Low-profile dual-polarized magnetoelectric dipole antenna realized on standard multi-layer PCB (printed circuit board) technology

Abstract

The invention provides a low-profile dual-polarized magnetoelectric dipole antenna which is realized on the basis of a standard multilayer PCB (Printed Circuit Board) technology, the antenna is realized by stacking antenna array elements on a standard multilayer PCB, and the antenna array elements are of nine-layer structures which are sequentially arranged from top to bottom; the antenna array element is composed of a top metal layer, two cross-polarized electric dipoles, a magnetic dipole, a through hole, a defected ground plane (DGS), an iron core, a prepreg plate layer, a feed unit and a ground plane layer. The antenna is thin in thickness, balanced in structure, light in weight, easy to manufacture and high in yield. High isolation between the elements can generate high beam scanning performance. The method is very suitable for a packaging technology and a standard PCB technology, and is an attractive candidate for millimeter wave application in a fifth generation (5G) mobile system. The designed low-profile dual-polarization magnetoelectric dipole antenna is simulated, and the result shows that the two polarization radiation modes of the infinite array uniformly cover the light beam steering range, and blind spots do not appear in the phased array.

Description

Technical Field

[0001] The invention belongs to the technical field of antenna design, and in particular relates to a low-profile dual-polarized magneto-electric dipole antenna array element and an antenna implemented on a standard multi-layer PCB technology. Background Art

[0002] The fifth generation of mobile communication networks (5G) will provide unprecedented data rate levels through a dense network infrastructure based on high-capacity small cells. In this case, it is critical to allocate mobile broadband links in the spectrum between 24 and 29.5 GHz. In this frequency range, the coverage requirements for both user terminals and base stations are very high.

[0003] 5G high-band antenna modules require a highly integrated and complex architecture, of which three are key elements: 1) RF integrated circuits (ICs) that support beamforming, signal amplification, and frequency conversion functions; 2) antenna array elements; and 3) integration and packaging technologies. However, the packaging domain generally does not allow the implementation of broadband antennas compatible with 5G requirements. To cope with this limitation, different solutions have been proposed, mainly increasing the substrate thickness and using low relative dielectric constant materials. However, millimeter-wave phased arrays require tight integration of different components, and the most common approach is to distribute the different components across multiple technology areas, namely IC, packaging, and PCB.

[0004] Dual-polarized ME antennas are very attractive in certain applications because of their wide operating bandwidth and nearly identical radiation patterns in the E-plane and H-plane. Several attempts have been made recently to reduce the profile of such antennas. Some of them use 3D metal structures to achieve miniaturization of the antenna while maintaining its performance advantages through carefully designed metal structures. Others use printed circuit board (PCB) technology to layout the antenna circuit on the PCB to reduce the overall profile height of the antenna.

[0005] Therefore, it is of great research interest to design and implement dual-polarized 5G phased arrays on standard multi-layer PCB technology, applying several low-frequency techniques to achieve broadband operation, allowing 5G requirements to be met without increasing the thickness of the dielectric core. In addition, the design of such antennas can also maintain a high degree of isolation.

[0006] In view of this, it is of great significance to propose a low-profile dual-polarized magneto-electric dipole antenna implemented on standard multi-layer PCB technology. Summary of the invention

[0007] In order to study and solve the design of radiating elements of phased arrays for 5G wireless access applications so that such antennas meet the coverage requirements of 5G micro cells, the present invention provides a low-profile dual-polarized magneto-electric dipole antenna implemented on standard multi-layer PCB technology to solve the above-mentioned technical defects.

[0008] In the first aspect, the present invention proposes a low-profile dual-polarized magneto-electric dipole antenna element, which is a nine-layer structure arranged in sequence from top to bottom, and consists of a top metal layer, two cross-polarized electric dipoles, a magnetic dipole, a through hole, a defective ground plane DGS, an iron core, a prepreg board layer, a feed unit and a ground plane layer; the top metal layer is coupled and connected with the two cross-polarized electric dipoles and the magnetic dipole; the electric dipole is used to achieve horizontal polarization and vertical polarization, and is connected to the feed unit through a microstrip line; the magnetic dipole interacts with the iron core, The iron core is used to enhance the magnetic field generated by the magnetic dipole; the through hole is used to achieve electrical connection between different layers; the defective ground plane DGS and the electric dipole and magnetic dipole interact with each other through the electromagnetic field; the prepreg board layer serves as a dielectric layer to provide mechanical support and insulation functions for the antenna array element; the feeding unit is used to introduce external RF signals into the antenna array element and distribute power to the electric dipole and magnetic dipole; the ground plane layer is used for the feeding unit to cooperate with the feeding unit to achieve impedance matching to reduce signal reflection, and cooperate with the defective ground plane DGS to jointly optimize the performance of the grounding system.

