Lighting device

Abstract

The invention discloses a lighting device, and relates to the technical field of lighting. The lighting device comprises a lamp holder, a supporting body and at least one light source module, wherein the supporting body is connected with the lamp holder; the multiple light source modules are installed on the supporting body and distributed in the circumferential direction of the supporting body, each light source module comprises a substrate, at least one light emitting unit arranged on one surface of the substrate and a light transmitting layer, and each light emitting unit comprises a laser chip; and the light transmitting layer is wrapped on the corresponding laser chips or covers the plurality of laser chips. According to the technical scheme, not only can the color of light be adjusted, but also the emitting angle of the light can be adjusted, the light emitting efficiency is effectively improved, and the laser chip can work under the high-power condition and can be well applied to the requirements of the high-power and high-lumen lighting market.

Description

Technical Field

[0001] The present application relates to the field of lighting technology, and in particular to a lighting device. Background Art

[0002] The most widely used LED lighting products on the market currently use LED chips as light-emitting components. As the power increases, the heat generated also increases. Higher heat easily leads to a decrease in the light output of the LED chip, or even LED chip failure. Therefore, the power of existing LED lighting products does not exceed 200W, and the light output efficiency is 100-120lm / W, which is difficult to meet the use needs of the high-power, high-lumen market, especially in some large-area application scenarios, such as stadiums, ports, docks, high-pole lighting and other fields. Summary of the invention

[0003] The main purpose of this application is to propose a lighting device, aiming to solve the problems of low power and low light output efficiency of existing LED lighting products.

[0004] To achieve the above-mentioned purpose, the present application proposes a lighting device, comprising:

[0005] Lamp holder;

[0006] A support body connected to the lamp holder; and

[0007] At least one light source module is mounted on the support body, and a plurality of the light source modules are distributed along the circumference of the support body, each of the light source modules comprises a substrate, at least one light emitting unit disposed on a surface of the substrate, and a light-transmitting layer, and each of the light emitting units comprises a laser chip;

[0008] The light-transmitting layer is wrapped around the corresponding laser chip or covers a plurality of the laser chips to have a first packaging state or a second packaging state respectively;

[0009] Wherein, in the first packaging state, there are multiple light-transmitting layers, and the multiple light-transmitting layers are wrapped on multiple corresponding laser chips, and the preparation materials of the light-transmitting layers include epoxy resin AB glue, hollow glass microbeads and fluorescent powder;

[0010] In the second packaging state, the light-transmitting layer is in a plate shape, used to cover the plurality of laser chips, and the raw materials for preparing the light-transmitting layer include hollow alumina balls, fluorescent materials and a binder.

[0011] In one embodiment, the lighting device further comprises a transparent lampshade, wherein the transparent lampshade is disposed on the plurality of light source modules, and an open end of the transparent lampshade is connected to the lower portion of the support body.

[0012] In one embodiment, the support body includes a support base and a support tube disposed on the support base, wherein the support tube is used to install the light source module, and one side of the support base is used to connect to the open end of the transparent lampshade, and the other side is used to connect to the lamp head.

[0013] In one embodiment, at least one heat dissipation channel is disposed on the support base.

[0014] In one embodiment, the support base includes at least one support plate, and two adjacent support plates are connected by a connecting member so that a heat dissipation channel is formed between the two adjacent support plates.

[0015] In one embodiment, the material of the support body includes aviation aluminum.

[0016] In one embodiment, a plurality of the light source modules are connected in series or in parallel to lead out a positive electrode lead and a negative electrode lead;

[0017] The positive lead is electrically connected to the positive electrode on the lamp holder, and the negative lead is electrically connected to the negative electrode on the lamp holder.

[0018] In one embodiment, the lighting device further comprises a driving power supply, wherein an input end of the driving power supply is connected to alternating current, and an output end of the driving power supply is connected to the lamp holder.

[0019] In the technical solution of the present application, when the lighting device is powered on, the laser chips on the multiple light source modules emit blue parallel light beams, which are irradiated to the light-transmitting layer. When in the first packaging state, the phosphor in the light-transmitting layer absorbs part of the blue light and then emits yellow light. The yellow light complements the blue light to form white light. Due to its special structure and refractive index, the hollow glass microbeads can effectively scatter the incident light. The hollow glass microbeads form scattering centers, so that the light is more evenly distributed in multiple directions, which can not only make the phosphor and the blue light more fully contact, but also make the light emit at a larger angle. The combination of hollow glass microbeads and phosphors can adjust the color of the light and the emission angle of the light, effectively improving the light output efficiency. The laser chip can work under high-power conditions and can be better applied to the needs of the high-power and high-lumen lighting market.

