Display module, display device and preparation method of display module

Abstract

The embodiment of the invention provides a display module, a display device and a preparation method of the display module. The display module comprises a display panel, a driving module and a flexible circuit board module, the display panel comprises a display area and a non-display area; the non-display area comprises a first fan-out area and a first bonding area; the first fan-out area comprises at least one first sub fan-out area; the first bonding area comprises at least one first sub-bonding area; the first bonding area and the first fan-out area are correspondingly arranged; the driving module is connected with the first bonding area through a flexible flat cable and is connected with an external signal through the flexible circuit board module; wherein the driving module is bonded with the flexible circuit board module, and the driving module is attached to the back surface of the surface where the display area is located in the display panel. According to the embodiment of the invention, the space occupied by the lower frame of the non-display area is effectively reduced.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a display module, a display device, and a method for manufacturing the display module. Background Art

[0002] The display module is a module that integrates display technology and control circuits. It can receive and process signals and display text, image information, etc. on the screen. According to the display technology adopted, display modules can be divided into many types, including liquid crystal display modules, field effect tube display modules and OLED (Organic Light Emitting Diode) display modules. OLED display module is an organic electroluminescent technology. Its working principle is that under the action of the electric field, the holes generated by the anode and the electrons generated by the cathode meet in the light-emitting layer, forming excitons and exciting the light-emitting molecules, and then compound to emit visible light.

[0003] However, the performance of current OLED display modules needs to be improved. Summary of the invention

[0004] In view of this, embodiments of the present application provide a display module, a display device, and a method for manufacturing the display module to at least partially solve the above problems.

[0005] According to a first aspect of an embodiment of the present application, a display module is provided, including:

[0006] Display panel, driver module and flexible circuit board module;

[0007] The display panel includes a display area and a non-display area; the non-display area includes a first fan-out area and a first bonding area; the first fan-out area includes at least one first sub-fan-out area; the first bonding area includes at least one first sub-bonding area; the first bonding area is arranged corresponding to the first fan-out area;

[0008] The driving module is connected to the first bonding area through a flexible cable and is connected to an external signal through the flexible circuit board module; wherein the driving module is bonded to the flexible circuit board module and the driving module is attached to the back side of the display panel where the display area is located.

[0009] In an optional embodiment, the driving module includes a substrate, at least one display driving chip, a second bonding area and a second fan-out area;

[0010] The display driver chip is bonded on the substrate;

[0011] The second bonding area includes at least one second sub-bonding area, and the second sub-bonding area is arranged corresponding to the first sub-bonding area, wherein one end of the flexible cable is bonded to the second sub-bonding area, and the other end of the flexible cable is bonded to the first sub-bonding area;

[0012] The second fan-out area includes at least one second sub-fan-out area; the second sub-fan-out area is arranged corresponding to the display driver chip;

[0013] Preferably, there are multiple display driver chips;

[0014] Preferably, there are multiple display driver chips, and the multiple display driver chips are cascaded and bonded on the substrate;

[0015] Preferably, there are a plurality of display driver chips, the driver module comprises a plurality of substrates, the number of the substrates is the same as the number of the display driver chips, and the plurality of display driver chips are cascaded and respectively bonded to different substrates.

[0016] In an optional embodiment, there is a third bonding area between the display driver chip and the second fan-out area; the third bonding area includes at least one third sub-bonding area; the third sub-bonding area is arranged corresponding to the second sub-fan-out area;

[0017] Preferably, there are two second sub-fan-out areas, and correspondingly, the third bonding area includes two third sub-bonding areas.

[0018] In an optional embodiment, the substrate in the driving module is bonded to the flexible circuit board module; and there is at least one connection point between the substrate and the flexible circuit board module.

[0019] In an optional embodiment, in the driving module, a reinforcement structure is provided on a side of the substrate facing the display panel;

[0020] A buffer structure is provided on a side of the substrate facing away from the display panel;

[0021] Preferably, the reinforcement structure comprises a steel sheet;

[0022] Preferably, the buffer structure comprises buffer foam.

[0023] In an optional embodiment, the first sub-bonding area in the first bonding area is arranged corresponding to the first sub-fan-out area in the first fan-out area;

[0024] Preferably, the first fan-out area includes four first sub-fan-out areas, or the first fan-out area includes two first sub-fan-out areas, or the first fan-out area includes one first sub-fan-out area.

