Display module, preparation method of display module and electronic equipment

Abstract

The invention provides a display module, a preparation method of the display module and electronic equipment, which are used for reducing the frame width of the display module and realizing the narrow frame design of the display module. The display module comprises a connecting panel, a display panel and a conductive piece. In the connecting panel, a second part is located on one side of a first part, the second part and the first part are arranged oppositely in a spaced mode, a bending part is connected between the first part and the second part and is bent relative to the first part and the second part, and in the thickness direction of the first part, a first via hole penetrates through at least part of the first part and exposes a first signal layer. The display panel is located on the side, away from the second part, of the first part. The peripheral side face of the display panel is located on the outer side of the bent part. The display layer structure is provided with a second via hole, the second via hole penetrates through at least part of the display layer structure and is communicated with the first via hole, and the second signal layer is arranged on the side, away from the first part, of the display layer structure. The conductive member is arranged in the first via hole and the second via hole, and is electrically connected between the first signal layer and the second signal layer.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module, a method for preparing a display module, and an electronic device. Background Art

[0002] Organic light emitting diode (OLED) display panels are widely used in electronic devices such as mobile phones and computers due to their advantages of high brightness, low power consumption, fast response and flexibility. At present, in OLED display panels, internal signal routing is often led out from the substrate and bent on the back of the OLED display panel to achieve integration with the display driver. However, the bend of the OLED display panel is more protruding than other positions. The existence of the bend limits the border width of the OLED display panel, which is not conducive to the narrow border design of the OLED display panel. Summary of the invention

[0003] The present application provides a display module, a method for preparing the display module, and an electronic device, which are used to reduce the border width of the display module and realize a narrow border design of the display module.

[0004] In a first aspect, the present application provides a display module, including a connection panel, a display panel and a conductive member.

[0005] The connecting panel includes a first part, a second part and a bending part. Along the thickness direction of the first part, the second part is located on one side of the first part, and is spaced apart from and arranged opposite to the first part. The bending part is connected between the first part and the second part, and is bent relative to the first part and the second part. The connecting panel includes a first signal layer. The first part is provided with a first via hole. Along the thickness direction of the first part, the first via hole penetrates at least a portion of the first part and exposes the first signal layer.

[0006] The display panel is located at a side of the first portion away from the second portion, the peripheral side of the display panel is located outside the bent portion, the display panel includes a display layer structure and a second signal layer, the display layer structure is provided with a second via hole, along the thickness direction of the display panel, the second via hole penetrates at least a portion of the display layer structure and is connected to the first via hole, and the second signal layer is provided on a side of the display layer structure away from the first portion;

[0007] The conductive element is disposed in the first via hole and the second via hole, and is electrically connected between the first signal layer and the second signal layer.

[0008] In the display module shown in the present application, the display module is split into two parts, a connecting panel and a display panel. Conductive parts are used to realize signal transmission between the first signal layer of the connecting panel and the second signal layer of the display panel. The bending portion in the connecting panel does not exceed the peripheral side of the display panel. Not only is the bending of the bending portion more free and elastic, but the existence of the bending portion will not increase the width of the non-display area, which can reduce the border width of the display module, help to realize the narrow border design of the display module, and improve the appearance and screen-to-body ratio of the electronic device.

[0009] In one embodiment, the display module has a display area and a non-display area, the non-display area is arranged around the display area, and the bent portion is located in the display area. The peripheral side surface of the display panel may be located in the non-display area.

[0010] In the display module shown in the present application, the bent portion in the connecting panel is located in the display area, which can further reduce the space occupied by the bent portion in the non-display area, reduce the width of the non-display area, and reduce the border width of the display module, thereby helping to achieve a narrow border design of the display module and improving the appearance and screen-to-body ratio of the electronic device.

[0011] In one embodiment, the display module further includes a display driver, which is installed on a side of the second portion away from the first portion and is electrically connected to the first signal layer.

[0012] In the display module shown in the present application, the display module is split into two parts, namely a connection panel and a display panel. The connection panel is used to realize the combination with the display driver, and the display panel is used to realize the display function of the display module. The conductive member is used to realize the signal transmission between the connection panel and the display panel to ensure the normal display of the display module.

[0013] In one embodiment, the second via hole penetrates the display layer structure along the thickness direction of the display panel. In other words, the second via hole and the conductive member can be formed in one process, which helps to reduce the preparation process of the display module and save the preparation cost of the display module.

[0014] In one embodiment, the second via hole includes a first via hole portion and a second via hole portion;

[0015] The display layer structure includes a first layer structure, a third signal layer and a second layer structure. The first layer structure is provided with a first via portion. Along the thickness direction of the display panel, the first via portion penetrates the first layer structure and is connected to the first via. The third signal layer is arranged on a side of the first layer structure away from the first portion. The second layer structure is arranged on a side of the third signal layer away from the first layer structure and is provided with a second via portion. The second layer structure is provided with a second via portion. Along the thickness direction of the display panel, the second via portion penetrates the second layer structure.

[0016] The conductive member includes a first conductive portion and a second conductive portion. The first conductive portion is disposed in the first via hole and the first via hole portion and is electrically connected between the first signal layer and the third signal layer. The second conductive portion is disposed in the second via hole portion and is electrically connected between the second signal layer and the third signal layer.

[0017] In other words, the second via hole and the conductive member can be formed by two processes, which helps to ensure the processing accuracy and improve the manufacturing yield of the display module.

[0018] In one embodiment, the connection panel further includes a first substrate and a protective layer, the first signal layer is disposed on one side of the first substrate, the protective layer is disposed on a side of the first signal layer away from the first substrate and covers the first signal layer, and the first via penetrates the protective layer. The protective layer can protect the first signal layer and prevent the first signal layer from being corroded and failing.

[0019] In one embodiment, the display module also includes a separation layer, which is arranged on the surfaces of the second portion and the bending portion, or the separation layer is arranged on the surface of the display panel facing the connecting panel and is arranged opposite to the bending portion, or part of the separation layer is arranged on the surfaces of the second portion and the bending portion, and part of the separation layer is arranged on the surface of the display panel facing the connecting panel and is arranged opposite to the bending portion.

[0020] During the preparation of the display module, when the second portion and the bending portion are bent relative to the first portion, the separation layer can prevent the second portion and the bending portion from adhering to the display panel, and the second portion and the bending portion are easily separated from the display panel and bent relative to the first portion.

[0021] In one implementation, the signal transmitted by the second signal layer includes at least one of an ELVSS signal, an ELVDD signal, a GIP signal / Demux signal, a source signal, and a touch signal.

[0022] In a second aspect, the present application provides a method for preparing a display module, comprising:

[0023] A connection panel is provided, wherein the connection panel comprises a first portion, a second portion and a bending portion, the bending portion is connected between the first portion and the second portion, the connection panel comprises a first signal layer, the first portion is provided with a first via hole, and along a thickness direction of the first portion, the first via hole penetrates at least a portion of the first portion and exposes the first signal layer;

[0024] A display panel and a conductive member are formed on the connection panel, wherein the display panel includes a display layer structure and a second signal layer, the display layer structure is provided with a second via hole, and along the thickness direction of the display panel, the second via hole penetrates at least a portion of the display layer structure and is connected to the first via hole, the second signal layer is provided on a side of the display layer structure away from the first portion, and the conductive member is provided in the first via hole and the second via hole, and is electrically connected between the first signal layer and the second signal layer;

[0025] The second part and the bending part are bent relative to the first part so that the second part is located on the side of the first part away from the display panel and is spaced apart from and arranged opposite to the first part. The bending part is bent relative to the first part and the second part and is located on the inner side of the peripheral side of the display panel.

[0026] In the display module prepared by the preparation method of the display module shown in the present application, the display module includes two parts, a connecting panel and a display panel. A conductive member is used to realize signal transmission between a first signal layer of the connecting panel and a second signal layer of the display panel. The bending portion in the connecting panel does not exceed the peripheral side of the display panel. Not only is the bending of the bending portion more free and elastic, but the existence of the bending portion will not increase the width of the non-display area, which can reduce the border width of the display module, help to realize the narrow border design of the display module, and improve the appearance and screen-to-body ratio of the electronic device.

[0027] In one embodiment, the step of forming a display panel and a conductive member on a connecting panel includes:

[0028] forming a display layer structure on the connection panel, wherein the display layer structure is provided with a second via hole, and the second via hole penetrates the display layer structure along the thickness direction of the display panel;

[0029] Conductive members are formed in the first via hole and the second via hole, and a second signal layer is formed on a side of the display layer structure facing away from the connection panel.

