Scalar wave generating chip and manufacturing method thereof

Abstract

The invention relates to the technical field of integrated circuits, and discloses a scalar wave generating chip and a manufacturing method thereof, comprising the design of a multi-layer shielding packaging structure for ensuring the stability and consistency of scalar waves in different environments and use conditions; a chip circuit is optimized based on the multi-layer shielding packaging structure so as to reduce external environment interference; and a high-precision temperature compensation circuit is adopted, so that the required scalar wave frequency can still be accurately generated in a wide-temperature environment. Through the scheme of the embodiment of the invention, the problems that the bracelet scalar wave generation chip can stably generate scalar waves and can keep the consistent effect under different environments and use conditions can be solved.

Description

Technical Field

[0001] The present invention and the technical field of integrated circuits specifically relate to a scalar wave generating chip and a manufacturing method thereof. Background Art

[0002] As for "a scalar wave generating chip and its manufacturing method", this usually refers to a technology used in wearable fitness devices, which aims to help users achieve health monitoring or other beneficial effects by generating so-called scalar waves through specially designed chips. However, there is a key challenge in this technology: how to ensure that the scalar wave generating chip in the bracelet can stably generate scalar waves and maintain consistent effects in different wearing environments and usage conditions. This means that multiple external factors, from temperature changes to physical activity levels, may affect the performance of the chip and therefore pose a potential threat to the overall performance provided by the bracelet.

[0003] In this problem, "stable generation of scalar waves and maintaining consistency under different environments and usage conditions" means that the scalar waves must be emitted continuously and accurately in a preset manner, without being affected by changes in external conditions; this is a technical difficulty because environmental variables and technical limitations may have a significant impact on its stability. In order to solve this problem, relevant researchers and technicians need to consider a series of complex factors to design a more reliable and durable wristband scalar wave chip. Summary of the invention

[0004] In view of this, the present invention discloses a scalar wave generating chip and a manufacturing method thereof, which at least partially solve the problems existing in the prior art.

[0005] A scalar wave generating chip and a manufacturing method thereof, comprising: A design of a multi-layer shielding packaging structure for ensuring scalar wave stability and consistency under different environments and usage conditions; Optimizing the chip circuit based on the multi-layer shielding packaging structure to reduce external environmental interference; A high-precision temperature compensation circuit is used to accurately generate the required scalar wave frequency in a wide temperature environment.

[0006] In a specific embodiment, the design of the multi-layer shielding packaging structure specifically includes: Select a material with a high dielectric constant as the shielding layer material; Design at least two metal shielding layers and place the signal conducting layer in the middle to improve stability; Fill dielectric layers between each layer of shielding to enhance the isolation between layers; Optimize the design of grounding and shielding layers to ensure good signal integrity and shielding effectiveness; The overall structural layout design is completed, so that the stability and consistency of the scalar wave can be guaranteed even in different environments and usage conditions.

[0007] In a specific embodiment, the chip circuit optimization step based on the multi-layer shielding packaging structure specifically includes: Integrate a low noise amplifier inside the package structure; Use low-sensitivity filtering and matching networks; Implement power and signal line decoupling measures to prevent crosstalk; Loop layout optimization and ground return planning; Embed feedback mechanisms such as zero-crossing comparison to enhance the ability to suppress external interference.

[0008] In a specific implementation, the step of using a high-precision temperature compensation circuit specifically includes: Set up a reference oscillator on the chip and ensure that its output signal is stable and does not change with temperature; Set up multiple temperature measurement sensors distributed near key components to monitor temperature drift; Use programmable gain controllers to automatically adjust the signal path based on temperature changes; Phase noise suppression unit is implanted in the signal path to maintain low phase noise performance over a wide temperature range; Integrating software and hardware compensation mechanisms ensures that the chip can accurately generate the desired scalar wave even in extremely cold or hot conditions.

[0009] In a specific embodiment, optimizing the chip circuit based on the multi-layer shielding packaging structure includes: Establish an environmental interference model of the shielding structure to analyze the impact of environmental factors; Test the shielding effects of different material combinations to select the best solution; Adjust internal circuit layout to reduce sensitivity to external interference; and A circuit feedback system is designed to maintain the frequency of the scalar wave stable.

