the wafer when not connected to electricity or air, thereby preventing positional deviation during the rotation of the indexing table and effectively ensuring subsequent processing accuracy.

[0018] The present invention provides a fixing device with a driving mechanism capable of driving the magnetic attraction ring to rotate, which can be connected to electricity or air after loading, thereby automatically driving the fixing device to fix the wafer to be processed, and can effectively cooperate with automatic loading and unloading equipment without manual fixing and loading and unloading operations.

[0019] The indexing table of the present invention is driven by a driving belt sleeved on the outer circumference, and the outer diameters of the driving roller and the indexing table are kept greatly different, thereby effectively increasing the contact area between the belt and the indexing table, effectively ensuring the reliable driving of the indexing table, and at the same time, the rotation speed of the indexing table can be controlled to be lower in the absence of a load deceleration structure.

[0020] The first plug assembly and the second plug assembly of the present invention have a buffering function and a detection function, and can timely detect the situation of unreliable alignment, thereby facilitating the discovery and resolution of abnormal situations.

[0021] The present invention provides a label and a label reading mechanism, and can determine the position of each indexing table by reading the information on the note when the driving motor is abnormal, so that the processing can be continued after the fault is eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1It is a partial schematic diagram of the indexing table, the wafer holding table, the first grinding mechanism, and the second grinding mechanism of the grinding equipment of the present invention; Figure 2 is a perspective view of a stage assembly of the present invention; Figure 3 is a perspective view of a first plug assembly and a socket assembly of the present invention; Figure 4 It is a schematic diagram of the gas joint and the liquid joint of the present invention having a buffer and a detection mechanism; Figure 5 is a three-dimensional diagram of a label and a label reading mechanism of the present invention; Figure 6 is a top view of the indexing table of the present invention driven by a driving belt; Figure 7 is a schematic diagram of the process of the first embodiment of the grinding method of the present invention; Figure 8 is a schematic diagram of a process of a second embodiment of the grinding method of the present invention; Fig. 9 It is a process schematic diagram of the second embodiment of the grinding method of the present invention having a third plug assembly. DETAILED DESCRIPTION

[0023] The purpose, advantages and features of the present invention will be illustrated and explained by the non-limiting description of the following preferred embodiments. These embodiments are only typical examples of the application of the technical solution of the present invention, and any technical solution formed by equivalent replacement or equivalent transformation falls within the scope of protection claimed by the present invention.

[0024] In the description of the scheme, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0025] Example 1 The grinding method disclosed by the present invention is described below in conjunction with the accompanying drawings. The grinding method is based on a grinding device, which is the same as the prior art. Figure 1As shown, it includes a carrier assembly, the carrier assembly includes a dividing table 100 and a plurality of wafer carriers 200 evenly arranged on the dividing table 100 around the axis of the dividing table 100, the grinding equipment also includes a first grinding equipment structure 300 and a second grinding equipment structure 400, when the dividing table 100 rotates, the plurality of wafer carriers 200 are rotated to the first grinding equipment structure 300 and the second grinding equipment structure 400 in turn for grinding, at the same time, when one wafer carrier 200 is located at the first grinding equipment structure 300 for thinning, the other wafer carrier 200 is located at the second grinding equipment structure 400 for thinning, the specific structures of the wafer carrier 200, the dividing table 100, the first grinding equipment structure 300 and the second grinding equipment structure 400 can refer to the prior art, which will not be described here.

[0026] The difference from the prior art is that in order to enable the indexing table 100 to rotate in one direction, the present invention eliminates the use of drag chains in the prior art to connect pipelines used for gas supply, water supply, power supply, communication, etc. Figure 2 , Attachment Figure 3 As shown, a socket assembly 500 corresponding to each wafer stage is arranged on the indexing table 100 or each wafer stage 200, and at the same time, a first plug assembly 600 and a second plug assembly 700 matching the socket assembly 500 are arranged below the indexing table 100, the first plug assembly 600 matches the socket assembly 500 corresponding to the wafer stage 200 at the first grinding device structure 300, and the second plug assembly 700 matches the socket assembly 500 corresponding to the wafer stage 200 at the second grinding device structure 400, that is, when one A wafer table 200 is located at the first grinding equipment structure 300, and the first plug assembly 600 can be docked with the socket assembly 500 corresponding to the wafer table 200; at the same time, the second plug assembly 700 can be docked with the socket assembly 500 corresponding to the wafer table 200 located at the second grinding equipment structure 400. At this time, the wafer table 200 located at the first wafer table 200 and the second wafer table 200 can adsorb and fix the wafer to be processed and drive it to rotate and cooperate with the first grinding equipment structure 300 and the second grinding equipment structure 400 to thin it.

