Injection molding quality control method and system for wafer carrier plastic parts

Abstract

The present invention discloses a method and system for quality control of injection molding of wafer carrier plastic parts, and relates to the field of injection molding technology, the method comprising: obtaining production task information of target wafer carrier plastic parts; obtaining multiple historical carrier molding quality records; obtaining multiple carrier molding quality control points; performing quality dynamic detection scheme analysis based on the number of production pieces and multiple carrier molding quality control points, and obtaining a target quality detection scheme configuration strategy; obtaining a first molding quality detection result, wherein the first quality detection scheme includes a first detection control point set; and performing injection molding quality control of an injection molding production line based on the first molding quality detection result. The present invention solves the technical problem of low reliability of injection molding quality control during mass production of wafer carrier plastic parts in the prior art, and achieves the technical effect of improving the accuracy and efficiency of injection molding quality control of wafer carrier plastic parts.

Description

Technical Field

[0001] The present invention relates to the technical field of injection molding, and in particular to a method and system for controlling the quality of injection molding of plastic parts of a wafer carrier. Background Art

[0002] When wafer carrier plastic parts are mass-produced, defects cannot be effectively and timely detected. For example, during the production process, due to uneven mold cooling or improper injection molding parameter settings, some key parts (such as tiny slots or support structures used to fix wafers) may not be fully formed. Traditional quality control methods mostly rely on fixed inspection points and cannot be dynamically adjusted according to the actual conditions of different batches of products, further affecting the accuracy of control and production efficiency.

[0003] The prior art has the technical problem of low reliability of injection molding quality control during mass production of wafer carrier plastic parts. Summary of the invention

[0004] The present application provides a method and system for controlling the injection molding quality of wafer carrier plastic parts, which are used to solve the technical problem of low reliability of injection molding quality control during mass production of wafer carrier plastic parts in the prior art.

[0005] In view of the above problems, the present application provides a method and system for controlling the injection molding quality of wafer carrier plastic parts.

[0006] In a first aspect of the present application, a method for controlling the quality of injection molding of a plastic part of a wafer carrier is provided, the method comprising:

[0007] Obtaining production task information of target wafer carrier plastic parts, wherein the production task information includes the number of production pieces, carrier type, and carrier application scenario information;

[0008] Based on the vehicle type and the vehicle application scenario information as indexes, mining molding quality records is performed to obtain multiple historical vehicle molding quality records;

[0009] Performing quality control point analysis on the plurality of historical carrier molding quality records to obtain a plurality of carrier molding quality control points;

[0010] Performing a dynamic quality inspection scheme analysis according to the number of production pieces and the plurality of carrier molding quality control points to obtain a target quality inspection scheme configuration strategy, wherein the target quality inspection scheme configuration strategy includes the number of dynamic carrier quality control points and a dynamic change cycle of the control points;

[0011] Generate a first quality inspection scheme based on the target quality inspection scheme configuration strategy, perform a carrier molding quality inspection on the injection molding production line according to the first quality inspection scheme in a first inspection window, and obtain a first molding quality inspection result, wherein the first quality inspection scheme includes a first inspection control point set;

[0012] The injection molding quality control of the injection molding production line is performed based on the first molding quality detection result.

[0013] A second aspect of the present application provides an injection molding quality control system for a wafer carrier plastic part, the system comprising:

[0014] A task information acquisition module, used to acquire production task information of target wafer carrier plastic parts, wherein the production task information includes the number of production pieces, carrier type and carrier application scenario information;

[0015] A molding quality record acquisition module, used to mine molding quality records based on the vehicle type and the vehicle application scenario information as indexes, and obtain multiple historical vehicle molding quality records;

[0016] A quality control point acquisition module, used to perform quality control point analysis on the plurality of historical carrier molding quality records to obtain a plurality of carrier molding quality control points;

[0017] A configuration strategy acquisition module, used to perform a dynamic quality detection scheme analysis according to the number of production pieces and the plurality of carrier molding quality control points, and obtain a target quality detection scheme configuration strategy, wherein the target quality detection scheme configuration strategy includes the number of dynamic carrier quality control points and a dynamic change cycle of the control points;

[0018] a quality inspection result obtaining module, configured to generate a first quality inspection scheme based on the target quality inspection scheme configuration strategy, and perform a carrier molding quality inspection on the injection molding production line according to the first quality inspection scheme in a first inspection window to obtain a first molding quality inspection result, wherein the first quality inspection scheme includes a first inspection control point set;

[0019] The injection molding quality control module is used to perform injection molding quality control on the injection molding production line based on the first molding quality detection result.

