Intelligent ink jet method and device

Abstract

The invention relates to the technical field of intelligent ink-jet equipment, and particularly discloses an intelligent ink-jet method and equipment, the intelligent ink-jet equipment comprises a bottom plate and an equipment body, the bottom plate is arranged at the bottom of the equipment body, the top of the bottom plate is provided with a first placing plate and a second placing plate, and the top of the equipment body is provided with an ink-jet box body; an ink jet device is installed in the ink jet box body, a movable plate is installed at the top of a device body, a limiting mechanism is installed at the top of the movable plate and comprises two first limiting plates and two second limiting plates, and auxiliary testing mechanisms are arranged in the two first limiting plates. According to the invention, after the semiconductor circuit board is placed at the top of the moving plate, the limiting mechanism can push and limit the four edges of the semiconductor circuit board to ensure that the semiconductor circuit board is centrally placed at the top of the moving plate, so that subsequent equipment can conveniently and accurately perform ink-jet printing on the semiconductor circuit board; and the ink-jet printing quality and efficiency of the equipment on the semiconductor circuit board are indirectly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor circuit board production, and in particular to an intelligent inkjet method and equipment. Background Art

[0002] Intelligent inkjet equipment refers to inkjet equipment that integrates intelligent technology and has the characteristics of automation, efficiency, precision and versatility. This type of equipment usually uses digital printing technology and controls the inkjet head through a computer for precise printing. It is suitable for a variety of application scenarios, such as advertising, exhibitions, textile printing and dyeing, decoration and semiconductor circuit board production. In semiconductor circuit board packaging and flexible electronics manufacturing, inkjet printing equipment is required to print logos and identification information on the semiconductor circuit board package, such as manufacturer name, product model, production batch number, etc. This information is very important for product traceability and quality control. ‌ When the intelligent inkjet equipment in the prior art is in use, although it can perform precise printing through a computer and a pre-set program, when the semiconductor circuit board is automatically placed on the top of the placement table of the equipment by the transfer robot, the semiconductor circuit board will generate slight vibrations when it falls on the top of the placement table, causing the semiconductor circuit board to easily become skewed after it falls on the top of the placement table. When the equipment performs inkjet printing on the semiconductor circuit board, the printing will be skewed or misaligned. Manual adjustment requires precise alignment of the semiconductor circuit board, which is time-consuming, labor-intensive, inefficient and difficult to adjust to a precise angle, greatly reducing the quality and efficiency of the equipment's inkjet printing on the semiconductor circuit board. Summary of the invention

[0003] The purpose of the present invention is to solve the shortcomings of the prior art and to propose an intelligent inkjet method and device.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions: The intelligent inkjet device comprises a bottom plate and a device body, wherein the bottom plate is arranged at the bottom of the device body, a first placement plate and a second placement plate are respectively installed on the top of the bottom plate, an inkjet box is installed on the top of the device body, an inkjet device is installed inside the inkjet box, a movable plate for placing a semiconductor circuit board is slidably installed on the top of the device body, a limiting mechanism for correcting and limiting the positions of the four sides of the semiconductor circuit board to be printed is installed on the top of the movable plate, the limiting mechanism comprises two first limiting plates and two second limiting plates arranged around the top of the movable plate, and auxiliary testing mechanisms for assisting the inkjet device in performing regular testing are arranged inside the two first limiting plates.

[0005] Optionally, a first slide groove is opened on the top of the device body, a first slider is installed inside the first slide groove, and the movable plate is installed on the top of the first slider.

[0006] Optionally, two first grooves are formed on the top of the movable plate, first double-headed screws are rotatably installed inside the two first grooves, and two first movable blocks are installed on the outer walls of the two first double-headed screws.

[0007] Optionally, the tops of the two first movable blocks are connected to mounting plates via electric telescopic rods, both ends of the two first limit plates are rotatably connected to the mounting plates adjacent to them, and the bottoms of the two first limit plates are installed with blowing heads, and the bottom ends of the two blowing heads are provided with multiple blowing outlets.

[0008] Optionally, a cleaning pad is installed on the top of the two first limiting plates, and a plurality of drainage ports are provided on the top of the two first limiting plates near the cleaning pad.

[0009] Optionally, the auxiliary testing mechanism includes a rectangular groove opened inside the two first limiting plates, and a winding roller is rotatably installed inside the two rectangular grooves, and a film is wound on the surface of the two winding rollers. A through groove is opened on the outer wall of one side of the two first limiting plates, and one end of the two films away from the winding roller extends out through the through groove.

[0010] Optionally, the two cleaning pads are provided with notches matching the thickness of the film, the ends of the two films located outside the first limiting plate are inserted into the corresponding notches, and the ends of the two films away from the winding roller are connected to connecting plates through the notches, and the outer walls of one side of the two cleaning pads are provided with storage grooves matching the connecting plates, and electromagnets are preset inside the two connecting plates.

[0011] Optionally, a second groove is further provided on the top of the movable plate, a second double-headed screw is rotatably installed inside the second groove, two second movable blocks are installed on the outer wall of the second double-headed screw, and two second limit plates are installed on the top of the corresponding second movable blocks.

[0012] Optionally, the outer walls of the two second limit plate boxes on the side close to each other are each provided with a second slide groove, a second slider is installed inside the two second slide grooves, a rotating plate is rotatably installed on the end of the two second sliders away from the second slide groove, and a rubber pad is bonded to the outer walls of the two rotating plates on the side away from the second sliders.