[0010] In one embodiment, designing a circuit feedback system to maintain the frequency stability of the scalar wave specifically includes: Monitor the degree of change Δf of the actual frequency of the scalar wave from the preset frequency in the working state; When the degree of change Δf exceeds the preset tolerance Tf, the adjustment mechanism is triggered to compensate; Calculate the required adjustment amount according to the compensation ratio K, adjustment amount = change degree × compensation ratio, that is, C = Δf × K; and Adjust the adjustable resistor Rv in the transmitting circuit to make it equal to the calculated required adjustment amount to ensure that the transmitting frequency returns to the normal range.

[0011] In a specific implementation, the adjustable resistor Rv in the transmitting circuit is adjusted to ensure the stability of the scalar wave frequency, and the operation includes: Detect the impact of environmental changes on current; The adjustment strategy is determined by the change of the ambient temperature T: if the change ΔT exceeds the temperature threshold Tth, the next step is executed; When ΔT exceeds a preset threshold value Tth, the current control voltage ΔV=Kt×ΔT is adjusted and applied to the adjustable power supply; and Implement new control signals to the transmit circuit and dynamically adjust based on the current frequency deviation to achieve frequency consistency Δf<=Δfn.

[0012] In one embodiment, implementing a new control signal to a transmitting circuit includes: Sense changes in the external environment and determine whether the environmental threshold condition E for starting automatic adjustment is met; If the environmental threshold conditions are met, real-time compensation is performed according to the pre-set compensation factor Ki; Calculate whether the difference XiXi,0 between the current environment variable value Xi and its threshold Xi,0 is less than the threshold ε: that is, ΔE = |(XiXi,0) / ε| ≤ Kt; If the above relationship holds, the resistance value is finely adjusted by the microcontroller to stabilize the scalar wave frequency. Compared with the prior art, the beneficial effects achieved by the present invention are: 1. Design a multi-layer shielding packaging structure to ensure the stability and consistency of scalar waves under different environments and usage conditions; optimize the chip circuit based on the multi-layer shielding packaging structure to reduce external environmental interference; use a high-precision temperature compensation circuit to achieve accurate generation of the required scalar wave frequency in a wide temperature environment, thereby resisting electromagnetic waves, improving spirits, and relieving muscle soreness after exercise.

[0013] 2. Through the solution of the embodiments of the present disclosure, it is possible to solve the problem of how to ensure that the bracelet scalar wave generating chip can stably generate scalar waves and maintain consistency in different environments and usage conditions, as well as improve human immunity and maintain qi and blood balance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a flow chart of a scalar wave generating chip and a method for making the same; Figure 2 It is a detailed flow chart of the design of multi-layer shielding packaging structure; Figure 3 It is a detailed flow chart of chip circuit optimization steps based on multi-layer shielding packaging structure; Figure 4 It is a detailed flow chart of the steps of using a high-precision temperature compensation circuit; Figure 5 It is a flow chart for optimizing chip circuits based on a multi-layer shielding packaging structure; Figure 6 It is a specific flow chart for designing a circuit feedback system to maintain the frequency stability of the scalar wave; Figure 7 It is to adjust the adjustable resistor Rv in the transmitting circuit to ensure the stability of the scalar wave frequency, and its operation flow chart; Figure 8 is a flow chart for implementing new control signals to the transmit circuit. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] Describing a specific innovative solution such as "a scalar wave generating chip and its manufacturing method" and solving the stability and consistency problems is a complex task. The following is a possible implementation and detailed explanation based on the inventive concept: The first thing to discuss is the design of a multi-layer shielding packaging structure. This is to ensure that the performance of the scalar wave generated in the bracelet can be kept stable regardless of the environment or conditions. The main function of the shielding package is to combat external electronic noise interference, which is a common cause of scalar wave signal quality degradation. To achieve this goal, a metal layer or a special non-conductive layer is used inside the bracelet to create a physical barrier. This design is similar to placing critical circuits in a closed, heavily guarded space, surrounded by multiple protective layers to further reduce external interference.

