Optical coupling packaging device

Abstract

The invention discloses an optical coupling packaging device, and belongs to the technical field of optoelectronic integration. The optical coupling packaging device comprises an interposer which comprises an optical device, a cavity, a first alignment structure and a first coupling structure, the first alignment structure and the first coupling structure are located in the cavity, and the first coupling structure is connected with the optical device; and the first optical chip is at least partially located in the cavity, the first optical chip comprises a second alignment structure and a second coupling structure, the second alignment structure and the first alignment structure are mutually embedded, and the second coupling structure and the first coupling structure are in coupling connection. According to the invention, high-precision alignment can be realized, the alignment error is reduced, the process complexity is reduced, the cost is reduced, the stability of optical signal transmission is improved, and the optical signal transmission loss is reduced.

Description

Technical Field

[0001] The present application belongs to the field of optoelectronic integration technology, and in particular, relates to an optical coupling packaging device. Background Art

[0002] In optoelectronic co-packaging technology solutions, an interposer is usually used as a packaging substrate to achieve the transmission of electrical signals, and optical chips use optical fiber connections to achieve the introduction and output of optical signals. The coupling connection between the optical chip and the optical fiber has high alignment accuracy requirements. The coupling alignment in related technologies relies on active adjustment, which is complex and costly, and is prone to alignment errors, thereby reducing the stability of optical signal transmission and increasing optical signal transmission losses. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the related art. To this end, the present application proposes an optical coupling packaging device that can achieve high-precision alignment, reduce alignment errors, reduce process complexity, reduce costs, improve the stability of optical signal transmission, and reduce optical signal transmission losses.

[0004] The present application provides an optical coupling packaging device, comprising:

[0005] An interposer, comprising an optical device, a cavity, and a first alignment structure and a first coupling structure located in the cavity, wherein the first coupling structure is connected to the optical device;

[0006] A first optical chip is at least partially located in the cavity. The first optical chip includes a second alignment structure and a second coupling structure. The second alignment structure is embedded in the first alignment structure. The second coupling structure is coupled to the first coupling structure.

[0007] According to one embodiment of the present application, the optical coupling packaging device further includes: an optical fiber or a second optical chip, which is located on a side of the intermediate layer close to the optical device and is coupled to the optical device.

[0008] According to one embodiment of the present application, the first alignment structure includes at least one first protrusion structure arranged at intervals, and the second alignment structure includes at least one first groove structure arranged in a one-to-one correspondence with the at least one first protrusion structure; the first protrusion structure and the corresponding first groove structure are mutually embedded; the first coupling structure is located in the first protrusion structure, and the second coupling structure is located on the peripheral side of the first groove structure.

[0009] According to one embodiment of the present application, the first alignment structure includes at least one second groove structure arranged at intervals, and the second alignment structure includes at least one second protrusion structure arranged in a one-to-one correspondence with the at least one second groove structure; the second protrusion structure and the corresponding second groove structure are mutually embedded; the first coupling structure is located on the peripheral side of the second groove structure, and the second coupling structure is located in the second protrusion structure.

[0010] According to an embodiment of the present application, the first coupling structure and the second coupling structure both include a grating coupler, an end face coupler or a spot converter.

[0011] According to an embodiment of the present application, the first coupling structure is disposed close to an inner wall of the cavity, and the optical device is located on a side of the cavity close to the first coupling structure and is connected to the first coupling structure.

[0012] According to an embodiment of the present application, the optical device and the first coupling structure are an integrated structure.

[0013] According to an embodiment of the present application, the interposer further includes a support structure located at the bottom of the cavity, and the first alignment structure and the first coupling structure are located on the support structure.

[0014] According to an embodiment of the present application, the intermediate layer further includes a first cladding layer, and the first cladding layer covers at least a portion of the first coupling structure.

[0015] According to one embodiment of the present application, the interposer includes a substrate, and at least one periodic structure stacked on the substrate; the periodic structure includes a second cladding layer, a device layer, and a first cladding layer stacked;

[0016] The device layer includes the optical device, the device layer in the periodic structure on the side away from the substrate also includes the first coupling structure, and the first cladding layer in the periodic structure on the side away from the substrate covers at least a portion of the first coupling structure. The above one or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

[0017] By setting a first alignment structure and a first coupling structure in the cavity of the interposer, and setting a second alignment structure and a second coupling structure in the first optical chip, the first alignment structure and the second alignment structure are interlocked with each other, and mechanical passive alignment of the first optical chip is achieved on the interposer, thereby reducing alignment errors, process complexity and process costs; and the first coupling structure is coupled to the second coupling structure to achieve efficient coupling of optical signals, thereby ensuring high-precision alignment while improving the stability of optical signal transmission and reducing optical signal transmission losses; and the first optical chip is at least partially located in the cavity, thereby achieving chip coupling packaging, simplifying the chip packaging process flow, and further reducing process costs.

