Image sensor assembly, camera module and electronic equipment

Abstract

The invention provides an image sensor assembly, a camera module and electronic equipment, the image sensor assembly comprises a first circuit board, an image sensor module and a suspension connecting piece, and the image sensor module and the first circuit board are opposite in a first direction and are arranged at an interval; the fixed connecting piece and the peripheral side of the image sensor module are arranged in a spaced mode, one end of the fixed connecting piece is connected with the first circuit board, the other end of the fixed connecting piece extends towards the side away from the first circuit board and is connected with the first connecting piece, and the first connecting piece and the second connecting piece are arranged in a spaced mode with the first circuit board. The plane where the first connecting sheet is located intersects with the plane where the first circuit board is located; the first connecting piece extends along the side edge of the image sensor module, and the second connecting piece extends from the first connecting piece to the side where the image sensor module is located and is connected with the image sensor module, so that the image sensor module is suspended relative to the first circuit board, movement in the first direction is reduced during anti-shake compensation, and the anti-shake effect is improved.

Description

Technical Field

[0001] The present application relates to the field of camera technology, and in particular to an image sensor component, a camera module and an electronic device. Background Art

[0002] With the development of camera technology, anti-shake function has become an important research field. Anti-shake function is divided into lens optical anti-shake and body anti-shake. Lens anti-shake uses the displacement of the lens group to change and correct the optical path during shaking to achieve the anti-shake compensation effect; while body anti-shake uses the displacement of the image sensor to perform anti-shake compensation. The displacement of the image sensor can achieve the anti-shake function. Therefore, how to have a camera module with anti-shake function has become a technical problem that needs to be solved. Summary of the invention

[0003] The present application provides an image sensor component, a camera module and an electronic device with an anti-shake function.

[0004] In a first aspect, an image sensor assembly provided by an embodiment of the present application includes:

[0005] a first circuit board;

[0006] An image sensor module, the image sensor module is arranged opposite to and spaced from the first circuit board along a first direction;

[0007] A hanging connector, the hanging connector includes a fixed connector, at least one first connecting piece, and at least one second connecting piece, the fixed connector is spaced apart from the outer peripheral side of the image sensor module, one end of the fixed connector is connected to the first circuit board, the other end of the fixed connector extends toward a side away from the first circuit board and is connected to the first connecting piece, the first connecting piece and the second connecting piece are both spaced apart from the first circuit board, and the surface where the first connecting piece is located intersects with the surface where the first circuit board is located; the first connecting piece extends along the side of the image sensor module, the second connecting piece extends from the first connecting piece toward the side where the image sensor module is located and is connected to the image sensor module, so that the image sensor module is suspended relative to the first circuit board.

[0008] In a second aspect, an embodiment of the present application provides a camera module, which includes a lens assembly and an autofocus motor arranged on the periphery of the lens assembly, and the image sensor assembly described in the first aspect, wherein the image sensor is directly opposite to the lens assembly.

[0009] In a third aspect, an embodiment of the present application provides an electronic device, wherein the electronic device includes the camera module described in the second aspect.

[0010] The image sensor assembly, camera module and electronic device having the image sensor assembly provided by the embodiments of the present application, the image sensor assembly comprises a first circuit board, an image sensor module and a suspension connector, the image sensor module and the first circuit board are opposite and spaced apart along a first direction; the suspension connector comprises a fixed connector, at least one first connecting piece and at least one second connecting piece, the fixed connector is spaced apart from the outer peripheral side of the image sensor module, one end of the fixed connector is connected to the first circuit board, the other end of the fixed connector extends toward a side away from the first circuit board and is connected to the first connecting piece, the first connecting piece and the second connecting piece are both spaced apart from the first circuit board, and the surface where the first connecting piece is located intersects with the surface where the first circuit board is located; the first connecting piece extends along the side of the image sensor module, the second connecting piece extends from the first connecting piece toward the side where the image sensor module is located and is connected to the image sensor module, so that the image sensor module is suspended relative to the first circuit board, and the image sensor moves or rotates within the plane relative to the first circuit board when anti-shake compensation is required, thereby reducing the movement in the first direction and improving the anti-shake effect of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments are briefly introduced below.

[0012] Figure 1 is a schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application;

[0013] Figure 2 is a schematic diagram of a three-dimensional exploded structure of an electronic device provided in an embodiment of the present application;

[0014] Figure 3 is a schematic diagram of the three-dimensional structure of a camera module provided in an embodiment of the present application;

[0015] Figure 4 is a schematic diagram of the structural decomposition of the camera module provided in an embodiment of the present application;

[0016] Figure 5 The structure of the image sensor assembly provided in the embodiment of the present application is schematically decomposed. Figure 1 ;

[0017] Figure 6 The structure of the image sensor assembly provided in the embodiment of the present application is schematically decomposed. Figure 2 ;

[0018] Figure 7a is a top view of an image sensor assembly provided by an embodiment of the present application;

[0019] Figure 7b The structure of the image sensor assembly provided in the embodiment of the present application is schematically decomposed. Figure 3 ;

[0020] Figure 8 is a structural schematic diagram of a third type of fixed connector in the sixth type of suspension connector provided in an embodiment of the present application;

[0021] Fig. 9 is a schematic diagram of the side view structure of the image sensor assembly provided in an embodiment of the present application;

[0022] Fig.10 is a structural schematic diagram of a first type of fixed connector in a sixth type of suspension connector provided in an embodiment of the present application;

[0023] Fig.11 is a structural schematic diagram of a second type of fixed connector in the sixth type of suspension connector provided in an embodiment of the present application;

[0024] Fig.12 This is a structural schematic diagram of a first connecting piece in a suspension connecting member provided in an embodiment of the present application;

[0025] Fig.13 is another structural schematic diagram of the first connecting piece in the suspension connecting member provided in an embodiment of the present application;

[0026] Fig.14 is a schematic structural diagram of a second connecting piece in a suspension connector provided in an embodiment of the present application;

[0027] Fig.15 It is a schematic diagram of the structure of a limit block in a suspension connector provided in an embodiment of the present application;

[0028] Fig.16 This is a schematic diagram of the structure of the first suspension connector provided in the embodiment of the present application. Figure 1 ;

[0029] Fig.17 This is a schematic diagram of the structure of the first suspension connector provided in the embodiment of the present application. Figure 2 ;

[0030] Fig.18 This is a schematic diagram of the structure of the second suspension connector provided in the embodiment of the present application. Figure 1 ;

[0031] Fig.19 This is a schematic diagram of the structure of the second suspension connector provided in the embodiment of the present application. Figure 2 ;

[0032] Fig. 20 This is a schematic diagram of the structure of the third suspension connector provided in the embodiment of the present application. Figure 1 ;

[0033] Fig.21 This is a schematic diagram of the structure of the third suspension connector provided in the embodiment of the present application. Figure 2 ;

[0034] Fig. 22 This is a schematic diagram of the structure of the fourth suspension connector provided in the embodiment of the present application. Figure 1 ;

[0035] Fig.23 This is a schematic diagram of the structure of the fourth suspension connector provided in the embodiment of the present application. Figure 2 ;

[0036] Fig.24 This is a schematic diagram of the structure of the fifth suspension connector provided in the embodiment of the present application. Figure 1 ;

[0037] Fig.25 This is a schematic diagram of the structure of the fifth suspension connector provided in the embodiment of the present application. Figure 2 ;

[0038] Fig.26 This is a schematic diagram of the structure of the sixth suspension connector provided in the embodiment of the present application. Figure 1 ;

[0039] Fig. 27 This is a schematic diagram of the structure of the sixth suspension connector provided in the embodiment of the present application. Figure 2 ;

[0040] Fig.28 is a schematic structural diagram of an elastic conductive connector provided in an embodiment of the present application;

[0041] Fig.29 is a partially enlarged schematic diagram of an elastic conductive connector provided in an embodiment of the present application;

[0042] Fig.30 is a cross-sectional view of an image sensor assembly provided by an embodiment of the present application;

[0043] Fig.31 is a cross-sectional view of a lens assembly of a telescopic camera provided in an embodiment of the present application when in an extended position;

[0044] Fig.32 It is a cross-sectional view of the lens assembly of the telescopic camera provided in an embodiment of the present application when it is in the retracted position.

[0045] Description of Figure Numbers:

[0046] Electronic device 1000; camera module 100; display screen 200; middle frame 300; back cover 400; middle plate 310; frame 320; main board 600; battery 700; sub-board 800; image sensor assembly 10; first circuit board 11; first main body 111; flexible extension 112; first sub-body 113; bearing surface 115; central area 115a; transition area 115b; peripheral area 115c; image sensor module 12 ; first side 12a; second side 12b; third side 12c; fourth side 12d; second circuit board 121; first through hole portion 1211; peripheral portion 1212; image sensor 122; hanging connector 13; fixed connector 131; first sub-connecting piece 1311; second sub-connecting piece 1312; fixed block 1313; first connecting piece 132; third sub-connecting piece 1321; fourth sub-connecting piece 1322; second connecting piece 133; fifth sub-connecting piece 1331; sixth sub-connecting piece 1332; limiting block 134; first connecting seat 141; second connecting seat 142; elastic conductive connecting member 143; first connecting plate 1431; flexible connecting wire 1432; second connecting plate 1433; first connecting arm 1434; middle connecting arm 1435; second connecting arm 1436; first fitting arm 1437; second fitting arm 1438; first group of elastic conductive connecting members 143a; second group of elastic conductive connecting members 143b; first conductive trace 144; multiple second conductive traces 145; bracket 150; second through hole portion 150a; first magnetic driving member 151; second magnetic driving member 152; first magnet 1521; middle connecting member 1522; second magnet 1523; third magnetic driving member 153; fourth magnetic driving member 154; filter 16; lens assembly 20; autofocus motor 30. DETAILED DESCRIPTION

[0047] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in the present application are only a part of the embodiments, not all of the embodiments. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present application.

[0048] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it mutually exclusive, independent, or alternative to other embodiments. It can be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0049] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example: a component or device including one or more parts is not limited to the one or more parts listed, but optionally includes one or more parts that are not listed but inherent to the exemplified product, or one or more parts that it should have based on the described function.

[0050] Generally, a "wire suspension system" is used to achieve balanced control of the movement of the image sensor and conduction of the electrical signal. However, on the one hand, the manufacturing process of the "wire suspension system" is very complicated, very difficult, and expensive. On the other hand, the "wire suspension system" makes the camera module too large.

[0051] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of the present application. The electronic device 1000 includes but is not limited to a mobile phone, a tablet computer, a laptop computer, a computer, a wearable device, a drone, a robot, a digital camera, and other devices with communication functions. The present embodiment of the application is described by taking a mobile phone as an example, and other electronic devices can refer to this embodiment.

