Cathode copper plate stripping method

Abstract

The invention provides a cathode copper plate stripping method which comprises the following steps: stripping preparation: a mechanical arm is positioned on the plate surface sides of the two sides of a cathode copper plate, and a clamping mechanism above a cathode plate acts to clamp a conducting rod; the large mechanical arm rotates around the rack to drive the small mechanical arm and the suction cup frame to move towards the plate face of the cathode copper plate; stripping: the large mechanical arm reversely rotates around the rack, so that the cathode copper plate and the cathode plate are completely separated; the mechanical arm continues to rotate and drives the inner side plate face of the cathode copper plate to swing downwards till the inner side plate face of the cathode copper plate and the conveying unit form an acute angle; and conveying: the cathode copper plate falls onto a conveying unit and is conveyed to the downstream. The mechanical arm drives the suction cup to strip the cathode copper plate from the cathode plate, the cathode copper plate is stably placed on the conveying unit, the stripping efficiency is improved, and meanwhile the cathode copper plate is prevented from being scratched or collided and damaged in the stripping process.

Description

Technical Field

[0001] The invention relates to the technical field of cathode copper stripping, and in particular to a cathode copper plate stripping method. Background Art

[0002] Electrolytic copper is simply the electrolytic refining of copper. The purification of copper refers to the purification to 99.95% after electrolysis. The specific method is: the crude copper (containing 99% copper) is pre-made into a thick plate as the anode, and the pure copper is made into a thin sheet as the cathode, and sulfuric acid (H 2 SO 4 ) and copper sulfate (CuSO 4 ) as the electrolyte. After power is turned on, copper dissolves from the anode into copper ions (Cu) and moves to the cathode. After reaching the cathode, it obtains electrons and precipitates pure copper (also known as electrolytic copper or cathode copper plate) at the cathode. Impurities in crude copper, such as iron and zinc that are more active than copper, will dissolve into ions (Zn and Fe) along with copper. Since these ions are less likely to precipitate than copper ions, the precipitation of these ions on the cathode can be avoided by properly adjusting the potential difference during electrolysis. Impurities that are less active than copper, such as gold and silver, are deposited at the bottom of the electrolytic cell. The cathode copper plate produced in this way is of extremely high quality and can be used to make electrical products. After the cathode copper plate is electrolyzed on the cathode plate, it is necessary to peel the cathode copper plate off the cathode plate. In the traditional copper electrolysis process, the electrolysis time of crude copper is about 22.5 hours. In order to complete the production cycle within one day, it is generally necessary to peel the cathode copper plate and return the cathode plate to the tank within 1.5 hours. The main method of copper plate peeling is manual or semi-automatic peeling machine. Manual peeling efficiency is low. It takes a lot of manpower to complete the peeling process within 1.5 hours, and the peeling quality is poor. The peeling knife of the existing peeling machine can easily damage the copper plate, causing it to deform or wrinkle, and the copper plate can be easily damaged by bumps when it falls directly on the conveyor after being peeled.

[0003] The technical solution disclosed in the patent entitled "A stripping suction cup device, clamping device and process method for a starting electrode sheet" (CN111826685A) includes a clamping device 1 and a stripping robot 2 arranged on both sides of the clamping device 1. The clamping device 1 clamps a cathode copper plate 4, and the stripping robot 2 strips the cathode copper plate through a suction cup. The above solution uses a suction cup adsorption method to avoid scratching the copper plate, but the cathode copper plate 4 needs to be placed on the two support blocks 1-5 of the clamping device 1 through the previous process, and the process is relatively cumbersome. Summary of the invention

[0004] The invention aims to provide a cathode copper plate stripping method, which can efficiently strip the cathode copper plate while preventing it from being scratched or damaged by bumps during stripping.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: a cathode plate with a vertical plate surface is suspended on the conveying line, and the cathode copper plates are attached to the plate surfaces on both sides of the cathode plate. A mechanical arm is provided on the stripping station, and the mechanical arm includes a mechanical arm hingedly connected to a frame at one end, and a mechanical arm is hingedly connected to the other end of the mechanical arm. The swing planes of the mechanical arm and the mechanical arm are parallel, and a suction cup frame and a suction cup connected to a vacuum air source are provided at one end of the mechanical arm away from the mechanical arm.

