Energy converter and manufacturing method thereof

Abstract

The invention discloses a transducer and a manufacturing method thereof. The transducer comprises a conductive backing, a composite piezoelectric layer, a first matching layer and a second matching layer, the composite piezoelectric layer is arranged on one side of the conductive backing; the first matching layer is arranged on the side, away from the conductive backing, of the composite piezoelectric layer, and the first matching layer comprises graphite and epoxy resin; the second matching layer is arranged on the side, away from the composite piezoelectric layer, of the first matching layer, and the material of the second matching layer is different from that of the first matching layer. By the adoption of the transducer, the problem that an existing transducer is low in sensitivity and bandwidth is solved, and the transducer has the beneficial effects of improving the sensitivity and the bandwidth.

Description

Technical Field

[0001] The present invention relates to the technical field of transducers, and in particular to a transducer and a manufacturing method thereof. Background Art

[0002] Intravascular ultrasound (IVUS) refers to a medical imaging technology that combines non-invasive ultrasound technology with invasive catheter technology, using a special catheter with an ultrasound transducer connected to the end. The ultrasound transducer is used to convert electrical energy and ultrasonic energy, and the conversion of ultrasonic energy to electrical energy is the core component of the entire IVUS catheter.

[0003] The common transducers used for intravascular ultrasound are: one is to stick a conductive matching layer on the piezoelectric material, and the other is to make the piezoelectric material into a composite material and then spray the matching layer on the surface of the composite material. However, the sensitivity and bandwidth of these two transducers are low and can no longer meet the requirements of high sensitivity and high bandwidth. Summary of the invention

[0004] The invention provides a transducer and a manufacturing method thereof, so as to solve the problem of low sensitivity and low bandwidth of the existing transducer.

[0005] In a first aspect, an embodiment of the present invention provides a transducer, the transducer comprising a conductive backing, a composite piezoelectric layer, a first matching layer, and a second matching layer;

[0006] The composite piezoelectric layer is disposed on one side of the conductive backing;

[0007] The first matching layer is disposed on a side of the composite piezoelectric layer away from the conductive backing, wherein the first matching layer comprises graphite and epoxy resin;

[0008] The second matching layer is disposed on a side of the first matching layer away from the composite piezoelectric layer, wherein a material of the second matching layer is different from a material of the first matching layer.

[0009] Optionally, the mass of the graphite accounts for 50-90% of the mass of the first matching layer, and the mass of the epoxy resin accounts for 10-50% of the mass of the first matching layer.

[0010] Optionally, the conductive backing includes silver powder, hollow glass microspheres, tungsten powder and epoxy resin.

[0011] Optionally, the mass of the silver powder accounts for 50-90% of the mass of the conductive backing, the mass of the hollow glass microspheres accounts for 1-20% of the mass of the conductive backing, the mass of the tungsten powder accounts for 1-20% of the mass of the conductive backing, and the mass of the epoxy resin accounts for 20-60% of the mass of the conductive backing.

[0012] Optionally, the composite piezoelectric layer includes piezoelectric material and epoxy resin;

[0013] The piezoelectric material includes piezoelectric ceramics, lead magnesium niobate-lead titanate or lead indium niobate-lead magnesium niobate-lead titanate.

[0014] Optionally, the second matching layer includes polyparaxylene.

[0015] Optionally, the transducer further comprises a cable; the cable comprises a first conductor and a second conductor;

[0016] The second matching layer is provided with a via hole penetrating through the second matching layer;

[0017] The first conductive line passes through the via hole and is electrically connected to the first matching layer;

[0018] The second conductive line is electrically connected to the conductive backing.

[0019] Optionally, the cable includes a coaxial cable or a twisted pair cable.

[0020] In a second aspect, an embodiment of the present invention provides a method for manufacturing a transducer, which is used to manufacture the transducer as described in any embodiment of the first aspect, wherein the transducer includes a conductive backing, a composite piezoelectric layer, a first matching layer and a second matching layer;

[0021] The production method comprises:

[0022] preparing a conductive backing;

[0023] Preparing a composite piezoelectric layer, and pasting the composite piezoelectric layer on the conductive backing;

[0024] Prepare a first matching layer, and stick the first matching layer on a side of the composite piezoelectric layer away from the conductive backing, wherein the first matching layer comprises graphite and epoxy resin;

[0025] A second matching layer is prepared on a side of the first matching layer away from the composite piezoelectric layer, wherein a material of the second matching layer is different from a material of the first matching layer.

