Wafer alignment and bonding device, wafer bonding method and precision compensation method

Abstract

The invention belongs to the technical field of wafer bonding, and discloses a wafer alignment and bonding device, a wafer bonding method and a precision compensation method. The wafer aligning and bonding device comprises a base, a first bearing assembly, a second bearing assembly and a camera assembly, the first bearing assembly is used for bearing a first wafer and driving the first wafer to translate along an X axis, translate along a Y axis and rotate around a Z axis, so that the relative position of the first wafer is adjustable; the second bearing assembly is used for bearing a second wafer and driving the second wafer to translate along the Z axis so as to realize bonding of the second wafer and the first wafer; the camera assembly comprises a CCD camera, and the CCD camera is used for identifying the mark points on the first wafer and the second wafer respectively so as to assist the alignment of the first wafer and the second wafer. According to the wafer alignment and bonding device, alignment and bonding are designed at the same position, the movement stroke to the bonding position is omitted after alignment is completed, errors are reduced, and the bonding quality and the product yield are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer bonding, and in particular to a wafer alignment and bonding device, a wafer bonding method and a precision compensation method. Background Art

[0002] Wafer bonding technology refers to the process of tightly bonding two mirror-polished homogeneous or heterogeneous wafers together through chemical and physical effects. After the wafers are bonded, the atoms on the interface react under the action of external forces to form covalent bonds to form a whole, and the bonding interface reaches a specific bonding strength. In wafer bonding technology, wafer alignment accuracy and wafer distortion after bonding are important parameters to characterize the quality of wafer bonding process. If there are defects in the alignment accuracy in the wafer bonding process, it will seriously affect the back-end process of the process, which will in turn affect the connection and functionality of the circuit after wafer bonding, and reduce the yield of the wafer.

[0003] The existing wafer bonding machine includes two sets of carriers and two sets of lens components, such as Figure 1 As shown, the first group of carriers 1' is arranged on a horizontal surface, and has the function of translation along the X-axis and Y-axis and rotation around the Z-axis; the second group of carriers 2' is suspended above the first group of carriers 1', and has the function of translation along the X-axis, Y-axis and Z-axis; the first group of lens components 3' is located on one side of the first group of carriers 1', and is used to identify the marking points of the chip on the second group of carriers 2'; the second lens component 4' is located on one side of the second group of carriers 2', and is used to identify the marking points of the chip on the first group of carriers 1'.

[0004] Specific bonding process: After the two wafers are loaded onto two sets of carriers respectively, the wafers are placed within the field of view of the corresponding lens assembly to determine the positions of the upper and lower wafers in the current coordinate system, and then calculate the bonding coordinate position. Next, the two sets of carriers move the two wafers to the bonding position for bonding. Figure 2 shown.

[0005] However, the above bonding method has very high requirements on the movement accuracy of the two sets of carriers. After the wafer is aligned with the lens assembly, it needs to move a certain distance to the bonding position. There will be many errors involved in this movement. When the alignment accuracy needs to reach the micron or sub-micron level, there are very high requirements on the movement accuracy of the carrier, the overall seismic performance of the equipment, etc. Any slight error will lead to the amplification of the bonding error and affect the bonding quality. Summary of the invention

[0006] Based on the above problems, the purpose of the present invention is to provide a wafer alignment and bonding device, a wafer bonding method and a precision compensation method to reduce the error generated during the wafer bonding process, improve the alignment accuracy and ensure the bonding quality.

[0007] To achieve the above object, in the first aspect, the present invention adopts the following technical solutions:

[0008] A wafer alignment and bonding device, comprising:

[0009] A base, with a mounting frame disposed above the base;

[0010] A first bearing assembly is disposed on the base, and is used to bear the first wafer and drive the first wafer to translate along the X-axis, translate along the Y-axis, and rotate around the Z-axis, so that the relative position of the first wafer is adjustable;

[0011] A second bearing assembly is disposed on the mounting frame, and is used to bear the second wafer and drive the second wafer to translate along the Z axis, so as to achieve bonding between the second wafer and the first wafer;

[0012] The camera assembly includes a CCD camera that can be moved in and out between the first supporting assembly and the second supporting assembly. The CCD camera is used to respectively identify the marking points on the first wafer and the second wafer to help adjust the position of the first wafer and achieve accurate alignment of the first wafer and the second wafer.