[0009] By adopting the above technical solution, the top metal layer uses four patch elements and edge-to-edge capacitor coupling to realize cross-polarized electric dipoles, the four blind holes connected by the patch realize magnetic dipoles, the small holes are fed into the bottom short wall of the magnetic dipole, and the slots on the bottom connection plane produce a loading effect at the end of the waveguide, increasing the current path of the magnetic dipole. In the entire stack, four dielectric layers are used for antenna and feeding structures. The core layer is the first iron core layer from top to bottom, which is dedicated to the realization of radiation elements. The thickness of this layer is limited to 508 to reduce the thickness of the antenna, making it structurally balanced, light in weight, easy to manufacture, and with high yield.

[0010] Preferably, the top metal layer is located in the first layer, and the top metal layer is evenly divided into four patch elements of the same size by an edge gap with a width of d. An intermediate gap with a width of W2 is arranged between two pairs of patch elements located on the upper and lower sides. The patch elements are cut at angles away from each other to form edge portions, and the four patch elements and the edge portions are coupled with edge capacitance to realize the cross-polarized electric dipole.

[0011] Further preferably, circular holes with a diameter of r2 are provided on the sides of the patch elements that are close to each other, and the interval between the circular holes on the left and right sides is L2; ​​the length and width of the top metal layer are L1 and W1 respectively, wherein L1=4.1mm, L2=1mm, W1=5.05mm, W2=0.75mm, r2=0.6mm, d=0.2mm.

[0012] Further preferably, the iron core includes a first core layer and a second core layer, the first core layer is located in the second layer, the second core layer is located in the sixth layer, and four blind holes corresponding to the circular holes are provided on the first core layer, and the blind holes are connected to the circular holes to realize the magnetic dipole.

[0013] Further preferably, the through hole includes an edge through hole arranged at the edge of the first core layer, the edge through hole is symmetrically arranged, the diameter of the edge through hole is r1, r1=0.9mm, and transition sheets are arranged on the top and bottom of the edge through hole.

[0014] Preferably, the defective ground plane DGS is located on the third layer, a cross groove portion is provided in the middle of the defective ground plane DGS, the cross groove portion is symmetrical on the left and right, and rectangular truncation portions are provided at both ends of the cross groove portion. Four circular holes are also provided on the edge of the cross groove portion on the defective ground plane DGS.

[0015] Preferably, the feeding unit comprises a horizontally polarized balanced stripline located on the fifth layer and a vertically polarized balanced stripline located on the seventh layer, and the balanced striplines are in a U-shaped feeding shape.

[0016] Preferably, the prepreg board layers are located on the fourth layer and the eighth layer respectively, and the ground plane layer is located on the ninth layer.

[0017] Further preferably, the height of the top metal layer is 35μm, the height of the magnetic dipole is 561μm, the height of the through hole is 955μm, and the height of the defect ground plane DGS is 18μm; the height of the first core layer is 508μm, the height of the second core layer is 127μm, and the first core layer and the second core layer are both set to Neltec NX9240 core with a relative dielectric constant of 2.4; the height of the vertically polarized balanced stripline is 35μm, and the height of the horizontally polarized balanced stripline is 18μm; the height of the prepreg board layer is 107μm, which is set to Isola MT77-1078 prepreg with a relative dielectric constant of 2.95, and the height of the ground plane layer is 35μm.

[0018] In a second aspect, an embodiment of the present invention further provides a low-profile dual-polarized magneto-electric dipole antenna implemented on a standard multi-layer PCB technology, comprising an antenna array element as described in the first aspect, wherein the antenna is implemented by stacking the antenna array elements on a standard multi-layer PCB, and the function of the antenna is realized by the coordinated work of the antenna array elements.

[0019] Through the above technical scheme, a new low-profile dual-polarized magneto-electric dipole antenna structure is proposed, which allows array elements with wide beam scanning performance and is competitive in packaging technology and standard PCB process.