[0027] The first plug assembly 600 and the second plug assembly 700 have the same structure. In this embodiment, the first plug assembly 600 is taken as an example for description. Figure 3As shown, the first plug assembly 600 includes a plug-in drive 610, and the plug-in drive 610 can be a known feasible device such as a pneumatic cylinder, a hydraulic cylinder, an electric cylinder, etc. The plug-in drive 610 is connected to the fixed block 620 and drives the fixed block 620 to translate radially along the dividing table. The fixed block 620 is provided with a gas connector 630 and / or a liquid connector 640 whose axes are parallel to the moving direction of the fixed block 620. Preferably, both the gas connector 630 and the liquid connector 640 are provided, and the fixed block 620 is also provided with a plug 650 for at least power supply. The positions of the gas handpiece, the liquid connector 640 and the plug on the fixed block 620 can be designed as needed. Correspondingly, the socket assembly 500 includes a power supply socket, a gas connector socket and a liquid connector socket respectively corresponding to the plug 650, the gas connector 630 and the liquid connector 640. The power supply socket is electrically connected to the various electrical components of the wafer support table 200, the gas connector socket is connected to the gas pipeline of the wafer support table 200, and the liquid connector socket is connected to the liquid pipeline on the wafer support table 200.

[0028] Furthermore, in order to avoid malfunction of the first plug assembly 600 and the second plug assembly 700 and affect normal processing when the first plug assembly 600 and the second plug assembly 700 are not fully aligned and plugged into the socket assembly 500, the connecting terminal of the plug 650 can be a known elastic terminal.

[0029] As attached Figure 4 As shown, the gas connector 630 and the liquid connector 640 can be connected to the fixed block 620 movably along their respective axial directions, and the gas connector 630 and / or the liquid connector 640 cannot rotate relative to the fixed block 620, and baffles 660 are respectively provided on them, and the baffles 660 are located at one end of them close to the socket assembly, and an elastic member 670 is connected between the baffle and the fixed block 620, and a detection sensor 680 for detecting the position of the gas connector 630 and / or the liquid connector 640 is provided on the fixed block 620. At this time, the plug can be set on the top of the fixed block 620, and the detection sensor 680 can be set on both sides of the fixed block 620. Correspondingly, the baffles 660 on the gas connector 630 and the liquid connector 640 extend to both sides of the fixed block 620.

[0030] Furthermore, when the first plug assembly 600, the second plug assembly 700 are separated from the socket assembly 500 and when the first plug assembly 600, the second plug assembly 700 are accurately docked with the socket assembly 500, the detection sensor 680 cannot detect the baffle 660. When the baffle 660 of the gas connector 630 and / or the liquid connector is blocked from moving toward the fixed block, the detection sensor 680 detects the baffle 660 of the gas connector 630 and / or the liquid connector, determines that the first plug assembly 600 and the second plug assembly 700 are not properly plugged into the socket assembly 500, and issues an alarm. At this time, correction can be made by manually controlling the rotation of the dividing table 100.

[0031] Furthermore, in order to avoid the loss of position data of the indexing table 100 when the drive motor 130 is abnormal during operation, as shown in the attached Figure 2 , Attachment Figure 5 As shown, the indexing table is provided with tags 800 corresponding to each indexing table 100 and evenly distributed around the circumference. The tags 800 may be known RFID tags. The tags 800 store information of the wafer stage 200 corresponding thereto. At least one tag reading mechanism 900 is provided outside the indexing table. When the two wafer stages 200 are located at the first grinding device structure 300 and the second grinding device structure 400, the tag 800 corresponding to one of the indexing tables can be read by the tag reading mechanism 900. More preferably, the tag reading mechanism 900 is the same in number as the tags 800 and evenly distributed around the circumference, so that the information of three tags 800 can be read simultaneously to determine the wafer stage 200 corresponding to each position.

[0032] At the same time, since the wafer to be processed is not fixed after being placed on the wafer stage 200, in order to prevent the wafer to be processed from moving during the rotation process, a feasible way is to rotate the indexing table 100 at a slower speed. In order to prevent the indexing table 100 from rotating too fast, as shown in the attached Figure 6 As shown, the wafer table 200 is driven to rotate by a driving belt 110 arranged around its periphery. A belt groove is formed on the circumferential surface of the wafer table 200, and the driving belt 110 is embedded in the belt groove. At the same time, the driving belt 110 is sleeved on the driving wheel 120. The ratio of the outer diameter of the indexing table 100 and the driving wheel 120 is not less than 10, and is more preferably between 10 and 15. The driving wheel 120 is connected to a driving motor 130 that drives it to rotate. The driving motor 130 is provided with a multi-turn absolute encoder, and the rotation angle of the indexing table is determined according to the multi-turn absolute encoder.