[0020] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0021] This application obtains the production task information of the target wafer carrier plastic parts, wherein the production task information includes the number of production pieces, carrier type and carrier application scenario information, and then, based on the carrier type and carrier application scenario information as indexes, performs molding quality record mining to obtain multiple historical carrier molding quality records, and then performs quality control point analysis on multiple historical carrier molding quality records to obtain multiple carrier molding quality control points, and performs quality dynamic detection scheme analysis based on the number of production pieces and multiple carrier molding quality control points to obtain the target quality detection scheme configuration strategy, wherein the target quality detection scheme configuration strategy includes the number of dynamic carrier quality control points and the dynamic change cycle of control points, and then generates a first quality detection scheme based on the target quality detection scheme configuration strategy, performs carrier molding quality detection of the injection molding production line according to the first quality detection scheme in the first detection window, and obtains the first molding quality detection result, wherein the first quality detection scheme includes a first detection control point set, and then, performs injection molding quality control of the injection molding production line based on the first molding quality detection result. The technical effect of improving the efficiency of injection molding quality control and controlling quality is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A schematic flow chart of a method for controlling the quality of injection molding of a plastic part of a wafer carrier provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of the structure of an injection molding quality control system for plastic parts of a wafer carrier provided in an embodiment of the present application.

[0025] Explanation of the reference numerals: task information acquisition module 11 , molding quality record acquisition module 12 , quality control point acquisition module 13 , configuration strategy acquisition module 14 , quality inspection result acquisition module 15 , injection molding quality control module 16 . DETAILED DESCRIPTION

[0026] The present application provides a method and system for controlling the injection molding quality of wafer carrier plastic parts, so as to solve the technical problem of low reliability of injection molding quality control during mass production of wafer carrier plastic parts in the prior art.

[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] It should be noted that the terms "including" and "having" are intended to cover non-exclusive inclusions. For example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or modules that are not explicitly listed or inherent to these processes, methods, products or devices.

[0029] Embodiment 1

[0030] like Figure 1 As shown, the present application provides a method for controlling the quality of injection molding of a wafer carrier plastic part, wherein the method comprises:

[0031] S100: Acquire production task information of a target wafer carrier plastic part, wherein the production task information includes the number of production pieces, carrier type, and carrier application scenario information;

[0032] In one possible embodiment, the target wafer carrier plastic part is a special device or container for supporting, storing and transporting wafers that needs to be produced. First, the production task of the current wafer carrier plastic part is obtained from the production management system of the target wafer carrier plastic part, including the number of pieces produced, the type of carrier to be produced, and the carrier application scenario information. The number of pieces produced will directly affect the configuration of the quality control strategy. For example, larger batch production may require setting up a higher frequency of quality inspections to ensure the stable quality of each batch of products.

[0033] The carrier type and carrier application scenario information describe the actual situation of the target wafer carrier plastic parts from two dimensions: carrier structure and carrier application. Different carrier types have different design and application requirements and may include different structures, sizes and functions. For example, some carriers are dedicated to large-size wafers, while others are used for small-size wafers or wafers used in special environments. Therefore, the carrier type will affect the process requirements and control focus of injection molding. Optionally, the carrier application scenario information generally includes the environment in which the carrier will be used, such as whether it is operated at high temperature, high humidity or in a clean room, including the working environment, usage conditions, functional requirements, etc. of the carrier. This information is very important for molding quality control. For example, for a carrier used in a high temperature environment, its plastic parts must have good heat resistance, so special attention should be paid to the uniformity of material cooling during molding.

[0034] By obtaining information on the number of pieces produced, carrier types, and application scenarios, we were able to provide detailed parameter basis for the subsequent quality control process, ensuring that the production plan and control strategy closely matched the actual production needs. This achieved the goal of laying the foundation for the dynamic configuration and precision of the entire quality control solution.

[0035] S200: Based on the vehicle type and the vehicle application scenario information as indexes, mining molding quality records is performed to obtain a plurality of historical vehicle molding quality records;

[0036] In one embodiment, index conditions are created based on the carrier type and application scenario information. These conditions may include the carrier's material, size, production process, working environment (such as temperature, humidity), and functional requirements (such as heat resistance, antistatic properties, etc.). Then, the data mining objectives are clarified, such as mining related molding defects, detected production problems, and related molding process parameters (such as temperature, pressure). These objectives contribute to the efficiency and pertinence of the mining process.

[0037] By querying the molding quality database of the injection molding production line of the target wafer carrier plastic parts, historical production data that meets the input carrier type and application scenario information is extracted. The database may include past molding quality inspection records, process parameter settings, defect records in the production process, etc. for similar carriers. Then, according to the carrier type and application scenario information, the queried historical data is matched with the current production task, and those molding quality records that are highly similar to the current task conditions are extracted to obtain the multiple historical carrier molding quality records.

[0038] By effectively mining the historical molding quality records related to the current task based on the carrier type and application scenario information, the technical effect of providing data support and quality control reference for the production of current wafer carrier plastic parts is achieved.

[0039] S300: Analyzing the quality control points of the plurality of historical carrier molding quality records to obtain a plurality of carrier molding quality control points;

[0040] Furthermore, the quality control points of the plurality of historical carrier molding quality records are analyzed to obtain a plurality of carrier molding quality control points. Step S300 of the embodiment of the present application further includes:

[0041] Using molding defects as indexes, searching the plurality of historical carrier molding quality records to obtain a plurality of historical defect position sets, a plurality of historical defect type sets, and a plurality of historical defect indicator sets;

[0042] Taking the defect type as an index, clustering the multiple historical defect type sets with the same defect type to obtain K historical clustered defect type sets, wherein the K historical clustered defect type sets correspond one-to-one to the K historical clustered defect position sets and the K historical clustered defect indicator sets;

[0043] Quality control point analysis is performed based on the K historical clustering defect type sets, the K historical clustering defect position sets, and the K historical clustering defect index sets to obtain the multiple carrier molding quality control points.

