Chip module, developing box, processing box and electrophotographic imaging equipment

Abstract

The invention provides a chip module, a developing box, a processing box and an electrophotographic imaging device, the chip module comprises a mounting base, a forced pushing block and a chip assembly, the mounting base is provided with a guide groove, the forced pushing block is slidably mounted in the guide groove, the guide groove penetrates through the mounting base in the forced pushing direction of the forced pushing block, the chip assembly comprises a substrate and a contact elastic sheet group, and the contact elastic sheet group is arranged on the substrate. The base plate is installed on the installation seat, the contact elastic piece set is installed on the base plate and electrically connected with the base plate, a part of the contact elastic piece set is located at the downstream end of the guide groove in the forced pushing direction, and when the forced pushing block is pushed to move in the forced pushing direction, the forced pushing block can push the contact elastic piece set to elastically deform back to the guide groove. And enabling the contact elastic sheet group to be in contact with a contact pin group in the electrophotographic imaging equipment. A processing box is arranged in the electrophotographic imaging equipment, the processing box comprises a developing box, the developing box is provided with the chip module, and the chip module can ensure that the chip assembly is stably and electrically connected with an electric contact pin in the electrophotographic imaging equipment and does not hinder the installation of the developing box.

Description

Technical Field

[0001] The present invention relates to the field of electronic photographic imaging technology, and in particular to a chip module, a developing box provided with the chip module, a processing box provided with the developing box, and an electronic photographic imaging device provided with the processing box. Background Art

[0002] Electrophotographic imaging equipment (such as laser printers) is an indispensable office equipment in daily work and study. It is a device that uses the principle of electrophotography to form images on image forming media (such as paper) through at least the processes of charging, exposure, development, transfer, fixing, and cleaning. The material device of printing consumables used on electrophotographic imaging equipment is generally called a processing cartridge.

[0003] The processing box includes a developing box and a drum box, such as Figure 1 As shown, an existing type of developing box 9 is provided with a chip 91, wherein the chip 91 is mounted on the end cover 93 of the developing box 9 through a movable bracket 92, the movable bracket 92 includes a mounting frame 921, a connecting frame 922 and a compression spring (not shown), the chip 91 is fixedly mounted on the mounting frame 921, the mounting frame 921 is slidably connected to the connecting frame 922, the compression spring is arranged between the mounting frame 921 and the connecting frame 922, the compression spring is used to force the mounting frame 921 and the connecting frame 922 to move away from each other, and the connecting frame 922 is movably mounted on the end cover 93. Since the mounting frame 921 is slidably connected to the connecting frame 922, the mounting frame 921 can move relative to the connecting frame 922 in the direction X1, and since the connecting frame 922 is movably connected to the end cover 93, the movable bracket 92 can move relative to the end cover 93 in the directions Y1 and Z1. This design ensures that when the developing box 9 is installed in the electronic photographic imaging device, the chip 91 will not have hard contact with the parts in the electronic photographic imaging device under the action of the movable bracket 92, so as to protect the chip 91 during the installation of the developing box 9. At the same time, after the developing box 9 is installed in the electronic photographic imaging device, the chip 91, under the action of the movable bracket 92, enables the contact points on the chip 91 to achieve stable connection with the electric contact pins in the electronic photographic imaging device. Even if the electronic photographic imaging device performs the "drum roller separation" operation during operation, that is, the developing box 9 moves a short distance relative to the drum box in the direction X1, the compression spring set between the mounting bracket 921 and the connecting bracket 922 can also ensure the stability of the electrical connection between the contact points of the chip 91 and the electric contact pins in the electronic photographic imaging device. However, the above design has the following problems: During the process of installing the developer box 9 into the electronic photographic imaging device, since the mounting frame 921 and the connecting frame 922 of the movable bracket 92 can both move in the direction X1, there is a certain probability that the entire movable bracket 92 will move excessively toward the electric contact pin structure in the electronic photographic imaging device, thereby causing the edge of the mounting frame 921 to press against the upper edge of the electric contact pin structure, resulting in the developer box 9 being unable to be installed in place and / or the contacts of the chip 91 being unable to make accurate electrical connection with the electric contact pins; especially when there are errors in manufacturing, the movable distance of the movable bracket 92 in the direction X1 is likely to exceed the safety range, thereby aggravating the above problem. Summary of the invention

[0004] In order to solve the above problems, the first object of the present invention is to provide a chip module that can ensure stable electrical connection between the chip assembly and the electrical contact pins in the electronic photographic imaging device and does not hinder the installation of the developer box.

[0005] A second object of the present invention is to provide a developing box provided with the above-mentioned chip module.

[0006] A third object of the present invention is to provide a processing box provided with the above-mentioned developing box.

[0007] A fourth object of the present invention is to provide an electronic photographic imaging device provided with the above-mentioned processing box.