[0026] Optionally, the transducer further comprises a cable; the cable comprises a first conductor and a second conductor;

[0027] The production method further comprises:

[0028] preparing a via hole in the second matching layer that penetrates the second matching layer;

[0029] Passing the first conductive wire through the via hole and electrically connecting the first matching layer;

[0030] The second lead is electrically connected to the conductive backing.

[0031] The technical solution of the embodiment of the present invention provides a transducer, which includes a conductive backing, a composite piezoelectric layer, a first matching layer and a second matching layer, wherein the composite piezoelectric layer is arranged on one side of the conductive backing, the first matching layer is arranged on the side of the composite piezoelectric layer away from the conductive backing, the first matching layer includes graphite and epoxy resin, and the second matching layer is arranged on the side of the first matching layer away from the composite piezoelectric layer, and the material of the second matching layer is different from that of the first matching layer. By adopting the above transducer, the present invention solves the problem of low sensitivity and bandwidth of the existing transducer, and has the beneficial effect of improving sensitivity and bandwidth.

[0032] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 A top view of a transducer provided by an embodiment of the present invention;

[0035] Figure 2 for Figure 1 A schematic cross-sectional view of a transducer along section line A-A';

[0036] Figure 3 for Figure 1 A schematic cross-sectional view of another transducer along the section line AA';

[0037] Figure 4 A schematic diagram of the structure of a transducer provided by an embodiment of the present invention;

[0038] Figure 5 A simulation diagram of acoustic performance of a transducer provided by an embodiment of the present invention;

[0039] Figure 6 A flow chart of a method for manufacturing a transducer provided by an embodiment of the present invention;

[0040] Figure 7 A flow chart of another method for manufacturing a transducer provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0042] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only used to illustrate the relative positional relationship between the components or components, and does not particularly limit the specific installation orientation of the components or components.

[0043] Embodiment 1

[0044] Figure 1 A top view of a transducer provided by an embodiment of the present invention, Figure 2 for Figure 1 A schematic cross-sectional view of a transducer along the section line A-A', see Figure 1 and Figure 2 The transducer in the embodiment of the present invention includes a conductive backing 110 , a composite piezoelectric layer 120 , a first matching layer 130 and a second matching layer 140 .

[0045] Specifically, refer to Figure 2 The composite piezoelectric layer 120 is disposed on one side of the conductive backing 110. The first matching layer 130 is disposed on the side of the composite piezoelectric layer 120 away from the conductive backing 110, wherein the first matching layer 130 includes graphite and epoxy resin. The second matching layer 140 is disposed on the side of the first matching layer 130 away from the composite piezoelectric layer 120, wherein the material of the second matching layer 140 is different from the material of the first matching layer 130.

[0046] It should be noted that epoxy resin itself is insulating, and it can be conductive after adding conductive graphite. Compared with the matching layer composed of pure epoxy resin, the matching layer composed of graphite and epoxy resin is tougher and conductive. Compared with the matching layer composed of other epoxy resin composite materials, the matching layer composed of graphite and epoxy resin has higher conductivity, while maintaining the low density of the material, which can make the matching layer tougher. The acoustic impedance range of the first matching layer 130 composed of graphite and epoxy resin is 2 to 9 MRayls. Compared with the first matching layer composed of other compositions, the embodiment of the present invention adopts the first matching layer 130 composed of graphite and epoxy resin, which not only has good conductivity and toughness, but also can make the acoustic impedance of the transducer composed of the conductive backing 110, the composite piezoelectric layer 120 and the second matching layer 140 more matched with the acoustic impedance of the object to be measured (human blood vessels), which is conducive to improving the sensitivity and bandwidth of the transducer.

[0047] As a feasible implementation method, refer to Figure 2 The mass of the graphite in the first matching layer 130 accounts for 50-90% of the mass of the first matching layer 130 , and the mass of the epoxy resin in the first matching layer 130 accounts for 10-50% of the mass of the first matching layer 130 .

[0048] Exemplarily, by setting the mass proportion of graphite in the first matching layer 130 within the range of 50-90%, and setting the mass proportion of epoxy resin in the first matching layer 130 within the range of 10-50%, the acoustic impedance range of the first matching layer 130 can be maintained within 2-9 MRayls, and the conductivity of the first matching layer 130 is maintained.

