PCB hole cleaning equipment and PCB thereof

Abstract

The invention relates to the technical field of cleaning equipment, in particular to PCB hole cleaning equipment and a PCB thereof.The PCB hole cleaning equipment comprises a rack, a first cleaning mechanism, a second cleaning mechanism and a third cleaning mechanism, a moving mechanism is arranged on the top face of the rack and arranged along the long edge of the rack, and the first cleaning mechanism comprises a first liquid supply assembly and a spraying assembly; one end of the spraying assembly is connected with the output end of the first liquid supply assembly; the second cleaning mechanism is arranged on one side of the first cleaning mechanism, the second cleaning mechanism comprises a first spraying assembly, the first spraying assembly is arranged at the top of the moving mechanism, and the first spraying assembly can obliquely spray water flow; the fourth cleaning mechanism comprises a first rolling brush set, and the first rolling brush set is rotationally connected to the top of the rack; the ultrasonic cleaning mechanism is arranged on one side of the fourth cleaning mechanism; and the fifth cleaning mechanism is located on one side of the ultrasonic cleaning mechanism, so that the PCB can be cleaned more thoroughly.

Description

Technical Field

[0001] The present application relates to the technical field of cleaning equipment, and in particular to a PCB board hole cleaning equipment and a PCB board thereof. Background Art

[0002] Printed circuit board, also known as PCB board, is the support body of electronic components and the carrier of electrical connection of electronic components. During the production process of PCB board, it is necessary to punch the PCB board to process the required hole positions on the PCB board. After that, the hole wall needs to be copper-plated to ensure the conductivity of the hole wall.

[0003] After the PCB board is punched, debris generated during punching will remain on the surface of the PCB board and in the hole wall. In the subsequent copper plating step, the debris remaining in the hole wall will affect the copper plating in the hole wall. Therefore, before copper plating in the hole wall, the debris on the surface of the PCB board and in the hole wall will be cleaned to reduce the impact of the debris on the copper plating in the hole wall of the PCB board.

[0004] At present, when cleaning the surface of the PCB board and the inside of the hole wall, the surface of the PCB board and the inside of the hole wall are often cleaned by spraying water downwards. However, this cleaning method is difficult to clean thoroughly, and debris often remains in the hole wall, which affects the subsequent copper plating in the hole wall. Summary of the invention

[0005] In order to clean the PCB board more thoroughly, the present application provides a PCB board hole cleaning device and a PCB board thereof.

[0006] In the first aspect, the present application provides a PCB board hole cleaning device, which adopts the following technical solution: A PCB board hole cleaning device, comprising: Rack: A moving mechanism is disposed on the top surface of the rack, and the moving mechanism is disposed along the long side of the rack, and the moving mechanism is used to move the PCB board; First cleaning mechanism: the first cleaning mechanism includes a first liquid supply component and a spray component, one end of the spray component is connected to the output end of the first liquid supply component, the spray component is located on the top of the input end of the moving mechanism, and the first liquid supply component is used to provide water flow for the spray component; Second cleaning mechanism: the second cleaning mechanism is arranged on one side of the first cleaning mechanism, the second cleaning mechanism comprises a first spraying assembly, the first spraying assembly is arranged on the top of the moving mechanism, and the first spraying assembly can spray water at an angle; Fourth cleaning mechanism: the fourth cleaning mechanism is arranged on one side of the second cleaning mechanism, and the fourth cleaning mechanism comprises a first roller brush group, the first roller brush group is rotatably connected to the top of the frame, and the first roller brush group is used to brush the PCB board; Ultrasonic cleaning mechanism: the ultrasonic cleaning mechanism is arranged on one side of the fourth cleaning mechanism, and the ultrasonic cleaning mechanism can clean the PCB board by ultrasonic wave; Fifth cleaning mechanism: The fifth cleaning mechanism is located on one side of the ultrasonic cleaning mechanism, and the fifth cleaning mechanism can flush the PCB board in all directions.

[0007] By adopting the above technical scheme, the present application roughly flushes the debris on the surface of the PCB board and the hole wall through the first cleaning mechanism, flushes away most of the debris, and then further cleans it through the second cleaning mechanism. By flushing at multiple angles, it flushes to the angle that the first cleaning mechanism cannot clean, thereby roughly cleaning the PCB board. After that, the PCB board enters the fourth cleaning mechanism. While the fourth cleaning mechanism flushes the PCB board, the first roller brush group can enter the hole wall for brushing, and directly brush away the debris attached to the hole wall that has not been flushed away, thereby reducing the debris remaining in the hole wall. The PCB board then enters the ultrasonic cleaning mechanism, and the ultrasonic cleaning can clean away the residual debris in the tiny gaps of the PCB board or in the hole wall, thereby cleaning the PCB board. Finally, the PCB board enters the fifth cleaning mechanism, and the fifth cleaning mechanism can flush the PCB board more comprehensively, further reducing the possibility of residual debris on the PCB board, so that the PCB board is cleaned more thoroughly.

