Radiation temperature measuring device and method based on dynamic calibration

Abstract

The invention provides a radiation temperature measurement device and method based on dynamic calibration, and relates to the technical field of radiation temperature measurement. The device is used for measuring temperature information of a hot end component and comprises a first lens group, a temperature measuring probe, a second lens group, an optical switch, an optical filter, a photoelectric detector, a pre-amplifier, an acquisition monitoring system and a controller, after passing through the optical filter, a corresponding temperature measurement characteristic wavelength is obtained; the photoelectric detector is of a thermoelectric refrigeration type, the temperature measurement characteristic wavelength is incident to the photoelectric detector for detection to obtain a corresponding electric signal, the electric signal is amplified into a collectable voltage signal through the pre-amplifier, and the collection monitoring system carries out collection and post-processing to obtain temperature information of the hot end component; the optical switch is arranged at the front end of the optical filter and is controlled to be turned on or turned off through the controller, and the controller is controlled by the collecting and monitoring system.

Description

Technical Field

[0001] The present invention relates to the technical field of radiation temperature measurement, and in particular to a radiation temperature measurement device and method based on dynamic calibration. Background Art

[0002] With the continuous improvement of the performance of aircraft engines and gas turbines, the temperature of the gas at the turbine inlet continues to rise, far exceeding the material use temperature of the turbine hot end components. In order to ensure that the hot end components of the turbine are within a safe temperature range, surface coating of thermal barrier coatings combined with internal flow / air film cooling has become the main thermal protection method at present, and the use of ceramic-based composite materials with higher temperature resistance to make hot end components has become a future development trend. In order to accurately guide the design of the thermal protection structure of the hot end components and evaluate the thermal protection effect during the development of turbine components, it is necessary to accurately measure the surface temperature of the hot end components. However, the working environment temperature of the hot end components is as high as 1500-2000℃, and the surface is made of ceramic-based materials, which limits the application of traditional contact temperature measurement technology. Non-contact radiation temperature measurement technology has become an effective means to obtain its surface temperature.

[0003] At present, the band used by the more mature turbine hot end component surface temperature radiation measurement system is generally the near-infrared band. Thermal barrier coatings and ceramic-based composites have the semi-transparent radiation characteristics of participating media in the near-infrared band. Therefore, the near-infrared temperature measurement technology cannot accurately measure their surface temperature. It is necessary to use the mid-infrared long-wave band that is opaque to thermal barrier coatings and ceramic-based composites to measure their surface temperature. At present, photoelectric detectors used for mid-infrared long-wave measurement all need to use multi-stage thermoelectric cooling or liquid nitrogen cooling. Although liquid nitrogen cooling can ensure higher detection performance, it is not convenient to use because liquid nitrogen needs to be continuously replenished. Multi-stage thermoelectric cooling detectors have high requirements for ambient temperature stability and have the problem of continuous drift of output signals. Blackbody furnaces cannot be used for steady-state calibration and measurement. There are large errors in temperature measurement, which limits the application of such detectors in radiation temperature measurement technology. Therefore, it is necessary to develop new radiation temperature measurement devices to meet the long-wave temperature measurement needs of such detectors. Summary of the invention

[0004] In view of this, the present invention provides a radiation temperature measurement device and method based on dynamic calibration.

[0005] On one hand, the present invention provides a radiation temperature measurement device based on dynamic calibration, which is used to measure the temperature information of a hot end component. The radiation temperature measurement device includes a first lens group, a temperature measuring probe, a second lens group, an optical switch, a filter, a photoelectric detector, a preamplifier, a collection monitoring system and a controller, wherein: the first lens group and the second lens group are arranged on two opposite sides inside the temperature measuring probe, and the spectral energy radiated from the surface of the hot end component is collected by the first lens group in the temperature measuring probe and focused by the second lens group, and then passes through the filter to obtain a temperature measurement characteristic wavelength corresponding to the spectral energy; the photoelectric detector is a thermoelectric cooling type, and the temperature measurement characteristic wavelength is incident on the photoelectric detector for detection to obtain an electrical signal corresponding to the temperature measurement characteristic wavelength, and the electrical signal is amplified by the preamplifier into a collectable voltage signal, and then collected and post-processed by the collection monitoring system to obtain the temperature information of the hot end component; the optical switch is arranged at the front end of the filter, and is controlled to be opened or closed by the controller, and the controller is controlled by the collection monitoring system.

