Laminated ceramic electronic component

Abstract

Provided is a laminated ceramic electronic component having improved mechanical strength and reliability. The laminated ceramic electronic component includes: a ceramic body in which a first internal electrode and a second internal electrode are laminated, the first main surface and the second main surface are opposite to each other in the stacking direction, the first side surface and the second side surface are opposite to each other in the width direction which is straight along with the stacking direction, and the first end surface and the second end surface are opposite to each other in the length direction which is straight along with the stacking direction and the width direction; a first external electrode formed on the first end surface, the edge portion of the first external electrode further extending from the first end surface to the first main surface, the second main surface, the first side surface, and the second side surface; and a second external electrode formed on the second end surface, the edge portion further extending from the second end surface to the first main surface, the second main surface, the first side surface, and the second side surface, the first internal electrode being led out to the first end surface and connected to the first external electrode, and the second internal electrode being led out to the second end surface and connected to the second external electrode, the first external electrode and the second external electrode are each provided with a base external electrode, a resin layer formed on the outer side of the base external electrode, and at least one plated external electrode layer formed on the outer side of the resin layer, and the base external electrode is discontinuously formed on the ceramic body. The ceramic body has an exposed region partially exposed from the discontinuously formed base external electrode, the resin layer covers the discontinuously formed base external electrode and the exposed region, the first external electrode is in the first end surface, and the second external electrode is in the second end surface. The first external electrode and the second external electrode are respectively formed on the first main surface, the second main surface, the first side surface and the second side surface, and are completely covered by a resin layer on the substrate external electrode and the exposed region which are formed discontinuously. The substrate is provided with a region in which the resin layer covers the substrate external electrode and the exposed region which are formed discontinuously, and a resin layer non-forming region in which the resin layer does not cover the substrate external electrode and the exposed region which are formed discontinuously.

Description

Technical Field

[0001] The present invention relates to a laminated ceramic electronic component, and more particularly, to a laminated ceramic electronic component having improved mechanical strength and reliability. Background Art

[0002] Laminated ceramic electronic components such as laminated ceramic capacitors, laminated ceramic thermistors, laminated ceramic varistors, and laminated ceramic composite components are widely used in electronic devices. Patent document 1 (Japanese Patent Application Publication No. 2003-243249) discloses a laminated ceramic capacitor. Figure 7 , a multilayer ceramic capacitor 1100 disclosed in Patent Document 1 is shown.

[0003] The multilayer ceramic capacitor 1100 includes a ceramic body 101. An internal electrode 102 is formed inside the ceramic body 101. External electrodes 105 are formed at both ends of the ceramic body 101. The external electrode 105 includes a base external electrode 103 formed by baking a conductive paste and a plating layer 104 formed on the base external electrode 103.

[0004] In such a laminated ceramic electronic component, improving the mechanical strength between the ceramic body and the external electrode becomes an important issue. That is, a laminated ceramic electronic component is required that, after being mounted on a circuit board, etc., the external electrode will not be peeled off from the ceramic body or cracks will be generated in the ceramic body even if stress is applied due to external force, thermal cycle, etc.

[0005] In multilayer ceramic electronic components, various methods have been studied as a method of improving the mechanical strength between a ceramic body and external electrodes.

[0006] Patent Document 2 (Japanese Patent Application Laid-Open No. 2020-161734) discloses a multilayer ceramic capacitor in which the mechanical strength between the ceramic body and the external electrode is improved by discontinuously forming a base external electrode. Figure 8 , a multilayer ceramic capacitor 1200 disclosed in Patent Document 2 is shown.

[0007] The multilayer ceramic capacitor 1200 includes a ceramic body 201 having ceramic layers stacked thereon. Internal electrodes 202 are formed between the ceramic layers of the ceramic body 201. External electrodes 203 are formed at both ends of the ceramic body 201. The internal electrodes 202 and the external electrodes 203 are connected to each other at both end surfaces of the ceramic body 201.

[0008] The external electrode 203 includes a base external electrode 204 formed by baking a conductive paste, a resin layer 205 , and a plated layer 206 .

[0009] The base external electrode 204 is formed discontinuously on the ceramic body 201. The so-called discontinuous formation means that the coverage rate (coverage) is not 100%. As a result, the ceramic body 201 has an exposed area EA partially exposed from the discontinuously formed base external electrode 204. The exposed area EA of the ceramic body 201 is buried by the resin layer 205. A plating layer 206 is formed on the base external electrode 204 and on the resin layer 205.

[0010] In the multilayer ceramic capacitor 1200, the exposed area EA of the ceramic body 201 where the base external electrode 204 is not formed is buried with the resin layer 205 in order to improve moisture resistance and thus improve reliability. That is, at the end face of the ceramic body 201, the internal electrode 202 is led out to connect to the external electrode 203, but moisture easily penetrates into the inside from this part. In the multilayer ceramic capacitor 1200, since the base external electrode 204 is formed discontinuously, if the plating layer 206 is formed on the base external electrode 204 without providing the resin layer 205, sufficient moisture resistance cannot be obtained. Therefore, in the multilayer ceramic capacitor 1200, the exposed area EA is buried with the resin layer 205, and on this basis, the plating layer 206 is formed on the base external electrode 204 and the resin layer 205, thereby achieving improved moisture resistance.

[0011] In the multilayer ceramic capacitor 1200 disclosed in Patent Document 2, since the base external electrode 204 is discontinuously formed on the ceramic body 201, the residual stress of the base external electrode 204 formed on the ceramic body 201 is relaxed, and the mechanical strength between the ceramic body 201 and the external electrode 203 is increased. Therefore, after the multilayer ceramic capacitor 1200 is mounted on a circuit board or the like, even if stress is applied by external force, thermal cycle, etc., the external electrode 203 (base external electrode 204) is not easily peeled off from the ceramic body 201, and cracks are not easily generated in the ceramic body 201.

[0012] Prior Art Literature

[0013] Patent Literature

[0014] Patent Document 1: Japanese Patent Application Publication No. 2003-243249

[0015] Patent Document 2: Japanese Patent Application Publication No. 2020-161734 Summary of the invention

[0016] Problem that the invention aims to solve

[0017] However, the multilayer ceramic capacitor 1200 still has a problem in that the improvement in moisture resistance is insufficient.