[0033] Correspondingly, as attached Figure 7 As shown, in the grinding method, each wafer to be processed on the wafer stage 200 is ground according to the following steps: S10, placing the wafer to be processed concentrically on the wafer stage 200 at the loading and unloading position; S20, driving the wafer table 200 to rotate in a predetermined direction and a predetermined angle by the indexing table 100 so that the wafer table 200 rotates to the bottom of the first grinding device 300; the predetermined direction may be clockwise or counterclockwise, which is specifically determined according to the positions of the first grinding mechanism and the second grinding mechanism. The predetermined angle is determined according to the number of wafer tables, for example, when there are three wafer tables, the predetermined angle is 120°.

[0034] S30, controlling the first plug assembly 600 to connect to the socket assembly 500 matched with the wafer stage 200, so that the wafer stage 200 generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage 200 drives the wafer to be processed to rotate, and the first grinding device 300 starts to thin the wafer to be processed; S40, after the first grinding device structure 300 completes the thinning, the first plug assembly 600 is controlled to separate from the socket assembly 500, and then the wafer stage 200 is driven by the indexing table 100 to rotate along the predetermined direction by a predetermined angle so that the wafer stage 200 rotates to the bottom of the second grinding device structure 400; S50, controlling the second plug assembly 700 to connect to the socket assembly 500 matched with the wafer stage 200, so that the wafer stage 200 generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage 200 drives the wafer to be processed to rotate, and the second grinding device 400 starts to thin the wafer to be processed; S60, after the second grinding device structure 400 completes the thinning, the second plug assembly 700 is controlled to separate from the socket assembly 500, and then the wafer stage 200 is driven by the indexing table 100 to rotate along the predetermined direction by a predetermined angle so that the wafer stage 200 rotates to a loading and unloading position; S70, unloading the processed wafer from the wafer stage 200 at the loading and unloading position; S80, repeat S10-S70.

[0035] Of course, when a wafer on a wafer stage 200 is being ground at the first grinding device mechanism 300, a wafer on another wafer stage 200 may also be being ground at the second grinding device mechanism 400, and another wafer stage 200 may be being loaded and unloaded at the loading and unloading position.

[0036] Example 2 In the above embodiment, since the wafer to be processed on the wafer table 200 is not fixed during the rotation of the dividing table 100, the rotation speed of the dividing table 100 needs to be controlled slowly, which affects the processing efficiency to a certain extent. In this embodiment, the wafer table 200 can also fix the wafer to be processed when no negative pressure is generated. At this time, the wafer to be processed is a wafer with an annular frame, and the wafer table 200 can fix the frame of the wafer to be processed by magnetic attraction. Correspondingly, the wafer table 200 can adopt the structure disclosed by the invention patent with application number 202311501114.X. In this structure, manual operation is required to realize the magnetic attraction of the frame by the wafer table 200 and release the magnetic attraction of the frame.

[0037] Correspondingly, as attached Figure 8 As shown, each wafer to be processed on the wafer stage 200 is ground according to the following steps: S1, after the wafer to be processed is concentrically placed on the wafer stage 200, the frame of the wafer to be processed is fixed by a fastening device of the wafer stage 200; S2, driving the wafer stage 200 to rotate along the predetermined direction by a predetermined angle through the indexing table 100 so that the wafer stage 200 rotates to below the first grinding device structure 300; S3, controlling the first plug assembly 600 to connect to the socket assembly 500 matched with the wafer stage 200, so that the wafer stage 200 generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage 200 drives the wafer to be processed to rotate, and the first grinding device 300 starts to thin the wafer to be processed; S4, after the first grinding device structure 300 completes the thinning, the first plug assembly 600 is controlled to separate from the socket assembly 500, and then the wafer stage 200 is driven by the indexing table 100 to rotate along the predetermined direction by a predetermined angle so that the wafer stage 200 rotates to the bottom of the second grinding device structure 400; S5, controlling the second plug assembly 700 to connect to the socket assembly 500 matched with the wafer stage 200, so that the wafer stage 200 generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage 200 drives the wafer to be processed to rotate, and the second grinding device 400 starts to thin the wafer to be processed; S6, after the second grinding device 400 completes the thinning, the second plug assembly 700 is controlled to separate from the socket assembly 500, and then the wafer stage 200 is driven by the indexing table 100 to rotate along the predetermined direction by a predetermined angle so that the wafer stage 200 rotates to a loading and unloading position; S7, releasing the fixing of the frame by the fastening device and then cutting the material; S8, repeat S1-S7.