[0049] Based on the above embodiments, Figure 2 , the conductive backing 110 includes silver powder, hollow glass microspheres, tungsten powder and epoxy resin.

[0050] It should be noted that the transducer needs to have a positive electrode and a negative electrode. The transducer can only work when an electrical signal is applied to the positive and negative electrodes. Usually, the negative electrode in the transducer is the conductive backing 110. Therefore, to ensure the normal operation of the transducer, its conductive backing 110 needs to be conductive. It can be understood that the higher the conductivity of the conductive backing 110, the more stable the transducer works. Compared with the conductive backing composed of glass balls, tungsten powder and epoxy resin, the conductive backing 110 used in the embodiment of the present invention is composed of silver powder, hollow glass microspheres, tungsten powder and epoxy resin. The conductivity of silver powder is relatively strong. Adding silver powder to the conductive backing 110 is conducive to improving the conductivity of the conductive backing 110.

[0051] As a feasible implementation method, refer to Figure 2The mass of the silver powder in the conductive backing 110 accounts for 50-90% of the mass of the conductive backing 110 , the mass of the hollow glass microspheres accounts for 1-20% of the mass of the conductive backing 110 , the mass of the tungsten powder accounts for 1-20% of the mass of the conductive backing 110 , and the mass of the epoxy resin accounts for 20-60% of the mass of the conductive backing 110 .

[0052] Exemplarily, by setting the mass proportion of silver powder in the conductive backing 110 within the range of 50-90%, setting the mass proportion of hollow glass microspheres in the conductive backing 110 within the range of 1-20%, setting the mass proportion of tungsten powder in the conductive backing 110 within the range of 1-20%, and setting the mass proportion of epoxy resin in the conductive backing 110 within the range of 20-60%, not only the conductivity of the conductive backing 110 can be improved, but also the acoustic impedance range of the conductive backing 110 can be maintained within 3-8 MRayls, thereby making the acoustic impedance of the transducer composed of the first matching layer 130, the composite piezoelectric layer 120 and the second matching layer 140 more matched with the acoustic impedance of the object being measured (human blood vessels), which is beneficial to improving the sensitivity and bandwidth of the transducer.

[0053] As a feasible implementation method, refer to Figure 2 The composite piezoelectric layer 120 includes piezoelectric material and epoxy resin. The piezoelectric material includes piezoelectric ceramics, lead magnesium niobate-lead titanate or lead indium niobate-lead magnesium niobate-lead titanate.

[0054] For example, compared with a piezoelectric layer composed of pure piezoelectric materials (piezoelectric ceramics, lead magnesium niobate-lead titanate, or lead indium niobate-lead magnesium niobate-lead titanate), the embodiment of the present invention uses a composite piezoelectric layer 120 formed by adding epoxy resin to the piezoelectric material, which is beneficial to improving the resolution, sensitivity and bandwidth of the transducer, because the piezoelectric composite material formed by adding epoxy resin to the piezoelectric material can change the vibration mode of the original piezoelectric material, improve the electromechanical conversion efficiency of the original piezoelectric material, reduce crosstalk, and can also change the dielectric constant of the original piezoelectric material to make it easier to match.

[0055] Exemplarily, by setting the volume proportion of the piezoelectric material in the composite piezoelectric layer 120 within the range of 20% to 75% and the aspect ratio of the piezoelectric material in the composite piezoelectric layer 120 within the range of 35% to 65%, the acoustic impedance range of the composite piezoelectric layer 120 can be set to 10 to 28 MRayls, thereby making the acoustic impedance of the transducer composed of the conductive backing 110, the first matching layer 130 and the second matching layer 140 more matched with the acoustic impedance of the object being measured (human blood vessels), which is beneficial to improving the sensitivity and bandwidth of the transducer.

[0056] If necessary, refer to Figure 2The piezoelectric material and epoxy resin in the composite piezoelectric layer 120 are arranged in intervals along the second direction X, and the size of each piezoelectric material is the same. The aspect ratio of the piezoelectric material refers to the ratio of the width of each piezoelectric material in the second direction X to its height in the third direction Z. Figure 2 The transducer sections are shown parallel.

