Circuit board etching machine

By designing circuit board etching machines with leverage and transmission components, the uniform distribution of etching solution and the uniform immersion of the circuit board have been realized, and the problems of uneven etching in existing technologies are solved, and the etching efficiency and effect are improved.

CN119383841AActive Publication Date: 2025-01-28CIRCUIT TECH MACHINERY
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Patent Information

Application Number
CN202411631068.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-15
Publication Date
2025-01-28
Estimated Expiration
2044-11-15

AI Technical Summary

Technical Problem

It is difficult for existing circuit board etching machines to achieve rapid and uniform immersion of circuit boards in alkaline solutions, resulting in uneven etching.

Method used

A circuit board etching machine is designed. Through the setting leverage and the transmission component, the etching box is driving up and down shaking up and down, combined with the electric telescopic lever and a jet rack to achieve the uniform distribution of the etching solution and the uniformly soaking of the circuit board.

Benefits of technology

By shaking the etching solution, the uniform distribution of the etching solution is increased, the frequency and intensity of the etching solution and the surface of the copper foil are increased, and the efficiency and effect of the carved carved carved carvings are improved.

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Abstract

The invention belongs to the technical field of circuit board production, and particularly relates to a circuit board etching machine which comprises a machine base. The machine base is rotationally connected with a lever, and the lever is located in the middle of the machine base. An etching box is fixedly connected to the lever; the etching box is supported by the arranged lever to be located above the machine base, the two bevel gears are driven to rotate along with the output end of the servo motor, the connecting rod is synchronously driven to pull the etching box at the bottom end of the fixing frame to fluctuate up and down, etching liquid is shaken, and the etching liquid is more evenly distributed on the surface of a circuit board; the circuit board etching device has the advantages that uneven etching caused by too high or too low local concentration is avoided, the contact frequency and strength of the etching liquid and the surface of the copper foil can be increased, chemical reaction is accelerated, and accordingly the circuit board etching efficiency is improved, the circuit boards fixed to the bottom ends of the multiple electric telescopic rods are synchronously driven by the multiple second connecting discs to rotate, and the circuit board etching efficiency is improved. Therefore, a plurality of circuit boards are rotationally soaked in the etching liquid, and the soaking effect on the circuit boards is improved.
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Description

Technical Field

[0001] The invention belongs to the technical field of circuit board production, in particular to a circuit board etching machine. Background Art

[0002] The circuit board is the provider of electrical connections for electronic components. It carries various electronic components and connects them to each other through lines to realize circuit functions. A very critical etching process is required during the production of circuit boards. It involves using chemical or physical methods to remove excess copper foil to form the desired circuit pattern.

[0003] A patent application with publication number CN111970838A discloses an etching machine for producing circuit boards, including a base frame, in which a longitudinal second ball screw module and a longitudinal second slide bar are arranged, the second slide bar is slidably connected to a U-shaped positioning plate, the positioning plate is connected to the ball nut of the second ball screw module, and an S-shaped cooling pipe is embedded in the bottom inner wall of the positioning plate. This application can be applied to circuit boards of different thicknesses, so that the etching machine has strong clamping stability for the circuit boards, and the cooling method is better than that of traditional etching machines.

[0004] The above-mentioned circuit board etching machine has strong clamping stability during the etching process by providing adaptability clamping for circuit boards of different thicknesses. However, when etching the circuit board, the current etching machine directly places the circuit board in an alkaline solution for immersion, corrodes the area not covered by the resistor mask, and takes it out after a set immersion time, which makes it difficult to quickly and evenly immerse the circuit board in the alkaline solution.

[0005] To this end, the present invention provides a circuit board etching machine. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problems is: a circuit board etching machine described in the present invention includes a machine base; a lever is rotatably connected to the machine base, and the lever is located in the middle of the machine base; an etching box is fixedly connected to the lever; support frames are fixedly connected to both sides of the machine base close to the lever; a top plate is fixedly connected to the support frame; a fixing frame is fixedly connected to one side of the top of the etching box; a connecting rod is rotatably connected to the fixing frame; a transmission assembly is provided at the bottom end of the top plate, and the transmission assembly is used to drive the etching box to shake the alkaline solution inside it.

