Optical module

Abstract

The optical module provided by the invention comprises a circuit board; the light receiving component is arranged on the circuit board and is used for receiving a receiving light signal comprising a plurality of wavelengths; wherein the light receiving part comprises a lens assembly, the lens assembly comprises a lens body, the lens body is provided with a containing groove, the bottom of the lens body is connected with the circuit board, and the containing groove and the circuit board form a containing cavity; one end of the lens body inputs and receives an optical signal, and a reflecting surface is arranged on the side wall of the accommodating groove and is used for reflecting the optical signal; the wave separator is arranged in the accommodating groove, and the wave separator receives the received optical signal and transmits the optical signal subjected to wave separation to the reflecting surface; and the light receiving chip is mounted on the circuit board and located in the accommodating cavity, and the light receiving chip receives the light signal reflected by the reflecting surface. According to the optical module provided by the invention, the packaging process of the optical receiving part is simple, so that the packaging of the optical receiving part is facilitated.

Description

Technical Field

[0001] The present disclosure relates to the technical field of optical fiber communication, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting photoelectric signals to each other. They are one of the key components in optical communication equipment and are at the core of optical communication.

[0003] At present, in order to improve the transmission rate of optical modules, multiple transmission channels are set in the optical modules, that is, the transmission capacity is increased through multi-channel design in the optical modules, thereby achieving the purpose of improving the transmission rate of the optical modules. For example, there are currently 4-channel and other multi-channel optical modules, in which the optical modules can receive optical signals of 4 wavelengths. As the number of transmission channels of optical modules increases, the number of devices involved will also increase, which puts higher requirements on the packaging of optical modules. Summary of the invention

[0004] The embodiments of the present disclosure provide an optical module, which facilitates the packaging of a light receiving component.

[0005] The optical module provided by the present disclosure includes:

[0006] Circuit boards;

[0007] A light receiving component, disposed on the circuit board, for receiving light signals including a plurality of wavelengths;

[0008] Wherein, the light receiving component comprises:

[0009] A lens assembly comprises a lens body, wherein a receiving groove is provided on the lens body, wherein the receiving groove is connected to the bottom of the lens body; wherein the bottom of the lens body is connected to the circuit board, so that the receiving groove and the circuit board form a receiving cavity; wherein an opening is provided at one end of the lens body, through which an optical signal is input and received, wherein a position of an end of the opening close to the receiving groove is lower than a position of a top surface of the receiving groove; and a reflecting surface is provided on a side wall of the receiving groove away from the opening, wherein the reflecting surface is used to reflect the optical signal;

[0010] A wave splitter, disposed in the receiving groove, the wave splitter receives the received optical signal and transmits the split optical signal to the reflecting surface;

[0011] A light receiving chip is mounted on the circuit board and located in the accommodating cavity, and the light receiving chip receives the receiving light signal reflected by the reflecting surface.

[0012] In the optical module provided by the present disclosure, the optical receiving component for receiving multi-wavelength optical signals includes a lens assembly, a wave splitter and an optical receiving chip; the wave splitter is arranged in the lens assembly, and the bottom of the lens assembly is connected to the circuit board to form a receiving cavity with the circuit board; the optical receiving chip is arranged in the receiving cavity and mounted on the circuit board. The received optical signal is transmitted to the wave splitter through the opening at one end of the lens body, and is transmitted to the reflecting surface after being split by the wave splitter, and the reflecting surface reflects and transmits the optical signals of different wavelengths to the corresponding optical receiving chip. In the optical module provided by the present disclosure, the wave splitter is assembled with a lens assembly and the turning transmission of the optical signal is realized through the lens assembly, so that the components involved in the optical receiving component are reduced, and the packaging process of the optical receiving component is simplified to facilitate the packaging of the optical receiving component. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0014] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure;

[0015] Figure 2 A partial structural diagram of a host computer according to some embodiments of the present disclosure;

[0016] Figure 3 A schematic diagram of the structure of an optical module provided according to some embodiments of the present disclosure;

[0017] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0018] Figure 5 A schematic diagram of the structure of a light receiving component provided according to some embodiments of the present disclosure;

[0019] Figure 6 A schematic diagram of a partial structure of a light receiving component provided according to some embodiments of the present disclosure;

[0020] Figure 7 A schematic diagram of the internal structure of another optical module is provided according to some embodiments of the present disclosure;