[0038] Example 3 In the above embodiment, the fixed structure on the wafer table 200 needs to be switched manually, which makes it difficult to realize automatic loading and unloading through automatic loading and unloading equipment. Therefore, preferably, in order to realize automatic operation, the fixing device on the wafer table 200 includes a driving mechanism connected to the operating part of its magnetic ring. The driving mechanism can be a crank rocker structure driven by a rotary cylinder, a motor, etc. The crank rocker structure is connected to the operating part. Of course, the driving mechanism can also be other known feasible structures, which are not limited here. At the same time, a third plug assembly (not shown in the figure) matching the socket assembly 500 corresponding to the wafer table 200 in the loading and unloading position is provided below the indexing table 100. The specific structure of the third plug assembly is the same as that of the first plug assembly, which is not repeated here.

[0039] As attached Fig. 9 As shown, after the wafer to be processed is placed concentrically on the wafer stage 200 at the loading and unloading position, the third plug assembly is controlled to connect to the socket assembly 500 matched with the wafer stage 200. At this time, power or air can be supplied to the driving mechanism of the fixing device, so that the driving mechanism can drive the magnetic ring of the fixing device to rotate to a position that can absorb the frame of the wafer to be processed on the wafer stage 200. After loading, the third plug assembly is separated from the socket assembly 500 corresponding to the wafer stage 200, and the indexing table 100 drives the wafer stage 200 to rotate.

[0040] Furthermore, when unloading is required, the third plug assembly is first docked with the corresponding socket assembly 500 on the wafer stage 200, and then the wafer stage 200 generates an adsorption force to fix the processed wafer. Then, the driving mechanism of the fixing device drives the magnetic ring to rotate to a position where the frame cannot be adsorbed, and then the wafer stage 200 stops adsorption, and then loading and unloading are carried out through the robot.

[0041] Furthermore, before unloading, the processed wafers may be cleaned by a cleaning mechanism, and then unloading may be performed after cleaning. Moreover, after the wafers are cleaned, the wafer stage 200 may also be cleaned, and then loading may be performed after cleaning.

[0042] Example 4 The present embodiment discloses a grinding device, comprising a first grinding device structure 300, a second grinding device structure 400 and a carrier assembly, wherein the carrier assembly comprises a dividing table, on which a plurality of wafer carriers 200 with evenly divided circumferential portions are arranged, and a socket assembly 500 for communicating and / or supplying power and / or ventilation and / or supplying liquid to each wafer carrier 200 is arranged on or on each wafer carrier 200, and a first plug assembly 600 and a second plug assembly 700 matching with the socket assemblies 500 on at least two wafer carriers 200 located at the first grinding device structure 300 and the second grinding device structure 400 are arranged below the dividing table, when the dividing table rotates, the first plug assembly 600 and the second plug assembly 700 are separated from the socket assembly 500, and when the dividing table rotates until the socket assembly 500 corresponds to the first plug assembly 600 and the second plug assembly 700, the first plug assembly 600 and the second plug assembly 700 can be connected to the socket assembly 500.

[0043] There are many implementation methods of the present invention, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A grinding method, characterized in that: The wafer to be processed on each wafer stage is ground according to the following steps: S1, after the wafer to be processed is concentrically placed on the wafer stage, the frame of the wafer to be processed is fixed by a fastening device of the wafer stage; S2, driving the wafer stage to rotate in a predetermined direction and by a predetermined angle by means of a dividing table so that the wafer stage rotates to below the first grinding device structure; S3, controlling the first plug assembly to connect to the socket assembly matched with the wafer stage, so that the wafer stage generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage drives the wafer to be processed to rotate, and the first grinding device is started to thin the wafer to be processed; S4, after the first grinding device structure completes the thinning, the first plug assembly is controlled to separate from the socket assembly, and then the wafer stage is driven by the indexing table to rotate along the predetermined direction by a predetermined angle so that the wafer stage is rotated to the bottom of the second grinding device structure; S5, controlling the second plug assembly to connect to the socket assembly matching the wafer stage, so that the wafer stage generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage drives the wafer to be processed to rotate, and the second grinding device is started to thin the wafer to be processed; S6, after the second grinding device completes the thinning, the second plug assembly is controlled to separate from the socket assembly, and then the wafer table is driven by the indexing table to rotate along the predetermined direction by a predetermined angle so that the wafer table is rotated to a loading and unloading position; S7, releasing the fixing device on the frame and then cutting the material; S8, repeat S1-S7.