[0008] Preferably, the transmission assembly includes a servo motor, a No. 1 connecting disk, a No. 1 bevel gear, a connecting frame, a rotating rod, a No. 2 bevel gear and a No. 1 bolt; the servo motor is fixedly connected to the bottom end of the top plate, and the servo motor is located above the fixed frame; the No. 1 connecting disk is fixedly connected to the output end of the servo motor; the No. 1 bevel gear is fixedly connected to the bottom end of the No. 1 connecting disk; the connecting frame is fixedly connected to the side of the bottom end of the top plate close to the No. 1 bevel gear; the rotating rod is rotatably connected to the connecting frame; the No. 2 bevel gear is fixedly connected to the outer wall of the rotating rod, and the No. 2 bevel gear can mesh with the No. 1 bevel gear; the No. 1 bolt is threadedly connected to the rotating rod, and the No. 1 bolt passes through one end of the connecting rod away from the fixed frame.

[0009] Preferably, a plurality of electric telescopic rods are provided at the bottom end of the top plate; a No. 1 fixing plate is fixedly connected to the output ends of the plurality of electric telescopic rods; a plurality of No. 2 bolts are threadedly connected to the No. 1 fixing plate; a matching component is provided at the bottom end of the top plate, and the matching component is used to drive the plurality of electric telescopic rods to rotate when the output end of the servo motor rotates.

[0010] Preferably, the mating component includes a No. 2 connecting disk, a No. 1 transmission gear and a No. 1 belt; a plurality of the No. 2 connecting disks are rotatably connected to the bottom end of the top plate, and the No. 2 connecting disks are located above the electric telescopic rod; the No. 1 transmission gear is fixedly connected to the bottom end of the No. 2 connecting disk, a plurality of No. 1 transmission gears can mesh with each other, and the bottom end of the No. 1 transmission gear is fixedly connected to the top end of the electric telescopic rod; the No. 1 belt is sleeved between the No. 1 connecting disk and the No. 2 connecting disk.

[0011] Preferably, a solution tank is fixedly connected to the top of the top plate, and a water pump is fixedly connected to the interior of the solution tank; a plurality of guide rods are fixedly connected to the bottom end of the top plate; a No. 1 guide ring is fixedly connected to the plurality of guide rods, and the No. 1 guide ring is sleeved on the outer wall of the electric telescopic rod; a No. 2 guide ring is rotatably connected to the bottom ends of the plurality of No. 1 guide rings, and the No. 2 guide ring is fixedly connected to the outer wall of the electric telescopic rod; a guide pipe is fixedly connected to the bottom ends of the plurality of No. 2 guide rings, and the guide rods can be connected to the guide pipe via the No. 1 guide ring and the No. 2 guide ring.

[0012] Preferably, the bottom ends of the plurality of flow guide tubes are fixedly connected to an injection rack; the injection rack is respectively provided with a plurality of injection holes and a plurality of flow slots, and the plurality of injection holes are located on the inner wall of the injection rack.

[0013] Preferably, a plurality of the No. 1 fixing plates are fixedly connected with electric heating wires inside; a heat-conducting rod is fixedly connected between the No. 1 fixing plate and the injection rack, and the electric heating wires are connected to the heat-conducting rod.

[0014] Preferably, a plurality of No. 3 connecting plates are rotatably connected to the bottom end of the top plate and the side away from the No. 1 bevel gear; a No. 2 transmission gear is fixedly connected to the bottom ends of the plurality of No. 3 connecting plates, and the plurality of No. 2 transmission gears can mesh with each other; a No. 2 fixing plate is fixedly connected to the bottom ends of the plurality of No. 2 transmission gears; and a No. 2 belt is sleeved between the No. 2 connecting plate and the No. 3 connecting plate.

[0015] Preferably, shielding plates are fixedly connected to both sides of the inner wall of the etching box; and the cross-sectional shape of the shielding plates is an arc shape.

[0016] Preferably, a drainage groove is provided on the bottom inner wall of the etching box; and an outer discharge pipe is fixedly connected to one end of the inner wall of the etching box close to the drainage groove.

[0017] The beneficial effects of the present invention are as follows: 1. A circuit board etching machine described in the present invention supports an etching box located above a machine base through a lever. As the output end of the servo motor drives two bevel gears to rotate, the connecting rod is synchronously driven to pull the etching box at the bottom of the fixed frame up and down, and the etching liquid is shaken to make the etching liquid more evenly distributed on the surface of the circuit board, thereby avoiding uneven etching caused by local excessively high or low concentrations, and can increase the contact frequency and intensity of the etching liquid with the copper foil surface, accelerate the chemical reaction, and thus improve the efficiency of circuit board etching. Multiple circuit boards fixed at the bottom ends of multiple electric telescopic rods are synchronously driven to rotate by multiple No. 2 connecting plates, so that multiple circuit boards are rotated and immersed in the etching liquid, thereby improving the immersion effect of the circuit boards. New etching liquid is pumped into the etching box for replacement by a water pump, and the new etching liquid is sprayed onto the circuit board, thereby achieving the dual effects of spraying and immersing the circuit board surface.