[0008] Preferably, a third cleaning mechanism is included, and the third cleaning mechanism is arranged between the second cleaning mechanism and the fourth cleaning mechanism. The third cleaning mechanism can clean the PCB board with a liquid or flush the PCB board with water.

[0009] By adopting the above technical solution, the PCB board passes through the second cleaning mechanism and then passes through the third cleaning mechanism. When there are contaminants that are difficult to clean and need to be cleaned, the contaminants are cleaned with liquid medicine. Alternatively, when liquid medicine cleaning is not required, water flushing is performed again to ensure that most of the debris is flushed away.

[0010] Preferably, a water absorption mechanism is provided on the top surface of the frame, and the water absorption mechanism is located on one side of the fifth cleaning mechanism, and the water absorption mechanism is used to absorb water flow on the surface of the PCB board.

[0011] By adopting the above technical solution, when the PCB board is cleaned, the PCB board moves to the water absorption mechanism, which can absorb the water flow on the surface of the PCB board, thereby reducing the situation where the water flow stays on the PCB board for a long time. After the water flow on the surface of the PCB board is absorbed, it is convenient for the PCB board to proceed to the next process.

[0012] Preferably, the water absorption mechanism includes a first water-absorbing sponge roller and a second water-absorbing sponge roller, the first water-absorbing sponge roller is rotatably connected to the top of the frame, the second water-absorbing sponge roller is rotatably connected to the top of the first water-absorbing sponge roller, and the PCB board passes between the first water-absorbing sponge roller and the second water-absorbing sponge roller.

[0013] By adopting the above technical solution, the PCB board moves to the water absorption mechanism, and the PCB board passes between the first water-absorbing sponge roller and the second water-absorbing sponge roller. Under the action of the first water-absorbing sponge roller and the second water-absorbing sponge roller, water is absorbed from the bottom surface and the top surface of the PCB board respectively, and the water flow on the surface of the PCB board is wiped.

[0014] Preferably, a drying mechanism is provided on the top surface of the frame, the drying mechanism is located on one side of the water absorbing mechanism, and the drying mechanism is used to dry the moisture on the PCB board.

[0015] By adopting the above technical solution, after the PCB board absorbs water through the first water-absorbing sponge roller and the second water-absorbing sponge roller, the PCB board enters the air-drying mechanism, and the air-drying mechanism blows away the moisture on the surface of the PCB board and the moisture in the hole wall, further drying the PCB board and reducing the residual moisture on the surface of the PCB board.

[0016] Preferably, the air-drying mechanism includes an air-drying box and an air duct. The air-drying box is installed on the top of the frame. The opening of the air-drying box is aligned with the movable mechanism. One end of the air duct is connected to the top of the air-drying box, and wind enters the air-drying box from the air duct.

[0017] By adopting the above technical solution, when the PCB board moves to the bottom of the air-drying box along the long side direction of the moving mechanism, wind blows from the bottom of the air-drying box to the PCB board, thereby drying the moisture on the surface of the PCB board and the moisture in the hole wall. Under the action of the air-drying box, the PCB board can be dried more concentratedly.

[0018] Preferably, the fifth cleaning mechanism includes a mounting tube, a rotating tube and a third nozzle, the rotating tube is rotatably connected to the top of the frame, the top surface of the mounting tube is connected to the bottom surface of the rotating tube, the mounting tube cavity is connected to the rotating tube cavity, there are multiple third nozzles, and the multiple third nozzles are obliquely arranged on the bottom surface of the mounting tube, and the inclination angles of the multiple third nozzles are different.

[0019] By adopting the above technical solution, water flows from the rotating tube into the installation tube cavity, and then the water flows out from the third nozzle. The third nozzle is tilted, and the tilt angles of multiple third nozzles are different, so that the water flows sprayed from the multiple third nozzles can flush the PCB board from different directions, thereby flushing more comprehensively.

[0020] Preferably, the fifth cleaning mechanism further includes a rotating assembly, an output end of the rotating assembly is assembled with the rotating tube, and the rotating assembly is used to drive the rotating tube to rotate.

[0021] By adopting the above technical solution, the rotating component can drive the mounting tube to rotate. When the PCB board moves to the bottom of the third nozzle, water is sprayed out from the third nozzle. At the same time, the rotating component is started, the rotating component drives the rotating tube to rotate, and the rotating tube drives the mounting tube to rotate, so that the third nozzle also rotates when spraying water, so that the PCB board can be flushed with water flow at multiple angles, and the debris that may remain on the PCB board can be cleaned by all-round flushing.

[0022] Preferably, a pressing mechanism is provided on the top of the moving mechanism, and the pressing mechanism can be raised and lowered according to the thickness of the PCB board.

[0023] By adopting the above technical solution, when the PCB board moves between the moving mechanism and the pressing mechanism, the PCB board applies an upward force to the pressing mechanism, so that the pressing mechanism moves upward, so that the space between the pressing mechanism and the moving mechanism can be changed according to the thickness of the PCB board, thereby adapting to PCB boards of different thicknesses and the situation where the thickness of the PCB board is uneven, so that the pressing mechanism can better press the PCB board, and reduce the situation where the PCB board overlaps with other PCB boards after being impacted by water flow.