[0020] Compared with the prior art, the beneficial results of the present invention are:

[0021] The antenna is stacked in the first five metal layers of the PCB. In order to alleviate the blind spots caused in wide beam steering applications, a defective ground plane structure (DGS) is used, which greatly reduces mutual coupling. The antenna is thin, structurally balanced, lightweight, easy to manufacture, and has a high yield rate. The high isolation between components can produce higher beam scanning performance. The design proposed in the present invention is very suitable for packaging technology and standard PCB processes, and is an attractive candidate for millimeter wave applications in fifth-generation (5G) mobile systems. The designed low-profile dual-polarized magneto-electric dipole antenna was simulated, and the results showed that the radiation patterns of the two polarizations of its infinite array evenly cover the beam steering range, and there will be no blind spots in the phased array. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate the embodiments and are used together with the description to explain the principles of the present invention. It will be easy to recognize other embodiments and many expected advantages of the embodiments because they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale with each other. The same reference numerals refer to corresponding similar parts.

[0023] Figure 1 A front view of a low-profile dual-polarized magneto-electric dipole antenna array element according to an embodiment of the present invention;

[0024] Figure 2 A side view of a low profile dual polarized magneto-electric dipole antenna according to an embodiment of the present invention;

[0025] Figure 3 A top view of a low-profile dual-polarized magneto-electric dipole antenna according to an embodiment of the present invention;

[0026] Figure 4 A layered perspective view of a low-profile dual-polarized magneto-electric dipole antenna array element according to an embodiment of the present invention;

[0027] Figure 5 The S-parameter diagram of the low-profile dual-polarized magneto-electric dipole antenna array element of an embodiment of the present invention;

[0028] Figure 6 It is a schematic diagram of the effect of the horizontally polarized radiation pattern of the low-profile dual-polarized magneto-electric dipole antenna of an embodiment of the present invention embedded in an infinite array;

[0029] Figure 7 It is a schematic diagram of the effect of the vertically polarized radiation pattern of the low-profile dual-polarized magneto-electric dipole antenna of an embodiment of the present invention embedded in an infinite array.

[0030] Description of the drawings: 100, top metal layer; 131, magnetic dipole; 160, through hole; 200, first core layer; 300, defective ground plane DGS; 400, prepreg board layer; 500, horizontally polarized balanced stripline; 600, second core layer; 700, vertically polarized balanced stripline; 800, prepreg board layer; 900, ground plane layer. DETAILED DESCRIPTION

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the relevant invention are shown in the accompanying drawings.

[0032] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0033] In a first aspect, an embodiment of the present invention discloses a low-profile dual-polarized magneto-electric dipole antenna array element, such as Figure 1 As shown, the antenna array element is a nine-layer structure arranged in sequence from top to bottom, and the antenna array element consists of a top metal layer 100, two cross-polarized electric dipoles, a magnetic dipole 131, a through hole 160, a defective ground plane DGS 300, an iron core, a prepreg board layer (400, 800), a feed unit and a ground plane layer 900.

[0034] In a second aspect, an embodiment of the present invention further discloses a low profile dual-polarized magneto-electric dipole antenna implemented on a standard multi-layer PCB technology, such as Figure 2 As shown, it includes the antenna array element as in the first aspect, the antenna is realized by stacking the antenna array elements on a standard multi-layer PCB, and the function of the antenna is realized by the coordinated work of the antenna array elements.

[0035] The embodiments of the present invention disclose a new low-profile dual-polarized magneto-electric dipole antenna structure that allows array elements with wide beam scanning performance and is competitive in packaging technology and standard PCB processes.

[0036] Furthermore, the top metal layer 100 is coupled and connected with two cross-polarized electric dipoles and the magnetic dipole 131; the electric dipole is used to achieve horizontal polarization and vertical polarization, and is connected to the feeding unit through a microstrip line; the magnetic dipole 131 interacts with the iron core, and the iron core is used to enhance the magnetic field generated by the magnetic dipole 131; the through hole 160 is used to achieve electrical connection between different layers; the defective ground plane DGS300 and the electric dipole and magnetic dipole 131 interact with each other through the electromagnetic field; the prepreg board layer 400 serves as a dielectric layer to provide mechanical support and insulation functions for the antenna array element; the feeding unit is used to introduce external RF signals into the antenna array element and distribute power to the electric dipole and magnetic dipole 131; the ground plane layer 900 is used for the feeding unit to cooperate with the impedance matching to reduce signal reflection, and cooperates with the defective ground plane DGS300 to jointly optimize the performance of the grounding system.