[0030] The second via hole and the conductive member can be formed by one-time processing, which helps to reduce the preparation process of the display module and save the preparation cost of the display module.

[0031] In one embodiment, the step of forming a display panel and a conductive member on a connecting panel includes:

[0032] Forming a first layer structure on the connection panel, wherein the first layer structure is provided with a first via portion, and along the thickness direction of the display panel, the first via portion penetrates the first layer structure and is connected with the first via hole;

[0033] forming a first conductive portion in the first via hole and the first via portion, and forming a third signal layer on a side of the first layer structure away from the connection panel, wherein the first conductive portion electrically connects the first signal layer and the third signal layer;

[0034] A second layer structure is formed on a side of the third signal layer away from the first layer structure, wherein the second layer structure is provided with a second via portion, and the second via portion penetrates the second layer structure along a thickness direction of the display panel;

[0035] A second conductive portion is formed in the second via portion, and a second signal layer is formed on a side of the second layer structure away from the third signal layer, wherein the second conductive portion electrically connects the second signal layer and the third signal layer.

[0036] The second via hole and the conductive member can both be formed through two processes, which helps to ensure processing accuracy and improve the manufacturing yield of the display module.

[0037] In one embodiment, after the step of providing a connection panel and before the step of forming a display panel and a conductive member on the connection panel, the method for preparing a display module further includes:

[0038] forming a separation layer on the connection panel, wherein the separation layer covers the second portion and the bent portion;

[0039] The step of forming a display panel and a conductive member on the connection panel includes: the display panel covers a separation layer;

[0040] In the step of bending the second part and the bending part relative to the first part, it includes: separating the display panel from the second part and the bending part, and a separation layer is arranged on the surface of the second part and the bending part, or, the separation layer is arranged on the surface of the display panel facing the connecting panel, or, part of the separation layer is arranged on the surface of the second part and the bending part, and part of the separation layer is arranged on the surface of the display panel facing the connecting panel.

[0041] When the second portion and the bending portion are bent relative to the first portion, the separation layer can prevent the second portion and the bending portion from adhering to the display panel, and the second portion and the bending portion are easily separated from the display panel and bent relative to the first portion.

[0042] In one embodiment, the step of providing a connection panel includes: providing a first panel, the first panel including a connection panel and a first surplus panel, the first surplus panel being arranged around the connection panel;

[0043] The step of forming a display panel and a conductive member on the connection panel includes: forming a second panel on the connection panel, the second panel including a display panel, a second margin panel and a third margin panel, the second margin panel is arranged around the display panel, and the third margin panel is arranged around the second margin panel;

[0044] After the step of forming the display panel and the conductive member on the connecting panel and before the step of bending the second portion and the bending portion relative to the first portion, the method for preparing the display module further includes:

[0045] Cutting the first panel and the second panel, removing the first surplus panel and the third surplus panel, so as to achieve large-profile cutting of the first panel and the second panel;

[0046] After the step of bending the second portion and the bent portion relative to the first portion, the method for preparing the display module further includes:

[0047] The second panel is cut to remove the second surplus panel.

[0048] In one embodiment, after the step of bending the second portion and the bent portion relative to the first portion, the method for preparing the display module further includes: installing a display driver on a side of the second portion away from the first portion and electrically connecting the display driver to the first signal layer.

[0049] In a third aspect, the present application provides an electronic device, comprising a processor and any one of the above-mentioned display modules, wherein the display module is electrically connected to the processor.

[0050] In the display module of the electronic device shown in the present application, the display module includes two parts, a connecting panel and a display panel. A conductive member is used to realize signal transmission between a first signal layer of the connecting panel and a second signal layer of the display panel. The bending portion in the connecting panel does not exceed the peripheral side of the display panel. Not only is the bending of the bending portion more free and elastic, but the existence of the bending portion will not increase the width of the non-display area, thereby reducing the border width of the display module, helping to realize a narrow border design of the display module, and improving the appearance and screen-to-body ratio of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0052] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0053] Figure 2 yes Figure 1 A schematic diagram of the local structure of the electronic device shown after the device body is cut open along position II;

[0054] Figure 3 yes Figure 1 A schematic diagram of the back structure of a display module of a device body in the electronic device shown;

[0055] Figure 4 yes Figure 3 The schematic diagram of the partial structure of the display module is shown;

[0056] Figure 5 yes Figure 4 The partial structural schematic diagram of the display module in the first embodiment is shown;

[0057] Figure 6 yes Figure 4 The partial structural schematic diagram of the display module in the second embodiment is shown;

[0058] Figure 7 is a process flow chart of a method for preparing a display module provided in the present application;

[0059] Figure 8 yes Figure 7A structural schematic diagram of step S1 in the method for preparing the display module shown;

[0060] Fig. 9 yes Figure 7 A structural schematic diagram of step S2 in the method for preparing the display module shown;

[0061] Fig.10 yes Figure 7 The structural schematic diagram of step S3 in the method for preparing the display module in the first embodiment;

[0062] Fig.11 yes Figure 7 The process flow chart of step S3 in the method for preparing the display module in the first embodiment;

[0063] Fig.12 yes Fig.11 A structural schematic diagram of step S31 in the method for preparing the display module shown;

[0064] Fig.13 yes Fig.11 A structural schematic diagram of step S32 in the method for preparing the display module shown;

[0065] Fig.14 yes Figure 7 A schematic structural diagram of step S3 in the method for preparing the display module in a second embodiment;

[0066] Fig.15 yes Figure 7 The process flow chart of step S3 in the method for preparing the display module in the second embodiment;

[0067] Fig.16 yes Fig.15 A structural schematic diagram of step S34 in the method for preparing the display module shown;

[0068] Fig.17 yes Fig.15 A structural schematic diagram of step S35 in the method for preparing the display module shown;

[0069] Fig.18 yes Fig.15 A schematic structural diagram of step S36 in the method for preparing the display module shown;

[0070] Fig.19 yes Fig.15 A structural schematic diagram of step S37 in the method for preparing the display module shown;

[0071] Fig. 20 yes Fig.15 A structural schematic diagram of step S38 in the method for preparing the display module shown;

[0072] Fig.21 yes Figure 7 A structural schematic diagram of step S4 in the method for preparing the display module shown;

[0073] Fig. 22 yes Figure 7 A structural schematic diagram of step S5 in the method for preparing the display module shown;

[0074] Fig.23 yes Figure 7 The structure diagram of step S6 in the method for preparing the display module is shown. DETAILED DESCRIPTION

[0075] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0076] See also Figure 1 , Figure 1 It is a schematic diagram of a partial structure of an electronic device 1000 provided in an embodiment of the present application.

[0077] The electronic device 1000 may be an electronic product such as a mobile phone, a tablet computer, a personal computer, a multimedia player, an e-book reader, a laptop computer, a vehicle-mounted device, or a wearable device. Among them, the wearable device may be a wearable electronic product such as a watch, a smart watch, a bracelet, a smart bracelet, augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses, VR helmets, or electronic health detection equipment, or a wearable decoration such as a belt, a belt, a bracelet, an anklet, a necklace, or a ring. Next, the electronic device 1000 is described as a watch as an example.

[0078] The electronic device 1000 includes a device body 100, two fixing straps (not shown) and a connecting mechanism (not shown), the two fixing straps are respectively connected to opposite sides of the device body 100, and the connecting mechanism can be connected to one end of the two fixing straps away from the device body 100. Exemplarily, the connecting mechanism has an unlocked state and a locked state. When the connecting mechanism is in the unlocked state, the two fixing straps can be relatively far apart, and the electronic device 1000 can be taken off the user's wrist. When the connecting mechanism is in the locked state, the two fixing straps can be relatively close, and the electronic device 1000 can be wearable and fit the user's wrist. It should be noted that the embodiment of the present application does not specifically limit the structure of the connecting mechanism.

[0079] The device body 100 includes a housing 110, a processor (not shown) and a display module 120, and the processor and the display module 120 are both mounted on the housing 110. The housing 110 includes a middle frame 111, a rear cover plate 112 and four fixing ears 113, and the rear cover plate 112 and the four fixing ears 113 are both mounted on the middle frame 111. Specifically, along the thickness direction of the middle frame 111, the rear cover plate 112 is mounted on one side of the middle frame 111. Among them, the rear cover 112 can be integrally formed with the middle frame 111 to increase the overall strength of the housing 110, or the rear cover 112 can be detachably mounted on the middle frame 111 to facilitate the maintenance of the electronic devices inside the device body 100.