[0025] In an optional embodiment, the flexible cable is a single-layer cable with a single row of bonding contact points; or, the flexible cable is a double-layer cable with a double row of bonding contact points.

[0026] According to a second aspect of the embodiments of the present application, a display device is provided.

[0027] A display module comprising any one of the first aspects.

[0028] According to a third aspect of an embodiment of the present application, a method for preparing a display module is provided, comprising the following steps:

[0029] At least one display panel and a driving module corresponding to the display panel are formed on the same display substrate; wherein the display panel includes a display area and a non-display area; the non-display area includes a first fan-out area and a first bonding area; the first fan-out area includes at least one first sub-fan-out area; the first bonding area includes at least one first sub-bonding area, and the first sub-bonding area is arranged corresponding to the first sub-fan-out area;

[0030] The display panel and the driving module are cut and separated, and the display panel and the driving module are connected through a flexible cable; wherein the driving module is connected to the first bonding area through the flexible cable;

[0031] Bonding the driving module to a flexible circuit board module, wherein the flexible circuit board module is connected to an external signal;

[0032] The driving module is bent to the back side of the surface of the display panel where the display area is located by bending the flexible cable, and the driving module is attached to the back side of the surface of the display panel where the display area is located.

[0033] In an optional embodiment, in the step of forming at least one display panel and a driving module corresponding to the display panel on the same display substrate, the number of the driving modules is greater than the number of the display panels.

[0034] According to the solution provided in the embodiment of the present application, the display module includes a display panel, a driving module and a flexible circuit board module, and the display panel and the driving module are connected by a flexible cable. Specifically, the flexible cable is bonded to the display panel and the driving module respectively, and the driving module is bonded to the flexible circuit board module, and the driving module is attached to the back side of the surface where the display area of ​​the display panel is located; the flexible circuit board module is connected to the external signal, transmits the external signal to the driving module, and then the driving module drives the display panel, thereby realizing the working process of the entire display module; the non-display area of ​​the display panel is provided with at least one first sub-fan-out area and at least one first sub-bonding area, which increases the range of the bonding area and enables the routing in the fan-out area to not be gathered in a small area, thereby reducing the area of ​​the non-display area of ​​the display panel occupied by the fan-out area, thereby achieving the effect of reducing the distance between the outer frame of the non-display area and the display area. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0036] Figure 1 is a schematic diagram of an exemplary structure of a display module;

[0037] Figure 2a is a structural schematic diagram of a flattened display module according to an embodiment of the present application;

[0038] Figure 2b is another structural schematic diagram of a flattened display module according to an embodiment of the present application;

[0039] Figure 2c is a structural side view of a display module according to an embodiment of the present application;

[0040] Figure 3a is a schematic structural diagram of a second display module in a flat state according to an embodiment of the present application;

[0041] Figure 3b is a second structural schematic diagram of a second flat display module according to an embodiment of the present application;

[0042] Figure 3c is a third structural schematic diagram of the flattened form of the second display module according to an embodiment of the present application;

[0043] Figure 4a is a schematic structural diagram of a third display module in a flat state according to an embodiment of the present application;

[0044] Figure 4b is a schematic diagram of a second structure of a flattened form of the third display module according to an embodiment of the present application;

[0045] Figure 4c is a third structural schematic diagram of a third flat display module according to an embodiment of the present application;

[0046] Figure 5a A schematic diagram of the structure of a single-layer flexible flat cable;

[0047] Figure 5b A cross-sectional view of a single-layer flexible flat cable;

[0048] Figure 6a A schematic diagram of the structure of a double-layer flexible flat cable;

[0049] Figure 6b A cross-sectional view of a flexible flat cable with a double-layer cable;

[0050] Figure 7 The present invention is a flowchart of a method for preparing a display module according to an embodiment of the present application. DETAILED DESCRIPTION

[0051] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0052] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in the embodiments of the present application refers to and includes any or all possible combinations of one or more associated listed items.

[0053] It should be understood that in the description of the embodiments of the present application, the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the schemes of the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0054] In addition, when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present.