[0006] According to an embodiment of the present invention, the radiation temperature measurement device also includes: a first water cooling structure and a constant temperature chiller, which are respectively arranged outside the photoelectric detector, wherein the first water cooling structure is used to cool the photoelectric detector, and the constant temperature chiller is used to provide constant temperature cold water for the first water cooling structure.

[0007] According to an embodiment of the present invention, the radiation temperature measuring device further includes: a switch blade, which is arranged inside the optical switch, and the surface of the switch blade is coated with a low-emissivity coating or polished stainless steel.

[0008] According to an embodiment of the present invention, the radiation temperature measuring device further includes: a second water cooling structure, arranged between the optical switch and the photoelectric detector, the second water cooling structure having two opposite heat exchange surfaces, and the two heat exchange surfaces are in contact with the optical switch and the photoelectric detector respectively.

[0009] According to an embodiment of the present invention, the filter is installed inside the optical switch and is arranged between the switch blade and the second water cooling structure.

[0010] According to an embodiment of the present invention, the radiation temperature measurement device further includes: an optical fiber, which is arranged between the first lens group and the second lens group, and the spectral energy collected by the first lens group is transmitted to the second lens group through the optical fiber.

[0011] According to an embodiment of the present invention, the radiation temperature measuring device also includes: a heat conducting plate and heat dissipation fins, wherein the heat conducting plate is arranged between the optical switch and the photodetector, and the heat dissipation fins are installed on the outer edge of the heat conducting plate, and the heat generated by the optical switch and the photodetector is transferred from the heat conducting plate to the heat dissipation fins for heat dissipation.

[0012] Another aspect of the present invention provides a radiation temperature measurement method based on dynamic calibration, which is applied to the above-mentioned radiation temperature measurement device based on dynamic calibration. The method comprises: step S1, when a black body furnace is used to calibrate the radiation temperature measurement device, the temperature measurement probe is aimed at the black body furnace; step S2, the optical switch is turned off, and when the black body furnace is at a stable first temperature, a first voltage value output by the acquisition monitoring system is recorded; step S3, the optical switch is turned on, and a second voltage value output by the acquisition monitoring system is recorded; step S4, the optical switch is turned off, and when the black body furnace is at a stable second temperature, a third voltage value output by the acquisition monitoring system is recorded, wherein the second temperature is different from the first temperature; step S5, the temperature measurement probe is aimed at the black body furnace; step S6, the temperature measurement probe is aimed at the black body furnace; step S7, the temperature measurement probe is aimed at the black body furnace; step S8, the temperature measurement probe is aimed at the black body furnace; step S9, the temperature measurement probe is aimed at the black body furnace; step S10, the temperature measurement probe is aimed at the black body furnace; step S11, the temperature measurement probe is aimed at the black body furnace; step S12, the temperature measurement probe is aimed at the black body furnace; step S13, the temperature measurement probe is aimed at the black body furnace; step S14, the temperature measurement probe is aimed at the black body furnace; step S15, the temperature measurement probe is aimed at the black body furnace; step S16, the temperature measurement probe is aimed at the black body furnace; step S17, the temperature measurement probe is aimed at the black body furnace; step S18, the temperature measurement probe is aimed at the black body furnace; step S19, the temperature measurement probe is aimed at the black body furnace; step S20, the temperature measurement probe is aimed at the black body furnace; step S21 Step S5, turn on the optical switch, and record the fourth voltage value output by the acquisition monitoring system; step S6, fit the first voltage value, the second voltage value, the third voltage value and the fourth voltage value to obtain the correlation between different black body furnace temperatures and the output voltage difference corresponding to the opening and closing of the optical switch; step S7, when measuring the temperature information of the hot end component, first turn off the optical switch, and record the fifth voltage value output by the acquisition monitoring system; then turn on the optical switch, and record the sixth voltage value output by the acquisition monitoring system; step S8, obtain the surface emissivity of the hot end component; determine the temperature information of the hot end component according to the fifth voltage value, the sixth voltage value, the surface emissivity and the correlation.