[0006] S1, stripping preparation: After the cathode plate moves to the stripping station on the conveying line, the conveying is suspended. At this time, the robot arm is located on the plate surface side on both sides of the cathode copper plate, and the clamping mechanism above the cathode plate moves to clamp the conductive rod of the cathode plate;

[0007] S2, adsorption: the mechanical arm of the mechanical arm rotates around the frame to drive the mechanical arm and the suction cup frame to move toward the surface of the cathode copper plate until the suction surface of the suction cup on the suction cup frame is adsorbed on the surface of the cathode copper plate;

[0008] S3, peeling: the mechanical arm rotates in the opposite direction around the frame, driving the mechanical arm and the suction cup frame to move, and adsorbing the cathode copper plate to make it move away from the cathode plate surface, so that the cathode copper plate and the cathode plate are completely separated;

[0009] S4, swing transfer: the robot arm continues to rotate and drives the inner side of the cathode copper plate to swing downward until the inner side of the cathode copper plate forms an acute angle with the conveying unit, and the conveying unit for transporting the cathode copper plate is located below or beside the cathode plate;

[0010] S5, conveying: The suction cup releases its suction, the cathode copper plate falls onto the conveying unit and is conveyed downstream, the clamping mechanism stops clamping the conductive rod, and the peeled cathode plate continues to be conveyed to the next process.

[0011] The present invention mainly arranges mechanical arms on both sides of the cathode plate, and the suction cups on the suction cup frame are adsorbed on the cathode copper plate through the swing of the mechanical arms, and then the suction cups are driven to adsorb the cathode copper plate and perform a displacement movement to separate from the cathode plate surface through the rotation of the mechanical arm and the mechanical arm, so as to successfully peel it off, and finally, under the swing of the mechanical arm, the cathode copper plate is stably placed on the conveying unit, thereby improving the stripping efficiency and preventing the cathode copper plate from being scratched or bumped during peeling. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic diagram of a cathode plate and a cathode copper plate;

[0013] Figure 2 , 3 They are the side view and the front view of the cathode copper plate stripping of the stripping machine;

[0014] Figure 4 This is an isometric view of the robotic arm;

[0015] Figures 5 to 9 The schematic diagrams of the position relationship of the suction cup adsorbing the cathode copper plate during the peeling process are shown in sequence;

[0016] Fig.10 is an isometric view of the clamping mechanism;

[0017] Fig.11 A schematic diagram of a conveying unit. DETAILED DESCRIPTION

[0018] See also Figures 1 to 11 The cathode copper plate stripping method shown in the figure has a cathode plate B with a vertical plate surface suspended on the conveying line, and the cathode copper plate A is attached to the plate surfaces of both sides of the cathode plate B. A mechanical arm 10 is provided on the stripping station, and the mechanical arm 10 includes a mechanical arm 11 with one end hingedly connected to a frame 1, and a mechanical arm 12 is hingedly connected to the other end of the mechanical arm 11. The swing planes of the mechanical arm 11 and the mechanical arm 12 are parallel, and a suction cup frame 20 and a suction cup 21 connected to a vacuum air source are provided at one end of the mechanical arm 12 away from the mechanical arm 11;

[0019] S1, stripping preparation: After the cathode plate B moves to the stripping station on the conveying line, the conveying is suspended. At this time, the robot arm 10 is located on the plate surface side of both sides of the cathode copper plate A, and the clamping mechanism 30 above the cathode plate B is actuated to clamp the conductive rod B' of the cathode plate B;

[0020] S2, adsorption: the mechanical arm 11 of the mechanical arm 10 rotates around the frame 1 to drive the mechanical arm 12 and the suction cup frame 20 to move toward the surface of the cathode copper plate A, until the suction surface of the suction cup 21 on the suction cup frame 20 is adsorbed on the surface of the cathode copper plate A;

[0021] S3, peeling: the mechanical arm 11 rotates in the opposite direction around the frame 1, driving the mechanical arm 12 and the suction cup frame 20 to move, and adsorbing the cathode copper plate A to make it move away from the surface of the cathode plate B, so that the cathode copper plate A and the cathode plate B are completely separated;

[0022] S4, swing transfer: the robot arm 10 continues to rotate and drives the inner side of the cathode copper plate A to swing downward until the inner side of the cathode copper plate A forms an acute angle with the conveying unit 40, and the conveying unit 40 for transporting the cathode copper plate A is located below or beside the cathode plate B;

[0023] S5, conveying: the suction cup 21 releases the suction force, the cathode copper plate A falls onto the conveying unit 40 and is conveyed downstream, the clamping mechanism 30 stops clamping the conductive rod B', and the peeled cathode plate B continues to be conveyed to the next process.