[0017] To give a specific example, this structure can be imagined as a schematic diagram of the internal structure of a bracelet chip with a multi-layer protective shield; the inside is responsible for processing the tiny electronic devices and connection lines that generate scalar waves, and the first outer layer may be made of metals with good shielding properties such as nickel; outside the first layer of metal protection, in order to prevent any possible changes that may affect the performance of the chip, a special heat-insulating material is added as the second layer; and the key to this design is that the gap between the two layers needs to be precisely maintained at a minimum in order to better block the influence of any exogenous signals. On the outside, the third layer can be wrapped with some more common polymer materials to form the final external shape of the bracelet; this not only provides an additional layer of safety protection but also increases the overall aesthetics and durability.

[0018] Another core component to be discussed next is the high-precision temperature compensation circuit design, which aims to eliminate the impact of temperature changes. Because temperature changes can cause changes in the physical properties of various materials (such as conductors or semiconductors), which can indirectly lead to fluctuations in chip performance.

[0019] For example, if quartz is used as one of the main materials to make components in the oscillator circuit, since this type of material has excellent temperature sensitivity and frequency stability in a wide temperature environment (especially for high-precision standard oscillators), choosing it as the basis for designing the oscillator part can greatly reduce the negative effects of temperature and maintain output stability; at the same time, by setting a dedicated sensor inside the chip to monitor real-time temperature information and using this data to adjust the frequency value to compensate for any frequency offset caused by temperature changes. There is also a type of piezoelectric crystal oscillator made based on ceramic dielectric technology that has similar advantages.

[0020] Finally, the layout and routing (Layout & Routing, "L&R") of the chip was carefully optimized to reduce the probability of noise sources interfering with internal circuits and improve the overall electromagnetic compatibility and long-term working stability of the product. This includes arranging the positions and shapes of various electronic components reasonably; making the signal routing as straight as possible; and increasing the capacitance between the power supply and the ground.

[0021] For example, the following basic principles need to be followed when performing L&R: First, try to keep a certain distance between high-frequency lines and other signals or add ground holes to reduce the probability of electromagnetic crosstalk; second, reasonably control the damping size (that is, the energy consumption caused by the resistance when the signal passes through the conductor). Generally, it is hoped that the resistance value is as small as possible to avoid excessive loss of voltage level, but the risk of mutual interference between lines must be fully considered; third, the power network should be as close to the load area as possible to achieve faster charging and reduce magnetic field distortion caused by current pulses. Through the above efforts, the overall operation of the wristband device can be improved to be more reliable and smooth and adapt to the requirements of more occasions.

[0022] In summary, by implementing multi-level protection design, precisely controlling temperature effects, and improving L&R technology, the triple protection measures can better alleviate problems such as scalar wave signal fluctuations caused by external factors, allowing the bracelet to perform excellent functions in more environments and application scenarios.

[0023] Next, the "design details of the multi-layer shielding packaging structure" are described.

[0024] The selection of materials with high dielectric constants as shielding materials is based on the need to maximize shielding effectiveness. A high dielectric constant means that the material can store electrical energy more efficiently, thereby reducing leakage. For example, ceramics or special composite materials can be selected as the material to ensure that the shielding layer can effectively isolate external interference while maintaining internal signal stability. Suppose a barium titanate composite material called BaTiO3 is selected, which has a high relative dielectric constant.

[0025] Next, in order to enhance the stability of signal transmission, it is necessary to consider setting up at least two metal shielding layers in the design, and sandwiching the transmission line between the two layers. In this way, even if it is disturbed by external forces or affected by environmental changes, the double shielding design can still maintain the consistency of the signal without damage. For example, three layers can be arranged in the chip, with a small and critical transmission line placed in the middle, and the first and second copper shielding layers wrapped around it to ensure the quality of the signal.

[0026] In addition, adding dielectric materials to fill the spaces between the above shielding layers is also an important step, in order to improve the insulation isolation between the layers to achieve better shielding effect and prevent signal leakage. This can be achieved by using polymer compounds or special resin mixtures; for example, materials with excellent dielectric properties such as polytetrafluoroethylene are selected to fill the gaps.

[0027] Grounding and optimizing shielding design are critical to improving the purity of signal transmission throughout the system, so careful consideration of grounding and shielding is required to prevent signals from being interfered with by reflections and distortion. This often involves ensuring that all components are properly connected to a common ground line. In practice, a method called microstrip ground patterns can be used to maximize shielding effectiveness and reduce any possible signal integrity issues.