[0018] In a laminated ceramic electronic component such as a laminated ceramic capacitor, in a ceramic body, the surface where the interlayer of the ceramic layer is exposed to the outside and the end of the internal electrode is led out (exposed) from the interlayer of the ceramic layer to the outside becomes the surface where moisture is most likely to penetrate into the inside. For example, in the laminated ceramic capacitor 1200, the two end surfaces of the ceramic body 201 where the interlayer of the ceramic layer is exposed to the outside and the end of the internal electrode 202 is led out from the interlayer of the ceramic layer become the surfaces where moisture is easily penetrated into the inside. That is, the two main surfaces opposite to each other in the stacking direction of the ceramic body 201 are not exposed to the outside, so it is not easy to become a path for moisture to penetrate. In addition, although the interlayer of the ceramic layer is exposed to the outside on both sides of the ceramic body 201, it is not easy to become a path for moisture to penetrate because the end of the internal electrode is not exposed to the outside from the interlayer of the ceramic layer. In contrast, the two end surfaces of the ceramic body 201 are exposed to the outside and the end of the internal electrode is led out from the interlayer of the ceramic layer to the outside, so moisture is easily penetrated from here to the inside.

[0019] Based on this background, there is still room for improving the moisture resistance of the multilayer ceramic capacitor 1200. Figure 8 In the cross section of the multilayer ceramic capacitor 1200 shown in FIG. 1 , the interface between the base external electrode 204 and the resin layer 205 is in contact with the plating layer 206. Generally, the interface between the base external electrode 204 and the resin layer 205 allows moisture to pass more easily than the base external electrode 204 and the resin layer 205. Therefore, in the multilayer ceramic capacitor 1200, there is a problem that moisture easily penetrates from the end surface of the ceramic body 201 to the inside of the ceramic body 201 through the plating layer 206 and further through the interface between the base external electrode 204 and the resin layer 205.

[0020] In addition, in the multilayer ceramic capacitor 1200, there is another problem that the resin layer 205 does not contribute to the improvement of the mechanical strength (bonding strength) between the ceramic body 201 and the base external electrode 204, and the improvement of the mechanical strength is insufficient. Figure 8 In the cross section of the multilayer ceramic capacitor 1200 shown, base external electrodes 204 and resin layers 205 are alternately and fragmentarily formed on the ceramic body 201 , and the resin layers 205 do not contribute to improving the mechanical strength between the ceramic body 201 and the base external electrodes 204 .

[0021] Technical solutions to solve problems

[0022] The present invention is completed to solve the above-mentioned conventional problems. As a technical solution, a laminated ceramic electronic component according to one embodiment of the present invention comprises: a ceramic body in which a first internal electrode and a second internal electrode are laminated, and the ceramic body has a first main surface and a second main surface opposite to each other in the stacking direction, a first side surface and a second side surface opposite to each other in a width direction running straight in the stacking direction, and a first end surface and a second end surface opposite to each other in a length direction running straight in both the stacking direction and the width direction; a first external electrode formed on the first end surface, with an edge further extending from the first end surface to the first main surface, the second main surface, the first side surface, and the second side surface, respectively; and a second external electrode formed on the second end surface, with an edge further extending from the second end surface to the first main surface, the second main surface, the first side surface, and the second side surface, respectively, the first internal electrode being led out to the first end surface and connected to the first external electrode, and the second internal electrode being led out to the second end surface and connected to the first external electrode. 2 external electrodes are connected, wherein the first external electrode and the second external electrode respectively include a base external electrode, a resin layer formed on the outside of the base external electrode, and at least one plated external electrode layer formed on the outside of the resin layer, the base external electrode is discontinuously formed on the ceramic body, the ceramic body has an exposed area partially exposed from the discontinuously formed base external electrode, the resin layer covers the discontinuously formed base external electrode and the exposed area, the first external electrode is in the first end face, and the second external electrode is in the second end face, respectively, the discontinuously formed base external electrode and the exposed area are completely covered by the resin layer, and the first external electrode and the second external electrode are respectively provided with an area where the discontinuously formed base external electrode and the exposed area are covered by the resin layer, and a resin layer non-formed area where the discontinuously formed base external electrode and the exposed area are not covered by the resin layer on the first main surface, the second main surface, the first side surface, and the second side surface.

[0023] Effects of the Invention

[0024] In a multilayer ceramic electronic component according to an embodiment of the present invention, at least in the first end face and the second end face of the ceramic body, the exposed area of ​​the base external electrode and the ceramic body is completely covered by the resin layer, so that the component has high moisture resistance and high reliability. That is, it is difficult for moisture to penetrate into the inside, and it is difficult for the component to become defective or malfunction due to the penetration of moisture.

[0025] In addition, in the laminated ceramic electronic component according to one embodiment of the present invention, since the base external electrode is discontinuously formed on the ceramic body, the residual stress of the base external electrode formed on the ceramic body is relaxed, and the mechanical strength between the ceramic body and the external electrode is high. That is, after being mounted on a circuit board, even if stress is applied by external force, thermal cycle, etc., the external electrode is not easy to be peeled off from the ceramic body, and cracks are not easy to be generated in the ceramic body.

[0026] In addition, in the laminated ceramic electronic component according to one embodiment of the present invention, the resin layer covers the base external electrode from the outside, which helps to improve the bonding strength between the base external electrode and the ceramic body, so the mechanical strength between the ceramic body and the external electrode is high. That is, after being mounted on a circuit board, even if stress is applied due to external force, thermal cycle, etc., the external electrode is not easy to be peeled off from the ceramic body, and cracks are not easy to be generated in the ceramic body.

[0027] In addition, in the multilayer ceramic electronic component according to one embodiment of the present invention, the first and second external electrodes are formed in a cap-like shape at the ends of the ceramic body, thereby improving the mechanical strength between the ceramic body and the first and second external electrodes.

[0028] Furthermore, in a laminated ceramic electronic component according to one embodiment of the present invention, the base external electrode and the plated external electrode layer are mechanically and electrically connected in the resin layer non-forming region, thereby improving the mechanical strength of the first external electrode and the second external electrode and improving electrical reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 (A) is a perspective view of the multilayer ceramic capacitor 100 according to the first embodiment. Figure 1 (B) is an exploded perspective view of a main part of the multilayer ceramic capacitor 100 .

[0030] Figure 2 is a cross-sectional view of the multilayer ceramic capacitor 100 .

[0031] Figure 3 (A) and (B) are cross-sectional views showing steps performed in an example of a method for manufacturing the multilayer ceramic capacitor 100 .