[0044] Furthermore, step S300 of the embodiment of the present application further includes:

[0045] Extracting a first historical cluster defect indicator set from the K historical cluster defect indicator sets, and constructing a first indicator screening space based on the first historical cluster defect indicator set, wherein the first indicator screening space includes a plurality of screening points, wherein each screening point corresponds to a first historical cluster defect indicator;

[0046] Extracting a space center point from the first indicator screening space, taking the space center point as a starting point, iterating in the first indicator screening space according to a preset iteration step length, and obtaining a first iteration screening point;

[0047] When the clustering density of the first iterative screening point is greater than or equal to the clustering density of the center point of the space, determine whether the difference between the clustering density of the first iterative screening point and the center point of the space is less than or equal to a preset difference, and if so, stop the iteration and use the first iterative screening point as the first target screening point;

[0048] If not, the first iteration screening point is updated as the starting point, and iteration is performed in the first indicator screening space according to the preset iteration step length until the difference in the aggregation density between two adjacent iterations is less than or equal to the preset difference, and the iteration is stopped, and the iteration screening point corresponding to the maximum aggregation density in the iteration process is used as the first target screening point;

[0049] Acquire a first carrier molding quality control point set of the first historical clustering defect index set according to the first target screening point and the preset iteration step;

[0050] The remaining K-1 historical clustering defect indicator sets are screened to determine K-1 carrier molding quality control point sets;

[0051] The plurality of carrier molding quality control points are obtained according to the first carrier molding quality control point set and the K-1 carrier molding quality control point sets.

[0052] Furthermore, step S300 of the embodiment of the present application further includes:

[0053] Constructing a first screening area with the first target screening point as the center and the preset iteration step as the radius;

[0054] taking a plurality of screening points in the first index screening space and located within the first screening area as a plurality of control screening points;

[0055] According to the mapping relationship between the defect index and the defect position, the first carrier molding quality control point set is obtained in combination with the multiple control screening points.

[0056] In one possible embodiment, the multiple historical carrier molding quality records are used as analysis data to determine the main analysis control points when performing quality control on the target wafer carrier plastic part, thereby obtaining the multiple carrier molding quality control points. The multiple carrier molding quality control points are locations of the target wafer carrier plastic part that are prone to molding defects, determined based on historical molding conditions. Obtaining the multiple carrier molding quality control points provides a basis for subsequent reliable injection molding quality control.

[0057] In one embodiment, an index of molding defects is defined and established based on defect information in historical carrier molding quality records. The defect index may include defect type (such as warpage, dent, crack, etc.), defect location (such as specific structural area, surface, etc.), and defect severity (such as mild, moderate, severe). Using molding defects as indexes, carriers with molding defects are retrieved from multiple historical carrier molding quality records, and the specific location, type, and related indicators of each defect are recorded. Thus, the multiple historical defect location sets, multiple historical defect type sets, and multiple historical defect indicator sets are obtained.

[0058] Optionally, the multiple historical defect location sets are specific locations where defects appear in multiple historical carrier molding quality records, such as a weak area or a specific support structure of a carrier. The multiple historical defect type sets are types of historical defects appearing in multiple historical carrier molding quality records, and each record may contain multiple defect types, such as dimensional deviation, surface depression, uneven cooling, etc. The multiple historical defect indicator sets are indicators that quantify the severity and frequency of defects, such as the dimensional deviation value, occurrence frequency, and impact range of the defects.

[0059] Then, with the defect type as the index, a cluster analysis is performed on the historical defect type set. The system groups the same or similar defect types through statistical analysis tools (such as the K-means clustering algorithm) to obtain K clustered historical defect type sets. This step ensures that the system can find those defect types that occur frequently and classify them. Each historical cluster defect type set is matched with its corresponding defect location and defect indicator set to ensure the consistency of defect type, location and indicator data in subsequent analysis. For example, the system matches the "warp" defect cluster with its specific location on the carrier and related parameters (such as temperature and cooling time) one by one.

[0060] Based on the K historical cluster defect type sets, the K historical cluster defect position sets and the K historical cluster defect index sets as analysis data, quality control point analysis is performed on the target wafer carrier plastic part to obtain the multiple carrier molding quality control points.

[0061] In a possible embodiment, a first historical cluster defect indicator set is extracted from the K historical cluster defect indicator sets, and a first indicator screening space is constructed based on the first historical cluster defect indicator set, wherein the first indicator screening space includes multiple screening points, wherein each screening point corresponds to a first historical cluster defect indicator. Further, a space center point is extracted from the first indicator screening space, and the space center point is used as a starting point, and the first indicator screening space is iterated according to a preset iteration step length to obtain a first iteration screening point. The preset iteration step length is a single movement distance in the first indicator screening space pre-set by a person skilled in the art.