[0013] Optionally, an intelligent inkjet method includes the inkjet device described above, and the inkjet method further includes the following steps: Step 1: Place the semiconductor circuit board to be inkjet printed on the top of the first placement plate, and place the semiconductor circuit board on the top of the first placement plate on the top of the movable plate with the help of a transfer robot, control the first slider to drive the movable plate and the semiconductor circuit board placed on the top to move to the inside of the inkjet box together, and after the preset pattern is inkjet printed on the top of the semiconductor circuit board with the help of an inkjet device, control the first slider to drive the movable plate and the semiconductor circuit board to move and reset, and then use the transfer robot to transfer the semiconductor circuit board after inkjet printing from the top of the movable plate to the top of the second placement plate, thereby completing the inkjet printing of the semiconductor circuit board; Step 2: After the semiconductor circuit board is transferred to the top of the movable plate by the transfer robot and placed thereon, the two first double-headed screws are controlled to drive the two corresponding first movable blocks to move in the approaching direction, drive the two first limit plates to move in the approaching direction, and control the second double-headed screw to rotate, drive the two second limit plates to move in the approaching direction, and the two first limit plates can push and limit the two sides of the semiconductor circuit board in the process of moving in the approaching direction, and the two second limit plates can move in the approaching direction, and can push and limit the other two sides of the semiconductor circuit board, so as to ensure that the semiconductor circuit board is placed in the center of the top of the movable plate; Step 3: After the two first limit plates are pushed to limit the two sides of the semiconductor circuit board on the top of the movable plate, the two first limit plates are controlled to rotate and adjust, driving the blowing heads originally located at the bottom of the two first limit plates to rotate to the side close to each other, and the multiple blowing ports on the two blowing heads are all facing the top of the semiconductor circuit board, and the multiple blowing ports on the two blowing heads are controlled to blow air toward the semiconductor circuit board to accelerate the drying of the ink on the surface of the semiconductor circuit board; Step 4: After drying the inkjet-printed ink on the surface of the semiconductor circuit board with the help of multiple air blowing ports, the two first limit plates are controlled to rotate and adjust, driving the air blowing heads installed on the outer walls of one side of the two first limit plates to rotate to the side away from each other, and the air blowing ports on the two air blowing heads blow air toward the top of the first placement plate and the second placement plate respectively, so as to clean the semiconductor circuit board to be processed and the top of the processed semiconductor circuit board together; Step 5: If the semiconductor circuit board needs to be printed on both sides, after the inkjet device prints ink on the top of the semiconductor circuit board, the movable plate drives the semiconductor circuit board to move and reset, controls the two second limit plates to move in opposite directions, and then controls the two second sliders to move to the end of the second slide groove together, and then controls the rubber pads on the adjacent side of the two second limit plates to abut against the two sides of the semiconductor circuit board, controls the two rotating plates to rotate synchronously, drives the clamped semiconductor circuit board to rotate and flip over, and as the two rotating plates drive the semiconductor circuit board to rotate downward to a horizontal state and contact with the top of the movable plate, the automatic flipping of the semiconductor circuit board is completed.

[0014] The beneficial effects of the present invention are: 1. In the invention, after the transfer robot places the semiconductor circuit board on the top of the movable plate, the limiting mechanism arranged on the top of the movable plate can push and limit the four sides of the semiconductor circuit board respectively, thereby ensuring that the semiconductor circuit board is placed in the center of the top of the movable plate, which is convenient for the subsequent inkjet equipment to accurately inkjet print on the surface of the semiconductor circuit board, indirectly improving the quality and efficiency of the equipment's inkjet printing on the semiconductor circuit board.

[0015] 2. In the invention, after the two first limit plates push the two sides of the semiconductor circuit board on the top of the movable plate to limit the position, the two first limit plates are controlled to rotate and adjust, driving the blowing head originally located at the bottom of the two first limit plates to rotate to the side close to each other. At this time, the multiple blowing ports on the two blowing heads are all facing the top of the semiconductor circuit board. After the top of the semiconductor circuit board is inkjet printed by an inkjet device, the multiple blowing ports on the two blowing heads are controlled to blow air toward the semiconductor circuit board, thereby accelerating the drying of ink on the surface of the semiconductor circuit board and reducing the adverse effects of slow ink drying.

[0016] 3. In the present invention, after the inkjet device has inkjet-printed the surface of the semiconductor circuit board, it controls the two first limit plates to rotate and adjust, driving the blowing heads installed on the outer wall of one side of the two first limit plates to rotate to the side away from each other. At this time, the blowing ports on the two blowing heads blow air toward the top of the first placing plate and the second placing plate respectively, so as to clean the top of the semiconductor circuit board to be processed and the top of the processed semiconductor circuit board together, so as to facilitate the subsequent inkjet printing of the semiconductor circuit board to be processed and to facilitate the placement of the processed semiconductor circuit board on the top of the second placing plate.