[0008] In order to achieve the first purpose of the present invention, the present invention provides a chip module, which includes a mounting seat, a pushing block and a chip assembly, the mounting seat has a guide groove, the pushing block is slidably installed in the guide groove, the guide groove penetrates the mounting seat in the pushing direction of the pushing block, the chip assembly includes a substrate and a contact spring group, the substrate is installed on the mounting seat, the contact spring group is installed on the substrate and is electrically connected to the substrate, along the pushing direction, a part of the contact spring group is located at the downstream end of the guide groove, when the pushing block is moved along the pushing direction by the thrust force, the pushing block can push the contact spring group to elastically deform back to the guide groove, so that the contact spring group contacts the contact pin group in the electronic photographic imaging device.

[0009] As can be seen from the above, the chip module is fixed on the end cover of the developer box when in use. Based on this connection method and the position of the contact pin group and the guide structure set in the electronic photographic imaging device, it can ensure that the chip module will not interfere with or collide with the contact pin group before the developer box is completely dropped into the machine (that is, before it is installed in the electronic photographic imaging device), thereby ensuring that the developer box can be installed in place; in addition, during the drop-off process of the developer box, the guide structure in the electronic photographic imaging device will force the pushing block to push the contact spring group to elastically deform against the guide groove to gradually move toward the contact pin group, and when the developer box is installed in place, ensure that the contact spring group and the contact pin group are stably and reliably electrically connected to ensure the stability of the communication between the chip assembly and the electronic photographic imaging device; furthermore, since the chip assembly is electrically connected to the contact pin group through the contact spring group, there is no need to worry about problems such as wear and damage of existing chip contacts.

[0010] A preferred solution is that the mounting seat also has a accommodating cavity, and at least a portion of the contact spring group is located in the accommodating cavity; along the forced pushing direction, the first end of the guide groove forms a first opening at the rear end of the mounting seat, the second end of the guide groove is connected to the first end of the accommodating cavity, and the second end of the accommodating cavity forms a second opening at the front end of the mounting seat.

[0011] As can be seen from the above, adding a receiving cavity to accommodate the contact spring group can reduce the probability of interference and collision between the contact spring group and parts of the electronic photographic imaging device during installation, and play a protective role for the contact spring group.

[0012] A further solution is that the chip assembly also includes a memory, which is mounted on a substrate and electrically connected to the substrate; along the falling direction of the chip module, the accommodating cavity forms a third opening at the top or bottom of the mounting seat, the substrate is mounted at the third opening, the memory is located in the accommodating cavity, or both the substrate and the memory are located in the accommodating cavity.

[0013] As can be seen from the above, the above design allows the memory of the chip component to be placed in the accommodating cavity for protection, thereby preventing the memory from being damaged by collision or impact, thereby improving the protection effect of the chip component.

[0014] Another preferred solution is that the elastic conductive sheet of the contact spring sheet group has a first bending section, which extends roughly along the forced pushing direction. Along the falling direction of the chip module, the first bending section is located above the guide groove, or the first bending section is located at the downstream port of the guide groove; the protruding end of the first bending section has a second bending section, and the second bending section has an angle with the first bending section, and the angle is between 70° and 100°.

[0015] It can be seen from the above that the above design is conducive to the contact spring group to more stably contact and electrically connect with the contact pin group.

[0016] Another preferred solution is that the chip module also includes a spring fixing part, and all elastic conductive sheets contacting the spring group pass through the spring fixing part; along the forced pushing direction, the spring fixing part is located at the downstream port of the guide groove, and the forced pushing block can move along the forced pushing direction until it contacts the spring fixing part.

[0017] As can be seen from the above, the provision of a spring sheet fixing part is conducive to the forced pushing block to synchronously push all the elastic conductive sheets of the contact spring sheet group to move toward the contact pin group, and ensure that each elastic conductive sheet is reliably and stably in contact and electrically connected with the corresponding contact pin of the contact pin group; at the same time, it is also conducive to the forced pushing block to synchronously reset when the contact spring sheet group is reset.

[0018] A further solution is that the mounting seat also has a limiting through groove, which is recessed from the outer wall of the mounting seat into the guide groove and connected with the guide groove, and the limiting through groove is parallel to the guide groove. The chip module also includes a limiting member, which passes through the limiting through groove and is connected to the pushing block; or the guide groove is T-shaped, and the guide groove has a transverse groove section and a vertical groove section, and the first width of the transverse groove section is greater than the second width of the vertical groove section. Along the pushing direction, the transverse groove section is located at the downstream end of the vertical groove section, and the pushing block is T-shaped, and the pushing block has a transverse portion and a vertical portion, and the third width of the transverse portion is greater than the fourth width of the vertical portion, the transverse portion is located in the transverse groove section, and the vertical portion is located in the vertical groove section, and a part of the vertical portion can be moved into the transverse groove section.