[0024] In a second aspect, the present application provides a PCB board, which is used for cleaning by the above-mentioned PCB board hole cleaning equipment, and includes a board body, and a mounting hole is opened through the top surface of the board body.

[0025] By adopting the above technical solution, a mounting hole is opened through the top surface of the board body, and the board body and the mounting hole are cleaned by using a PCB board hole cleaning device.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. The present application roughly flushes the debris on the surface of the PCB board and the hole wall through the first cleaning mechanism to flush away most of the debris, and then further cleans it through the second cleaning mechanism. By flushing at multiple angles, it flushes to the angle that the first cleaning mechanism cannot clean, thereby roughly cleaning the PCB board. After that, the PCB board enters the fourth cleaning mechanism. While the fourth cleaning mechanism flushes the PCB board, the first roller brush group can enter the hole wall for brushing, and directly brush away the debris attached to the hole wall that cannot be flushed away, thereby reducing the debris remaining in the hole wall. The PCB board then enters the ultrasonic cleaning mechanism, and the ultrasonic cleaning can clean away the residual debris in the tiny gaps of the PCB board or in the hole wall, thereby cleaning the PCB board. Finally, the PCB board enters the fifth cleaning mechanism, and the fifth cleaning mechanism can flush the PCB board more comprehensively, further reducing the possibility of residual debris on the PCB board, so that the PCB board is cleaned more thoroughly.

[0027] 2. When the PCB board is cleaned, it moves to the water absorption mechanism, which can absorb the water on the surface of the PCB board to reduce the situation where the water stays on the PCB board for a long time. After the water on the surface of the PCB board is absorbed, it is convenient for the PCB board to proceed to the next process. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0029] Figure 2 It is a partial schematic diagram of the first cleaning mechanism in the embodiment of the present application.

[0030] Figure 3 yes Figure 2 A is an enlarged view of the middle image.

[0031] Figure 4 It is a schematic diagram of the local structure from another perspective of the embodiment of the present application.

[0032] Figure 5 It is a bottom view of the first cleaning mechanism and the second cleaning mechanism in the embodiment of the present application.

[0033] Figure 6 It is a bottom view of the third cleaning mechanism in the embodiment of the present application.

[0034] Figure 7 It is a partial schematic diagram of the fourth cleaning mechanism in the embodiment of the present application.

[0035] Figure 8 It is a partial schematic diagram of the fifth cleaning mechanism in the embodiment of the present application.

[0036] Fig. 9It is a partial schematic diagram of the water absorption mechanism and the air drying mechanism in the embodiment of the present application.

[0037] Description of reference numerals: 1. frame; 11. mounting base; 111. moving groove; 12. cover plate; 13. moving block; 2. moving mechanism; 21. rotating drive assembly; 211. rotating shaft; 212. transmission gear; 213. driven gear; 22. moving assembly; 221. rotating column; 222. guide wheel; 3. first cleaning mechanism; 31. first liquid supply assembly; 311. water tank; 312. water inlet pipe; 313. water pump; 314. water outlet pipe; 32. spray assembly; 321. spray pipe; 322. first nozzle; 4. pressing mechanism; 41. pressing assembly; 5. second cleaning mechanism; 51. second liquid supply assembly; 52 , the first spraying assembly; 521, the spraying pipe; 522, the second nozzle; 61, the third cleaning mechanism; 611, the third liquid supply assembly; 612, the second spraying assembly; 613, the spare liquid supply assembly; 62, the fourth cleaning mechanism; 621, the first roller brush; 622, the second roller brush; 63, the ultrasonic cleaning mechanism; 7, the fifth cleaning mechanism; 71, the fourth liquid supply assembly; 72, the rotating assembly; 73, the flushing assembly; 731, the mounting tube; 732, the third nozzle; 8, the water absorbing mechanism; 81, the first water absorbing sponge roller; 82, the second water absorbing sponge roller; 9, the air drying mechanism; 91, the air drying assembly; 911, the air drying box; 912, the air duct. DETAILED DESCRIPTION

[0038] The following is combined with Figure 1-9 This application is described in further detail.

[0039] The embodiment of the present application discloses a PCB board hole cleaning device.

[0040] Reference Figure 1 and Figure 2 A PCB board hole cleaning device includes a frame 1, a moving mechanism 2 is arranged on the top of the frame 1, the moving mechanism 2 includes a rotating drive component 21 and a moving component 22, and mounting seats 11 are respectively fixed at both ends of the top of the frame 1 (refer to Figure 3 ), the long side of the mounting seat 11 is parallel to the long side of the frame 1, the moving component 22 includes a rotating column 221 and a guide wheel 222, the rotating column 221 is rotatably connected between the two mounting seats 11, the long side of the rotating column 221 is parallel to the wide side of the frame 1, the guide wheel 222 is fixed to the outer wall of the rotating column 221, there are multiple guide wheels 222, and the multiple guide wheels 222 are evenly distributed along the long side direction of the rotating column 221, the rotating driving component 21 includes a rotating shaft 211, a transmission gear 212 and a driven gear 213, the rotating shaft 211 is rotatably connected between the two sides of the frame 1, the rotating shaft 211 is located at one end of the top of the frame 1, and the long side of the rotating shaft 211 is perpendicular to the extension direction of the rotating column 221.