[0080] The four fixing ears 113 are all installed on the peripheral side of the middle frame 111 and are arranged at intervals around the middle frame 111. Specifically, two fixing ears 113 are installed on one side of the middle frame 111 and can be connected to a fixing belt, and the other two fixing ears 113 are installed on the other side of the middle frame 111 and can be connected to another fixing belt to achieve the connection between the housing 110 and the two fixing belts, and then achieve the connection between the device body 100 and the two fixing belts. Among them, the four fixing ears 113 and the middle frame 111 can be integrally formed to increase the overall strength of the housing 110.

[0081] The processor is installed on the inner side of the housing 110. Specifically, the processor is installed on the inner side of the middle frame 111. The processor may be a central processing unit (CPU) of the electronic device 1000.

[0082] Please also read Figure 2 , Figure 2 yes Figure 1 The schematic diagram of the partial structure of the device body 100 of the electronic device 1000 after being cut along line II. Here, cutting along line II means cutting along the plane where line II is located. Figure 1 The II line is given as an example, Figure 2 Shown as single dotted line.

[0083] Along the thickness direction of the housing 110, the display module 120 is installed on one side of the housing 110. Specifically, the display module 120 is installed on the side of the middle frame 111 away from the rear cover 112. That is, along the thickness direction of the middle frame 111, the display module 120 and the rear cover 112 are respectively installed on opposite sides of the middle frame 111. When the user uses the electronic device 1000, the display module 120 faces away from the user's wrist, and the rear cover 112 faces the user's wrist. Among them, the display module 120 is electrically connected to the processor. The processor can send a display signal to the display module 120, and the display module 120 can display information such as images or text according to the display signal.

[0084] Please also read Figure 3and Figure 4 , Figure 3 yes Figure 1 The back structure diagram of the display module 120 of the device body 100 in the electronic device 1000 is shown. Figure 4 yes Figure 3 A partial structural diagram of the display module 120 is shown.

[0085] In this embodiment, the display module 120 is circular. In some other embodiments, the display module 120 may also be square or irregular. The display module 120 has a display area 121 and a non-display area 122. The display area 121 is located in the middle area of ​​the display module 120. The non-display area 122 is located in the edge area of ​​the display module 120 and is arranged around the display area 121. Figure 2 The boundary between the display area 121 and the non-display area 122 is exemplarily shown as follows: Figure 2 As shown by the double dotted line in the figure. Exemplarily, the display area 121 is circular, and the non-display area 122 is annular. In some other embodiments, the display area 121 may also be square or irregular, and / or the non-display area 122 may also be square or irregular.

[0086] The display module 120 includes a connection panel 10, a display panel 20, a conductive member 30, a polarizer (POL) 40, a cover plate 50, an optically clear adhesive (OCA) layer 60, and a display driver 70. Along the thickness direction of the connection panel 10, the display panel 20, the conductive member 30, the polarizer 40, the cover plate 50, and the optically clear adhesive layer 60 are located on one side of the connection panel 10, and the display driver 70 is located on the other side of the connection panel 10.

[0087] In this embodiment, the connection panel 10 includes a first portion 10a, a second portion 10b and a bent portion 10c. The first portion 10a is provided with a first via hole 101, and along the thickness direction of the first portion 10a, the first via hole 101 penetrates at least a portion of the first portion 10a. Exemplarily, there are four first via holes 101, and the four first via holes 101 are arranged at intervals from each other. Along the thickness direction of the first portion 10a, the second portion 10b is located on one side of the first portion 10a, and is spaced from and opposite to the first portion 10a. Exemplarily, the second portion 10b is arranged parallel to the first portion 10a. The bent portion 10c is connected between the first portion 10a and the second portion 10b, and is bent relative to the first portion 10a and the second portion 10b. Among them, the bent portion 10c is located in the display area 121. In some other embodiments, part of the bent portion 10c may also be located in the non-display area 122, for example, the portion of the bent portion 10c away from the first portion 10a and the second portion 10b may also be located in the non-display area 122. in, Figure 2The boundary lines among the first portion 10 a , the second portion 10 b and the bent portion 10 c are exemplarily shown as indicated by the dotted lines in the connection panel 10 .

[0088] The display panel 20 is located on the side of the first part 10a away from the second part 10b. Exemplarily, the display panel 20 is disc-shaped. The display panel 20 has a display surface 201 and a peripheral side surface 202. The display surface 201 is the surface of the display panel 20 away from the first part 10a, and is used to display information such as images or text. The peripheral side surface 202 is connected to the display surface 201 and is arranged around the peripheral side surface 202. Specifically, the peripheral side surface 202 is located in the non-display area 122 and is located on the outside of the bending portion 10c. It should be noted that the peripheral side surface 202 is located on the outside of the bending portion 10c, which means that along the thickness direction of the display panel 20, the projection of the bending portion 10c on the display panel 20 is located inside the display panel 20. At this time, the end of the bending portion 10c away from the first part 10a and the second part 12 can be spaced from the peripheral side surface 202, or the end of the bending portion 10c away from the first part 10a and the second part 12 can be flush with the peripheral side surface 202.

[0089] In this embodiment, the peripheral side surface 202 is located between the bending portion 10c and the middle frame 111, and is spaced apart from the bending portion 10c and the middle frame 111. The distance between the peripheral side surface 202 and the bending portion 10c is w 1 , the distance between the peripheral side surface 202 and the middle frame 111 is w 2 For example, 1 Can be 0.75mm or 0.8mm, w 2 It can be 0.3mm.

[0090] Exemplarily, the display panel 20 may be an organic light emitting diode display panel. In some other embodiments, the display panel 20 may also be an active-matrix organic light emitting diode or an active-matrix organic light emitting diode (AMOLED) display panel, a flexible light emitting diode (FLED) display panel, a sub-millimeter light emitting diode (MiniLED) display panel, a micro light emitting diode (MicroLED) display panel, or a quantum dot light emitting diode (QLED) display panel.

[0091] In this embodiment, the display panel 20 is provided with a second via hole 203, and along the thickness direction of the display panel 20, the second via hole 203 penetrates at least a portion of the display panel 20 and is connected to the first via hole 101. Exemplarily, there are four second via holes 203, and the four second via holes 203 are arranged at intervals from each other, and each second via hole 203 is connected to one first via hole 101.

[0092] The conductive member 30 is disposed in the first via hole 101 and the second via hole 203, and electrically connects the display panel 20 and the connection panel 10 to achieve electrical connection between the connection panel 10 and the display panel 20. Exemplarily, there are four conductive members 30, each of which is disposed in one first via hole 101 and one second via hole 203. The conductive member 30 may be made of a conductive material such as a metal material, for example, the conductive member 30 may be a conductive column, or the conductive member 30 may be a conductive layer formed on the hole wall surface of the first via hole 101 and the hole wall surface of the second via hole 203.

[0093] The polarizer 40 is located on the side of the display panel 20 away from the first part 10a. The cover plate 50 is located on the side of the polarizer 40 away from the display panel 20, and covers the display panel 20 and the polarizer 40. Exemplarily, the cover plate 50 may be a glass cover plate (coverglass, CG). The optical adhesive layer 60 is located between the polarizer 40 and the cover plate 50, and is bonded between the polarizer 40 and the cover plate 50. The display driver 70 is installed on the side of the second part 10b away from the first part 10a, and is electrically connected to the second part 10b and the processor. Among them, the display driver 70 can be installed in the second part 10b by a chip on plastic bonding (COP bonding) process. Exemplarily, the display driver 70 can be an integrated circuit chip (integrated circuit, IC).

[0094] In addition, the device body 100 further includes an adhesive layer 130, which is located between the display module 120 and the middle frame 111, and is bonded between the display module 120 and the middle frame 111. Specifically, the adhesive layer 130 is located between the cover plate 50 and the middle frame 111, and is bonded between the cover plate 50 and the middle frame 111, so as to realize the assembly between the display module 120 and the middle frame 111, and further realize the assembly between the display module 120 and the housing 110. The width of the adhesive layer 130 is w 3 For example, 3 It can be 0.9mm.

[0095] In the display module 120 shown in this embodiment, the display module 120 is split into two parts, namely a connection panel 10 and a display panel 20. The connection panel 10 is used to realize the combination with the display driver 70, and the display panel 20 is used to realize the display function of the display module 120, and the conductive member 30 is used to realize the signal transmission between the connection panel 10 and the display panel 20. The bending portion 10c in the connection panel 10 does not exceed the peripheral side surface 202 of the display panel 20, and is located in the display area 121. Not only is the bending of the bending portion 10c more free and elastic, but the existence of the bending portion 10c will not increase the width of the non-display area 122, and the border width of the display module 120 can be reduced, which helps to realize the narrow border design of the display module 120 and improve the appearance and screen-to-body ratio of the electronic device 1000.