[0019] It can be seen from the above that the above design can prevent the forced push block from falling off the mounting seat.

[0020] In order to achieve the second objective of the present invention, the present invention provides a developing box, including a first end cover, wherein the above-mentioned chip module is also included, and a mounting seat is arranged on the first end cover.

[0021] As can be seen from the above, by setting the above-mentioned chip module, the developer box ensures that the chip module will not interfere with or collide with the contact pin group before the completion of the machine drop (that is, before being installed in the electronic photographic imaging device), thereby ensuring that it can be installed in place; and, during the machine drop process, the guide structure in the electronic photographic imaging device will force the pushing block to cause the pushing block contact spring group to elastically deform back to the guide groove to gradually move toward the contact pin group, and when the developer box is installed in place, ensure that the contact spring group and the contact pin group are stably and reliably electrically connected, so as to ensure the stability of the communication between the chip assembly and the electronic photographic imaging device; in addition, since the chip assembly is electrically connected to the contact pin group through the contact spring group, there is no need to worry about problems such as wear and damage of existing chip contacts.

[0022] A further solution is that the mounting seat is detachably connected to the first end cover; or the mounting seat is integrally formed on the first end cover.

[0023] As can be seen from the above, the connection between the chip module and the first end cover is flexible, can adapt to different production requirements, meet different usage requirements, expand the application scope of the developer box, and improve the practicality of the developer box.

[0024] In order to achieve the third object of the present invention, the present invention provides a processing box, including a drum box, which also includes the above-mentioned developing box, and the developing box is connected to the drum box.

[0025] As can be seen from the above, in the processing box provided with the above-mentioned developer box, the chip module will not interfere with or collide with the contact pin group before the developer box is completely dropped into the machine (that is, before it is installed in the electronic photographic imaging device), thereby ensuring that it can be installed in place; and, in the process of dropping into the machine, the guide structure in the electronic photographic imaging device will force the pushing block to cause the pushing block contact spring sheet group to elastically deform away from the guide groove to gradually move toward the contact pin group, and when the developer box is installed in place, ensure that the contact spring sheet group and the contact pin group are stably and reliably electrically connected, so as to ensure the stability of the communication between the chip assembly and the electronic photographic imaging device; in addition, since the chip assembly is electrically connected to the contact pin group through the contact spring sheet group, there is no need to worry about problems such as wear and damage of existing chip contacts.

[0026] In order to achieve the fourth purpose of the present invention, the present invention provides an electronic photographic imaging device, including a body, the body having a processing box installation cavity, wherein a contact pin group and a pushing surface are provided in the processing box installation cavity, and the above-mentioned processing box is installed in the processing box installation cavity; the pushing surface forces the pushing block to move along the pushing direction, so that the pushing block pushes the contact spring sheet group to elastically deform back to the guide groove and contact with the contact pin group.

[0027] As can be seen from the above, through the design of the electronic photographic imaging device, the developer box can be installed in place, and the chip component and the contact pin group can be stably contacted and electrically connected. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a partial structural diagram of an existing developer box.

[0029] Figure 2 It is a structural diagram of the first embodiment of the chip module of the present invention from a first viewing angle.

[0030] Figure 3 It is a structural diagram of the first embodiment of the chip module of the present invention from a second viewing angle.

[0031] Figure 4 It is a structural diagram of the mounting base of the first embodiment of the chip module of the present invention.

[0032] Figure 5 It is a structural diagram of the chip assembly of the first embodiment of the chip module of the present invention.

[0033] Figure 6It is a cross-sectional view of the first embodiment of the chip module of the present invention.

[0034] Figure 7 It is a cross-sectional view of the chip module of the first embodiment of the present invention after the chip module is dropped from the machine.

[0035] Figure 8 It is a cross-sectional view of the second embodiment of the chip module of the present invention.

[0036] Fig. 9 It is a cross-sectional view of the third embodiment of the chip module of the present invention.

[0037] Fig.10 is a cross-sectional view of a fourth embodiment of a chip module of the present invention.

[0038] Fig.11 It is a structural diagram of the developer box embodiment of the present invention with some components omitted.

[0039] The present invention is further described below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0040] Chip module first embodiment Reference Figure 2 and Figure 3 The chip module 100 includes a mounting seat 1, a pushing block 2 and a chip assembly 3; the chip module 100 can be mounted on an end cover 102 provided on a developing box, remain fixed relative to the end cover 102 of the developing box, and move synchronously with the developing box.