[0018] 2. A circuit board etching machine described in the present invention is fixed on the bottom end of the guide tube by an injection rack, and the extracted etching liquid is guided and sprayed evenly onto the surface of the circuit board, thereby improving the etching effect on the circuit board; the heat is generated by the heating wire and the heat is conducted to the injection rack in cooperation with the heat-conducting rod, thereby increasing the temperature of the etching liquid around the circuit board and ensuring the etching effect of the etching liquid on the circuit board; multiple circuit boards are respectively fixed on multiple No. 2 fixed plates; as the output end of the servo motor rotates, the No. 3 connecting disk connected to the No. 2 connecting disk is synchronously driven to rotate; the circuit board is suspended on the No. 2 fixed plate and rotated for dehydration, thereby reducing the adhesion of liquid on the circuit board; two shielding plates are used to block the etching liquid, thereby reducing the situation where the etching liquid spills when it is shaken; the etching liquid is extracted from the drainage trough by an external pipe connected to the external pipe of the external discharge pipe and discharged, thereby realizing the function of replacing the etching liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Figure 1 is a stereogram of the present invention; Figure 2 It is a schematic diagram of the structure of the second bevel gear in the present invention; Figure 3 It is a structural schematic diagram of the etching box in the present invention; Figure 4 It is a structural schematic diagram of the electric telescopic rod in the present invention; Figure 5 It is a structural schematic diagram of the injection rack in the present invention.

[0021] In the figure: 1. machine base; 11. lever; 12. etching box; 13. support frame; 14. top plate; 15. fixed frame; 16. connecting rod; 2. servo motor; 21. No. 1 connecting plate; 22. No. 1 bevel gear; 23. connecting frame; 24. rotating rod; 25. No. 2 bevel gear; 26. No. 1 bolt; 3. electric telescopic rod; 31. No. 1 fixing plate; 32. No. 2 bolt; 4. No. 2 connecting plate; 41. No. 1 transmission gear; 42. No. 1 belt; 5. solution box; 51. guide rod; 52. No. 1 guide ring; 53. No. 2 guide ring; 54. guide pipe; 6. injection frame; 7. heat conduction rod; 8. No. 3 connecting plate; 81. No. 2 transmission gear; 82. No. 2 fixing plate; 83. No. 2 belt; 9. shielding plate; 91. drainage trough; 92. external discharge pipe. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0023] like Figures 1 to 3As shown, a circuit board etching machine described in an embodiment of the present invention includes a machine base 1; a lever 11 is rotatably connected to the machine base 1, and the lever 11 is located in the middle of the machine base 1; an etching box 12 is fixedly connected to the lever 11; support frames 13 are fixedly connected to both sides of the machine base 1 close to the lever 11; a top plate 14 is fixedly connected to the support frame 13; a fixing frame 15 is fixedly connected to one side of the top of the etching box 12; a connecting rod 16 is rotatably connected to the fixing frame 15; a transmission assembly is provided at the bottom end of the top plate 14, and the transmission assembly is used to drive the etching box 12 to shake the alkaline solution inside it up and down; when etching the circuit board, the machine base 1 is used as the main base structure of the circuit board etching machine, and two support frames 13 are fixed on both sides of the machine base 1 to support the top plate 14. First, the alkaline solution is poured into the interior of the etching box 12, and a plurality of resistors that have been covered are placed in the etching box 12. The masked circuit board is placed in the etching box 12, and the area of ​​the circuit board not covered with the resistor mask is corroded by an alkaline solution. During the immersion of the circuit board, the transmission component drives the connecting rod 16 to pull up and down and rotate on the fixed frame 15, so that the etching box 12 supported by the lever 11 at the bottom of the fixed frame 15 rises and falls and shakes continuously. Shaking the alkaline solution can make the etching liquid more evenly distributed on the surface of the circuit board, avoiding uneven etching caused by local excessive or low concentration. By shaking the alkaline solution, the difference in the residence time of the etching liquid on the surface of the circuit board can be reduced, thereby reducing side etching and undercutting. Moreover, shaking can increase the contact frequency and intensity between the etching liquid and the copper foil surface, accelerate the chemical reaction, and thus increase the etching speed. Shaking can also make the generated reaction products detach from the surface of the circuit board to prevent them from affecting the etching effect, thereby achieving the effect of quickly and evenly immersing the circuit board in the etching liquid.