[0013] According to an embodiment of the present invention, step S6 also includes: repeating steps S2 to S5 in sequence for a predetermined number of times to obtain multiple real-time voltage values ​​output by the acquisition monitoring system; fitting the multiple real-time voltage values ​​to obtain the correlation between different blackbody furnace temperatures and the output voltage difference corresponding to the opening and closing of the optical switch.

[0014] According to an embodiment of the present invention, in step S8, determining the temperature information of the hot end component according to the fifth voltage value, the sixth voltage value, the surface emissivity and the associated relationship includes: calculating the voltage difference between the sixth voltage value and the fifth voltage value; dividing the voltage difference by the surface emissivity to obtain a correction value; substituting the correction value into the associated relationship to obtain the temperature information of the hot end component.

[0015] Compared with the prior art, the radiation temperature measurement device and method based on dynamic calibration provided by the present invention realizes dynamic calibration of the radiation temperature measurement device by setting an optical switch and combining a cooling temperature control structure to continuously open and close the optical switch during measurement, greatly reducing the large measurement error caused by the drift of the output signal of the long-wave photoelectric detector, and effectively improving the temperature measurement accuracy. The present invention realizes real-time dynamic calibration during the measurement process of the mid-infrared long-wave band radiation temperature measurement system, greatly reducing the radiation energy measurement error caused by the signal drift of the thermoelectric cooling type long-wave infrared photoelectric detector, and can accurately measure the surface temperature of the thermal barrier coating of the hot end component and the surface temperature of the ceramic-based composite material. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0017] Figure 1 A schematic diagram of a structure of a radiation temperature measurement device based on dynamic calibration according to an embodiment of the present invention is shown;

[0018] Figure 2 A schematic diagram showing the structure of an air-cooled thermoelectric cooling type photodetector coupled to an optical switch according to an embodiment of the present invention;

[0019] Figure 3 A schematic diagram showing the structure of a liquid-cooled thermoelectric cooling type photodetector coupled to an optical switch according to an embodiment of the present invention;

[0020] Figure 4 A schematic diagram of a radiation temperature measurement device using optical fiber transmission according to an embodiment of the present invention is shown;

[0021] Figure 5 A flowchart of a radiation temperature measurement method based on dynamic calibration according to an embodiment of the present invention is schematically shown;

[0022] Figure 6 The flowchart of temperature measurement using an association relationship according to an embodiment of the present invention is schematically shown. DETAILED DESCRIPTION

[0023] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0024] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0025] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0026] like Figure 1 As shown, the embodiment of the present invention provides a radiation temperature measurement device based on dynamic calibration, which is used to measure the temperature information of the hot end component 1. The radiation temperature measurement device includes a first lens group 2, a temperature measurement probe 3, a second lens group 4, an optical switch 5, a filter 6, a photodetector 7, a pre-amplifier 9, a collection and monitoring system 10 and a controller 12, wherein:

[0027] The first lens group 2 and the second lens group 4 are arranged on opposite sides of the temperature measuring probe 3. The spectral energy radiated from the surface of the hot end component 1 is collected by the first lens group 2 in the temperature measuring probe 3 and focused by the second lens group 4. After passing through the filter 6, a temperature measuring characteristic wavelength corresponding to the spectral energy is obtained.

[0028] The photoelectric detector 7 is of thermoelectric cooling type. The temperature measurement characteristic wavelength is incident on the photoelectric detector 7 for detection, and an electrical signal corresponding to the temperature measurement characteristic wavelength is obtained. The electrical signal is amplified by the pre-amplifier 9 to be a collectible voltage signal, and then collected and post-processed by the collection monitoring system 10 to obtain the temperature information of the hot end component 1;

[0029] The optical switch 5 is disposed at the front end of the optical filter 6 , and the opening or closing of the optical switch 5 is controlled by a controller 12 , and the controller 12 is controlled by the acquisition monitoring system 10 .

[0030] In this embodiment, the photodetector 7 is a thermoelectric cooling type, which can convert optical power into an electrical signal. The temperature measurement characteristic wavelength obtained by the filter 6 is incident on the photodetector 7, and an electrical signal corresponding to the temperature measurement characteristic wavelength can be obtained.

[0031] In this embodiment, the acquisition monitoring system 10 can acquire the voltage signal amplified by the pre-amplifier 9, and then post-process the acquired voltage signal to obtain the temperature information of the hot end component 1. The post-processing can, for example, convert the analog signal into a digital signal, and the present invention does not specifically limit the post-processing method.