[0052] See also Figure 2 , Figure 2 1 is a partial exploded schematic diagram of an electronic device 1000 provided in an embodiment of the present application. The electronic device 1000 includes at least one camera module 100. Taking the electronic device 1000 as a mobile phone as an example, the working environment of the camera module 100 is illustrated. The electronic device 1000 includes a display screen 200, a middle frame 300 and a back cover 400 arranged in sequence along the thickness direction. Among them, the middle frame 300 includes a middle plate 310 and a frame 320 surrounding the side of the middle plate 310. The frame 320 is a conductive frame, such as a metal frame. A receiving space is formed between the display screen 200 and the middle plate 310, and between the middle plate 310 and the back cover 400 to accommodate the main board 600, the image sensor assembly, the receiver module, the battery 700, the sub-board 800 and various sensors and other devices. One side of the frame 320 along the thickness direction is surrounded by the edge of the display screen 200, and the other side of the frame 320 along the thickness direction is surrounded by the edge of the back cover 400 to form a complete appearance structure of the electronic device 1000. In this embodiment, the frame 320 and the middle plate 310 are an integral structure, and the frame 320 and the back cover 400 are a separate structure. The above is the working environment of the camera module 100 taking a mobile phone as an example, but the camera module 100 of the present application is not limited to the above working environment.

[0053] According to the functional classification, the camera module 100 includes but is not limited to a normal camera, an ultra-wide-angle camera, a wide-angle camera, a telephoto camera, a periscope telephoto camera, a portrait camera, a macro camera, a depth of field camera, etc.

[0054] According to the installation position, the camera module 100 includes but is not limited to a front camera and a rear camera. According to the number of camera combinations, the camera module 100 includes but is not limited to a main camera lens + a secondary camera lens combination, for example, a main camera lens with an ultra-wide-angle lens; a triple-camera lens combination, for example, an ultra-wide-angle main camera + an ultra-wide-angle + a periscope telephoto lens; a wide-angle lens + an ultra-wide-angle lens + a depth of field lens; a wide-angle lens + an ultra-wide-angle lens + a telephoto lens / macro lens, etc. A quad-camera lens combination, for example, a wide-angle lens + an ultra-wide-angle lens + an ultra-wide-angle lens + a periscope telephoto lens; a wide-angle lens + a telephoto lens + an ultra-wide-angle lens + a depth of field lens, etc.

[0055] See also Figure 3 and Figure 4 The embodiment of the present application further provides a camera module 100. The camera module 100 includes an image sensor assembly 10, a lens assembly 20, and an autofocus motor 30 disposed around the lens assembly 20. The autofocus motor 30 is used to adjust the position of the lens assembly 20 in the optical axis direction to achieve autofocus.

[0056] The image sensor 122 (see Fig.30 ) is directly opposite to the lens assembly 20 to receive light from the lens assembly 20.

[0057] See also Figure 5 and Figure 6 The present application also provides an image sensor assembly 10. The image sensor assembly 10 is a assembly including an image sensor and other peripheral structures.

[0058] Image sensors include but are not limited to photosensitive chips. Photosensitive chips (image sensors) are optoelectronic devices with photoelectric conversion functions. Image sensors are based on the photoelectric effect. Photons enter the sensor through the lens and are absorbed by the photodiode in the sensor, generating electrons. The electrons are collected and converted into electrical signals, that is, the light image on the photosensitive surface is converted into an electrical signal in a corresponding proportional relationship with the light image. After amplification and processing, a digital image is finally formed.

[0059] Types of image sensors include, but are not limited to, charge-coupled device (CCD) image sensors, complementary metal oxide field effect transistor (CMOS) image sensors, and the like.

[0060] This application provides examples to illustrate the specific structure of the image sensor assembly 10 described above.

[0061] See also Figure 5 and Figure 6 The image sensor assembly 10 includes a first circuit board 11 , an image sensor module 12 and a suspension connector 13 .

[0062] See also Figure 5-Figure 7a , Figure 7b Specifically, the first circuit board 11 is a module circuit board of the camera module 100. For example, the first circuit board 11 includes a first main body 111, a flexible extension 112 and a first auxiliary body 113 connected in sequence. The first circuit board 11 includes but is not limited to a PFC circuit board, a first support plate and a second support plate. Among them, the first support plate supports and fixes a part of the PFC circuit board to form the first main body 111, and the side of the PFC circuit board of this part away from the first support plate is the bearing surface, and a number of wiring interfaces, welding points, etc. are arranged on the bearing surface. With reference to the perspective in the figure, the first support plate is located on the bottom side of a part of the PFC circuit board.

[0063] The second support plate supports and fixes the other part of the PFC circuit board to form a second main body. Optionally, the second support plate and the first support plate support two sides of the PFC circuit board respectively. With reference to the perspective in the figure, the second support plate is located on the top side of the other part of the PFC circuit board. A conductive connection seat is provided on the bottom side of the other part of the PFC circuit board. For example, the conductive connection seat is used to electrically connect another conductive connection seat on the main board.

[0064] The image sensor module 12 and the first circuit board 11 are arranged opposite to each other along a first direction and spaced apart from each other. Specifically, the image sensor module 12 includes a combination of the image sensor module 12 and a sensor circuit. The following embodiments will provide a detailed description.

[0065] The first direction is a direction perpendicular to the surface (the bearing surface 115) where the first circuit board 11 is located. The first direction is the Z direction.

[0066] The orthographic projection of the image sensor module 12 on the first circuit board 11 is located in the area where the first main body 111 of the first circuit board 11 is located.

[0067] For illustration purposes, see Figure 7a , Figure 7b, a central area 115a, a transition area 115b surrounding the central area 115a, and a peripheral area 115c surrounding the transition area 115b are defined on the bearing surface 115 of the first circuit board 11. The orthographic projection of the image sensor module 12 on the first circuit board 11 is located in the central area 115a. The image sensor module 12 and the central area 115a are spaced apart in the first direction, and the present application does not make a specific limitation on this spacing. Optionally, the image sensor module 12 is spaced apart from the central area 115a of the first circuit board 11 in the first direction. The spacing ensures that the image sensor module 12 can move relative to the first circuit board 11 and will not interfere with the devices on the first circuit board 11 during movement.

[0068] See also Figure 8 The hanging connection member 13 includes a fixed connection member 131 , at least one first connection piece 132 and at least one second connection piece 133 .

[0069] Please also read Figure 5 , Figure 7a , Figure 7b , Figure 8 The fixed connection member 131 is spaced apart from the outer periphery of the image sensor module 12 .

[0070] Optional, please also see Figure 5 , Figure 7a , Figure 7b , Figure 8 , the fixed connection member 131 is located in the peripheral area 115c.

[0071] Please also read Figure 5 , Figure 7a , Figure 7b , Figure 8 The fixed connection member 131 is spaced apart from the outer periphery of the image sensor module 12. The region between the orthographic projection of the fixed connection member 131 on the first circuit board 11 and the orthographic projection of the image sensor module 12 on the first circuit board 11 includes a transition region 115b.

[0072] Please also read Figure 5 , Figure 7a , Figure 7b , Figure 8 , one end of the fixed connector 131 is connected to the first circuit board 11, and the other end of the fixed connector 131 extends toward a side away from the first circuit board 11 and is connected to the first connecting piece 132. Optionally, one end of the fixed connector 131 is fixedly connected to the first circuit board 11, so that the hanging connector 13 is fixedly connected to the first circuit board 11.

[0073] Optionally, the extension direction of the fixed connector 131 intersects (including perpendicularly) with the surface of the first circuit board 11. In this way, the fixed connector 131 has a certain structure in the first direction to limit the movement of other parts of the suspension connector 13 (the first connecting piece 132 and the second connecting piece 133) in the Z direction, thereby making it difficult for the suspension connector 13 to move in the Z direction. When anti-shake compensation is required, the image sensor module 12 moves or rotates within the plane relative to the first circuit board 11, reducing the movement in the first direction and improving the anti-shake effect of the camera module 100. The specific structure of the fixed connector 131 will be described below with examples.

[0074] Please also read Figure 5 , Figure 7a , Figure 7b , Figure 8 , the first connecting piece 132 is spaced apart from the first circuit board 11, and the surface where the first connecting piece 132 is located intersects (including perpendicularly) with the surface where the first circuit board 11 is located. The first connecting piece 132 is in a sheet shape, and the surface where the first connecting piece 132 is located intersects with the surface where the first circuit board 11 is located, so that the first connecting piece 132 is not easy to move in the Z direction, thereby limiting the movement of the suspension connector 13 in the Z direction. When anti-shake compensation is required, the image sensor module 12 moves or rotates within the plane relative to the first circuit board 11, reducing the movement in the first direction and improving the anti-shake effect of the camera module 100.

[0075] Please also read Figure 5 , Figure 7a , Figure 7b , Figure 8 , Fig. 9 , the first connecting piece 132 extends along the side of the image sensor module 12. For example, the side of the image sensor module 12 extends along the X direction, the first connecting piece 132 also extends along the X direction, and the first connecting piece 132 and the side of the image sensor module 12 have a spacing in the Y direction. For another example, the side of the image sensor module 12 first extends along the X direction and then extends along the Y direction, the first connecting piece 132 also first extends along the X direction, and the first connecting piece 132 and the side of the image sensor module 12 have a spacing H1 in the Y direction; the first connecting piece 132 also extends along the Y direction, and the first connecting piece 132 and the side of the image sensor module 12 have a spacing in the X direction.

[0076] Please also read Figure 5 , Figure 7a , Figure 7b-Figure 9The second connecting piece 133 is spaced apart from the first circuit board 11 by a distance H2. The second connecting piece 133 extends from the first connecting piece 132 toward the side where the image sensor module 12 is located and connects the image sensor module 12, so that the image sensor module 12 is suspended relative to the first circuit board 11.

[0077] The second connecting piece 133 is fixedly connected to the image sensor module 12. Further, the second connecting piece 133 is attached to the bottom side of the image sensor module 12 to support the image sensor module 12 so that there is a gap between the image sensor module 12 and the first circuit board 11. The second connecting piece 133 is in a sheet shape, so that it has a large bearing area, so as to provide a large supporting force and ensure the suspension stability of the image sensor module 12.