[0024] like Figures 1 to 4As shown, the transmission assembly includes a servo motor 2, a No. 1 connecting disk 21, a No. 1 bevel gear 22, a connecting frame 23, a rotating rod 24, a No. 2 bevel gear 25 and a No. 1 bolt 26; the servo motor 2 is fixedly connected to the bottom end of the top plate 14, and the servo motor 2 is located above the fixing frame 15; the No. 1 connecting disk 21 is fixedly connected to the output end of the servo motor 2; the No. 1 bevel gear 22 is fixedly connected to the bottom end of the No. 1 connecting disk 21; the connecting frame 23 is fixedly connected to the side of the bottom end of the top plate 14 close to the No. 1 bevel gear 22; the rotating rod 24 is rotatably connected to the connecting frame 23; the No. 2 bevel gear 25 is fixedly connected to the outer wall of the rotating rod 24, and the No. 2 bevel gear 25 can mesh with the No. 1 bevel gear 22; the No. 1 bolt 26 is threadedly connected to the rotating rod 24, and the No. 1 bolt 26 passes through the end of the connecting rod 16 away from the fixing frame 15; when the etching box 12 is shaken up and down, the output end of the servo motor 2 drives the No. 1 connecting disk 21 to rotate, and the No. 1 bevel gear 22 rotates synchronously with the No. 1 connecting disk 21, and the connecting frame 23 supports the rotating rod 24 to be located below the No. 1 bevel gear 22, and the No. 2 bevel gear 25 and the No. 1 bevel gear 22 can mesh and rotate with each other. During the rotation of the No. 2 bevel gear 25, the connecting rod 16 fixed by the No. 1 bolt 26 on the rotating rod 24 is driven to rotate, and the connecting rod 16 continuously pulls and presses down the fixing frame 15, thereby achieving the effect of driving the etching box 12 to shake continuously, so that the etching liquid in the etching box 12 can shake, thereby improving the etching efficiency and etching effect of the circuit board.

[0025] like Figure 1 , Figure 4 and Figure 5 As shown, a plurality of electric telescopic rods 3 are provided at the bottom end of the top plate 14; the output ends of the plurality of electric telescopic rods 3 are fixedly connected to a No. 1 fixing plate 31; a plurality of No. 2 bolts 32 are threadedly connected to the No. 1 fixing plate 31; a matching component is provided at the bottom end of the top plate 14, and the matching component is used to drive the plurality of electric telescopic rods 3 to rotate when the output end of the servo motor 2 rotates; when etching a plurality of circuit boards, a plurality of electric telescopic rods 3 are fixed to the middle bottom end of the top plate 14 through the matching component, and the plurality of circuit boards are respectively fixed on the No. 1 fixing plate 31 by two No. 2 bolts 32 threadedly penetrated, so as to realize the suspension of the circuit boards, and the output end of the electric telescopic rod 3 extends downward, so as to drive the circuit boards suspended on the No. 1 fixing plate 31 to be immersed in the etching liquid in the etching box 12, so as to evenly immerse the circuit boards, and at the same time, when the output end of the servo motor 2 rotates, the circuit boards on the plurality of electric telescopic rods 3 are synchronously driven to rotate, so as to improve the effect of immersing the circuit boards.

[0026] The matching assembly includes a No. 2 connection disk 4, a No. 1 transmission gear 41 and a No. 1 belt 42; a plurality of the No. 2 connection disks 4 are rotatably connected to the bottom end of the top plate 14, and the No. 2 connection disks 4 are located above the electric telescopic rod 3; the No. 1 transmission gear 41 is fixedly connected to the bottom end of the No. 2 connection disk 4, and a plurality of the No. 1 transmission gears 41 can mesh with each other, and the bottom end of the No. 1 transmission gear 41 is fixedly connected to the top end of the electric telescopic rod 3; the No. 1 belt 42 is sleeved between the No. 1 connection disk 21 and the No. 2 connection disk 4; when a plurality of electric telescopic rods 3 are fixed to the bottom end of the top plate 14, a plurality of The No. 2 connecting disk 4 is rotatably connected to the bottom end of the top plate 14, and the electric telescopic rod 3 is fixed to the bottom end of the No. 2 connecting disk 4 through the No. 1 transmission gear 41. When the output end of the servo motor 2 drives the No. 1 connecting disk 21 to rotate, the No. 1 connecting disk 21 drives a No. 2 connecting disk 4 to rotate synchronously by relying on the No. 1 belt 42. A No. 2 connecting disk 4 is engaged with multiple No. 1 transmission gears 41 to achieve the effect of driving multiple No. 2 connecting disks 4 to rotate synchronously, thereby driving each circuit board fixed on the No. 1 fixing plate 31 to rotate and immerse in the etching liquid, thereby achieving the effect of rotating and immersing multiple circuit boards.