[0096] See also Figure 5 , Figure 5 yes Figure 4 The display module 120 is a schematic diagram of a partial structure in the first embodiment.

[0097] The connection panel 10 includes a first substrate 11, a first insulating layer 12, a second substrate 13, a first signal layer 14 and a protective layer 15. The first insulating layer 12 is disposed on the surface of the first substrate 11. Exemplarily, the first insulating layer 12 can be made of amorphous silicon (amorphous silicon, α-Si) or silicon oxide (SiOx). The second substrate 13 is disposed on the surface of the first insulating layer 12 away from the first substrate 11. Exemplarily, the first substrate 11 and the second substrate 13 can both be made of polyimide (Polyimide, PI). Among them, the first substrate 11 and the second substrate 13 are a single-layer structure or a multi-layer structure. The first signal layer 14 is disposed on the surface of the second substrate 13 away from the first insulating layer 12. Exemplarily, the first signal layer 14 can be made of a conductive material such as metal, for example, the first signal layer 14 can be made of Ti or TiAl.

[0098] Among them, the first signal layer 14 may include a variety of signal routings, which are insulated from each other and are used to transmit different signals. Exemplarily, the first signal layer 14 includes five signal routings, which are the first signal routing, the second signal routing, the third signal routing, the fourth signal routing and the fifth signal routing. The first signal routing can transmit an ELVDD signal (anode voltage signal), the second signal routing can transmit a GIP signal (gate drive signal) / Demux signal (source conversion signal), the third signal routing can transmit a source signal (source signal), the fourth signal routing can transmit an ELVSS signal (cathode voltage signal), and the fifth signal routing can transmit a touch panel (TP) signal.

[0099] The protective layer 15 is disposed on the surface of the first signal layer 14 away from the second substrate 13, and covers the first signal layer 14 to protect the first signal layer 14 and prevent the first signal layer 14 from being corroded and failing. Exemplarily, the protective layer 15 may be a planarization layer (PLN), which can planarize the surface of the connection panel 10 while protecting the first signal layer 14, so as to facilitate the subsequent formation of the display panel 20.

[0100] In the present embodiment, the first via 101 passes through the protective layer 15 and exposes the first signal layer 14. There may be multiple first vias 101, and the multiple first vias 101 are arranged at intervals from each other. Exemplarily, there are five first vias 101, one first via 101 exposes the first signal routing, one first via 101 exposes the second signal routing, one first via 101 exposes the third signal routing, one first via 101 exposes the fourth signal routing, and one first via 101 exposes the fifth signal routing. It should be noted that, in other embodiments, the first vias 101 may be less than five or greater than five, and there may be more than two first vias 101 to expose at least one of the first signal routing, the second signal routing, the third signal routing, the fourth signal routing, and the fifth signal routing.

[0101] The display panel 20 is disposed on the surface of the protective layer 15 away from the first signal layer 14. The display panel 20 includes a display layer structure 20a and a second signal layer 28. The display layer structure 20a is disposed on the side of the protective layer 15 away from the first signal layer 14. The display layer structure 20a is provided with a second via hole 203, and the second via hole 203 penetrates at least a portion of the display layer structure 20a along the thickness direction of the display panel 20. The second signal layer 28 is disposed on the side of the display layer structure 20a away from the protective layer 15.

[0102] In this embodiment, along the thickness direction of the display panel 20, the second via hole 203 penetrates the display layer structure 20a. The display layer structure 20a includes a third substrate 21, a second insulating layer 22, a fourth substrate 23, a first buffer layer 24, a shielding layer 25, a second buffer layer 26 and a polysilicon (poly-si) layer 27. The third substrate 21, the second insulating layer 22, the fourth substrate 23, the first buffer layer 24, the shielding layer 25, the second buffer layer 26 and the polysilicon layer 27 are sequentially stacked on the surface of the protective layer 15 away from the first signal layer 14. The second signal layer 28 is provided on the side of the polysilicon layer 27 away from the second buffer layer 26. Among them, the second via hole 203 penetrates the third substrate 21, the second insulating layer 22, the fourth substrate 23, the first buffer layer 24, the shielding layer 25, the second buffer layer 26 and the polysilicon layer 27. In other words, the second via hole 203 penetrates all layer structures below the second signal layer 28 in the display panel 20 to achieve communication with the first via hole 101 .

[0103] Exemplarily, the third substrate 21 and the fourth substrate 23 can be made of polyimide. The third substrate 21 and the fourth substrate 23 are single-layer structures or multi-layer structures. The second insulating layer 22 can be made of amorphous silicon or silicon oxide. The first buffer layer 24 and the second buffer layer 26 can both be made of silicon oxide or silicon nitride (SiNx). The shielding layer 25 can be a bottom shield metal (BSM) layer and can be made of a metal material. The second signal layer 28 can be made of a metal material. It should be noted that Figure 5 Only part of the layer structure of the display panel 20 is shown. For example, the layer structure between the polysilicon layer 27 and the second signal layer 28 in the display layer structure 20a is not shown. The specific layer structure of the display panel 20 can refer to the relevant description of the layer structure of the existing display panel, which will not be repeated here.

[0104] The conductive member 30 is disposed in the first via hole 101 and the second via hole 203, and is electrically connected between the second signal layer 28 and the first signal layer 14, so as to realize the electrical connection between the connection panel 10 and the display panel 20. The conductive member 30 can be integrally formed with the second signal layer 28. Exemplarily, the conductive member 30 can be formed in the same process as the second signal layer 28, that is, in the process of depositing and forming the second signal layer 28, metal material can be deposited in the second via hole 203 and the first via hole 101 at the same time to obtain the conductive member 30. It should be noted that Figure 5 Only two conductive members 30 are shown as examples, and the display module 120 may also include one or more than three conductive members 30 .

[0105] The display driver 70 is installed on the side of the protection layer 15 away from the first signal layer 14 and is electrically connected to the first signal layer 14. The display driving signal of the display driver 70 can be transmitted to the second signal layer 28 through the first signal layer 14 and the conductive member 30 in sequence to realize signal transmission of the display module 120.

[0106] It should be noted that the second signal layer 28 may be a signal layer for transmitting an ELVDD signal, a GIP signal / Demux, a source signal, an ELVSS signal or a touch signal, and the conductive member 30 may conduct the second signal layer 28 with the first signal layer 14. Exemplarily, the second signal layer 28 may be a signal layer for transmitting an ELVDD signal, and the conductive member 30 may electrically connect the second signal layer 28 and the first signal trace of the first signal layer 14 to conduct the second signal layer 28 and the first signal trace of the first signal layer 14. At this time, the ELVDD signal sent by the display driver 70 may be transmitted to the second signal layer 28 via the first signal trace of the first signal layer 14 and the conductive member 30 to realize signal transmission of the ELVDD signal.

[0107] It is understandable that the second signal layer 28 may include a plurality of signal traces, which are insulated from each other and are used to transmit different signals. Exemplarily, the second signal layer 28 includes two signal traces, which are the sixth signal trace and the seventh signal trace, respectively. The sixth signal trace transmits the ELVDD signal, and the seventh signal trace transmits the GIP signal / Demux signal. At this time, there may be two types of conductive members 30, which are the first conductive member and the second conductive member. The first conductive member 30 electrically connects the sixth signal trace of the second signal layer 28 and the first signal trace of the first signal layer 14 to conduct the sixth signal trace of the second signal layer 28 and the first signal trace of the first signal layer 14. The second conductive member 30 electrically connects the seventh signal trace of the second signal layer 28 and the second signal trace of the first signal layer 14 to conduct the seventh signal trace of the second signal layer 28 and the second signal trace of the first signal layer 14. At this time, the ELVDD signal sent by the display driver 70 can be transmitted to the sixth signal line of the second signal layer 28 via the first signal line of the first signal layer 14 and the first conductive member to achieve signal transmission of the ELVDD signal. The GIP signal / Demux signal sent by the display driver 70 can be transmitted to the seventh signal line of the second signal layer 28 via the second signal line of the first signal layer 14 and the second conductive member to achieve signal transmission of the GIP signal / Demux signal.

[0108] It can be understood that the sixth signal line and the seventh signal line can also transmit other signals. For example, the sixth signal line can transmit a GIP signal / Demux signal, a source signal, an ELVSS signal or a touch signal, and the seventh signal line can transmit an ELVDD signal, a source signal, an ELVSS signal or a touch signal. Alternatively, the second signal layer 28 may include more than three signal lines, each of which transmits a touch signal among the ELVDD signal, the GIP signal / Demux signal, the source signal and the ELVSS signal. In this case, there are correspondingly multiple types of conductive elements 30, and each type of conductive element 30 electrically connects the signal lines transmitting the same type of signals in the second signal layer 28 and the first signal layer 14 to achieve conduction of each signal line in the second signal layer 28 and the first signal layer 14.