[0024] In step S1 of the above scheme, the cathode plate B is suspended in a coplanar manner on the conveying line and displaced in sequence to the stripping station where the robot arm 10 is located. After the displacement of the cathode plate B is suspended, the clamping mechanism 30 first clamps the conductive rod B' of the cathode plate B, so that the cathode plate B does not shake significantly during the stripping process, that is, the height position of the cathode plate B is determined, the plate surface is located in the plumb plane, and the position of the cathode plate B in the length direction of the conductive rod B' is determined. Step S2 uses the suction surface of the suction cup 21 to adsorb the cathode copper plate A, which is more efficient than the traditional method of stripping with a stripping knife, and will not scratch the surface of the cathode copper plate A. In steps S3 to 5, the suction cup 21 adsorbs the cathode copper plate A for stripping and swings downward until the inner plate surface of the cathode copper plate A is at an acute angle with the conveying unit 40, and the suction is released to make the cathode copper plate A fall onto the conveying unit 40, which can prevent the cathode copper plate A from being damaged due to collision. It should be noted that steps S2 to 4 are performed in a continuous action, that is, when the suction surface of the suction cup 21 is pressed against the plate surface of the cathode copper plate A under the drive of the mechanical arm 10, the vacuum air source works, and the suction surface of the suction cup 21 generates suction to be adsorbed on the plate surface of the cathode copper plate A. The mechanical arm 10 then rotates, driving the cathode copper plate A to peel it off from the cathode plate B. The above steps are a continuous process. In addition, during the downward swing of the suction cup 21 adsorbing the cathode copper plate A, the plate surface of the adsorbed side of the cathode copper plate A must be kept facing upward, which not only facilitates the placement of the cathode copper plate A on the conveying unit 40, but also ensures that the cathode copper plate A maintains its outer plate surface facing upward. The cathode copper plate A that falls on the conveying unit 40 is convenient for the detection of the outer plate surface quality in the subsequent detection process, and also provides convenience for the subsequent sorting, packaging and other processes.

[0025] In order to improve the success rate of peeling, in the peeling step S3, the mechanical arm 11 and the mechanical arm 12 swing to drive the displacement direction of the suction cup frame 20 to be perpendicular to the plate surface of the cathode copper plate A at the suctioned part. The verticality here does not strictly require to meet the verticality in the mathematical sense, that is, it only needs to be basically vertical. Figure 6 In the state shown, when the upper edge of the cathode copper plate A is partially peeled off, the peeled cathode copper plate A has a tendency to separate from the cathode plate B under the action of gravity, and contributes to the continued peeling of the entire cathode copper plate A. That is to say, at the beginning of peeling, the adsorption force provided by the suction cup 21 first needs to overcome the bonding force between the upper edge of the cathode copper plate A and the cathode plate B, and then the cathode copper plate A and the cathode plate B can be gradually separated from the top to the bottom. After the cathode copper plate A and the cathode plate B are completely separated, the suction force provided by the suction cup 21 mainly bears the weight of the cathode copper plate A and the centrifugal force during the swinging process, and the robot arm 10 drives the suction cup 21 and drives the cathode copper plate A to make a swinging posture adjustment.

[0026] In order to improve the success rate of the suction and peeling of the suction cup 21, in the step S2, the suction surface of the suction cup 21 is adsorbed on the upper board surface of the cathode copper plate A adjacent to its upper edge. In the above scheme, the suction cup 21 is adsorbed on the board surface of the cathode copper plate A adjacent to the upper edge, and the lower edge of the cathode copper plate A away from the adsorption position of the suction cup 21 is used as a fulcrum. Compared with the center of the board surface directly adsorbing the cathode copper plate A, the force arm of the adsorption force applied near the upper edge of the cathode copper plate A is longer relative to the fulcrum, and the lever principle is utilized, and the success rate of peeling is higher. On the contrary, if the suction position of the suction cup 21 is set in the middle of the cathode copper plate A away from the edge, it is difficult to peel the cathode copper plate A from the cathode plate B even if a huge suction force is provided and severe plastic deformation occurs in the back adsorption area of ​​the cathode copper plate A and its surroundings.