[0018] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is one of the cross-sectional schematic diagrams of the optical coupling packaging device provided in the embodiment of the present application;

[0021] Figure 2 This is one of the structural schematic diagrams of the interposer in the optical coupling packaging device provided in the embodiment of the present application;

[0022] Figure 3 This is one of the structural schematic diagrams of the first optical chip in the optical coupling packaging device provided in an embodiment of the present application;

[0023] Figure 4 It is one of the structural schematic diagrams of the first alignment structure or the second alignment structure in the optical coupling packaging device provided in the embodiment of the present application;

[0024] Figure 5 This is the second structural schematic diagram of the first alignment structure or the second alignment structure in the optical coupling packaging device provided in the embodiment of the present application;

[0025] Figure 6 This is the third structural schematic diagram of the first alignment structure or the second alignment structure in the optical coupling packaging device provided in the embodiment of the present application;

[0026] Figure 7 This is the fourth structural schematic diagram of the first alignment structure or the second alignment structure in the optical coupling packaging device provided in the embodiment of the present application;

[0027] Figure 8 This is the fifth structural schematic diagram of the first alignment structure or the second alignment structure in the optical coupling packaging device provided in the embodiment of the present application;

[0028] Fig. 9 This is the sixth structural schematic diagram of the first alignment structure or the second alignment structure in the optical coupling packaging device provided in the embodiment of the present application;

[0029] Fig.10 This is the second structural schematic diagram of the interposer in the optical coupling packaging device provided in the embodiment of the present application;

[0030] Fig.11 This is the second structural schematic diagram of the first optical chip in the optical coupling packaging device provided in an embodiment of the present application;

[0031] Fig.12 This is the second cross-sectional schematic diagram of the optical coupling packaging device provided in the embodiment of the present application;

[0032] Fig.13 This is the third structural schematic diagram of the interposer in the optical coupling packaging device provided in the embodiment of the present application;

[0033] Fig.14 This is the third structural schematic diagram of the first optical chip of the optical coupling packaging device provided in an embodiment of the present application;

[0034] Fig.15 is a top view of an interposer of an optical coupling packaging device provided in an embodiment of the present application;

[0035] Fig.16 is a cross-sectional schematic diagram of an interposer of an optical coupling packaging device provided in an embodiment of the present application;

[0036] Fig.17 Schematic diagram of the film layer structure of the intermediate layer of the optical coupling packaging device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0038] In recent years, with the rapid development of technologies such as optical communication, optical interconnection, and optical computing, traditional optoelectronic packaging solutions can no longer meet the requirements of new application scenarios for high speed and low power consumption. Optoelectronic co-packaging technology packages optical chips and electrical chips on the same substrate to form a microsystem unit, shortening the transmission distance of optoelectronic signals, increasing data transmission rates, and reducing system power consumption. Among them, optical coupling packaging technology is used to solve the problems that exist when the optical signals on optoelectronic integrated chips are interconnected with external optical signals. It is a key technology to ensure the performance of optoelectronic chips.

[0039] The size of the optical waveguide in the optical chip is usually in the micron or submicron order, while the core diameter of the single-mode optical fiber is about 8-10 microns. In order to achieve optical mode field matching between the optical waveguide in the optical chip and the single-mode optical fiber, it is usually necessary to set a narrower optical waveguide tip. End-face coupling has extremely high requirements for the accuracy of coupling alignment (end-face coupling requires the alignment accuracy between the optical fiber and the waveguide of the optical chip to reach the submicron level), which puts forward extremely high requirements for mass production and packaging processes, and packaging is very difficult. During the alignment process, the relevant technology adopts an active adjustment method, using high-precision coupling packaging equipment for real-time alignment and adjustment to ensure the accuracy, yield and efficiency of the packaging. This method leads to high manufacturing and assembly costs and is not suitable for large-scale production. Moreover, in the environment of thermal expansion and mechanical vibration, optical coupling devices are prone to misalignment, affecting the stability of optical signal transmission and increasing optical signal transmission losses. This application uses an interposer as a substrate for optoelectronic signal transmission and an interposer as an optical signal transmission platform. The optical signal is coupled during the packaging process of the optical chip and the interposer, thereby avoiding direct coupling between the external optical fiber and the chip. At the same time, a mechanical alignment structure is used to achieve passive coupling alignment of the optical chip, which can effectively reduce the packaging cost.

[0040] The optical coupling packaging device provided by the embodiments of the present application is described below with reference to the accompanying drawings.

[0041] Figure 1 This is one of the cross-sectional schematic diagrams of an optical coupling packaging device provided in an embodiment of the present application.

[0042] like Figure 1 As shown, the optical coupling packaging device provided in the embodiment of the present application includes an intermediate layer 100 and a first optical chip 200 .

[0043] The interposer 100 includes an optical device 103 , a cavity 104 , and a first alignment structure 101 and a first coupling structure 102 located in the cavity 104 . The first coupling structure 102 is connected to the optical device 103 .