[0109] In addition, the display module 120 further includes a separation layer 80, which is disposed on the surface of the second portion 10b and the bending portion 10c. Specifically, the separation layer 80 is disposed on the surface of the protective layer 15 away from the first signal layer 14. The separation layer 80 can be made of a material that is easy to separate and non-adhesive. For example, the separation layer 80 can be made of BPN and AlQ 3 and other organic small molecule materials, wherein BPN and AlQ 3 The organic small molecule material may also be doped with inorganic materials such as LiF (lithium fluoride). The separation layer 80 is made of organic small molecule material, so that the material of the separation layer 80 is in powder granular form, which can avoid adhesion between the connection panel 10 and the display panel 20, and the second part 10b and the bending part 10c are easy for the display panel 20 to separate and bend relative to the first part 10a.

[0110] In some other embodiments, the separation layer 80 may also be disposed on the surface of the display panel 20 facing the connection panel 10. In this case, the separation layer 80 is disposed in the area of ​​the surface of the display panel 20 facing the connection panel 10 that is opposite to the bending portion 10c, and is disposed opposite to the bending portion 10c. Alternatively, the separation layer 80 may also be partially disposed on the surface of the second portion 10b and the bending portion 10c, and partially disposed in the area of ​​the surface of the display panel 20 facing the connection panel 10 that is opposite to the bending portion 10c. The present application does not impose any specific restrictions on the position of the separation layer 80. It should be noted that, compared with the various layer structures of the connection panel 10 and the display panel 20, the thickness of the separation layer 80 is very small, which can further reduce the adhesive force of the separation layer 80 and avoid adhesion between the local separation layer 80 and the connection panel 10 and the display panel 20.

[0111] See also Figure 6 , Figure 6 yes Figure 4 The display module 120 is a schematic diagram of a partial structure in a second embodiment.

[0112] The display module 120 shown in this embodiment is different from the display module 120 shown in the first embodiment in that the display layer structure 20a includes a first layer structure 20b, a third signal layer 29 and a second layer structure 20c, and the first layer structure 20b, the third signal layer 29 and the second layer structure 20c are stacked on the surface of the protective layer 15 away from the first signal layer 14. The first layer structure 20b and the second layer structure 20c may include Figure 5 The third substrate 21, the second insulating layer 22, the fourth substrate 23, the first buffer layer 24, the shielding layer 25, the second buffer layer 26 and the polysilicon layer 27 are shown as one or more layers. Exemplarily, the third signal layer 29 can be made of metal material. It should be noted that, Figure 6 The specific layer structures of the first layer structure 20b and the second layer structure 20c are not shown.

[0113] The second via 203 includes a first via portion 204 and a second via portion 205. Along the thickness direction of the display panel 20, the first via portion 204 penetrates the first layer structure 20b, that is, the first via portion 204 penetrates all layer structures below the third signal layer 29 in the display panel 20 to achieve communication with the first via 103. Along the thickness direction of the display panel 20, the second via portion 205 penetrates the second layer structure 20c, that is, the second via portion 205 penetrates the layer structure between the second signal layer 28 and the third signal layer 29. In the thickness direction of the display panel 20, the second via portion 205 and the first via portion 204 are completely misaligned. In some other embodiments, along the thickness direction of the display panel 20, the second via portion 205 and the first via portion 204 may also be partially misaligned, or the second via portion 205 and the first via portion 204 may also be non-misaligned, and the present application does not impose specific restrictions on this.

[0114] The conductive member 30 includes a first conductive portion 31 and a second conductive portion 32. The first conductive portion 31 is provided in the first via 101 and the first via portion 204, and electrically connects the third signal layer 29 and the first signal layer 14. The second conductive portion 32 is provided in the second via 205, and electrically connects the third signal layer 29 and the second signal layer 28, so as to realize the electrical connection between the second signal layer 28 and the first signal layer 14, and further realize the electrical connection between the connection panel 10 and the display panel 20. Among them, the first conductive portion 31 can be integrally formed with the third signal layer 29, and the second conductive portion 32 can be integrally formed with the second signal layer 28. Exemplarily, the first conductive portion 31 can be formed in the same process as the third signal layer 29, that is, in the process of depositing and forming the third signal layer 29, metal material can be deposited in the first via portion 204 and the first via 101 at the same time to obtain the first conductive portion 31. Moreover, the second conductive portion 32 can be formed in the same process as the second signal layer 28, that is, in the process of depositing the second signal layer 28, a metal material can be deposited in the second via portion 205 to obtain the second conductive portion 32. It should be noted that, Figure 6 Only one conductive member 30 is shown as an example, and the display module 120 may also include more than two conductive members 30 .

[0115] In this embodiment, the third signal layer 29 can transmit the same type of signal as the second signal layer 28. For example, the third signal layer 29 can be a signal layer that transmits an ELVDD signal, a GIP signal / Demux signal, a source signal, an ELVSS signal, or a touch signal. The first conductive portion 31 can conduct the third signal layer 29 with the first signal layer 14, and the second conductive portion 32 can conduct the second signal layer 28 with the third signal layer 29. Exemplarily, the second signal layer 28 and the third signal layer 29 can both be signal layers that transmit an ELVDD signal. The first conductive portion 31 electrically connects the third signal layer 29 with the first signal trace of the first signal layer 14 to conduct the third signal layer 29 with the first signal trace of the first signal layer 14. At this time, the ELVDD signal sent by the display driver 70 can be transmitted to the second signal layer 28 via the first signal trace of the first signal layer 14, the first conductive portion 31, the third signal layer 29, and the second conductive portion 32 in sequence to achieve signal transmission of the ELVDD signal.

[0116] It is understandable that the third signal layer 29 may include a plurality of signal traces, which are insulated from each other and are used to transmit different signals. Exemplarily, the third signal layer 29 includes two signal traces, which are the eighth signal trace and the ninth signal trace, respectively. The eighth signal trace transmits the ELVDD signal, and the ninth signal trace transmits the GIP signal / Demux signal. At this time, there may be two types of conductive members 30, which are the first conductive member and the second conductive member. The first conductive portion 31 of the first conductive member electrically connects the eighth signal trace of the third signal layer 29 and the first signal trace of the first signal layer 14 to conduct the eighth signal trace of the third signal layer 29 and the first signal trace of the first signal layer 14, and the second conductive portion 32 of the first conductive member electrically connects the sixth signal trace of the second signal layer 28 and the eighth signal trace of the third signal layer 29 to conduct the sixth signal trace of the second signal layer 28 and the eighth signal trace of the third signal layer 29. The first conductive portion 31 of the second conductive member 30 is electrically connected to the ninth signal line of the third signal layer 29 and the second signal line of the first signal layer 14, so as to conduct the ninth signal line of the third signal layer 29 and the second signal line of the first signal layer 14. The second conductive portion 32 of the second conductive member is electrically connected to the seventh signal line of the second signal layer 28 and the ninth signal line of the third signal layer 29, so as to conduct the seventh signal line of the second signal layer 28 and the ninth signal line of the third signal layer 29. At this time, the ELVDD signal sent by the display driver 70 can be transmitted to the sixth signal line of the second signal layer 28 via the first signal line of the first signal layer 14, the first conductive portion 31 of the first conductive member, the eighth signal line of the third signal layer 29 and the second conductive portion 32 of the first conductive member, so as to realize the signal transmission of the ELVDD signal. The GIP signal / Demux signal sent by the display driver 70 can be transmitted to the seventh signal line of the second signal layer 28 via the second signal line of the first signal layer 14, the first conductive part 31 of the second conductive element, the ninth signal line of the third signal layer 29 and the second conductive part 32 of the second conductive element to realize signal transmission of the GIP signal / Demux signal.

[0117] It can be understood that the eighth signal line and the ninth signal line can also transmit other signals. For example, the eighth signal line can transmit a GIP signal / Demux signal, a source signal, an ELVSS signal or a touch signal, and the ninth signal line can transmit an ELVDD signal, a source signal, an ELVSS signal or a touch signal. Alternatively, the third signal layer 29 may include more than three signal lines, each of which transmits a touch signal among the ELVDD signal, the GIP signal / Demux signal, the source signal and the ELVSS signal. In this case, there are correspondingly multiple types of conductive members 30. In each type of conductive member 30, the first conductive portion 31 electrically connects the signal lines transmitting the same type of signals in the third signal layer 29 and the first signal layer 14, and the second conductive portion 32 electrically connects the signal lines transmitting the same type of signals in the second signal layer 28 and the first signal layer 14, so as to realize conduction of each signal line in the second signal layer 28 and the first signal layer 14.