[0032] Figure 4 (C) and (D) are Figure 3 (B) and subsequent figures are cross-sectional views showing steps performed in an example of a method for manufacturing the multilayer ceramic capacitor 100 .

[0033] Figure 5 (E) and (F) are Figure 4 (D) and subsequent figures are cross-sectional views showing steps performed in an example of a method for manufacturing the multilayer ceramic capacitor 100 .

[0034] Figure 6 It is a cross-sectional view of a multilayer ceramic capacitor 200 according to the second embodiment.

[0035] Figure 71 is a cross-sectional view showing a multilayer ceramic capacitor 1100 disclosed in Patent Document 1.

[0036] Figure 8 1 is a cross-sectional view showing a multilayer ceramic capacitor 1200 disclosed in Patent Document 2. DETAILED DESCRIPTION

[0037] The following, with the attached Figure 1 The method for implementing the present invention is described below. In addition, each embodiment exemplifies the implementation of the present invention, and the present invention is not limited to the contents of the embodiment. In addition, the contents described in different embodiments can be combined for implementation, and the implementation contents in this case are also included in the present invention. In addition, the drawings are used to help understand the description, and are sometimes drawn schematically. The ratio of the dimensions of the drawn components or components is sometimes inconsistent with the ratio of these dimensions described in the description. In addition, there are cases where the components described in the description are omitted in the drawings, and the number of components is omitted and drawn.

[0038] [First embodiment]

[0039] In this embodiment, a laminated ceramic capacitor is described as an example of a laminated ceramic electronic component. However, the type of the laminated ceramic electronic component of the present invention is arbitrary and is not limited to the laminated ceramic capacitor.

[0040] exist Figure 1 (A), (B), Figure 2 , a multilayer ceramic capacitor 100 according to the first embodiment is shown. Figure 1 (A) is a perspective view of the multilayer ceramic capacitor 100 . Figure 1 (B) is an exploded perspective view of the main part of the multilayer ceramic capacitor 100 , and shows two of the plurality of ceramic layers 1 a described later. Figure 2 is a cross-sectional view of a laminated ceramic capacitor 100, showing Figure 1 XX is indicated by a dashed arrow in (A) and (B). In addition, the height direction T, the length direction L, and the width direction W are shown in the figure, and these directions are sometimes mentioned in the following description. In this embodiment, the stacking direction of the ceramic layer 1a, the first internal electrode 2, and the second internal electrode 3 described later is taken as the height direction T.

[0041] The multilayer ceramic capacitor 100 includes a ceramic body 1 in which a plurality of ceramic layers 1a, a plurality of first internal electrodes 2, and a plurality of second internal electrodes 3 are stacked. The ceramic body 1 has a rectangular parallelepiped shape, and has a first main surface 1A and a second main surface 1B facing each other in a height direction T (stacking direction), a first side surface 1C and a second side surface 1D facing each other in a width direction W running straight to the height direction T, and a first end surface 1E and a second end surface 1F facing each other in a length direction L running straight to both the height direction T and the width direction W.

[0042] The dimensions of the ceramic body 1 in the height direction T, the width direction W, and the length direction L are arbitrary. Concavities and convexities may be formed partially or entirely on the first main surface 1A, the second main surface 1B, the first side surface 1C, the second side surface 1D, the first end surface 1E, and the second end surface 1F.

[0043] In the rectangular parallelepiped ceramic body 1, the edges where two surfaces meet and the corners where three surfaces meet are preferably rounded. For example, the edges and corners of the ceramic body 1 can be rounded by barrel-polishing the unfired ceramic body in the manufacturing process.

[0044] The material of the ceramic body 1 (ceramic layer 1a) is arbitrary, and for example, a dielectric ceramic containing BaTiO3 as a main component can be used. However, a dielectric ceramic containing other materials such as CaTiO3, SrTiO3, and CaZrO3 as a main component instead of BaTiO3 can also be used. Subcomponents such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds can also be added to the dielectric ceramic.

[0045] In the ceramic body 1, the number of stacked ceramic layers 1a is arbitrary, and is preferably 10 to 2000 layers, including the protective layers on the first main surface 1A side and the second main surface 1B side where the first internal electrode 2 and the second internal electrode 3 are not stacked. The thickness of the ceramic layer 1a is preferably 0.1 μm to 10.0 μm, for example.

[0046] The material of the first internal electrode 2 and the second internal electrode 3 is arbitrary, but for example, Ni, Cu, Ag, Pd, Au, or alloys thereof can be used. As the alloy, for example, Ag-Pd alloy can be cited. In addition, these metals and alloys are not limited to one type, and may include multiple types.

[0047] The planar shapes of the first internal electrode 2 and the second internal electrode 3 are arbitrary, but can be rectangular, for example. In addition, the planar shapes of the first internal electrode 2 and the second internal electrode 3 can also be rounded at the corners or tapered at the sides.

[0048] The number of layers of the first internal electrode 2 and the second internal electrode 3 is arbitrary, and the total number is preferably, for example, 10 to 2000. The thickness of the first internal electrode 2 and the second internal electrode 3 is arbitrary, and each is preferably, for example, 0.1 μm to 10.0 μm.

[0049] In principle, the first internal electrodes 2 and the second internal electrodes 3 are preferably stacked alternately inside the ceramic body 1. When the ceramic body 1 is viewed in the height direction T, the first internal electrodes 2 and the second internal electrodes 3 overlap. Capacitance is formed between the first internal electrodes 2 and the second internal electrodes 3 that overlap with the ceramic layer 1a, and capacitor characteristics are exhibited.

[0050] The first internal electrode 2 is led out to the first end face 1E of the ceramic body 1. The second internal electrode 3 is led out to the second end face 1F of the ceramic body 1. Neither the first internal electrode 2 nor the second internal electrode 3 is exposed on the first side face 1C and the second side face 1D of the ceramic body 1. That is, both the first internal electrode 2 and the second internal electrode 3 have gaps between them and the first side face 1C and the second side face 1D.

[0051] A first external electrode 4 is formed at one end of the ceramic body 1. A second external electrode 5 is formed at the other end of the ceramic body 1. The first external electrode 4 and the second external electrode 5 are respectively formed in a cap shape. That is, the first external electrode 4 is formed on the first end surface 1E of the ceramic body 1, and the edge further extends from the first end surface 1E to the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D. The second external electrode 5 is formed on the second end surface 1F of the ceramic body 1, and the edge further extends from the second end surface 1F to the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D.