[0041] Reference Figure 2 and Figure 3 In the embodiment of the present application, the transmission gear 212 and the driven gear 213 are helical gears. The transmission gear 212 is fixed to the outer wall of the rotating shaft 211. One end of the rotating column 221 passes through the side wall of the mounting seat 11. The driven gear 213 is fixed to the outer wall of the rotating column 221. The driven wheel is located at the part of the rotating column 221 that passes through the side wall of the mounting seat 11. The transmission gear 212 is meshed with the driven gear 213. The rotation of the rotating shaft 211 can drive the transmission gear 212 to rotate. With the cooperation of the transmission gear 212 and the driven gear 213, the driven gear 213 can be driven to rotate, thereby driving the rotating column 221 to rotate, and then causing the guide wheel 222 to rotate.

[0042] There are multiple moving assemblies 22, and the multiple moving assemblies 22 are evenly distributed along the long side direction of the frame 1. Correspondingly, the number of transmission gears 212 is consistent with the number of moving assemblies 22. At the same time, the number of driven gears 213 is consistent with the number of moving assemblies 22. The rotating column 221, the transmission gear 212 and the driven gear 213 correspond to each other one by one. The PCB board is placed on the top of the multiple guide wheels 222, and the rotating shaft 211 is rotated. The rotating shaft 211 drives the multiple transmission gears 212 to rotate, and the multiple transmission gears 212 drive the driven gears 213 meshing therewith to rotate, thereby driving the multiple rotating columns 221 to rotate, so that the guide wheel 222 fixed on the outer wall of the rotating column 221 rotates. The rotation of the guide wheel 222 can transfer the PCB board, and then drive the PCB board to move along the long side direction of the frame 1.

[0043] The rotation drive assembly 21 also includes a rotation drive unit, which is arranged at one end of the frame 1. The rotation drive unit includes a motor, a transmission wheel, a belt and a driven wheel. The motor is installed in the frame 1, the transmission wheel is assembled at the output end of the motor, the driven wheel is fixed to the outer wall of the rotating shaft 211, one end of the belt is sleeved on the outer wall of the transmission wheel, and the other end of the belt is sleeved on the outer wall of the driven wheel. When the motor is started, the motor drives the transmission wheel to rotate. With the cooperation of the transmission wheel, the belt and the driven wheel, the driven wheel is driven to rotate. The rotation of the driven wheel drives the rotating shaft 211 to rotate. Under the action of the rotation drive unit, the rotation of the rotating shaft 211 can be driven, so that the PCB board moves along the long side direction of the frame 1.

[0044] Reference Figure 4 and Figure 5The top surface of the frame 1 is provided with a cover plate 12, which blocks the top of the frame 1. A gap is provided between the bottom surface of the cover plate 12 and the top surface of the frame 1, so that the PCB board can pass through. The top surface of the frame 1 is provided with a first cleaning mechanism 3. The input end of the moving mechanism 2 is the feeding end. The PCB board is placed at the feeding end. After that, the PCB board enters the cover plate 12. A plurality of guide wheels 222 transfer the PCB board to the first cleaning mechanism 3. The first cleaning mechanism 3 includes a first liquid supply component 31 and a spray The shower assembly 32, the first liquid supply assembly 31 includes a water tank 311, a water inlet pipe 312, a water pump 313 and a water outlet pipe 314, the water tank 311 is arranged at the bottom of the frame 1, the water pump 313 is installed on the side wall of the frame 1, the input end of the water pump 313 is connected to a connecting pipe, the other end of the connecting pipe is inserted into the water tank 311 cavity, one end of the water inlet pipe 312 is connected to the output end of the water pump 313, one end of the water outlet pipe 314 is inserted into the top of the water tank 311, and the other end of the water outlet pipe 314 is inserted into the top surface of the frame 1.

[0045] The spray assembly 32 includes a spray pipe 321 and a first nozzle 322. The spray pipe 321 is installed in the cover plate 12. The long side of the spray pipe 321 is parallel to the wide side of the frame 1. One end of the spray pipe 321 extends out of the side wall of the cover plate 12. The spray pipe 321 extends out of the side wall of the cover plate 12 and is connected to the end of the water inlet pipe 312 away from the water pump 313. The first nozzle 322 is installed on the outer wall of the spray pipe 321. The output end of the first nozzle 322 is aligned with the guide wheel 222. There are multiple first nozzles 322, and the multiple first nozzles 322 are distributed along the long side direction of the spray pipe 321. Accordingly, the number of spray pipes 321 depends on the specific situation. In the embodiment of the present application, there are two spray pipes 321, and the two spray pipes 321 are arranged in parallel.