[0027] A further solution is that step S4 specifically includes:

[0028] S4a, first swing: the mechanical arm 11 rotates around the frame 1 in the direction away from the cathode plate B and drives the cathode copper plate A away from the cathode plate B; at the same time, the mechanical small arm 12 rotates around the mechanical arm 11 to drive the cathode copper plate A adsorbed on the suction cup frame 20 to swing downward;

[0029] S4b, second swing: while the mechanical small arm 12 continues to swing downward, the mechanical large arm 11 turns around the frame 1 and rotates toward the cathode plate B, so that the inner plate surface of the cathode copper plate A forms an acute angle with the conveying unit 40;

[0030] S4c, end of swinging: the robot arm 10 continues to rotate until the lower plate surface of the inner side of the cathode copper plate A near the lower edge abuts against the conveying roller frame 40 and stops.

[0031] In the above scheme, during the process of the mechanical arm 11 rotating in the direction away from the cathode plate B and the mechanical arm 12 driving the suction cup frame 20 to rotate downward, the cathode copper plate A will gain acceleration in the direction away from the cathode plate B when it is sucked and swung downward by the suction cup 21. During the process of the mechanical arm 12 continuing to swing downward, the hinge between the mechanical arm 11 and the mechanical arm 12 reaches the highest point of the motion trajectory, after which the mechanical arm 11 turns to rotate in the opposite direction, that is, rotates around the frame 1 toward the cathode plate B. At this time, the cathode copper plate A still has the inertia to move away from the cathode plate B. Under the combined effect of the suction cup 21 sucking the cathode copper plate A forward and its own inertia, the plate surface of the cathode copper plate A presents a slightly downwardly convex curved surface, as shown in FIG. Fig. 9 As shown, the lower edge of the cathode copper plate A swings upward. In this state, the first part of the cathode copper plate A that contacts the conveying roller frame 40 is the plate surface close to the lower edge of the cathode copper plate A rather than the lower edge of the cathode copper plate A. This can prevent the lower edge of the cathode copper plate A from hitting the conveying roller frame 4 and reduce the wear of the cathode copper plate A and the conveying roller frame 40.

[0032] A more preferred solution is that a detection sensor is provided on the mechanical arm 10, and the detection direction of the detection sensor points to the plate surface of the cathode plate B. The detection sensor can detect the distance between the suction cup 21 and the cathode copper plate A in real time.

[0033] like Figures 5 to 7 As shown, the step S3 specifically includes:

[0034] S3a1, peeling: the suction cup frame 20 is hingedly connected to the mechanical arm 12. When the mechanical arm 10 rotates to completely separate the cathode copper plate A and the cathode plate B, the mechanical arm 11 rotates around the frame 1 to move the hinged end of the mechanical arm 11 and the mechanical arm 12 away from the cathode plate B. At the same time, the mechanical arm 12 rotates around the hinged end to move the suction cup frame 20 away from the cathode plate B. At the same time, the suction cup frame 20 keeps its displacement direction perpendicular to the plate surface of the cathode copper plate A where it is adsorbed.

[0035] S3a2, hovering: After the cathode copper plate A and the cathode plate B are completely separated, the robot arm 10 continues to rotate in the direction of movement in step S3a1, so that the cathode copper plate A continues to move away from the cathode plate B until its inner plate surface moves to a small distance from the cathode plate B, and then the robot arm 10 stops moving. Figure 7 As shown;

[0036] S3b1, peeling success: if the detection sensor detects that the distance between the suction cup 21 and the cathode copper plate A remains unchanged during the execution of step S3a2, it is marked as state B1, and step S4 is continued;

[0037] S3b2, peeling failure: If the detection sensor detects that the distance between the suction cup 21 and the cathode copper plate A gradually increases during the execution of step S3a2, it is marked as state B2, and the robot arm 10 sequentially performs actions completely opposite to steps S3a2 and S3a1, so that the suction surface of the suction cup 21 is re-adsorbed on the surface of the cathode copper plate A, and then starts to execute step S3a1 again.

[0038] After executing step S3a2, if the detection sensors on both sides of the surface of the cathode plate B detect the state B1, the robot arms 10 on both sides execute step S4;

[0039] If the detection sensors on both sides of the cathode plate B detect the state B2, the robot arms 10 on both sides execute step S3b2;

[0040] If the detection sensor on one side of the surface of the cathode plate B detects state B1 and the detection sensor on the other side detects state B2, the robot arm 10 on the state B2 side executes step S3b2, and the robot arm 10 on the state B1 side executes the following step S3b3: the robot arm 10 performs an action completely opposite to step S3a2, so that the suction cup 21 adsorbs the inner surface of the cathode copper plate A and re-approaches or abuts against the surface of the cathode plate B, and then the robot arm 10 executes step S3a2 again.