[0020] When in the second packaging state, the fluorescent component in the light-transmitting layer absorbs part of the blue light and emits yellow light. The yellow light complements the blue light to form white light. After high-temperature sintering, the hollow alumina spheres have a special structure with better scattering properties for light. The hollow alumina spheres form scattering centers, which make the light more evenly distributed in multiple directions, so that the fluorescent component and the blue light can be more fully contacted, and the white light can be emitted at a larger angle. The combination of the hollow alumina spheres and the fluorescent components can adjust the color of the light and the emission angle of the light, effectively improving the light output efficiency. The laser chip can work under high-power conditions and can be better applied to the needs of the high-power and high-lumen lighting market. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0022] Figure 1 A schematic structural diagram of an embodiment of a lighting device provided in the present application;

[0023] Figure 2 for Figure 1 A schematic diagram of the structure in which the positive lead and the negative lead are connected to the lamp holder;

[0024] Figure 3 for Figure 1 A schematic diagram of the structure of the middle support body;

[0025] Figure 4 for Figure 1 A structural schematic diagram of an embodiment of a light emitting module;

[0026] Figure 5 for Figure 1 A structural schematic diagram of another embodiment of the light emitting module;

[0027] Figure 6 for Figure 4 and Figure 5 A schematic diagram of the structure of the light-emitting unit in FIG.

[0028] Figure 7 for Figure 6 A schematic diagram of the structure of the circuit pad and the fixed pad;

[0029] Figure 8 for Figure 6 Schematic diagram of the structure of the connection pads on the laser chip;

[0030] Fig. 9for Figure 4 Schematic diagram of the three-dimensional structure of the light-transmitting layer corresponding to a single light-emitting unit;

[0031] Fig.10 for Figure 5 A schematic diagram of the cross-sectional structure of the light-transmitting layer corresponding to a single light-emitting unit;

[0032] Fig.11 It is a schematic structural diagram of an embodiment of a driving power supply of the present application.

[0033] Description of Figure Numbers:

[0034] 1. Lamp holder; 11. Positive electrode; 12. Negative electrode; 2. Support body; 21. Support seat; 211. Support plate; 212. Connector; 213. Heat dissipation channel; 22. Support tube; 3. Light source module; 31. Substrate; 311. Positive electrode lead; 312. Negative electrode lead; 313. Positive electrode conductive hole; 314. Negative electrode conductive hole; 315. Positive electrode terminal; 316. Negative electrode terminal; 32. Light-emitting unit; 321. Positive electrode pad; 322. Negative electrode pad; 323. Inner area; 324. Fixed pad; 325. Laser chip; 326. Gold wire; 327. Connecting pad; 33. Light-transmitting layer; 4. Transparent lampshade; 5. Driving power supply.

[0035] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0038] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0039] The power of existing LED lighting products does not exceed 200W, and the light output efficiency is 100-120lm / W, which is difficult to meet the use needs of the high-power and high-lumen market, especially in some large-area application scenarios, such as stadiums, ports, docks, high-pole lighting and other fields. In view of this, the present application proposes a lighting device to solve the problems of low power and low light output efficiency of existing LED lighting products.

[0040] See also Figures 1 to 3 In one embodiment of the present application, the lighting device comprises: a lamp holder 1, a support body 2, and at least one light source module 3, wherein the support body 2 is connected to the lamp holder 1; a plurality of the light source modules 3 are mounted on the support body 2, and the plurality of the light source modules 3 are distributed along the circumference of the support body 2, see Figures 4 to 6 Each of the light source modules 3 includes a substrate 31, at least one light emitting unit 32 disposed on a surface of the substrate 31, and a light-transmitting layer 33, each of the light emitting units 32 includes a laser chip 325; the light-transmitting layer 33 is wrapped around the corresponding laser chip 325 or covers a plurality of the laser chips 325, so as to have a first packaging state or a second packaging state correspondingly;

[0041] Wherein, in the first packaging state, there are multiple light-transmitting layers 33, and the multiple light-transmitting layers 33 are wrapped on multiple corresponding laser chips 325, and the preparation materials of the light-transmitting layers 33 include epoxy resin AB glue, hollow glass microbeads and phosphors;

[0042] In the second packaging state, the light-transmitting layer 33 is in a plate shape, and is used to cover the plurality of laser chips 325 . The raw materials for preparing the light-transmitting layer 33 include hollow alumina balls, fluorescent materials, and a binder.