[0037] By adopting the above technical solution, the top metal layer 100 uses four patch elements and edge-to-edge capacitor coupling to realize cross-polarized electric dipoles, the four blind holes connected by the patch realize magnetic dipoles 131, the small holes are fed into the bottom short wall of the magnetic dipole 131, and the slots on the bottom contact plane produce a loading effect at the end of the waveguide, increasing the current path of the magnetic dipole 131. In the entire stack, four dielectric layers are used for antenna and feeding structures. The core layer is the first iron core layer from top to bottom, which is specifically used for the realization of radiation elements. The thickness of this layer is limited to 508 to reduce the thickness of the antenna, making it structurally balanced, light in weight, easy to manufacture, and high in yield.

[0038] Furthermore, the reduction in the antenna dielectric thickness strongly affects its impedance and bandwidth. To address this limitation, a defective ground plane structure (DGS) 300 is used to create four circular holes under the horizontal patch ground corners. The presence of the DGS affects the capacitive effect of the fringe field in the stripline, flattens the imaginary part of the electric dipole antenna input impedance, and helps balance the real part of the impedance of the electric dipole and magnetic dipole 131. Secondly, the electric field between the two horizontal patches and the ground plane finds an additional path to the relatively low ground plane, resulting in an increase in the effective height of the electric dipole thickness. Due to the strip coupling between the DGS and the slot, the magnetic dipole 131 is also affected, ultimately reducing its resonant frequency.

[0039] Specifically, Figure 3 As shown, the top metal layer 100 is located in the first layer, and the top metal layer 100 is evenly divided into four patch elements of the same size by an edge gap of width d. A middle gap of width W2 is set between the two pairs of patch elements located on the upper and lower sides. The patch elements are cut away from each other at the corners to form edge parts, and the four patch elements and the edge parts are coupled with the edge capacitance to realize the cross-polarized electric dipole. The corners of the patch are cut to balance the impedance matching at the edge frequency.

[0040] The top metal layer 100 is the first layer, carrying two cross-polarized electric dipoles, which are implemented using four patch elements and edge capacitance coupling, where the corners of the patches are cut to balance the impedance matching at the edge frequencies, and the patches are deformed along the vertical plane to match the technical requirements related to the through-hole.

[0041] Circular holes with a diameter of r2 are provided on the sides of the patch components that are close to each other, and the interval between the circular holes on the left and right sides is L2; ​​the length and width of the top metal layer 100 are L1 and W1 respectively, where L1=4.1mm, L2=1mm, W1=5.05mm, W2=0.75mm, r2=0.6mm, and d=0.2mm.

[0042] Further, such as Figure 3 and Figure 4 As shown, the core includes a first core layer 200 and a second core layer 600, the first core layer 200 is located in the second layer, the second core layer 600 is located in the sixth layer, and four blind holes corresponding to the circular holes are arranged on the first core layer 200, and the blind holes are connected with the circular holes to realize the magnetic dipole 131. That is, the magnetic dipole 131 is realized by the top metal layer 100 at the top and the four blind holes in the DGS middle core. The through hole 160 is attached to the edge of the blind hole. The through hole 160 includes an edge through hole 160 arranged at the edge of the first core layer 200, and the edge through hole 160 is arranged symmetrically on the left and right. The diameter of the edge through hole 160 is r1, r1=0.9mm, and the top and bottom of the edge through hole 160 are both provided with transition sheets.

[0043] Specifically, the blind holes are distributed in the middle of the second core layer, are axially symmetrical, and are connected to the top metal layer 100. The magnetic dipole 131 is formed by the vertical current flowing in the opposite direction of the vertical direction. The bottom of the blind hole is connected to the groove on the plane, which produces a loading effect at the end of the waveguide and increases the current path of the magnetic dipole 131. The edge through hole 160 is distributed at the edge of the second core layer, is bilaterally symmetrical, and has transition sheets with increased radius at the top and bottom of the through hole.

[0044] Furthermore, the defective ground plane DGS 300 is located on the third layer, and a cross slot is provided in the middle of the defective ground plane DGS 300, the cross slot is symmetrical, and the ends of the cross slot are provided with rectangular truncation portions, and four circular holes are provided on the edge of the cross slot on the defective ground plane DGS300. The defective ground plane realizes the excitation of two polarizations, and the horizontal layout creates four circular holes to realize the antenna input impedance of vertical polarization. For horizontal polarization, it is also realized with a similar aperture. This shape is a cross slot shape.