[0078] The image sensor assembly 10, the camera module 100 and the electronic device 1000 provided by the embodiment of the present application, the image sensor assembly 10 includes a first circuit board 11, an image sensor module 12, and a suspension connector 13, the image sensor module 12 and the first circuit board 11 are opposite to each other and spaced apart along a first direction; the suspension connector 13 includes a fixed connector 131, at least one first connecting piece 132, and at least one second connecting piece 133, the fixed connector 131 is spaced apart from the outer peripheral side of the image sensor module 12, one end of the fixed connector 131 is connected to the first circuit board 11, and the other end of the fixed connector 131 faces away from the first circuit board The first connecting piece 132 extends from one side of the image sensor module 11 and is connected to the first connecting piece 132. The first connecting piece 132 and the second connecting piece 133 are both spaced apart from the first circuit board 11. The surface where the first connecting piece 132 is located intersects with the surface where the first circuit board 11 is located. The first connecting piece 132 extends along the side of the image sensor module 12, and the second connecting piece 133 extends from the first connecting piece 132 toward the side where the image sensor module 12 is located and is connected to the image sensor module 12, so that the image sensor module 12 is suspended relative to the first circuit board 11. When anti-shake compensation is required, the image sensor moves or rotates within the plane relative to the first circuit board 11, thereby reducing the movement in the first direction and improving the anti-shake effect of the camera module 100.

[0079] The specific structure of the suspension connector 13 is described below with reference to the accompanying drawings.

[0080] See also Fig.10 In an optional implementation of the first fixed connection member 131 , the fixed connection member 131 includes a first sub-connection piece 1311 and a second sub-connection piece 1312 that are connected to each other.

[0081] Please also read Figure 5The first sub-connecting piece 1311 is attached to and fixed to the surface of the first circuit board 11. The first sub-connecting piece 1311 is in sheet shape, which can provide a larger area to be fixed to the surface of the first circuit board 11, so as to improve the firmness of the fixed connection between the suspension connector 13 and the first circuit board 11.

[0082] The present application does not limit the connection method between the first sub-connecting sheet 1311 and the first circuit board 11 , and the connection method includes but is not limited to adhesive bonding, screw fixing connection, welding, etc.

[0083] At least part of the second sub-connecting piece 1312 extends in a direction perpendicular to the first circuit board 11 and connects to the first connecting piece 132. The connection method between the second sub-connecting piece 1312 and the first sub-connecting piece 1311 includes but is not limited to interconnection as one body, adhesive bonding, screw fixing connection, welding, etc. In this embodiment, the second sub-connecting piece 1312 and the first sub-connecting piece 1311 are interconnected as one body. The first sub-connecting piece 1311 and the second sub-connecting piece 1312 are two parts formed by bending a sheet, and the bending angle thereof is but is not limited to 60° to 100°. This embodiment takes a bending angle of 90° as an example.

[0084] Specifically, optionally, the surface where the first sub-connecting piece 1311 is located is parallel to the XY plane, and the surface where the second sub-connecting piece 1312 is located is located in the XZ plane. This embodiment is described by taking the second sub-connecting piece 1312 being located on the side of the first sub-connecting piece 1311 facing the image sensor module 12 as an example. In other embodiments, the second sub-connecting piece 1312 may be located on the side of the first sub-connecting piece 1311 facing away from the image sensor module 12.

[0085] The connection method between the second sub-connection sheet 1312 and the first connection sheet 132 includes but is not limited to direct connection or indirect connection. In this embodiment, the second sub-connection sheet 1312 is directly connected to the first connection sheet 132. In other embodiments, the second sub-connection sheet 1312 and the first connection sheet 132 can also be connected through other planar sub-connection sheets or bent sub-connection sheets.

[0086] The connection method between the second sub-connection piece 1312 and the first connection piece 132 includes but is not limited to interconnection into one body, adhesive bonding, screw fixing connection, welding, etc.

[0087] In this embodiment, the first sub-connecting piece 1311 , the second sub-connecting piece 1312 and the first connecting piece 132 can be formed by bending one sheet.

[0088] Please also read Figure 5 , Figure 7a , Figure 7b , Fig.11In an optional implementation of the second type of fixed connector 131 , the fixed connector 131 includes a fixed block 1313 . The fixed block 1313 is fixed on the first circuit board 11 . The fixed block 1313 is fixedly connected to the first connecting piece 132 .

[0089] Optionally, the fixing block 1313 is block-shaped. The bottom surface of the fixing block 1313 has a certain area to fit and fix with the bearing surface 115 of the first circuit board 11, so as to improve the connection strength between the fixing block 1313 and the first circuit board 11. The connection method includes but is not limited to adhesive bonding, screw fixing connection, welding, etc.

[0090] The connection method between the fixed block 1313 and the first connecting piece 132 includes but is not limited to interconnection, adhesive bonding, screw fixing connection, welding, etc. The fixed block 1313 and the first connecting piece 132 are in surface contact with each other, and have a relatively large connection area to improve the connection strength between the fixed block 1313 and the first connecting piece 132. In addition, the fixed block 1313 provides a more reliable bonding force for the first connecting piece 132 to further prevent the first connecting piece 132 from moving in the Z direction, thereby limiting the movement of the suspension connector 13 in the Z direction. When anti-shake compensation is required, the image sensor module 12 moves or rotates relative to the first circuit board 11 in the XY plane, reduces the movement in the first direction, and improves the anti-shake effect of the camera module 100.

[0091] The present application does not make any specific limitation on the material of the fixing block 1313. For example, the material of the fixing block 1313 includes, but is not limited to, plastic, metal, etc. The fixing block 1313 has a certain rigidity. Optionally, the fixing block 1313 is a plastic block, which can reduce the weight of the fixing block 1313. The fixing block 1313 can be integrally formed with the first connecting piece 132 by injection molding, which can improve the connection firmness between the fixing block 1313 and the first connecting piece 132. In addition, the first connecting piece 132 can be embedded in the fixing block 1313 to further improve the connection firmness between the fixing block 1313 and the first connecting piece 132.

[0092] Please also read Figure 5 , Figure 7a , Figure 7b-Figure 8In the optional implementation of the third type of fixed connector 131, this implementation is an implementation of combining the first type of fixed connector 131 with the second type of fixed connector 131, that is, the fixed connector 131 includes a fixed block 1313, a first sub-connecting piece 1311 and a second sub-connecting piece 1312. The first sub-connecting piece 1311 is attached to and fixed to the surface of the first circuit board 11, and at least a portion of the second sub-connecting piece 1312 extends in a direction perpendicular to the first circuit board 11 and connects to the first connecting piece 132. The fixed block 1313 is fixed on the first circuit board 11, and the fixed block 1313 connects the first sub-connecting piece 1311 and the second sub-connecting piece 1312.

[0093] Optionally, the fixed block 1313, the first sub-connecting piece 1311 and the second sub-connecting piece 1312 are integrally formed by injection molding, which can improve the connection firmness between the fixed block 1313, the first sub-connecting piece 1311 and the second sub-connecting piece 1312. In addition, the first sub-connecting piece 1311 and the second sub-connecting piece 1312 can be embedded in the fixed block 1313 to further improve the connection firmness between the fixed block 1313 and the first sub-connecting piece 1311 and the second sub-connecting piece 1312.

[0094] In other embodiments, the fixed block 1313 is an inclined connecting piece, which intersects with the first sub-connecting piece 1311 and the second sub-connecting piece 1312. The inclined connecting piece, the first sub-connecting piece 1311 and the second sub-connecting piece 1312 form a stable triangular structure to avoid angle changes between the first sub-connecting piece 1311 and the second sub-connecting piece 1312 and improve the stability of the second sub-connecting piece 1312.

[0095] Optional, see Fig.12 The first connection piece 132 includes a third sub-connection piece 1321 and a fourth sub-connection piece 1322 which are connected in a bent manner. Optionally, the third sub-connection piece 1321 and the fourth sub-connection piece 1322 are interconnected as a whole.

[0096] The third sub-connecting piece 1321 is arranged at intervals along the first side 12a of the image sensor module 12. The third sub-connecting piece 1321 is connected to the fixed connecting member 131. Optionally, the first side 12a is a side extending along the X direction. In other words, one end of the third sub-connecting piece 1321 is connected to the fixed connecting member 131, the other end of the third sub-connecting piece 1321 extends along the X direction, and the third sub-connecting piece 1321 is arranged at intervals from the first side 12a.

[0097] The fourth sub-connecting pieces 1322 are disposed at intervals along the second side 12 b of the image sensor module 12 . The fourth sub-connecting pieces 1322 are connected to the second connecting piece 133 .

[0098] Optional, see Fig.12 , the first side 12a and the second side 12b are adjacent sides of the image sensor module 12. The second side 12b is a side extending along the Y direction. In other words, one end of the fourth sub-connecting piece 1322 is connected to the third sub-connecting piece 1321, the fourth sub-connecting piece 1322 extends along the Y direction, and the fourth sub-connecting piece 1322 is spaced apart from the second side 12b. The other end of the fourth sub-connecting piece 1322 is connected to the second connecting piece 133.

[0099] For optional reference, see Fig.13 , the first side 12a and the second side 12b are the opposite sides of the image sensor module 12. The second side 12b is the other side extending along the X direction. In other words, one end of the fourth sub-connecting piece 1322 is connected to the third sub-connecting piece 1321, the fourth sub-connecting piece 1322 first extends along the Y direction and then extends along the X direction to the second side 12b, and the fourth sub-connecting piece 1322 is spaced apart from the second side 12b. The other end of the fourth sub-connecting piece 1322 is connected to the second connecting piece 133.

[0100] In this embodiment, the second connecting piece 133 and the fixed connecting member 131 are located on different sides of the image sensor module 12. Due to the arrangement of the fixed connecting member 131, the first connecting piece 132 on the side where the fixed connecting member 131 is located is not easy to move in the XY plane, that is, the side where the fixed block 1313 is located has some restrictions on the movement of the first connecting piece 132 in the XY plane, so the fixed block 1313 and the second connecting piece 133 are arranged on different sides, so that the second connecting piece 133 can move with the image sensor module 12 in the XY plane.

[0101] Further optionally, the surface where the third sub-connecting piece 1321 is located is perpendicular to the surface where the fourth sub-connecting piece 1322 is located. The surface where the third sub-connecting piece 1321 is located and the surface where the fourth sub-connecting piece 1322 is located are both perpendicular to the first circuit board 11. For example, the first circuit board 11 is parallel to the XY plane. The surface where the third sub-connecting piece 1321 is located is parallel to the XZ plane, and the surface where the fourth sub-connecting piece 1322 is located is parallel to the YZ plane.

[0102] The third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 form a three-dimensional structure. The third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 both have a certain extension length in the Z direction. Compared with the linear connection structure in the XY plane, the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 provided in the present application are not easy to deform in the Z direction. At the same time, the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 are vertically arranged, and the angle between the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 is not easy to deform. Therefore, when translation compensation or rotation compensation is required in the XY plane, the suspension connecting piece 13 is not easy to deform in the Z direction, and can also maintain its shape during translation compensation or rotation compensation.

[0103] The present application does not specifically limit the lengths of the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322. Optionally, when the first side 12a and the second side 12b are adjacent sides of the image sensor module 12, the length of the third sub-connecting piece 1321 is slightly greater than half of the first side 12a of the image sensor module 12. The length of the fourth sub-connecting piece 1322 is slightly greater than half of the second side 12b of the image sensor module 12.