[0043] In the technical solution of the present application, when the lighting device is powered on, the laser chips 325 on the multiple light source modules 3 emit a blue parallel light beam of 450 to 460 nm, and the blue parallel light beam is irradiated to the light-transmitting layer 33. When in the first packaging state, the phosphor in the light-transmitting layer 33 absorbs part of the blue light and then emits yellow light. The yellow light and the blue light complement each other to form white light. Due to its special structure and refractive index, the hollow glass microbeads can effectively scatter the incident light. The hollow glass microbeads form a scattering center, so that the light is more evenly distributed in multiple directions, which can not only make the phosphor and the blue light more fully contact, but also make the light emit at a larger angle. The combination of hollow glass microbeads and phosphors can adjust the color of the light and the emission angle of the light, effectively improving the light output efficiency. The laser chip 325 can work under high-power conditions and can be better applied to the needs of the high-power and high-lumen lighting market.

[0044] When in the second packaging state, the fluorescent component in the light-transmitting layer 33 absorbs part of the blue light and emits yellow light. The yellow light and the blue light complement each other to form white light. After high-temperature sintering, the hollow alumina spheres have a special structure and have better scattering properties for light. The hollow alumina spheres form scattering centers, so that the light is more evenly distributed in multiple directions, which can not only make the fluorescent component and the blue light more fully contact, but also make the light emit at a larger angle. The hollow alumina spheres and the fluorescent components can adjust the color of the light and the emission angle of the light, effectively improving the light output efficiency. The laser chip 325 can work under high-power conditions and can be better applied to the needs of the high-power and high-lumen lighting market.

[0045] It should be noted that the substrate 31 has one surface and another surface opposite to each other, and the one surface is used to correspond to the light-emitting side. Each of the light-emitting units 32 includes a pad and a laser chip 325 arranged in sequence in a direction away from one surface of the substrate 31, and in each of the light-emitting units 32, the pad includes a circuit pad and a fixed pad 324, and the laser chip 325 is fixed to the fixed pad 324 and electrically connected to the circuit pad. The thickness of the light-transmitting layer 33 is 0.1 to 0.4 mm. Controlling the thickness of the light-transmitting layer 333 to 0.1 to 0.4 mm can better ensure the light-emitting efficiency. The laser chip 325 is a blue laser chip. In each light source module 3, multiple light-emitting units 32 are connected in series or in parallel. The substrate 31 is selected from one of an aluminum oxide substrate, an aluminum nitride substrate and a sapphire substrate.

[0046] Specifically, see Figure 6 In each of the light-emitting units 32 , the circuit pads include a positive electrode pad 321 and a negative electrode pad 322 , the positive electrode of the laser chip 325 is electrically connected to the positive electrode pad 321 through a gold wire 326 , and the negative electrode of the laser chip 325 is electrically connected to the negative electrode pad 322 through a gold wire 326 .

[0047] Further, see Fig.10 , each of the light-emitting units 32 also includes a group of electrode terminals and a group of conductive holes, a group of the electrode terminals includes a positive terminal 315 and a negative terminal 316 arranged on the other surface of the substrate 31, and a group of conductive holes includes a positive conductive hole 313 and a negative conductive hole 314 penetrating the substrate 31; in each of the light-emitting units 32, the positive electrode pad 321 is electrically connected to the positive terminal 315 through the positive conductive hole 313, and the negative electrode pad 322 is electrically connected to the negative terminal 316 through the negative conductive hole 314.

[0048] In order to fix the laser chip 325 more stably on the substrate 31, refer to Figure 7 and Figure 8 In each of the light-emitting units 32, the positive electrode pad 321 and the negative electrode pad 322 define an inner area 323, the fixing pad 324 is arranged in the inner area 323, and the laser chip 325 is provided with a connecting pad 327 corresponding to the fixing pad 324 on a surface close to the substrate 31.