[0028] Ultimately, the goal of the overall structural layout design phase is to ensure that the scalar wave can be propagated stably even in a variety of operating scenarios. This means that not only all of the above points must be taken into account, but also the overall structure of the package must be adjusted according to the actual application scenario to achieve the desired effect. For example, in the actual production of the bracelet, in addition to considering wearing comfort, the shielding layer will be specially designed so that it does not deform when the motion state changes, so as to always maintain the consistency and stability of signal transmission.

[0029] Next, the “chip circuit optimization steps based on the multi-layer shielding packaging structure” are described in detail. In the chip design of multi-layer shielding packaging, it is a very important step to improve performance by optimizing key components. These steps ensure the stability and reliability of the final product.

[0030] First, a low-noise amplifier (LNA) is integrated inside the package structure. This design reduces the noise impact caused by the package and helps to reduce the signal noise level in the entire circuit. For example, in an application scenario for receiving RF signals, a high-performance LNA can be integrated close to the receiving port to reduce the noise level of the received signal and ensure that high-quality signals are transmitted to subsequent circuit processing links.

[0031] Secondly, use low-inductance filters and matching networks to further reduce the impact of electromagnetic interference and ensure signal quality. Specific examples can be the use of low-inductance components, such as low-Q inductors and low-damping coefficient capacitors to build LC resonant filters, or setting up appropriate matching circuits around the chip so that the RF signals entering and leaving the chip can effectively maintain a good matching state with the external transmission line.

[0032] The second is to implement effective power and signal line decoupling measures to prevent crosstalk. This is due to the capacitor effect between the packaging layers. By setting decoupling capacitors on key signal lines, it can be ensured that there is no unnecessary coupling between the power or signal lines to cause interference. For example, decoupling capacitors with sufficient capacity and appropriate value range can be placed to absorb current pulse fluctuations to avoid the voltage drop on the power line caused by instantaneous high power demand affecting the operation of other circuits.

[0033] In addition, loop layout optimization and reasonable arrangement of ground return lines are also very important links. Reasonable layout can reduce the additional magnetic field generated by the ring structure and ensure that the mutual interference between signal paths is minimized; and carefully planned and multiple, wide ground planes can not only form a good low-inductance loop but also effectively improve the performance of high-frequency circuits. For example, when laying out, the principle of short lines for high-frequency analog signals should be followed, and a dedicated ground grid connection method should be provided for important circuits to ensure that they are not affected by the outside world.

[0034] Finally, embedding feedback mechanisms to enhance external interference resistance refers to improving the resistance to external interference by detecting and controlling the input signal. This may involve adding a dedicated signal feedback loop, such as a zero-crossing comparator. For example, when external noise causes output fluctuations, the zero-crossing detection unit can be set to send a correction signal after logical operation to maintain a stable operating state, thereby enhancing the system's self-recovery ability to interference factors.

[0035] In general, the above steps improve the overall performance indicators by targetedly improving key nodes and components, and lay a solid foundation for realizing a stable and reliable bracelet scalar wave generating chip.

[0036] Next, the specific steps of using the high-precision temperature compensation circuit are described. This process includes several main steps, each of which is to ensure that the scalar wave generating chip of the sports energy bracelet can achieve stable performance and have excellent temperature characteristics. The specific steps are as follows: First, the chip design needs to ensure that a highly stable reference oscillator is integrated on it. The signal output by this reference oscillator needs to be accurate enough to be unaffected by the ambient temperature and maintain the same frequency stability even under different environmental conditions, which provides a reliable basis for the precise temperature compensation of the system. For example, a high-quality silicon-based resonator can show very small frequency drift over a wide temperature range.

[0037] Next, when designing the chip, multiple small temperature measurement sensors must be configured at some key locations that have a greater impact on performance. These sensors can monitor the local heating effects caused by work or external factors in different areas of the chip, and then correct the potential changes in output signals caused by thermal stress through feedback control. In a chip with a processor as the core, temperature monitoring points may be configured in the processing unit, memory, etc.

[0038] Then, an amplifier with programmable gain control function is used to automatically adjust the size and shape of the signal in the circuit according to the temperature information received from the sensor. The purpose of this is to adapt to temperature changes by adjusting the signal amplitude in the signal path to maintain the output signal quality unchanged. For example, when the ambient temperature is high, it may affect the operating parameters of the circuit. This change is collected by the temperature sensitive unit, and the digital control system calls the corresponding compensation parameters to set the appropriate correction for the programmable gain amplifier.