[0046] When the PCB board is transferred to the bottom of the first nozzle 322, the water pump 313 is started, and the water pump 313 transports the water flow in the water tank 311 to the water inlet pipe 312. Then, the water flow enters the spray pipe 321 from the water inlet pipe 312. Finally, the water flow is sprayed out from the output end of the first nozzle 322, and the water flow sprays the PCB board to wash the debris on the surface of the PCB board and the hole wall. Then, the water flow enters the water tank 311 from the water outlet pipe 314, and the water flow is filtered in the water tank 311 and then sprayed out through the first nozzle 322 to wash the PCB board, and this cycle is repeated.

[0047] Reference Figure 3In order to reduce the impact force generated by the water flow sprayed by the first nozzle 322 applied to the PCB board, causing multiple PCB boards to overlap, affecting the movement of the PCB board and the flushing of the PCB board, a pressing mechanism 4 is arranged on the top of the transfer mechanism, and the pressing mechanism 4 includes a pressing component 41. In the embodiment of the present application, the structure of the pressing component 41 is consistent with the structure of the moving component 22. In the embodiment of the present application, no detailed description is given. A moving groove 111 is opened on the top surface of the two mounting seats 11, and a moving block 13 is slidably connected to the top of the two mounting seats 11. The two moving blocks 13 are respectively located in the moving grooves 111 adjacent to them. Correspondingly, active grooves are respectively opened in the two moving blocks 13. The two ends of the pressing component 41 are respectively movably inserted into the active grooves adjacent to them. The outer wall of the pressing component 41 is in contact with the outer wall of the moving component 22. There are multiple pressing components 41, and the multiple pressing components 41 are distributed along the long side direction of the frame 1.

[0048] When the PCB board moves to between the pressing component 41 and the moving component 22, the PCB board applies an upward force to the pressing component 41, so that the pressing component 41 moves upward along the movable groove. When the pressing component 41 is located inside the movable groove, the moving block 13 moves upward along the moving groove 111, so that the space between the pressing component 41 and the moving component 22 can be changed according to the thickness of the PCB board, thereby adapting to PCB boards of different thicknesses and adapting to the situation where the thickness of the PCB board is uneven, so that the pressing component 41 can better press the PCB board and reduce the overlap of the PCB board with other PCB boards after being impacted by water flow.

[0049] Reference Figure 4 and Figure 5 A second cleaning mechanism 5 is provided on the top surface of the frame 1, and the second cleaning mechanism 5 is located on one side of the first cleaning mechanism 3. The second cleaning mechanism 5 includes a second liquid supply component 51 and a first spray component 52. The structure of the second liquid supply component 51 is consistent with that of the first liquid supply component 31. In the embodiment of the present application, no detailed description is given. The first spray component 52 includes a spray pipe 521 and a second nozzle 522. One end of the spray pipe 521 is connected to the output end of the second liquid supply component 51. The second nozzle 522 is installed on the outer wall of the spray pipe 521. The output end of the second nozzle 522 is aligned with the moving mechanism 2. There are multiple second nozzles 522, and the multiple second nozzles 522 are evenly distributed along the long side of the spray pipe 521. There are multiple first spray components 52, and the multiple first spray components 52 are distributed along the long side direction of the frame 1.

[0050] The second nozzle 522 is tilted, and the second nozzles 522 on two adjacent spray pipes 521 are tilted in opposite directions, so that the water flow sprayed from the nozzle can impact the PCB board at an angle, so that the water flow can better impact the hole wall and better clean the debris in the hole wall. Accordingly, the second nozzles 522 on two adjacent spray pipes 521 are staggered, thereby reducing the collision of water flows sprayed from two adjacent second nozzles 522.

[0051] Reference Figure 4 and Figure 6 A third cleaning mechanism 61 is provided on the top surface of the frame 1. The third cleaning mechanism 61 is located on the side of the second cleaning mechanism 5 away from the first cleaning mechanism 3. The third cleaning mechanism 61 includes a third liquid supply component 611 and a second spray component 612. The structure of the third liquid supply component 611 is consistent with that of the first liquid supply component 31, and the structure of the second spray component 612 is consistent with that of the first spray component 52. In the embodiment of the present application, detailed description is not given.

[0052] The third cleaning mechanism 61 also includes a standby liquid supply component 613. The structure of the standby liquid supply component 613 is consistent with that of the third liquid supply component 611. The input end of the standby liquid supply component 613 is connected to the input end of the third liquid supply component 611, and the output end of the standby liquid supply component 613 is connected to the output end of the third liquid supply component 611. The standby liquid supply component 613 is equipped with liquid medicine. When it is difficult to clean the contaminants on the PCB board by physical cleaning methods, and the contaminants on the PCB board need to be cleaned with liquid medicine, the third liquid supply component 611 is suspended, the standby liquid supply component 613 is started, and the liquid medicine in the standby liquid supply component 613 is sprayed out through the second spray component 612, so as to clean the PCB board with liquid medicine. When the PCB board does not need to be cleaned with liquid medicine, the liquid medicine in the rack 1 is stored in the standby liquid supply component 613, and the third liquid supply component 611 is started, and the water flow in the third liquid supply component 611 is sprayed out through the second spray component 612, so as to further clean the PCB board.