[0055] The terms first, second, etc. are used to describe various elements, components, regions, layers and / or parts, but these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer and / or part from another element, component, region, layer and / or part.

[0056] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0057] In the process of implementing the present invention, the inventors found that the following problems exist in the related technology: the display module is a module that integrates display technology and control circuits, which can receive and process signals and display text, image information, etc. on the screen. In the display module, the signal line used to lead out the screen signal needs to be laid out and routed in the lower frame area to ensure stable signal transmission, thereby occupying more lower frame space and increasing the width of the lower frame. In the driving scheme of the medium-sized display module, the TCON (Timing Controller) plus SDIC (Source Driver IC) solution converts the data signal, control signal and clock conversion signal received from the outside into a data signal, control signal and clock signal suitable for SDIC through TCON to realize the image display of the display panel. The cost of this solution is relatively high. In another solution of cascading two DDICs (Display Driver Integrated Circuit), such as Figure 1 As shown in Figure 1 (a) Using COG (Chip On Glass), i.e. chip on glass technology, Figure 1 (b) COF (Chip On Film), which is to directly package the chip onto a flexible circuit board, also requires more space on the bottom frame. Figure 1 The AA (Active Area) area is the visible area of ​​the display panel and is the only area in the display module used to display images and characters.

[0058] Based on this, the solution of the embodiment of the present application provides a display module, and the specific implementation of the embodiment of the present application is further explained below in conjunction with the drawings of the embodiment of the present application.

[0059] The solution of the embodiment of the present application provides a display module, referring to Figure 2a As shown, it includes a display panel, a driving module and a flexible circuit board module.

[0060] The display panel is a key component of the display module, which is used to display images or text that can be recognized by the human eye. It includes two types: liquid crystal and organic light emitting diode. In one feasible way, the display panel of this solution is implemented as an AMOLED (Active-Matrix Organic Light Emitting Diode) in an organic light emitting diode display panel.

[0061] The display panel includes a display area 10 and a non-display area 20 surrounding the display area. The non-display area 20 has a first fan-out area and a first bonding area, which are arranged correspondingly, and a first bonding area is arranged on a side of each first fan-out area away from the display area 10.

[0062] The fan-out area is used to lead key lines such as signal lines and data lines in the display area to the edge of the display panel so as to connect with external drive circuits or other components, and protect the lines from interference and damage from the external environment through structures such as insulation layers and planarization layers.

[0063] The bonding area is usually located at the edge of the display panel. The connection between the display panel and the external driving circuit or other components is realized in the bonding area, and the transmission of signals, data, etc. is realized through necessary connection points and interfaces.

[0064] In the present application, some functional wiring in the display area 10 is connected from the display area 10 to the first bonding area through the first fan-out area, for transmitting data, signals, etc. In one feasible manner, the first fan-out area includes at least one first sub-fan-out area 30, the first bonding area includes at least one first sub-bonding area 40, the first sub-fan-out area 30 and the first sub-bonding area 40 are arranged correspondingly, and some functional wiring in the display area 10 is connected from the display area 10 to the first sub-bonding area 40 through the first sub-fan-out area 30, for transmitting data, signals, etc. to the display area 10, so as to control the display area 10.

[0065] In one possible approach, referring to Figure 2a As shown, the first fan-out area includes four first sub-fan-out areas 30, and the first bonding area includes four first sub-bonding areas 40. The first sub-fan-out areas 30 and the first sub-bonding areas 40 are arranged correspondingly. By setting a plurality of first sub-fan-out areas 30 and first sub-bonding areas 40, the area for bonding is increased, so the wiring in the first sub-fan-out area 30 does not need to be gathered in a small area. As a result, the area occupied by the first fan-out area in the non-display area 20 becomes smaller, thereby achieving the effect of reducing the distance between the outer frame of the non-display area 20 and the display area 10.

[0066] Another possible approach is to refer to Figure 3a As shown, the first fan-out area includes two first sub-fan-out areas 30, and the first bonding area includes two first sub-bonding areas 40, and the first sub-fan-out areas 30 and the first sub-bonding areas 40 are arranged correspondingly. The first sub-bonding area 40 is arranged to be longer in a direction parallel to the display panel, and the corresponding routing lines in the first sub-fan-out area 30 do not need to be gathered in a small area, thereby, the area occupied by the first fan-out area in the non-display area 20 becomes smaller, achieving the effect of reducing the distance between the outer frame of the non-display area 20 and the display area 10.