[0057] As a feasible implementation method, refer to Figure 2 , the second matching layer 140 includes polyparaxylene.

[0058] Exemplarily, the acoustic impedance of the second matching layer 140 composed of polyparaxylene is about 2.89 MRayls, which can make the acoustic impedance of the transducer composed of the conductive backing 110, the composite piezoelectric layer 120 and the first matching layer 130 more matched with the acoustic impedance of the object being measured (human blood vessels), which is beneficial to improving the sensitivity and bandwidth of the transducer.

[0059] It should be noted that the connection mode of the composite piezoelectric layer 120 can be either 2-2 type or 1-3 type. The embodiment of the present invention takes 2-2 type as an example for explanation. Figure 2 , Figure 3 and Figure 4 The piezoelectric material and epoxy resin in the composite piezoelectric layer 120 are arranged in a spaced relationship along the second direction X, and the epoxy resin extends in the first direction. It should be noted that the first direction is perpendicular to the Figure 2 The transducer cross section shown in FIG. 1 is the same as the second direction X. Figure 2 The cross sections of the transducers shown are parallel. Type 1-3 is different from Type 2-2 in that it also includes epoxy resin extending along the second direction X, and the piezoelectric material and epoxy resin in the first direction are also spaced apart.

[0060] Based on the above embodiments, Figure 4 A schematic diagram of a structure of a transducer provided in an embodiment of the present invention, referring to Figure 4 The transducer further comprises a cable 150 . The cable 150 comprises a first conductor 151 and a second conductor 152 .

[0061] Specifically, the second matching layer 140 is provided with a via hole 141 penetrating the second matching layer 140 . The first wire 151 passes through the via hole 141 and is electrically connected to the first matching layer 130 . The second wire 152 is electrically connected to the conductive backing 110 .

[0062] It should be noted that the transducer needs to have a positive electrode and a negative electrode. The transducer can only work when electrical signals are applied to the positive and negative electrodes. Usually, the negative electrode in the transducer is the side of the conductive backing 110 away from the composite piezoelectric layer 120, and the positive electrode is the side of the composite piezoelectric layer 120 away from the conductive backing 110. Since the first matching layer 130 in the embodiment of the present invention is conductive, for the convenience of manufacturing, the side of the first matching layer 130 away from the composite piezoelectric layer 120 can be used as the positive electrode of the transducer and electrically connected to the first wire 151 providing the positive electrode electrical signal. A second matching layer 140 made of polyparaxylene is further provided on the side of the first matching layer 130 away from the composite piezoelectric layer 120, and the second matching layer 140 is not conductive. Therefore, in order to electrically connect the first conductor 151 of the cable 150 with the first matching layer 130, it is necessary to open a via hole 141 on the second matching layer 140 to expose the first matching layer 130. The first conductor 151 can pass through the via hole 141 to be electrically connected to the first matching layer 130, and the second conductor 152 for providing a negative electrical signal is electrically connected to the conductive backing 110.

[0063] It should be noted that the embodiment of the present invention does not limit the shape of the via hole 141, which can be Figure 1 The circular hole shown may also be a square hole, a polygonal hole, etc., and those skilled in the art can set them according to actual needs.

[0064] For example, Figure 3 for Figure 1 A schematic cross-sectional view of another transducer along the section line A-A', see Figure 3 and Figure 4 , the transducer in the embodiment of the present invention further includes an insulating layer 160, a shell 170 and a rotating wire 180. The outer surface of the transducer body is provided with an insulating layer 160 except for the side of the conductive backing 110 away from the composite piezoelectric layer 120 and the side of the second matching layer 140 away from the first matching layer 130. As a feasible embodiment, the insulating layer 160 can be composed of polyparaxylene, which is the same as the composition of the second matching layer 140, so the insulating layer 160 can be prepared together with the second matching layer 140. The transducer body is arranged in the shell 170, and the cable 150 is arranged in the rotating wire 180. As a feasible embodiment, the rotating wire 180 can be a rotating spring. The shell 170 is fixedly connected to the rotating wire 180 and can be electrically conductive with each other. The side of the conductive backing 110 away from the composite piezoelectric layer 120 is electrically connected to the shell 170 through a conductive silver paste, and the second wire 152 for providing a negative electrical signal is electrically connected to the rotating wire 180, thereby realizing the electrical connection between the second wire 152 and the conductive backing 110.