[0052] However, the first external electrode 4 only needs to be formed on at least the first end surface 1E of the ceramic body 1, and the portions formed on the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D may be omitted. In addition, the second external electrode 5 only needs to be formed on at least the first end surface 1E of the ceramic body 1, and the portions formed on the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D may be omitted.

[0053] The thickness of the first external electrode 4 and the second external electrode 5 are arbitrary, but are preferably, for example, 0.1 μm to 20.0 μm.

[0054] The plurality of first internal electrodes 2 are electrically connected to the first external electrode 4. The plurality of second internal electrodes 3 are electrically connected to the second external electrode 5.

[0055] like Figure 2As shown, the first external electrode 4 and the second external electrode 5 respectively include a base external electrode 6 formed on the outer surface of the ceramic body 1, a resin layer 7 formed on the base external electrode 6, and at least one plated external electrode layer formed on the resin layer 7.

[0056] The resin layer 7 of this embodiment contains metal. The material of the resin layer 7 is sometimes called a conductive resin. However, in terms of structure, when electrical connection between the base external electrode 6 and the plated external electrode layer can be achieved, a material that does not contain metal can be used for the resin layer 7.

[0057] In the present embodiment, the first external electrode 4 and the second external electrode 5 include a first Ni-plated electrode layer 8 and a second Sn-plated electrode layer 9 as plated external electrode layers, respectively.

[0058] Furthermore, in the present embodiment, the first external electrode 4 and the second external electrode 5 each have a resin layer non-forming region NR in which the resin layer 7 does not cover the base external electrode 6. In the resin layer non-forming region NR, the plated external electrode layer (the first layer of Ni-plated electrode layer 8) covers the base external electrode 6, and the two are mechanically and electrically connected.

[0059] The material of the base external electrode 6 is arbitrary, but includes metal and glass components, for example. The base external electrode 6 may be formed by firing simultaneously with the ceramic body 1, or may be formed by applying a conductive paste and firing after the ceramic body 1 is manufactured.

[0060] The type of metal included in the base external electrode 6 is arbitrary, but for example, Cu, Ni, Ag, Pd, Au, and alloys thereof can be used. As alloys, for example, Ag-Pd alloys can be cited. In addition, these metals and alloys are not limited to one type, and can also include multiple types.

[0061] The type of glass component contained in the base external electrode 6 is also arbitrary, but for example, a material containing at least one selected from B, Si, Ba, Mg, Al, Li, etc. can be used.

[0062] The base external electrode 6 is not limited to a single layer, but may include multiple layers. The thickness of the base external electrode 6 is arbitrary, but for example, the size near the center of the first end surface 1E of the first external electrode 4 and the size near the center of the first end surface 1E of the second external electrode 5 are preferably 20 μm or less.

[0063] Depend on Figure 2It can be seen that the base external electrode 6 is formed discontinuously on the ceramic body 1. The so-called discontinuous formation means that the coverage rate (coverage rate) is not 100%. As a result, the ceramic body 1 has an exposed area EA partially exposed from the discontinuously formed base external electrode 6. When the coverage rate of the base external electrode 6 is high, the exposed area EA tends to appear in the base external electrode 6 in an island shape. On the contrary, when the coverage rate of the base external electrode 6 is low, the base external electrode 6 tends to appear in the exposed area EA in an island shape. The exposed area EA can be formed uniformly throughout the entire base external electrode 6, or it can be concentrated in a part of the base external electrode 6.

[0064] When the exposed area EA is formed uniformly throughout the entire base external electrode 6, the thickness of the base external electrode 6 can be made uniform (even) throughout the entire base external electrode 6. Since no protruding and thicker portion is formed, the outer dimensions of the multilayer ceramic capacitor 100 including the first external electrode 4 and the second external electrode 5 can be suppressed from increasing.

[0065] In the first external electrode 4 and the second external electrode 5, when the exposed area EA is concentrated in the peripheral area of ​​the first end face 1E and the second end face 1F compared to the central area of ​​the first end face 1E and the second end face 1F, the thickness of the central area of ​​the first end face 1E and the second end face 1F of the base external electrode 6 can be made larger than the thickness of the peripheral area of ​​the first end face 1E and the second end face 1F of the base external electrode 6, thereby improving the sealing strength between the ceramic body 1 and the base external electrode 6.

[0066] For example, the average size of the exposed area EA (the average size between adjacent base external electrodes 6) appearing in the cross section of the multilayer ceramic capacitor 100 parallel to the first side surface 1C and the second side surface 1D is preferably greater than 0.1 μm and less than 10.0 μm. This is because, if it is less than 0.1 μm, the base external electrodes 6 may cause necking to each other, the residual stress of the base external electrode 6 may increase, and the mechanical strength (bonding strength) between the ceramic body 1 and the base external electrode 6 may decrease. Also, if it exceeds 10.0 μm, the electrical connectivity between the first internal electrode 2 and the first external electrode 4 and between the second internal electrode 3 and the second external electrode 5 may decrease, resulting in a decrease in the capacitance of the multilayer ceramic capacitor 100 and an increase in the equivalent series resistance (ESR).

[0067] The thickness of the base external electrode 6 is arbitrary, but for example, the maximum thickness at the first end surface 1E and the second end surface 1F is preferably 20 μm or less.

[0068] In the multilayer ceramic capacitor 100, the resin layer 7 covers the base external electrode 6 and the exposed area EA. The resin layer 7 completely covers the base external electrode 6 and the exposed area EA in at least the first end face 1E of the ceramic body 1. In addition, the resin layer 7 completely covers the base external electrode 6 and the exposed area EA in at least the second end face 1F of the ceramic body 1. The so-called complete coverage means that the base external electrode 6 and the exposed area EA are completely hidden by the resin layer 7, and the base external electrode 6 and the exposed area EA (ceramic body 1) are not exposed to the outside.