[0013] As an optional solution, the first supporting component includes a Y-axis linear module installed on the base, an X-axis linear module is arranged at the output end of the Y-axis linear module, a rotary drive module is arranged at the output end of the X-axis linear module, and a first supporting platform is arranged at the output end of the rotary drive module.

[0014] As an optional solution, the second bearing assembly includes a Z-axis linear module installed on a mounting frame, and a second bearing platform is provided at an output end of the Z-axis linear module.

[0015] As an optional solution, the camera assembly includes a bracket installed on the base, the bracket is provided with a camera Y-axis drive module, the output end of the camera Y-axis drive module is provided with a camera X-axis drive module, and the CCD camera is installed at the output end of the camera X-axis drive module.

[0016] As an optional solution, the CCD camera includes a camera body, a lens of the camera body is provided with a lens barrel, the front end of the lens barrel can extend between the first chip and the second chip, and a light source is provided at the front end of the lens barrel to locate the first chip and the second chip by clearly identifying the position of the marking point.

[0017] In the second aspect, the present invention adopts the following technical solutions:

[0018] A wafer bonding method, based on the above-mentioned wafer alignment and bonding device, comprises the following steps:

[0019] S10, loading the first wafer on the first carrier assembly, loading the second wafer on the second carrier assembly, and adjusting the position of the first wafer relative to the second wafer by the first carrier assembly, so that the first wafer and the second wafer are in a preliminary alignment state;

[0020] S20, moving the CCD camera of the camera assembly between the first wafer and the second wafer, positioning the marking point on the first wafer and the marking point on the second wafer respectively, and calculating the difference between the first wafer and the second wafer in the X-axis direction, the Y-axis direction and the Z-axis rotation direction;

[0021] S30, adjusting the position of the first wafer relative to the second wafer again through the first supporting assembly according to the calculated difference;

[0022] S40, repeating step S20 and step S30 until the differences of the first wafer relative to the second wafer in the X-axis direction, the Y-axis direction and the Z-axis rotation direction are all within the allowable range;

[0023] S50, moving the CCD camera out from between the first wafer and the second wafer, and driving the second wafer to move along the Z axis through the second supporting assembly to complete the bonding action with the first wafer.

[0024] In the third aspect, the present invention adopts the following technical solutions:

[0025] A precision compensation method, based on the above-mentioned wafer alignment and bonding device, comprises the following steps:

[0026] P10, loading the first standard component on the first carrier assembly aligned with the second wafer instead of the first wafer, and loading the second standard component on the second carrier assembly instead of the second wafer;

[0027] P20, the second bearing assembly drives the second standard component to bond with the first standard component;

[0028] P30, measuring the deviation value generated between the first standard component and the second standard component after bonding;

[0029] P40, calculating the required compensation amounts in the X-axis direction, the Y-axis direction and the Z-axis rotation direction according to the deviation value, and applying the compensation amounts to the first bearing assembly to adjust the position of the first standard component before bonding;

[0030] P50. Repeat step P20, step P30 and step P40 until the deviation value is within the allowable range.

[0031] As an optional scheme, at least one of the first standard component and the second standard component is an optically transparent component, and characteristic pattern arrays are respectively provided on the first standard component and the second standard component. The overlapping position deviation of the characteristic pattern array of the first standard component and the characteristic pattern array of the second standard component after bonding is obtained by image recognition, that is, the deviation value is obtained.

[0032] As an optional solution, the characteristic pattern array includes at least two hollow circles. When the hollow circles on the first standard component overlap and are concentric with the hollow circles on the second standard component, the first standard component and the second standard component are considered to be in an ideal bonding state.

[0033] As an optional solution, the diameter of the hollow circle on the first standard component is different from the diameter of the corresponding hollow circle on the second standard component, so that the two overlapping hollow circles can be clearly identified after bonding.