[0067] In the third possible approach, refer to Figure 4a As shown, the first fan-out area includes a first sub-fan-out area 30, and the first bonding area includes a first sub-bonding area 40, and the first sub-fan-out area 30 and the first sub-bonding area 40 are arranged correspondingly. The first sub-bonding area 40 is arranged to be longer in a direction parallel to the display panel, and the corresponding routing lines in the first sub-fan-out area 30 do not need to be gathered in a small area, thereby, the area occupied by the first fan-out area in the non-display area 20 becomes smaller, achieving the effect of reducing the distance between the outer frame of the non-display area 20 and the display area 10.

[0068] The driving module is used to drive the display panel to display images or texts, etc. The driving module includes a substrate 130, at least one display driving chip 80, a second bonding area and a second fan-out area.

[0069] In a feasible manner, the number of display driver chips 80 in the driving module is one or more; for example, the number of display driver chips 80 in the driving module is one, and one display driver chip 80 is bonded to the substrate 130; for example, the driving module includes multiple display driver chips 80, and the multiple display driver chips 80 are cascaded and bonded to the substrate 130; for example, the driving module includes multiple display driver chips 80 and multiple substrates 130, the number of substrates 130 is the same as the number of display driver chips 80, multiple display driver chips 80 are cascaded, and each display driver chip 80 is respectively bonded to a different substrate 130. Multiple display driver chips 80 are cascaded for internal communication, thereby driving the entire display panel.

[0070] In one feasible manner, the display driver chip 80 is bonded to the substrate 130, and the bonding position is sealed, specifically including applying the sealing material to the bonding area to play a fixing role and isolate external moisture, oxygen and other impurities, enhance the reliability of the bonding and thus extend the service life of the display panel. The sealing material can be implemented as epoxy resin, polyurethane, etc. In one feasible manner, the substrate 130 is implemented as a glass plate, and the edge of the glass plate is cut to avoid bumps.

[0071] Bonding technology is a connection process that can connect the display panel and other electronic components in a specific way to achieve signal transmission and control. In a feasible way, the display driver chip 80 is bonded to the substrate 130 by using a high-precision alignment system to position and align the display driver chip 80 and the substrate 130, and bonding equipment such as a bonding machine is used to perform bonding operations to accurately connect the connection medium to the specified position of the display driver chip 80 and the substrate 130.

[0072] In one feasible method, an ACF (Anisotropic Conductive Film) bonding method is used. The ACF film can conduct electricity in the vertical direction while maintaining an insulating state in the horizontal direction. The ACF film is placed between the display driver chip 80 and the substrate 130. After ensuring that the ACF film is placed accurately and flatly, heating and pressurizing are performed. The heating operation softens the adhesive in the ACF film so that the display driver chip 80 and the substrate 130 are tightly combined. The pressurizing operation realizes the electrical connection between the display driver chip 80 and the substrate 130. After the heating and pressurizing operation is completed, the ACF film gradually solidifies so that the display driver chip 80 and the substrate 130 form a stable connection structure, and the bonding is completed. In a feasible method, an ACF bonding machine is used to perform heating and pressurizing operations.

[0073] In a preferred embodiment, bonding is performed around the contact surface between the display driver chip 80 and the substrate 130 , and sealing is performed at the bonding position to improve the reliability of the bonding between the display driver chip 80 and the substrate 130 .

[0074] The driving module is connected to the first bonding area via the flexible flat cable 50. Specifically, the second bonding area in the driving module is connected to the first bonding area via the flexible flat cable 50.

[0075] The second bonding area includes at least one second sub-bonding area 60. In one feasible manner, the second sub-bonding area 60 and the first sub-bonding area 40 are arranged correspondingly, that is, a second sub-bonding area 60 is arranged on a side of each first sub-bonding area 40 away from the display area 10, and each second sub-bonding area 60 is connected to the first sub-bonding area 40 through a flexible cable 50.