[0039] Afterwards, a phase noise suppression module is implanted inside the signal transmission channel to suppress the noise impact caused by various factors, so that the system has good anti-interference performance in the entire temperature range. This can effectively reduce the change of the internal oscillation phase of the system caused by temperature changes, avoid the interference and distortion of the signal by phase noise, and affect the quality of the signal. For example, a phase-locked loop (PLL) can be introduced in combination with loop filtering to ensure that the output signal phase noise is always below a certain limit.

[0040] Finally, while implementing the above compensation strategy at the hardware level, it is also necessary to develop relevant algorithms and integrate them into the software. This can further improve the system's adaptive ability to external changes, especially temperature effects, and the compensation efficiency. At the software level, the result correction and verification of the hardware compensation strategy can be achieved through the optimization algorithm to ensure that the sports energy bracelet can generate accurate scalar waves that meet the predetermined specifications under any circumstances.

[0041] Through the above combined measures, this sports energy bracelet can effectively overcome the performance impact caused by environmental uncertainties and provide stable scalar wave generation capabilities in various harsh working environments.

[0042] Next, the various steps involved in "optimizing the chip circuit based on the multi-layer shielding packaging structure" are described. First, the environmental interference model of the shielding structure is established to evaluate the possible impact of external factors, such as electromagnetic interference, on the circuit in the package. Through simulation calculations and physical experiments, designers can foresee the interference that the chip may be subject to in a specific working environment, and adjust the design parameters of the shielding material and structure accordingly. For example, in the design of a sports energy bracelet for the medical and health field, the development team constructed an electromagnetic interference environment and used the model to calculate the impact of the chip when it is not optimized under common interference conditions (such as mobile phone signals, radiation from home electronic devices, etc.), and determined that these impacts are within an acceptable safety range.

[0043] Secondly, in order to further improve the effectiveness of multi-layer shielding and verify the predicted results from a practical perspective, it is necessary to test the shielding effects of different shielding materials and layer combinations to select the most suitable solution. For example, the materials that may be involved in the above case are metal coatings, magnetic layers, conductive rubber, etc. By simulating and testing various shielding solutions in real-world environments (for example, using a laboratory environment to generate various types of electromagnetic interference to simulate the environmental factors that may occur when actually wearing a bracelet), engineers can accurately understand the effectiveness of each solution, thereby selecting the combination with the lowest cost or the most convenient mass production method while ensuring good performance.

[0044] Next, the internal circuit layout needs to be adjusted to make it less affected by external interference to ensure the reliability of the entire system. This work is usually completed using computer-aided design software. Take the same example as an example: the designer integrates the optimized shielding solution into the existing chip package layout, and makes a series of adjustments such as increasing the ground network coverage and ensuring the integrity of the power supply to reduce the impact of interference and maximize the circuit's working efficiency. This not only reduces the interference problem from external factors, but also makes the overall performance more robust and durable.

[0045] Finally, a circuit feedback mechanism needs to be designed to ensure that the frequency of scalar wave generation remains unchanged even when the external environment changes and certain parameters fluctuate. The normal operation of the circuit can be maintained by monitoring the output frequency in real time and automatically adjusting certain parts of the circuit (such as the oscillator control signal) when necessary. For example, for the application scenario of this bracelet, when the frequency drift is detected, the feedback loop can be started in time to automatically adjust the corresponding part so that the signal returns to the range near the set value to keep the output stability intact. In this way, no matter where the user is or the type of activity changes, it can ensure that the intended functions are played normally, enhancing the actual usability and market competitiveness of the product.

[0046] Next, the key steps involved in "designing a circuit feedback system to maintain the frequency stability of a scalar wave" and their meanings are described as follows: Such a feedback system is designed to ensure that the signal generated by the scalar wave generator is always stable at the set operating frequency. The first task of monitoring is to determine the deviation between the actual operating frequency and the predefined frequency. By monitoring this parameter in real time, it can be determined whether the frequency change is large enough to affect the system performance.