[0065] Figure 5 A simulation diagram of the acoustic performance of a transducer provided in an embodiment of the present invention, Figure 5The horizontal axis in the figure represents the design frequency of the transducer, the vertical axis on the left represents the transducer's transmit / receive voltage ratio Vo / Vi, and the vertical axis on the right represents the transducer's dB and the transmit / receive voltage ratio Vo / Vi after Fourier transform. Figure 5 When the transducer in the embodiment of the present invention is designed with a frequency of 30M, the graphite epoxy mixture is the first matching layer 130, and Parylene is the second matching layer 140, the bandwidth of -6dB is 95.61%, and the bandwidth of -20dB is 139.08%, which has very high sensitivity and bandwidth.

[0066] As a feasible implementation, the cable 150 includes a coaxial cable or a twisted pair cable.

[0067] Figure 4 The cable 150 using twisted pair cable is used as an example for explanation. It can be understood that the cable 150 can also use coaxial cable. Due to the differences in manufacturing and structure of coaxial cable and twisted pair cable, the characteristic impedance of coaxial cable is more stable compared to twisted pair cable. Therefore, the use of coaxial cable is beneficial to improving the accuracy of intravascular ultrasound detection.

[0068] Embodiment 2

[0069] The embodiment of the present invention provides a method for manufacturing a transducer, which is used to manufacture the transducer described in any embodiment of the present invention, referring to Figure 1 The transducer in the embodiment of the present invention includes a conductive backing 110 , a composite piezoelectric layer 120 , a first matching layer 130 and a second matching layer 140 . Figure 6 A flowchart of a method for manufacturing a transducer provided in an embodiment of the present invention, referring to Figure 6 The manufacturing method of the transducer in the embodiment of the present invention includes:

[0070] S210, preparing a conductive backing.

[0071] Exemplary, reference Figure 2 The conductive backing 110 includes silver powder, hollow glass microspheres, tungsten powder and epoxy resin, wherein the mass proportion of the silver powder in the conductive backing 110 is set in the range of 50-90%, the mass proportion of the hollow glass microspheres is set in the range of 1-20%, the mass proportion of the tungsten powder is set in the range of 1-20%, the mass proportion of the epoxy resin is set in the range of 20-60%, and the acoustic impedance of the conductive backing 110 is in the range of 3-8 MRayls. The technicians can adjust the ratio of the silver powder, hollow glass microspheres, tungsten powder and epoxy resin in the conductive backing 110 according to the actual acoustic impedance requirements.

[0072] S220, preparing a composite piezoelectric layer, and pasting the composite piezoelectric layer onto a conductive backing.

[0073] Exemplary, reference Figure 2 The composite piezoelectric layer 120 includes a piezoelectric material and an epoxy resin, wherein the piezoelectric material includes a piezoelectric ceramic, lead magnesium niobate-lead titanate (PMN-PT) or lead indium niobate-lead magnesium niobate-lead titanate (PMN-PMN-PT), and the volume proportion of the piezoelectric material in the composite piezoelectric layer 120 is set within a range of 20 to 75%, and the aspect ratio of the piezoelectric material in the composite piezoelectric layer 120 is set within a range of 35% to 65%, and the acoustic impedance range of the composite piezoelectric layer 120 is 10 to 28 MRayls. Technicians can adjust the type of piezoelectric material in the composite piezoelectric layer 120, the ratio of the piezoelectric material to the epoxy resin, and the aspect ratio of the piezoelectric material according to actual acoustic impedance requirements. Specifically, the preparation of the composite piezoelectric layer 120 includes: firstly, the piezoelectric material (piezoelectric ceramics, PMNPT or PIN-PMN-PT) is cut into 50 to 500 um with a blade with a width of 10 to 100 um to form a cutting slit extending in the first direction, and ensuring that the volume of the piezoelectric material accounts for 20 to 75% of the volume of the composite piezoelectric layer 120, and then epoxy resin is filled in the cutting slit, and then the piezoelectric material filled with epoxy resin is ground to a preset thickness to ensure that the aspect ratio of the piezoelectric material is within the range of 35% to 65%, and finally a conductive layer is plated on both sides after grinding, and the conductive layer includes: a titanium layer for primer and a gold layer for enhancing conductivity. It should be noted that the above-mentioned first direction is perpendicular to the first direction as shown in FIG. Figure 2 In the transducer cross section shown, the gold layer may be replaced by other conductive materials, which is not limited in the embodiment of the present invention.