[0041] Combination Figure 4 In this embodiment, the mounting seat 1 has a guide groove 11 and an accommodating cavity 12. The guide groove 11 penetrates the mounting seat 1 in the pushing direction X2 of the pushing block 2, and along the pushing direction X2, the first end of the guide groove 11 forms a first opening 111 at the rear end of the mounting seat 1 (i.e., the upstream end side of the mounting seat 1 in the pushing direction X2), the second end of the guide groove 11 is connected to the first end of the accommodating cavity 12, and the second end of the accommodating cavity 12 forms a second opening 121 at the front end of the mounting seat 1 (i.e., the downstream end side of the mounting seat 1 in the pushing direction X2). Preferably, along the falling direction Z2 of the chip module 100 (i.e., the direction in which the chip module 100 is installed in the electronic photographic imaging device 101 following the developer box), the accommodating cavity 12 forms a third opening 122 at the top or bottom of the mounting seat 1; more preferably, along the falling direction Z2 of the chip module 100, the third opening 122 of the accommodating cavity 12 is formed at the bottom of the mounting seat 1 to better protect the chip component 3 (such as the substrate 31, the memory 33, etc.) and prevent the chip component 3 from being bumped.

[0042] The forced pushing block 2 is slidably installed in the guide groove 11. In this embodiment: the forced pushing block 2 is roughly in the shape of a square block, and the mounting seat 1 also has a limiting through groove 13, which is recessed from the outer wall of the mounting seat 1 to the guide groove 11 until it is connected with the guide groove 11, wherein the limiting through groove 13 is parallel to the guide groove 11; preferably, along the landing direction Z2, the limiting through groove 13 is located at the upper part of the mounting seat 1. In addition, the chip module 100 also includes a limiting member 51, which passes through the limiting through groove 13 and is connected to the forced pushing block 2; preferably, the limiting member 51 adopts a first bolt, which passes through the limiting through groove 13 from the outside of the mounting seat 1 and is threadedly connected to the forced pushing block 2. Through the above design, the forced pushing block 2 can be effectively limited to prevent the forced pushing block 2 from falling off the mounting seat 1. Of course, as another optional solution, in other embodiments, the limiting member 51 may also be a pin. Similarly, the pin mounting seat 1 passes through the limiting slot 13 and has an interference fit with the pin hole set on the pushing block 2 to fix the pin on the pushing block 2.

[0043] Combination Figure 5 and Figure 6 The chip assembly 3 includes a substrate 31, a contact spring group 32 and a memory 33, and the contact spring group 32 and the memory 33 are both mounted on the substrate 31 and electrically connected to the substrate 31. The contact spring group 32 includes more than two elastic conductive sheets 321, and the number of the elastic conductive sheets 321 can be matched according to the number of contact pins of the contact pin group 1011 in the electronic photographic imaging device 101. For example, in this embodiment, the number of the elastic conductive sheets 321 is four; more than two plug holes 311 are provided on the substrate 31, and the number of the plug holes 311 is equal to the number of the elastic conductive sheets 321, and the more than two plug holes 311 correspond to the more than two elastic conductive sheets 321 one by one, so that one elastic conductive sheet 321 can be inserted into one plug hole 311. In addition, the elastic conductive sheet 321 is also welded and fixed to the substrate 31 to ensure the firmness of the connection between the conductive sheet and the substrate 31 while realizing the electrical connection between the elastic conductive sheet 321 and the substrate 31.

[0044] A connecting hole 312 is also provided on the substrate 31. When the chip assembly 3 is assembled with the mounting base 1, the second bolt 52 passes through the connecting hole 312 of the substrate 31 and is threadedly connected with the mounting base 1 to fix the substrate 31 on the mounting base 1. As in the present embodiment: the substrate 31 is installed at the third opening 122 of the mounting base 1, and at least a part of the contact spring group 32 is located in the accommodating cavity 12, so that the accommodating cavity 12 can reduce the probability of interference and collision between the contact spring group 32 and the parts of the electronic photographic imaging device 101 during the installation process while accommodating the contact spring group 32, thereby protecting the contact spring group 32; at the same time, under the protection of the accommodating cavity 12, it is also possible to avoid the contact spring group 32 in a non-drop state from being excessively exposed outside the mounting base 1, thereby preventing the contact spring group 32 from being deformed due to being squeezed or hit by foreign objects, thereby ensuring that the contact spring group 32 can accurately match and dock with the contact pin group 1011. It should be noted that, as an optional solution, the contact spring group 32 can be completely located in the accommodating cavity 12, but this may increase the amplitude of the elastic deformation required for the electrical connection between the contact spring group 32 and the contact pin group 1011, and / or increase the length of the contact pin group 1011 extending toward the chip module 100. In addition, the memory 33 is also configured to be located in the accommodating cavity 12, so that the accommodating cavity 12 internally protects the memory 33, effectively preventing the memory 33 from being hit or impacted, thereby preventing the memory 33 from being damaged, and improving the protection effect of the chip component 3. Furthermore, the mounting seat 1 may be provided with a sunken groove at the third opening 122, and the sunken groove is recessed from the outer wall portion of the mounting seat 1 into the accommodating cavity 12. The sunken groove is used to accommodate the substrate 31, so that the side of the substrate 31 facing away from the accommodating cavity 12 is flush with the outer wall portion of the mounting seat 1, or the side of the substrate 31 facing away from the accommodating cavity 12 is closer to the accommodating cavity 12 relative to the outer wall portion of the mounting seat 1, thereby providing better protection for the substrate 31 and also helping to reduce the space occupied by the chip module 100.