[0076] In one possible approach, referring to Figure 2a As shown, the first bonding area includes four first sub-bonding areas 40, the second bonding area includes four second sub-bonding areas 60, and four flexible cables 50 connect the first sub-bonding areas 40 and the second sub-bonding areas 60 accordingly; in another feasible manner, referring to Figure 3a As shown, the first bonding area includes two first sub-bonding areas 40, the second bonding area includes two second sub-bonding areas 60, and two flexible cables 50 connect the first sub-bonding areas 40 and the second sub-bonding areas 60 accordingly; in the third feasible method, refer to Figure 4a As shown, the first bonding area includes a first sub-bonding area 40 , the second bonding area includes a second sub-bonding area 60 , and a flexible flat cable 50 connects the first sub-bonding area 40 and the second sub-bonding area 60 accordingly.

[0077] In a feasible manner, the flexible cable 50 connects the first sub-bonding area 40 and the second sub-bonding area 60 correspondingly, specifically including: one end of the flexible cable 50 is bonded to the display panel in the first sub-bonding area 40, and the other end of the flexible cable 50 is bonded to the substrate 130 in the driving module in the second sub-bonding area 60, so as to realize the transmission of data, signals, etc. between the display panel and the driving module, so as to drive the display panel through the driving module. In a feasible manner, the bonding is performed by ACF bonding, and the surface of the connection is sealed with glue to enhance the bonding reliability.

[0078] In one possible approach, referring to Figure 5a As shown, the flexible cable 50 is implemented as a single-layer flexible flat cable, having a single row of bonding contact points 140, where the bonding contact points 140 are locations where the flexible cable 50 is bonded to the display panel or substrate 130; Figure 5b A cross-sectional view of a single-layer flexible cable 50 is shown. Figure 6a As shown, the flexible cable 50 is implemented as a flexible flat cable with double layers, having double rows of bonding contact points 140. Figure 6b The cross-sectional view of the flexible cable 50 of the double-layer cable is shown; the double-layer cable structure enables the flexible cable 50 to integrate more signal lines in a limited space, so that the area occupied by the non-display area 20 in the first sub-fan-out area 30 becomes smaller, thereby achieving the effect of reducing the distance between the outer frame of the non-display area 20 and the display area 10. In a feasible manner, the material of the flexible cable 50 includes an adhesive film 150, a metal wiring 160 and a polyimide (PI) 170.

[0079] Reference Figure 3c As shown, in a preferred embodiment, the driving module includes two identical substrates 130 and two display driving chips 80. The two display driving chips 80 are respectively bonded to different substrates 130. By using two substrates 130, after one end of the flexible cable 50 is bonded and fixed to the display panel in the first sub-bonding area 40, the position accuracy of the other end of the flexible cable 50 when bonding to the substrate 130 in the driving module in the second sub-bonding area 60 can be improved. Thus, the bonding accuracy is improved and the reliability of bonding between the flexible cable 50 and the substrate 130 is ensured.

[0080] The second fan-out area includes at least one second sub-fan-out area 70, and the second sub-fan-out area 70 is arranged corresponding to the display driver chip 80. The display driver chip 80 is arranged on the side of each second sub-fan-out area 70 away from the display area 10. In a feasible manner, there is a third bonding area between the second fan-out area and the display driver chip 80, and the third bonding area includes at least one third sub-bonding area, and the third sub-bonding area is arranged corresponding to the second sub-fan-out area 70, and a third sub-bonding area is arranged between each second sub-fan-out area 70 and the display driver chip 80; in a feasible manner, there are two display driver chips 80, the second fan-out area includes two second sub-fan-out areas 70, and the third bonding area includes two third sub-bonding areas. Therefore, the data, signals, etc. transmitted by the display driver chip 80 are transmitted to the second sub-bonding area 60 via the third sub-bonding area and the second sub-fan-out area 70, and are transmitted to the display panel through the flexible cable 50, thereby realizing the control of the display panel.

[0081] The side of the substrate 130 in the driving module away from the display panel is also bonded to the flexible circuit board module, and there is at least one connection point between the substrate 130 and the flexible circuit board module, so that the signals and data in the flexible circuit board module are transmitted to the driving module. Specifically, the fourth bonding area on the substrate 130 is bonded to the fifth bonding area in the flexible circuit board module, the fourth bonding area includes at least one fourth sub-bonding area 91, and the fifth bonding area includes at least one fifth sub-bonding area 92.

