Laser scribing method, system and related device for reducing physical stress damage to chip

Abstract

The invention discloses a laser scribing method, system and related device for reducing physical stress damage to a chip, and the method comprises the steps: obtaining the basic data of a to-be-scribed chip, and building a laser scribing database according to the basic data; collecting a feature image of the chip subjected to physical stress damage, and storing the feature image as initial data in the database as a first data feature; based on the current production plan, determining the type of a to-be-scribed chip, obtaining the information of the determined type of the to-be-scribed chip, and taking the information as a second data feature; and comparing the first data feature with the second data feature before performing scribing operation on the chip to obtain a data distinguishing point, and formulating a scribing operation mode according to the data distinguishing point. Through data comparison and analysis, risk points possibly causing physical stress damage can be identified in advance, so that the physical stress damage of the chip in the scribing process is effectively reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser scribing, and in particular relates to a laser scribing method, system and related devices for reducing physical stress damage to chips. Background Art

[0002] The traditional laser scribing process requires manual adjustment of laser scribing parameters, which is inefficient and low in precision. In addition, different laser scribing process parameter settings are required for chips of different specifications and models. In this process, the probability of chip damage will increase sharply, and many damaged chips will appear in the actual chip scribing operation. In order to solve this problem, experienced process engineers are required to conduct a large number of experiments before they can be completed. The test cycle is long, which affects the actual production operation efficiency. Summary of the invention

[0003] The present invention provides a laser scribing method, system and related devices for reducing physical stress damage to chips, so as to solve the problem in the prior art that different laser scribing process parameters need to be set when performing laser scribing operations on chips of different specifications and models. During this process, the probability of chip damage will increase sharply, and many technical defects of chip damage will occur during the actual chip scribing operation.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions: In a first aspect, a laser scribing method for reducing physical stress damage to a chip is provided, comprising: Obtaining basic data of the chip to be scribed, and establishing a laser scribe database according to the basic data; Collecting a characteristic image of a chip damaged by physical stress, and storing the characteristic image as initial data in the database as a first data feature; Based on the current production plan, determine the type of chip to be marked, and obtain information about the determined type of chip to be marked, and use the information as the second data feature; Before the chip is diced, the first data feature and the second data feature are compared to obtain data difference points, and a dicing operation method is determined according to the data difference points.

[0005] Furthermore, basic data of the chip to be scribed is obtained, and a laser scribe database is established according to the basic data, specifically including: The basic data includes chip type, chip size parameters and size data of the scribing lane between two adjacent chip blocks, and the laser scribing database is established by acquiring specifications and models of multiple different types of chips to be scribed; The size parameters of multiple different types of chips to be diced and the size data of the dicing lanes between two adjacent chip blocks are obtained as the basic information of the signal chip of the corresponding specification.

[0006] Furthermore, a characteristic image of the chip being damaged by physical stress is collected, and the characteristic image is stored as initial data in the database as a first data feature, specifically including: Collect characteristic images of chips that have been damaged by physical stress in the past, store the characteristic images as initial data in a database, and analyze the characteristic images to obtain specific damage areas in the characteristic images; The type of factors causing the damage is analyzed by acquiring the specific damage area, and the type of factors is used as the first data feature.

[0007] Furthermore, the types of factors include laser source wavelength data, laser power data, laser emission frequency data and laser emission angle data.

[0008] Further, based on the current production plan, the type of chip to be diced is determined, and information about the type of chip to be diced is obtained, and the information is used as the second data feature, specifically including: Based on the current production plan, determine the type of chips to be diced, and obtain information about the determined type of chips to be diced, wherein the chip type information includes chip specifications, chip size parameters, and size data of dicing lanes between two adjacent chip blocks; The obtained chip type information is used as a second data feature, and the second data feature is compared with the first data feature to obtain data feature differences.

[0009] Furthermore, the differences in the characteristics of the acquired data are specifically as follows: Comparing the second data feature with the first data feature to obtain data feature differences, wherein the feature differences include chip specification signal mismatch, chip size parameter mismatch, and size data mismatch of dicing lanes between two adjacent chip blocks; Determine the specific reasons for the chip specification signal mismatch, chip size parameter mismatch, and scribe lane size data mismatch between two adjacent chip blocks, and analyze and correct the mismatch reasons in combination with the current production schedule.

[0010] Furthermore, before the chip is diced, the first data feature and the second data feature are compared to obtain a data difference point, and a dicing operation method is formulated according to the data difference point, specifically including: Compare the first data feature with the second data feature to obtain a data difference point, and determine whether the data difference point affects the dicing operation. If not, execute a preset dicing scheme to perform the dicing operation; If there is any impact, analyze the reasons for the difference and adjust and correct the slicing plan.