[0069] The reason why the resin layer 7 completely covers the base external electrode 6 and the exposed area EA in at least the first end face 1E and the second end face 1F of the ceramic body 1 is as follows. That is, if the resin layer 7 does not completely cover the base external electrode 6 and the exposed area EA, when observing the cross section parallel to the first side face 1C and the second side face 1D, the base external electrode 6 and the resin layer 7 are alternately formed in fragments in the height direction T in the first end face 1E and the second end face 1F of the ceramic body 1. However, in this structure, the resin layer 7 does not contribute to the improvement of the bonding strength, the compressive stress of the first external electrode 4 and the second external electrode 5 in the height direction T becomes weak, and the bonding strength of the first external electrode 4 and the second external electrode 5 to the ceramic body 1 becomes insufficient. That is, the first external electrode 4 and the second external electrode 5 become easy to peel off from the ceramic body 1. In contrast, in the multilayer ceramic capacitor 100, the resin layer 7 completely covers the base external electrode 6 and the exposed area EA in at least the first end face 1E and the second end face 1F of the ceramic body 1, the compressive stress in the height direction T of the first external electrode 4 and the second external electrode 5 is strong, the bonding strength of the first external electrode 4 and the second external electrode 5 to the ceramic body 1 is improved, and the first external electrode 4 and the second external electrode 5 are not easily peeled off from the ceramic body 1.

[0070] In addition, in at least the first end face 1E and the second end face 1F of the ceramic body 1, when the resin layer 7 completely covers the base external electrode 6 and the exposed area EA, the resin layer 7 becomes a structure that protects the base external electrode 6 formed on the ceramic body 1, and the base external electrode 6 becomes difficult to peel off from the ceramic body 1. Therefore, it can be seen from this point that the bonding strength of the first external electrode 4 and the second external electrode 5 to the ceramic body 1 is improved.

[0071] In addition, in the multilayer ceramic capacitor 100, the resin layer 7 completely covers the base external electrode 6 and the exposed area EA in the first end surface 1E and the second end surface 1F of the ceramic body 1, thereby improving moisture resistance. That is, as described above, the first end surface 1E and the second end surface 1F of the ceramic body 1 are the places where moisture is most likely to penetrate into the interior of the ceramic body 1, but these parts are completely covered by the resin layer 7, so the moisture resistance is improved. Therefore, the reliability of the multilayer ceramic capacitor 100 is high.

[0072] The surfaces of the resin layer 7 formed on the first end surface 1E and the second end surface 1F of the ceramic body 1 may be flat or may be formed with irregularities.

[0073] On the other hand, the first external electrode 4, which is formed on the first main surface 1A, the second main surface 1B, the first side surface 1C and the second side surface 1D of the ceramic body 1, has a region where the base external electrode 6 and the exposed area EA are covered by the resin layer 7, and a resin layer non-formation region NR where the base external electrode 6 and the exposed area EA are not covered at all by the resin layer 7. Similarly, the second external electrode 5, which is formed on the first main surface 1A, the second main surface 1B, the first side surface 1C and the second side surface 1D of the ceramic body 1, has a region where the base external electrode 6 and the exposed area EA are covered by the resin layer 7, and a resin layer non-formation region NR where the base external electrode 6 and the exposed area EA are not covered at all by the resin layer 7.

[0074] The resin layer non-forming region NR of the first external electrode 4 is formed on the side away from the first end face 1E of the ceramic body 1. The resin layer non-forming region NR of the second external electrode 5 is formed on the side away from the second end face 1F of the ceramic body 1. In the resin layer non-forming region NR, the end of the base external electrode 6 and the plated external electrode layer (Ni plated electrode layer 8, Sn plated electrode layer 9) are directly bonded, so that the first external electrode 4 and the second external electrode 5 become strong and the mechanical strength is improved. In addition, in the resin layer non-forming region NR, the base external electrode 6 and the plated external electrode layer are electrically connected.

[0075] In the portions of the first external electrode 4 and the second external electrode 5 formed on the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D of the ceramic body 1, when the dimension of the length direction L of the first external electrode 4 is set to 100%, the dimension of the length direction L of the region covered by the resin layer 7 with respect to the base external electrode 6 and the exposed area EA is preferably 75% or less. This is because, in this case, the dimension of the length direction L of the resin layer non-formed region NR can be ensured to be sufficiently large, the bonding strength between the end of the base external electrode 6 and the plated external electrode layer can be increased, and the mechanical strength of the first external electrode 4 and the second external electrode 5 is improved.

[0076] As described above, in this embodiment, the resin layer 7 contains metal. Therefore, the first external electrode 4 and the second external electrode 5 electrically connect the base external electrode 6 and the plated external electrode layer (Ni plated electrode layer 8 and Sn plated electrode layer 9 ) via the resin layer 7 .

[0077] In the portion where the base external electrode 6 is not formed near the center of the first end face 1E and the second end face 1F of the ceramic body 1, the thickness of the resin layer 7 is preferably, for example, not less than 0.1 μm and not more than 100 μm. In addition, near the center of the first external electrode 4 and the second external electrode 5 of the first main surface 1A, the second main surface 1B, the first side surface 1C, and the second side surface 1D of the ceramic body 1 in the longitudinal direction L, the thickness of the resin layer 7 is preferably, for example, not less than 0.1 μm and not more than 100 μm.

[0078] The resin layer 7 contains, for example, a thermosetting resin and a metal. Since the resin layer 7 contains a thermosetting resin, it is generally more flexible than the base external electrode 6 and the plated external electrode layer (Ni plated electrode layer 8, Sn plated electrode layer 9). Therefore, even when a physical impact or an impact caused by a thermal cycle is applied to the multilayer ceramic capacitor 100, the resin layer 7 functions as a buffer layer, so that cracks can be suppressed from occurring in the ceramic body 1.

[0079] As the resin contained in the resin layer 7, various known thermosetting resins such as epoxy resin, phenolic resin, polyurethane resin, silicone resin, and polyimide resin can be used. Among them, epoxy resin is one of the most suitable resins because it is excellent in heat resistance, moisture resistance, and adhesion.

[0080] The resin contained in the resin layer 7 preferably accounts for 25 volume % or more and 65 volume % or less relative to the total volume of the material of the resin layer 7 .

[0081] It is also preferable that not only the thermosetting resin but also a curing agent is contained in the resin layer 7. When an epoxy resin is used as the base resin, various well-known compounds such as phenolic, amine, acid anhydride, and imidazole can be used as the curing agent.

[0082] As the metal contained in the resin layer 7, for example, metal fillers of Ag, Cu, Ni, or alloys thereof can be used. In addition, Ag or the like may be applied to the surface of these metal fillers. In the case where Ag is applied to the surface of the metal filler, Cu, Ni or the like is preferably used for the main body of the metal filler. In addition, for the metal filler of Cu, a filler subjected to an oxidation prevention treatment may also be used.