[0104] See also Fig.14 The second connecting piece 133 includes a fifth sub-connecting piece 1331 and a sixth sub-connecting piece 1332 .

[0105] Optionally, the fifth sub-connecting piece 1331 and the sixth sub-connecting piece 1332 are connected by bending. The fifth sub-connecting piece 1331 and the sixth sub-connecting piece 1332 are interconnected as a whole.

[0106] Optional, please also see Figure 5 , Fig.12 and Fig.14 , the fifth sub-connecting piece 1331 extends from one end of the fourth sub-connecting piece 1322 toward the first circuit board 11 and connects to the sixth sub-connecting piece 1332. The sixth sub-connecting piece 1332 extends toward the image sensor module 12 and is fixedly connected to the image sensor module 12. Specifically, the surface where the fifth sub-connecting piece 1331 is located may be located in the YZ plane. The surface where the sixth sub-connecting piece 1332 is located may be located in the XY plane.

[0107] In this embodiment, the fifth sub-connecting piece 1331 is provided. On the one hand, the fifth sub-connecting piece 1331 is connected to the first connecting piece 132. On the other hand, the fifth sub-connecting piece 1331 can be deformed in the XY plane under the driving force, so that the image sensor module 12 can move in the XY plane under the driving force.

[0108] Of course, in other embodiments, the fifth sub-connecting plate 1331 may not be provided, and the sixth sub-connecting plate 1332 is directly connected to the second connecting plate 133 .

[0109] Optionally, the present application does not impose any specific limitation on the width and thickness of each sub-connecting piece.

[0110] Optional, see Fig.15 The suspension connector 13 further includes a stopper 134. The stopper 134 includes a first sub-stopper 1341 and a second sub-stopper 1342 that are interconnected as one body and bent. The first sub-stopper 1341 is fixedly connected to the third sub-connecting piece 1321. The second sub-stopper 1342 is fixedly connected to the fourth sub-connecting piece 1322. The bottom of the stopper 134 is spaced apart from the first circuit board 11.

[0111] Since the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 are both in the shape of thin sheets, when the image sensor module 12 is driven by a force, the angle between the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 may change, thereby absorbing a portion of the driving force, resulting in inaccurate movement of the image sensor module 12 .

[0112] The limit block 134 is a rigid structure, and is used to keep the first sub-connecting piece 1311 and the second sub-connecting piece 1312 in shape in the X-axis direction and the Y-axis direction, so as to avoid the angle between the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 changing when performing movement or rotation compensation, thereby absorbing part of the driving force and causing inaccurate compensation of the image sensor module 12, thereby further improving the anti-shake compensation stability of the image sensor module 12.

[0113] In this embodiment, the connection position of the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 is strengthened by designing a limit block 134 to maintain the bending angle of the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322, reduce the deformation of the suspension connecting member 13 during the movement compensation process, and further improve the anti-shake compensation stability of the image sensor module 12.

[0114] The present application does not make any specific limitation on the material of the limit block 134. For example, the material of the limit block 134 includes, but is not limited to, plastic, metal, etc. The limit block 134 has a certain rigidity. Optionally, the limit block 134 is a plastic block, which can reduce the weight of the limit block 134. The limit block 134 can be integrally formed with the first connecting piece 132 by injection molding, which can improve the connection firmness between the limit block 134 and the first connecting piece 132. In addition, the first connecting piece 132 can be embedded in the limit block 134 to further improve the connection firmness between the limit block 134 and the first connecting piece 132.

[0115] The following is an example of the structure of the suspension connector 13 provided in the present application, taking the embodiments in which the fixed connector 131 includes a fixed block 1313, a first sub-connection sheet 1311 and a second sub-connection sheet 1312 and the embodiments in which the fixed connector 131 includes a fixed block 1313, a first sub-connection sheet 1311 and a second sub-connection sheet 1312 as examples.

[0116] In the first embodiment of the suspension connector 13, see Fig.16 , the first side 12a and the second side 12b are adjacent two sides of the image sensor module 12. The surface where the first sub-connecting piece 1311 is located is parallel to the XY plane. The surface where the second sub-connecting piece 1312 is located is parallel to the XZ plane. The surface where the third sub-connecting piece 1321 is located is parallel to the XZ plane. The surface where the fourth sub-connecting piece 1322 is located is parallel to the YZ plane. The surface where the fifth sub-connecting piece 1331 is located is parallel to the XZ plane, and the surface where the sixth sub-connecting piece 1332 is located is parallel to the XY plane. From the perspective of height, the height of the first sub-connecting piece 1311 is lower than the height of the second sub-connecting piece 1312, the height of the second sub-connecting piece 1312 is lower than the height of the third sub-connecting piece 1321, and the height of the fourth sub-connecting piece 1322 is equal to the height of the third sub-connecting piece 1321. The height of the fifth sub-connecting piece 1331 is lower than the height of the fourth sub-connecting piece 1322. The height of the sixth sub-connecting piece 1332 is less than the height of the fifth sub-connecting piece 1331 and higher than the height of the first sub-connecting piece 1311.

[0117] In this embodiment, the suspension connector 13 is roughly L-structured. Under the driving force, the third sub-connecting piece 1321, the fourth sub-connecting piece 1322, and the fifth sub-connecting piece 1331 can be deformed, so that the image sensor module 12 moves in the XY plane under the driving force and the suspension connector 13 is not easily deformed along the Z direction.

[0118] See also Fig.17 , Fig.17 The suspension connection member 13 shown is Fig.16 The difference of the hanging connector 13 shown is that the fixed connector 131 further includes a fixed block 1313. The hanging connector 13 further includes a limit block 134.

[0119] In the second embodiment of the suspension connector 13, please refer to Fig.18, the first side 12a and the second side 12b are opposite sides of the image sensor module 12. The surface where the first sub-connecting piece 1311 is located is parallel to the XY plane. The surface where the second sub-connecting piece 1312 is located is parallel to the XZ plane. The surface where the third sub-connecting piece 1321 is located is parallel to the XZ plane. The surface where a part of the fourth sub-connecting piece 1322 is located is parallel to the YZ plane, and the surface where another part of the fourth sub-connecting piece 1322 is located is parallel to the XZ plane and directly opposite to the third sub-connecting piece 1321. The fourth sub-connecting piece 1322 is L-shaped. The surface where the fifth sub-connecting piece 1331 is located is parallel to the XZ plane, and the surface where the sixth sub-connecting piece 1332 is located is parallel to the XY plane. From the perspective of height, the height of the first sub-connecting piece 1311 is lower than the height of the second sub-connecting piece 1312, the height of the second sub-connecting piece 1312 is lower than the height of the third sub-connecting piece 1321, and the height of the fourth sub-connecting piece 1322 is equal to the height of the third sub-connecting piece 1321. The height of the fifth sub-connecting plate 1331 is lower than that of the fourth sub-connecting plate 1322. The height of the sixth sub-connecting plate 1332 is lower than that of the fifth sub-connecting plate 1331 and higher than that of the first sub-connecting plate 1311.

[0120] In this embodiment, the suspension connector 13 is roughly in a C structure. Under the driving force, the third sub-connecting piece 1321, the fourth sub-connecting piece 1322, and the fifth sub-connecting piece 1331 can be deformed, so that the image sensor module 12 moves in the XY plane under the driving force and the suspension connector 13 is not easy to deform along the Z direction.

[0121] See also Fig.19 , Fig.19 The suspension connection member 13 shown is Fig.18 The difference of the hanging connector 13 shown is that the fixed connector 131 further includes a fixed block 1313. The hanging connector 13 further includes a limit block 134.

[0122] In the third embodiment of the suspension connector 13, please refer to Fig. 20 , the number of the first connecting pieces 132 is two. The two first connecting pieces 132 (the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322) are both connected to the two sides of one of the fixed connecting pieces 131. The two first connecting pieces 132 are symmetrically arranged. The first connecting piece in this embodiment has the same structure as the first connecting piece in the second embodiment. The number of the second connecting piece 133 is one. The ends of the two first connecting pieces 132 away from the fixed connecting piece 131 are respectively connected to the two sides of one of the second connecting pieces 133.

[0123] In this embodiment, the two first connecting pieces 132 form an annular structure, and under the driving force, the third sub-connecting piece 1321, the fourth sub-connecting piece 1322, and the fifth sub-connecting piece 1331 can be deformed, so that the image sensor module 12 moves in the XY plane under the driving force and the suspension connecting piece 13 is not easy to deform along the Z direction. In this embodiment, the suspension connecting piece 13 is roughly annular, and can provide a more balanced deformation amount and deformation force in the XY plane to improve the accuracy of displacement compensation in all directions.

[0124] See also Fig.21 , Fig.21 The suspension connection member 13 shown is Fig. 20 The difference of the hanging connector 13 shown is that the fixed connector 131 further includes a fixed block 1313. The hanging connector 13 further includes a limit block 134.

[0125] In the fourth embodiment of the suspension connector 13, please refer to Fig. 22 , the first connecting piece 132 (see Fig. 22 The number of the third sub-connecting piece 1321 and the fourth sub-connecting piece 1322 is two. The two first connecting pieces 132 are connected to one of the fixed connecting members 131 (see Fig. 22 The first connecting piece 1311 and the second connecting piece 1312 are arranged on both sides of the image sensor module 12. The two first connecting pieces 132 are symmetrically arranged. The first connecting piece 132 in this embodiment has the same structure as the first connecting piece 132 in the first embodiment. The first side edge 12a and the second side edge 12b are respectively the adjacent two sides of the image sensor module 12. The second connecting piece 133 (see Fig. 22 The number of the fifth sub-connecting piece 1331 and the sixth sub-connecting piece 1332 is two. The two second connecting pieces 133 are respectively disposed on two opposite sides of the image sensor module 12 .

[0126] In this embodiment, the two first connecting pieces 132 form a C structure. Under the driving force, the two first connecting pieces 132 and the two fifth sub-connecting pieces 1331 can be deformed, so that the image sensor module 12 moves in the XY plane under the driving force and the suspension connector 13 is not easy to deform along the Z direction. In addition, the two first connecting pieces 132 and the two second connecting pieces 133 are symmetrically arranged to improve the accuracy of displacement compensation in all directions.

[0127] See also Fig.23 , Fig.23 The suspension connection member 13 shown is Fig. 22 The difference of the hanging connector 13 shown is that the fixed connector 131 further includes a fixed block 1313. The hanging connector 13 further includes a limit block 134.