[0049] By adopting the above technical solution, in each light-emitting unit 32, the positive electrode pad 321 and the negative electrode pad 322 define an inner region 323, and the fixed pad 324 is arranged in the inner region 323, so that the limited area of ​​the surface of the substrate 31 can be fully utilized, and the laser chip 325 can be stably fixed on the substrate 31. It should be noted that in each light-emitting unit 32, there are two fixed pads 324, one of which is arranged corresponding to the positive electrode pad 321, and the other fixed pad 324 is arranged corresponding to the negative electrode pad 322. It can be understood that both the connecting pad and the fixing pad are arranged on the substrate, and there are two connecting pads 327, and the two connecting pads 327 are arranged corresponding to the two fixing pads 324; when the laser chip 325 is fixed on the substrate 31, the connecting pad 327 on the laser chip 325 is aligned with the fixing pad 324 on the substrate 31, and eutectic welding is performed through a eutectic furnace, and the temperature of the eutectic furnace has at least one temperature zone of 300℃-340℃, and the eutectic furnace is protected by nitrogen during the eutectic process, and the eutectic time is 15 to 30 minutes. After eutectic, the laser chip 325 is fixed on the substrate 31. It should be noted that the material of the fixing pad 324 and the connecting pad 327 is gold-tin alloy.

[0050] In an embodiment of the present application, the lighting device further comprises a transparent lampshade 4 , which is disposed on the plurality of light source modules 3 , and an open end of the transparent lampshade 4 is connected to the lower portion of the support body 2 .

[0051] By adopting the above technical solution, the transparent lampshade 4 does not affect the light output effect of the light source module 3, and can effectively isolate the light source module 3 from the outside world, prevent dust from entering the lampshade, and extend the service life of the lighting device. It should be noted that the transparent lampshade 4 is made of high borosilicate glass.

[0052] In the embodiments of this application, see Figure 3 The support body 2 includes a support base 21 and a support tube 22 arranged on the support base 21, and the support tube 22 is used to install the light source module 3. One side of the support base 21 is used to connect with the open end of the transparent lampshade 4, and the other side is used to connect with the lamp head 1.

[0053] By adopting the above technical solution, multiple light source modules 3 are distributed on the circumferential side wall of the support tube 22, and the light-emitting sides of the multiple light source modules 3 are away from the support tube 22. Each light source module 3 can be fixed to the support tube 22 by screws, or by other fixing methods, which are not limited in the embodiments of the present application. The support tube 22 has a hollow shell structure, which is helpful for heat dissipation. The open end of the transparent lampshade 4 can be glued to one side of the support base 21 by glue, or fixed to one side of the support base 21 by other methods, which are not limited in the embodiments of the present application.

[0054] Furthermore, at least one heat dissipation channel 213 is provided on the support base 21. A plurality of heat dissipation channels 213 are provided on the support base 21, and the heat dissipation channels 213 are connected to the outside, which helps to dissipate heat from the lighting device by air cooling, thereby helping to improve the heat dissipation effect.

[0055] Specifically, the support base 21 includes at least one support plate 211 , and two adjacent support plates 211 are connected via a connecting member 212 , so that a heat dissipation channel 213 is formed between the two adjacent support plates 211 .

[0056] By adopting the above technical solution, the support seat 21 includes a plurality of support plates 211 , and two adjacent support plates 211 are connected by a connecting piece 212 . The structure is simple and stable, and it is also helpful to improve the heat dissipation effect.

[0057] In the embodiment of the present application, the material of the support body 2 includes aviation aluminum. Aviation aluminum is light, which can reduce the weight of the lighting device, and aviation aluminum has excellent thermal conductivity.

[0058] In the embodiments of this application, see Figure 2 The multiple light source modules 3 are connected in series or in parallel to lead out a positive lead 311 and a negative lead 312; the positive lead 311 is electrically connected to the positive electrode 11 on the lamp holder 1, and the negative lead 312 is electrically connected to the negative electrode 12 on the lamp holder 1.

[0059] By adopting the above technical scheme, multiple light source modules 3 are electrically connected in series or in parallel to lead out a positive lead 311 and a negative lead 312, and the positive lead 311 and the negative lead 312 pass through the support body 2, the end of the positive lead 311 is electrically connected to the positive electrode 11 on the lamp holder 1, and the end of the negative lead 312 is electrically connected to the negative electrode 12 on the lamp holder 1. In this way, a relatively stable electrical connection is formed between the multiple light source modules 3 and the lamp holder 1, and when the lamp holder 1 is connected to an external power supply, the light source module 3 can be lit.