[0082] The flexible circuit board module is connected to an external signal and can transmit data and power. In a feasible manner, the flexible circuit board module includes a first flexible circuit board 100, such as Figure 2a , Figure 3a and Figure 4a As shown. In one feasible manner, the first flexible circuit board 100 is connected to an external signal, and there are one or more connection points between the substrate 130 and the flexible circuit board module. In one feasible manner, the fourth bonding area on the substrate 130 includes two fourth sub-bonding areas 91, the fifth bonding area in the flexible circuit board module includes two fifth sub-bonding areas 92, the fifth bonding area is located on the first flexible circuit board 100, and there are 2 connection points between the substrate 130 and the flexible circuit board module. In one feasible manner, the fourth bonding area on the substrate 130 includes a fourth sub-bonding area 91, the fifth bonding area in the flexible circuit board module includes a fifth sub-bonding area 92, the fifth bonding area is located on the first flexible circuit board 100, and there is 1 connection point between the substrate 130 and the flexible circuit board module. In one feasible manner, bonding is performed by ACF bonding, and sealing is performed on the surface of the connection to enhance bonding reliability.

[0083] In another feasible manner, the flexible circuit board module includes a plurality of second flexible circuit boards 110, each corresponding to a different display driver chip 80, the number of the second flexible circuit boards 110 is the same as the number of the display driver chips 80, and the number of connection points between the substrate 130 and the flexible circuit board module is the same as the number of the second flexible circuit boards 110. For example, the flexible circuit board module includes two second flexible circuit boards 110, each corresponding to two display driver chips 80, such as Figure 2b , Figure 3b and Figure 4b As shown; the second flexible circuit board 110 includes a connector 111, and the two second flexible circuit boards 110 are connected to the transfer flexible circuit board 120 through the two connectors 111 respectively; wherein the transfer flexible circuit board 120 is connected to the external signal. In a feasible manner, the fourth bonding area on the substrate 130 includes two fourth sub-bonding areas 91, and the fifth bonding area in the flexible circuit board module includes two fifth sub-bonding areas 92, and the two fifth sub-bonding areas 92 are respectively located on different second flexible circuit boards 110, and there are two connection points between the substrate 130 and the flexible circuit board module. As a result, the two second flexible circuit boards 110 can communicate with each other, and signal transmission and communication can be achieved through the transfer flexible circuit board 120.

[0084] Thus, the external signal is transmitted from the fifth bonding area in the flexible circuit board module via the fourth bonding area on the substrate 130 to the display driver chip 80, and the display driver chip 80 generates a driving signal for the display panel according to the external signal. The driving signal sequentially passes through the third bonding area, the second fan-out area, the second bonding area and the flexible cable 50, reaches the first bonding area on the display panel, and finally passes through the first fan-out area to reach the display area 10 of the display panel, and the information indicated by the external signal is displayed in the display area 10. In a feasible manner, the first flexible circuit board 100 is provided with a touch panel interface controller (TP IC, Touch Panel Interface Controller), which can process and transmit touch signals related to touch actions.

[0085] Reference Figure 4c As shown, in a feasible method, the width of the lower frame area of ​​the non-display area 20 is relatively small, the driving module includes a display driving chip 80 and a substrate 130, and the display driving chip 80 is bonded to the substrate 130; the flexible circuit board module includes a first flexible circuit board 100, and there is at least one connection point between the substrate 130 and the flexible circuit board module; the implementation of other structures of the display module in this method can refer to the aforementioned embodiment, which will not be repeated here.

[0086] like Figure 2cAs shown, in the display module, the flexible cable 50 is in a bent state, and part of the flexible cable 50, the driving module and the flexible circuit board module are located on the back of the surface of the display panel where the display area 10 is located. Among them, the driving module is attached to the back of the surface of the display panel where the display area 10 is located. In a feasible manner, the driving module is attached to the composite tape 180 on the back of the surface of the display panel where the display area 10 is located. In a feasible manner, the side of the driving module facing the display panel also includes a reinforcement structure 190; the reinforcement structure includes foam and polyethylene terephthalate (PET) reinforcement film; in a preferred embodiment, the reinforcement structure includes a steel sheet, which supports and protects the substrate 130 in the driving module, thereby increasing the service life of the display module. In a feasible manner, a buffer structure 200 is provided on the side of the driving module away from the display panel. In a preferred embodiment, the buffer structure includes buffer foam to enhance mechanical reliability and increase the service life of the display module.