[0027] The top of the top plate 14 is fixedly connected with a solution box 5, and the interior of the solution box 5 is fixedly connected with a water pump; the bottom end of the top plate 14 is fixedly connected with a plurality of guide rods 51; a number-one guide ring 52 is fixedly connected to the plurality of guide rods 51, and the number-one guide ring 52 is sleeved on the outer wall of the electric telescopic rod 3; the bottom ends of the plurality of number-one guide rings 52 are rotatably connected with a number-two guide ring 53, and the number-two guide ring 53 is fixedly connected to the outer wall of the electric telescopic rod 3; the bottom ends of the plurality of number-two guide rings 53 are fixedly connected with a guide pipe 54, and the guide rods 51 can be connected to the guide pipe 54 through the number-one guide ring 52 and the number-two guide ring 53; when the circuit board is soaked in etching, since the etching liquid soaks multiple batches of circuit boards for a long time, each soaking of a batch of circuit boards After the etching liquid is added, its concentration will decrease, thereby affecting the etching effect of the circuit board. New etching liquid is loaded into the solution box 5, and the etching liquid in the solution box 5 is extracted by a water pump and sent to multiple guide rods 51 respectively. The etching liquid is sent into the first guide ring 52 through the guide rod 51, and the second guide ring 53 rotates to receive the etching liquid at the bottom end of the first guide ring 52, so that the etching liquid finally reaches the bottom end of the guide tube 54 and is sprayed onto the circuit board immersed in the etching box 12, and part of the original etching liquid in the etching box 12 is extracted. By adding new etching liquid, not only the concentration of the etching liquid in the etching box 12 is guaranteed, but also the new etching liquid is sprayed on the circuit board, which can improve the immersion etching effect of the circuit board.

[0028] The bottom ends of the plurality of guide tubes 54 are fixedly connected to a spray rack 6; the spray rack 6 is respectively provided with a plurality of spray holes and a plurality of flow slots, and the plurality of spray holes are located on the inner wall of the spray rack 6; when new etching liquid is sprayed onto the circuit board, the spray rack 6 is fixed at a position below the No. 1 fixed plate 31 through the guide tube 54. As the new etching liquid enters the guide tube 54, the etching liquid originally sprayed from the bottom end of the guide tube 54 is introduced into the interior of the spray rack 6, and is evenly sprayed toward the surface of the circuit board from the plurality of spray holes on the inner wall of the spray rack 6, thereby improving the etching effect on the circuit board. At the same time, by relying on the opening of the plurality of flow slots on the spray rack 6, the circuit board is ensured to be immersed in the etching liquid in the etching box 12.

[0029] The interior of the plurality of No. 1 fixing plates 31 is fixedly connected with electric heating wires; a heat-conducting rod 7 is fixedly connected between the No. 1 fixing plate 31 and the injection rack 6, and the electric heating wire is connected to the heat-conducting rod 7; when the circuit board is immersed in etching, since the etching liquid in the etching box 12 is immersed in multiple batches of circuit boards for a long time, the temperature of the etching liquid also decreases with time, and the etching liquid with reduced temperature is likely to affect the etching effect on the circuit board. The electric heating wire is installed inside the No. 1 fixing plate 31. When the temperature of the etching liquid decreases, the electric heating wire generates heat, and the heat-conducting rod 7 absorbs the heat and conducts it to the injection rack 6. The material of the injection rack 6 can absorb heat, so that the injection rack 6 immersed in the etching liquid can heat up its surroundings, thereby ensuring the etching temperature of the circuit board.

[0030] like Figures 1 to 4 As shown, a plurality of No. 3 connecting plates 8 are rotatably connected to the bottom end of the top plate 14 and the side away from the No. 1 bevel gear 22; a plurality of No. 3 connecting plates 8 are fixedly connected to the bottom ends of the plurality of No. 3 connecting plates 8, and the plurality of No. 2 transmission gears 81 can mesh with each other; a plurality of No. 2 transmission gears 81 are fixedly connected to the bottom ends of the plurality of No. 2 fixing plates 82; a No. 2 belt 83 is sleeved between the No. 2 connecting plate 4 and the No. 3 connecting plate 8; after the circuit board is soaked or rinsed, a large amount of liquid is attached to the surface of the circuit board, and the plurality of No. 3 connecting plates 8 are rotated at the bottom end of the top plate 14 to fix the plurality of circuit boards on the plurality of No. 2 fixing plates 82 respectively, and the No. 2 belt 83 is sleeved between a No. 2 connecting plate 4 and a No. 3 connecting plate 8, and during the rotation of the No. 2 connecting plate 4, the No. 3 connecting plate 8 can be synchronously driven to rotate, thereby driving the plurality of No. 2 transmission gears 81 to mesh with each other and rotate, and the circuit board is suspended on the No. 2 fixing plate 82 to rotate and dehydrate, thereby reducing the liquid adhesion on the circuit board.