[0034] The beneficial effects of the present invention are as follows: the wafer alignment and bonding device and the wafer bonding method design the alignment and bonding at the same position, and after the alignment is completed, the movement stroke to the bonding position is omitted, the error generation is reduced, and the requirement for the absolute accuracy of the motion axis system is lowered. Before bonding, the position confirmation can be repeatedly performed and the deviation can be corrected in time, thereby improving the bonding accuracy and ensuring the bonding quality and product yield. In addition, the accuracy compensation method can reduce the system error as much as possible and further improve the bonding accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a schematic diagram of the structure of an existing wafer bonding machine. Figure 1 ;

[0036] Figure 2 This is a schematic diagram of the structure of an existing wafer bonding machine. Figure 2 ;

[0037] Figure 3 It is a structural schematic diagram of a wafer alignment and bonding device provided by an embodiment of the present invention;

[0038] Figure 4 is a front view of a wafer alignment and bonding device provided by an embodiment of the present invention;

[0039] Figure 5 is a structural schematic diagram of a CCD camera involved in an embodiment of the present invention;

[0040] Figure 6 is another structural schematic diagram of a CCD camera involved in an embodiment of the present invention;

[0041] Figure 7 is a flow chart of a precision compensation method involved in an embodiment of the present invention;

[0042] Figure 8is a schematic diagram of a characteristic pattern array on a first standard component involved in an embodiment of the present invention;

[0043] Fig. 9 is a schematic diagram of a characteristic pattern array on a second standard component involved in an embodiment of the present invention;

[0044] Fig.10 It is a schematic diagram of bonding the first standard component and the second standard component involved in an embodiment of the present invention.

[0045] In the attached figure:

[0046] 1', first group of carriers; 2', second group of carriers; 3', first group of lens components; 4', second lens components;

[0047] 1. Base; 11. Mounting frame;

[0048] 2. First bearing assembly; 21. Y-axis linear module; 22. X-axis linear module; 23. Rotary drive module; 24. First bearing platform;

[0049] 3. Second bearing assembly; 31. Z-axis linear module; 32. Second bearing platform;

[0050] 4. Camera assembly; 41. CCD camera; 411. Camera body; 412. Lens barrel; 413. Light source; 42. Bracket; 43. Camera Y-axis drive module; 44. Camera X-axis drive module;

[0051] 5. The first standard part;

[0052] 6. Second standard part. DETAILED DESCRIPTION

[0053] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0054] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0056] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0057] See also Figures 3 to 6 As shown, this preferred embodiment provides a wafer alignment and bonding device, including a base 1, a first carrying component 2, a second carrying component 3 and a camera component 4, wherein:

[0058] A mounting frame 11 is provided above the base 1;

[0059] The first bearing assembly 2 is disposed on the base 1, and is used to bear the first wafer and drive the first wafer to translate along the X-axis, translate along the Y-axis, and rotate around the Z-axis, so that the relative position of the first wafer is adjustable;

[0060] The second bearing assembly 3 is disposed on the mounting frame 11, and is used to bear the second wafer and drive the second wafer to translate along the Z axis, so as to achieve bonding between the second wafer and the first wafer;

[0061] The camera assembly 4 includes a CCD camera 41 that can be moved in and out between the first supporting assembly 2 and the second supporting assembly 3. The CCD camera 41 is used to respectively identify the marking points on the first chip and the second chip to help adjust the position of the first chip and achieve accurate alignment of the first chip and the second chip.

[0062] Therefore, the wafer alignment and bonding device is designed to be aligned and bonded at the same position. After the alignment is completed, the movement stroke to the bonding position is omitted, the error generation is reduced, and the requirement for the absolute accuracy of the moving axis system is lowered. Before bonding, the position confirmation can be repeatedly performed and the deviation can be corrected in time, thereby improving the bonding accuracy and ensuring the bonding quality and product yield.

[0063] Specifically, the first supporting assembly 2 includes a Y-axis linear module 21 installed on the base 1, an X-axis linear module 22 is provided at the output end of the Y-axis linear module 21, a rotary drive module 23 is provided at the output end of the X-axis linear module 22, and a first supporting platform 24 is provided at the output end of the rotary drive module 23, so that the first chip is loaded by the first supporting platform 24, and the first chip is adjusted to translate along the X-axis direction, translate along the Y-axis direction and rotate around the Z-axis as needed, thereby adjusting the relative position of the first chip.