[0047] For example, suppose the bracelet we designed needs to generate a scalar wave to maintain a stable oscillation at a constant frequency of 24kHz, and the maximum allowable error tolerance Tf is set to ±50Hz. The system starts to monitor the actual frequency of the emitted scalar wave, and after a period of time, it is measured and found that the frequency actually drifts to 24.052kHz. This will produce a deviation value Δf = 52Hz.

[0048] When such a drift is identified that exceeds our preset error tolerance Tf, the control part of the system will receive feedback and trigger the corresponding compensation mechanism. In order to correct this change, the system will use the compensation ratio (i.e. K) to calculate the adjustment that should be made. The compensation ratio varies according to the actual design of the circuit and may be a fixed value or a variable value obtained based on experimental testing or theoretical simulation.

[0049] As a specific example, if it is assumed that the K value of the wristband system is set to 0.9 (unit: resistance change per Hz), the actual adjustment C that should be made should be: C = 52Hz × 0.9 = 46.8Ω resistance value adjustment.

[0050] The next operation is to change the adjustable resistor Rv in the transmitting circuit according to the calculated result of this adjustment amount. Continuing with our case, if the original Rv in the transmitting circuit is configured with an initial value of XΩ, then its resistance should now be adjusted to X + 46.8Ω. This allows the actual frequency of the scalar wave to gradually return to the target frequency range, thereby ensuring that the entire bracelet chip continues to operate in an ideal working state. Through this series of processes, the output signal quality can be maintained stable, and automatic adjustment can be achieved even if the external conditions change slightly.

[0051] Next, the description is made of "adjusting the adjustable resistance Rv in the transmitting circuit to ensure the stability of the scalar wave frequency, and its operation".

[0052] Detecting the impact of environmental changes on current: First, we monitor the temperature fluctuations and other changes in the working environment of the scalar wave generator. This environmental variable may affect the current flowing through the transmitting circuit and the resulting frequency output. By accurately measuring the temperature change, we can understand how the temperature drift may cause the current to change, and how such changes affect the final scalar wave spectrum.

[0053] For example, suppose that when designed at room temperature (25°C), our sports energy bracelet produces an ideal frequency output, but when the environment increases from room temperature to 32°C, the detection equipment records the increased temperature difference and estimates the increase in current due to the warming environment. Assuming that the temperature increase causes the current to increase and thus changes the scalar wave frequency, this change will be captured and analyzed to estimate the magnitude of the current change.

[0054] When the change exceeds the preset temperature threshold, such as Tth=10°C, appropriate action will be taken. If the current change exceeds the threshold (such as the case mentioned in the above example, the change reaches 7°C or higher), we will determine a new control voltage based on a specific algorithm to offset the temperature effect. Specifically, based on the pre-established proportional relationship Kt (this is an empirical coefficient based on circuit design and the effect of temperature change on frequency), we can calculate the new power supply voltage adjustment value: [\Delta V = Kt \times \Delta T\] Assume in this example that Kt is -5 mV / C (this negative value indicates that the control voltage supplied to the transmitter circuit needs to be reduced as the temperature rises so that the output frequency does not deviate from the desired target), and we record an ambient change of 7°C, then [\Delta V_{example} = (-5 \text{ mV / C}) \times (7 \text{ C}) = -35 \text{ mV}\] This means that the circuit supply voltage needs to be lowered by 35 mV.

[0055] A new control signal is implemented to achieve precise adjustment of the frequency so that the scalar wave maintains a stable frequency characteristic: when the updated voltage signal is transmitted to the adjustable element in the circuit (such as the adjustable resistor Rv in this example), the circuit adjusts the current in response to the new control signal. If the frequency deviation is less than the preset allowable limit (for example, Δf≤2%Δfn or other thresholds set according to application requirements), the transmitted frequency will be considered consistent and stable. Otherwise, the adjustment will continue until the target is achieved, ensuring the stable performance of the entire scalar wave transmission circuit, and the scalar wave signal of the desired frequency can be output even in the face of environmental challenges.

[0056] Next, the specific steps involved in the process of "implementing a new control signal to the transmitting circuit" are described along with a specific example.

[0057] The purpose of sensing changes in the external environment is to understand how the current environmental conditions affect the working conditions of the scalar wave generator. This can be achieved through external detection devices such as temperature sensors, light sensors, or other forms. Assume that in an actual scenario, the temperature sensing component in the sports energy bracelet detects that the external temperature is dropping and reaches below the preset value, which means that the environment has changed and may trigger the need for automatic adjustment. This is the step and significance of determining environmental changes.