[0044] like Figure 1 As shown, the optical device 103 may be located inside the intermediary layer 100. In some embodiments, the optical device 103 may extend along a first direction to a surface of one side (such as the left side) of the intermediary layer 100. The first direction may be lateral. The optical device 103 may include an optical waveguide, an optical passive device, an optical active device, and the like. The optical device 103 may realize path selection and transmission of optical signals in the intermediary layer 100, and may distribute and modulate optical signals transmitted in the intermediary layer 100. The optical device 103 may be made of a material with good optical transparency and a low refractive index to improve the coupling effect of the optical signal. For example, the material of the optical device 103 may include one or more combinations of silicon dioxide, silicon oxynitride, and silicon nitride.

[0045] The cavity 104 extends from the upper surface of the interposer 100 along the height direction into the interposer 100, and the first direction is perpendicular to the height direction. The optical device 103 is located in the interposer 100 outside the cavity 104, for example, the optical device 103 is located on one side (such as the left side) of the cavity 104, and the optical device 103 can extend along the first direction to the side wall (such as the left side wall) of the cavity 104.

[0046] The first coupling structure 102 is located in the cavity 104. The first coupling structure 102 can be arranged close to the optical device 103, and the first coupling structure 102 is connected to the optical device 103, so that the optical signal is transmitted from the optical device 103 to the first coupling structure 102. The first coupling structure 102 can be made of a material with good optical transparency and a low refractive index to improve the coupling effect of the optical signal between the optical device 103 and the first coupling structure 102. For example, the material of the first coupling structure 102 may include one or more combinations of silicon dioxide, silicon oxynitride, and silicon nitride.

[0047] The first alignment structure 101 is located in the cavity 104. The first alignment structure 101 may be disposed close to the first coupling structure 102, or the first coupling structure 102 may be located inside the first alignment structure 101. The first alignment structure 101 may include at least one of a protrusion structure and a groove structure.

[0048] The first optical chip 200 is at least partially located in the cavity 104. The first optical chip 200 includes a second alignment structure 201 and a second coupling structure 202. The second alignment structure 201 is interlocked with the first alignment structure 101, and the second coupling structure 202 is coupled to the first coupling structure 102. The first optical chip 200 may include a PIC (Photonic integrated circuit) or the like.

[0049] like Figure 1 As shown, the first optical chip 200 may be partially or entirely located in the cavity 104. The cross-section of the first optical chip 200 matches the cross-section of the cavity 104 in size and shape, so that the first optical chip 200 can be at least partially located in the cavity 104. When the height of the cavity 104 along the height direction is not less than the height of the first optical chip 200 along the height direction, the first optical chip 200 may be entirely located in the cavity 104; when the height of the cavity 104 along the height direction is less than the height of the first optical chip 200 along the height direction, the first optical chip 200 may be partially located in the cavity 104, and the remaining portion may exceed the upper surface of the cavity 104.

[0050] The second alignment structure 201 may be located at the bottom of the first optical chip 200, and the second alignment structure 201 may be located in the cavity 104. The second alignment structure 201 matches the shape and size of the first alignment structure 101, so that the second alignment structure 201 and the first alignment structure 101 are mutually embedded. The second alignment structure 201 may include at least one of a protrusion structure and a groove structure. When the first alignment structure 101 includes a protrusion structure, the second alignment structure 201 includes a groove structure; when the first alignment structure 101 includes a groove structure, the second alignment structure 201 includes a protrusion structure.

[0051] The second coupling structure 202 may be located at the bottom of the second alignment structure 201, and the second alignment structure 201 is located in the cavity 104. The second coupling structure 202 may be disposed close to the second alignment structure 201, or the second coupling structure 202 may be disposed inside the second alignment structure 201. The second alignment structure 201 and the first alignment structure 101 are mutually interlocked, so that the second coupling structure 202 is disposed close to the first coupling structure 102, and the second coupling structure 202 is coupled to the first coupling structure 102.

[0052] The second alignment structure 201 in the first optical chip 200 is interlocked with the first alignment structure 101 in the intermediary layer 100 to achieve mechanical passive alignment of the first optical chip 200. The first coupling structure 102 and the second coupling structure 202 are coupled and connected to transmit the optical signal from the intermediary layer 100 to the first optical chip 200.

[0053] In an embodiment of the present application, a first alignment structure 101 and a first coupling structure 102 are arranged in the cavity 104 of the interposer 100, and a second alignment structure 201 and a second coupling structure 202 are arranged in the first optical chip 200, so that the first alignment structure 101 and the second alignment structure 201 are interlocked with each other, and mechanical passive alignment of the first optical chip 200 is realized on the interposer 100, which can improve the stability of the mechanical alignment, avoid the influence of device misalignment and position offset (such as deviations caused by thermal expansion and mechanical vibration), reduce alignment errors, improve alignment accuracy (alignment accuracy reaches sub-micron level), and reduce process complexity and process cost to meet the needs of mass production. While the first alignment structure 101 and the second alignment structure 201 are mechanically engaged and aligned, the first coupling structure 102 and the second coupling structure 202 are coupled and connected to achieve efficient coupling of the light field, so as to ensure the stability of the transmission of the optical signal between the interposer 100 and the first optical chip 200, optimize the mode matching of the optical field at the coupling interface, improve the stability of the optical coupling packaging device, and have a certain tolerance, which can reduce the scattering and reflection loss of the optical signal during the transmission process in the optical coupling packaging device, and improve the efficiency and stability of the optical signal transmission. At the same time, the first optical chip 200 is at least partially located in the cavity 104, realizing chip coupling packaging, simplifying the process flow of chip packaging, further reducing costs, and meeting the needs of mass production.