[0064] Specifically, the second bearing assembly 3 includes a Z-axis linear module 31 mounted on the mounting frame 11, and a second bearing platform 32 is provided at the output end of the Z-axis linear module 31, so that the second wafer is loaded by the second bearing platform 32, and the second wafer is driven to move along the Z-axis direction to complete bonding with the first wafer. Compared with the first bearing assembly 2, the second bearing assembly 3 here omits the adjustment function, which can simplify the motion structure, reduce error accumulation, and improve bonding accuracy.

[0065] Specifically, the camera assembly 4 includes a bracket 42 installed on the base 1, a camera Y-axis driving module 43 is arranged on the bracket 42, a camera X-axis driving module 44 is arranged at the output end of the camera Y-axis driving module 43, and a CCD camera 41 is installed at the output end of the camera X-axis driving module 44 to meet the movement requirements of the CCD camera 41 moving in and out between the first chip and the second chip.

[0066] Furthermore, the CCD camera 41 includes a camera body 411, a lens barrel 412 is arranged on the lens of the camera body 411, the front end of the lens barrel 412 can extend between the first chip and the second chip, and a light source 413 is arranged at the front end of the lens barrel 412 to locate the first chip and the second chip by clearly identifying the position of the marking point.

[0067] Optionally, two camera bodies 411 are provided, and two lens barrels 412 are provided corresponding to the two camera bodies 411 to position the first chip and the second chip respectively.

[0068] Alternatively, only one camera body 411 is provided, and an optical structure is provided in the lens barrel 412, so that the first chip and the second chip can be positioned simultaneously by the single camera body 411. The optical structure here mainly changes the viewing direction through the principle of mirror reflection, expands the field of view, and allows two marking points to be seen simultaneously in one lens, and the optical structure is not further limited here.

[0069] Based on the above-mentioned wafer alignment and bonding device, this embodiment further provides a wafer bonding method, which includes the following steps:

[0070] S10, loading the first wafer on the first carrier assembly 2, loading the second wafer on the second carrier assembly 3, and adjusting the position of the first wafer relative to the second wafer by the first carrier assembly 2, so that the first wafer and the second wafer are in a preliminary alignment state;

[0071] S20, moving the CCD camera 41 of the camera assembly 4 between the first wafer and the second wafer, positioning the marking point on the first wafer and the marking point on the second wafer respectively, and calculating the difference between the first wafer and the second wafer in the X-axis direction, the Y-axis direction and the Z-axis rotation direction;

[0072] S30, adjusting the position of the first wafer relative to the second wafer again through the first supporting assembly 2 according to the calculated difference;

[0073] S40, repeating step S20 and step S30 until the differences of the first wafer relative to the second wafer in the X-axis direction, the Y-axis direction and the Z-axis rotation direction are all within the allowable range;

[0074] S50, moving the CCD camera 41 out from between the first wafer and the second wafer, and driving the second wafer to move along the Z axis through the second supporting assembly 3 to complete the bonding operation with the first wafer.

[0075] Therefore, under the premise of ensuring the alignment accuracy, there is only a small displacement in the Z-axis direction during the bonding process, which reduces the motion error as much as possible and ensures the bonding accuracy.

[0076] According to metrology knowledge, if the linear motion length is L, the error formula is as follows:

[0077] ΔL=±(k*L+Δ);

[0078] Among them, k is the error constant, L is the motion displacement, and Δ is the system error.

[0079] It can be seen that the motion stroke length is positively correlated with the size of the motion error. The wafer alignment and bonding device and wafer bonding method of this embodiment reduce the motion error from the perspective of reducing the running stroke. In this embodiment, the method of performing Z-axis motion bonding after completing visual alignment is adopted, and the motion amount in the X-axis direction and the Y-axis direction is compressed to almost zero. Theoretically, the error caused by the displacement L is compressed to the minimum.

[0080] However, as can be seen from the above formula, the system error is also a part that cannot be ignored. The sources of this part of the error include the error of the camera lens, the verticality error of the mechanical structure, the straightness error, the flatness error, etc. During the bonding process, the small stroke in the Z-axis direction may still cause a large position deviation due to the system error, affecting the bonding quality.