[0083] When Ag is used for the metal filler contained in the resin layer 7, Ag has an extremely low resistivity among metals, is non-oxidizable and has high resistance, and thus can form a good resin layer 7. In addition, when a metal other than Ag is used for the metal contained in the resin layer 7 and Ag is coated on the surface, the resin layer 7 can be formed inexpensively while enjoying the good properties of Ag.

[0084] The metal contained in the resin layer 7 preferably accounts for 35 volume % or more and 75 volume % or less relative to the total volume of the material of the resin layer 7 .

[0085] The shape of the metal contained in the resin layer 7 is not particularly limited. For example, it may be spherical, flat, etc. In addition, it is also preferable to use a mixture of spherical metal and flat metal. The average particle size of the metal contained in the resin layer 7 is not particularly limited. The average particle size of the metal contained in the resin layer 7 can be set to, for example, 0.3 μm or more and 10 μm or less.

[0086] The metal contained in the resin layer 7 is responsible for ensuring the conductivity in the resin layer 7. That is, the metal fillers are in contact with each other, thereby forming a conduction path inside the resin layer 7.

[0087] In the present embodiment, as the plated external electrode layer, a first layer of Ni plated electrode layer 8 and a second layer of Sn plated electrode layer 9 are formed in the first external electrode 4 and the second external electrode 5. However, the number of layers and the material of the plated electrode layer are arbitrary and can be changed. As the material of the plated electrode layer, in addition to Ni and Sn, for example, Cu, Ag, Pd, Au, Ag-Pd alloy, etc. can also be used. For example, it is also possible to replace the two-layer structure of the first layer of Ni plated electrode layer 8 and the second layer of Sn plated electrode layer 9 with a three-layer structure in which the first layer is set as Sn plated electrode layer, the second layer is set as Ni plated electrode layer, and the third layer is set as Sn plated electrode layer.

[0088] The thickness of each plated external electrode layer is preferably 0.1 μm or more and 20.0 μm or less.

[0089] The first Ni-plated electrode layer 8 covers the resin layer 7 in the region where the resin layer 7 is formed, and covers the base external electrode 6 and the ceramic body 1 in the resin layer non-formed region NR where the resin layer 7 is not formed. When the Ni-plated electrode layer 8 covers the resin layer 7, it is preferred that the Ni-plated electrode layer 8 completely covers the resin layer 7. The Ni-plated electrode layer 8 plays the role of preventing the base external electrode 6 from being corroded by solder when the multilayer ceramic capacitor 100 is mounted.

[0090] The second Sn-plated electrode layer 9 covers the Ni-plated electrode layer 8. The Sn-plated electrode layer 9 plays a role of improving the wettability of solder when mounting the multilayer ceramic capacitor 100.

[0091] In the first embodiment of the multilayer ceramic capacitor 100 having the above structure, the base external electrode 6 is discontinuously formed on the ceramic body 1, so that the residual stress of the base external electrode 6 formed on the ceramic body 1 is relaxed, and the mechanical strength between the ceramic body 1 and the first external electrode 4 and the second external electrode 5 is high.

[0092] Furthermore, the multilayer ceramic capacitor 100 according to one embodiment of the present invention has high moisture resistance and thus high reliability because the base external electrode 6 and the exposed area EA of the ceramic body 1 are completely covered by the resin layer 7 at least on the first end surface 1E and the second end surface 1F of the ceramic body 1 .

[0093] (An Example of a Method for Manufacturing Multilayer Ceramic Capacitor 100)

[0094] Reference Figure 3 (A)~ Figure 5 (F) describes an example of a method for manufacturing the multilayer ceramic capacitor 100 .

[0095] First, make Figure 3 The ceramic body 1 is shown in (A).

[0096] Although not shown in the figure, first, dielectric ceramic powder, a binder resin, a solvent, etc. are prepared, and these are wet-mixed to prepare ceramic slurry.

[0097] Next, the ceramic slurry is applied to the carrier film in a sheet form using a die coater, a gravure coater, a micro gravure coater, or the like, and dried to produce a ceramic green sheet.

[0098] Next, a previously prepared electrical paste is printed in a desired pattern shape on the main surface of a given ceramic green sheet to form the first internal electrode 2 and the second internal electrode 3. The conductive paste is not printed on the ceramic green sheet that will serve as a protective layer.

[0099] Next, the ceramic green sheets are stacked in a given order and integrated by isostatic pressing or the like to produce an unfired ceramic main body block.

[0100] Next, the unfired ceramic body block is cut into a given size, thereby obtaining individual unfired ceramic bodies.

[0101] Next, the unfired ceramic body is subjected to barrel grinding as necessary to round off the ridges and corners.

[0102] Next, the unfired ceramic body is fired according to a given curve to complete the ceramic body 1. For example, the firing temperature is set to about 900° C. to 1400° C. In addition, at this time, the conductive paste printed on the main surface of the ceramic green sheet is also fired at the same time, forming the first internal electrode 2 and the second internal electrode 3 inside the ceramic body 1.

[0103] Next, in order to form the base external electrode 6 on the ceramic body 1, as shown in FIG. Figure 3 As shown in (B), conductive paste 16 is applied to both ends of the ceramic body 1. Specifically, for example, the ends of the ceramic body 1 are immersed in a bath containing conductive paste 16. By adjusting the number and depth of immersion, the formation position, amount, shape, etc. of the applied conductive paste 16 can be adjusted.

[0104] In this embodiment, the thickness of the conductive paste 16 applied to the end of the ceramic body 1 is made smaller than that in the case of manufacturing a general multilayer ceramic capacitor. This is to form the base external electrode 6 discontinuously on the ceramic body 1 .

[0105] Next, the ceramic body 1 is heated according to a given curve to sinter the conductive paste 16 applied to the end of the ceramic body 1 to the ceramic body 1. The sintering temperature is set to, for example, about 700°C to 900°C. As a result, Figure 4 As shown in FIG. 2 (C), discontinuous base external electrodes 6 are formed at both ends of the ceramic body 1 . In addition, the ceramic body 1 has an exposed area EA partially exposed from the base external electrode 6 .

[0106] Then, if Figure 4 As shown in (D), the resin layer 7 is formed on the ceramic body 1 on which the base external electrode 6 is formed.