[0031] like Figures 1 to 3As shown, shielding plates 9 are fixedly connected to both sides of the inner wall of the etching box 12; the cross-sectional shape of the shielding plates 9 is curved; when the etching liquid in the etching box 12 is shaken, two shielding plates 9 are respectively fixed to both sides of the inner wall of the etching box 12, and the two curved shielding plates 9 can shield the etching liquid when it is shaken. After the etching liquid collides with the shielding plates 9, it is guided back into the etching box 12, thereby reducing the situation where the etching liquid spills when it is shaken.

[0032] A drainage groove 91 is provided on the inner wall at the bottom of the etching box 12; an outer discharge pipe 92 is fixedly connected to one end of the inner wall of the etching box 12 near the drainage groove 91; when new etching liquid is added to the etching box 12, the used etching liquid needs to be extracted, and the drainage groove 91 is used to guide the etching liquid from high to low, and the etching liquid is extracted from the drainage groove 91 through an external pipe connected to the outer discharge pipe 92 to discharge the etching liquid, so as to achieve the function of replacing the etching liquid. After the etching liquid is replaced, the outer discharge pipe 92 is blocked and the circuit board can be immersed and etched again.

[0033] Working process: When etching the circuit board, the machine base 1 is used as the main base structure of the circuit board etching machine. Two support frames 13 are fixed on both sides of the machine base 1 to support the top plate 14. First, the alkaline solution is poured into the inside of the etching box 12, and a plurality of circuit boards covered with resistance masks are placed in the etching box 12. The alkaline solution is used to corrode the area on the circuit board that is not covered with the resistance mask. During the soaking process of the circuit board, the transmission component drives the connecting rod 16 to pull up and down and rotate on the fixed frame 15, so that the etching box 12 supported by the lever 11 at the bottom of the fixed frame 15 fluctuates and shakes continuously. Shaking the alkaline solution can make the etching solution more evenly distributed. On the surface of the circuit board, uneven etching caused by excessively high or low local concentration is avoided; when the etching box 12 is shaken up and down, the output end of the servo motor 2 drives the No. 1 connecting disk 21 to rotate, and the No. 1 bevel gear 22 rotates synchronously with the No. 1 connecting disk 21, and the connecting frame 23 supports the rotating rod 24 located below the No. 1 bevel gear 22, and the No. 2 bevel gear 25 and the No. 1 bevel gear 22 can mesh and rotate with each other. During the rotation of the No. 2 bevel gear 25, the connecting rod 16 fixed by the No. 1 bolt 26 on the rotating rod 24 is driven to rotate, and the connecting rod 16 continuously pulls and presses down the fixing frame 15, thereby achieving the effect of driving the etching box 12 to shake continuously, so that the etching box 12 is The etching liquid can shake, thereby improving the etching efficiency and etching effect of the circuit board; when etching multiple circuit boards, multiple electric telescopic rods 3 are fixed to the middle bottom end of the top plate 14 through matching components, and multiple circuit boards are respectively fixed to the No. 1 fixing plate 31 by two No. 2 bolts 32 threaded through, so as to realize the suspension of the circuit board, and the output end of the electric telescopic rod 3 extends downward, driving the circuit board suspended on the No. 1 fixing plate 31 to be immersed in the etching liquid in the etching box 12, and the circuit board is evenly immersed, and at the same time, when the output end of the servo motor 2 rotates, the circuit boards on the multiple electric telescopic rods 3 are synchronously driven to rotate, thereby improving the effect of immersion of the circuit board; when etching multiple circuit boards When the electric telescopic rod 3 is fixed to the bottom end of the top plate 14, multiple No. 2 connecting plates 4 are used to rotate and connect to the bottom end of the top plate 14 respectively. The electric telescopic rod 3 is fixed to the bottom end position of the No. 2 connecting plate 4 through the No. 1 transmission gear 41. When the output end of the servo motor 2 drives the No. 1 connecting plate 21 to rotate, the No. 1 connecting plate 21 drives a No. 2 connecting plate 4 to rotate synchronously by relying on the No. 1 belt 42. One No. 2 connecting plate 4 is meshed with multiple No. 1 transmission gears 41 to achieve the effect of driving multiple No. 2 connecting plates 4 to rotate synchronously, thereby driving each No. 1 fixed plate 31. The circuit board is rotated and immersed in the etching solution, which has the effect of rotating and immersing multiple circuit boards; When the circuit board is soaked in etching, since the etching solution soaks multiple