[0045] In addition, along the forced pushing direction X2, a part of the contact spring sheet group 32 is located at the downstream end of the guide groove 11 (that is, along the forced pushing direction X2, a part of the contact spring sheet group 32 is located at the downstream end of the guide groove 11 and located on the extension line of the guide groove 11), so as to ensure that when the forced pushing block 2 is pushed along the forced pushing direction X2, the forced pushing block 2 can reliably push the contact spring sheet group 32 to elastically deform away from the guide groove 11, thereby making the contact spring sheet group 32 contact with the contact pin group 1011 in the electronic photographic imaging device 101, so as to establish a stable electrical connection between the electronic photographic imaging device 101 and the chip assembly 3. The length of the forced pushing block 2 extending to the first opening 111 is sufficient for the forced pushing block 2 to push the contact spring sheet group 32 to produce elastic deformation and to make stable contact with the contact pin group 1011 in the electronic photographic imaging device 101.

[0046] Preferably, the elastic conductive sheet 321 of the contact spring sheet group 32 has a first bending section 3211, and the first bending section 3211 extends approximately along the forced pushing direction X2, and along the landing direction Z2, the first bending section 3211 is located above the guide groove 11, or the first bending section 3211 is located at the downstream port of the guide groove 11; wherein, the first bending section 3211 and the main part of the elastic conductive sheet 321 are preferably an arc-shaped transition to reduce stress concentration, and the angle a between the first bending section 3211 and the main part of the elastic conductive sheet 321 is preferably approximately a right angle. The design of the first bending section 3211 can reduce the moving distance required for the pushing block 2 to push the elastic conductive sheet 321 to contact the contact pin group 1011, thereby helping to reduce the volume of the chip module 100; and it can also reduce the deformation required when the elastic conductive sheet 321 contacts the corresponding contact pins of the contact pin group 1011, thereby ensuring the reliability of the connection between the elastic conductive sheet 321 and the substrate 31, avoiding damage to the elastic conductive sheet 321 and / or the substrate 31, and extending the service life of the chip component 3.

[0047] Further, the extended end of the first bending section 3211 has a second bending section 3212, and the first bending section 3211 and the second bending section 3212 preferably have an arc transition to reduce stress concentration. The second bending section 3212 can be bent relative to the first bending section 3211 toward the lower side or the upper side of the first bending section 3211 to adapt to the position setting of the contact pin group 1011 in the electronic photographic imaging device 101. The second bending section 3212 can increase the contact area between the elastic conductive sheet 321 and the contact pin group 1011, ensure the reliability and stability of the electrical connection between the elastic conductive sheet 321 and the corresponding contact pins of the contact pin group 1011, and reduce the influence of the vibration generated during the operation of the electronic photographic imaging device 101 on the electrical connection between the elastic conductive sheet 321 and the contact pins of the contact pin group 1011. In addition, the angle b between the second bending section 3212 and the first bending section 3211 is preferably between 70° and 100°. By designing the angle b, it is ensured that the second bending section 3212 and the corresponding contact pins of the contact pin group 1011 can be closely contacted with each other after the machine is dropped.

[0048] Furthermore, the chip module 100 preferably further includes a spring fixing member 4, on which two or more through holes 41 are provided, the number of through holes 41 being equal to the number of elastic conductive sheets 321 contacting the spring sheet group 32, and the two or more through holes 41 correspond to the two or more elastic conductive sheets 321, so that each elastic conductive sheet 321 passes through the corresponding through hole 41 on the spring fixing member 4. In the forced pushing direction X2, the spring fixing member 4 is located at the downstream end of the guide groove 11, so that the forced pushing block 2 can move along the forced pushing direction X2 to contact the spring fixing member 4, and push the contact spring sheet group 32 to move toward the contact pin group 1011 through the spring fixing member 4.