[0021] Figure 8 for Figure 7 Schematic diagram of the decomposition of

[0022] Fig. 9 A schematic diagram of a lens assembly according to some embodiments of the present disclosure Figure 1 ;

[0023] Fig.10 A schematic diagram of the structure of another lens assembly provided according to some embodiments of the present disclosure Figure 2 ;

[0024] Fig.11 A cross-sectional view of a lens assembly is provided according to some embodiments of the present disclosure;

[0025] Fig.12 A cross-sectional view of an assembly of a lens assembly and a circuit board according to some embodiments of the present disclosure;

[0026] Fig.13 A schematic diagram of a partial structure of a lens body provided according to some embodiments of the present disclosure;

[0027] Fig.14 A diagram showing a lens assembly in use according to some embodiments of the present disclosure;

[0028] Fig.15 A cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure;

[0029] Fig.16 A cross-sectional view of a light receiving component provided according to some embodiments of the present disclosure;

[0030] Fig.17 A cross-sectional view of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0031] Fig.18 A schematic diagram of the structure of a lens assembly in a COB packaged optical module Figure 1 ;

[0032] Fig.19 A schematic diagram of the structure of a lens assembly in a COB packaged optical module Figure 2 . DETAILED DESCRIPTION

[0033] The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0034] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0035] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0036] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0037] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0038] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0039] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0040] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0041] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0042] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0043] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0044] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is a schematic diagram of an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and 4 As shown, the optical module 200 includes a shell, a circuit board 300, a light emitting component 400 and a light receiving component 500 disposed in the shell. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0045] The shell comprises an upper shell 201 and a lower shell 202 . The upper shell 201 covers the lower shell 202 to form the above shell with two openings. The outer contour of the shell is generally a square body.

[0046] In some embodiments of the present disclosure, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0047] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0048] The direction of the line connecting the two openings 203 and 204 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 ( Figure 3 The opening 204 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200. The opening 203 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port and is inserted into the host computer 100 (for example, an optical network terminal); the opening 204 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0049] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted to facilitate the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the shell, and the upper shell 201 and the lower shell 202 form a package protection for these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400, and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to the automated production.

[0050] In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation.

[0051] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing, and the unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0052] Exemplarily, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0053] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting Amplifier, LIA), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, and digital signal processing (Digital Signal Processing, DSP) chips.

[0054] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0055] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions where the number of pins is large. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0056] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger. In some embodiments, at least one of the light emitting component or the light receiving component can be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 can be disposed on the surface of the circuit board 300 or on the side of the circuit board 300.

[0057] In some embodiments, the optical transmitting component 400 is configured to transmit an optical signal, and the optical receiving component 500 is configured to receive an optical signal. Exemplarily, the optical transmitting component 400 and the optical receiving component 500 are combined together to form an integrated optical transceiver component.

[0058] In some embodiments, the light emitting component 400 or the light receiving component 500 is physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through a corresponding flexible circuit board or electrical connector.

[0059] Figure 5 FIG. 1 is a schematic diagram of the structure of a light receiving component provided according to some embodiments of the present disclosure. Figure 5 As shown, the optical receiving component 500a includes a housing 501 and a cover plate 502, and the cover plate 502 covers and connects the housing 501. The cover plate 502 covers the housing 501 to form a receiving cavity, and a light receiving component for receiving an optical signal is arranged in the receiving cavity, and the light receiving component includes a collimating lens, a turning prism, a focusing lens, and a light receiving chip, etc. An electrical connector 503 is arranged at the end of the housing 501, and the electrical connector 503 is used to realize the electrical connection between the optical receiving component and the circuit board 300.

[0060] Figure 6 is a partial structural schematic diagram of a light receiving component provided according to some embodiments of the present disclosure, Figure 6 The figure shows a structure of a light receiving component after removing the cover plate. Figure 6 As shown, a light receiving component 504 is disposed in the inner cavity of the housing 501 , and the light receiving component 504 includes a collimating lens, a wave splitter, a turning prism, a focusing lens, a light receiving chip, a transimpedance amplifier, and the like.

[0061] Figure 5 and Figure 6 A light receiving component of a micro-optical packaging structure in the optical module displayed, combined with Figure 5 and Figure 6As can be seen from the structure of the light receiving component 500a shown, the light receiving component 500a involves many components, which will make the management and control relatively complicated. In addition, during the assembly process of the light receiving component 500a, the collimating lens, the wave splitter, the turning prism, the focusing lens, the light receiving chip, the transimpedance amplifier, etc. need to be assembled to the preset position in a preset order. The assembly process is relatively complicated and has high requirements for optical path coupling.