batches of circuit boards for a long time, its concentration will decrease after soaking each batch of etching solution, thereby affecting the etching effect of the circuit board. New etching solution is loaded into the solution box 5, and the etching solution in the solution box 5 is extracted by a water pump and respectively sent to multiple guide rods 51. The etching solution is sent into the first guide ring 52 through the guide rod 51, and the second guide ring 53 rotates to receive the etching solution at the bottom end of the first guide ring 52, so that the etching solution finally reaches the bottom end of the guide pipe 54 and is sprayed onto the circuit board soaked in the etching box 12, and part of the original etching solution in the etching box 12 is extracted. By adding new etching solution, not only the concentration of the etching solution in the etching box 12 is guaranteed, but also the new etching solution is sprayed on the circuit board, which can improve the soaking etching effect of the circuit board; when spraying new etching solution on the circuit board, the injection frame 6 is fixed to the lower position of the first fixed plate 31 through the guide pipe 54 As the new etching liquid enters the guide tube 54, the etching liquid originally sprayed from the bottom end of the guide tube 54 is introduced into the inside of the spray rack 6, and is sprayed uniformly toward the surface of the circuit board from the multiple spray holes on the inner wall of the spray rack 6, thereby improving the etching effect on the circuit board. At the same time, by relying on the opening of multiple flow slots on the spray rack 6, the circuit board is guaranteed to be immersed in the etching liquid in the etching box 12. When the circuit board is immersed and etched, since the etching liquid in the etching box 12 is immersed in multiple batches of circuit boards for a long time, the temperature of the etching liquid also decreases with time. The etching liquid with reduced temperature is easy to affect the etching effect on the circuit board. The heating wire is installed inside the first fixing plate 31. When the temperature of the etching liquid decreases, the heating wire works to generate heat, and the heat-conducting rod 7 absorbs the heat and conducts it to the spray rack 6. The material of the spray rack 6 can absorb heat, so that the spray rack 6 immersed in the etching liquid can heat up its surroundings, thereby ensuring the etching temperature of the circuit board; After the circuit board is soaked or rinsed, a large amount of liquid adheres to the surface of the circuit board. Multiple No. 3 connecting plates 8 are rotated at the bottom of the top plate 14 to fix multiple circuit boards on multiple No. 2 fixing plates 82 respectively. The No. 2 belt 83 is sleeved between a No. 2 connecting plate 4 and a No. 3 connecting plate 8. During the rotation of the No. 2 connecting plate 4, the No. 3 connecting plate 8 can be driven to rotate synchronously, thereby driving multiple No. 2 transmission gears 81 to mesh and rotate with each other. The circuit board is suspended on the No. 2 fixing plate 82 and rotated to dehydrate, thereby reducing the liquid adhesion on the circuit board. When the etching liquid in the etching box 12 is shaken, two shielding plates 9 are respectively fixed on both sides of the inner wall of the etching box 12. The two curved shielding plates 9 can shield the etching liquid when it is shaken. After the etching liquid hits the shielding plates 9, it is guided back into the etching box 12 to reduce the situation where the etching liquid spills when it is shaken; when new etching liquid is added to the etching box 12, the used etching liquid needs to be extracted, and the drainage groove 91 is used to guide the etching liquid from high to low, and the etching liquid is extracted from the drainage groove 91 through an external pipe connected to the external discharge pipe 92 to discharge the etching liquid, thereby realizing the role of replacing the etching liquid. After the etching liquid is replaced, the external discharge pipe 92 is blocked and the circuit board can be immersed and etched again.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A circuit board etching machine, characterized in that: The invention comprises a machine base (1); a lever (11) is rotatably connected to the machine base (1), and the lever (11) is located in the middle of the machine base (1); an etching box (12) is fixedly connected to the lever (11); support frames (13) are fixedly connected to both sides of the machine base (1) close to the lever (11); a top plate (14) is fixedly connected to the support frame (13); a fixing frame (15) is fixedly connected to one side of the top of the etching box (12); a connecting rod (16) is rotatably connected to the fixing frame (15); a transmission assembly is arranged at the bottom end of the top plate (14), and the transmission assembly is used to drive the etching box (12) to rise and fall to shake the alkaline solution inside the etching box (12).