[0041] If after steps S3a1 and S3a2 are executed n times, at least one of the detection sensors on both sides of the cathode plate B still detects state B2, the subsequent steps are suspended and an alarm signal is issued; n can be 2, 3, 4 or 5.

[0042] In the above scheme, when the mechanical arms 10 on both sides of the surface of the cathode plate B simultaneously drive the suction cups 21 to absorb and peel off the cathode copper plate A, it is possible that the cathode copper plate A on one side of the cathode plate B is successfully peeled off (i.e., state B1), but the cathode copper plate A on the other side is not successfully peeled off due to insufficient suction of the suction cups 21 on that side (i.e., state B2). At this time, the suspended cathode plate B is subjected to unbalanced force, and the clamping mechanism 30 clamps the conductive rod B' of the cathode plate B to ensure that the angle between the cathode plate B and the original plumb line is a smaller angle, so that the cathode copper plate A on the side with no attenuation of suction can be reliably peeled off from the cathode plate B. The cathode copper plate A hovers for a short period of time in step S3a2, so that the detection sensor stops in time and repeats step S3a1 when detecting the state B2 of peeling failure.

[0043] In order to keep the stripping and transportation rhythm of the cathode copper plates A on both sides of the cathode plate B consistent, when at least one side is in the state B2 of unsuccessful stripping, the robot arms 10 on both sides re-execute step S3b2 or step S3b3 until the cathode copper plates A on both sides of the cathode plate B are successfully stripped. However, if the state B2 of unsuccessful stripping of the cathode copper plates A still occurs after repeated multiple times, the suction cup 21 of the robot arm 10 may leak or have other conditions that lead to insufficient adsorption force. In order not to affect the overall production efficiency, the stripping station sends an alarm signal to prompt the staff to check.

Claims

1. A cathode copper plate stripping method, characterized in that: A cathode plate (B) with a vertical plate surface is suspended on the conveying line, and cathode copper plates (A) are attached to the plate surfaces on both sides of the cathode plate (B). A mechanical arm (10) is provided on the stripping station, and the mechanical arm (10) includes a mechanical arm (11) with one end hingedly connected to the frame (1), and a mechanical arm (12) is hingedly connected to the other end of the mechanical arm (11). The swing planes of the mechanical arm (11) and the mechanical arm (12) are parallel, and a suction cup frame (20) and a suction cup (21) connected to a vacuum air source are provided at one end of the mechanical arm (12) away from the mechanical arm (11); S1, stripping preparation: After the cathode plate (B) moves to the stripping station on the conveying line, the conveying is suspended. At this time, the robot arm (10) is located on the plate surface side of both sides of the cathode copper plate (A), and the clamping mechanism (30) above the cathode plate (B) is actuated to clamp the conductive rod (B') of the cathode plate (B); S2, adsorption: the mechanical arm (11) of the mechanical arm (10) rotates around the frame (1) to drive the mechanical arm (12) and the suction cup frame (20) to move toward the surface of the cathode copper plate (A), until the suction surface of the suction cup (21) on the suction cup frame (20) is adsorbed on the surface of the cathode copper plate (A); S3, peeling: the mechanical arm (11) rotates in the opposite direction around the frame (1), driving the mechanical arm (12) and the suction cup frame (20) to move, and adsorbing the cathode copper plate (A) to make it move away from the surface of the cathode plate (B), so that the cathode copper plate (A) and the cathode plate (B) are completely separated; S4, swing transfer: the mechanical arm (10) continues to rotate and drives the inner plate surface of the cathode copper plate (A) to swing downward until the inner plate surface of the cathode copper plate (A) forms an acute angle with the conveying unit (40), and the conveying unit (40) for transporting the cathode copper plate (A) is located below or beside the cathode plate (B); S5, conveying: the suction cup (21) releases the suction force, the cathode copper plate (A) falls onto the conveying unit (40) and is conveyed downstream, the clamping mechanism (30) releases the clamping of the conductive rod (B'), and the peeled cathode plate (B) continues to be conveyed to the next process.