[0062] Figure 7 To provide a schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure, Figure 8 for Figure 7 Schematic diagram of the decomposition of Figure 7 and Figure 8 Another assembly form of the light receiving component and the circuit board is shown in FIG. Figure 7 As shown, in some embodiments, the optical module includes a light receiving component 500b, and the light receiving component 500b is mounted on the circuit board 300. The light receiving component 500b includes a lens assembly 510 and a light receiving chip 520, and the light receiving chip 520 is mounted on the surface of the circuit board 300. The bottom of the lens assembly 510 is connected to the surface of the circuit board 300 to cover the light receiving chip 520 in the accommodating cavity formed by the lens assembly 510 and the circuit board 300; the lens assembly 510 is used to focus and turn the received optical signal. In some embodiments, the light receiving component 500b is set at the end of the circuit board 300. Exemplarily, the lens assembly 510 is integrally formed using polyetherimide (PEI).

[0063] In some embodiments, the light receiving component 500b further includes a transimpedance amplifier 530, which is disposed on the side of the light receiving chip 520 and mounted on the surface of the circuit board 300. In some embodiments, the transimpedance amplifier 530 is covered under the lens assembly 510, and the transimpedance amplifier 530 is wired to the light receiving chip 520.

[0064] Fig. 9 A schematic diagram of a lens assembly according to some embodiments of the present disclosure Figure 1 , Fig.10 A schematic diagram of the structure of another lens assembly provided according to some embodiments of the present disclosure Figure 2 , Fig.11 A cross-sectional view of a lens assembly is provided according to some embodiments of the present disclosure. Fig.12 FIG. 1 is a cross-sectional view of an assembly of a lens assembly and a circuit board according to some embodiments of the present disclosure. Figure 9-12As shown, the lens assembly 510 includes a lens body 511, and a receiving groove 512 is provided at the bottom of the lens body 511, and the receiving groove 512 is used to carry and assemble other devices. The bottom of the lens body 511 is connected to the circuit board 300, so that the receiving groove 512 and the circuit board 300 form a receiving cavity, and the receiving cavity is used to carry other devices and facilitate the arrangement of other devices. Exemplarily, the optical receiving chip 520 and the transimpedance amplifier 530 are located in the receiving cavity, and the receiving groove 512 is convenient for avoiding the optical receiving chip 520 or the transimpedance amplifier 530; the splitter and the like are assembled and connected to the receiving groove 512.

[0065] In some embodiments, Fig.12 As shown, an opening 513 is provided at one end of the lens body 511; one end of the opening 513 penetrates the end surface of one end of the lens body 511, and the other end of the opening 513 extends in the opposite direction of the receiving groove 512. The position of the end of the opening 513 close to the receiving groove 512 is lower than the position of the top surface of the receiving groove 512, so that the optical receiving signal input through the opening 513 is transmitted to the receiving groove 512, and then the optical receiving signal can be transmitted to the components mounted in the receiving groove 512 for transmission.

[0066] In some embodiments, a collimating lens surface 5131 is provided on the end surface of the other end of the opening 513, and the collimating lens surface 5131 is used to collimate the optical signal in the direction of the receiving groove 512. Exemplarily, the opening 513 extends in the direction parallel to the circuit board 300 in the direction of the receiving groove 512, and the position of the central axis of the opening 513 is lower than the position of the top surface of the receiving groove 512; the collimating lens surface 5131 is a spherical lens.

[0067] In some embodiments, the lens assembly 510 further includes a fiber adapter 514, one end of which is used to connect to an optical fiber, and the other end of which is connected to the lens body 511, and the fiber adapter 514 is connected to the opening 513, so that the received optical signal is transmitted to the opening 513 through the fiber adapter 514. In some embodiments, the fiber adapter 514 can be connected to an optical fiber inside the optical module, or to an optical fiber outside the optical module; when the fiber adapter 514 is used to connect to an optical fiber outside the optical module, the lens assembly 510 is connected to the end of the surface of the circuit board 300, so that the fiber adapter 514 is located at the optical port of the optical module.