[0118] See also Figure 7 , Figure 7 It is a process flow chart of the method for preparing the display module provided in this application.

[0119] The method for preparing a display module provided in the present application is used to prepare the above-mentioned display module 120. The method for preparing a display module includes the following steps S1 to S7.

[0120] See also Figure 8 , Figure 8 yes Figure 7 The structure diagram of step S1 in the method for preparing the display module is shown.

[0121] Step S1, providing a first panel 140. In this embodiment, the first panel 140 is in the shape of a flat plate. The first panel 140 includes a connection panel 10 and a first surplus panel 150, wherein the connection panel 10 is located in the middle of the first panel 140, and the first surplus panel 150 is located at the edge of the first panel 140 and is arranged around the connection panel 10. Among them, the connection panel 10 is in the shape of a flat plate. The connection panel 10 includes a first portion 10a, a second portion 10b and a bending portion 10c. The first portion 10a is provided with a first via hole 101, and along the thickness direction of the first portion 10a, the first via hole 101 at least partially penetrates the first portion 10a. Exemplarily, there is one first via hole 101. The second portion 10b is located on one side of the first portion 10a and is spaced apart from the first portion 10a. The bending portion 10c is connected between the first portion 10a and the second portion 10b, and can be bent relative to the first portion 10a and the second portion 10b.

[0122] In this embodiment, the first panel 140 includes a first substrate layer 141, a first insulating material layer 142, a second substrate layer 143, a first signal material layer 144 and a protective material layer 145. The first insulating material layer 142, the second substrate layer 143, the first signal material layer 144 and the protective material layer 145 are sequentially stacked on the surface of the first substrate layer 141. Among them, the first via 101 penetrates the protective material layer 145 and exposes the first signal material layer 144. Exemplarily, the first insulating material layer 142 can be made of amorphous silicon or silicon oxide. The first substrate layer 141 and the second substrate layer 143 can both be made of polyimide. The first signal material layer 144 can be made of a conductive material such as metal. The protective material layer 145 can be made of a protective material.

[0123] See also Fig. 9 , Fig. 9 yes Figure 7 The structure diagram of step S2 in the method for preparing the display module is shown.

[0124] Step S2, forming a separation layer 80 on the first panel 140. Specifically, the separation layer 80 is formed on the surface of the protective material layer 145 away from the first signal material layer 144. The separation layer 80 covers the surface of the second part 10b and the bending part 10c. Exemplarily, the separation layer 80 can be made of a material that is easy to separate and non-adhesive, for example, it can be made of one or more organic small molecule materials such as BPN and ALQ3, wherein the organic small molecule materials such as BPN and ALQ3 can also be doped with inorganic materials such as LiF. At this time, the separation layer 80 can be formed by an evaporation process. In some other embodiments, the separation layer 80 can also be located on the surface of the first surplus panel 150. In other words, the separation layer 80 is at least located on the surface of the second part 10b and the bending part 10c. In some other embodiments, the method for preparing the display module may not include step S2, that is, step S3 can be performed directly after step S1, and the present application does not impose specific restrictions on this.

[0125] See also Fig.10 , Fig.10 yes Figure 7 The structure diagram of step S3 in the method for preparing the display module in the first embodiment is shown.

[0126] Step S3, forming a second panel 170 and a conductive member 30 on the first panel 140. The second panel 170 covers the first panel 140 and the separation layer 80. The display panel 20 is provided with a second via hole 203, and along the thickness direction of the display panel 20, the second via hole 203 at least partially penetrates the display panel 20 and is connected to the first via hole 101. The conductive member 30 is provided in the first via hole 101 and the second via hole 203, and electrically connects the display panel 20 and the connection panel 10 to achieve electrical connection between the connection panel 10 and the display panel 20. Exemplarily, there is one second via hole 203 and one conductive member 30.

[0127] In this embodiment, the second panel 170 includes a display panel 20, a second margin panel 180 and a third margin panel 190. The display panel 20 is located in the middle of the second panel 170. The second margin panel 180 and the third margin panel 190 are both located at the edge of the second panel 170 and are both arranged around the display panel 20. The third margin panel 190 is also arranged around the second margin panel 180.

[0128] The second panel 170 includes a panel layer structure 170a and a second signal material layer 178. The panel layer structure 170a is disposed on the surface of the protective material layer 145 away from the first signal material layer 144, and covers the first panel 140 and the separation layer 80. The second signal material layer 178 is disposed on the surface of the panel layer structure 170a away from the protective layer 15. The panel layer structure 170a is provided with a second via hole 203, and the second via hole 203 penetrates the panel layer structure 170a along the thickness direction of the second panel 170.

[0129] Exemplarily, the panel layer structure 170a includes a third substrate layer 171, a second insulating material layer 172, a fourth substrate layer 173, a first buffer material layer 174, a shielding material layer 175, a second buffer material layer 176 and a polysilicon material layer 177. The third substrate layer 171 is disposed on the surface of the protective material layer 145 away from the first signal material layer 144, and covers the first panel 140 and the separation layer 80. The second insulating material layer 172, the fourth substrate layer 173, the first buffer material layer 174, the shielding material layer 175, the second buffer material layer 176 and the polysilicon material layer 177 are sequentially disposed on the surface of the third substrate layer 171 away from the protective layer 15. The second signal material layer 178 is disposed on the side of the polysilicon material layer 177 away from the second buffer material layer 176. The second via hole 203 penetrates the third substrate layer 171 , the second insulating material layer 172 , the fourth substrate layer 173 , the first buffer material layer 174 , the shielding material layer 175 , the second buffer material layer 176 and the polysilicon material layer 177 .

[0130] Exemplarily, the third substrate layer 171 and the fourth substrate layer 173 can be made of polyimide. The second insulating material layer 172 can be made of amorphous silicon or silicon oxide. The first buffer material layer 174 and the second buffer material layer 176 can be made of silicon oxide or silicon nitride. The shielding material layer 175 and the second signal material layer 178 can be made of metal material. It should be noted that Fig.10 Only part of the layer structure of the second panel 170 is shown. For example, the layer structure between the polysilicon material layer 177 and the second signal material layer 178 in the panel layer structure 170a is not shown. The specific layer structure of the panel layer structure 170a can refer to the relevant description of the layer structure of the existing display panel, which will not be repeated here.

[0131] See also Fig.11 , Fig.11 yes Figure 7 The process flow chart of step S3 in the method for preparing the display module in the first embodiment is shown.

[0132] In this embodiment, step S3 includes steps S31 to S33.

[0133] See also Fig.12 , Fig.12 yes Fig.11 The structure diagram of step S31 in the method for preparing the display module is shown.

[0134] Step S31, forming a panel layer structure 170a on the first panel 140. Specifically, a third substrate layer 171, a second insulating material layer 172, a fourth substrate layer 173, a first buffer material layer 174, a shielding material layer 175, a second buffer material layer 176 and a polysilicon material layer 177 are sequentially formed on the surface of the protective material layer 145 away from the first signal material layer 144. The third substrate layer 171 may also cover the first via 101.

[0135] See also Fig.13 , Fig.13 yes Fig.11 The structure diagram of step S32 in the method for preparing the display module is shown.

[0136] Step S32, forming a second via hole 203 penetrating the panel layer structure 170a. Specifically, forming the second via hole 203 penetrating the third substrate layer 171, the second insulating material layer 172, the fourth substrate layer 173, the first buffer material layer 174, the shielding material layer 175, the second buffer material layer 176 and the polysilicon material layer 177. Exemplarily, the second via hole 203 may be formed by a wet etching process or a dry etching process.

[0137] Step S33, forming a conductive member 30 in the first via hole 101 and the second via hole 203, and forming a second signal material layer 178 on the surface of the panel layer structure 170a away from the first panel 140, such as Fig.10 Specifically, the second signal material layer 178 is formed on the polysilicon material layer 177 away from the second buffer material layer 176 . The conductive member 30 is electrically connected to the second signal material layer 178 and the first signal material layer 144 .

[0138] It should be noted that the conductive member 30 can be formed in the same process as the second signal material layer 178, that is, in the process of depositing the second signal material layer 178, metal material can be deposited in the second via 203 and the first via 101 at the same time to obtain the conductive member 30, or the conductive member 30 and the second signal material layer 178 can also be formed successively, for example, the conductive member 30 can be first formed in the second via 203 and the first via 101, and then the second signal material layer 178 can be formed in the polysilicon material layer 177 away from the second buffer material layer 176.