[0074] If necessary, refer to Figure 2 The piezoelectric material and epoxy resin in the composite piezoelectric layer 120 are arranged in intervals along the second direction X, and the size of each piezoelectric material is the same. The aspect ratio of the piezoelectric material refers to the ratio of the width of each piezoelectric material in the second direction X to its height in the third direction Z, wherein the first direction is perpendicular to the first direction. Figure 2 The transducer cross section shown in FIG. 1 is the same as the second direction X. Figure 2 The transducer sections are shown parallel.

[0075] Exemplary, reference Figure 2 The composite piezoelectric layer 120 can be adhered to the conductive backing 110 by using epoxy resin. It should be noted that when the epoxy resin used is 5 μm or less, it will not affect the conductivity of the composite piezoelectric layer 120 and the conductive backing 110.

[0076] S230, preparing a first matching layer, and pasting the first matching layer on a side of the composite piezoelectric layer away from the conductive backing, wherein the first matching layer comprises graphite and epoxy resin.

[0077] Exemplary, reference Figure 2The mass proportion of graphite in the first matching layer 130 is set in the range of 50-90%, the mass proportion of epoxy resin is set in the range of 10-50%, and the acoustic impedance range of the first matching layer 130 is maintained in the range of 2-9 MRayls. The technicians can adjust the ratio of graphite and epoxy resin in the first matching layer 130 according to the actual acoustic impedance requirements.

[0078] S240 , preparing a second matching layer on a side of the first matching layer away from the composite piezoelectric layer, wherein a material of the second matching layer is different from a material of the first matching layer.

[0079] Exemplary, reference Figure 2 , polyparaxylene liquid is sprayed on the surface of the first matching layer 130 away from the composite piezoelectric layer 120 to form a second matching layer 140. The acoustic impedance of the second matching layer 140 composed of polyparaxylene is about 2.89 MRayls. The acoustic impedance of the transducer composed of the second matching layer 140, the conductive backing 110, the composite piezoelectric layer 120 and the first matching layer 130 is more matched with the acoustic impedance of the measured object (human blood vessel), which is beneficial to improve the sensitivity and bandwidth of the transducer.

[0080] Based on the above embodiments, Figure 4 The transducer further includes a cable 150 , and the cable 150 includes a first conductor 151 and a second conductor 152 . Figure 7 A flowchart of another method for manufacturing a transducer provided in an embodiment of the present invention, Figure 7 The embodiment shown enriches the process of the method for manufacturing the transducer, refer to Figure 7 The manufacturing method of the transducer in the embodiment of the present invention includes:

[0081] S310, preparing a conductive backing.

[0082] S320, preparing a composite piezoelectric layer, and pasting the composite piezoelectric layer onto a conductive backing.

[0083] S330, preparing a first matching layer, and pasting the first matching layer on a side of the composite piezoelectric layer away from the conductive backing, wherein the first matching layer comprises graphite and epoxy resin.

[0084] S340 , preparing a second matching layer on a side of the first matching layer away from the composite piezoelectric layer, wherein a material of the second matching layer is different from a material of the first matching layer.

[0085] S350 , preparing a via hole penetrating the second matching layer in the second matching layer.

[0086] Exemplary, reference Figure 4Since a second matching layer 140 made of polyparaxylene is disposed on a side of the first matching layer 130 away from the composite piezoelectric layer 120 and the second matching layer 140 is not conductive, in order to electrically connect the first conductor 151 of the cable 150 with the first matching layer 130, it is necessary to open a via 141 on the second matching layer 140 to expose the conductive first matching layer 130.

[0087] S360 , passing the first conductive line through the via hole to electrically connect the first matching layer.

[0088] S370, electrically connecting the second conductive wire to the conductive backing.

[0089] Exemplary, reference Figure 4 The first wire 151 for providing a positive electrical signal can pass through the via 141 and be electrically connected to the first matching layer 130 , and the second wire 152 for providing a negative electrical signal can be electrically connected to the conductive backing 110 .