[0068] like Figure 10-12As shown, a reflective surface 515 is formed on the side wall of the receiving groove 512, and the reflective surface 515 is used to change the transmission direction of the optical signal. The reflective surface 515 is located on the side wall of the receiving groove 512 away from the hole 513. In some embodiments, the reflective surface 515 turns and converges the optical signal to transmit the corresponding optical receiving chip 520. Exemplarily, the reflective surface 515 is an off-axis parabola, which turns the optical axis of the optical signal from parallel to the circuit board 300 to obliquely transmitted to the circuit board 300, and converges the optical signal in the process of turning the optical signal. In some embodiments, the focus of the reflective surface 515 is located on the photosensitive surface of the optical receiving chip 520. By adjusting the parameters of the reflective surface 515, the focus position of the reflective surface 515 can be adjusted, thereby changing the optical path interval when the reflective surface 515 reflects the optical signal, so as to adapt to different optical receiving chips 520, to adapt to optical receiving chips with different channel intervals such as 250 / 500 / 750um, so that the optical receiving component 500b has a high degree of commonality. In the embodiment of the present disclosure, using an off-axis parabolic reflecting surface 515 helps to save the size of the lens body 511 .

[0069] Fig.13 FIG. 1 is a schematic diagram of a partial structure of a lens body provided according to some embodiments of the present disclosure. Fig.13 As shown, a groove 517 is formed on the lens body 511, and a first reflection surface 518 is formed at the bottom of the groove 517. The first reflection surface 518 is located above the light receiving chip 520, and the first reflection surface 518 is used to reflect the optical signal in the direction of the light receiving chip 520. Exemplarily, a focusing lens 519 is provided at the bottom of the lens body 511, and the focusing lens 519 is located on the optical signal transmission optical path from the first reflection surface 518 to the light receiving chip 520, and the focusing lens 519 is used to converge the optical signal reflected by the first reflection surface 518 and transmit it to the light receiving chip 520.

[0070] In some embodiments, the receiving groove 512 includes a first receiving groove 5121 and a second receiving groove 5122, wherein the second receiving groove 5122 is located at the edge of the first receiving groove 5121 and the second receiving groove 5122 is connected to the first receiving groove 5121; Fig.12 In the direction shown, the bottom surface of the second receiving groove 5122 is higher than the bottom surface of the first receiving groove 5121. The second receiving groove 5122 is used to assemble the connecting device, and the emitting surface 515 is set on the side wall of the second receiving groove 5122; the first receiving groove 5121 is used to adjust the thickness of the lens body 511 and avoid the light receiving chip 520 or the transimpedance amplifier 530. Exemplarily, the depth of the first receiving groove 5121 is less than the depth of the second receiving groove 5122.

[0071] In some embodiments, a glue dispensing groove 5123 is provided on the bottom surface of the second receiving groove 5122, and the glue dispensing groove 5123 is used to store glue. Exemplarily, the outer contour of the glue dispensing groove 5123 is circular, but of course the outer contour of the glue dispensing groove 5123 in the embodiment of the present disclosure is not limited to a circle.

[0072] In some embodiments, an overflowing glue groove 5124 is provided at the edge of the glue dispensing groove 5123, and the overflowing glue groove 5124 is used to store the glue overflowing from the glue dispensing groove 5123. Exemplarily, the overflowing glue groove 5124 is annular, and the overflowing glue groove 5124 evenly surrounds the edge of the glue dispensing groove 5123, so as to more fully store the glue overflowing from the glue dispensing groove 5123.

[0073] In some embodiments, an avoidance groove 5125 is provided at the edge of the second receiving groove 5122, and the avoidance groove 5125 is used to facilitate the assembly of components into the second receiving groove 5122. Fig.10 and Fig.11 In the direction shown, the avoidance groove 5125 is arranged on the side wall parallel to the direction from one end to the other end of the lens body 511 ; the second receiving groove 5122 is widened by the avoidance groove 5125 .

[0074] In some embodiments, a vent hole 516 is provided in the receiving groove 512, and the vent hole 516 connects the opening 513 and the receiving groove 512. The vent hole 516 is used to balance the air pressure of the opening 513 and the air pressure of the receiving groove 512. Exemplarily, when the optical fiber adapter 514 is plugged with an optical fiber, the air in the optical fiber adapter 514 is transmitted to the receiving groove 512 through the vent hole 516, thereby facilitating the insertion of the optical fiber into the optical fiber adapter 514. Exemplarily, the vent hole 516 is provided on the bottom surface of the first receiving groove 5121.