[0053] Reference Figure 7, a fourth cleaning mechanism 62 is arranged on the top surface of the frame 1, and the fourth cleaning mechanism 62 is located on one side of the third cleaning mechanism 61. The fourth cleaning mechanism 62 is consistent with the second cleaning mechanism 5 in structure. In the embodiment of the present application, no detailed description is given. A first roller brush 621 group and a second roller brush 622 group are also arranged on the top surface of the frame 1. The first roller brush 621 group and the second roller brush 622 group are located at the output end of the fourth cleaning mechanism 62. The first roller brush 621 group includes a first roller brush 621, which is arranged between two adjacent rotating columns 221. The first roller brush 621 is long The side is parallel to the long side of the rotating column 221, and both ends of the first roller brush 621 are respectively rotatably connected to the mounting seat 11 close to it, and one end of the first roller brush 621 is connected to the rotating drive component 21. The connection method between the first roller brush 621 and the rotating drive component 21 is consistent with the connection method between the rotating column 221 and the rotating drive component 21. In the embodiment of the present application, it is not described in detail. The rotation of the rotating shaft 211 can drive the first roller brush 621 to rotate. There are multiple first roller brushes 621, and the multiple first roller brushes 621 are distributed along the long side direction of the frame 1.

[0054] The second roller brush 622 group includes a second roller brush 622, the long side of the second roller brush 622 is parallel to the long side of the rotating column 221, the second roller brush 622 is arranged on the top of the rotating column 221, and the two ends of the second roller brush 622 are respectively connected to the top of the mounting seat 11 close to it, and the connection method between the second roller brush 622 and the mounting seat 11 is consistent with the connection method between the pressing component 41 and the mounting seat 11. In the embodiment of the present application, it is not described in detail. There are multiple second roller brushes 622, and the multiple second roller brushes 622 are distributed along the long side of the frame 1, and the second roller brush 622 and the first roller brush 621 are staggered.

[0055] When the PCB board passes through the fourth cleaning mechanism 62, the water flow sprayed by the fourth cleaning mechanism 62 flushes the PCB board. After that, after the PCB board moves to the bottom of the second roller brush 622, the hair on the outer wall of the second roller brush 622 enters the hole wall from the top of the PCB board. As the PCB board moves, the outer wall of the second roller brush 622 can enter from the top of the hole wall to clean the hole wall, and the debris that cannot be flushed out of the hole wall is brushed away by the second roller brush 622. Correspondingly, after the PCB board passes through the top of the first roller brush 621, the outer wall of the first roller brush 621 can enter from the bottom of the hole wall and brush the hole wall. Under the action of the first roller brush 621, the hole wall can be brushed more comprehensively.

[0056] Reference Figure 1 and Figure 4An ultrasonic cleaning mechanism 63 is provided on the top surface of the frame 1, and the ultrasonic cleaning mechanism 63 is located on one side of the fourth cleaning mechanism 62. The ultrasonic cleaning mechanism 63 can clean the PCB board by ultrasonic waves. The ultrasonic cleaning can penetrate into the hard-to-reach parts such as tiny gaps, holes, blind holes, etc. of the PCB board, so that the cleaning liquid can fully contact and act on the dirt, thereby achieving thorough cleaning of the PCB board.

[0057] Reference Figure 4 and Figure 8 A fifth cleaning mechanism 7 is provided on the top surface of the frame 1. The fifth cleaning mechanism 7 is located on one side of the ultrasonic cleaning mechanism 63. The fifth cleaning mechanism 7 includes a fourth liquid supply component 71, a rotating component 72 and a flushing component 73. The fourth liquid supply component 71 has the same structure as the first liquid supply component 31. The flushing component 73 includes a mounting tube 731, a rotating tube and a third nozzle 732. The bottom end of the rotating tube passes through the top surface of the cover plate 12. The rotating tube and the cover plate 12 are rotatably connected. The top surface of the mounting tube 731 is fixed to the bottom surface of the rotating tube. The cavity of the mounting tube 731 is connected to the The rotating tube cavities are interconnected, and the third nozzle 732 is installed on the bottom surface of the installation tube 731. There are multiple third nozzles 732, and the multiple third nozzles 732 are arranged in two rows on the bottom surface of the installation tube 731. The two rows of third nozzles 732 are tilted, and the two rows of third nozzles 732 are relatively tilted. Moreover, the tilt angles of the multiple third nozzles 732 are different, so that the water flow sprayed by the multiple third nozzles 732 can flush the PCB board from different directions, thereby flushing more comprehensively. The two rows of third installation nozzles are staggered to reduce the collision of water flow sprayed by multiple nozzles.

[0058] The output end of the fourth liquid supply component 71 is rotatably connected to the top of the mounting tube 731, the output end cavity of the fourth liquid supply component 71 is connected to the cavity of the mounting tube 731, the rotating component 72 is assembled with the mounting tube 731, and the rotating component 72 can drive the mounting tube 731 to rotate. When the PCB board moves to the bottom of the third nozzle 732, the water flows into the cavity of the rotating tube through the fourth liquid supply component 71, and then the water flows into the cavity of the mounting tube 731 from the rotating tube. Finally, the water flows out from the third nozzle 732. At the same time, the rotating component 72 is started, the rotating component 72 drives the rotating tube to rotate, and the rotating tube drives the mounting tube 731 to rotate, so that the third nozzle 732 also rotates when spraying water, so that the PCB board can be flushed with water flows at multiple angles, and the debris that may remain on the PCB board can be cleaned by all-round flushing.