[0128] In the fifth embodiment of the suspension connector 13, please refer to Fig.24 , the first side 12a and the second side 12b are respectively adjacent two sides of the image sensor module 12. The number of the fixed connector 131, the first connecting piece 132, and the second connecting piece 133 is two. The two fixed connectors 131 are respectively arranged at intervals with the first side 12a and the third side 12c opposite to the image sensor module 12. Optionally, the two fixed connectors 131 may be respectively opposite to the center position of the first side 12a and the center position of the third side 12c of the image sensor module 12.

[0129] The two first connecting pieces 132 are respectively located at two diagonal sides of the image sensor module 12. The first connecting piece 132 in this embodiment may be the first connecting piece 132 in the embodiment of the first hanging connector 13. The two second connecting pieces 133 are respectively arranged at intervals with the second side 12b and the fourth side 12d opposite to the image sensor module 12 to be connected to the second side 12b and the fourth side 12d of the image sensor module 12.

[0130] In this embodiment, the two first connecting pieces 132 form two diagonal L structures. Under the driving force, the two first connecting pieces 132 and the two fifth sub-connecting pieces 1331 can be deformed, so that the image sensor module 12 moves in the XY plane under the driving force and the suspension connector 13 is not easy to deform along the Z direction. In addition, the two first connecting pieces 132 and the two second connecting pieces 133 are all arranged diagonally symmetrically, which can provide a more balanced deformation amount and deformation force in the XY plane to improve the accuracy of displacement compensation in all directions.

[0131] See also Fig.25 , Fig.25 The suspension connection member 13 shown is Fig.24 The difference of the hanging connector 13 shown is that the fixed connector 131 further includes a fixed block 1313. The hanging connector 13 further includes a limit block 134.

[0132] In the sixth embodiment of the suspension connector 13, please refer to Fig.26, the first side 12a and the second side 12b are respectively the adjacent two sides of the image sensor module 12. The number of the fixed connecting members 131 is two, the number of the first connecting pieces 132 is four, and the number of the second connecting pieces 133 is two. The two fixed connecting members 131 are respectively arranged at intervals with the first side 12a and the third side 12c opposite to the image sensor module 12. The four first connecting pieces 132 are respectively located at the four corners of the image sensor module 12 and are connected in pairs to form a ring. The two second connecting pieces 133 are respectively located at the second side 12b and the fourth side 12d opposite to the image sensor module 12 and are arranged at intervals.

[0133] Optionally, the two fixing connectors 131 may be respectively opposite to the center position of the first side 12 a and the center position of the third side 12 c of the image sensor module 12 .

[0134] The four first connecting pieces 132 are respectively located outside the four corners of the image sensor module 12. The first connecting piece 132 in this embodiment can be the first connecting piece 132 in the embodiment of the first hanging connector 13. The two second connecting pieces 133 are respectively arranged at intervals with the second side 12b and the fourth side 12d opposite to the image sensor module 12 to be connected to the second side 12b and the fourth side 12d of the image sensor module 12.

[0135] See also Fig. 27 , Fig. 27 The suspension connection member 13 shown is Fig.26 The difference of the hanging connector 13 shown is that the fixed connector 131 further includes a fixed block 1313. The hanging connector 13 further includes a limit block 134.

[0136] When the image sensor module 12 is driven along the +X direction, the first connecting piece 132 and the two fifth sub-connecting pieces 1331 on the side of the X direction are deformed, so that the image sensor module 12 moves along the +X direction relative to the first circuit board 11. When the image sensor module 12 is driven along the +Y direction, the first connecting piece 132 on the side of the Y direction is deformed, so that the image sensor module 12 moves along the +Y direction relative to the first circuit board 11. When the image sensor module 12 receives driving forces in the +X and -Y directions at the same time, the first connecting piece 132 and the two fifth sub-connecting pieces 1331 on the sides of the X and Y directions are deformed, so that the image sensor module 12 rotates, and so on, so that displacement compensation in any direction of the XY plane can be achieved.

[0137] In this embodiment, the four first connecting pieces 132 form four diagonal L structures and are connected to form a ring shape to increase the movement balance of the suspension connector 13 in the XY plane under the action of external force. For example, when subjected to a force in the X direction, the suspension connector 13 moves in the X direction as a whole, and when subjected to a force in the Y direction, the suspension connector 13 moves in the Y direction as a whole, reducing the absorption of part of the driving force due to the deformation of the suspension connector 13 in the XY plane, resulting in the unequal application of the driving force and the movement process of the suspension connector 13, and reducing the anti-shake compensation accuracy, so as to improve the accuracy of displacement compensation in all directions. Under the driving force, the four first connecting pieces 132 and the two fifth sub-connecting pieces 1331 can be deformed, so that the image sensor module 12 moves in the XY plane under the driving force and the suspension connector 13 is not easily deformed in the Z direction. In addition, the two fixed connectors 131 can increase the connection strength between the suspension connector 13 and the first circuit board 11. The two fixed connectors 131 are symmetrically arranged to increase the uniformity of the fixed connection force of the suspension connector 13 to improve the accuracy of displacement compensation in all directions.

[0138] In addition, in this embodiment, the plane where the first connecting piece 132 is located is perpendicular to the plane where the first circuit board 11 is located, so the space occupied by the first connecting piece 132 in the XY plane is small, which is conducive to miniaturization of the image sensor module 12.

[0139] The suspension connector 13 is described in detail below from the perspective of elastic coefficient.

[0140] Optionally, the elastic coefficient of the suspension connector 13 in the plane where the first circuit board 11 is located is smaller than the elastic coefficient of the suspension connector 13 in the plane perpendicular to the first circuit board 11. In other words, the suspension connector 13 is more likely to deform in the XY plane, thereby making it easier for the image sensor module 12 to overcome the force of the suspension connector 13 under the driving force and to move in the XY plane. Moreover, the driving force for moving the image sensor module 12 in the XY plane can be set to be smaller, thereby reducing the design requirements for the driving member.

[0141] In addition, the suspension connector 13 is less likely to deform in the Z direction, and has sufficient rigidity in the Z direction to support the entire image sensor module 12 and limit the movement of the image sensor module 12 in the Z direction, so that the image sensor module 12 will not deform in the Z direction when moving in the XY plane under the driving force. On the one hand, it avoids the Z direction deformation causing the driving force and the moving displacement to be unequal, and on the other hand, it avoids the posture change of the image sensor module 12 due to the Z direction deformation, which affects the reception of light and imaging.

[0142] Optionally, the elastic coefficient of the suspension connector 13 in the plane where the first circuit board 11 is located is 10 to 100 mN / mm. Optionally, the elastic coefficient of the suspension connector 13 in the plane where the first circuit board 11 is located includes but is not limited to 10 mN / mm, 20 mN / mm, 30 mN / mm, 40 mN / mm, 50 mN / mm, 60 mN / mm, 70 mN / mm, 80 mN / mm, 90 mN / mm, 100 mN / mm. If the elastic coefficient of the suspension connector 13 in the plane where the first circuit board 11 is located is too large, for example, greater than 100 mN / mm, it may cause the suspension connector 13 to be difficult to deform in the plane where the first circuit board 11 is located, and a larger driving force is required to drive the image sensor module 12 to perform displacement compensation in the plane where the first circuit board 11 is located, which has higher design requirements for the driver, or causes the size of the driver to be designed to be larger.

[0143] Optionally, the elastic coefficient of the suspension connector 13 in a plane perpendicular to the first circuit board 11 is 1000-3000 mN / mm. Optionally, the elastic coefficient of the suspension connector 13 in the plane where the first circuit board 11 is located includes but is not limited to 1000mN / mm, 1100mN / mm, 1200mN / mm, 1300mN / mm, 1400mN / mm, 1500mN / mm, 1600mN / mm, 1700mN / mm, 1800mN / mm, 1900mN / mm, 2000mN / mm, 2100mN / mm, 2200mN / mm, 2300mN / mm, 2400mN / mm, 2500mN / mm, 2600mN / mm, 2700mN / mm, 2800mN / mm, 2900mN / mm and 3000mN / mm. If the elastic coefficient of the suspension connector 13 in the plane perpendicular to the first circuit board 11 is too small, for example, less than 1000mN / mm, the suspension connector 13 may be easily deformed in the plane perpendicular to the first circuit board 11. The deformation in the Z direction causes the driving force and the movement displacement to be unequal. On the other hand, the posture of the image sensor module 12 changes due to the deformation in the Z direction, which affects the reception of light and imaging.

[0144] Optional, see Fig. 27 and Fig.28 The image sensor assembly 10 further includes a first connection seat 141 and a second connection seat 142. Optionally, the first connection seat 141 extends along the X direction, and the second connection seat 142 extends along the X direction. The first connection seat 141, the second connection seat 142 and the image sensor module 12 are all arranged in a space surrounded by the suspension connector 13.

[0145] The first connection base 141 is disposed on the first circuit board 11 and is located between the fixed connection member 131 and the first side 12 a of the image sensor module 12 .

[0146] The second connection base 142 is disposed on the image sensor module 12 and close to the first side 12a of the image sensor module 12. The first connection base 141 and the second connection base 142 can be disposed in parallel or nearly parallel. The first connection base 141 and the second connection base 142 are disposed at an interval.

[0147] See also Fig. 27 and Fig.28 The image sensor assembly 10 further includes a plurality of elastic conductive connectors 143. One end of each of the elastic conductive connectors 143 is fixed to the first connection seat 141, and the other end of each of the elastic conductive connectors 143 is fixedly connected to the second connection seat 142, so as to achieve electrical conduction between the image sensor module 12 and the first circuit board 11, and also allow the image sensor module 12 to maintain electrical conduction with the first circuit board 11 when the image sensor module 12 moves relative to the first circuit board 11.

[0148] Optional, see Fig.29 Each of the elastic conductive connecting members 143 includes a first connecting plate 1431, a flexible connecting wire 1432 and a second connecting plate 1433. The first connecting plate 1431 is fixed on the first connecting seat 141. The second connecting plate 1433 is fixed on the second connecting seat 142. A plurality of first connecting plates 1431 are sequentially spaced along the X direction on the first connecting seat 141. A plurality of second connecting plates 1433 are sequentially spaced along the X direction on the second connecting seat 142.

[0149] The plurality of flexible connecting wires 1432 are arranged at intervals. Both ends of each flexible connecting wire 1432 are respectively connected between one of the first connecting seats 141 and one of the second connecting seats 142. The first connecting plate 1431, the flexible connecting wire 1432 and the second connecting plate 1433 are sequentially connected and electrically conductive.

[0150] The flexible connecting wire 1432 can ensure that the first connecting disk 1431 and the second connecting disk 1433 are still electrically connected when they are displaced to a certain extent in any direction of the XY plane.

[0151] Optionally, the flexible connecting wire 1432 is a silicon wire. The first connecting plate 1431, the plurality of flexible connecting wires 1432 and the second connecting plate 1433 form an integrated structure through a MEMS process, and are formed into a three-dimensional structure through extrusion.