[0060] In the embodiments of this application, see Fig.11 The lighting device also includes a driving power supply 5, an input end of the driving power supply 5 is connected to the alternating current, and an output end is connected to the lamp holder 1.

[0061] By adopting the above technical solution, the driving power supply 5 can convert 110V or 220V AC power into DC power that meets lighting needs, and the driving power supply 5 and the light source module 3 are separately set, and the heat dissipation effect is also better than that of lighting equipment with a built-in driving power supply 5.

[0062] In an embodiment of the present application, when in the first packaging state, the light-transmitting layer 3 includes the following raw materials in parts by weight: 80 to 91 parts of epoxy resin AB glue and 10 to 21 parts of powder; wherein the powder includes hollow glass beads and fluorescent powder, and the weight ratio of the hollow glass beads to the fluorescent powder is (22 to 26): (4 to 8); the particle size of the hollow glass beads is 30 to 70 μm, and the particle size of the fluorescent powder is 1 to 20 μm.

[0063] In the technical solution of the present application, epoxy resin AB glue, hollow glass microspheres and phosphor powder are used in a specific ratio to form a packaging slurry, and the slurry is wrapped on the laser chip by dispensing or molding. After the slurry is cured, a bulb-shaped or hemispherical light-transmitting layer 33 is formed. Fig. 9 .

[0064] It should be noted that the chemical composition of hollow glass microspheres includes: SiO2 55-65wt%, Al2O3 26-35wt%, MgO 1-2wt%, Fe2O3 1-5wt%, TiO2 0.5-2wt%, C 0.01-2wt%, and 0.5-4wt% of Na2O and K2O, where wt% refers to the mass percentage. The specific gravity of hollow glass microspheres is 0.2-0.3g / cm 3 , with a specific surface area of ​​1 to 1.5 m 2 / g, light diffusion rate is 80-88%. Phosphors include YAG:Ce 3+Fluorescent powder. The raw material of epoxy resin AB glue is JL-510AB produced by Polyli Adhesive. When using, epoxy resin A glue and epoxy resin B glue are mixed in a mass ratio of 1:1 to form epoxy resin AB glue.

[0065] In an embodiment of the present application, when in the second packaging state, the light-transmitting layer 3 includes the following raw materials in parts by weight: 40 to 60 parts of powder, 0.2 to 0.3 parts of sintering modifier, 7 to 8 parts of sintering aid, 15 to 25 parts of binder, 20 to 30 parts of deionized water, 1 to 2 parts of dispersant, 0.6 to 1.2 parts of plasticizer, and 0.2 to 0.6 parts of defoaming agent; wherein the powder includes hollow alumina balls, Al2O3, Y2O3, CeO2, ZnO and ZrO2, and the weight ratio of the hollow alumina balls, Al2O3, Y2O3, CeO2, ZnO and ZrO2 is (58 to 82): (10 to 12): (5 to 8): (0.05 to 0.15): (0.04 to 0.07): (0.20 to 0.30).

[0066] In the technical solution of the present application, powder, sintering modifier, sintering aid, binder, deionized water, dispersant, plasticizer and defoamer are mixed to form a slurry, and then sintered to obtain a transparent YAG fluorescent composite crystal, i.e., a light-transmitting layer. Among them, the YAG fluorescent composite crystal has a fluorescent component.

[0067] It should be noted that the particle size of the alumina hollow sphere is 0.2-5 mm, the bulk density is 0.5-1 g / cm3, the sintering modifier includes CaO, the sintering aid includes ethyl quinate and MgO, the binder includes PVA aqueous solution, the dispersant includes polyacrylamide, and the plasticizer includes polyethylene glycol.

[0068] Performance Test Example 1

[0069] A method for preparing a lighting device in a first packaging state comprises the following steps:

[0070] S1. Preparation of packaging materials

[0071] (1) 21 g of hollow glass microspheres with an average particle size of 50 μm and 8.5 g of YAG:Ce with an average particle size of 15 μm were mixed. 3+ The phosphor (YAG-04 phosphor) is mixed and stirred to form a powder, wherein the chemical composition of the hollow glass microspheres includes: SiO2 61wt%, Al2O3 31.5wt%, MgO 1.5wt%, Fe2O3 3.5wt%, TiO2 1.25wt%, and the balance is Na2O and K2O, wherein wt% refers to the mass percentage; and the specific gravity of the hollow glass microspheres is 0.25g / cm 3, with a specific surface area of ​​1.3m 2 / g, light diffusion rate is 85%;

[0072] (2) Mix epoxy resin A glue and epoxy resin B glue (JL-510AB of Polyli Adhesive) in a weight ratio of 1:1, stir thoroughly, and form epoxy resin AB glue;

[0073] (3) Take 17 g of powder and 87 g of epoxy resin AB glue, add 17 g of powder to 87 g of epoxy resin AB glue, stir thoroughly, and obtain a packaging material.