[0054] In some embodiments, the optical coupling package device further includes an optical fiber 301 or a second optical chip 302 , which is located on a side of the intermediate layer 100 close to the optical device 103 and is coupled to the optical device 103 .

[0055] The optical fiber 301 is a transmission medium for optical signals in the optical coupling packaging device, and can introduce the optical signal into the interposer 100. When the optical coupling packaging device includes the optical fiber 301, the optical fiber 301 can be coupled to an external light source or a discrete laser on the side away from the optical device 103. Thus, the optical signal is generated by the external light source or the discrete laser, transmitted to the optical device 103 in the interposer 100 through the optical fiber 301, and then transmitted to the first optical chip 200 through the first coupling structure 102 coupled to the optical device 103 and the second coupling structure 202 coupled to the first coupling structure 102.

[0056] When the optical coupling package device includes the second optical chip 302, the second optical chip 302 can generate an optical signal, or serve as a transfer structure for introducing an optical signal, and the second optical chip 302 transmits the optical signal to the optical device 103 in the interposer 100. Then, the optical signal is transmitted to the first optical chip 200 through the first coupling structure 102 connected to the optical device 103 and the second coupling structure 202 coupled to the first coupling structure 102. The second optical chip 302 may include an on-chip integrated light source, etc.

[0057] The intermediary layer 100 can be used as a substrate for transmitting optoelectronic signals and a transmission platform for optical signals. The first optical chip 200 and the intermediary layer 100 realize coupling of optical signals during the packaging process, thereby avoiding direct coupling between the optical fiber 301 or the second optical chip 302 and the first optical chip 200. The coupling alignment has a high tolerance, thereby effectively improving the effect of optical signal coupling between the optical fiber 301 or the second optical chip 302 and the intermediary layer 100.

[0058] In some embodiments, the first alignment structure 101 includes at least one first protrusion structure arranged at intervals, and the second alignment structure 201 includes at least one first groove structure arranged in a one-to-one correspondence with the at least one first protrusion structure; the first protrusion structure and the corresponding first groove structure are mutually embedded; the first coupling structure 102 is located in the first protrusion structure, and the second coupling structure 202 is located on the peripheral side of the first groove structure.

[0059] The number of the first protrusion structures in the first alignment structure 101 is the same as the number of the first groove structures in the second alignment structure 201. Each first protrusion structure corresponds to a first groove structure, and the size and shape of each first protrusion structure match the corresponding first groove structure, so that each first protrusion structure fits with the corresponding first groove structure.

[0060] The number, shape and size of the first protrusion structure in the first alignment structure 101 are not specifically limited. The first protrusion structure can be in any shape, that is, the first protrusion structure can be in a regular shape or an irregular shape. In the case where the first alignment structure 101 includes a plurality of first protrusion structures, the shapes of the plurality of first protrusion structures can be the same or different, and the sizes of the plurality of first protrusion structures can be the same or different. The number, shape and size of the first groove structure in the second alignment structure 201 are not specifically limited. The first groove structure can be in any shape, that is, the first groove structure can be in a regular shape or an irregular shape. In the case where the second alignment structure 201 includes a plurality of first groove structures, the shapes of the plurality of first groove structures can be the same or different, and the sizes of the plurality of first groove structures can be the same or different. The size and shape of each first protrusion structure and each first groove structure are not specifically limited here, and it is only necessary to ensure that the size and shape of each first protrusion structure and the corresponding first groove structure match each other.

[0061] like Figure 4 As shown, the first alignment structure 101 includes a first protruding structure, and the first protruding structure can be a regular rectangular parallelepiped. Figure 5 As shown, the first alignment structure 101 includes a first protruding structure, which may be a prism, and the cross section of the prism may be a trapezoid. Figure 6As shown, the first alignment structure 101 includes a first protruding structure, which may be a pyramid with a flattened top. Figure 7 As shown, the first alignment structure 101 includes three first protruding structures spaced apart along the second direction, and each first protruding structure may be a regular rectangular parallelepiped. Figure 8 As shown, the first alignment structure 101 includes a first protruding structure, and the first protruding structure may be in the shape of a combination of two prisms distributed in sequence. Fig. 9 As shown, the first alignment structure 101 includes a first protruding structure, and the first protruding structure may be in the shape of a combination of two prisms disposed opposite to each other.