2. The grinding method according to claim 1, characterized in that: After the wafer to be processed is concentrically placed on the wafer stage at the loading and unloading position, the third plug assembly is controlled to connect to the socket assembly matching the wafer stage, and then the fastening device is controlled to magnetically fix the frame of the wafer to be processed; When the wafer stage at the loading and unloading position needs to unload materials, the third plug assembly is controlled to connect to the socket assembly matching the wafer stage, and then the fastening device is controlled to release the magnetic attraction to the frame.

3. The grinding method according to claim 1, characterized in that: The wafer carrier is driven to rotate by a driving belt arranged around its periphery.

4. The grinding method according to claim 1, characterized in that: The driving motor driving the wafer stage is provided with a multi-turn absolute value encoder, and the rotation angle of the dividing table is determined according to the multi-turn absolute value encoder.

5. The grinding method according to claim 1, characterized in that: The first plug assembly and / or the second plug assembly includes a plug-in drive, which is connected to a fixed block and drives the fixed block to translate radially along the dividing table. The fixed block is provided with a gas connector and / or a liquid connector whose axis is parallel to the moving direction of the fixed block. The fixed block is also provided with a plug at least for power supply.

6. The grinding method according to claim 5, characterized in that: The gas connector and / or the liquid connector can be connected to the fixed block movably along their respective axial directions, and baffles are respectively provided on the gas connector and / or the liquid connector, an elastic member is connected between the baffle and the fixed block, and a detection sensor for detecting the position of the gas connector and / or the liquid connector is provided on the fixed block. When the detection sensor detects the baffle of the gas connector and / or the liquid connector, it is determined that the first plug assembly and the second plug assembly are not plugged into place with the socket assembly, and an alarm is issued.

7. The grinding method according to claim 1, characterized in that: The dividing table is provided with labels corresponding to each of the dividing tables and evenly distributed around the circumference, and at least one label reading mechanism is provided on the outer side of the dividing table. When the two wafer carriers are in the first grinding device structure and the second grinding device structure, the label corresponding to one of the dividing tables can be read by the label reading mechanism.

8. The grinding device according to claim 7, characterized in that: The number of the tag reading mechanisms is the same as the number of the tags and they are evenly distributed around the circumference.

9. Grinding method: Each wafer to be processed on the wafer stage is ground according to the following steps: S10, placing the wafer to be processed concentrically on a wafer holding table at a loading and unloading position; S20, driving the wafer stage to rotate in a predetermined direction and by a predetermined angle by means of a dividing table so that the wafer stage rotates to below the first grinding device structure; S30, controlling the first plug assembly to connect to the socket assembly matching the wafer stage, so that the wafer stage generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage drives the wafer to be processed to rotate, and the first grinding device is started to thin the wafer to be processed; S40, after the first grinding device structure completes the thinning, the first plug assembly is controlled to separate from the socket assembly, and then the wafer stage is driven by the indexing table to rotate along the predetermined direction by a predetermined angle so that the wafer stage is rotated to below the second grinding device structure; S50, controlling the second plug assembly to connect to the socket assembly matched with the wafer stage, so that the wafer stage generates negative pressure to adsorb and fix the wafer body of the wafer to be processed, so that the wafer stage drives the wafer to be processed to rotate, and the second grinding device is started to thin the wafer to be processed; S60, after the second grinding device completes the thinning, the second plug assembly is controlled to separate from the socket assembly, and then the wafer table is driven by the indexing table to rotate along the predetermined direction by a predetermined angle so that the wafer table is rotated to a loading and unloading position; S70, unloading the processed wafer from the wafer loading table at the loading and unloading position; S80, repeat S10-S70.

10. A grinding device, comprising a first grinding device structure, a second grinding device structure and a stage assembly, wherein the stage assembly comprises a dividing table, and a plurality of wafer carriers equally divided into circular portions are arranged on the dividing table, characterized in that: A socket assembly for communication and / or power supply and / or ventilation and / or liquid supply to each wafer table is arranged on each wafer table or indexing table, and a first plug assembly and a second plug assembly matching with at least the socket assemblies on the two wafer tables located at the first grinding device structure and the second grinding device structure are arranged below the indexing table. When the indexing table rotates, the first plug assembly and the second plug assembly are separated from the socket assembly. When the indexing table rotates until the socket assembly corresponds to the first plug assembly and the second plug assembly, the first plug assembly and the second plug assembly can be connected to the socket assembly.

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