[0045] Specifically, the defective ground plane (DGS) 300 is a cross-slot structure, which is bilaterally symmetrical, has four circular holes, a cross gap in the middle, and the edges of the gap are truncated by four rectangles. The DGS makes the imaginary part of the input impedance of the electric dipole antenna flat and helps to balance the real part of the impedance of the electric dipole and magnetic dipole 131. Secondly, the electric field between the two horizontal patches and the ground plane finds an additional path to a relatively low ground plane, resulting in an increase in the effective height of the electric dipole thickness.

[0046] Furthermore, the feeding unit includes a horizontally polarized balanced stripline 500 located on the fifth layer and a vertically polarized balanced stripline 700 located on the seventh layer, and the balanced stripline is in a U-shaped feeding shape. The prepreg board layers (400, 800) are located on the fourth layer and the eighth layer respectively, and the ground plane layer 900 is located on the ninth layer.

[0047] Specifically, the feed is composed of a balanced stripline structure in the fifth and seventh layers for horizontal and vertical polarization, and the fourth and eighth layers are prepreg board layers (400, 800). The ground plane is the ninth layer to protect the feed line and antenna from interference from the control line and DC line located at the bottom of the phased array stack.

[0048] Reference Figure 4 Preferably, in this embodiment, the height of the top metal layer 100 is 35μm, the height of the magnetic dipole 131 is 561μm, the height of the through hole 160 is 955μm, and the height of the defective ground plane DGS300 is 18μm; the height of the first core layer 200 is 508μm, and the height of the second core layer 600 is 127μm, and the first core layer 200 and the second core layer 600 are both set to Neltec NX9240 core with a relative dielectric constant of 2.4; the height of the vertically polarized balanced stripline 700 is 35μm, and the height of the horizontally polarized balanced stripline 500 is 18μm; the height of the prepreg board layer (400, 800) is 107μm, which is set to IsolaMT77-1078 prepreg with a relative dielectric constant of 2.95, and the height of the ground plane layer 900 is 35μm. In other embodiments, the sizes of the above components, such as length, width, height and other parameters, can be designed for suitability and will not be elaborated again.

[0049] Furthermore, Figure 5 The S parameter diagram of the low profile dual polarized magneto-electric dipole antenna array element proposed by the present invention is shown in FIG. Figure 5 As shown, the -10dB impedance bandwidth is between 28.6GHz and 28.7GHz, and the entire S21 is less than -20dB within the -10dB impedance bandwidth.

[0050] Figure 6The figure shows the radiation pattern of the horizontal polarization of the low profile dual-polarized magneto-electric dipole antenna proposed by the present invention embedded in an infinite array, and the peak gain of the antenna under horizontal polarization is 6 dB.

[0051] Figure 7 The radiation pattern of the vertically polarized low-profile dual-polarized magneto-electric dipole antenna proposed in this invention is shown, which simulates the radiation pattern of the vertical polarization embedded in an infinite array. The peak gain of the antenna is 5dB in the vertical polarization case. The radiation pattern shows a main lobe that is slightly narrower in the vertical polarization case. The radiation pattern of both polarizations covers the beam steering range evenly, which means that there will be no blind spots in the phased array.

[0052] The antenna disclosed in the present invention is stacked in the first five metal layers of the PCB. In order to alleviate the blind spots caused in wide beam steering applications, a defective ground plane structure (DGS) is adopted, which greatly reduces mutual coupling. The antenna is thin, structurally balanced, light, easy to manufacture, and has a high yield rate. The high isolation between components can produce higher beam scanning performance. The design proposed in the present invention is very suitable for packaging technology and standard PCB processes, and is an attractive candidate for millimeter wave applications in fifth-generation (5G) mobile systems. The designed low-profile dual-polarized magneto-electric dipole antenna is simulated, and the results show that the radiation patterns of the two polarizations of its infinite array evenly cover the beam steering range, and there will be no blind spots in the phased array.

[0053] The above description is only a preferred embodiment of the present invention and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present invention is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above inventive concept. For example, the above features are replaced with the technical features with similar functions disclosed in the present invention (but not limited to) to form a technical solution.