[0087] In a feasible manner, a second flexible circuit board is connected between the display panel and the driving module for transmitting touch signals related to the touch operation.

[0088] According to the display module of the embodiment of the present application, by setting multiple bonding areas, or setting the bonding areas to a longer length, the wiring in the fan-out area does not need to be gathered in a small area. As a result, the area of ​​the non-display area in the display panel occupied by the fan-out area becomes smaller, achieving the effect of reducing the distance between the outer frame of the non-display area and the display area.

[0089] The various implementations of the above embodiments of the present application can be used in combination or in association.

[0090] See also Figure 7 As shown, the embodiment of the present application also provides a method for preparing a display module, comprising:

[0091] S102. Form at least one display panel and a driving module corresponding to the display panel on the same display substrate.

[0092] Among them, the display panel includes a display area and a non-display area; the non-display area includes a first fan-out area and a first bonding area; the first fan-out area includes at least one first sub-fan-out area; the first bonding area includes at least one first sub-bonding area, and the first sub-bonding area is arranged corresponding to the first sub-fan-out area, that is, each first sub-fan-out area is provided with a first sub-bonding area on a side away from the display area, and data, signals, etc. can be transmitted between the first sub-fan-out area and the first sub-bonding area.

[0093] In a preferred embodiment, multiple driving modules are formed in the vacant positions of the uncut display substrate, so that the number of driving modules is greater than the number of display panels. In the subsequent process flow, since the risk of the driving module breaking is high, forming multiple spare driving modules can effectively reduce the loss caused by the breaking of the driving module.

[0094] S104 . Cut and separate the display panel and the driving module, and connect the display panel and the driving module via a flexible cable.

[0095] The driving module is connected to the first bonding area through a flexible cable.

[0096] Specifically, the driving module includes a substrate, at least one display driving chip, a second bonding area and a second fan-out area; the display driving chip is bonded to the substrate, one end of the flexible cable is bonded to the display panel in the first bonding area, and the other end of the flexible cable is bonded to the substrate in the driving module in the second bonding area. In a feasible method, the bonding is performed by ACF bonding, and the surface of the connection is sealed with glue to enhance the bonding reliability.

[0097] S106. Bond the driving module to the flexible circuit board module.

[0098] Among them, the flexible circuit board module is connected to the external signal and can transmit data and power, etc.

[0099] S108. Bend the driving module to the back side of the surface of the display panel where the display area is located by bending the flexible cable, and attach the driving module to the back side of the surface of the display panel where the display area is located.

[0100] Specifically, the driving module is attached to the composite tape on the back side of the surface of the display panel where the display area is located.

[0101] In one feasible manner, a reinforcing structure is also attached to one side of the driving module facing the display panel; in a preferred embodiment, the reinforcing structure is implemented as a steel sheet, which supports and protects the substrate in the driving module and increases the service life of the display module.

[0102] In one feasible manner, a buffer structure is disposed on a side of the driving module facing away from the display panel. In a preferred embodiment, the buffer structure includes buffer foam to enhance mechanical reliability and increase the service life of the display module.

[0103] In a specific embodiment, the display panel includes an encap (Encapsulation Technology) packaging layer, which can effectively isolate the external environment, thereby extending the life of the display panel, and On-Cell touch screen technology or In-Cell touch screen technology is adopted on the surface of the encap packaging layer; the flexible circuit board module includes a first flexible circuit board, and the first flexible circuit board is provided with a touch panel interface controller (TP IC, Touch Panel Interface Controller), which can process and transmit touch signals, thereby converting the touch signals into digital signals, and the digital signals are processed by an external processor.

[0104] In another specific embodiment, the display panel includes a TFE (Thin Film Encapsulation) encapsulation layer, which can effectively isolate the external environment, thereby extending the life of the display panel; the surface of the TFE encapsulation layer adopts metal mesh touch screen (Metal Mesh TP) technology to generate touch signals; the flexible circuit board module includes a first flexible circuit board, and the first flexible circuit board is provided with a touch panel interface controller (TP IC, Touch Panel Interface Controller), which can process and transmit touch signals, thereby converting the touch signals into digital signals, and the digital signals are processed by an external processor.