[0075] In some embodiments, the optical receiving component 500b further includes a wave splitter, which is used to split the light signal according to its wavelength. Exemplarily, the wave splitter is disposed in the through-hole formed by the lens assembly 510 and the circuit board 300, and a beam of received light signals including four wavelengths (such as 1271nm / 1291nm / 1311nm / 1331nm) is transmitted to the lens body 511 through the optical fiber adapter 514, and the optical receiving component 500b is used to receive the light signals of the four wavelengths; the received light signal is transmitted to the wave splitter, so as to be split according to the wavelength of the light signal in the received light signal through the wave splitter, and then the split light signal is transmitted to the reflecting surface 515. Of course, in some embodiments, the optical receiving component 500b is not limited to receiving a beam of received light signals including four wavelengths, but can also receive a beam of received light signals including two, three, etc. wavelengths.

[0076] Fig.14 is a diagram of a lens assembly in use according to some embodiments of the present disclosure, Fig.151 is a cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure. Fig.14 and Fig.15 As shown, the optical receiving component 500b further includes a splitter 540, which is disposed in the receiving groove 512; the top of the splitter 540 is connected to the bottom surface of the receiving groove 512, so that the lens body 511 supports and connects the splitter 540, and the splitter 540 is suspended above the circuit board 300. The splitter 540 is assembled and connected to the lens body 511, which facilitates the assembly and fixation of the splitter 540. In some embodiments, the splitter 540 can adopt a demultiplexing component (DeMUX).

[0077] In some embodiments, the top surface of the splitter 540 is fixedly connected to the bottom surface of the second receiving groove 5122 by glue, and the top surface of the splitter 540 covers the glue dispensing groove 5123 and the glue overflow groove 5124; the avoidance groove 5125 is used to facilitate the placement of the splitter 540 in the receiving groove 512.

[0078] Fig.16 is a cross-sectional view of a light receiving component provided according to some embodiments of the present disclosure, Fig.17 is a cross-sectional view of the internal structure of an optical module provided according to some embodiments of the present disclosure, Fig.16 and Fig.17 A transmission optical path for receiving an optical signal is shown in FIG. Fig.16 and Fig.17 As shown, the bottom of the lens body 511 is connected to the circuit board 300, the optical receiving chip 520 and the transimpedance amplifier 530 are mounted on the surface of the circuit board 300, and the optical receiving chip 520 and the transimpedance amplifier 530 are arranged below the lens body 511; the transimpedance amplifier 530 is located on the side of the optical receiving chip 520 away from the optical fiber adapter 514, and the transimpedance amplifier 530 is located below the reflecting surface 515.

[0079] The received optical signal is transmitted to the optical fiber adapter 514, transmitted to the opening 513 through the optical fiber adapter 514, and collimated by the collimating lens surface 5131 and transmitted to the light input port of the wave splitter 540. The wave splitter 540 splits the received optical signal according to the wavelength of the received optical signal (for example, the received optical signal is divided into 4 beams). After the splitting, the optical signal is output through the light output port of the wave splitter 540 and transmitted to the reflecting surface 515, and is reflected and converged by the reflecting surface 515 and transmitted to the corresponding optical receiving chip 520. In the process of the reflecting surface 515 converging and transmitting the optical signal to the optical receiving chip 520, the optical axis of the optical signal is tilted. When the optical signal is reflected at the end face of the optical receiving chip 520, the reflected optical signal will not return along the input optical axis of the optical signal, effectively reducing the return loss caused by the reflected optical signal.

[0080] Therefore, the optical receiving component 500b provided in the embodiment of the present disclosure intersects with the optical receiving component 500a provided in the above-mentioned embodiment, and uses a lens assembly 510 to integrate the functions of collimating, turning, and converging the optical path through the lens assembly 510, and can be directly assembled with a collimator 540, so that the optical receiving component 500b can construct a beam of optical receiving signals including multiple wavelengths, relatively reduce the number of components, simplify the packaging process of the optical receiving component 500b, reduce the difficulty of optical path coupling, facilitate the packaging of the optical receiving component 500, and improve the assembly efficiency of the optical receiving component 500.

[0081] In the field of optical modules, there is an optical module with a chip on board (COB) structure, which also involves a lens assembly. Fig.18 A schematic diagram of the structure of a lens assembly in a COB packaged optical module Figure 1 , Fig.19 A schematic diagram of the structure of a lens assembly in a COB packaged optical module Figure 2 , the lens assembly is used to transmit a receiving optical signal of a wavelength and / or a transmitting optical signal of a wavelength.