Claims

1. A low profile dual-polarized magneto-electric dipole antenna array element, characterized in that: The antenna array element is a nine-layer structure arranged in sequence from top to bottom, and the antenna array element consists of a top metal layer, two cross-polarized electric dipoles, a magnetic dipole, a through hole, a defective ground plane DGS, an iron core, a prepreg board layer, a feed unit and a ground plane layer; The top metal layer is coupled with the two cross-polarized electric dipoles and the magnetic dipole; the electric dipole is used to realize horizontal polarization and vertical polarization, and is connected to the feeding unit through a microstrip line; the magnetic dipole interacts with the iron core, and the iron core is used to enhance the magnetic field generated by the magnetic dipole; the through hole is used to realize electrical connection between different layers; The defective ground plane DGS interacts with the electric dipole and the magnetic dipole through an electromagnetic field; the prepreg board layer serves as a dielectric layer to provide mechanical support and insulation functions for the antenna array element; the feeding unit is used to introduce external RF signals into the antenna array element and distribute power to the electric dipole and the magnetic dipole; the ground plane layer is used for the feeding unit to cooperate with the impedance matching to reduce signal reflection, and cooperates with the defective ground plane DGS to jointly optimize the performance of the grounding system.

2. The low-profile dual-polarized magneto-electric dipole antenna array element according to claim 1, characterized in that: The top metal layer is located in the first layer, and the top metal layer is evenly divided into four patch elements of the same size by an edge gap with a width of d. An intermediate gap with a width of W2 is arranged between two pairs of patch elements located on the upper and lower sides. The patch elements are cut at angles away from each other to form edge portions, and the four patch elements and the edge portions are coupled with edge capacitance to realize the cross-polarized electric dipole.

3. The low-profile dual-polarized magneto-electric dipole antenna array element according to claim 2, characterized in that: The patch elements are provided with circular holes with a diameter of r2 on the sides close to each other, and the interval between the circular holes on the left and right sides is L2; The length and width of the top metal layer are L1 and W1 respectively, wherein L1=4.1 mm, L2=1 mm, W1=5.05 mm, W2=0.75 mm, r2=0.6 mm, and d=0.2 mm.

4. The low-profile dual-polarized magneto-electric dipole antenna array element according to claim 3, characterized in that: The iron core includes a first iron core layer and a second iron core layer, the first iron core layer is located in the second layer, the second iron core layer is located in the sixth layer, and four blind holes corresponding to the circular holes are arranged on the first iron core layer, and the blind holes are connected with the circular holes to realize the magnetic dipole.

5. The low-profile dual-polarized magneto-electric dipole antenna array element according to claim 4, characterized in that: The through holes include edge through holes arranged at the edge of the first core layer, the edge through holes are arranged symmetrically, the diameter of the edge through holes is r1, r1=0.9mm, and transition sheets are arranged at the top and bottom of the edge through holes.

6. The low-profile dual-polarized magneto-electric dipole antenna array element according to claim 1, characterized in that: The defective ground plane DGS is located on the third layer, and a cross groove portion is arranged in the middle of the defective ground plane DGS. The cross groove portion is symmetrical on both sides, and rectangular truncation portions are arranged at both ends of the cross groove portion. Four circular holes are also arranged on the edge of the cross groove portion on the defective ground plane DGS.

7. The low-profile dual-polarized magneto-electric dipole antenna array element according to claim 4, characterized in that: The feeding unit includes a horizontally polarized balanced stripline located on the fifth layer and a vertically polarized balanced stripline located on the seventh layer, and the balanced striplines are in a U-shaped feeding shape.

8. The low profile dual-polarized magneto-electric dipole antenna array element according to claim 1, characterized in that: The prepreg board layers are located on the fourth and eighth layers respectively, and the ground plane layer is located on the ninth layer.

9. The low-profile dual-polarized magneto-electric dipole antenna array element according to claim 7, characterized in that: The height of the top metal layer is 35 μm, the height of the magnetic dipole is 561 μm, the height of the through hole is 955 μm, and the height of the defect ground plane DGS is 18 μm; The height of the first core layer is 508μm, the height of the second core layer is 127μm, and the first core layer and the second core layer are both set to Neltec NX9240 core with a relative dielectric constant of 2.4; the height of the vertically polarized balanced strip line is 35μm, and the height of the horizontally polarized balanced strip line is 18μm; the height of the prepreg board layer is 107μm, which is set to Isola MT77-1078 prepreg with a relative dielectric constant of 2.95, and the height of the ground plane layer is 35μm.

10. A low profile dual polarized magneto-electric dipole antenna implemented on standard multi-layer PCB technology, characterized in that, The invention comprises the antenna array element as claimed in any one of claims 1 to 9, wherein the antenna is realized by stacking the antenna array elements on a standard multi-layer PCB, and the function of the antenna is realized by the coordinated work of the antenna array elements.

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