[0011] In a second aspect, a laser scribing system for reducing physical stress damage to a chip is provided, comprising: A data acquisition module is used to obtain basic data of the chip to be sliced; A database establishment module, used to establish a laser scribing database; An image acquisition module, used to acquire characteristic images of chips damaged by physical stress; A data comparison module, used for comparing the first data feature with the second data feature; The operation mode formulation module is used to formulate the slicing operation mode according to the data distinguishing points.

[0012] According to a third aspect, an electronic device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable in the processor, wherein the processor implements the steps of the laser scribing method for reducing physical stress damage to the chip as described above when executing the computer program.

[0013] In a fourth aspect, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the laser scribing method for reducing physical stress damage to a chip as described above is implemented.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. Through data comparison and analysis, risk points that may cause physical stress damage can be identified in advance, and the physical stress damage characteristics of different types of chips during the slicing process can be understood more accurately, so as to formulate more accurate slicing operation methods and take corresponding measures to prevent and control them during the slicing operation, thereby effectively reducing the physical stress damage suffered by the chip during the slicing process and improving the slicing accuracy and chip quality. Secondly, by establishing a laser slicing database and conducting data analysis, production plans can be formulated more scientifically, and the production sequence and slicing operation methods can be reasonably arranged according to the characteristics and needs of different types of chips, which not only improves production efficiency and resource utilization, but also significantly reduces the risk of physical stress damage to the chip during the slicing process, thereby improving the yield and quality stability of the product, and solving the technical defects that require experienced process engineers to conduct a large number of experiments before completion, and the test cycle is long, which affects the actual production operation efficiency.

[0015] 2. By obtaining the specifications and models of multiple different types of chips to be scribed, it can be ensured that the database contains the basic data of various chips, including chip types, size parameters, and scribe lane dimensions. The accuracy of these data is directly related to the accuracy of scribe. The establishment of the database enables these data to be stored in a systematic and standardized manner, reducing errors caused by human operations. When performing laser scribe, the corresponding basic data can be quickly found in the database according to the specifications and models of the chips to be scribed. By comparing and analyzing these data, the parameter settings of laser scribe can be optimized, thereby improving the accuracy of scribe.

[0016] 3. By collecting characteristic images of chips damaged by physical stress and processing these images using image analysis technology, the damaged area can be accurately identified, which is more accurate and efficient than traditional manual inspection. After identifying the damaged area, further analysis of the types of factors that cause the damage will help to gain a deeper understanding of the impact of physical stress on the chip and provide strong support for subsequent preventive measures.

[0017] 4. By considering data from multiple dimensions such as laser source wavelength, laser power, laser emission frequency, and laser emission angle, we can have a more comprehensive understanding of the factors that may cause physical stress damage to the chip during laser scribing, which helps to improve the accuracy of damage analysis and reduce misjudgments and missed judgments. By analyzing these specific data, we can accurately identify the specific causes of damage and provide strong support for subsequent optimization and improvement.

[0018] 5. By accurately identifying the types of chips to be scribed in the current production plan, detailed information such as the specifications, size parameters, and scribe lane size data of each chip can be obtained, providing a basis for customized production and ensuring that each step in the production process meets the specific needs of the chip. By comparing the second data feature with the first data feature, potential physical stress damage risks can be discovered in a timely manner. Through comparative analysis, the parameters of laser scribing, such as laser power, wavelength, frequency, and emission angle, can be adjusted according to the characteristics of the chip to be scribed, which helps to reduce the physical stress generated during the scribing process, thereby reducing the risk of chip damage.

[0019] 6. By comparing the second data feature with the first data feature, it is possible to accurately identify which aspects of the data are mismatched, helping the production department to quickly locate the problem and avoid waste and delays caused by data errors during the production process.

[0020] 7. By comparing the first data feature and the second data feature, the difference between the current chip to be diced and the previously damaged chip can be identified. Based on these difference points, a more targeted and accurate dicing plan can be formulated to ensure that the dicing operation can meet the specific needs of the current chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A flow chart of the laser scribing method for reducing physical stress damage to chips provided by the present invention; Figure 2 This is a system schematic diagram of the laser scribing method for reducing physical stress damage to chips provided by the present invention. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0026] In the description of the embodiments of the present invention, it should be noted that if the terms "upper", "lower", "horizontal", "inner", etc. indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0027] In addition, if the term "horizontal" appears, it does not mean that the component must be absolutely horizontal, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", which does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0028] In the description of the embodiments of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] The traditional laser scribing process requires manual adjustment of laser scribing parameters, which is inefficient and low in precision. In addition, different laser scribing process parameter settings are required for chips of different specifications and models. In this process, the probability of chip damage will increase sharply, and many damaged chips will appear in the actual chip scribing operation. In order to solve this problem, experienced process engineers are required to conduct a large number of experiments before they can be completed. The test cycle is long, which affects the actual production operation efficiency.