[0152] Specifically, in the present application, a MEMS process can be used to prepare a plurality of the elastic conductive connectors 143 on a substrate through deposition, graphic transfer, etching and other processes, and the plurality of elastic conductive connectors 143 are peeled off from the substrate. The peeled elastic conductive connectors 143 are extruded to form a flexible connecting wire 1432 with a three-dimensional structure, so that the flexible connecting wire 1432 can ensure a certain deformation space in any direction of the XY plane, so as to accommodate a certain displacement of the first connecting plate 1431 and the second connecting plate 1433 in any direction of the XY plane, and maintain electrical conductivity between the first connecting plate 1431 and the second connecting plate 1433.

[0153] The flexible connecting wire 1432 may be a two-dimensional pattern made by MEMS technology and a three-dimensional structure formed by extrusion.

[0154] Optional, see Fig.29 The flexible connecting wire 1432 includes a first connecting arm 1434, an intermediate connecting arm 1435 and a second connecting arm 1436. Optionally, the first connecting arm 1434, the intermediate connecting arm 1435 and the second connecting arm 1436 extend in the Y direction in sequence.

[0155] One end of the first connecting arm 1434 is connected to the first connecting plate 1431. The first connecting arm 1434 extends along the first side edge 12a and in a direction perpendicular to the first circuit board 11, and is connected to one end of the middle connecting arm 1435. In other words, the first connecting arm 1434 extends toward the +Z direction and the X direction. Further optionally, the first connecting arm 1434 may extend in an arc-shaped trajectory.

[0156] The middle connecting arm 1435 extends along the third side 12c of the image sensor module 12. In other words, the middle connecting arm 1435 extends along the Y direction.

[0157] One end of the second connecting arm 1436 is connected to the other end of the middle connecting arm 1435 , and the second connecting arm 1436 extends along the first side 12 a and in a direction perpendicular to the first circuit board 11 . The other end of the second connecting arm 1436 is connected to the second connecting plate 1433 .

[0158] In other words, the second connecting arm 1436 extends toward the -Z direction and the X direction. Further optionally, the second connecting arm 1436 may extend in an arc-shaped trajectory. Further, the first connecting arm 1434 and the second connecting arm 1436 are mirror-symmetrical structures, wherein the symmetry planes of the first connecting arm 1434 and the second connecting arm 1436 are parallel to the XZ plane.

[0159] For more details, please refer to Fig.29The flexible connecting wire 1432 includes a first fitting arm 1437 and a second fitting arm 1438. The first fitting arm 1437 is connected between the first connecting plate 1431 and the first connecting arm 1434. The second fitting arm 1438 is connected between the second connecting plate 1433 and the second connecting arm 1436. The first fitting arm 1437 is fitted on the first connecting seat 141.

[0160] The first laminating arm 1437 and the second laminating arm 1438 in the middle part extend in the Y-axis direction. The extension directions of the first laminating arm 1437 and the second laminating arm 1438 located at the two side parts intersect with both the X-direction and the Y-direction. The extension direction of the first connecting arm 1434 in the Y-direction is opposite to the extension direction of the first laminating arm 1437. For example, the first laminating arm 1437 extends in the +X and -Y directions, the first connecting arm 1434 extends in the +X, +Y, and +Z directions, the middle connecting arm 1435 extends in the +X direction, the second connecting arm 1436 extends in the +X, -Y, and -Z directions, and the second laminating arm 1438 extends in the +X and +Y directions.

[0161] When the image sensor module 12 moves along the X direction, a deformable space can be formed between the first connecting arm 1434 and the second connecting arm 1436 along the X direction, and the angle between the first connecting arm 1434 and the second connecting arm 1436 along the X direction can change as the position of the image sensor module 12 changes, so as to absorb and / or compensate for the distance generated when the image sensor module 12 moves along the X direction;

[0162] When the image sensor module 12 moves along the Y direction, a deformable space is formed between the first connecting arm 1434 and the second connecting arm 1436 along the Y direction. The angle between the first connecting arm 1434 and the second connecting arm 1436 along the Y direction can change with the position of the image sensor module 12 to absorb and / or compensate for the distance generated when the image sensor module 12 moves along the Y direction.

[0163] In other embodiments, for example, the first fitting arm 1437 extends along the +X and -Y directions, the first connecting arm 1434 extends along the +X, +Y, +Z directions, the middle connecting arm 1435 extends along the +X direction, the second connecting arm 1436 extends along the +X, -Y, -Z directions, and the second fitting arm 1438 extends along the +X and +Y directions.

[0164] Optional, see Fig.28 The plurality of elastic conductive connecting members 143 are divided into a first group of elastic conductive connecting members 143a and a second group of elastic conductive connecting members 143b along the first side 12a.

[0165] The first group of elastic conductive connectors 143a and the second group of elastic conductive connectors 143b are symmetrically arranged along the first side 12a. The middle connecting arm 1435 of the first group of elastic conductive connectors 143a deviates toward the side away from the second group of elastic conductive connectors 143b. The middle connecting arm 1435 of the second group of elastic conductive connectors 143b deviates toward the side away from the first group of elastic conductive connectors 143a. The first group of elastic conductive connectors 143a and the second group of elastic conductive connectors 143b are symmetrical about the Y direction to improve the overall force uniformity of the elastic conductive connectors 143.

[0166] For example, when the image sensor module 12 is subjected to a driving force in the +X direction, the first connecting arm 1434 of the first group of elastic conductive connecting members 143a deforms as the image sensor module 12 moves in the +X direction. Since the first connecting arm 1434 of the first group of elastic conductive connecting members 143a extends in the +X, +Y, and +Z directions, the first connecting arm 1434 of the first group of elastic conductive connecting members 143a will bring a force in the -Y direction during the movement in the +X direction, and the first connecting arm 1434 of the second group of elastic conductive connecting members 143b will bring a force in the +Y direction during the movement in the +X direction. Therefore, the first group of elastic conductive connecting members 143a and the second group of elastic conductive connecting members 143b are symmetrically arranged about the Y direction so that the forces in the Y direction during the above movement process can be offset.

[0167] In this embodiment, the elastic conductive connecting member 143 is roughly in the shape of a "J" in the YZ plane. In other embodiments, the elastic conductive connecting member 143 can also be in a horizontal "S", an inverted "U", a horizontal "C", etc. in the YZ plane.

[0168] Optionally, the plurality of elastic conductive connectors 143 in this embodiment are arranged on one side of the image sensor module 12. Furthermore, since the elastic conductive connector 143 in the present application is made by MEMS process, the size of the elastic conductive connector 143 is small. For example, the size of the flexible connecting wire 1432 is micro-nanoscale (e.g., 1 to 10 um), which is smaller than the size of the metal traces in the traditional circuit board process (e.g., 50 um). Since the size of each flexible connecting wire 1432 is small, it creates conditions for moving all the electrical connection lines between the image sensor module 12 and the first circuit board 11 out from the same side.

[0169] Compared with TSA-type image sensors in general traditional technologies, TSA-type image sensors not only have a very complex manufacturing process, are extremely difficult and expensive, but also because metal traces are designed around the image sensor to electrically connect the image sensor and the circuit board, the size of the image sensor component is too large, for example, the module plane size is 23*22mm.

[0170] On the one hand, the present application separates the elastic conductive connector 143 from the suspension connector 13, and most of the area of ​​the suspension connector 13 extends along the Z direction, so that the area occupied by the suspension connector 13 in the XY plane is small; the elastic conductive connector 143 is made by MEMS technology, so the size of the elastic conductive connector 143 is small. Since the size of each flexible connecting wire 1432 is small, it creates conditions for moving the electrical connection lines between the image sensor module 12 and the first circuit board 11 from the same side. In addition, since the elastic conductive connector 143 does not need to be considered to be evenly distributed around the image sensor, only the electrical signal connection between the image sensor and the first circuit board 11 needs to be considered. All of the above create conditions for setting the electrical connection between the elastic conductive connector 143 and the first circuit board 11 on one side of the image sensor module 12. On the one hand, the reduction in the size of the elastic conductive connector 143 can reduce the size of the entire module. On the other hand, setting the elastic conductive connector 143 on one side of the image sensor module 12 can also further reduce the size of the entire module, for example, the module plane size is 20*20mm.

[0171] Optional, see Fig.30 , the image sensor assembly 10 includes a plurality of first conductive traces 144 and a plurality of second conductive traces 145 .

[0172] Each of the first conductive traces 144 electrically connects the image sensor module 12 and one end of the elastic conductive connection member 143 . Each of the second conductive traces 145 electrically connects the first circuit board 11 and the other end of the elastic conductive connection member 143 .

[0173] In this embodiment, the first conductive trace 144 is used to conduct the electrical signal of the pad of the image sensor module 12 to one end of the elastic conductive connector 143, specifically the first connection pad 1431. The electrical signal of the first connection pad 1431 of the elastic conductive connector 143 is conducted to the second connection pad 1433 via the flexible connecting wire 1432. The second conductive trace 145 is used to conduct the electrical signal of the second connection pad 1433 to the pad of the first circuit board 11, thereby achieving electrical signal conduction between the first circuit board 11 and the image sensor module 12.

[0174] The embodiment of the present application does not specifically limit the materials of the first conductive trace 144 and the second conductive trace 145. For example, the first conductive trace 144 and the second conductive trace 145 are both gold wires, and the two ends of the first conductive trace 144 are electrically connected to the pad of the image sensor module 12 and the first connection pad 1431 through a bonding process, and the two ends of the second conductive trace 145 are electrically connected to the pad of the first circuit board 11 and the second connection pad 1433 through a bonding process.

[0175] In other words, the electrical signal from the image sensor module 12 is conducted to the electrical connection pad on the first connection plate 1431 (the moving part of the MEMS silicon structure) through the gold wire (the first conductive trace 144), and the electrical connection pad and the flexible connecting wire 1432 (silicon wire) are electrically conductive, and the signal is conducted to the electrical connection pad on the second connection plate 1433 (the fixed part of the MEMS silicon structure), and the signal is again conducted to the first circuit board 11 through the gold wire (the second conductive trace 145).

[0176] Optionally, the first connection plate 1431 (the moving part of the MEMS silicon structure) and the first connection seat 141 on the image sensor module 12 are fixed by glue, and can perform translational and rotational movements relative to the second connection plate 1433 (the fixed part of the MEMS silicon structure) after external force is applied.

[0177] The second connection plate 1433 (the fixing part of the MEMS silicon structure) and the second connection seat 142 are fixed by glue and finally fixed on the first circuit board 11 .

[0178] The specific structure of the image sensor module 12 is described below with reference to the accompanying drawings.