[0032] In this embodiment, an optical switch 5 is provided at the front end of the optical filter 6 for instantaneously cutting off or connecting the optical path. The optical switch 5 is opened or closed by the controller 12, and the controller 12 is controlled by the acquisition monitoring system 10. It can be seen that the opening and closing states of the optical switch 5 are double-controlled, which improves the controllability and accuracy of the temperature measurement.

[0033] In some embodiments, the radiation temperature measurement device further includes: a first water cooling structure 8 and a constant temperature chiller 11, which are respectively arranged outside the photodetector 7, wherein the first water cooling structure 8 is used to cool the photodetector 7, and the constant temperature chiller 11 is used to provide constant temperature cold water for the first water cooling structure 8. Since the thermoelectric cooling type photodetector 7 generates heat when working, in this way, the photodetector 7 can be ensured to work under a constant cooling temperature condition.

[0034] like Figure 2As shown, in some embodiments, the radiation temperature measurement device further includes: a switch blade 14, which is arranged inside the optical switch 5, and the surface of the switch blade 14 is coated with a low-emissivity coating or polished stainless steel. Among them, the low-emissivity coating means that the emissivity is lower than the preset emissivity threshold, for example, the preset emissivity threshold is 0.1. In this way, the influence of the radiation of the optical switch 5 itself on the output signal of the photodetector 7 when it is turned off can be reduced.

[0035] Since the opening and closing of the switch blade 14 inside the optical switch 5 is usually realized by electric drive, a certain amount of heat will be generated when the optical switch 5 is working. In order to take away the heat generated by the optical switch 5 in time and maintain it at a constant temperature to reduce the impact of temperature fluctuations on system signals, Figure 3 As shown, in some embodiments, the radiation temperature measurement device further includes: a second water cooling structure 13, which is arranged between the optical switch 5 and the photodetector 7, and the second water cooling structure 13 has two opposite heat exchange surfaces, and the two heat exchange surfaces are respectively in contact with the optical switch 5 and the photodetector 7. Then, the above-mentioned constant temperature chiller 11 can continue to provide constant temperature cold water for the second water cooling structure 13, so as to cool and control the temperature of the optical switch 5 and the photodetector 7.

[0036] In some embodiments, the filter 6 is installed inside the optical switch 5 and disposed between the switch blade 14 and the second water cooling structure 13 .

[0037] In some embodiments, the radiation temperature measurement device further includes: a heat conducting plate 15 and a heat dissipation fin 16, wherein the heat conducting plate 15 is disposed between the optical switch 5 and the photodetector 7, and the heat dissipation fin 16 is installed on the outer edge of the heat conducting plate 15, and the heat generated by the optical switch 5 and the photodetector 7 is transferred from the heat conducting plate 15 to the heat dissipation fin 16 for heat dissipation. Then, the heat dissipation fin 16 can use a fan to take away the heat to reduce the overall complexity of the radiation temperature measurement device.

[0038] like Figure 4 As shown, in some embodiments, the radiation temperature measurement device further includes: an optical fiber 17, which is arranged between the first lens group 2 and the second lens group 4, and the spectral energy collected by the first lens group 2 is transmitted to the second lens group 4 through the optical fiber 17. For example, in an installation restricted position, the spectral energy collected by the first lens group 2 is transmitted to the second lens group 4 through the optical fiber 17, and then is selected by the filter 6 for temperature measurement characteristic wavelength and focused on the thermoelectric cooling type photoelectric detector 7 for detection, and an electrical signal corresponding to the input temperature measurement characteristic wavelength spectral energy is obtained.

[0039] Based on the above-mentioned radiation temperature measurement device based on dynamic calibration, the present invention also provides a radiation temperature measurement method based on dynamic calibration. Figure 5 The method is described in detail.

[0040] like Figure 5 As shown, the embodiment of the present invention further provides a radiation temperature measurement method based on dynamic calibration, which can be applied to the radiation temperature measurement device based on dynamic calibration in any of the above embodiments. The method includes steps S1 to S8.

[0041] Step S1, when a black body furnace is used to calibrate the radiation temperature measuring device, the temperature measuring probe 3 is aligned with the black body furnace.