[0030] In order to solve the above technical defects, the inventor provides a laser scribing method, system and related devices for reducing physical stress damage to chips.

[0031] The present invention is further described in detail below in conjunction with the accompanying drawings: In a first aspect, this embodiment provides a laser scribing method for reducing physical stress damage to a chip, such as Figure 1 As shown, the method includes: S101, obtain the basic data of the chip to be scribed, and establish a laser scribing database based on the basic data; illustratively, the basic data includes chip type, chip size parameters and size data of the scribing path between two adjacent chip blocks. By obtaining the specifications and models of multiple different types of chips to be scribed, a laser scribing database is established; then the size parameters of multiple different types of chips to be scribed and the size data of the scribing path between two adjacent chip blocks are displayed as the basic information of the corresponding specification signal chip. By obtaining the specifications and models of multiple different types of chips to be scribed, it can be ensured that the database contains the basic data of various chips, including chip type, size parameters and scribing path size, etc. The accuracy of these data is directly related to the precision of scribing. The establishment of the database enables these data to be stored in a systematic and standardized manner, reducing the errors caused by human operation. When performing laser scribing, the corresponding basic data can be quickly found in the database according to the specifications and models of the chip to be scribed. By comparing and analyzing these data, the parameter settings of laser scribing can be optimized, thereby improving the precision of scribing.

[0032] S102, collect characteristic images of chips damaged by physical stress, store the characteristic images as initial data in the database as the first data feature; illustratively, collect characteristic images of chips that have been damaged by physical stress in the past, store the characteristic images as initial data in the database, and analyze the characteristic images to obtain specific damaged areas in the characteristic images; analyze the types of factors that cause damage through the obtained specific damaged areas, and use the types of factors as the first data feature; wherein the types of factors include laser source wavelength data, laser power data, laser emission frequency data, and laser emission angle data. By collecting characteristic images of chips damaged by physical stress and processing these images using image analysis technology, the damaged areas can be accurately identified, which is more accurate and efficient than traditional manual inspection. After identifying the damaged areas, further analyzing the types of factors that cause damage helps to gain a deeper understanding of the impact of physical stress on chips and provide strong support for subsequent preventive measures.

[0033] S103, based on the current production plan, determine the type of chip to be scribed, and obtain the information of the determined type of chip to be scribed, and use the information as the second data feature; illustratively, based on the current production plan, determine the type of chip to be scribed, obtain the information of the determined type of chip to be scribed, and the chip type information includes chip specification model, chip size parameters and the size data of the scribe path between two adjacent chip blocks; use the obtained chip type information as the second data feature, and compare the second data feature with the first data feature to obtain the difference in data features. By accurately identifying the type of chip to be scribed in the current production plan, detailed information such as the specification model, size parameters and scribe path size data of each chip can be obtained, which provides a basis for customized production and ensures that each step in the production process meets the specific needs of the chip. By comparing the second data feature with the first data feature, potential physical stress damage risks can be discovered in a timely manner. Through comparative analysis, the parameters of laser scribing, such as laser power, wavelength, frequency and emission angle, can be adjusted according to the characteristics of the chip to be scribed, which helps to reduce the physical stress generated during the scribing process, thereby reducing the risk of chip damage.

[0034] S104: Before performing a chip slicing operation, the first data feature and the second data feature are compared to obtain a data difference point, and a slicing operation method is formulated according to the data difference point. Exemplarily, the first data feature and the second data feature are compared to obtain a data difference point, and it is determined whether the data difference point affects the slicing operation. If there is no effect, a preset slicing scheme is executed to perform the slicing operation; if there is an effect, the cause of the difference point is analyzed, and the slicing scheme is adjusted and corrected.

[0035] By comparing the first data feature and the second data feature, the difference between the current chip to be diced and the previously damaged chip can be identified. Based on these differences, a more targeted and accurate dicing plan can be formulated to ensure that the dicing operation can meet the specific needs of the current chip. When the method is used to slice the chip, the risk points that may cause physical stress damage can be identified in advance through data comparison and analysis, and the physical stress damage characteristics of different types of chips during the dicing process can be more accurately understood, so as to formulate a more accurate dicing operation method, and take corresponding measures to prevent and control the physical stress damage suffered by the chip during the dicing process, thereby effectively reducing the physical stress damage suffered by the chip during the dicing process and improving the dicing accuracy and chip quality. Secondly, by establishing a laser dicing database and performing data analysis, a production plan can be formulated more scientifically, and the production sequence and dicing operation method can be reasonably arranged according to the characteristics and needs of different types of chips, which not only improves production efficiency and resource utilization, but also can significantly reduce the risk of physical stress damage to the chip during the dicing process, thereby improving the yield and quality stability of the product, and solving the technical defects that require experienced process engineers to conduct a large number of experiments before completion, the test cycle is long, and the actual production operation efficiency is affected.