[0179] Optional, see Fig.30 The image sensor module 12 includes a second circuit board 121 and an image sensor 122. The image sensor 122 can be soldered on the second circuit board 121 by flip chip bonding to form a miniaturized module.

[0180] The second circuit board 121 includes a first through hole portion 1211 and a peripheral portion 1212 arranged around the first through hole portion 1211. The image sensor 122 is located between the second circuit board 121 and the first circuit board 11. The photosensitive area of ​​the image sensor 122 faces the first through hole portion 1211 and receives light from the outside through the first through hole. The peripheral portion 1212 is provided with a plurality of first conductive portions (not shown). A plurality of second conductive portions (not shown) are provided on a side of the second circuit board 121 facing the image sensor 122. The first conductive portion is electrically connected to the second conductive portion, and the specific electrical connection method includes but is not limited to welding.

[0181] In general technology, the image sensor 122 is packaged and then soldered to the second circuit board 121. On the one hand, a shell needs to be provided after the image sensor 122 is packaged, which increases the thickness between the image sensor 122 and the second circuit board 121 and the module size. On the other hand, the image sensor 122 and the second circuit board 121 need to be transferred multiple times, which increases the transmission distance of the electrical signal between the image sensor 122 and the second circuit board 121.

[0182] In this embodiment, the image sensor 122 is soldered on the second circuit board 121 by using a chip flipping process. The chip flipping process is an advanced integrated circuit packaging technology. Different from the traditional packaging technology in which the chip is packaged at the bottom and connected to the packaging substrate through gold wires, the flip chip technology directly flips the image sensor 122 chip and mounts it on the packaging substrate (second circuit board 121), and then uses tiny solder joints or conductive glue for connection.

[0183] In this embodiment, the image sensor 122 is soldered on the second circuit board 121 by using a flip-chip process. Firstly, the size of the formed image sensor module 12 is smaller, which can significantly reduce the size and thickness of the image sensor module 12. Secondly, the flip-chip technology can shorten the electrical signal transmission distance between the image sensor 122 and the second circuit board 121, reduce the adverse effects such as resistance and inductance, and thus obtain better electrical performance. Furthermore, since the image sensor 122 chip is directly in contact with the second circuit board 121, the heat dissipation effect is better, which can improve the stability and reliability of the image sensor 122 chip. In addition, the image sensor 122 chip in the flip-chip technology is directly and tightly combined with the second circuit board 121, so that it has higher impact resistance. The flip-chip welding process can simplify the packaging process, reduce the required materials and equipment, and reduce production costs.

[0184] The following is an example of a driving structure that provides driving force for displacement compensation of the image sensor module 12 with reference to the accompanying drawings.

[0185] See also Figure 5 and Figure 6 The image sensor assembly 10 further includes a first magnetic driving member 151. The first magnetic driving member 151 is disposed on the image sensor module 12 and is close to the second side edge 12b of the image sensor module 12.

[0186] Optionally, the first magnetic driving member 151 may extend along the direction Y. The first magnetic driving member 151 is in a long strip shape.

[0187] See also Figure 5 and Figure 6 The image sensor assembly 10 further includes a bracket 150 and a second magnetic driving member 152 .

[0188] The bracket 150 is fixed on the first circuit board 11. The bracket 150 is covered on the first circuit board 11, and the image sensor module 12, the suspension connector 13, etc. are all accommodated in the space where the bracket 150 is located.

[0189] The second magnetic driving member 152 is fixed on the bracket 150. The extension direction of the second magnetic driving member 152 is the same as the extension direction of the first magnetic driving member 151. The second magnetic driving member 152 is arranged opposite to the first magnetic driving member 151. Further, the first magnetic driving member 151 and the second magnetic driving member 152 are directly opposite.

[0190] The second magnetic driving member 152 cooperates with the first magnetic driving member 151 to drive the image sensor module 12 to move or rotate relative to the first circuit board 11 .

[0191] Optionally, the first magnetic driving member 151 is an electromagnetic coil, and the second magnetic driving member 152 is a permanent magnet. In this case, the first magnetic driving member 151 can be electrically connected to the controller on the first circuit board 11 through the aforementioned elastic conductive connecting member 143. Of course, in other embodiments, the first magnetic driving member 151 is a permanent magnet, and the second magnetic driving member 152 is an electromagnetic coil.

[0192] Specifically, when displacement compensation and anti-shake are required in the X direction, the image sensor assembly 10 forms an electrical signal according to the displacement compensation amount, and the electrical signal is input to the first magnetic driving member 151. The first magnetic driving member 151 generates a displacement along the X direction in response to the electrical signal, thereby driving the image sensor module 12 to move relative to the first circuit board 11 to perform displacement compensation and anti-shake in the X direction.

[0193] See also Figure 5 and Figure 6 , the second magnetic driving member 152 includes a first magnet 1521, an intermediate connecting member 1522 and a second magnet 1523 arranged in sequence. The arrangement direction of the first magnet 1521, the intermediate connecting member 1522 and the second magnet 1523 is perpendicular to the extension direction of the second magnetic driving member 152. Optionally, the intermediate connecting member 1522 is a non-magnetic structure. The first magnetic driving member 151 can cut the magnetic induction lines of the first magnet 1521 and the second magnet 1523 during the movement to improve the responsiveness of the movement of the first magnetic driving member 151 under the electrical signal.

[0194] Optional, see Figure 5 and Figure 6The image sensor assembly 10 further includes a third magnetic driving member 153. The third magnetic driving member 153 is disposed on the image sensor module 12 and is close to the third side edge 12c of the image sensor module 12 (see Fig.24 ).

[0195] In this embodiment, the first side edge 12a and the third side edge 12c are adjacent sides.

[0196] Optionally, the third magnetic driving member 153 may extend along the X direction. The third magnetic driving member 153 is in a strip shape. The third magnetic driving member 153 is located at a side away from the elastic conductive connecting member 143 .

[0197] See also Figure 5 and Figure 6 The image sensor assembly 10 further includes a fourth magnetic driving member 154. The fourth magnetic driving member 154 is fixed to the bracket 150. The fourth magnetic driving member 154 is arranged opposite to the third magnetic driving member 153. Further, the fourth magnetic driving member 154 is directly opposite to the third magnetic driving member 153.

[0198] The second magnetic driving member 152 , the first magnetic driving member 151 , the fourth magnetic driving member 154 and the third magnetic driving member 153 cooperate to drive the image sensor module 12 to move or rotate relative to the first circuit board 11 .

[0199] Optionally, the third magnetic driving member 153 is an electromagnetic coil, and the fourth magnetic driving member 154 is a permanent magnet. In this case, the third magnetic driving member 153 can be electrically connected to the controller on the first circuit board 11 through the aforementioned elastic conductive connecting member 143. Of course, in other embodiments, the third magnetic driving member 153 is a permanent magnet, and the fourth magnetic driving member 154 is an electromagnetic coil.

[0200] Specifically, when displacement compensation and anti-shake performance in the Y direction is required, the image sensor component 10 forms an electrical signal according to the displacement compensation amount, and the electrical signal is input to the third magnetic driving component 153. The third magnetic driving component 153 responds to the electrical signal and generates a displacement along the Y direction, thereby driving the image sensor module 12 to move relative to the first circuit board 11 to perform displacement compensation and anti-shake performance in the Y direction.

[0201] When clockwise rotation compensation and anti-shake are required, the image sensor component 10 forms a first electrical signal and a second electrical signal according to the rotation compensation amount, and the first electrical signal is input to the third magnetic driving component 153. The third magnetic driving component 153 generates a displacement along the X direction in response to the first electrical signal, and the second electrical signal is input to the fourth magnetic driving component 154. The fourth magnetic driving component 154 generates a displacement along the Y direction in response to the second electrical signal, thereby driving the image sensor module 12 to rotate relative to the first circuit board 11 to perform clockwise rotation compensation and anti-shake.

[0202] Optional, see Figure 5 and Figure 6 The bracket 150 has a second through hole portion 150a. The second through hole portion 150a is directly opposite to the photosensitive area of ​​the image sensor assembly 10. That is, it is directly opposite to the lens assembly, so that the light incident from the lens assembly is incident to the photosensitive area of ​​the image sensor assembly 10 through the second through hole portion 150a and the first through hole portion 1211.

[0203] See also Figure 4 and Figure 5 The image sensor assembly 10 further includes a filter 16. The filter 16 is disposed on the bracket 150 and covers the second through hole portion 150a.

[0204] The filter 16 includes but is not limited to a blue glass filter. The filter 16 is used to filter infrared light, reduce halo problems, and reduce color deviation, stray light, and ghost problems.

[0205] The electronic device 1000 further includes a gyro sensor (not shown) and a controller (not shown).

[0206] When the hand shakes, the motion data is detected by the gyroscope sensor and transmitted to the controller. The controller sends an electrical signal to at least one of the autofocus motor 30, the first magnetic driver 151, and the third magnetic driver 153 according to the motion data. The position of the lens assembly 20 and / or the image sensor module 12 is adjusted to compensate for the shake, thereby maintaining the stability of the image. It can be used to take static photos and shoot in low-light environments, effectively reducing image deviation caused by hand shaking or other unstable factors, and clear photos can be taken even in low-light environments.

[0207] Optionally, the camera module 100 further includes a variable aperture (not shown).

[0208] The variable aperture is disposed in the lens assembly 20 or outside the lens assembly 20. The axis of the variable aperture is collinear with the optical axis of the lens assembly 20.

[0209] Since the displacement compensation module in the XY plane in the present application is located on the peripheral side of the image sensor 122, it is set separately from the autofocus motor 30. Therefore, the peripheral structure of the lens assembly 20 in the present application is relatively simple, and the circuit and structure of the autofocus motor 30 are relatively simple, which can better free up space for setting the variable aperture and setting the control and adjustment structure of the variable aperture.

[0210] The present application does not specifically limit the position of the variable aperture. By adjusting the aperture size of the variable aperture, the depth of field can be controlled, the brightness can be adjusted, the shooting quality can be improved, etc.

[0211] Optionally, the camera module 100 may also be a pop-up camera or a retractable camera.

[0212] See also Fig.31 and Fig.32 The autofocus motor 30 is configured to drive the lens assembly 20 to an extended position (eg Fig.31 ) or retracted position (such as Fig.32 ).

[0213] See also Fig.31 When the lens assembly 20 is in the extended position, the distance between the lens assembly 20 and the image sensor 122 in the axial direction is a first distance. The camera module 100 is in a focus alignment state. Normal shooting can be performed at this time.

[0214] See also Fig.32 When the lens assembly 20 is in the retracted position, the distance between the lens assembly 20 and the image sensor 122 in the axial direction is a second distance. The second distance is smaller than the first distance. At this time, the camera module 100 is in the storage state to reduce the thickness of the camera module 100, thereby creating conditions for the camera module 100 to be arranged in a thinner electronic device 1000.