[0139] See also Fig.14 , Fig.14 yes Figure 7 The structure diagram of step S3 in the method for preparing the display module in the second embodiment is shown.

[0140] The difference between step S3 in this embodiment and step S3 in the first embodiment is that the panel layer structure 170a includes a first panel structure 170b, a third signal material layer 179, and a second panel structure 170c. The first panel structure 170b is disposed on the surface of the protective material layer 145 away from the first signal material layer 144, and covers the first panel 140 and the separation layer 80. The third signal material layer 179 and the second panel structure 170c are sequentially stacked on the surface of the first panel structure 170b away from the protective material layer 145. The first panel structure 170b and the second panel structure 170c may include Fig.10 The third substrate layer 171, the second insulating material layer 172, the fourth substrate layer 173, the first buffer material layer 174, the shielding material layer 175, the second buffer material layer 176 and the polysilicon material layer 177 are shown as one or more layers. Exemplarily, the third signal material layer 179 can be made of metal material. It should be noted that, Fig.14 The specific layer structures of the first panel structure 170b and the second panel structure 170c are not shown.

[0141] The second via 203 includes a first via portion 204 and a second via portion 205. In the thickness direction of the second panel 170, the first via portion 204 penetrates the first panel structure 170b, that is, the first via portion 204 penetrates all layer structures below the third signal material layer 179 in the second panel 170 to achieve communication with the first via 103. In the thickness direction of the second panel 170, the second via portion 205 penetrates the second panel structure 170c, that is, the second via portion 205 penetrates the layer structure between the second signal material layer 178 and the third signal material layer 179. In the thickness direction of the second panel 170, the second via portion 205 and the first via portion 204 are completely misaligned. In some other embodiments, in the thickness direction of the display panel 20, the second via portion 205 and the first via portion 204 may also be partially misaligned, or the second via portion 205 and the first via portion 204 may also be non-misaligned, and the present application does not impose any specific restrictions on this.

[0142] The conductive member 30 includes a first conductive portion 31 and a second conductive portion 32. The first conductive portion 31 is disposed in the first via 101 and the first via portion 204, and electrically connects the third signal material layer 179 and the first signal material layer 144. The second conductive portion 32 is disposed in the second via 205, and electrically connects the third signal material layer 179 and the second signal material layer 178, so as to realize the electrical connection between the second signal material layer 178 and the first signal material layer 144, and further realize the electrical connection between the first panel 140 and the second panel 170.

[0143] See also Fig.15 , Fig.15 yes Figure 7 The process flow chart of step S3 in the method for preparing the display module in the second embodiment is shown.

[0144] In this embodiment, step S3 includes steps S34 to S39.

[0145] See also Fig.16 , Fig.16 yes Fig.15 The structure diagram of step S34 in the method for preparing the display module is shown.

[0146] Step S34 , forming a first panel structure 170 b on the first panel 140 . Specifically, the first panel structure 170 b is formed on the surface of the protection material layer 145 away from the first signal material layer 144 . The first panel structure 170 b may cover the first via hole 101 .

[0147] See also Fig.17 , Fig.17 yes Fig.15 The structure diagram of step S35 in the method for preparing the display module is shown.

[0148] Step S35 , forming a first via hole portion 204 penetrating the first panel structure 170 b , wherein the first via hole portion 204 is connected to the first via hole 101 .

[0149] See also Fig.18 , Fig.18 yes Fig.15 FIG. 1 is a schematic diagram of the structure of step S36 in the method for preparing a display module.

[0150] Step S36, forming the first conductive portion 31 in the first via hole 101 and the first via hole portion 204, and forming the third signal material layer 179 on the surface of the first panel structure 170b away from the first panel 140. Specifically, the third signal material layer 179 is formed on the surface of the first panel structure 170b away from the protective material layer 145. The first conductive portion 31 is electrically connected to the first signal material layer 144 and the third signal material layer 179.

[0151] It should be noted that the first conductive portion 31 can be formed in the same process as the third signal material layer 179, that is, in the process of depositing the third signal material layer 179, metal material can be simultaneously deposited in the first via 101 and the first via portion 204 to obtain the first conductive portion 31, or the first conductive portion 31 and the third signal material layer 179 can also be formed successively, for example, the first conductive portion 31 can be first formed in the first via 101 and the first via portion 204, and then the third signal material layer 179 can be formed on the surface of the first panel structure 170b away from the first panel 140.

[0152] See also Fig.19 , Fig.19 yes Fig.15 The structure diagram of step S37 in the method for preparing the display module is shown.

[0153] Step S37 , forming a second panel structure 170 c on a surface of the third signal material layer 179 away from the first panel structure 170 b .

[0154] See also Fig. 20 , Fig. 20 yes Fig.15 The structure diagram of step S38 in the method for preparing the display module is shown.

[0155] Step S38 , forming a second via portion 205 penetrating the second panel structure 170 c to form a second via hole 203 , thereby obtaining the panel layer structure 170 a .

[0156] Step S39, forming a second conductive portion 32 in the second via portion 205, and forming a second signal material layer 178 on a surface of the second panel structure 170c away from the third signal material layer 179, so as to obtain a conductive member 30 and a second panel 170, as shown in FIG. Fig.14 The second conductive portion 32 is electrically connected to the second signal material layer 178 and the third signal material layer 179 .

[0157] It should be noted that the second conductive portion 32 can be formed in the same process as the second signal material layer 178, that is, in the process of depositing the second signal material layer 178, metal material can be simultaneously deposited in the second via portion 205 to obtain the second conductive portion 32, or the second conductive portion 32 and the second signal material layer 178 can also be formed successively, for example, the second conductive portion 32 can be first formed in the second via portion 205, and then the second signal material layer 178 can be formed on the surface of the second panel structure 170c away from the third signal material layer 179.

[0158] It should be noted that, for different implementations, step S3, step S4 to step S6 are substantially the same. Fig.10 The second panel structure 170 is taken as an example to illustrate steps S4 to S6.

[0159] See also Figure 7 , Fig.10 and Fig.21 , Fig.21 yes Figure 7 The structure diagram of step S4 in the method for preparing the display module is shown.

[0160] Step S4, cutting the first panel 140 and the second panel 170, removing the first surplus panel 150 of the first panel 140 and the third surplus panel 190 of the second panel 170, to obtain the connection panel 10. Specifically, the first panel 140 and the second panel 170 can be cut into large shapes by laser cutting.

[0161] See also Figure 7 and Fig. 22 , Fig. 22 yes Figure 7 The structure diagram of step S5 in the method for preparing the display module is shown.

[0162] Step S5, the second portion 10b and the bent portion 10c of the connecting panel 10 in the first panel 140 are bent relative to the first portion 10a, so that the second portion 10b is located on the side of the first portion 10a away from the display panel 20, and is spaced apart from and arranged opposite to the first portion 10a, and the bent portion 10c is bent relative to the first portion 10a and the second portion 10b, and is located on the inner side of the peripheral side surface 202 of the display panel 20. The bent portion 10c is located in the display area 121.

[0163] It should be noted that, since the separation layer 80 is made of an easily separable and non-adhesive material, when the second portion 10b and the bending portion 10c are bent relative to the first portion 10a, they can be easily separated from the second panel 170, and the separation layer 80 will not affect the bending of the second portion 10b and the bending portion 10c relative to the first portion 10a. Exemplarily, after the second portion 10b and the bending portion 10c are bent relative to the first portion 10a, the separation layer 80 is still located on the surface of the second portion 10b and the bending portion 10c.

[0164] See also Figure 7 and Fig.23 , Fig.23 yes Figure 7 The structure diagram of step S6 in the method for preparing the display module is shown.

[0165] Step S6: the display driver 70 is mounted on the second portion 10b and electrically connected to the connection panel 10. Specifically, the display driver 70 is mounted on the side of the separation layer 80 away from the second portion 10b and electrically connected to the first signal layer 14. The display driver 70 can be mounted on the second portion 10b by a chip on plastic bonding (COP bonding) process.

[0166] Step S7, cutting the second panel 170, removing the second surplus panel 180 of the second panel 170, and obtaining the display panel 20 and the display module 120, as shown in FIG. Figure 5 Specifically, the second panel 170 may be cut by laser cutting. Exemplarily, the second panel 170 may be cut in a circular shape to obtain a display panel 20 in a disc shape.