[0049] The provision of the spring sheet fixing member 4 is conducive to the forced pushing block 2 to synchronously push all the elastic conductive sheets 321 of the contact spring sheet group 32 to move toward the contact pin group 1011, and ensure that each elastic conductive sheet 321 is reliably and stably in contact and electrically connected with the corresponding contact pin of the contact pin group 1011; at the same time, it is also conducive to better forcing the forced pushing block 2 to synchronously reset with the help of the spring sheet fixing member 4 when the contact spring sheet group 32 is reset. In addition, the spring sheet fixing member 4 can also keep a fixed spacing between the elastic conductive sheets 321 of the contact spring sheet group 32, and prevent the elastic conductive sheets 321 of the contact spring sheet group 32 from short-circuiting due to mutual contact; wherein, the spring sheet fixing member 4 is preferably made of insulating material (such as non-conductive plastics such as ABS).

[0050] Combination Figure 7 When in use, the chip module 100 is fixed on the end cover 102 of the developer box, so that the chip module 100 and the developer box keep moving synchronously, and based on the connection method and the position and guide structure of the contact pin group 1011 set in the electronic photographic imaging device 101, it can be ensured that the chip module 100 will not interfere with or collide with the contact pin group 1011 before the developer box is completely dropped into the machine (that is, before it is installed in the electronic photographic imaging device 101), thereby ensuring that the developer box can be installed in place.

[0051] In addition, during the process of the developer box falling into the machine, the guide structure in the electronic photographic imaging device 101 will force the pushing block 2, causing the pushing block 2 to push the contact spring group 32 to elastically deform away from the guide groove 11 to gradually move toward the contact pin group 1011. Since the guide structure is in mechanical hard contact with the pushing block 2, it can ensure that when the developer box is installed in place, the contact spring group 32 and the contact pin group 1011 are stably and reliably electrically connected to ensure the stability of the communication between the chip assembly 3 and the electronic photographic imaging device 101.

[0052] Furthermore, since the chip assembly 3 is electrically connected to the contact pin assembly 1011 through the contact spring assembly 32, there is no need to worry about problems such as wear and damage of the existing chip contacts; and since the contact spring assembly 32 contacts and establishes an electrical connection with the contact pin assembly 1011 through elastic deformation after the developer box is installed in place, and relies on its own elastic function to retract and reset when the developer box is taken out of the electronic photographic imaging device 101, and forces the pushing block 2 to reset together, it can also effectively prevent the contact spring assembly 32 from interfering with or colliding with parts of the electronic photographic imaging device 101 during the disassembly and assembly of the developer box, thereby protecting the chip assembly 3.

[0053] In addition, a connecting portion 14 is formed on the mounting seat 1, and the connecting portion 14 is used to connect the mounting seat 1 with the end cover 102 of the developer box, and also to form a certain avoidance space between the chip assembly 3 and the end cover 102, so as to avoid certain parts on the end cover 102, thereby preventing these parts from blocking the chip module 100 from docking with the contact pin group 1011 and the guide structure in the electronic photographic imaging device 101; preferably, along the landing direction Z2, the mounting seat 1 is formed with a guide surface 15 below the first opening 111, and the guide surface 15 can cooperate with the guide structure to better guide the chip module 100 to land accurately, and enable the guide structure to reliably push the pushing block 2 toward the contact spring group 32 during the landing process of the developer box, thereby pushing the contact spring group 32 to move toward the contact pin group 1011, so as to ensure that the contact spring group 32 and the contact pin group 1011 are stably and reliably electrically connected after the developer box is landed.

[0054] Chip module second embodiment Reference Figure 8 The difference between this embodiment and the first embodiment of the chip module is that, in this embodiment: The mounting seat 1 eliminates the design of the accommodating cavity 12 and the second opening 121 and the third opening 122 , and eliminates the provision of the elastic sheet fixing member 4 .

[0055] Except for the above differences, other structural designs of the chip module 100 in this embodiment are the same as those in the first embodiment of the chip module.

[0056] Chip module third embodiment Reference Fig. 9 The difference between this embodiment and the first embodiment of the chip module is that, in this embodiment: The mounting base 1 substrate 31 and the memory 33 are both located in the accommodating cavity 12; meanwhile, the mounting base 1 can eliminate the design of the third opening 122 of the accommodating cavity 12. In addition, the contact spring group 32 can also be completely disposed in the accommodating cavity 12, that is, the chip assembly 3 can be completely disposed in the accommodating cavity 12, so as to better protect the chip assembly 3.

[0057] Except for the above differences, other structural designs of the chip module 100 in this embodiment are the same as those in the first embodiment of the chip module.