[0107] Specifically, first, a resin paste containing a thermosetting resin and a metal component is applied to the sintered layer. The application is performed, for example, by dipping the end of the ceramic body 1 into a bath filled with the resin paste.

[0108] Next, heat treatment is performed at a desired temperature to heat cure the thermosetting resin to form a resin layer. The temperature of the heat treatment is, for example, 250° C. to 550° C., but may be a temperature above that. The atmosphere during the heat treatment is preferably an N2 atmosphere. In addition, in order to prevent the scattering of the resin and the oxidation of various metal components, the oxygen concentration is preferably suppressed to below 100 ppm.

[0109] The size and shape of the length direction L of the base external electrode 6 formed on the first main surface 1A, the second main surface 1B, the first side surface 1C, the second side surface 1D, the first end surface 1E and the second end surface 1F of the ceramic body 1 can be adjusted by changing the gap and the amount of paste by changing the pressing amount when the resin paste is dip-coated.

[0110] Then, if Figure 5 As shown in (E), in the region where the resin layer 7 is formed, the Ni-plated electrode layer 8 is formed on the surface of the resin layer 7, and in the resin layer non-formed region NR where the resin layer 7 is not formed, the Ni-plated electrode layer 8 is formed on the surface of the base external electrode 6 and the ceramic body 1. The Ni-plated electrode layer 8 can be formed by any method, but can be formed by electrolytic barrel plating, for example.

[0111] Then, if Figure 5 As shown in (F), Sn plated electrode layer 9 is formed on the surface of Ni plated electrode layer 8, thereby completing the multilayer ceramic capacitor 100. The Sn plated electrode layer 9 may be formed by any method, but may be formed by electrolytic barrel plating, for example.

[0112] [Modification of the first embodiment]

[0113] A multilayer ceramic capacitor according to a modified example was produced by changing part of the structure of the multilayer ceramic capacitor 100 according to the first embodiment.

[0114] Basic structure and structure of multilayer ceramic capacitor according to modification example Figure 2 The structure of the multilayer ceramic capacitor 100 according to the first embodiment shown in FIG. 1 is the same as that of the multilayer ceramic capacitor 100 according to the first embodiment shown in FIG. Figure 2 However, when invoked, set Figure 2 The resin layer 7 of the multilayer ceramic capacitor is read as resin layer 7'.

[0115] As described above, in the multilayer ceramic capacitor 100 according to the first embodiment, metal is contained in the resin layer 7. The multilayer ceramic capacitor according to the modified example changes this so that the resin layer 7' does not contain metal.

[0116] In the multilayer ceramic capacitor according to the modification, the resin layer 7' does not have conductivity. Therefore, in the multilayer ceramic capacitor according to the modification, the base external electrode 6 and the plated external electrode layer are electrically connected in the resin layer non-formation region NR where the plated external electrode layer (Ni plated electrode layer 8, Sn plated electrode layer) is formed on the base external electrode 6. The other structures of the multilayer ceramic capacitor according to the modification are set to be the same as those of the multilayer ceramic capacitor 100.

[0117] [Second embodiment]

[0118] exist Figure 6 FIG. 2 shows a multilayer ceramic capacitor 200 according to a second embodiment. Figure 6 It is a cross-sectional view of the multilayer ceramic capacitor 200 parallel to the first side surface 1C and the second side surface 1D.

[0119] The multilayer ceramic capacitor 200 according to the second embodiment has Figure 6 In the cross section parallel to the first side surface 1C and the second side surface 1D shown, the portion where the dimension in the height direction T of the ceramic body 1 becomes the largest is obtained, the first point Y on the first main surface 1A as one starting point of the dimension and the second point Z on the second main surface 1B as the other starting point of the dimension are obtained, and when the first imaginary line LY extending in the length direction L and passing through the first point Y and the second imaginary line LZ extending in the length direction L and passing through the second point Z are drawn, the first imaginary line LY and the second imaginary line LZ do not overlap with the resin layer 7 of the first external electrode 4 and the resin layer 7 of the second external electrode 5. (In addition, the first point Y and the second point Z sometimes exist in multiple locations respectively) If expressed in another way, the maximum dimension HC in the height direction T of the ceramic body 1 is larger than the maximum dimension HR in the height direction T of the resin layer 7 in the first external electrode 4 and the second external electrode 5.

[0120] The multilayer ceramic capacitor 200 according to the second embodiment has the above-mentioned structure, so when mounted on a substrate or the like by reflow soldering or the like, the opposing surface of the mounting surface (upper main surface) of the substrate, which is connected to the plurality of convex portions appearing on the surface of the Ni-plated electrode layer 8, becomes more parallel to the mounting surface of the substrate. Therefore, the multilayer ceramic capacitor 200 can be stably mounted on the substrate or the like, and mounting defects such as the so-called tombstone phenomenon are not likely to occur. In addition, the Sn-plated electrode layer 9 generally disappears by performing reflow soldering.

[0121] The above-described structures of the first external electrode 4 and the second external electrode 5 of the multilayer ceramic capacitor 200 can be formed by barrel-polishing the unfired ceramic body to slightly round the ridges and corners of the ceramic body 1 during the manufacturing process.

[0122] The embodiments of the present invention have been described above, but the present invention is not limited to the above-described contents, and various modifications can be made according to the gist of the invention.

[0123] For example, in the above embodiment, the laminated ceramic capacitor 100 is cited as an example for explanation, but the type of the laminated ceramic electronic component of the present invention is arbitrary and is not limited to the laminated ceramic capacitor. The present invention can be applied to all types of laminated ceramic electronic components such as laminated ceramic thermistors, laminated ceramic varistors, laminated ceramic inductors, and laminated ceramic composite components.

[0124] Furthermore, in the above-described embodiment, the resin layer non-formed region NR is provided in each of the first external electrode 4 and the second external electrode 5 , but the resin layer non-formed region NR may be omitted.

[0125] In addition, in the above-mentioned embodiment, the first external electrode 4 and the second external electrode 5 are also formed on the first main surface 1A, the second main surface 1B, the first side surface 1C, the second side surface 1D, the first end surface 1E, and the second end surface 1F of the ceramic body 1, respectively, but these parts can be omitted. That is, the first external electrode 4 only needs to be formed on at least the first end surface 1E, and the second external electrode 5 only needs to be formed on at least the first end surface 1E.