[0017] 4. In the present invention, when the device is not in use, in order to prevent the ink of the inkjet device from solidifying, the inkjet device needs to be regularly controlled to perform inkjet printing operations several times. When the device needs an inkjet printing test, with the aid of an auxiliary testing mechanism provided inside the two first limiting plates, the inkjet device can perform inkjet printing tests on the two unfolded film surfaces of the auxiliary testing mechanism. There is no need for additional paper to perform the inkjet printing test, thereby reducing paper waste. The entire inkjet printing test has a high degree of automation and does not require additional manual assistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the overall structure of the intelligent inkjet device proposed by the present invention; Figure 2 for Figure 1 A schematic diagram of the structure from another angle; Figure 3 It is a structural schematic diagram of the present invention without the moving plate; Figure 4 It is a structural schematic diagram of the bottom of the movable plate in the present invention; Figure 5 It is a structural schematic diagram of the movable plate in the present invention; Figure 6 It is a schematic diagram of the structure in which the limiting mechanism is separated from the movable plate in the present invention; Figure 7 It is a schematic diagram of the structure of two second limiting plates in the present invention; Figure 8 It is a schematic structural diagram of a first limiting plate in the present invention; Fig. 9 It is a structural schematic diagram of the bottom of the first limiting plate in the present invention; Fig.10 for Fig. 9 A schematic diagram of the structure from another angle; Fig.11 It is a structural cross-sectional view of the first limiting plate in the present invention; Fig.12 for Fig.11 Schematic diagram of the structure in which the middle winding roller and the cleaning pad are separated from the first limiting plate.

[0020] In the figure: 1. bottom plate; 2. equipment body; 3. inkjet box; 4. first placement plate; 5. second placement plate; 6. moving plate; 7. first slide groove; 8. first slider; 9. first groove; 10. second groove; 11. first double-headed screw; 12. second double-headed screw; 13. second limit plate; 14. mounting plate; 15. first limit plate; 16. second moving block; 17. first moving block; 18. second slide groove; 19. second slider; 20. rotating plate; 21. electric telescopic rod; 22. cleaning pad; 23. blow head; 24. blow port; 25. film; 26. connecting plate; 27. rectangular groove; 28. winding roller; 29. ​​drain port; 30. through groove; 31. notch. DETAILED DESCRIPTION

[0021] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Reference Figure 1-Figure 12The intelligent inkjet device includes a bottom plate 1 and a device body 2. The bottom plate 1 is arranged at the bottom of the device body 2. A first placement plate 4 and a second placement plate 5 are respectively installed on the top of the bottom plate 1. An inkjet box 3 is installed on the top of the device body 2. An inkjet device is installed inside the inkjet box 3. A movable plate 6 for placing a semiconductor circuit board is slidably installed on the top of the device body 2. A limiting mechanism for correcting and limiting the position of the four sides of the semiconductor circuit board to be printed is installed on the top of the movable plate 6. The limiting mechanism includes two first limiting plates 15 and two second limiting plates 13 arranged around the top of the movable plate 6. Auxiliary testing mechanisms for assisting the inkjet device in performing regular testing are arranged inside the two first limiting plates 15. The inkjet device is arranged inside the inkjet box 3 for use, which is a technical solution that has been disclosed in the prior art and will not be elaborated on here; and the print head of the inkjet device contains a microprocessor and a drive circuit, which are usually made of semiconductor materials and are used to control the operation of the nozzle and the ejection of ink droplets; two sets of lifting devices are preset on the top of the base plate 1, and the telescopic ends of the two sets of lifting devices are respectively connected to the bottom ends of the first placement plate 4 and the second placement plate 5, so that the first placement plate 4 and the second placement plate 5 can be driven to adjust the height of the top of the base plate 1, which is convenient for the transfer robot to adsorb and transfer the semiconductor circuit board; and buffer pads are bonded to the top of the first placement plate 4 and the second placement plate 5 to avoid rigid contact between the semiconductor circuit board to be inkjet printed and the top of the first placement plate 4 and the second placement plate 5 after inkjet printing.

[0023] As a technical optimization solution of the present invention, a first slide groove 7 is provided on the top of the device body 2, a first slider 8 is installed inside the first slide groove 7, and a movable plate 6 is installed on the top of the first slider 8. A first linear motor is preset inside the first slide groove 7, and the first linear motor can drive the first slider 8 to move back and forth inside the first slide groove 7, and drive the movable plate 6 to move back and forth on the top of the device body 2, so that the movable plate 6 can drive the semiconductor circuit board placed on the top thereof to move to the inside of the inkjet housing 3, and the inkjet device located inside the inkjet housing 3 can perform inkjet printing on the surface of the semiconductor circuit board.

[0024] As a technical optimization solution of the present invention, two first grooves 9 are provided on the top of the movable plate 6, and first double-headed screws 11 are rotatably installed inside the two first grooves 9, and two first moving blocks 17 are installed on the outer walls of the two first double-headed screws 11. Two first driving motors are preset on the outer wall of one side of the movable plate 6, and the output ends of the two first driving motors are respectively connected to one end of the two first double-headed screws 11, so as to drive the two first double-headed screws 11 to rotate inside the corresponding first grooves 9, and drive the two corresponding first moving blocks 17 to move towards or away from each other on the surface of the first double-headed screws 11.

[0025] As a technical optimization solution of the present invention, the tops of the two first moving blocks 17 are connected to the mounting plate 14 through the electric telescopic rod 21, the two ends of the two first limit plates 15 are rotatably connected to the mounting plate 14 close to them, and the bottoms of the two first limit plates 15 are installed with blowing heads 23, and the bottoms of the two blowing heads 23 are provided with multiple blowing ports 24. The telescopic end of the electric telescopic rod 21 is extended and retracted, which can drive the height of the mounting plate 14 and the corresponding first limit plate 15 to be adjusted; and the inside of the two mounting plates 14 is preset with a second driving motor, and the output ends of the two second driving motors are respectively connected to the rotating parts of the corresponding first limit plates 15, so as to drive the two first limit plates 15 to be rotated and adjusted; the two blowing heads 23 are connected to the external preset blowing equipment through the preset first hose, so that the external blowing equipment can discharge the blown wind through the multiple blowing ports 24 to accelerate the drying of the ink printed on the surface of the semiconductor circuit board.