[0058] Chip module fourth embodiment Reference Fig.10 The difference between this embodiment and the first embodiment of the chip module is that, in this embodiment: The design of the limiting member 51 and the limiting through groove 13 on the mounting seat 1 is cancelled; at the same time, the guide groove 11 is designed to be T-shaped, that is, the guide groove 11 has a transverse groove section 112 and a vertical groove section 113, along the forced pushing direction X2, the transverse groove section 112 is located at the downstream end of the vertical groove section 113, wherein the first width W1 of the transverse groove section 112 is greater than the second width W2 of the vertical groove section 113; correspondingly, the forced pushing block 2 is designed to be T-shaped, that is, the forced pushing block 2 has a transverse portion 21 and a vertical portion 22, along the forced pushing direction X2, the transverse portion 21 is located at the downstream end of the vertical portion 22, and the third width of the transverse portion 21 is greater than the fourth width of the vertical portion 22, wherein the transverse portion 21 is located in the transverse groove section 112, the vertical portion 22 is located in the vertical groove section 113, and a part of the vertical portion 22 can be moved into the transverse groove section 112 and pass through the transverse groove section 112.

[0059] Except for the above differences, other structural designs of the chip module 100 in this embodiment are the same as any one of the first to third embodiments of the chip module.

[0060] Development box embodiment Reference Fig.11 The developing box includes a chip module 100, a first end cover 102, a developing frame (not shown), a developing roller (not shown), etc. Since the other components of the developing box except the chip module 100 are basically the same as the developing box of the prior art, they are not described here. Among them, the chip module 100 is arranged on the first end cover 102, the first end cover 102 is installed on the first end wall of the developing frame, and the developing roller is rotatably installed on the developing frame. Among them, the chip module 100 is the chip module 100 described in any one of the first embodiment to the fourth embodiment of the chip module.

[0061] The developer box is provided with the above-mentioned chip module 100 so that before the chip module 100 is completely dropped into the machine (i.e. before being installed into the electronic photographic imaging device 101), it will not interfere with or collide with the contact pin group 1011 in the electronic photographic imaging device 101, thereby ensuring that it can be installed in place; and, during the dropping process, the guide structure in the electronic photographic imaging device 101 will force the pushing block 2, so that the contact spring sheet group 32 of the pushing block 2 elastically deforms away from the guide groove 11 to gradually move toward the contact pin group 1011, and when the developer box is installed in place, it is ensured that the contact spring sheet group 32 and the contact pin group 1011 are stably and reliably electrically connected, so as to ensure the stability of the communication between the chip component 3 and the electronic photographic imaging device 101; in addition, since the chip component 3 is electrically connected to the contact pin group 1011 through the contact spring sheet group 32, there is no need to worry about the problem of wear and damage of the existing chip contacts.

[0062] In this embodiment, the mounting base 1 is detachably connected to the first end cover 102. For example, a first connection hole group 141 is provided on the connection portion 14 of the mounting base 1, and a second connection hole group 1021 matching the first connection hole group 141 is provided on the first end cover 102. When the mounting base 1 is connected to the first end cover 102, the bolt group 53 is used to connect the first connection hole group 141 and the second connection hole group 1021.

[0063] Of course, as another optional solution, the detachable connection between the mounting base 1 and the first end cover 102 can also be connected by a buckle structure. For example, a buckle is provided on the first end cover 102, and a buckle is provided on the connecting portion 14. When the mounting base 1 is connected to the first end cover 102, the buckle is engaged with the buckle and the slot to fix the mounting base 1 on the first end cover 102.

[0064] As another optional solution, the mounting base 1 can also be integrally formed on the end cover 102. It can be seen that the connection between the chip module 100 and the first end cover 102 is flexible, which can adapt to different production requirements, meet different use requirements, expand the application range of the developing box, and improve the practicality of the developing box.

[0065] Processing box embodiment The processing box includes a drum box and the developing box described in the above-mentioned developing box embodiment; wherein the drum box is basically the same as the drum box of the prior art, so it is not described here in detail, and the developing box is connected to the drum box.

[0066] The processing box is provided with the above-mentioned developing box so that before the developing box is completely dropped into the machine (i.e., before it is installed into the electronic photographic imaging device 101), the chip module 100 will not interfere with or collide with the contact pin group 1011 in the electronic photographic imaging device 101, thereby ensuring that it can be installed in place; and, during the dropping process, the guide structure in the electronic photographic imaging device 101 will force the pushing block 2, so that the contact spring sheet group 32 of the pushing block 2 elastically deforms away from the guide groove 11 to gradually move toward the contact pin group 1011, and when the developing box is installed in place, it is ensured that the contact spring sheet group 32 is stably and reliably electrically connected with the contact pin group 1011, so as to ensure the stability of the communication between the chip component 3 and the electronic photographic imaging device 101; in addition, since the chip component 3 is electrically connected with the contact pin group 1011 through the contact spring sheet group 32, there is no need to worry about the problem of wear and damage of the existing chip contacts.