[0062] When the cluster density of the first iterative screening point is greater than or equal to the cluster density of the center point of the space, it is determined whether the difference between the first iterative screening point and the center point of the space is less than or equal to a preset difference. If so, the iteration is stopped and the first iterative screening point is used as the first target screening point. Optionally, the cluster density of the first iterative screening point is the ratio of the number of screening points in the area constructed with the first iterative screening point as the center and the preset iteration step as the radius to the area of ​​the area, reflecting the density distribution of the screening points gathered around the first iterative screening point.

[0063] When the clustering density of the first iteration screening point is greater than or equal to the clustering density of the center point of the space, it indicates that the number of screening points clustered around the first iteration screening point is greater than the center point of the space. When the difference in the clustering density between the first iteration screening point and the center point of the space is less than or equal to a preset difference, it indicates that a relatively densely distributed area has been reached, and the iteration can be stopped at this time.

[0064] If not, it indicates that the area with denser distribution has not yet been reached. It is necessary to update the first iterative screening point as the starting point, and iterate in the first indicator screening space according to the preset iteration step until the difference in aggregation density between two adjacent iterations is less than or equal to the preset difference. Stop the iteration, and use the iterative screening point corresponding to the maximum aggregation density during the iteration process as the first target screening point.

[0065] The first carrier molding quality control point set of the first historical clustering defect index set is obtained according to the first target screening point and the preset iteration step. Preferably, a first screening area is constructed with the first target screening point as the center and the preset iteration step as the radius. Then, a plurality of screening points located in the first screening area in the first index screening space are used as a plurality of control screening points. According to the mapping relationship between the defect index and the defect position, the first carrier molding quality control point set is obtained in combination with the plurality of control screening points.

[0066] Based on the same acquisition principle, the remaining K-1 historical clustering defect indicator sets are screened to determine K-1 carrier molding quality control point sets. The multiple carrier molding quality control points are obtained according to the first carrier molding quality control point set and the K-1 carrier molding quality control point sets.

[0067] S400: Performing a dynamic quality inspection scheme analysis according to the number of production pieces and the plurality of carrier molding quality control points to obtain a target quality inspection scheme configuration strategy, wherein the target quality inspection scheme configuration strategy includes the number of dynamic carrier quality control points and a dynamic change cycle of the control points;

[0068] Further, a dynamic quality detection scheme analysis is performed according to the number of production pieces and the plurality of carrier molding quality control points to obtain a target quality detection scheme configuration strategy, wherein the target quality detection scheme configuration strategy includes the number of dynamic carrier quality control points and the dynamic change cycle of the control points. Step S400 of the embodiment of the present application further includes:

[0069] Obtaining the unit production efficiency of the injection molding production line, performing change cycle configuration in combination with the number of pieces produced, and obtaining the dynamic change cycle of the control point;

[0070] Determine a first detection bandwidth according to the size specification of the target wafer carrier plastic part, wherein the first detection bandwidth is the maximum distance interval between two adjacent quality control points when configuring the number of quality control points;

[0071] Performing a quality control point quantity analysis based on the first detection bandwidth and the plurality of carrier molding quality control points to obtain the dynamic carrier quality control point quantity;

[0072] The number of dynamic vehicle quality control points and the dynamic change period of the control points are used as the target quality detection solution configuration strategy.

[0073] Furthermore, step S400 in the embodiment of the present application further includes:

[0074] Acquire a target three-dimensional model of the target wafer carrier plastic part;

[0075] Randomly extract a first carrier molding quality control point from the multiple carrier molding quality control points, take the first carrier molding quality control point as a control starting point, perform an iterative search for control points in any direction according to the first detection bandwidth, and obtain a first iterative carrier molding quality control point set, wherein the first iterative carrier molding quality control point set includes the first quality control point quantity;

[0076] Performing a three-dimensional simulation according to the first iterative carrier molding quality control point set to obtain a first iterative three-dimensional model;

[0077] Determine whether the similarity between the target three-dimensional model and the first iterative three-dimensional model meets the requirements, and if so, use the first quality control point number as the dynamic vehicle quality control point number.

[0078] Furthermore, step S400 in the embodiment of the present application further includes:

[0079] If not, randomly select a second carrier molding quality control point from the multiple carrier molding quality control points, take the second carrier molding quality control point as the control starting point, perform iterative search for control points in any direction according to the second detection bandwidth, and obtain a second iterative carrier molding quality control point set, wherein the second detection bandwidth is the maximum distance interval between two adjacent quality control points when configuring the number of quality control points after the first detection bandwidth is reduced according to a preset ratio;

[0080] The dynamic vehicle quality control point quantity analysis is performed using the second iterative vehicle forming quality control point set to obtain the dynamic vehicle quality control point quantity.

[0081] In one possible embodiment, the number of carriers that can be produced per hour or per shift is calculated based on the capacity of the production line. This information determines the adjustment frequency of the dynamic quality inspection cycle. The higher the production efficiency, the higher the dynamic adjustment frequency of the control points may be to ensure the quality of each batch of products. Consider the production rhythm and the continuity of production (such as multi-shift production or single-shift production) to determine the basis for the dynamic inspection cycle. Furthermore, based on multiple carrier molding quality control points and corresponding distribution positions, the minimum number of quality control points that can reflect the overall situation of the target wafer carrier plastic parts is determined as the dynamic carrier quality control point number. The dynamic carrier quality control point number and the control point dynamic change cycle are used as the target quality inspection scheme configuration strategy.