[0105] The embodiment of the present application further provides a display device, which includes the display module described in the above embodiment. The above display device can be implemented in the form of various electronic devices such as mobile phones, tablet computers, handheld computers, PADs, etc.

[0106] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A display module, characterized in that: include: Display panel, driver module and flexible circuit board module; The display panel includes a display area and a non-display area; the non-display area includes a first fan-out area and a first bonding area; the first fan-out area includes at least one first sub-fan-out area; the first bonding area includes at least one first sub-bonding area; the first bonding area is arranged corresponding to the first fan-out area; The driving module is connected to the first bonding area through a flexible cable and is connected to an external signal through the flexible circuit board module; wherein the driving module is bonded to the flexible circuit board module and the driving module is attached to the back side of the display panel where the display area is located.

2. The display module according to claim 1, characterized in that: The driving module includes a substrate, at least one display driving chip, a second bonding area and a second fan-out area; The display driver chip is bonded on the substrate; The second bonding area includes at least one second sub-bonding area, and the second sub-bonding area is arranged corresponding to the first sub-bonding area, wherein one end of the flexible cable is bonded to the second sub-bonding area, and the other end of the flexible cable is bonded to the first sub-bonding area; The second fan-out area includes at least one second sub-fan-out area; the second sub-fan-out area is arranged corresponding to the display driver chip; Preferably, there are multiple display driver chips; Preferably, there are multiple display driver chips, and the multiple display driver chips are cascaded and bonded on the substrate; Preferably, there are a plurality of display driver chips, the driver module comprises a plurality of substrates, the number of the substrates is the same as the number of the display driver chips, and the plurality of display driver chips are cascaded and respectively bonded to different substrates.

3. The display module according to claim 2, characterized in that: There is a third bonding area between the display driver chip and the second fan-out area; the third bonding area includes at least one third sub-bonding area; the third sub-bonding area is arranged corresponding to the second sub-fan-out area; Preferably, there are two second sub-fan-out areas, and correspondingly, the third bonding area includes two third sub-bonding areas.

4. The display module according to claim 2, characterized in that: The substrate in the driving module is bonded to the flexible circuit board module; there is at least one connection point between the substrate and the flexible circuit board module.

5. The display module according to claim 2, characterized in that: In the driving module, a reinforcement structure is provided on a side of the substrate facing the display panel; A buffer structure is provided on a side of the substrate facing away from the display panel; Preferably, the reinforcement structure comprises a steel sheet; Preferably, the buffer structure comprises buffer foam.

6. The display module according to claim 1, characterized in that: The first sub-bonding area in the first bonding area is arranged correspondingly to the first sub-fan-out area in the first fan-out area; Preferably, the first fan-out area includes four first sub-fan-out areas, or the first fan-out area includes two first sub-fan-out areas, or the first fan-out area includes one first sub-fan-out area.

7. The display module according to claim 1, characterized in that: The flexible cable is a single-layer cable with a single row of bonding contact points; or the flexible cable is a double-layer cable with a double row of bonding contact points.

8. A display device, characterized in that: A display module comprising any one of claims 1 to 7.

9. A method for preparing a display module, characterized in that: The following steps are involved: At least one display panel and a driving module corresponding to the display panel are formed on the same display substrate; wherein the display panel includes a display area and a non-display area; the non-display area includes a first fan-out area and a first bonding area; the first fan-out area includes at least one first sub-fan-out area; the first bonding area includes at least one first sub-bonding area, and the first sub-bonding area is arranged corresponding to the first sub-fan-out area; The display panel and the driving module are cut and separated, and the display panel and the driving module are connected through a flexible cable; wherein the driving module is connected to the first bonding area through the flexible cable; Bonding the driving module to a flexible circuit board module, wherein the flexible circuit board module is connected to an external signal; The driving module is bent to the back side of the surface of the display panel where the display area is located by bending the flexible cable, and the driving module is attached to the back side of the surface of the display panel where the display area is located.

10. The method according to claim 9, characterized in that In the step of forming at least one display panel and a driving module corresponding to the display panel on the same display substrate, the number of the driving modules is greater than the number of the display panels.

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