[0059] In the present application, the debris on the surface of the PCB board and the hole wall is roughly flushed by the first cleaning mechanism 3 to flush away most of the debris, and then further cleaning is performed by the second cleaning mechanism 5. By flushing at multiple angles, the PCB board is flushed to the angle that the first cleaning mechanism 3 cannot clean, so that the PCB board is roughly cleaned. Then, when there are pollutants that are difficult to clean and need to be cleaned, the pollutants are cleaned by liquid medicine, or when liquid medicine cleaning is not required, water flow flushing is performed again to ensure that most of the debris is flushed away. Then, the PCB board enters the fourth cleaning mechanism 62. While the fourth cleaning mechanism 62 is flushing the PCB board, the outer wall of the roller brush can enter the hole wall for brushing, and directly brush away the debris attached to the hole wall that cannot be flushed away, thereby reducing the debris remaining in the hole wall. The PCB board then enters the ultrasonic cleaning mechanism 63, and the ultrasonic cleaning can clean the residual debris in the tiny gaps of the PCB board or in the hole wall, thereby cleaning the PCB board. Finally, the PCB board enters the fifth cleaning mechanism 7, and the fifth cleaning mechanism 7 can flush the PCB board more comprehensively, further reducing the possibility of residual debris on the PCB board, so that the PCB board is cleaned more thoroughly.

[0060] Reference Figure 1 and Fig. 9 A water absorption mechanism 8 is arranged on the top surface of the frame 1, and the absorption mechanism is located on one side of the fifth cleaning mechanism 7. The water absorption mechanism 8 includes a first water absorption sponge group and a second water absorption sponge group. The first water absorption sponge group includes a first water absorption sponge roller 81. The first water absorption sponge roller 81 is arranged between two adjacent rotating columns 221. The long side of the first water absorption sponge roller 81 is parallel to the long side of the rotating column 221. Both ends of the first water absorption sponge roller 81 are respectively rotatably connected to the mounting seats 11 close to it. One end of the first water absorption sponge roller 81 is connected to the rotating drive assembly 21. The connection method between the first water absorption sponge roller 81 and the rotating drive assembly 21 is consistent with the connection method between the rotating column 221 and the rotating drive assembly 21. In the embodiment of the present application, it is not described in detail. The rotation of the rotating shaft 211 can drive the first water absorption sponge roller 81 to rotate. There are multiple first water absorption sponge rollers 81, and the multiple first water absorption sponge rollers 81 are distributed along the long side direction of the frame 1.

[0061] The second absorbent sponge group includes a second absorbent sponge roller 82, the long side of the second absorbent sponge roller 82 is parallel to the long side of the rotating column 221, the second absorbent sponge roller 82 is arranged on the top of the first absorbent sponge roller 81, and the two ends of the second absorbent sponge roller 82 are respectively connected to the top of the mounting seat 11 close to it, and the connection method between the second absorbent sponge roller 82 and the mounting seat 11 is consistent with the connection method between the pressing component 41 and the mounting seat 11. In the embodiment of the present application, it is not described in detail. There are multiple second absorbent sponge rollers 82, and the multiple second absorbent sponge rollers 82 are distributed along the long side of the frame 1.

[0062] Reference Fig. 9 When the PCB board is cleaned, it moves to the water absorption mechanism 8, and the PCB board passes between the first water absorption roller 81 and the second water absorption roller 82. Under the action of the first water absorption roller 81 and the second water absorption roller 82, the bottom surface and the top surface of the PCB board are respectively absorbed, and the water flow on the surface of the PCB board is wiped.

[0063] A drying mechanism 9 is provided on the top surface of the frame 1, and the drying mechanism 9 is located on one side of the water absorption mechanism 8. The drying mechanism 9 includes a drying component 91, and the drying component 91 includes a drying box 911 and an air duct 912. The long side of the drying box 911 is parallel to the long side of the rotating column 221, and both ends of the drying box 911 are respectively installed on the mounting seats 11 close to it, and the drying box 911 is located between two adjacent pressing components 41. The opening of the drying box 911 is aligned with the rotating column 221, and one end of the air duct 912 is installed on the top of the drying box 911. The cavity of the air duct 912 is connected with the cavity of the drying box 911, and the wind enters the drying box 911 through the air duct 912, and then the wind is blown out from the opening of the drying box 911. There are multiple drying components 91, and the multiple drying components 91 are distributed along the long side direction of the frame 1.

[0064] After the PCB board absorbs water through the first water-absorbing sponge roller 81 and the second water-absorbing sponge roller 82, the PCB board enters the air-drying mechanism 9. When the PCB board moves to the bottom of the air-drying box 911, wind blows toward the PCB board from the bottom of the air-drying box 911, thereby drying the moisture on the surface of the PCB board and the moisture in the hole wall.