[0026] As a technical optimization solution of the present invention, a cleaning pad 22 is installed on the top of the two first limiting plates 15, and a plurality of drainage ports 29 are provided on the top of the two first limiting plates 15 near the cleaning pad 22. Corresponding cavities are pre-opened inside the two first limiting plates 15, and the two first limiting plates 15 are connected to an external preset drainage device through a preset second hose, so that the external drainage device can discharge the volatile detergent used to clean the ink into the interior of the cleaning pad 22 through the plurality of drainage ports 29.

[0027] As a technical optimization solution of the present invention, the auxiliary testing mechanism includes a rectangular groove 27 opened inside the two first limit plates 15, and a winding roller 28 is rotatably installed inside the two rectangular grooves 27. The surfaces of the two winding rollers 28 are rolled up with films 25. The outer walls of one side of the two first limit plates 15 are opened with a through groove 30, and the ends of the two films 25 away from the winding rollers 28 extend out through the through groove 30. A third driving motor is preset inside the two first limit plates 15, and the output ends of the two third driving motors are respectively connected to the rotating parts of the two winding rollers 28, so that the two winding rollers 28 can be driven to rotate and adjust inside the corresponding rectangular grooves 27, so that the two films 25 can be rotated and rolled or unfolded by the corresponding winding rollers 28.

[0028] As a technical optimization solution of the present invention, the inside of the two cleaning pads 22 is provided with a notch 31 adapted to the thickness of the film 25, the ends of the two films 25 located outside the first limiting plate 15 are inserted into the corresponding notch 31, and the ends of the two films 25 away from the winding roller 28 are connected to the connecting plate 26 through the notch 31, and the outer wall of one side of the two cleaning pads 22 is provided with a storage groove adapted to the connecting plate 26, and the inside of the two connecting plates 26 are preset with electromagnets. In the process of the two winding rollers 28 winding the film 25, the film 25 is driven to frictionally contact with the notch 31 inside the cleaning pad 22, so that the detergent adsorbed inside the cleaning pad 22 can contact with the surface of the film 25; the two first limiting plates 15 are controlled to rotate, and the two connecting plates 26 are driven to rotate to a position close to each other. As the two first limiting plates 15 move and abut, the two connecting plates 26 are driven to abut each other, and the internal electromagnets are energized to generate magnetism, so that they can be magnetically fixed.

[0029] As a technical optimization solution of the present invention, a second groove 10 is also provided on the top of the movable plate 6, and a second double-headed screw 12 is rotatably installed inside the second groove 10, and two second movable blocks 16 are installed on the outer wall of the second double-headed screw 12, and two second limit plates 13 are installed on the top of the corresponding second movable blocks 16. A fourth drive motor is preset inside the second groove 10, and the output end of the fourth drive motor is connected to one end of the second double-headed screw 12, so that the second double-headed screw 12 can be driven to rotate inside the second groove 10, and the two second movable blocks 16 can be driven to move in a direction close to or away from each other, and the two second limit plates 13 are driven to move and adjust synchronously on the top of the movable plate 6.

[0030] As a technical optimization solution of the present invention, the outer wall of the side close to the two second limit plates 13 is provided with a second slot 18, and the inside of the two second slots 18 is installed with a second slider 19, and the end of the two second sliders 19 away from the second slots 18 is rotatably installed with a rotating plate 20, and the outer wall of the two rotating plates 20 away from the second slider 19 is bonded with a rubber pad. A second linear motor is preset inside the two second slots 18, and the two second linear motors can drive the two second sliders 19 to move back and forth inside the corresponding second slots 18, thereby driving the two rotating plates 20 to move and adjust synchronously; a driving device is preset inside the two second sliders 19, and the output end of the driving device is respectively connected to the rotating parts of the two rotating plates 20, so as to drive the two rotating plates 20 to rotate and adjust; the outer wall of the two rotating plates 20 close to the side is flush with the outer wall of the second limit plate 13 corresponding to the side, so that the outer wall of the two rotating plates 20 close to the side is set The rubber pad is protruding on one side of the corresponding second limiting plate 13. In the process of the two second limiting plates 13 pushing and limiting the two sides of the semiconductor circuit board, the two rubber pads are driven to contact the two sides of the semiconductor circuit board first. After the two first limiting plates 15 push and limit the two sides of the rectangular semiconductor circuit board, the semiconductor circuit board is now neatly placed on the top of the movable plate 6. The two second limiting plates 13 move in a direction close to each other, driving the two rubber pads to push the other two sides of the semiconductor circuit board, thereby ensuring that the semiconductor circuit board can be placed in the center of the top of the movable plate 6.