[0062] For example Figure 2 As shown, the first alignment structure 101 may include a first protruding structure, and the first protruding structure is located in the cavity 104. Figure 3 As shown, the second alignment structure 201 may include a first groove structure, and the first groove structure is located in the first optical chip 200. The first protrusion structure is arranged in a rectangular parallelepiped, and correspondingly, the first groove structure is arranged in a rectangular parallelepiped, and the shape, size and position of the rectangular parallelepiped groove are consistent with the rectangular parallelepiped protrusion, and are in a complementary relationship. The first protrusion structure can be located exactly in the first groove structure, so that the first protrusion structure and the first groove structure are embedded with each other.

[0063] For example Fig.10 As shown, the first alignment structure 101 may include a plurality of first protrusion structures, and the plurality of first protrusion structures are arranged at intervals in the cavity 104. For example, the plurality of first protrusion structures may be arranged in parallel and at intervals in the cavity 104 along the second direction. The second direction is perpendicular to the first direction and the height direction. Fig.11 As shown, the second alignment structure 201 may include a plurality of first groove structures, and the plurality of first groove structures are arranged at intervals in the first optical chip 200. For example, the plurality of first groove structures may be arranged in parallel and at intervals in the first optical chip 200 along the second direction. Each first protrusion structure is arranged in a rectangular parallelepiped, and correspondingly, each first groove structure is arranged in a rectangular parallelepiped, and the shape, size and position of each rectangular parallelepiped groove match the corresponding rectangular parallelepiped protrusion. Each first protrusion structure may be located exactly in the corresponding first groove structure, so that each first protrusion structure and the corresponding first groove structure are mutually embedded.

[0064] By providing a plurality of first protrusion structures and a plurality of first groove structures, the mechanical alignment coupling of the optical coupling packaging device can be made tighter, thereby improving the coupling effect of the optical coupling packaging device.

[0065] The first coupling structure 102 is located in the first protruding structure, and the second coupling structure 202 is located on the peripheral side of the first groove structure. The first coupling structure 102 can be integrated with the first alignment structure 101, and can serve as a coupling waveguide structure for optical signal transmission and a mechanical alignment coupling structure, thereby ensuring the consistency and stability of mechanical interlocking and simplifying the manufacturing process. The second coupling structure 202 can be located on at least one side of the first groove structure, such as the opposite sides of the first groove structure along the second direction, one side along the first direction (e.g. Figure 1 on the right side of the first groove structure in the embodiment, and / or on the bottom of the first groove structure.

[0066] In the case where the first alignment structure 101 includes a plurality of first protrusion structures and the second alignment structure 201 includes a plurality of first groove structures, the first coupling structure 102 may be located in one or more first protrusion structures, and the second coupling structure 202 may be located around one or more first groove structures. The specific positions of the first coupling structure 102 and the second coupling structure 202 may be set according to actual application requirements and are not specifically limited here.

[0067] Combination Figure 1 , Figure 2 and Figure 3 As shown, the first protrusion structure and the first groove structure are interlocked, and the second coupling structure 202 located around the first groove structure forms a coupling connection with the first coupling structure 102 located in the first protrusion structure, so that the optical signal is transmitted from the intermediate layer 100 to the first optical chip 200.

[0068] In this embodiment, the first protrusion structure and the first groove structure are mechanically engaged and aligned to achieve passive alignment between the interposer 100 and the first optical chip 200, forming a spatial snap-on design structure to avoid the effects of device misalignment and positional displacement (such as deviations caused by thermal expansion and mechanical vibration) during the optical coupling process, thereby improving the mechanical alignment accuracy between the interposer 100 and the first optical chip 200 (the alignment accuracy reaches sub-micron level), and enhancing the coupling effect of the optical coupling packaging device. At the same time, it can reduce process complexity and cost.

[0069] In some embodiments, the first alignment structure 101 includes at least one second groove structure arranged at intervals, and the second alignment structure 201 includes at least one second protrusion structure arranged in a one-to-one correspondence with at least one second groove structure; the second protrusion structure and the corresponding second groove structure are mutually embedded; the first coupling structure 102 is located on the peripheral side of the second groove structure, and the second coupling structure 202 is located inside the second protrusion structure.

[0070] The number of the second groove structures in the first alignment structure 101 is the same as the number of the second protrusion structures in the second alignment structure 201. Each second groove structure corresponds to a second protrusion structure, and the size and shape of each second groove structure match the corresponding second protrusion structure, so that each second groove structure fits with the corresponding second protrusion structure.

[0071] The number, shape and size of the second protrusion structure in the second alignment structure 201 are not specifically limited. The second protrusion structure can be in any shape, that is, the second protrusion structure can be in a regular shape or an irregular shape. In the case where the second alignment structure 201 includes a plurality of second protrusion structures, the shapes of the plurality of second protrusion structures can be the same or different, and the sizes of the plurality of second protrusion structures can be the same or different. The number, shape and size of the second groove structure in the first alignment structure 101 are not specifically limited. The second groove structure can be in any shape, that is, the second groove structure can be in a regular shape or an irregular shape. In the case where the first alignment structure 101 includes a plurality of second groove structures, the shapes of the plurality of second groove structures can be the same or different, and the sizes of the plurality of second groove structures can be the same or different. The size and shape of each second protrusion structure and each second groove structure are not specifically limited here, and it is only necessary to ensure that the size and shape of each second protrusion structure and the corresponding second groove structure match each other.