[0082] In a possible embodiment, the unit production efficiency of the injection molding production line is obtained, and the change cycle of the control point is determined in combination with the number of pieces produced. For example, in mass production, the system can set a shorter change cycle to ensure the frequency of dynamic adjustment of the control point; in small batch production, the change cycle can be appropriately extended, and the technicians in this field can obtain the dynamic change cycle of the control point according to the actual situation.

[0083] Furthermore, a first detection bandwidth is determined according to the size specifications (such as length, width, and number of complex structures) of the target wafer carrier plastic part, wherein the first detection bandwidth is the maximum distance interval between two adjacent quality control points when configuring the number of quality control points. Optionally, the first detection bandwidth is 1 / 10 of the length of the target wafer carrier plastic part.

[0084] Furthermore, based on the first detection bandwidth and the multiple carrier molding quality control points, the number of quality control points is analyzed to obtain the target three-dimensional model of the target wafer carrier plastic part. Wherein, the target three-dimensional model reflects the three-dimensional structure of the target wafer carrier plastic part. Furthermore, the first carrier molding quality control point is randomly selected from the multiple carrier molding quality control points, and the first carrier molding quality control point is used as the control starting point. The control point is iteratively searched in any direction according to the first detection bandwidth to obtain the first iterative carrier molding quality control point set, wherein the first iterative carrier molding quality control point set includes the first number of quality control points. The distance between any two adjacent control points in the first iterative carrier molding quality control point set is the first detection bandwidth.

[0085] Then, a three-dimensional simulation is performed according to the first iterative vehicle forming quality control point set to obtain a first iterative three-dimensional model. A similarity identifier is used to determine whether the similarity between the target three-dimensional model and the first iterative three-dimensional model meets the requirements. If so, the number of first quality control points is used as the number of dynamic vehicle quality control points. Optionally, multiple sample three-dimensional models, multiple sample iterative three-dimensional models, and multiple sample similarities are obtained as training data, and supervised training is performed on a framework built based on a convolutional neural network until the output reaches convergence, thereby obtaining the trained similarity identifier.

[0086] If not, then randomly select a second carrier forming quality control point from the multiple carrier forming quality control points, take the second carrier forming quality control point as the control starting point, perform iterative search for control points in any direction according to the second detection bandwidth, and obtain a second iterative carrier forming quality control point set, wherein the second detection bandwidth is the maximum distance interval between two adjacent quality control points when configuring the number of quality control points after the first detection bandwidth is reduced according to a preset ratio, that is, the goal of expanding the number of quality control points is achieved by obtaining a second detection bandwidth that is smaller than the first detection bandwidth. Furthermore, based on the same principle, the second iterative carrier forming quality control point set is used to perform a dynamic carrier quality control point quantity analysis to obtain the dynamic carrier quality control point quantity. Furthermore, the dynamic carrier quality control point quantity and the control point dynamic change cycle are used as the target quality detection scheme configuration strategy.

[0087] S500: generating a first quality inspection scheme based on the target quality inspection scheme configuration strategy, performing a carrier molding quality inspection on the injection molding production line according to the first quality inspection scheme in a first inspection window, and obtaining a first molding quality inspection result, wherein the first quality inspection scheme includes a first inspection control point set;

[0088] S600: Performing injection molding quality control of the injection molding production line based on the first molding quality detection result.

[0089] In one possible embodiment, according to the target quality inspection scheme configuration strategy generated in the previous step, the system generates a specific first quality inspection scheme for the current production task. The scheme includes: a first inspection control point set: this is a plurality of randomly selected inspection control points determined according to the number of dynamic carrier quality control points. The control points are usually distributed in key areas of the carrier or parts prone to defects, such as microstructures, supporting parts, etc. Inspection frequency and cycle: the inspection cycle is determined based on the dynamic change cycle of the control points to ensure that all key control points are effectively covered during the production process. Then, according to the nature of the control points, the corresponding inspection methods and tools are determined, such as using optical inspection, infrared scanning or X-ray inspection. The first inspection window is the time point for the first injection molding inspection. The first molding quality inspection result reflects the injection molding quality of the injection molding production line in the first inspection window. Then, according to the first molding quality inspection result, it is evaluated whether there are quality problems in the current production process. If the inspection result shows that there are defects, such as the molding quality of certain areas is not up to standard, the system will take corresponding measures to adjust. By accurately monitoring the molding quality of plastic parts on the wafer carrier within each inspection window and dynamically adjusting and optimizing based on real-time inspection results, the quality stability of the injection molding production line is ensured. This method combines historical data, real-time inspection and dynamic adjustment to significantly improve the efficiency and reliability of production quality control.