[0036] In a second aspect, a laser scribing system is provided to reduce physical stress damage to the chip. Figure 2 As shown, including: A data acquisition module is used to obtain basic data of the chip to be sliced; A database establishment module, used to establish a laser scribing database; An image acquisition module, used to acquire characteristic images of chips damaged by physical stress; A data comparison module, used for comparing the first data feature with the second data feature; The operation mode formulation module is used to formulate the slicing operation mode according to the data distinguishing points.

[0037] According to a third aspect, an electronic device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable in the processor, wherein the processor implements the steps of the laser scribing method for reducing physical stress damage to the chip as described above when executing the computer program.

[0038] In a fourth aspect, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the laser scribing method for reducing physical stress damage to a chip as described above is implemented.

[0039] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

[0040] It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0041] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0042] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0043] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0044] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A laser scribing method for reducing physical stress damage to a chip, characterized in that: include: Obtaining basic data of the chip to be scribed, and establishing a laser scribe database according to the basic data; Collecting a characteristic image of a chip damaged by physical stress, and storing the characteristic image as initial data in the database as a first data feature; Based on the current production plan, determine the type of chip to be marked, and obtain information about the determined type of chip to be marked, and use the information as the second data feature; Before the chip is diced, the first data feature and the second data feature are compared to obtain data difference points, and a dicing operation method is determined according to the data difference points.

2. The method according to claim 1, characterized in that Obtaining basic data of the chip to be scribed and establishing a laser scribe database based on the basic data, specifically including: The basic data includes chip type, chip size parameters and size data of the scribing lane between two adjacent chip blocks, and the laser scribing database is established by acquiring specifications and models of multiple different types of chips to be scribed; The size parameters of multiple different types of chips to be diced and the size data of the dicing lanes between two adjacent chip blocks are obtained as the basic information of the signal chip of the corresponding specification.

3. The method according to claim 1, characterized in that Collecting a characteristic image of a chip damaged by physical stress, and storing the characteristic image as initial data in the database as a first data feature, specifically includes: Collect characteristic images of chips that have been damaged by physical stress in the past, store the characteristic images as initial data in a database, and analyze the characteristic images to obtain specific damage areas in the characteristic images; The type of factors causing the damage is analyzed by acquiring the specific damage area, and the type of factors is used as the first data feature.

4. The method according to claim 3, characterized in that: The types of factors include laser source wavelength data, laser power data, laser emission frequency data and laser emission angle data.

5. The method according to claim 1, characterized in that Based on the current production plan, the type of chip to be diced is determined, and information about the type of chip to be diced is obtained, and the information is used as the second data feature, specifically including: Based on the current production plan, determine the type of chips to be diced, and obtain information about the determined type of chips to be diced, wherein the chip type information includes chip specifications, chip size parameters, and size data of dicing lanes between two adjacent chip blocks; The obtained chip type information is used as a second data feature, and the second data feature is compared with the first data feature to obtain data feature differences.

6. The method according to claim 5, characterized in that The differences in the characteristics of the acquired data are specifically as follows: Comparing the second data feature with the first data feature to obtain data feature differences, wherein the feature differences include chip specification signal mismatch, chip size parameter mismatch, and size data mismatch of dicing lanes between two adjacent chip blocks; The specific reasons for the chip specification signal mismatch, chip size parameter mismatch, and scribe lane size data mismatch between two adjacent chip blocks are determined, and the mismatch reasons are analyzed and corrected in combination with the current production schedule.

7. The method according to claim 1, characterized in that Before performing a dicing operation on the chip, the first data feature and the second data feature are compared to obtain a data difference point, and a dicing operation method is formulated according to the data difference point, specifically including: Compare the first data feature with the second data feature to obtain a data difference point, and determine whether the data difference point affects the dicing operation. If not, execute a preset dicing scheme to perform the dicing operation; If there is any impact, analyze the reasons for the difference and adjust and correct the slicing plan.

8. A laser scribing system for reducing physical stress damage to chips, characterized in that: include: A data acquisition module is used to obtain basic data of the chip to be sliced; A database establishment module, used to establish a laser scribing database; An image acquisition module, used to acquire characteristic images of chips damaged by physical stress; A data comparison module, used for comparing the first data feature with the second data feature; The operation mode formulation module is used to formulate the slicing operation mode according to the data distinguishing points.

9. An electronic device, characterized in that: The invention comprises a memory, a processor and a computer program stored in the memory and executable in the processor, wherein the processor implements the steps of the laser scribing method for reducing physical stress damage to a chip as described in any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the laser scribing method for reducing physical stress damage to a chip according to any one of claims 1 to 7 is implemented.

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