2. The cathode copper plate stripping method according to claim 1, characterized in that: In the S3 peeling step, when the mechanical arm (11) and the mechanical arm (12) swing, the displacement direction of the suction cup frame (20) is driven to be perpendicular to the plate surface of the cathode copper plate (A) at the adsorbed part.

3. The cathode copper plate stripping method according to claim 1, characterized in that: In the step S2, the suction surface of the suction cup (21) is adsorbed on the upper plate surface of the cathode copper plate (A) adjacent to its upper edge.

4. The cathode copper plate stripping method according to claim 3, characterized in that: The step S4 specifically includes: S4a, first swing: the mechanical arm (11) rotates around the frame (1) in a direction away from the cathode plate (B) and drives the cathode copper plate (A) away from the cathode plate (B); at the same time, the mechanical small arm (12) rotates around the mechanical arm (11) to drive the cathode copper plate (A) adsorbed on the suction cup frame (20) to swing downward; S4b, second swing: while the mechanical small arm (12) continues to swing downward, the mechanical large arm (11) turns around the frame (1) and rotates in the direction of the cathode plate (B), so that the inner plate surface of the cathode copper plate (A) forms an acute angle with the conveying unit (40); S4c, end of swinging: the mechanical arm (10) continues to rotate until the lower plate surface of the inner side of the cathode copper plate (A) near the lower edge abuts against the conveying roller frame (40) and stops.

5. The cathode copper plate stripping method according to claim 1 or 2, characterized in that: A detection sensor is provided on the mechanical arm (10), and the detection direction of the detection sensor points to the plate surface of the cathode plate (B).

6. The cathode copper plate stripping method according to claim 5, characterized in that: The step S3 specifically includes: S3a1, peeling: the suction cup frame (20) is hingedly connected to the mechanical arm (12). When the mechanical arm (10) rotates to completely separate the cathode copper plate (A) and the cathode plate (B), the mechanical arm (11) rotates around the frame (1) to move the hinged end of the mechanical arm (11) and the mechanical arm (12) away from the cathode plate (B). At the same time, the mechanical arm (12) rotates around the hinged end to move the suction cup frame (20) away from the cathode plate (B). At the same time, the suction cup frame (20) maintains its own displacement direction perpendicular to the plate surface of the cathode copper plate (A) where it is adsorbed. S3a2, hovering: after the cathode copper plate (A) and the cathode plate (B) are completely separated, the robot arm (10) continues to rotate in the direction of movement in step S3a1, so that the cathode copper plate (A) continues to move away from the cathode plate (B), until its inner plate surface is displaced to a short distance from the cathode plate (B), and then the robot arm (10) stops moving; S3b1, peeling is successful: if the detection sensor detects that the distance between the suction cup (21) and the cathode copper plate (A) remains unchanged during the execution of step S3a2, it is marked as state B1, and step S4 is continued; S3b2, peeling failure: If the detection sensor detects that the distance between the suction cup (21) and the cathode copper plate (A) gradually increases during the execution of step S3a2, it is marked as state B2, and the robot arm (10) sequentially performs actions completely opposite to steps S3a2 and S3a1, so that the suction surface of the suction cup (21) is re-adsorbed on the surface of the cathode copper plate (A), and then starts to execute step S3a1 again.

7. The cathode copper plate stripping method according to claim 6, characterized in that: After executing step S3a2, if the detection sensors on both sides of the cathode plate (B) detect state B1, the mechanical arms (10) on both sides execute step S4; If the detection sensors on both sides of the cathode plate (B) detect state B2, the mechanical arms (10) on both sides execute step S3b2; If the detection sensor on one side of the cathode plate (B) detects state B1 and the detection sensor on the other side detects state B2, the robot arm (10) on the state B2 side executes step S3b2, and the robot arm (10) on the state B1 side executes the following step S3b3: the robot arm (10) executes an action completely opposite to step S3a2, so that the suction cup (21) adsorbs the inner surface of the cathode copper plate (A) and re-approaches or abuts against the surface of the cathode plate (B), and then the robot arm (10) executes step S3a2 again.

8. The cathode copper plate stripping method according to claim 6 or 7, characterized in that: If after steps S3a1 and S3a2 are executed n times, at least one of the detection sensors on both sides of the cathode plate (B) still detects state B2, the subsequent steps are suspended and an alarm signal is issued; n can be 2, 3, 4 or 5.

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