[0065] The embodiment of the present application also discloses a PCB board, which is cleaned by the above-mentioned PCB board hole cleaning device.

[0066] A PCB board comprises a board body, wherein a top surface of the board body is penetrated with a mounting hole, and the mounting holes are provided in a plurality and distributed on the top surface of the board body.

[0067] The above are all preferred embodiments of the present application. The embodiments are only explanations of the present application and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A PCB board hole cleaning device, characterized in that: include: Frame (1): a moving mechanism (2) is arranged on the top surface of the frame (1), the moving mechanism (2) is arranged along the long side of the frame (1), and the moving mechanism (2) is used to move the PCB board; A first cleaning mechanism (3): the first cleaning mechanism (3) comprises a first liquid supply component (31) and a spray component (32), one end of the spray component (32) is connected to the output end of the first liquid supply component (31), the spray component (32) is located on the top of the input end of the moving mechanism (2), and the first liquid supply component (31) is used to provide water flow to the spray component (32); A second cleaning mechanism (5): the second cleaning mechanism (5) is arranged on one side of the first cleaning mechanism (3), the second cleaning mechanism (5) comprises a first spraying assembly (52), the first spraying assembly (52) is arranged on the top of the moving mechanism (2), and the first spraying assembly (52) can spray water at an angle; Fourth cleaning mechanism (62): the fourth cleaning mechanism (62) is arranged on one side of the second cleaning mechanism (5), and the fourth cleaning mechanism (62) comprises a first roller brush (621) group, the first roller brush (621) group is rotatably connected to the top of the frame (1), and the first roller brush (621) group is used to brush the PCB board; Ultrasonic cleaning mechanism (63): the ultrasonic cleaning mechanism (63) is arranged on one side of the fourth cleaning mechanism (62), and the ultrasonic cleaning mechanism (63) can clean the PCB board by ultrasonic wave; Fifth cleaning mechanism (7): The fifth cleaning mechanism (7) is located on one side of the ultrasonic cleaning mechanism (63), and the fifth cleaning mechanism (7) can flush the PCB board in all directions.

2. A PCB board hole cleaning device according to claim 1, characterized in that: The third cleaning mechanism (61) is provided between the second cleaning mechanism (5) and the fourth cleaning mechanism (62). The third cleaning mechanism (61) can clean the PCB board with a liquid medicine or flush the PCB board with water.

3. A PCB board hole cleaning device according to claim 1, characterized in that: The top surface of the frame (1) is provided with a water absorption mechanism (8), the water absorption mechanism (8) is located on one side of the fifth cleaning mechanism (7), and the water absorption mechanism (8) is used to absorb water flow on the surface of the PCB board.

4. A PCB board hole cleaning device according to claim 3, characterized in that: The water absorption mechanism (8) comprises a first water absorption roller (81) and a second water absorption roller (82); the first water absorption roller (81) is rotatably connected to the top of the frame (1); the second water absorption roller (82) is rotatably connected to the top of the first water absorption roller (81); and the PCB board passes between the first water absorption roller (81) and the second water absorption roller (82).

5. A PCB board hole cleaning device according to claim 3, characterized in that: The top surface of the frame (1) is provided with an air-drying mechanism (9), the air-drying mechanism (9) is located on one side of the water-absorbing mechanism (8), and the air-drying mechanism (9) is used to air-dry the moisture on the PCB board.

6. A PCB board hole cleaning device according to claim 5, characterized in that: The air drying mechanism (9) comprises an air drying box (911) and an air duct (912); the air drying box (911) is installed on the top of the frame (1); the opening of the air drying box (911) is aligned with the moving mechanism (2); one end of the air duct (912) is connected to the top of the air drying box (911); and wind enters the air drying box (911) from the air duct (912).

7. A PCB board hole cleaning device according to claim 1, characterized in that: The fifth cleaning mechanism (7) comprises a mounting tube (731), a rotating tube and a third nozzle (732); the rotating tube is rotatably connected to the top of the frame (1); the top surface of the mounting tube (731) is connected to the bottom surface of the rotating tube; the cavity of the mounting tube (731) is connected to the cavity of the rotating tube; there are a plurality of third nozzles (732); the plurality of third nozzles (732) are obliquely arranged on the bottom surface of the mounting tube (731); and the inclination angles of the plurality of third nozzles (732) are different.

8. A PCB board hole cleaning device according to claim 7, characterized in that: The fifth cleaning mechanism (7) further comprises a rotating assembly (72), the output end of the rotating assembly (72) being assembled with the rotating tube, and the rotating assembly (72) being used to drive the rotating tube to rotate.

9. A PCB board hole cleaning device according to claim 1, characterized in that: A pressing mechanism (4) is arranged on the top of the moving mechanism (2), and the pressing mechanism (4) can be raised or lowered according to the thickness of the PCB board.

10. A PCB board, characterized in that: A PCB board hole cleaning device used for cleaning as described in any one of claims 1-9 comprises a board body, and a mounting hole is formed through the top surface of the board body.

Images