[0082] like Fig.18 and Fig.19 As shown, the end of the lens assembly 700 is provided with an optical port 710 for passing an optical signal; the top of the lens assembly 700 is provided with a first groove 720 and the bottom is provided with a second groove 730. A plurality of optical surfaces are formed inside the first groove 720 to reflect or refract the received optical signal through the optical surface, so as to achieve the purpose of changing the transmission direction of the received optical signal. The lens assembly 700 is arranged on a circuit board, and the second groove 730 is used to avoid the optical device arranged on the circuit board or to facilitate the cooperation with the optical receiving chip. In order to ensure that the optical signal is transmitted between the optical port 710 and the optical surface in the first groove 720, the depth of the second groove 730 will not reach the position of the optical port 710, and then the bottom of the lens assembly 700 can only be provided with a groove with a relatively shallow depth, and no other devices will be arranged in the groove formed at the bottom of the lens assembly 700 except for the electrical device mounted on the circuit board. In addition, the lens assembly 700 changes the transmission direction of the optical signal through the optical surface in the first groove 720, so that when the lens assembly 700 is used to receive an optical signal, it is only used for receiving an optical signal of a single wavelength. Therefore, the lens assembly 510 in the light receiving component 500b provided in the embodiment of the present disclosure is a technical breakthrough of the lens assembly in the COB packaged optical module, and it is not easy to conceive of the lens assembly 510 based on the lens assembly in the COB packaged optical module.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Circuit boards; A light receiving component, disposed on the circuit board, for receiving light signals including a plurality of wavelengths; Wherein, the light receiving component comprises: A lens assembly comprises a lens body, wherein a receiving groove is provided on the lens body, wherein the receiving groove is connected to the bottom of the lens body; wherein the bottom of the lens body is connected to the circuit board, so that the receiving groove and the circuit board form a receiving cavity; wherein an opening is provided at one end of the lens body, through which an optical signal is input and received, wherein a position of an end of the opening close to the receiving groove is lower than a position of a top surface of the receiving groove; and a reflecting surface is provided on a side wall of the receiving groove away from the opening, wherein the reflecting surface is used to reflect the optical signal; A wave splitter, disposed in the receiving groove, the wave splitter receives the received optical signal and transmits the split optical signal to the reflecting surface; A light receiving chip is mounted on the circuit board and located in the accommodating cavity, and the light receiving chip receives the receiving light signal reflected by the reflecting surface.

2. The optical module according to claim 1, characterized in that: The reflecting surface is an off-axis parabola, which reflects and converges the optical signal and makes the optical axis of the optical signal reflected by the reflecting surface non-parallel to the receiving optical axis of the optical receiving chip.

3. The optical module according to claim 1, characterized in that: The opening extends in a direction parallel to the circuit board and in the direction of the receiving groove; A collimating lens surface is arranged on the end surface of the opening, and the collimating lens surface is used to collimate the received optical signal toward the optical inlet of the splitter.

4. The optical module according to claim 1, characterized in that: The receiving groove comprises a first receiving groove and a second receiving groove, and the opening area of ​​the first receiving groove is larger than the opening area of ​​the second receiving groove; The first receiving groove is located at the edge of the second receiving groove and the depth of the first receiving groove is less than the depth of the second receiving groove; The top surface of the splitter is connected to the top surface of the second receiving groove, so that the splitter is arranged in the second receiving groove, and the light receiving chip is located in the first receiving groove.

5. The optical module according to claim 4, characterized in that: An avoidance groove is arranged on the side of the second containing groove; a glue dispensing groove and a glue overflow groove are arranged on the top surface of the second containing groove, the glue overflow groove surrounds the side of the glue dispensing groove, and the wave splitter covers the glue dispensing groove and the glue overflow groove.

6. The optical module according to claim 4, characterized in that: A vent hole is arranged on the bottom of the first containing groove, and the vent hole connects the first containing groove and the opening.

7. The optical module according to claim 1, characterized in that: The lens assembly also includes a fiber optic adapter, which is connected to one end of the lens body and communicates with the opening.

8. The optical module according to claim 1, characterized in that: The light receiving component further includes a transimpedance amplifier, which is mounted on the circuit board; the transimpedance amplifier is located in the accommodating cavity and below the reflecting surface.

9. The optical module according to claim 1, characterized in that: The opening is close to the side of the lens body, and the optical signal received by the light receiving component includes four wavelengths.

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