[0126] A multilayer ceramic electronic component according to one embodiment of the present invention is as described in the column of “Solution to Problem”.

[0127] In the laminated ceramic electronic component, it is also preferred that the resin layer non-formed region of the first external electrode is formed on the side away from the first end face among the first main surface, the second main surface, the first side surface, and the second side surface of the ceramic body, and the resin layer non-formed region of the second external electrode is formed on the side away from the second end face among the first main surface, the second main surface, the first side surface, and the second side surface of the ceramic body. In this case, the resin layer is wrapped inside by the base external electrode and the plated external electrode layer, and the integrity of the first external electrode and the second external electrode is improved, and the mechanical strength is improved.

[0128] It is also preferred that when the lengthwise dimensions of the portions formed on the first main surface, the second main surface, the first side surface, and the second side surface of the first external electrode and the second external electrode are set to 100%, the ratio of the lengthwise dimensions of the region covered by the resin layer to the discontinuously formed base external electrode and the exposed region is 75% or less. In this case, the lengthwise dimensions of the non-formed region of the resin layer can be sufficiently ensured, and the bonding strength between the base external electrode and the plated external electrode layer can be increased, so that the mechanical strength of the first external electrode and the second external electrode is improved respectively. In addition, the lengthwise dimensions of the non-formed region of the resin layer can be sufficiently ensured, and the electrical connection between the base external electrode and the plated external electrode layer becomes reliable, so that the electrical reliability of the first external electrode and the second external electrode is improved respectively.

[0129] It is also preferable that the resin layer contains metal. In this case, the base external electrode 6 and the plated external electrode layer are electrically connected via the resin layer 7, so that the electrical reliability of the first external electrode and the second external electrode is improved.

[0130] It is also preferred that, in any cross section parallel to the first side surface and the second side surface, the portion where the height dimension of the ceramic body becomes the largest is obtained, the first point on the first main surface as one starting point of the dimension and the second point on the second main surface as another starting point of the dimension are obtained, and when a first imaginary line extending in the length direction and passing through the first point and a second imaginary line extending in the length direction and passing through the second point are drawn, neither the first imaginary line nor the second imaginary line overlaps with the resin layer of the first external electrode and the resin layer of the second external electrode. In this case, when mounting on a substrate or the like by reflow soldering or the like, the opposing surface to which the mounting surface (upper main surface) of the substrate, which is connected to a plurality of convex portions appearing on the surface of the plated external electrode layer, faces becomes more parallel to the mounting surface of the substrate. Therefore, it can be mounted stably on the substrate or the like, and mounting defects such as the so-called tombstone phenomenon are less likely to occur.

[0131] Description of Reference Numerals

[0132] 1: Ceramic body;

[0133] 1a: ceramic layer;

[0134] 1A: 1st main surface;

[0135] 1B: 2nd main surface;

[0136] 1C: 1st side;

[0137] 1D: lateral side 2;

[0138] 1E: 1st end face;

[0139] 1F: 2nd end face;

[0140] 2: 1st internal electrode;

[0141] 3: Second internal electrode;

[0142] 4: 1st external electrode;

[0143] 5: second external electrode;

[0144] 6: substrate external electrode;

[0145] 7: resin layer;

[0146] 8: Ni-plated electrode layer;

[0147] 9: Sn plated electrode layer.

Claims

1. A laminated ceramic electronic component comprising: A ceramic body having a first internal electrode and a second internal electrode stacked therein, having a first main surface and a second main surface opposite to each other in the stacking direction, a first side surface and a second side surface opposite to each other in a width direction running straight to the stacking direction, and a first end surface and a second end surface opposite to each other in a length direction running straight to both the stacking direction and the width direction; a first external electrode formed on the first end surface, with an edge further extending from the first end surface to the first main surface, the second main surface, the first side surface, and the second side surface; and a second external electrode formed on the second end surface, wherein the edge portion further extends from the second end surface to the first main surface, the second main surface, the first side surface, and the second side surface, respectively; The first internal electrode is led out to the first end surface and connected to the first external electrode, and the second internal electrode is led out to the second end surface and connected to the second external electrode. in, The first external electrode and the second external electrode each include a base external electrode, a resin layer formed outside the base external electrode, and at least one plated external electrode layer formed outside the resin layer. The base external electrode is discontinuously formed on the ceramic body, The ceramic body has an exposed region partially exposed from the discontinuously formed base external electrode, The resin layer covers the discontinuously formed base external electrode and the exposed area, The first external electrode is formed on the first end surface, and the second external electrode is formed on the second end surface, and the base external electrode and the exposed area are completely covered by the resin layer. The first external electrode and the second external electrode respectively include areas where the resin layer covers the discontinuously formed base external electrode and the exposed area, and areas where the resin layer does not cover the discontinuously formed base external electrode and the exposed area on the first main surface, the second main surface, the first side surface, and the second side surface.

2. The multilayer ceramic electronic component according to claim 1, wherein The resin layer non-formed region of the first external electrode is formed on a side away from the first end surface among the first main surface, the second main surface, the first side surface, and the second side surface of the ceramic body. The resin layer non-formed region of the second external electrode is formed on a side away from the second end surface among the first main surface, the second main surface, the first side surface, and the second side surface of the ceramic body.

3. The multilayer ceramic electronic component according to claim 1 or 2, wherein: When the lengthwise dimensions of the first external electrode and the second external electrode formed on the first main surface, the second main surface, the first side surface, and the second side surface are assumed to be 100%, A ratio of a dimension in the longitudinal direction of a region where the resin layer covers the discontinuously formed base external electrode and the exposed region is 75% or less.

4. The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein In the resin layer non-formed region, the base external electrode and the plated external electrode layer are mechanically and electrically connected.

5. The multilayer ceramic electronic component according to any one of claims 1 to 4, wherein The resin layer contains metal.

6. The multilayer ceramic electronic component according to any one of claims 1 to 5, wherein In any cross section parallel to the first side surface and the second side surface, Find the part where the height dimension of the ceramic body becomes the largest. Find the first point on the first principal surface as one starting point of the dimension and the second point on the second principal surface as the other starting point of the dimension, When a first imaginary line extending in the length direction and passing through the first point and a second imaginary line extending in the length direction and passing through the second point are drawn, Neither the first imaginary line nor the second imaginary line overlaps the resin layer of the first external electrode nor the resin layer of the second external electrode.

Images