[0081] In this regard, this embodiment also proposes a precision compensation method to offset the system error as much as possible. Based on the above-mentioned wafer alignment and bonding device, such as Figure 7 As shown, the accuracy compensation method includes the following steps:

[0082] P10, the first standard component 5 is loaded on the first carrier assembly 2 which is aligned with the second wafer instead of the first wafer, and the second standard component 6 is loaded on the second carrier assembly 3 instead of the second wafer;

[0083] P20, the second bearing assembly 3 drives the second standard component 6 to bond with the first standard component 5;

[0084] P30, measuring the deviation value generated between the first standard component 5 and the second standard component 6 after bonding;

[0085] P40, calculating the required compensation amounts in the X-axis direction, the Y-axis direction and the Z-axis rotation direction according to the deviation value, and applying the compensation amounts to the first bearing assembly 2 to adjust the position of the first standard component 5 before bonding;

[0086] P50. Repeat step P20, step P30 and step P40 until the deviation value is within the allowable range.

[0087] Optionally, at least one of the first standard component 5 and the second standard component 6 is an optically transparent component, and characteristic pattern arrays are respectively provided on the first standard component 5 and the second standard component 6. Specifically, a high-precision measuring device is used to obtain the overlapping position deviation of the characteristic pattern array of the first standard component 5 and the characteristic pattern array of the second standard component 6 after bonding by image recognition, that is, the deviation value is obtained, and the deviation value includes the displacement deviation in the X-axis direction, the displacement deviation in the Y-axis direction and the rotation angle deviation in the Z-axis direction.

[0088] Optionally, the characteristic pattern array includes at least two hollow circles. In this embodiment, five hollow circles distributed in a cross pattern are respectively used as examples on the first standard component 5 and the second standard component 6. Figure 8 and Fig. 9 When each hollow circle on the first standard component 5 overlaps and is concentric with each hollow circle on the second standard component 6 in a one-to-one correspondence, the first standard component 5 and the second standard component 6 are considered to be in an ideal bonding state.

[0089] Furthermore, the diameter of the hollow circle on the first standard component 5 is different from the diameter of the corresponding hollow circle on the second standard component 6, so that the two overlapping hollow circles can be clearly identified by high-precision measuring equipment after bonding. In this embodiment, the size of the hollow circle on the first standard component 5 is larger than the size of the hollow circle on the second standard component 6. When the two are accurately bonded, Fig.10 shown.

[0090] In addition, when the first standard component 5 and the second standard component 6 are bonded, they can be fixed by using photosensitive adhesive or other methods, which is convenient for bonding and fixing and disassembly without affecting operation and measurement.

[0091] Therefore, the initial position of the first standard component 5, that is, the initial position of the first wafer, is reversely adjusted according to the measured deviation value to offset the system error as much as possible.

[0092] In summary, the wafer alignment and bonding device and the wafer bonding method can effectively reduce the generation of errors in the wafer bonding process, improve bonding accuracy, reduce the sensitivity of the equipment to the external environment, and improve product accuracy and yield; before performing the bonding action, the position check can be repeatedly performed to confirm that all errors meet the accuracy requirements before performing the bonding action. Compared with the traditional blind bonding mode, it provides space for multiple inspections, confirmations and adjustments, which can improve equipment reliability; in addition, the accuracy compensation method can minimize the system error and further improve the bonding accuracy.

[0093] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A wafer alignment and bonding device, characterized in that: include: A base (1), wherein a mounting frame (11) is arranged above the base (1); A first bearing assembly (2) is arranged on the base (1) and is used to bear the first chip and drive the first chip to translate along the X-axis, translate along the Y-axis and rotate around the Z-axis, so that the relative position of the first chip is adjustable; A second bearing assembly (3) is arranged on the mounting frame (11) and is used to bear a second wafer and drive the second wafer to translate along the Z axis, thereby achieving bonding of the second wafer to the first wafer; A camera assembly (4) comprises a CCD camera (41) that can be moved in and out between the first supporting assembly (2) and the second supporting assembly (3), wherein the CCD camera (41) is used to respectively identify marking points on the first wafer and the second wafer, so as to help adjust the position of the first wafer and achieve accurate alignment of the first wafer and the second wafer.