[0031] As a technical optimization solution of the present invention, an intelligent inkjet method includes the inkjet device mentioned above, and the inkjet method also includes the following steps: Step 1: Place the semiconductor circuit board to be inkjet printed on the top of the first placement plate 4, and place the semiconductor circuit board on the top of the first placement plate 4 on the top of the movable plate 6 by means of a transfer robot, control the first slider 8 to drive the movable plate 6 and the semiconductor circuit board placed on the top to move to the inside of the inkjet box 3, and after the preset pattern is inkjet-printed on the top of the semiconductor circuit board by means of an inkjet device, control the first slider 8 to drive the movable plate 6 and the semiconductor circuit board to move and reset, and then transfer the semiconductor circuit board after inkjet printing from the top of the movable plate 6 to the top of the second placement plate 5 by means of a transfer robot, thereby completing the inkjet printing of the semiconductor circuit board; Step 2: After the semiconductor circuit board is transferred to the top of the movable plate 6 by the transfer robot, the two first double-headed screws 11 are controlled to drive the two corresponding first moving blocks 17 to move in the approaching direction, drive the two first limiting plates 15 to move in the approaching direction, and control the second double-headed screw 12 to rotate, drive the two second limiting plates 13 to move in the approaching direction. In the process of moving in the approaching direction, the two first limiting plates 15 can push and limit the two sides of the semiconductor circuit board. The two second limiting plates 13 move in the approaching direction and can push and limit the other two sides of the semiconductor circuit board, ensuring that the semiconductor circuit board is placed in the center of the top of the movable plate 6; Step 3: After the two first limit plates 15 are pushed to limit the two sides of the semiconductor circuit board on the top of the movable plate 6, the two first limit plates 15 are controlled to rotate and adjust, driving the blowing heads 23 originally located at the bottom of the two first limit plates 15 to rotate to the side close to each other, and the multiple blowing ports 24 on the two blowing heads 23 are all facing the top of the semiconductor circuit board. The multiple blowing ports 24 on the two blowing heads 23 are controlled to blow air toward the semiconductor circuit board to accelerate the drying of the ink on the surface of the semiconductor circuit board; Step 4: After drying the inkjet-printed ink on the surface of the semiconductor circuit board with the help of multiple blowing ports 24, the two first limit plates 15 are controlled to rotate and adjust, driving the blowing heads 23 installed on the outer wall of one side of the two first limit plates 15 to rotate to the side away from each other, and the blowing ports 24 on the two blowing heads 23 blow air toward the top of the first placement plate 4 and the second placement plate 5 respectively, so as to clean the semiconductor circuit board to be processed and the top of the processed semiconductor circuit board together; Step 5: If the semiconductor circuit board needs to be printed on both sides, after the inkjet device inkjet prints on the top of the semiconductor circuit board, the movable plate 6 drives the semiconductor circuit board to move and reset, controls the two second limit plates 13 to move in opposite directions, and then controls the two second sliders 19 to move together to the end of the second slide groove 18, and then controls the rubber pads on the adjacent side of the two second limit plates 13 to abut against the two sides of the semiconductor circuit board, controls the two rotating plates 20 to rotate synchronously, drives the clamped semiconductor circuit board to rotate and flip over, and as the two rotating plates 20 drive the semiconductor circuit board to rotate downward to a horizontal state and contact with the top of the movable plate 6, the automatic flipping of the semiconductor circuit board is completed.

[0032] In the present invention, when the user uses the device, Figure 1As shown, during actual use of the device, a transfer robot with a vacuum suction cup is preset on the left side of the device body 2, and the semiconductor circuit board to be inkjet printed is placed on the top of the first placement plate 4. The semiconductor circuit board on the top of the first placement plate 4 is adsorbed and placed on the top of the movable plate 6 by means of the transfer robot, and the first slider 8 is controlled to move inside the first slide groove 7, driving the movable plate 6 and the semiconductor circuit board placed on the top to move to the inside of the inkjet box 3 together. After the preset logo and identification information are inkjet-printed on the top of the semiconductor circuit board with the help of the inkjet device, the first slider 8 is controlled to slide and reset inside the first slide groove 7, driving the movable plate 6 and the semiconductor circuit board to move and reset, and then the semiconductor circuit board after inkjet printing is adsorbed from the top of the movable plate 6 by the transfer robot and transferred to the top of the second placement plate 5. The semiconductor circuit board after inkjet printing is transferred to other subsequent processing production lines by other related transfer equipment, and the entire inkjet printing work of the semiconductor circuit board can be completed.

[0033] After the semiconductor circuit board on the top of the first placement plate 4 is transferred to the top of the movable plate 6 by the transfer robot and placed, in order to ensure that the pattern of subsequent inkjet printing is located in the center of the semiconductor circuit board and improve the accuracy of inkjet printing, the two first double-headed screws 11 can be controlled to rotate together, driving the two corresponding first moving blocks 17 to move in a direction close to each other, driving the two mounting plates 14 and the first limiting plate 15 to move in a direction close to each other on the top of the movable plate 6, and synchronously controlling the second double-headed screw 12 to rotate, driving the two second moving blocks 16 and the second limiting plate 13 to move in a direction close to each other, The width of the semiconductor circuit board is adapted to the length of the two second limit plates 13, so that the two first limit plates 15 can push and limit the two sides of the semiconductor circuit board during the process of moving in the direction of approaching each other, ensuring that the two sides of the semiconductor circuit board and the two ends of the two second limit plates 13 are in the same straight line. With the help of the two second limit plates 13 moving in the direction of approaching each other, the other two sides of the semiconductor circuit board can be pushed and limited, thereby ensuring that the semiconductor circuit board is placed in the top center position of the movable plate 6, which is convenient for the subsequent inkjet equipment to accurately inkjet print on the surface of the semiconductor circuit board.

[0034] After the two first limit plates 15 push the two sides of the semiconductor circuit board on the top of the movable plate 6 to limit the position, the two first limit plates 15 can be controlled to rotate and adjust between the corresponding two mounting plates 14, driving the blowing head 23 originally located at the bottom of the two first limit plates 15 to rotate to the side close to each other. At this time, the multiple blowing ports 24 on the two blowing heads 23 are all facing the top of the semiconductor circuit board. After the top of the semiconductor circuit board is inkjet printed by an inkjet device, the multiple blowing ports 24 on the two blowing heads 23 can be controlled to blow air toward the semiconductor circuit board, thereby accelerating the drying of ink on the surface of the semiconductor circuit board and reducing the adverse effects of slow ink drying.