[0067] Electrophotographic imaging device embodiment The electronic photographic imaging device 101 includes a body, which has a processing box installation cavity; wherein, a contact pin group 1011 and a guide structure are provided in the processing box installation cavity, and the guide structure has a forced push surface 1012. The processing box described in the above processing box embodiment is installed in the processing box installation cavity, and when the processing box is installed in the processing box installation cavity, the forced push surface 1012 forces the forced push block 2 to move along the forced push direction X2, so that the forced push block 2 pushes the contact spring sheet group 32 to elastically deform away from the guide groove 11; when the processing box is completely dropped, the forced push surface 1012 causes the forced push block 2 to push the contact spring sheet group 32 to elastically deform away from the guide groove 11 and to stably contact and electrically connect with the contact pin group 1011.

[0068] It can be seen that, through the design of the electronic photographic imaging device 101, the developer box can be installed in place, and the chip assembly 3 and the contact pin group 1011 can be stably contacted and electrically connected.

[0069] Finally, it should be emphasized that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip module, characterized in that: include: A mounting seat, wherein the mounting seat has a guide groove; A forced pushing block, wherein the forced pushing block is slidably mounted in the guide groove, and the guide groove penetrates the mounting seat in the forced pushing direction of the forced pushing block; A chip assembly, wherein the chip assembly comprises a substrate and a contact spring group, wherein the substrate is mounted on the mounting seat, and the contact spring group is mounted on the substrate and electrically connected to the substrate, wherein along the forced pushing direction, a portion of the contact spring group is located at the downstream end of the guide groove, and when the forced pushing block is moved along the forced pushing direction by a thrust force, the forced pushing block can push the contact spring group to elastically deform away from the guide groove, so that the contact spring group contacts the contact pin group in the electronic photographic imaging device.

2. The chip module according to claim 1, characterized in that: The mounting seat further has a receiving cavity, and at least a part of the contact spring assembly is located in the receiving cavity; Along the forced pushing direction, the first end of the guide groove forms a first opening at the rear end of the mounting seat, the second end of the guide groove is connected to the first end of the accommodating cavity, and the second end of the accommodating cavity forms a second opening at the front end of the mounting seat.

3. The chip module according to claim 2, characterized in that: The chip assembly further includes a memory, which is mounted on the substrate and electrically connected to the substrate; Along the falling direction of the chip module, the accommodating cavity forms a third opening at the top or bottom of the mounting seat, the substrate is mounted at the third opening, and the memory is located in the accommodating cavity, or The substrate and the memory are both located in the accommodating cavity.

4. The chip module according to claim 1, characterized in that: The elastic conductive sheet of the contact spring sheet group has a first bending section, the first bending section extends substantially along the forced pushing direction, and along the falling direction of the chip module, the first bending section is located above the guide groove, or the first bending section is located at the downstream port of the guide groove; The extended end of the first bending section has a second bending section, and an angle is formed between the second bending section and the first bending section, and the angle is between 70° and 100°.

5. The chip module according to claim 1, characterized in that: The chip module further comprises a spring sheet fixing member, through which all elastic conductive sheets of the contact spring sheet group pass; Along the forced pushing direction, the spring sheet fixing piece is located at the downstream end of the guide groove, and the forced pushing block can move along the forced pushing direction until it contacts the spring sheet fixing piece.

6. The chip module according to any one of claims 1 to 5, characterized in that: The mounting seat further comprises a limiting through groove, which is concave from the outer wall of the mounting seat toward the guide groove and communicates with the guide groove, and the limiting through groove is parallel to the guide groove. The chip module further includes a limiting member, the limiting member passes through the limiting through slot and is connected to the forced pushing block; or The guide groove is T-shaped, and has a transverse groove section and a vertical groove section. The first width of the transverse groove section is greater than the second width of the vertical groove section. Along the forced pushing direction, the transverse groove section is located at the downstream end of the vertical groove section. The forced pushing block is T-shaped and has a transverse portion and a vertical portion. The third width of the transverse portion is greater than the fourth width of the vertical portion. The transverse portion is located in the transverse groove section, and the vertical portion is located in the vertical groove section. A portion of the vertical portion can be moved into the transverse groove section.

7. A developing box, comprising a first end cover, characterized in that: It also includes the chip module according to any one of claims 1 to 6, wherein the mounting seat is arranged on the first end cover.

8. The developer cartridge according to claim 7, wherein: The mounting seat is detachably connected to the first end cover; or The mounting seat is integrally formed on the first end cover.

9. A process cartridge, including a drum cartridge, characterized in that It also includes a developing box as described in claim 7 or 8, and the developing box is connected to the drum box.

10. An electrophotographic imaging device, comprising a body having a process cartridge mounting cavity, characterized in that: The process cartridge installation cavity is provided with a contact pin group and a pushing surface, and the process cartridge as claimed in claim 9 is installed in the process cartridge installation cavity; The pushing surface forces the pushing block to move along the pushing direction, so that the pushing block pushes the contact spring sheet group to elastically deform away from the guide groove and contact the contact pin group.

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