[0090] In summary, the embodiments of the present application have at least the following technical effects:

[0091] This application obtains the production task information of the target wafer carrier plastic parts, wherein the production task information includes the number of production pieces, carrier type and carrier application scenario information, and then, based on the carrier type and carrier application scenario information as indexes, performs molding quality record mining to obtain multiple historical carrier molding quality records, and then performs quality control point analysis on multiple historical carrier molding quality records to obtain multiple carrier molding quality control points, and performs quality dynamic detection scheme analysis based on the number of production pieces and multiple carrier molding quality control points to obtain the target quality detection scheme configuration strategy, wherein the target quality detection scheme configuration strategy includes the number of dynamic carrier quality control points and the dynamic change cycle of control points, and then generates a first quality detection scheme based on the target quality detection scheme configuration strategy, performs carrier molding quality detection of the injection molding production line according to the first quality detection scheme in the first detection window, and obtains the first molding quality detection result, wherein the first quality detection scheme includes a first detection control point set, and then, performs injection molding quality control of the injection molding production line based on the first molding quality detection result. The technical effect of improving the efficiency of injection molding quality control and controlling quality is achieved.

[0092] Embodiment 2

[0093] Based on the same inventive concept as the method for controlling the quality of injection molding of a plastic part of a wafer carrier in the aforementioned embodiment, Figure 2 As shown, the present application provides an injection molding quality control system for wafer carrier plastic parts, and the system and method embodiments in the present application are based on the same inventive concept. The system includes:

[0094] The task information acquisition module 11 is used to acquire the production task information of the target wafer carrier plastic parts, wherein the production task information includes the number of production pieces, carrier type and carrier application scenario information;

[0095] A molding quality record acquisition module 12 is used to perform molding quality record mining based on the vehicle type and the vehicle application scenario information as indexes to obtain a plurality of historical vehicle molding quality records;

[0096] A quality control point acquisition module 13 is used to perform quality control point analysis on the plurality of historical carrier molding quality records to obtain a plurality of carrier molding quality control points;

[0097] A configuration strategy acquisition module 14 is used to perform a quality dynamic detection scheme analysis according to the number of production pieces and the plurality of carrier molding quality control points to obtain a target quality detection scheme configuration strategy, wherein the target quality detection scheme configuration strategy includes the number of dynamic carrier quality control points and a dynamic change cycle of the control points;

[0098] The quality inspection result obtaining module 15 is used to generate a first quality inspection scheme based on the target quality inspection scheme configuration strategy, and perform a carrier molding quality inspection on the injection molding production line according to the first quality inspection scheme in a first inspection window to obtain a first molding quality inspection result, wherein the first quality inspection scheme includes a first inspection control point set;

[0099] The injection molding quality control module 16 is used to perform injection molding quality control on the injection molding production line based on the first molding quality detection result.

[0100] Furthermore, the quality control point acquisition module 13 is used to perform the following steps:

[0101] Using molding defects as indexes, searching the plurality of historical carrier molding quality records to obtain a plurality of historical defect position sets, a plurality of historical defect type sets, and a plurality of historical defect indicator sets;

[0102] Taking the defect type as an index, clustering the multiple historical defect type sets with the same defect type to obtain K historical clustered defect type sets, wherein the K historical clustered defect type sets correspond one-to-one to the K historical clustered defect position sets and the K historical clustered defect indicator sets;

[0103] Quality control point analysis is performed based on the K historical clustering defect type sets, the K historical clustering defect position sets, and the K historical clustering defect index sets to obtain the multiple carrier molding quality control points.

[0104] Furthermore, the quality control point acquisition module 13 is used to perform the following steps:

[0105] Extracting a first historical cluster defect indicator set from the K historical cluster defect indicator sets, and constructing a first indicator screening space based on the first historical cluster defect indicator set, wherein the first indicator screening space includes a plurality of screening points, wherein each screening point corresponds to a first historical cluster defect indicator;

[0106] Extracting a space center point from the first indicator screening space, taking the space center point as a starting point, iterating in the first indicator screening space according to a preset iteration step length, and obtaining a first iteration screening point;

[0107] When the clustering density of the first iterative screening point is greater than or equal to the clustering density of the center point of the space, determine whether the difference between the clustering density of the first iterative screening point and the center point of the space is less than or equal to a preset difference, and if so, stop the iteration and use the first iterative screening point as the first target screening point;

[0108] If not, the first iteration screening point is updated as the starting point, and iteration is performed in the first indicator screening space according to the preset iteration step length until the difference in the aggregation density between two adjacent iterations is less than or equal to the preset difference, and the iteration is stopped, and the iteration screening point corresponding to the maximum aggregation density in the iteration process is used as the first target screening point;

[0109] Acquire a first carrier molding quality control point set of the first historical clustering defect index set according to the first target screening point and the preset iteration step;

[0110] The remaining K-1 historical clustering defect indicator sets are screened to determine K-1 carrier molding quality control point sets;

[0111] The plurality of carrier molding quality control points are obtained according to the first carrier molding quality control point set and the K-1 carrier molding quality control point sets.

[0112] Furthermore, the quality control point acquisition module 13 is used to perform the following steps:

[0113] Constructing a first screening area with the first target screening point as the center and the preset iteration step as the radius;

[0114] taking a plurality of screening points in the first index screening space and located within the first screening area as a plurality of control screening points;

[0115] According to the mapping relationship between the defect index and the defect position, the first carrier molding quality control point set is obtained in combination with the multiple control screening points.