[0072] like Figure 4 As shown, the second alignment structure 201 includes a second protruding structure, and the second protruding structure can be a regular rectangular parallelepiped. Figure 5 As shown, the second alignment structure 201 includes a second protruding structure, which may be a prism, and the cross section of the prism may be a trapezoid. Figure 6 As shown, the second alignment structure 201 includes a second protruding structure, which may be a pyramid with a flattened top. Figure 7 As shown, the second alignment structure 201 includes three second protruding structures spaced apart along the second direction, and each second protruding structure may be a regular rectangular parallelepiped. Figure 8 As shown, the second alignment structure 201 includes a second protruding structure, and the second protruding structure may be in the shape of a combination of two prisms distributed in sequence. Fig. 9 As shown, the second alignment structure 201 includes a second protruding structure, and the second protruding structure may be in the shape of a combination of two prisms disposed opposite to each other.

[0073] For example Fig.13 As shown, the first alignment structure 101 may include a second groove structure, and the second groove structure is located in the cavity 104. Fig.14As shown, the second alignment structure 201 may include a second protrusion structure, and the second protrusion structure is located in the first optical chip 200. The second groove structure is arranged in a rectangular parallelepiped, and correspondingly, the second protrusion structure is arranged in a rectangular parallelepiped, and the shape, size and position of the rectangular parallelepiped groove are consistent with the rectangular parallelepiped protrusion, and are in a complementary relationship. The second groove structure can be located exactly in the second protrusion structure, so that the second groove structure and the second protrusion structure are embedded with each other.

[0074] The first coupling structure 102 is located on the circumferential side of the second groove structure, and the second coupling structure 202 is located in the second protruding structure. The second coupling structure 202 can be integrated with the second alignment structure 201, and can serve as a coupling waveguide structure for optical signal transmission and a mechanical alignment coupling structure, thereby ensuring the consistency and stability of mechanical interlocking and simplifying the manufacturing process. The first coupling structure 102 can be located on at least one side of the second groove structure, such as the opposite sides of the second groove structure along the second direction, one side along the first direction (e.g. Fig.13 ), and / or the bottom of the second groove structure.

[0075] In the case where the first alignment structure 101 includes a plurality of second groove structures and the second alignment structure 201 includes a plurality of second protrusion structures, the first coupling structure 102 may be located around one or more second groove structures, and the second coupling structure 202 may be located inside one or more second protrusion structures. The specific positions of the first coupling structure 102 and the second coupling structure 202 may be set according to actual application requirements and are not specifically limited herein.

[0076] Combination Fig.13 and Fig.14 As shown, the second protrusion structure and the second groove structure are interlocked, and the first coupling structure 102 located on the periphery of the second groove structure can form a coupling connection with the second coupling structure 202 located in the second protrusion structure, so that the optical signal is transmitted from the intermediate layer 100 to the first optical chip 200.

[0077] In this embodiment, passive alignment between the intermediary layer 100 and the first optical chip 200 is achieved by mechanically interlocking the second protrusion structure and the second groove structure, forming a spatial snap-on design structure, thereby avoiding the influence of device misalignment and position displacement (such as caused by thermal expansion and mechanical vibration) during the optical coupling process, improving the mechanical alignment accuracy between the intermediary layer 100 and the first optical chip 200 (the alignment accuracy reaches sub-micron level), and enhancing the coupling effect of the optical coupling packaging device. At the same time, it can reduce process complexity and cost.

[0078] In some embodiments, the first coupling structure 102 and the second coupling structure 202 in the optical coupling package device both include a grating coupler, an end face coupler, or a spot converter.

[0079] In the case where the first coupling structure 102 and the second coupling structure 202 are pattern spot converters (ie, vertical couplers), as shown in FIG. Figure 3 As shown, the second coupling structure 202 is disposed on the peripheral side of the first groove structure, for example, on opposite sides of the first groove structure along the second direction, and / or on the bottom of the first groove structure (or, as shown in FIG. Fig.13 As shown, the first coupling structure 102 is arranged on the circumference of the second groove structure, for example, on the opposite sides of the second groove structure along the second direction, and / or on the bottom of the second groove structure), and the light field energy in the first coupling structure 102 will be efficiently transmitted to the first optical chip 200 through evanescent wave coupling. In the case where the first coupling structure 102 and the second coupling structure 202 are end face couplers, as shown in FIG. Fig.12 As shown, the second coupling structure 202 is arranged on one side of the first groove structure along the first direction, for example, on the right side of the first groove structure (or, the first coupling structure 102 is arranged on one side of the second groove structure along the first direction), and the light field energy in the first coupling structure 102 will be efficiently transmitted to the first optical chip 200 through end face coupling. In the case where the first coupling structure 102 and the second coupling structure 202 are grating couplers, as shown in FIG. Figure 3 As shown, the second coupling structure 202 is disposed on the peripheral side of the first groove structure, for example, on opposite sides of the first groove structure along the second direction, and / or on the bottom of the first groove structure (or, as shown in FIG. Fig.13 As shown, the first coupling structure 102 is arranged on the peripheral side of the second groove structure, for example, on the opposite sides of the second groove structure along the second direction, and / or at the bottom of the second groove structure), and the light field energy in the first coupling structure 102 will be efficiently transmitted to the first optical chip 200 through grating coupling.