2. The wafer alignment and bonding device according to claim 1, characterized in that: The first bearing assembly (2) comprises a Y-axis linear module (21) mounted on the base (1); an X-axis linear module (22) is arranged at the output end of the Y-axis linear module (21); a rotary drive module (23) is arranged at the output end of the X-axis linear module (22); and a first bearing platform (24) is arranged at the output end of the rotary drive module (23).

3. The wafer alignment and bonding device according to claim 1, characterized in that: The second bearing assembly (3) comprises a Z-axis linear module (31) mounted on the mounting frame (11), and a second bearing platform (32) is provided at the output end of the Z-axis linear module (31).

4. The wafer alignment and bonding device according to claim 1, characterized in that: The camera assembly (4) comprises a bracket (42) mounted on the base (1), a camera Y-axis driving module (43) being arranged on the bracket (42), a camera X-axis driving module (44) being arranged at the output end of the camera Y-axis driving module (43), and the CCD camera (41) being mounted at the output end of the camera X-axis driving module (44).

5. The wafer alignment and bonding device according to claim 1, characterized in that: The CCD camera (41) comprises a camera body (411), a lens of the camera body (411) being provided with a lens barrel (412), a front end of the lens barrel (412) being able to extend between the first chip and the second chip, and a light source (413) being provided at the front end of the lens barrel (412), so as to locate the first chip and the second chip by clearly identifying the position of a marking point.

6. A wafer bonding method, based on the wafer alignment and bonding device according to any one of claims 1 to 5, characterized in that: The following steps are involved: S10, loading a first wafer onto the first carrier assembly (2), loading a second wafer onto the second carrier assembly (3), and adjusting the position of the first wafer relative to the second wafer by means of the first carrier assembly (2), so that the first wafer and the second wafer are in a preliminary alignment state; S20, moving the CCD camera (41) of the camera assembly (4) between the first wafer and the second wafer, positioning the marking points on the first wafer and the marking points on the second wafer respectively, and calculating the difference between the first wafer and the second wafer in the X-axis direction, the Y-axis direction and the Z-axis rotation direction; S30, adjusting the position of the first wafer relative to the second wafer again through the first supporting assembly (2) according to the calculated difference; S40, repeating step S20 and step S30 until the differences of the first wafer relative to the second wafer in the X-axis direction, the Y-axis direction and the Z-axis rotation direction are all within the allowable range; S50, moving the CCD camera (41) out from between the first chip and the second chip, and driving the second chip to move along the Z axis through the second supporting component (3), thereby completing the bonding action with the first chip.

7. A precision compensation method, based on the wafer alignment and bonding device according to any one of claims 1 to 5, characterized in that: The following steps are involved: P10, loading a first standard component (5) on the first carrier assembly (2) aligned with the second carrier assembly (2) instead of the first wafer, and loading a second standard component (6) on the second carrier assembly (3) instead of the second wafer; P20, the second bearing assembly (3) drives the second standard component (6) to bond with the first standard component (5); P30, measuring the deviation value generated between the first standard component (5) and the second standard component (6) after bonding; P40, calculating the required compensation amounts in the X-axis direction, the Y-axis direction and the Z-axis rotation direction according to the deviation value, and applying the compensation amounts to the first bearing component (2) to adjust the position of the first standard component (5) before bonding; P50, repeat step P20, step P30 and step P40 until the deviation value is within the allowable range.

8. The accuracy compensation method according to claim 7, characterized in that: At least one of the first standard component (5) and the second standard component (6) is an optically transparent component, and characteristic pattern arrays are respectively arranged on the first standard component (5) and the second standard component (6). The deviation of the overlapping positions of the characteristic pattern array of the first standard component (5) and the characteristic pattern array of the second standard component (6) after bonding is obtained by image recognition, that is, the deviation value is obtained.

9. The accuracy compensation method according to claim 8, characterized in that: The characteristic pattern array comprises at least two hollow circles. When the hollow circles on the first standard component (5) overlap and are concentric with the hollow circles on the second standard component (6) in a one-to-one correspondence, the first standard component (5) and the second standard component (6) are considered to be in an ideal bonding state.

10. The accuracy compensation method according to claim 9, characterized in that: The diameter of the hollow circle on the first standard component (5) is different from the diameter of the corresponding hollow circle on the second standard component (6), so that the two overlapping hollow circles can be clearly identified after bonding.

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