[0116] Furthermore, the configuration strategy obtaining module 14 is used to perform the following steps:

[0117] Obtaining the unit production efficiency of the injection molding production line, performing change cycle configuration in combination with the number of pieces produced, and obtaining the dynamic change cycle of the control point;

[0118] Determine a first detection bandwidth according to the size specification of the target wafer carrier plastic part, wherein the first detection bandwidth is the maximum distance interval between two adjacent quality control points when configuring the number of quality control points;

[0119] Performing a quality control point quantity analysis based on the first detection bandwidth and the plurality of carrier molding quality control points to obtain the dynamic carrier quality control point quantity;

[0120] The number of dynamic vehicle quality control points and the dynamic change period of the control points are used as the target quality detection solution configuration strategy.

[0121] Furthermore, the configuration strategy obtaining module 14 is used to perform the following steps:

[0122] Acquire a target three-dimensional model of the target wafer carrier plastic part;

[0123] Randomly extract a first carrier molding quality control point from the multiple carrier molding quality control points, take the first carrier molding quality control point as a control starting point, perform an iterative search for control points in any direction according to the first detection bandwidth, and obtain a first iterative carrier molding quality control point set, wherein the first iterative carrier molding quality control point set includes the first quality control point quantity;

[0124] Performing a three-dimensional simulation according to the first iterative carrier molding quality control point set to obtain a first iterative three-dimensional model;

[0125] Determine whether the similarity between the target three-dimensional model and the first iterative three-dimensional model meets the requirements, and if so, use the first quality control point number as the dynamic vehicle quality control point number.

[0126] Furthermore, the configuration strategy obtaining module 14 is used to perform the following steps:

[0127] If not, randomly select a second carrier molding quality control point from the multiple carrier molding quality control points, take the second carrier molding quality control point as the control starting point, perform iterative search for control points in any direction according to the second detection bandwidth, and obtain a second iterative carrier molding quality control point set, wherein the second detection bandwidth is the maximum distance interval between two adjacent quality control points when configuring the number of quality control points after the first detection bandwidth is reduced according to a preset ratio;

[0128] The dynamic vehicle quality control point quantity analysis is performed using the second iterative vehicle forming quality control point set to obtain the dynamic vehicle quality control point quantity.

[0129] It should be noted that the above-mentioned sequence of the embodiments of the present application is only for description and does not represent the advantages and disadvantages of the embodiments. And the above-mentioned specific embodiments of this specification are described. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0130] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

[0131] This specification and drawings are merely exemplary illustrations of the present application and are deemed to cover any and all modifications, variations, combinations or equivalents within the scope of the present application. Obviously, a person skilled in the art may make various modifications and variations to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and its equivalents, the present application intends to include these modifications and variations.

Claims

1. A method for controlling the quality of injection molding of a wafer carrier plastic part, characterized in that: The method comprises: Obtaining production task information of target wafer carrier plastic parts, wherein the production task information includes the number of production pieces, carrier type, and carrier application scenario information; Based on the vehicle type and the vehicle application scenario information as indexes, mining molding quality records is performed to obtain multiple historical vehicle molding quality records; Performing quality control point analysis on the plurality of historical carrier molding quality records to obtain a plurality of carrier molding quality control points; Performing a dynamic quality inspection scheme analysis according to the number of production pieces and the plurality of carrier molding quality control points to obtain a target quality inspection scheme configuration strategy, wherein the target quality inspection scheme configuration strategy includes the number of dynamic carrier quality control points and a dynamic change cycle of the control points; Generate a first quality inspection scheme based on the target quality inspection scheme configuration strategy, perform a carrier molding quality inspection on the injection molding production line according to the first quality inspection scheme in a first inspection window, and obtain a first molding quality inspection result, wherein the first quality inspection scheme includes a first inspection control point set; Performing injection molding quality control of the injection molding production line based on the first molding quality detection result; The quality control points of the multiple historical carrier molding quality records are analyzed to obtain multiple carrier molding quality control points, including: Using molding defects as indexes, searching the plurality of historical carrier molding quality records to obtain a plurality of historical defect position sets, a plurality of historical defect type sets, and a plurality of historical defect indicator sets; Taking the defect type as an index, clustering the multiple historical defect type sets with the same defect type to obtain K historical clustered defect type sets, wherein the K historical clustered defect type sets correspond one-to-one to the K historical clustered defect position sets and the K historical clustered defect indicator sets; Quality control point analysis is performed based on the K historical clustering defect type sets, the K historical clustering defect position sets, and the K historical clustering defect index sets to obtain the multiple carrier molding quality control points.