[0167] In some other embodiments, the first panel 140 may not include the first margin panel 150, and the second panel 170 may not include the second margin panel 180 and the third margin panel 190. In this case, the method for preparing the display module may not include step S4 and step S7, and the remaining steps may be changed according to the structural adaptability of the connection panel 10 and the display panel 20, and will not be repeated here.

[0168] In the display module 120 shown in this embodiment, the display module 120 is split into two parts, namely a connection panel 10 and a display panel 20. The connection panel 10 is used to realize the combination with the display driver 70, and the display panel 20 is used to realize the display function of the display module 120, and the conductive member 30 is used to realize the signal transmission between the connection panel 10 and the display panel 20. The bending portion 10c in the connection panel 10 does not exceed the peripheral side surface 202 of the display panel 20, and is located in the display area 121. Not only is the bending of the bending portion 10c more free and elastic, but the existence of the bending portion 10c will not increase the width of the non-display area 122, and the border width of the display module 120 can be reduced, which helps to realize the narrow border design of the display module 120 and improve the appearance and screen-to-body ratio of the electronic device 1000.

[0169] The above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application; in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: including a connection panel, a display panel and a conductive member; The connection panel includes a first portion, a second portion and a bent portion. Along the thickness direction of the first portion, the second portion is located at one side of the first portion and is spaced apart from and arranged opposite to the first portion. The bent portion is connected between the first portion and the second portion and is bent relative to the first portion and the second portion. The connection panel includes a first signal layer. The first portion is provided with a first via hole. Along the thickness direction of the first portion, the first via hole penetrates at least a portion of the first portion and exposes the first signal layer. The display panel is located at a side of the first portion away from the second portion, and the peripheral side surface of the display panel is located outside the bent portion. The display panel includes a display layer structure and a second signal layer. The display layer structure is provided with a second via hole. Along the thickness direction of the display panel, the second via hole penetrates at least a portion of the display layer structure and is connected to the first via hole. The second signal layer is provided on a side of the display layer structure away from the first portion. The conductive member is disposed in the first via hole and the second via hole, and is electrically connected between the first signal layer and the second signal layer.

2. The display module according to claim 1, characterized in that: The display module has a display area and a non-display area. The non-display area is arranged around the display area, and the bending portion is located in the display area.

3. The display module according to claim 1 or 2, characterized in that: The display module further includes a display driver, which is installed on a side of the second portion away from the first portion and is electrically connected to the first signal layer.

4. The display module according to any one of claims 1 to 3, characterized in that: The second via hole penetrates the display layer structure along the thickness direction of the display panel.

5. The display module according to any one of claims 1 to 3, characterized in that: The second via hole includes a first via hole portion and the second via hole portion; The display layer structure comprises a first layer structure, a third signal layer, and a second layer structure, wherein the first layer structure is provided with the first via portion, and the first via portion penetrates the first layer structure along the thickness direction of the display panel and is connected with the first via hole, the third signal layer is provided on a side of the first layer structure away from the first portion, the second layer structure is provided on a side of the third signal layer away from the first layer structure, and is provided with the second via portion, the second layer structure is provided with the second via portion, and the second via portion penetrates the second layer structure along the thickness direction of the display panel; The conductive member includes a first conductive portion and a second conductive portion, the first conductive portion is arranged in the first via hole and the first via hole portion, and is electrically connected between the first signal layer and the third signal layer, and the second conductive portion is arranged in the second via hole portion, and is electrically connected between the second signal layer and the third signal layer.

6. The display module according to any one of claims 1 to 5, characterized in that: The connection panel further includes a first substrate and a protective layer. The first signal layer is disposed on one side of the first substrate. The protective layer is disposed on a side of the first signal layer away from the first substrate and covers the first signal layer. The first via penetrates the protective layer.

7. The display module according to any one of claims 1 to 6, characterized in that: The display module also includes a separation layer, which is arranged on the surfaces of the second portion and the bending portion, or the separation layer is arranged on the surface of the display panel facing the connecting panel and is arranged opposite to the bending portion, or part of the separation layer is arranged on the surfaces of the second portion and the bending portion, and part of the separation layer is arranged on the surface of the display panel facing the connecting panel and is arranged opposite to the bending portion.

8. The display module according to any one of claims 1 to 7, characterized in that: The signal transmitted by the second signal layer includes at least one of an ELVSS signal, an ELVDD signal, a GIP signal / / Demux signal, a source signal and a TP signal.

9. A method for preparing a display module, characterized in that: include: A connection panel is provided, wherein the connection panel comprises a first portion, a second portion and a bending portion, the bending portion is connected between the first portion and the second portion, the connection panel comprises a first signal layer, the first portion is provided with a first via hole, and along a thickness direction of the first portion, the first via hole penetrates at least a portion of the first portion and exposes the first signal layer; A display panel and a conductive member are formed on the connection panel, wherein the display panel includes a display layer structure and a second signal layer, the display layer structure is provided with a second via hole, and along the thickness direction of the display panel, the second via hole penetrates at least a portion of the display layer structure and is connected to the first via hole, the second signal layer is provided on a side of the display layer structure away from the first portion, and the conductive member is provided in the first via hole and the second via hole, and is electrically connected between the first signal layer and the second signal layer; The second part and the bending part are bent relative to the first part so that the second part is located on the side of the first part away from the display panel and is spaced apart from and opposite to the first part. The bending part is bent relative to the first part and the second part and is located on the inner side of the peripheral side of the display panel.

10. The method for preparing a display module according to claim 9, characterized in that: The step of forming a display panel and a conductive member on the connection panel includes: forming a display layer structure on the connection panel, wherein the display layer structure is provided with the second via hole, and the second via hole penetrates the display layer structure along the thickness direction of the display panel; The conductive member is formed in the first via hole and the second via hole, and the second signal layer is formed on a side of the display layer structure away from the connection panel.

11. The method for preparing a display module according to claim 9, characterized in that: The step of forming a display panel and a conductive member on the connection panel includes: forming a first layer structure on the connection panel, wherein the first layer structure is provided with a first via portion, and along the thickness direction of the display panel, the first via portion penetrates the first layer structure and is connected with the first via hole; forming a first conductive portion in the first via hole and the first via portion, and forming a third signal layer on a side of the first layer structure away from the connection panel, wherein the first conductive portion electrically connects the first signal layer and the third signal layer; A second layer structure is formed on a side of the third signal layer away from the first layer structure, wherein the second layer structure is provided with a second via portion, and the second via portion penetrates the second layer structure along a thickness direction of the display panel; A second conductive portion is formed in the second via portion, and the second signal layer is formed on a side of the second layer structure away from the third signal layer, wherein the second conductive portion electrically connects the second signal layer and the third signal layer.

12. The method for preparing a display module according to any one of claims 9 to 11, characterized in that: After the step of providing a connection panel and before the step of forming a display panel and a conductive member on the connection panel, the method for preparing the display module further includes: forming a separation layer on the connection panel, wherein the separation layer covers the second portion and the bending portion; The step of forming a display panel and a conductive member on the connection panel includes: the display panel covers the separation layer; In the step of bending the second part and the bending part relative to the first part, the display panel is separated from the second part and the bending part, and the separation layer is arranged on the surface of the second part and the bending part, or the separation layer is arranged on the surface of the display panel facing the connecting panel, or part of the separation layer is arranged on the surface of the second part and the bending part, and part of the separation layer is arranged on the surface of the display panel facing the connecting panel.

13. The method for preparing a display module according to any one of claims 9 to 12, characterized in that: The step of providing a connection panel includes: providing a first panel, wherein the first panel includes the connection panel and a first margin panel, and the first margin panel is arranged around the connection panel; The step of forming a display panel and a conductive member on the connection panel includes: forming a second panel on the connection panel, the second panel including the display panel, a second margin panel and a third margin panel, the second margin panel is arranged around the display panel, and the third margin panel is arranged around the second margin panel; After the step of forming a display panel and a conductive member on the connection panel and before the step of bending the second portion and the bent portion relative to the first portion, the method for preparing the display module further includes: Cutting the first panel and the second panel to remove the first surplus panel and the third surplus panel; After the step of bending the second portion and the bent portion relative to the first portion, the method for preparing the display module further includes: The second panel is cut to remove the second surplus panel.

14. The method for preparing a display module according to any one of claims 9 to 13, characterized in that: After the step of bending the second portion and the bent portion relative to the first portion, the method for preparing the display module further includes: installing a display driver on a side of the second portion away from the first portion and electrically connecting the display driver to the first signal layer.

15. An electronic device, characterized in that: The device comprises a processor and a display module as claimed in any one of claims 1 to 8, wherein the display module is electrically connected to the processor.

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