[0042] Step S2, closing the optical switch 5, and recording and collecting a first voltage value output by the monitoring system 10 when the black body furnace is at a stable first temperature.

[0043] For example, when it is monitored that the temperature of the black body furnace is stable within the first preset time period, the stable temperature is at the first temperature, and the surface temperature of the photodetector 7 is also stable, the first voltage value output by the acquisition monitoring system 10 is recorded.

[0044] Step S3, turning on the optical switch 5, and recording and collecting the second voltage value output by the monitoring system 10.

[0045] The second voltage value outputted in this step may be understood as an output voltage value corresponding to the radiation energy of the black body furnace at the current temperature.

[0046] Step S4, closing the optical switch 5, and recording and collecting a third voltage value output by the monitoring system 10 when the black body furnace is at a stable second temperature, wherein the second temperature is different from the first temperature.

[0047] This step is to adjust the temperature of the black body furnace from the first temperature to the second temperature, that is, to adjust the temperature of the black body furnace to another calibration point, and record the output voltage value after the temperature stabilizes.

[0048] Step S5 , turning on the optical switch 5 , and recording and collecting the fourth voltage value output by the monitoring system 10 .

[0049] The fourth voltage value outputted in this step may be understood as an output voltage value corresponding to the radiation energy of the black body furnace at the current temperature.

[0050] Step S6, fitting the first voltage value, the second voltage value, the third voltage value and the fourth voltage value to obtain the correlation between different black body furnace temperatures and the output voltage difference corresponding to opening and closing of the optical switch 5.

[0051] By adjusting different blackbody furnace temperatures, the difference in the recorded output voltage values ​​of the optical switch 5 after being turned on and before being turned on (i.e., turned off) corresponding to different blackbody furnace temperatures can be obtained, that is, the output voltage difference, and then the correlation between different blackbody furnace temperatures and the output voltage difference can be fitted.

[0052] For example, when the temperature of the blackbody furnace is the first temperature, the output voltage difference of the second voltage value minus the first voltage value can be obtained. For the sake of distinction, it can be named the first output voltage difference; when the temperature of the blackbody furnace is the second temperature, the output voltage difference of the fourth voltage value minus the third voltage value can be obtained. For the sake of distinction, it can be named the second output voltage difference.

[0053] Then, the first temperature, the first output voltage difference, the second temperature, and the second output voltage difference are fitted to obtain the correlation between different black body furnace temperatures and the output voltage differences corresponding to the opening and closing of the optical switch 5 .

[0054] It should be noted that linear fitting or nonlinear fitting can be used. For nonlinear fitting, polynomial fitting method or least squares curve fitting method can be used for fitting. The present invention does not specifically limit the fitting method.

[0055] Step S7, when measuring the temperature information of the hot end component 1, first close the optical switch 5, and record the fifth voltage value output by the acquisition monitoring system 10; then open the optical switch 5, and record the sixth voltage value output by the acquisition monitoring system 10.

[0056] The sixth voltage value outputted in this step may be understood as an output voltage value corresponding to the radiation energy on the surface of the hot end component 1 measured at the current temperature.

[0057] Step S8, obtaining the surface emissivity of the hot end component 1; and determining the temperature information of the hot end component 1 according to the fifth voltage value, the sixth voltage value, the surface emissivity and the correlation relationship.

[0058] It can be understood that the aforementioned steps S1 to S6 are steps of calibrating the radiation temperature measuring device using a black body furnace to obtain a correlation relationship; the aforementioned steps S7 to S8 are steps of measuring the temperature information of the hot end component 1 using the radiation temperature measuring device.

[0059] In this embodiment, in step S7, the time difference between closing the optical switch 5 and opening the optical switch 5 is less than a predetermined time difference threshold. In this way, in the short time when the optical switch 5 is opened, the signal drift of the photodetector 7 is small, thereby having little effect on the temperature measurement accuracy.

[0060] like Figure 6 As shown, in this embodiment, in step S8, the temperature information of the hot end component 1 is determined according to the fifth voltage value, the sixth voltage value, the surface emissivity and the correlation relationship, including steps S81 to S83.

[0061] Step S81, calculating a voltage difference value obtained by subtracting the fifth voltage value from the sixth voltage value;

[0062] Step S82, dividing the voltage difference by the surface emissivity to obtain a correction value;

[0063] Step S83, substituting the correction value into the association relationship to obtain the temperature information of the hot end component 1.