[0058] Next, if the detected change is large enough or close enough to the preset environmental threshold condition E, the system must respond according to the pre-calculated and set specific compensation factor Ki - usually these response strategies are pre-configured in the chip development stage to adapt to a variety of changes. In this scenario, when the system detects that the temperature drops to the predetermined threshold condition, it will adjust the frequency according to the temperature coefficient Kt and the pre-configured compensation factor Ki to ensure that the efficiency of the scalar wave generation remains unchanged; for example, the compensation factor is related to the temperature coefficient, and it may be set to increase the Ki value by 10% at -10°C, so as to more effectively adjust the resistance value in a cold environment to stabilize the performance of the frequency generator. Then, the difference Xi,0 between the current value of the environmental variable (Xi) and the previously set stable operation reference value is calculated, as well as the relationship between this difference and a pre-set comparison limit, that is, the allowable variation range value (ε). In our specific example, if the system detects that the temperature is 10% or 1.0℃ lower than the initial working environment temperature reference value, and the deviation is less than the allowable threshold ε (such as 1%), the next level of action is triggered, that is, the subsequent adjustment action is executed.

[0059] Finally, if the above relationship is satisfied, that is, if the small fluctuations in the current environment are not enough to cause a significant drop in frequency or exceed the design requirements, the integrated microcontroller automatically controls the resistor network to achieve fine frequency modulation of the scalar wave. For example, in this scenario, the system may dynamically adjust the value of a variable resistor based on the small temperature changes detected, so that a stable scalar wave can still be output under different temperature conditions to ensure the consistency and reliability of chip performance. This completes the entire dynamic control logic process from monitoring to response.

[0060] Through the above steps, real-time monitoring of environmental changes can be achieved and reasonable responses can be made, thereby optimizing the scalar wave emission quality and working efficiency of the sports energy bracelet, and ultimately improving the user experience.

[0061] The "scalar wave generating chip and its manufacturing method" of the present invention includes: firstly, a specially designed multi-layer shielding packaging structure is adopted for the chip, and the design is intended to ensure that the generation and stability of scalar waves can be achieved regardless of the use environment and conditions; secondly, based on the special shielding design, the circuit in the chip is optimized to slow down and reduce the influence of adverse interference factors such as external electromagnetics on the scalar waves generated in the bracelet to the greatest extent, thereby further ensuring the accuracy and stability of the generated scalar waves; finally, based on the special shielding design and optimization, a temperature compensation design with high temperature adaptability and high-precision control is added to ensure that scalar waves can be accurately and stably generated in a wider range of use environments (such as high or low temperatures) and maintain the accuracy and effectiveness of their frequency. Overall, the present invention solves the above technical problems through a multi-level systematic design.

[0062] The specific implementation steps of this method are summarized as follows: 1. A special multi-layer shielding packaging method is constructed to resist the influence of external environmental factors, which not only ensures the consistency and stability of the scalar wave generated in the chip, but also improves the reliability of the chip itself; 2. Based on the package structure designed in the first step, the circuit design is optimized to reduce the adverse effects of external signal interference on the scalar wave generated by the bracelet; in addition, the anti-interference ability and the stability of scalar wave generation are enhanced through circuit design; 3. A highly precise temperature compensation circuit system design is introduced to accurately control the frequency fluctuation caused by the temperature change inside the chip under working conditions. This is the so-called temperature compensation mechanism. This mechanism can ensure that the basic performance of the bracelet to emit scalar waves will not be significantly attenuated even in a more drastic temperature change zone; Combining the above three key technical elements, the proposed new scalar wave generation method can obtain stable high-quality output scalar waves under any complex working conditions. This method effectively improves the accuracy, stability and reliability of energy transfer, while greatly enhancing the possibility and breadth of the device's applicability under different conditions and scenarios, and is expected to become a new high-tech product solution with competitive advantages in the market.

[0063] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware, or any combination thereof. When implemented by software, all or part of the embodiments may be implemented in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function according to the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit thereof, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A scalar wave generating chip and a method for manufacturing the same, characterized in that: include: A design of a multi-layer shielding packaging structure for ensuring scalar wave stability and consistency under different environments and usage conditions; Optimizing the chip circuit based on the multi-layer shielding packaging structure to reduce external environmental interference; A high-precision temperature compensation circuit is used to accurately generate the required scalar wave frequency in a wide temperature environment.