[0215] For some cameras with longer focal lengths, increasing the focal length means increasing the thickness of the camera module 100. However, a camera using a pop-up camera or a telescopic camera can not only effectively accommodate the camera without increasing the thickness, but also have a longer focal length when in use. In addition, the camera module 100 uses the aforementioned image sensor assembly 10, which has displacement compensation and anti-shake, and can also reduce the area of ​​the camera module 100 in the XY plane.

[0216] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present application, and these improvements and modifications are also regarded as the scope of protection of the present application.

Claims

1. An image sensor assembly, characterized in that: include: a first circuit board; Image sensor module; and a suspension connector, the suspension connector comprising a fixed connector, at least one first connector, and at least one second connector, the fixed connector being spaced apart from the outer peripheral side of the image sensor module, one end of the fixed connector being connected to the first circuit board, the other end of the fixed connector extending toward a side away from the first circuit board and connected to the first connector, the first connector and the second connector being spaced apart from the first circuit board, and the surface where the first connector is located intersecting with the surface where the first circuit board is located; The first connecting piece extends along a side of the image sensor module, and the second connecting piece extends from the first connecting piece toward the side where the image sensor module is located and connects the image sensor module, so that the image sensor module is suspended relative to the first circuit board.

2. The image sensor assembly according to claim 1, wherein: The fixed connection member comprises a first sub-connecting piece and a second sub-connecting piece connected to each other, the first sub-connecting piece is attached to and fixed to the surface of the first circuit board, and at least a portion of the second sub-connecting piece extends in a direction perpendicular to the first circuit board and is connected to the first connecting piece; and / or, The fixed connection member includes a fixed block, the fixed block is fixed on the first circuit board, and the fixed block is fixedly connected to the first connecting piece.

3. The image sensor assembly according to claim 1, wherein: The first connecting piece includes a third sub-connecting piece and a fourth sub-connecting piece that are bent and connected, the third sub-connecting piece is arranged at intervals along the first side of the image sensor, and the fourth sub-connecting piece is arranged at intervals along the second side of the image sensor, the third sub-connecting piece is connected to the fixed connecting piece, and the fourth sub-connecting piece is connected to the second connecting piece, and the first side and the second side are respectively adjacent two sides or opposite two sides of the image sensor.

4. The image sensor assembly according to claim 3, wherein: The surface where the third sub-connecting piece is located is perpendicular to the surface where the fourth sub-connecting piece is located, and the surface where the third sub-connecting piece is located and the surface where the fourth sub-connecting piece is located are both perpendicular to the first circuit board.

5. The image sensor assembly according to claim 3, wherein: The second connecting piece includes a fifth sub-connecting piece and a sixth sub-connecting piece. The fifth sub-connecting piece extends from one end of the fourth sub-connecting piece toward the first circuit board and is connected to the sixth sub-connecting piece. The sixth sub-connecting piece extends toward the image sensor module and is fixedly connected to the image sensor module.

6. The image sensor assembly according to any one of claims 1 to 5, characterized in that: The number of the first connecting pieces is two, and the two first connecting pieces are connected to two sides of one of the fixed connecting pieces respectively, and the two first connecting pieces are symmetrically arranged.

7. The image sensor assembly of claim 6, wherein: The number of the second connecting pieces is one, and the ends of two first connecting pieces away from the fixed connecting piece are respectively connected to the two sides of one second connecting piece; or, the first side edge and the second side edge are respectively adjacent two sides of the image sensor, the number of the second connecting pieces is two, and the two second connecting pieces are respectively arranged on the opposite sides of the image sensor.

8. The image sensor assembly according to any one of claims 3 to 5, characterized in that: The first side and the second side are respectively adjacent sides of the image sensor, the number of the fixed connecting member, the first connecting piece, and the second connecting piece are all two, the two fixed connecting members are respectively spaced apart from the first side and the third side opposite to the image sensor module, the two first connecting pieces are respectively located at the diagonal sides of the image sensor module, and the two second connecting pieces are respectively spaced apart from the third side and the fourth side opposite to the image sensor module.

9. The image sensor assembly according to any one of claims 3 to 5, characterized in that: The first side and the second side are respectively adjacent sides of the image sensor, the number of the fixed connecting members is two, the number of the first connecting sheets is four, and the number of the second connecting sheets is two, the two fixed connecting members are respectively spaced apart from the first side and the third side opposite to the image sensor module, the four first connecting sheets are respectively located at the four corners of the image sensor module and are connected in pairs to form a ring, and the two second connecting sheets are respectively located at the second side and the fourth side opposite to the image sensor module and are spaced apart.

10. The image sensor assembly of claim 3, wherein: The suspension connector also includes a limit block, which includes a first sub-limit block and a second sub-limit block that are interconnected as a whole and bent, the first sub-limit block is fixedly connected to the third sub-connecting piece, the second sub-limit block is fixedly connected to the fourth sub-connecting piece, and the bottom of the limit block is spaced apart from the first circuit board.

11. The image sensor assembly according to any one of claims 1 to 5 and 10, characterized in that: The elastic coefficient of the suspension connection member in the plane where the first circuit board is located is smaller than the elastic coefficient of the suspension connection member in the plane perpendicular to the plane where the first circuit board is located.

12. The image sensor assembly of claim 11, wherein: The elastic coefficient of the suspension connection member in the plane where the first circuit board is located is 10-100 mN / mm; the elastic coefficient of the suspension connection member in the plane perpendicular to the plane where the first circuit board is located is 1000-3000 mN / mm.

13. The image sensor assembly of claim 1, wherein: The image sensor assembly further includes a first connection seat and a second connection seat, wherein the first connection seat is disposed on the first circuit board and is located between the fixed connection member and the first side of the image sensor module, and the second connection seat is disposed on the image sensor module and is close to the first side of the image sensor module; The image sensor assembly further includes a plurality of elastic conductive connecting members, one end of each of the elastic conductive connecting members is fixed to the first connecting seat, and the other end of each of the elastic conductive connecting members is fixedly connected to the second connecting seat.

14. The image sensor assembly of claim 13, wherein: The elastic conductive connecting member includes a first connecting plate, a flexible connecting wire and a second connecting plate. The first connecting plate is fixed on the first connecting seat, and the second connecting plate is fixed on the second connecting seat. The multiple flexible connecting wires are arranged at intervals and connected between the first connecting seat and the second connecting seat.

15. The image sensor assembly of claim 14, wherein: The flexible connecting wire is a silicon wire, and the first connecting plate, the plurality of the flexible connecting wires and the second connecting plate form an integrated structure through a MEMS process, and are formed into a three-dimensional structure through extrusion.

16. The image sensor assembly of claim 14, wherein: The flexible connecting wire includes a first connecting arm, an intermediate connecting arm and a second connecting arm, one end of the first connecting arm is connected to the first connecting plate, the first connecting arm extends along the first side and in a direction perpendicular to the first circuit board, and is connected to one end of the intermediate connecting arm, the intermediate connecting arm extends along the third side of the image sensor module, one end of the second connecting arm is connected to the other end of the intermediate connecting arm, the second connecting arm extends along the first side and in a direction perpendicular to the first circuit board, and the other end of the second connecting arm is connected to the second connecting plate.

17. The image sensor assembly of claim 15, wherein: The plurality of elastic conductive connecting members are divided into a first group of elastic conductive connecting members and a second group of elastic conductive connecting members along the first side. The first group of elastic conductive connecting members and the second group of elastic conductive connecting members are symmetrically arranged along the first side.

18. The image sensor assembly of claim 14, wherein: The image sensor assembly includes a plurality of first conductive traces and a plurality of second conductive traces, each of the first conductive traces electrically connects the image sensor module and one end of the elastic conductive connector, and each of the second conductive traces electrically connects the first circuit board and the other end of the elastic conductive connector.

19. The image sensor assembly of claim 1, wherein: The image sensor module includes a second circuit board and an image sensor, the second circuit board includes a first through hole portion and a peripheral portion surrounding the first through hole portion, the image sensor is located between the second circuit board and the first circuit board, the photosensitive area of ​​the image sensor faces the first through hole portion, the peripheral portion is provided with a plurality of first conductive portions, the second circuit board is provided with a plurality of second conductive portions on a side facing the image sensor, and the first conductive portions are electrically connected to the second conductive portions.

20. The image sensor assembly of claim 13, wherein: The image sensor assembly further includes a first magnetic driving member, wherein the first magnetic driving member is disposed on the image sensor module and is close to a second side edge of the image sensor module; The image sensor assembly also includes a bracket and a second magnetic driving component, the bracket is fixed on the first circuit board, the second magnetic driving component is fixed on the bracket, the second magnetic driving component is arranged opposite to the first magnetic driving component, and the second magnetic driving component cooperates with the first magnetic driving component to drive the image sensor module to move or rotate relative to the first circuit board.

21. The image sensor assembly of claim 20, wherein: The first magnetic driving component is an electromagnetic coil, and the second magnetic driving component includes a first magnet, an intermediate connecting component and a second magnet arranged in sequence. The arrangement direction of the first magnet, the intermediate connecting component and the second magnet is perpendicular to the extension direction of the second magnetic driving component.

22. The image sensor assembly of claim 20, wherein: The image sensor assembly further includes a third magnetic driving member, wherein the third magnetic driving member is disposed on the image sensor module and is close to a third side edge of the image sensor module; The image sensor assembly further includes a fourth magnetic driving component, which is fixed on the bracket and is arranged opposite to the third magnetic driving component.

23. The image sensor assembly of claim 20, wherein: The bracket has a second through hole portion, and the second through hole portion is directly opposite to the photosensitive area of ​​the image sensor component. The image sensor component also includes a filter, and the filter is arranged on the bracket and covers the second through hole portion.

24. A camera module, characterized in that: The camera module includes a lens assembly and an autofocus motor arranged on the periphery of the lens assembly, and an image sensor assembly as described in any one of claims 1 to 23, wherein the image sensor is directly opposite to the lens assembly.

25. The camera module according to claim 24, wherein: The camera module also includes a variable aperture, which is arranged in the lens assembly or outside the lens assembly, and the axis of the variable aperture is colinear with the optical axis of the lens assembly.

26. The camera module according to claim 25, wherein: The camera module is a pop-up camera, and the autofocus motor is configured to drive the lens assembly to an extended position or a retracted position. When the lens assembly is in the extended position, the axial distance between the lens assembly and the image sensor is a first distance, and the camera module is in a focus alignment state; when the lens assembly is in the retracted position, the axial distance between the lens assembly and the image sensor is a second distance, and the second distance is smaller than the first distance.

27. An electronic device, characterized in that: The electronic device comprises the camera module as described in any one of claims 24 to 26.

Images