[0074] S2. Provide eight aluminum nitride substrates, each of which is provided with 42 light-emitting units connected in series. The laser chip in each light-emitting unit is a VCSEL blue light laser chip. Wrap the packaging material obtained in step S1 on each laser chip by dispensing. After the packaging material is cured, a hemispherical light-transmitting layer is formed. The thickness of the light-transmitting layer is 0.1 mm. In this way, eight light source modules are obtained.

[0075] S3. Fix the eight light source modules on the circumferential side wall of the support body in sequence with screws, the eight light source modules form a cylindrical structure with openings at both ends, use wires to electrically connect the eight light source modules so that the eight light source modules are connected in series, and lead out a positive lead and a negative lead, the positive lead is connected to the positive pole on the lamp holder, and the negative lead is connected to the negative pole on the lamp holder, fix the lamp holder to the bottom of the support body, cover the eight light source modules with a high borosilicate glass lampshade, and fix the open end of the lampshade to the lower part of the support body with glue.

[0076] S4. Provide a driving power supply, the input end of the driving power supply can be connected to the alternating current, and the output end is connected to the lamp holder to obtain a lighting device.

[0077] Performance Test Example 2

[0078] A method for preparing a laser chip light source in a second packaging state comprises the following steps:

[0079] S1. Preparation of powder

[0080] 56g of hollow alumina balls, 11g of Al2O3, 7g of Y2O3, 0.1g of CeO2, 0.05g of ZnO and 0.25g of ZrO2 were mixed, stirred and fully mixed to obtain a powder. The chemical composition of the hollow alumina balls includes Al2O3, and the mass percentage of Al2O3 is ≥99wt%, the particle size of the hollow alumina balls is 0.2-0.5mm, and the bulk density is 0.95g / cm 3; The purity of Al2O3, Y2O3, CeO2, ZnO and ZrO2 is 99.99%, the average particle size of Al2O3 is 0.8μm, the average particle size of Y2O3 and CeO2 is 2μm, and the average particle size of ZnO and ZrO2 is 0.5μm.

[0081] S2. Preparation of binder

[0082] PVA was dissolved in deionized water, stirred, and fully mixed to form a 15.0 wt % PVA aqueous solution, wherein wt % refers to the mass percentage, and the polymerization degree of PVA is 1750±50.

[0083] S3, add 49g of the powder obtained in step S1, 20g of deionized water, 0.2g of sintering modifier CaO, 7g of sintering aid, and 1g of polyacrylamide dispersant into a ball mill, and disperse them by ball milling at a speed of 150rpm for 20h, add 15g of the PVA aqueous solution obtained in step S2, 0.7g of polyethylene glycol (PEG-400) plasticizer, and 0.2g of polypropylene glycol (molecular weight 1200) defoamer into the ball mill, and continue to ball mill at a speed of 150rpm for 22h to form a slurry. Among them, the polyacrylamide is a cationic polyacrylamide with a molecular weight of 12 million; the sintering aid includes ethyl quinoline and MgO, and the mass ratio of ethyl quinoline to MgO is 10:1.

[0084] S4. Degas the slurry obtained in step S3 under a vacuum degree of 0.08 MPa for 5 minutes, place the degassing slurry on a casting machine for casting, the casting speed is 10 mm / min, the cast green sheet enters a drying chamber for drying treatment, the drying temperature is divided into three stages, the first stage temperature is 50°C, the second stage temperature is 90°C, and the third stage temperature is 70°C, to obtain a cast green sheet with a thickness of 0.4 mm.

[0085] S5. After vacuum-sealing the cast green sheet obtained in step S4, place it in a warm isostatic press for pressurization to increase density. During the warm isostatic pressing treatment, the temperature is 60° C., the pressure is 120 MPa, and the time is 5 min. The green sheet is pre-cut on a pre-cutting machine to obtain a green sheet.

[0086] S6. Place the green sheet obtained in step S5 in a muffle furnace for heating treatment to remove binder and form a green sheet. During the heating treatment, the temperature is increased to 600° C. at a heating rate of 0.5° C. / min and kept at this temperature for 8 hours.