[0080] In some embodiments, the first coupling structure 102 in the optical coupling package is disposed close to the inner wall of the cavity 104, and the optical device 103 is located on a side of the cavity 104 close to the first coupling structure 102 and connected to the first coupling structure 102. Figure 1As shown, the first coupling structure 102 is arranged in the cavity 104 close to the left side wall of the cavity 4. The optical device 103 is located in the intermediary layer 100 on the left side of the cavity 4, and the optical device 103 extends to the left side wall of the intermediary layer 100 along the first direction, and extends to the left side wall of the cavity 104. The first coupling structure 102 is in contact with the optical device 103, and the left side surface of the first coupling structure 102 and the right side surface of the optical device 103 may overlap in whole or in part, so that a coupling connection is formed between the first coupling structure 102 and the optical device 103, so that the optical signal is transmitted from the optical device 103 to the first coupling structure 102. It should be noted that the first coupling structure 102 and the optical device 103 may not be located in the same horizontal plane, that is, the left side surface of the first coupling structure 102 and the right side surface of the optical device 103 may not overlap, and it is only necessary to ensure the coupling connection between the first coupling structure 102 and the optical device 103.

[0081] In some embodiments, the optical device 103 and the first coupling structure 102 are integrated structures. The first coupling structure 102 and the optical device 103 can be formed at the same time, and the left surface of the first coupling structure 102 and the right surface of the optical device 103 completely overlap to ensure the stability of the optical coupling connection between the two, ensure the stable transmission of the optical signal, and simplify the process complexity.

[0082] In some embodiments, the interposer 100 in the optical coupling package device may further include a support structure 105 located at the bottom of the cavity 104 , and the first alignment structure 101 and the first coupling structure 102 are located on the support structure 105 .

[0083] like Figure 1 As shown, the support structure 105 is arranged at the bottom of the cavity 104 close to the left side wall of the cavity 4. The support structure 105 can provide support for the first alignment structure 101 and the first coupling structure 102. The support structure 105 does not completely cover the bottom of the cavity 104, and there is a gap between the support structure 105 and the side wall of the cavity 104. For example Figure 1 As shown, the support structure 105 is located on the left side of the cavity 104, and there is a gap between the support structure 105 and the right side wall of the cavity 104. An electrical redistribution layer (RDL layer) and a through-hole structure may be disposed in the gap for circuit wiring and electrical contact.

[0084] In some embodiments, the interposer 100 in the optical coupling package device further includes a first cladding layer 106, and the first cladding layer 106 covers at least a portion of the first coupling structure 102. The first coupling structure 102 may be completely wrapped by the first cladding layer 106, or partially wrapped by the first cladding layer 106, or completely exposed in the cavity 104. Fig.15 and Fig.16As shown, the first cladding layer 106 completely encloses the first coupling structure 102. The first cladding layer 106 may be made of a material with good compatibility and low loss. For example, the material of the first cladding layer 106 may include silicon dioxide or the like.

[0085] In some embodiments, the intermediate layer 100 includes a substrate 107, and at least one periodic structure 110 stacked on the substrate 107; the periodic structure 110 includes a second cladding 109, a device layer 108 and a first cladding 106 that are stacked; the device layer 108 includes an optical device, the device layer 108 in the periodic structure 110 on the side away from the substrate 107 also includes a first coupling structure 102, and the first cladding 106 in the periodic structure 110 on the side away from the substrate 107 covers at least a portion of the first coupling structure 102.

[0086] like Fig.17 As shown, in the process of manufacturing the optical coupling packaging device, a substrate 107 is first provided, and the substrate 107 can provide physical support for other film layers that subsequently form the intermediate layer 100. The material of the substrate 107 may include silicon, quartz, sapphire, gallium nitride, etc. One or more periodic structures 110 are stacked on the substrate 107. In a periodic structure 110, a thin film deposition process is used to sequentially stack and deposit to form a second cladding 109, a device layer 108, and a first cladding 106. The device layer 108 is processed by an etching process, a photolithography process, or an ion exchange process to form an optical device 103. The optical device 103 may include a waveguide, a passive device, a modulator, a detector, and a light source. The device layer 108 may be made of some materials with a low refractive index. For example, the material of the device layer 108 may include one or more combinations of silicon dioxide, silicon oxynitride, or silicon nitride. The refractive index of the second cladding 109 is less than that of the device layer 108, and there is a refractive index difference between the two to form an optical waveguide, guide and limit the transmission of the optical signal in the device layer 108, thereby reducing the leakage and scattering of the optical signal, reducing the optical field coupling loss, and improving the transmission efficiency and transmission quality of the optical signal. The material of the second cladding 109 can be the same as or different from the material of the first cladding 106. The material of the second cladding 109 can include silicon dioxide, etc.