[0035] After the inkjet device mentioned above has performed inkjet printing on the surface of the semiconductor circuit board, after the inkjet printed on the surface of the semiconductor circuit board is dried by means of a plurality of air blowing ports 24, the two first limit plates 15 can be controlled to rotate and adjust between the corresponding two mounting plates 14, driving the air blowing heads 23 installed on the outer wall of one side of the two first limit plates 15 to rotate to the side away from each other. At this time, the air blowing ports 24 on the two air blowing heads 23 blow air toward the top of the first placement plate 4 and the second placement plate 5 respectively, so as to clean the top of the semiconductor circuit board to be processed and the top of the processed semiconductor circuit board together, so as to facilitate the subsequent inkjet printing of the semiconductor circuit board to be processed and the placement of the processed semiconductor circuit board on the top of the second placement plate 5; And in the process of the two first limit plates 15 driving the blowing head 23 to rotate and blow air, the telescopic ends of the corresponding two electric telescopic rods 21 can be controlled to extend upward, driving the height of the corresponding first limit plates 15 to increase, so that the corresponding first limit plates 15 can drive the blowing head 23 to rotate downward to a larger adjustment angle, so that the multiple blowing outlets 24 can blow and clean the surface of the semiconductor circuit board at the lower top of the first placement plate 4 and the second placement plate 5.

[0036] If the semiconductor circuit board needs to be printed on both sides, after the inkjet device prints ink on the top of the semiconductor circuit board, the movable plate 6 drives the semiconductor circuit board to move and reset. At this time, the two second limiting plates 13 can be controlled to move in the direction away from each other, so that the outer walls on the side close to the two second limiting plates 13 are separated from the other two sides of the semiconductor circuit board, and the rubber pads on the side close to the two rotating plates 20 are also separated from the other two sides of the semiconductor circuit board. Then, the two second sliding blocks 19 are controlled to move in the same direction inside the corresponding second slide groove 18 to the end of the second slide groove 18, and then the two second limiting plates 13 are controlled to move in the direction close to each other, so that the outer walls on the side close to the two second limiting plates 13 and the rubber pads on the side close to the two rotating plates 20 are separated from the semiconductor circuit board. The other two sides of the road plate are in contact with each other, and at this time, the two rubber pads are in contact with the corner positions on the other two sides of the semiconductor circuit board, and the two rotating plates 20 are controlled to rotate synchronously, thereby driving the clamped semiconductor circuit board to rotate and turn over, so that the semiconductor circuit board rotates to abut against the top of one of the first limit plates 15, and then the two second sliders 19 are controlled to move toward the other end inside the corresponding second slide grooves 18, driving the clamped semiconductor circuit board to move back between the two second limit plates 13, as the two rotating plates 20 drive the semiconductor circuit board, which is in an inclined state at this time, to rotate downward to a horizontal state and contact with the top of the movable plate 6, the automatic turning over of the semiconductor circuit board can be completed, which is convenient for the subsequent inkjet equipment to perform inkjet printing on the other side of the semiconductor circuit board.

[0037] If the transfer robot arranged on the left side of the equipment fails during use, making it impossible to automatically place the semiconductor circuit board on the top of the movable plate 6, and the semiconductor circuit board after inkjet printing is removed from the top of the movable plate 6, the semiconductor circuit board to be processed can be manually placed on the top of the movable plate 6. After the semiconductor circuit board is inkjet printed, the telescopic ends of two of the electric telescopic rods 21 close to the second placement plate 5 can be controlled to extend upward together, pushing one of the first limit plates 15 close to the second placement plate 5 to move upward, so that there is a gap between one of the first limit plates 15 and the movable plate 6, and the two second limit plates 13 move in the approaching direction, driving the two rotating plates 20 to approach each other. After the rubber pads on one side clamp and fix the two sides of the semiconductor circuit board, as the two second sliders 19 drive the rotating plate 20 and the clamped semiconductor circuit board to move toward the second placement plate 5, the semiconductor circuit board can pass through the gap between one of the first limiting plates 15 and the movable plate 6 until most of the semiconductor circuit board itself is separated from the movable plate 6. The second placement plate 5 is controlled to move upward to a position flush with the top of the movable plate 6, and the two second limiting plates 13 are controlled to move in opposite directions. At this time, the semiconductor circuit board can move from the top of the movable plate 6 to the top of the second placement plate 5 for placement, thereby achieving the effect of assisting automatic unloading of the semiconductor circuit board after inkjet printing, thereby improving the applicability of the limiting mechanism.