2. A scalar wave generating chip and a method for manufacturing the same according to claim 1, characterized in that: The design of the multi-layer shielding packaging structure specifically includes: Select a material with a high dielectric constant as the shielding layer material; Design at least two metal shielding layers and place the signal conducting layer in the middle to improve stability; Fill dielectric layers between each layer of shielding to enhance the isolation between layers; Optimize the design of grounding and shielding layers to ensure good signal integrity and shielding effectiveness; The overall structural layout design is completed, so that the stability and consistency of the scalar wave can be guaranteed even in different environments and usage conditions.

3. A scalar wave generating chip and a method for manufacturing the same according to claim 1, characterized in that: The chip circuit optimization steps based on the multi-layer shielding packaging structure specifically include: Integrate a low noise amplifier inside the package structure; Use low-sensitivity filtering and matching networks; Implement power and signal line decoupling measures to prevent crosstalk; Loop layout optimization and ground return planning; Embed feedback mechanisms such as zero-crossing comparison to enhance the ability to suppress external interference.

4. A scalar wave generating chip and a method for manufacturing the same according to claim 1, characterized in that: The steps of adopting a high-precision temperature compensation circuit specifically include: Set up a reference oscillator on the chip and ensure that its output signal is stable and does not change with temperature; Set up multiple temperature measurement sensors distributed near key components to monitor temperature drift; Use programmable gain controllers to automatically adjust the signal path based on temperature changes; Phase noise suppression unit is implanted in the signal path to maintain low phase noise performance over a wide temperature range; Integrating software and hardware compensation mechanisms ensures that the chip can accurately generate the desired scalar wave even in extremely cold or hot conditions.

5. A scalar wave generating chip and a method for manufacturing the same according to claim 1, characterized in that: Optimizing the chip circuit based on the multi-layer shielding packaging structure includes: Establish an environmental interference model of the shielding structure to analyze the impact of environmental factors; Test the shielding effects of different material combinations to select the best solution; Adjust internal circuit layout to reduce sensitivity to external interference; and A circuit feedback system is designed to maintain the frequency of the scalar wave stable.

6. A scalar wave generating chip and a method for manufacturing the same according to claim 5, characterized in that: Designing a circuit feedback system to maintain the frequency stability of the scalar wave specifically includes: Monitor the degree of change Δf of the actual frequency of the scalar wave from the preset frequency in the working state; When the degree of change Δf exceeds the preset tolerance Tf, the adjustment mechanism is triggered to compensate; Calculate the required adjustment amount according to the compensation ratio K, adjustment amount = change degree × compensation ratio, that is, C = Δf × K; and Adjust the adjustable resistor Rv in the transmitting circuit to make it equal to the calculated required adjustment amount to ensure that the transmitting frequency returns to the normal range.

7. A scalar wave generating chip and a method for manufacturing the same according to claim 6, characterized in that: Adjust the adjustable resistor Rv in the transmitting circuit to ensure the stability of the scalar wave frequency. The operation includes: Detect the impact of environmental changes on current; The adjustment strategy is determined by the change of the ambient temperature T: if the change ΔT exceeds the temperature threshold Tth, the next step is executed; When ΔT exceeds a preset threshold value Tth, the current control voltage ΔV=Kt×ΔT is adjusted and applied to the adjustable power supply; and Implement new control signals to the transmit circuit and dynamically adjust based on the current frequency deviation to achieve frequency consistency Δf<=Δfn.

8. A scalar wave generating chip and a method for manufacturing the same according to claim 7, characterized in that: Implementing new control signals to the transmit circuit involves: Sense changes in the external environment and determine whether the environmental threshold condition E for starting automatic adjustment is met; If the environmental threshold conditions are met, real-time compensation is performed according to the pre-set compensation factor Ki; Calculate whether the difference XiXi,0 between the current environment variable value Xi and its threshold Xi,0 is less than the threshold ε: that is, ΔE = |(XiXi,0) / ε| ≤ Kt; If the above relationship holds, the resistance value is finely adjusted by the microcontroller to stabilize the scalar wave frequency.

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