[0064] In some embodiments, the above step S6 further includes: repeating steps S2 to S5 in sequence for a predetermined number of times to obtain a plurality of real-time voltage values ​​output by the acquisition monitoring system 10; fitting the plurality of real-time voltage values ​​to obtain a correlation between different blackbody furnace temperatures and the output voltage difference corresponding to the opening and closing of the optical switch 5. In this way, when the radiation temperature measuring device is calibrated using a blackbody furnace, more output voltage values ​​can be collected to participate in the fitting, a more accurate correlation can be obtained, the fitting quality can be improved, and the temperature measurement accuracy can be improved.

[0065] Through the embodiments of the present invention, after the radiation temperature measuring device is calibrated by using a black body furnace and the correlation relationship is obtained, the voltage difference corresponding to the opening of the optical switch 5 before and after each test can be recorded, so that the dynamic calibration of the radiation temperature measuring device can be achieved, which greatly reduces the large measurement error caused by the signal drift of the photodetector 7, and obtains accurate temperature information of the thermal barrier coating surface of the hot end component 1 or the ceramic-based composite material surface.

[0066] It should be noted that the implementation method of the device part is similar to the implementation method of the method part, and the technical effects achieved are also similar.

[0067] In summary, the embodiment of the present invention provides a radiation temperature measurement device and method based on dynamic calibration. By setting an optical switch and combining a cooling temperature control structure, the optical switch is continuously opened and closed during measurement to achieve dynamic calibration of the radiation temperature measurement device, greatly reducing the large measurement error caused by the drift of the output signal of the long-wave photoelectric detector, and effectively improving the temperature measurement accuracy. The present invention realizes real-time dynamic calibration during the measurement process of the mid-infrared long-wave band radiation temperature measurement system, greatly reducing the radiation energy measurement error caused by the signal drift of the thermoelectric cooling type long-wave infrared photoelectric detector, and can accurately measure the surface temperature of the thermal barrier coating of the hot end component and the surface temperature of the ceramic-based composite material.

[0068] It should be noted that the directional terms mentioned in the embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only reference directions of the drawings and are not intended to limit the scope of protection of the present invention. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or configurations will be omitted when they may cause confusion in the understanding of the present invention.

[0069] In addition, the terms "first" and "second" are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the feature. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the word "one" or "an" preceding an element does not exclude the presence of multiple such elements.

[0070] The embodiments of the present invention are described above. However, these embodiments are only for the purpose of illustration, and are not intended to limit the scope of the present invention. Although each embodiment is described above, it does not mean that the measures in each embodiment cannot be used in combination advantageously. Without departing from the scope of the present invention, those skilled in the art may make various substitutions and modifications, which should all fall within the scope of the present invention.

Claims

1. A radiation temperature measuring device based on dynamic calibration, used to measure the temperature information of a hot end component (1), characterized in that: The radiation temperature measurement device comprises a first lens group (2), a temperature measurement probe (3), a second lens group (4), an optical switch (5), a filter (6), a photodetector (7), a preamplifier (9), a collection and monitoring system (10) and a controller (12), wherein: The first lens group (2) and the second lens group (4) are arranged on two opposite sides of the temperature measuring probe (3); the spectral energy radiated from the surface of the hot end component (1) is collected by the first lens group (2) in the temperature measuring probe (3) and focused by the second lens group (4), and then passes through a filter (6) to obtain a temperature measuring characteristic wavelength corresponding to the spectral energy; The photoelectric detector (7) is of a thermoelectric cooling type, the temperature measurement characteristic wavelength is incident on the photoelectric detector (7) for detection, and an electrical signal corresponding to the temperature measurement characteristic wavelength is obtained, the electrical signal is amplified by a pre-amplifier (9) into a collectible voltage signal, and then collected and post-processed by a collection monitoring system (10) to obtain temperature information of the hot end component (1); The optical switch (5) is arranged at the front end of the optical filter (6), and is controlled to be turned on or off by a controller (12), and the controller (12) is controlled by the acquisition monitoring system (10).