[0087] The device layer 108 in the periodic structure 110 (i.e., the periodic structure 110 at the top) away from the substrate 107 is processed by an etching process, a photolithography process, or an ion exchange process to form an optical device 103 and a first coupling structure 102. The device layer 108 in the periodic structure 110 at the top can achieve a high alignment tolerance with the optical fiber 301 or the second optical chip 302. Then, a first cladding 106 is deposited above the device layer 108 in the periodic structure 110 at the top, and the first cladding 106 covers the optical device 103 and at least part of the first coupling structure 102. Then, according to the design requirements of the actual package, the first cladding 106 is etched to form a cavity 104. At the same time, the first alignment structure 101 and the first coupling structure 102 in the cavity 104 are retained as mechanical alignment structures to ensure the transmission of the optical signal. Accordingly, a second alignment structure 201 corresponding to and complementary to the first alignment structure 101 is formed on the first optical chip 200 to achieve high-precision passive complementary alignment between the two.

[0088] In summary, according to the optical coupling packaging device provided by the present application, by setting the first alignment structure 101 and the first coupling structure 102 in the cavity 104 of the interposer 100, and setting the second alignment structure 201 and the second coupling structure 202 in the first optical chip 200, the first alignment structure 101 and the second alignment structure 201 are interlocked with each other, and the mechanical passive alignment of the first optical chip 200 is realized on the interposer 100, the alignment error is reduced, and the process complexity and process cost are reduced. The first coupling structure 102 is coupled to the second coupling structure 202 to achieve efficient coupling of the light field, thereby ensuring high-precision alignment while improving the stability of optical signal transmission and reducing optical signal transmission loss; moreover, the first optical chip 200 is at least partially located in the cavity 104, so as to realize chip coupling packaging, simplify the chip packaging process flow, and further reduce the process cost.

[0089] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0090] In the description of the present application, “plurality” means two or more.

[0091] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0092] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An optical coupling packaging device, characterized in that: include: An interposer, comprising an optical device, a cavity, and a first alignment structure and a first coupling structure located in the cavity, wherein the first coupling structure is connected to the optical device; A first optical chip is at least partially located in the cavity. The first optical chip includes a second alignment structure and a second coupling structure. The second alignment structure is engaged with the first alignment structure, and the second coupling structure is coupled to the first coupling structure.

2. The optical coupling packaging device according to claim 1, characterized in that: The optical coupling packaging device further includes: The optical fiber or the second optical chip is located on a side of the intermediate layer close to the optical device and is coupled to the optical device.

3. The optical coupling packaging device according to claim 1, characterized in that: The first alignment structure includes at least one first protruding structure arranged at intervals, and the second alignment structure includes at least one first groove structure arranged in one-to-one correspondence with the at least one first protruding structure; the first protruding structure and the corresponding first groove structure are embedded in each other; The first coupling structure is located in the first protrusion structure, and the second coupling structure is located on a peripheral side of the first groove structure.

4. The optical coupling packaging device according to claim 1, characterized in that: The first alignment structure includes at least one second groove structure arranged at intervals, and the second alignment structure includes at least one second protrusion structure arranged in a one-to-one correspondence with the at least one second groove structure; The second protrusion structure and the corresponding second groove structure are embedded in each other; The first coupling structure is located at a peripheral side of the second groove structure, and the second coupling structure is located inside the second protrusion structure.

5. The optical coupling package device according to claim 1, characterized in that: The first coupling structure and the second coupling structure both include a grating coupler, an end face coupler or a spot converter.

6. The optical coupling package device according to claim 1, characterized in that: The first coupling structure is arranged close to the inner wall of the cavity, and the optical device is located at a side of the cavity close to the first coupling structure and is connected to the first coupling structure.

7. The optical coupling package device according to claim 6, characterized in that: The optical device and the first coupling structure are an integrated structure.

8. The optical coupling package device according to claim 1, characterized in that: The interposer further includes a support structure located at the bottom of the cavity, and the first alignment structure and the first coupling structure are located on the support structure.

9. The optical coupling package device according to claim 1, characterized in that: The interposer further includes a first cladding layer, wherein the first cladding layer covers at least a portion of the first coupling structure.

10. The optical coupling packaging device according to any one of claims 1 to 9, characterized in that: The interposer comprises a substrate and at least one periodic structure stacked on the substrate; the periodic structure comprises a second cladding layer, a device layer and a first cladding layer stacked in layers; The device layer includes the optical device, the device layer in the periodic structure on a side away from the substrate further includes the first coupling structure, and the first cladding layer in the periodic structure on a side away from the substrate covers at least a portion of the first coupling structure.

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