2. A circuit board etching machine according to claim 1, characterized in that: The transmission assembly comprises a servo motor (2), a No. 1 connecting plate (21), a No. 1 bevel gear (22), a connecting frame (23), a rotating rod (24), a No. 2 bevel gear (25) and a No. 1 bolt (26); the servo motor (2) is fixedly connected to the bottom end of the top plate (14), and the servo motor (2) is located above the fixing frame (15); the No. 1 connecting plate (21) is fixedly connected to the output end of the servo motor (2); the No. 1 bevel gear (22) is fixedly connected to the No. 1 connecting plate (21) The connecting frame (23) is fixedly connected to the bottom end of the top plate (14) on one side close to the first bevel gear (22); the rotating rod (24) is rotatably connected to the connecting frame (23); the second bevel gear (25) is fixedly connected to the outer wall of the rotating rod (24), and the second bevel gear (25) can mesh with the first bevel gear (22); the first bolt (26) is threadedly connected to the rotating rod (24), and the first bolt (26) passes through one end of the connecting rod (16) away from the fixing frame (15).

3. A circuit board etching machine according to claim 2, characterized in that: A plurality of electric telescopic rods (3) are arranged at the bottom end of the top plate (14); the output ends of the plurality of electric telescopic rods (3) are fixedly connected to a No. 1 fixing plate (31); a plurality of No. 2 bolts (32) are threadedly connected to the No. 1 fixing plate (31); a matching component is arranged at the bottom end of the top plate (14), and the matching component is used to drive the plurality of electric telescopic rods (3) to rotate when the output end of the servo motor (2) rotates.

4. A circuit board etching machine according to claim 3, characterized in that: The mating assembly comprises a No. 2 connection disk (4), a No. 1 transmission gear (41) and a No. 1 belt (42); a plurality of the No. 2 connection disks (4) are rotatably connected to the bottom end of the top plate (14), and the No. 2 connection disks (4) are located above the electric telescopic rod (3); the No. 1 transmission gear (41) is fixedly connected to the bottom end of the No. 2 connection disk (4), the plurality of No. 1 transmission gears (41) can mesh with each other, and the bottom end of the No. 1 transmission gear (41) is fixedly connected to the top end of the electric telescopic rod (3); and the No. 1 belt (42) is sleeved between the No. 1 connection disk (21) and the No. 2 connection disk (4).

5. A circuit board etching machine according to claim 3, characterized in that: The top end of the top plate (14) is fixedly connected to a solution box (5), and the interior of the solution box (5) is fixedly connected to a water pump; the bottom end of the top plate (14) is fixedly connected to a plurality of guide rods (51); a first guide ring (52) is fixedly connected to the plurality of guide rods (51), and the first guide ring (52) is sleeved on the outer wall of the electric telescopic rod (3); the bottom ends of the plurality of first guide rings (52) are rotatably connected to a second guide ring (53), and the second guide ring (53) is fixedly connected to the outer wall of the electric telescopic rod (3); the bottom ends of the plurality of second guide rings (53) are fixedly connected to a guide pipe (54), and the guide rods (51) can be connected to the guide pipe (54) through the first guide ring (52) and the second guide ring (53).

6. A circuit board etching machine according to claim 5, characterized in that: The bottom ends of the plurality of flow guide tubes (54) are fixedly connected to an injection rack (6); the injection rack (6) is respectively provided with a plurality of injection holes and a plurality of flow slots, and the plurality of injection holes are located on the inner wall of the injection rack (6).

7. A circuit board etching machine according to claim 6, characterized in that: A plurality of the first fixing plates (31) are internally fixed with electric heating wires; a heat conducting rod (7) is fixedly connected between the first fixing plate (31) and the injection frame (6), and the electric heating wires are connected to the heat conducting rod (7).

8. A circuit board etching machine according to claim 4, characterized in that: A plurality of No. 3 connecting disks (8) are rotatably connected to the bottom end of the top plate (14) and the side away from the No. 1 bevel gear (22); a No. 2 transmission gear (81) is fixedly connected to the bottom ends of the plurality of No. 3 connecting disks (8), and the plurality of No. 2 transmission gears (81) can mesh with each other; a No. 2 fixing plate (82) is fixedly connected to the bottom ends of the plurality of No. 2 transmission gears (81); and a No. 2 belt (83) is sleeved between the No. 2 connecting disk (4) and the No. 3 connecting disk (8).

9. A circuit board etching machine according to claim 1, characterized in that: Shielding plates (9) are fixedly connected to both sides of the inner wall of the etching box (12); the cross-sectional shape of the shielding plates (9) is a curved arc.

10. A circuit board etching machine according to claim 1, characterized in that: The bottom inner wall of the etching box (12) is provided with a drainage groove (91); an outer discharge pipe (92) is fixedly connected to one end of the inner wall of the etching box (12) close to the drainage groove (91).

Citation Information

Patent Citations

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    CN220149668U