[0038] When the device is not in use, in order to prevent the ink of the inkjet device from solidifying, it is necessary to regularly control the inkjet device to perform several inkjet printing operations. When the device needs an inkjet printing test, the two first limit plates 15 can be controlled to rotate and adjust between the corresponding two mounting plates 14, driving the two cleaning pads 22 to rotate to the bottom of the corresponding first limit plates 15 respectively, and the connecting plate 26 located on the outer wall of one side of the two cleaning pads 22 is rotated to the side where the two first limit plates 15 are close to each other, so that Fig.11The bottom of the film 25 located inside the cleaning pad 22 is the printing test surface for the subsequent inkjet printing test, and then the telescopic ends of the multiple electric telescopic rods 21 are controlled to extend upward together, pushing the heights of the two first limit plates 15 to move upward to be higher than the second limit plate 13. At this time, the two first double-headed screws 11 are controlled to rotate, driving the two corresponding first moving blocks 17 to move in a direction close to each other, and can drive the two first limit plates 15 to move in a direction close to each other above the two second limit plates 13 until the connecting plates 26 on the adjacent sides of the two cleaning pads 22 move to abut each other. After the state is reached, the electromagnets inside the two connecting plates 26 are energized to generate magnetism, so that the two connecting plates 26 can be fixed to each other by magnetic attraction, and the two winding rollers 28 are controlled to rotate inside the corresponding rectangular grooves 27, driving the two films 25 to unfold. As the two first limit plates 15 move away from each other and reset, the two films 25 are stretched and unfolded on the top of the movable plate 6. At this time, the movable plate 6 is controlled to move into the inkjet box 3, and the inkjet equipment can perform inkjet printing tests on the surfaces of the two unfolded films 25 without the need for additional paper for inkjet printing tests, thereby reducing paper waste.

[0039] After the inkjet printing test of the equipment is completed with the help of two unfolded films 25, the two cleaning pads 22 are respectively located at the bottom of the corresponding first limit plate 15, and the external discharge device is controlled to start, so that the multiple discharge ports 29 can discharge the cleaning agent to the internal adsorption storage of the cleaning pad 22, and the two winding rollers 28 are controlled to roll up and unfold the film 25 on the surface in turn in the corresponding rectangular groove 27, that is, one of the winding rollers 28 is rolling up one of the films 25, and the other winding roller 28 is unfolding the other film 25, and the control The two winding rollers 28 are controlled to repeat the above steps alternately, so that the two films 25 are located on the top of the movable plate 6 and are constantly pulled back and forth, which can drive the two films 25 to move back and forth inside the corresponding notches 31, so that the detergent inside the two cleaning pads 22 can fully contact the ink on the printing test surface of the film 25, and with the help of the continuous friction between the cleaning pad 22 and the film 25, the ink on the surface of the film 25 can be quickly cleaned and removed, and the residual liquid after cleaning can be automatically absorbed by the cleaning pad 22, which is convenient for the film 25 to continue to assist the equipment in inkjet printing test work.

[0040] The two films 25 in the unfolded state on the top of the movable plate 6 can shield and protect the two second limit plates 13, and can also shield and protect the semiconductor circuit board placement area on the top of the movable plate 6, so that when the equipment is used subsequently, the staff only needs to clean other areas on the top of the movable plate 6, which facilitates the equipment to quickly put into subsequent semiconductor circuit board inkjet printing work.

[0041] Since the cleaning agent is volatile, after the cleaning pad 22 cooperates with the cleaning agent to remove the ink on the surface of the film 25, the multiple drainage ports 29 can be controlled to discharge the cleaning agent into the cleaning pad 22, and the excess cleaning agent drips downward on the top of the movable plate 6, and as the position of the two first limiting plates 15 above the movable plate 6 is moved and adjusted, the cleaning agent can be evenly dripped on different positions on the top of the movable plate 6, and the two second limiting plates 13 are controlled to move back and forth on the top of the movable plate 6, so that a certain range on the top of the movable plate 6 can be cleaned. After the telescopic ends of the multiple electric telescopic rods 21 are retracted and reset downward, the two cleaning pads 22 are driven to contact the movable plate 6, and the two first limiting plates 15 are controlled to move on the top of the movable plate 6, so that the positions that the two second limiting plates 13 cannot clean can be further cleaned, which is convenient for the subsequent use of the movable plate 6.

[0042] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An intelligent inkjet device, comprising a base plate (1) and a device body (2), characterized in that: The bottom plate (1) is arranged at the bottom of the device body (2); a first placement plate (4) and a second placement plate (5) are respectively installed on the top of the bottom plate (1); an inkjet box (3) is installed on the top of the device body (2); an inkjet device is installed inside the inkjet box (3); a movable plate (6) for placing a semiconductor circuit board is slidably installed on the top of the device body (2); a limiting mechanism for correcting and limiting the positions of the four sides of the semiconductor circuit board to be printed is installed on the top of the movable plate (6); the limiting mechanism comprises two first limiting plates (15) and two second limiting plates (13) arranged around the top of the movable plate (6); and auxiliary testing mechanisms for assisting the inkjet device in performing regular testing are arranged inside the two first limiting plates (15).

2. The intelligent inkjet device according to claim 1, characterized in that: A first slide groove (7) is provided on the top of the device body (2), a first sliding block (8) is installed inside the first slide groove (7), and the moving plate (6) is installed on the top of the first sliding block (8).

3. The intelligent inkjet device according to claim 2, characterized in that: The top of the movable plate (6) is provided with two first grooves (9), the interiors of the two first grooves (9) are both rotatably mounted with first double-headed screws (11), and the outer walls of the two first double-headed screws (11) are both mounted with two first movable blocks (17).

4. The intelligent inkjet device according to claim 3, characterized in that: The tops of the two first moving blocks (17) are connected to a mounting plate (14) via an electric telescopic rod (21); both ends of the two first limiting plates (15) are rotatably connected to the mounting plates (14) adjacent thereto; the bottoms of the two first limiting plates (15) are each installed with a blowing head (23); and the bottom ends of the two blowing heads (23) are each provided with a plurality of blowing ports (24).