[0087] S7. The green blank obtained in step S6 is vacuum sintered at 1730° C. for 30 h, annealed in air at 1400° C. for 20 h, and taken out to obtain a transparent YAG fluorescent complex phase crystal.

[0088] S8. Provide eight aluminum nitride substrates, each of which is provided with 42 light-emitting units connected in series, and the laser chip in each light-emitting unit is a VCSEL blue light laser chip. Provide eight YAG fluorescent complex phase crystals obtained in step S7, and cover the eight YAG fluorescent complex phase crystals on the multiple laser chips on the corresponding aluminum nitride substrates, wherein the length and width of the YAG fluorescent complex phase crystals are adapted to the size of the substrate, so as to obtain eight light source modules.

[0089] S9. Fix the eight light source modules on the circumferential side wall of the support body in sequence with screws. The eight light source modules form a cylindrical structure with openings at both ends. Use wires to electrically connect the eight light source modules so that the eight light source modules are connected in series, and lead out a positive lead and a negative lead. The positive lead is connected to the positive pole on the lamp holder, and the negative lead is connected to the negative pole on the lamp holder. Fix the lamp holder to the bottom of the support body, cover the eight light source modules with a high borosilicate glass lampshade, and fix the open end of the lampshade to the lower part of the support body with glue.

[0090] S10, providing a driving power supply, wherein the input end of the driving power supply can be connected to an alternating current, and the output end is connected to a lamp holder, to obtain a lighting device.

[0091] Using a remote integrating sphere, the luminous flux of the laser chip light source in performance test example 1 and performance test example 2 was measured under the conditions of voltage of 220V and current of 0.44A, and the light extraction efficiency was obtained by the luminous flux and power. The light extraction efficiency = (luminous flux / power) × 100%, where power = voltage × current. It was measured that the light extraction efficiency of performance test example 1 was 285.4lm / W; the light extraction efficiency of performance test example 2 was 286.1lm / W.

[0092] The above description is only an exemplary embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the technical concept of the present application, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A lighting device, characterized in that: include: Lamp holder; A support body connected to the lamp holder; as well as, At least one light source module is mounted on the support body, and a plurality of the light source modules are distributed along the circumference of the support body, each of the light source modules comprises a substrate, at least one light emitting unit disposed on a surface of the substrate, and a light-transmitting layer, and each of the light emitting units comprises a laser chip; The light-transmitting layer is wrapped around the corresponding laser chip or covers a plurality of the laser chips to have a first packaging state or a second packaging state; Wherein, in the first packaging state, there are multiple light-transmitting layers, and the multiple light-transmitting layers are wrapped on multiple corresponding laser chips, and the raw materials for preparing the light-transmitting layers include epoxy resin AB glue, hollow glass microbeads and fluorescent powder; In the second packaging state, the light-transmitting layer is in a plate shape, used to cover the plurality of laser chips, and the raw materials for preparing the light-transmitting layer include hollow alumina balls, fluorescent materials and a binder.

2. The lighting device according to claim 1, characterized in that: The lighting device further comprises a transparent lampshade, which is disposed on the plurality of light source modules, and an open end of the transparent lampshade is connected to the lower portion of the support body.

3. The lighting device according to claim 2, characterized in that: The support body includes a support base and a support tube arranged on the support base, wherein the support tube is used to install the light source module, one side of the support base is used to connect with the open end of the transparent lampshade, and the other side is used to connect with the lamp holder.

4. The lighting device according to claim 3, characterized in that: At least one heat dissipation channel is arranged on the support base.

5. The lighting device according to claim 4, characterized in that: The support base includes at least one support plate, and two adjacent support plates are connected by a connecting piece so that a heat dissipation channel is formed between the two adjacent support plates.

6. The lighting device according to claim 1, characterized in that: The material of the support body includes aviation aluminum.

7. The lighting device according to claim 1, characterized in that: A plurality of the light source modules are connected in series or in parallel to lead out a positive electrode lead and a negative electrode lead; The positive lead is electrically connected to the positive electrode on the lamp holder, and the negative lead is electrically connected to the negative electrode on the lamp holder.

8. The lighting device according to claim 1, characterized in that: The lighting device also includes a driving power supply, an input end of the driving power supply is connected to the alternating current, and an output end of the driving power supply is connected to the lamp holder.

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