2. The radiation temperature measurement device based on dynamic calibration according to claim 1, characterized in that: Also includes: A first water cooling structure (8) and a constant temperature water chiller (11) are respectively arranged outside the photoelectric detector (7), wherein the first water cooling structure (8) is used to cool the photoelectric detector (7), and the constant temperature water chiller (11) is used to provide constant temperature cold water for the first water cooling structure (8).

3. The radiation temperature measurement device based on dynamic calibration according to claim 1, characterized in that: Also includes: A switch blade (14) is arranged inside the optical switch (5); a surface of the switch blade (14) is coated with a low-emissivity coating or polished stainless steel.

4. The radiation temperature measurement device based on dynamic calibration according to claim 3, characterized in that: Also includes: The second water cooling structure (13) is arranged between the optical switch (5) and the photoelectric detector (7), and the second water cooling structure (13) has two opposite heat exchange surfaces, and the two heat exchange surfaces are in contact with the optical switch (5) and the photoelectric detector (7) respectively.

5. The radiation temperature measurement device based on dynamic calibration according to claim 4, characterized in that: The optical filter (6) is installed inside the optical switch (5) and is arranged between the switch blade (14) and the second water cooling structure (13).

6. The radiation temperature measurement device based on dynamic calibration according to claim 1, characterized in that: Also includes: The optical fiber (17) is arranged between the first lens group (2) and the second lens group (4), and the spectral energy collected by the first lens group (2) is transmitted to the second lens group (4) via the optical fiber (17).

7. The radiation temperature measurement device based on dynamic calibration according to claim 1, characterized in that: Also includes: A heat conducting plate (15) and a heat dissipation fin (16), wherein the heat conducting plate (15) is arranged between the optical switch (5) and the photodetector (7), and the heat dissipation fin (16) is installed on the outer edge of the heat conducting plate (15), and the heat generated by the optical switch (5) and the photodetector (7) is transferred from the heat conducting plate (15) to the heat dissipation fin (16) for heat dissipation.

8. A radiation temperature measurement method based on dynamic calibration, characterized in that: The radiation temperature measurement device based on dynamic calibration applied to any one of claims 1 to 7, the method comprising: Step S1, when using a black body furnace to calibrate the radiation temperature measuring device, aligning the temperature measuring probe (3) with the black body furnace; Step S2, closing the optical switch (5), and when the black body furnace is at a stable first temperature, recording and collecting a first voltage value output by the monitoring system (10); Step S3, turning on the optical switch (5) and recording the second voltage value output by the acquisition monitoring system (10); Step S4, closing the optical switch (5), and recording a third voltage value output by the acquisition monitoring system (10) when the black body furnace is at a stable second temperature, wherein the second temperature is different from the first temperature; Step S5, turning on the optical switch (5) and recording the fourth voltage value output by the acquisition monitoring system (10); Step S6, fitting the first voltage value, the second voltage value, the third voltage value and the fourth voltage value to obtain a correlation relationship between different black body furnace temperatures and the output voltage difference corresponding to the optical switch (5) being turned on and off; Step S7, when measuring the temperature information of the hot end component (1), first close the optical switch (5) and record the fifth voltage value output by the acquisition monitoring system (10); then open the optical switch (5) and record the sixth voltage value output by the acquisition monitoring system (10); Step S8, obtaining the surface emissivity of the hot end component (1); and determining the temperature information of the hot end component (1) according to the fifth voltage value, the sixth voltage value, the surface emissivity and the association relationship.

9. The radiation temperature measurement method based on dynamic calibration according to claim 8, characterized in that: The step S6 further comprises: Repeating steps S2 to S5 in sequence for a predetermined number of times to obtain a plurality of real-time voltage values ​​output by the acquisition monitoring system (10); The multiple real-time voltage values ​​are fitted to obtain a correlation between different black body furnace temperatures and the output voltage difference corresponding to the optical switch (5) being turned on and off.

10. The radiation temperature measurement method based on dynamic calibration according to claim 8, characterized in that: In step S8, determining the temperature information of the hot end component (1) according to the fifth voltage value, the sixth voltage value, the surface emissivity and the association relationship comprises: Calculating a voltage difference value of the sixth voltage value minus the fifth voltage value; Dividing the voltage difference by the surface emissivity to obtain a correction value; Substituting the correction value into the association relationship, the temperature information of the hot end component (1) is obtained.

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