[0090] Based on the above embodiments, continue to refer to Figure 4 , the transducer in the embodiment of the present invention further includes an insulating layer 160, a shell 170 and a wire 180. Therefore, the manufacturing method of the transducer in the embodiment of the present invention further includes: preparing an insulating layer 160 on the outer surface of the transducer body except for the side of the conductive backing 110 away from the composite piezoelectric layer 120 and the side of the second matching layer 140 away from the first matching layer 130, wherein the insulating layer 160 can be composed of polyparaxylene, which has the same composition as the second matching layer 140, so the insulating layer 160 can be prepared together with the second matching layer 140, and illustratively, the polyparaxylene liquid is sprayed on the outer surface of the transducer body except for the side of the conductive backing 110 away from the composite piezoelectric layer 120 to form the second matching layer 140 and the insulating layer 160. The manufacturing method of the transducer also includes: setting the transducer body in the shell 170, setting the cable 150 in the rotating wire 180, and fixing the shell 170 and the rotating wire 180 so that they can be electrically connected to each other. For example, the rotating wire 180 can be a rotating spring and the shell 170 can be a metal shell.

[0091] Exemplary, reference Figure 4 S370, electrically connecting the second wire to the conductive backing includes: electrically connecting the side of the conductive backing 110 away from the composite piezoelectric layer 120 to the shell 170 through conductive silver paste, and electrically connecting the second wire 152 to the rotating wire 180, thereby achieving electrical connection between the second wire 152 and the conductive backing 110.

[0092] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A transducer, characterized in that: It includes a conductive backing, a composite piezoelectric layer, a first matching layer and a second matching layer; The composite piezoelectric layer is disposed on one side of the conductive backing; The first matching layer is disposed on a side of the composite piezoelectric layer away from the conductive backing, wherein the first matching layer comprises graphite and epoxy resin; The second matching layer is disposed on a side of the first matching layer away from the composite piezoelectric layer, wherein a material of the second matching layer is different from a material of the first matching layer.

2. The transducer according to claim 1, characterized in that The mass of the graphite accounts for 50-90% of the mass of the first matching layer, and the mass of the epoxy resin accounts for 10-50% of the mass of the first matching layer.

3. The transducer according to claim 1, characterized in that The conductive backing comprises silver powder, hollow glass microspheres, tungsten powder and epoxy resin.

4. The transducer according to claim 3, characterized in that The mass of the silver powder accounts for 50-90% of the mass of the conductive backing, the mass of the hollow glass microspheres accounts for 1-20% of the mass of the conductive backing, the mass of the tungsten powder accounts for 1-20% of the mass of the conductive backing, and the mass of the epoxy resin accounts for 20-60% of the mass of the conductive backing.

5. The transducer according to claim 1, characterized in that: The composite piezoelectric layer comprises piezoelectric material and epoxy resin; The piezoelectric material includes piezoelectric ceramics, lead magnesium niobate-lead titanate or lead indium niobate-lead magnesium niobate-lead titanate.

6. The transducer according to claim 1, characterized in that The second matching layer includes parylene.

7. The transducer according to claim 1, characterized in that The transducer further comprises a cable; the cable comprises a first conductor and a second conductor; The second matching layer is provided with a via hole penetrating through the second matching layer; The first conductive line passes through the via hole and is electrically connected to the first matching layer; The second conductive line is electrically connected to the conductive backing.

8. The transducer according to claim 7, characterized in that The cable includes a coaxial cable or a twisted pair cable.

9. A method for manufacturing a transducer, used for manufacturing the transducer according to any one of claims 1 to 8, characterized in that: The transducer includes a conductive backing, a composite piezoelectric layer, a first matching layer and a second matching layer; The production method comprises: preparing a conductive backing; Preparing a composite piezoelectric layer, and pasting the composite piezoelectric layer on the conductive backing; Prepare a first matching layer, and stick the first matching layer on a side of the composite piezoelectric layer away from the conductive backing, wherein the first matching layer comprises graphite and epoxy resin; A second matching layer is prepared on a side of the first matching layer away from the composite piezoelectric layer, wherein a material of the second matching layer is different from a material of the first matching layer.

10. The manufacturing method according to claim 9, characterized in that: The transducer further comprises a cable; the cable comprises a first conductor and a second conductor; The production method further comprises: preparing a via hole in the second matching layer that penetrates the second matching layer; Passing the first conductive wire through the via hole and electrically connecting the first matching layer; The second lead is electrically connected to the conductive backing.

Images