2. The method for controlling the quality of injection molding of a wafer carrier plastic part according to claim 1, wherein: include: Extracting a first historical cluster defect indicator set from the K historical cluster defect indicator sets, and constructing a first indicator screening space based on the first historical cluster defect indicator set, wherein the first indicator screening space includes a plurality of screening points, wherein each screening point corresponds to a first historical cluster defect indicator; Extracting a space center point from the first indicator screening space, taking the space center point as a starting point, iterating in the first indicator screening space according to a preset iteration step length, and obtaining a first iteration screening point; When the clustering density of the first iterative screening point is greater than or equal to the clustering density of the center point of the space, determine whether the difference between the clustering density of the first iterative screening point and the center point of the space is less than or equal to a preset difference, and if so, stop the iteration and use the first iterative screening point as the first target screening point; If not, the first iteration screening point is updated as the starting point, and iteration is performed in the first indicator screening space according to the preset iteration step length until the difference in the aggregation density between two adjacent iterations is less than or equal to the preset difference, and the iteration is stopped, and the iteration screening point corresponding to the maximum aggregation density in the iteration process is used as the first target screening point; Acquire a first carrier molding quality control point set of the first historical clustering defect index set according to the first target screening point and the preset iteration step; The remaining K-1 historical clustering defect indicator sets are screened to determine K-1 carrier molding quality control point sets; The plurality of carrier molding quality control points are obtained according to the first carrier molding quality control point set and the K-1 carrier molding quality control point sets.

3. The method for controlling the quality of injection molding of a wafer carrier plastic part according to claim 2, wherein: include: Constructing a first screening area with the first target screening point as the center and the preset iteration step as the radius; taking a plurality of screening points in the first index screening space and located within the first screening area as a plurality of control screening points; According to the mapping relationship between the defect index and the defect position, the first carrier molding quality control point set is obtained in combination with the multiple control screening points.

4. The method for controlling the quality of injection molding of a wafer carrier plastic part according to claim 1, wherein: According to the number of production pieces and the plurality of carrier molding quality control points, a dynamic quality detection scheme analysis is performed to obtain a target quality detection scheme configuration strategy, wherein the target quality detection scheme configuration strategy includes the number of dynamic carrier quality control points and the dynamic change cycle of the control points, including: Obtaining the unit production efficiency of the injection molding production line, performing change cycle configuration in combination with the number of pieces produced, and obtaining the dynamic change cycle of the control point; Determine a first detection bandwidth according to the size specification of the target wafer carrier plastic part, wherein the first detection bandwidth is the maximum distance interval between two adjacent quality control points when configuring the number of quality control points; Performing a quality control point quantity analysis based on the first detection bandwidth and the plurality of carrier molding quality control points to obtain the dynamic carrier quality control point quantity; The number of dynamic vehicle quality control points and the dynamic change period of the control points are used as the target quality detection solution configuration strategy.

5. The method for controlling the quality of injection molding of a wafer carrier plastic part according to claim 4, wherein: include: Acquire a target three-dimensional model of the target wafer carrier plastic part; Randomly extract a first carrier molding quality control point from the multiple carrier molding quality control points, take the first carrier molding quality control point as a control starting point, perform an iterative search for control points in any direction according to the first detection bandwidth, and obtain a first iterative carrier molding quality control point set, wherein the first iterative carrier molding quality control point set includes the first quality control point quantity; Performing a three-dimensional simulation according to the first iterative carrier molding quality control point set to obtain a first iterative three-dimensional model; Determine whether the similarity between the target three-dimensional model and the first iterative three-dimensional model meets the requirements, and if so, use the first quality control point number as the dynamic vehicle quality control point number.

6. The method for controlling the quality of injection molding of a wafer carrier plastic part according to claim 5, wherein: include: If not, randomly select a second carrier molding quality control point from the multiple carrier molding quality control points, take the second carrier molding quality control point as the control starting point, perform iterative search for control points in any direction according to the second detection bandwidth, and obtain a second iterative carrier molding quality control point set, wherein the second detection bandwidth is the maximum distance interval between two adjacent quality control points when configuring the number of quality control points after the first detection bandwidth is reduced according to a preset ratio; The dynamic vehicle quality control point quantity analysis is performed using the second iterative vehicle forming quality control point set to obtain the dynamic vehicle quality control point quantity.

7. A quality control system for injection molding of plastic parts of wafer carriers, characterized in that: The system is used to implement the injection molding quality control method of a wafer carrier plastic part according to any one of claims 1 to 6, and the system comprises: A task information acquisition module, used to acquire production task information of target wafer carrier plastic parts, wherein the production task information includes the number of production pieces, carrier type and carrier application scenario information; A molding quality record acquisition module, used to mine molding quality records based on the vehicle type and the vehicle application scenario information as indexes, and obtain multiple historical vehicle molding quality records; A quality control point acquisition module, used to perform quality control point analysis on the plurality of historical carrier molding quality records to obtain a plurality of carrier molding quality control points; A configuration strategy acquisition module, used to perform a dynamic quality detection scheme analysis according to the number of production pieces and the plurality of carrier molding quality control points, and obtain a target quality detection scheme configuration strategy, wherein the target quality detection scheme configuration strategy includes the number of dynamic carrier quality control points and a dynamic change cycle of the control points; a quality inspection result obtaining module, configured to generate a first quality inspection scheme based on the target quality inspection scheme configuration strategy, and perform a carrier molding quality inspection on the injection molding production line according to the first quality inspection scheme in a first inspection window to obtain a first molding quality inspection result, wherein the first quality inspection scheme includes a first inspection control point set; The injection molding quality control module is used to perform injection molding quality control on the injection molding production line based on the first molding quality detection result.

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