5. The intelligent inkjet device according to claim 4, characterized in that: A cleaning pad (22) is installed on the top of each of the two first limiting plates (15), and a plurality of liquid discharge ports (29) are provided on the top of each of the two first limiting plates (15) near the cleaning pad (22).

6. The intelligent inkjet device according to claim 5, characterized in that: The auxiliary testing mechanism comprises a rectangular groove (27) opened inside the two first limiting plates (15), a winding roller (28) is rotatably installed inside the two rectangular grooves (27), and a film (25) is wound on the surface of the two winding rollers (28), and a through groove (30) is opened on the outer wall of one side of the two first limiting plates (15), and one end of the two films (25) away from the winding roller (28) extends out through the through groove (30).

7. The intelligent inkjet device according to claim 6, characterized in that: The two cleaning pads (22) are each provided with a notch (31) matching the thickness of the film (25); the ends of the two films (25) located outside the first limiting plate (15) are inserted into the corresponding notch (31); and the ends of the two films (25) away from the winding roller (28) pass through the notch (31) and are connected to a connecting plate (26); one side outer wall of the two cleaning pads (22) is provided with a storage groove matching the connecting plate (26); and the two connecting plates (26) are each preset with an electromagnet.

8. The intelligent inkjet device according to claim 7, characterized in that: The top of the movable plate (6) is also provided with a second groove (10), a second double-headed screw (12) is rotatably mounted inside the second groove (10), two second movable blocks (16) are mounted on the outer wall of the second double-headed screw (12), and two second limit plates (13) are mounted on the tops of the corresponding second movable blocks (16).

9. The intelligent inkjet device according to claim 8, characterized in that: The outer walls of the two second limit plates (13) boxes on the side close to each other are each provided with a second slide groove (18), the interior of the two second slide grooves (18) is each provided with a second slider (19), the ends of the two second sliders (19) away from the second slide grooves (18) are each provided with a rotating plate (20) rotatably mounted thereon, and the outer walls of the two rotating plates (20) on the side away from the second slider (19) are each bonded with a rubber pad.

10. An intelligent inkjet method, characterized in that: The inkjet method comprises the inkjet device of claim 9, and the inkjet method further comprises the following steps: Step 1: placing a semiconductor circuit board to be inkjet printed on top of a first placement plate (4), and placing the semiconductor circuit board on the top of the first placement plate (4) on top of a movable plate (6) by means of a transfer robot, controlling the first slider (8) to drive the movable plate (6) and the semiconductor circuit board placed on the top of the movable plate (6) to move together to the inside of the inkjet box (3), and after inkjet printing a preset pattern on the top of the semiconductor circuit board by means of an inkjet device, controlling the first slider (8) to drive the movable plate (6) and the semiconductor circuit board to move and reset, and then transferring the semiconductor circuit board after inkjet printing from the top of the movable plate (6) to the top of the second placement plate (5) by means of a transfer robot, thereby completing the inkjet printing of the semiconductor circuit board; Step 2: After the semiconductor circuit board is transferred to the top of the movable plate (6) by the transfer robot and placed thereon, the two first double-headed screw rods (11) are controlled to drive the two corresponding first movable blocks (17) to move in a direction close to each other, thereby driving the two first limit plates (15) to move in a direction close to each other, and the second double-headed screw rods (12) are controlled to rotate, thereby driving the two second limit plates (13) to move in a direction close to each other. In the process of the two first limit plates (15) moving in a direction close to each other, the two sides of the semiconductor circuit board can be pushed and limited. The two second limit plates (13) move in a direction close to each other, thereby driving the other two sides of the semiconductor circuit board to be pushed and limited, thereby ensuring that the semiconductor circuit board is placed in the center of the top of the movable plate (6); Step 3: After the two first limit plates (15) are pushed to limit the two sides of the semiconductor circuit board on the top of the movable plate (6), the two first limit plates (15) are controlled to rotate and adjust, driving the blowing heads (23) originally located at the bottom of the two first limit plates (15) to rotate to a side close to each other, and the multiple blowing ports (24) on the two blowing heads (23) are all facing the top of the semiconductor circuit board. The multiple blowing ports (24) on the two blowing heads (23) are controlled to blow air towards the semiconductor circuit board, thereby accelerating the drying of the ink on the surface of the semiconductor circuit board; Step 4: After the inkjet-printed ink on the surface of the semiconductor circuit board is dried by means of a plurality of air blowing ports (24), the two first limit plates (15) are controlled to rotate and adjust, thereby driving the air blowing heads (23) installed on the outer walls of one side of the two first limit plates (15) to rotate to the side away from each other, and the air blowing ports (24) on the two air blowing heads (23) blow air toward the top of the first placement plate (4) and the second placement plate (5) respectively, so as to clean the semiconductor circuit board to be processed and the top of the processed semiconductor circuit board together; Step 5: If the semiconductor circuit board needs to be printed on both sides, after the inkjet device has printed ink on the top of the semiconductor circuit board, the movable plate (6) drives the semiconductor circuit board to move and reset, controls the two second limit plates (13) to move in directions away from each other, then controls the two second sliders (19) to move together to the ends of the second slide groove (18), and then controls the rubber pads on the adjacent sides of the two second limit plates (13) to abut against the two sides of the semiconductor circuit board, controls the two rotating plates (20) to rotate synchronously, drives the clamped semiconductor circuit board to rotate and flip over, and as the two rotating plates (20) drive the semiconductor circuit board to rotate downward to a horizontal state and contact the top of the movable plate (6), the automatic flipping of the semiconductor circuit board is completed.

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