Metallization coating method for magnetic attraction jig
By using an ultrasonic cleaning machine and argon plasma activation treatment during the coating process of magnetic suction fixtures, combined with ALD technology and real-time environmental parameter monitoring and adjustment, the problems of insufficient adhesion of the coating and inaccurate environmental parameter regulation are solved, and the coating is high stability, uniformity and consistency are achieved.
Patent Information
- Application Number
- CN202510303468.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2045-03-14
AI Technical Summary
Traditional coating methods are difficult to ensure uniformity and adhesion of coatings under complex structures or high precision requirements, especially in magnetic suction fixtures, which may lead to unstable coating quality and affect product performance.
The substrate surface is cleaned by an ultrasonic cleaning machine, and argon is selected for plasma activation treatment. Combined with atomic layer deposition (ALD) technology, the environmental parameter range of the reaction chamber is set, and an integrated sensor is used to monitor the environmental parameters during the deposition process in real time, and adjust the measures are automatically triggered to ensure uniformity and consistency of the coating.
By improving the bonding force between the substrate and the plating layer, the stability and durability of the plating layer are improved, the problem of insufficient adhesion of the plating layer is solved, and the uniformity and consistency of the plating layer is ensured by precise control of the plating process, and the problem of inaccurate environmental parameter regulation is solved.
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Figure CN120099495A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of atomic layer deposition of nano-coatings, in particular to a metallization coating method for a magnetic fixture. Background Art
[0002] Metallization coating technology is widely used in the fields of microelectronics, optoelectronics and materials science, and is particularly important in the manufacture of magnetic fixtures. Traditional PVD and CVD technologies have gradually shown their limitations and are unable to meet the needs of modern industry for high-performance materials. In recent years, atomic layer deposition (ALD) technology has attracted much attention due to its nanoscale thickness control, high uniformity and excellent step coverage capability. ALD forms a single atomic layer on the substrate surface by alternately injecting precursors and reactive gases, ensuring high consistency and high quality of the coating.
[0003] Traditional coating methods have difficulty ensuring coating uniformity and adhesion under complex structures or high-precision requirements, especially in magnetic fixture applications, which may lead to unstable coating quality and affect product performance. The main problem lies in inconsistent thickness on a microscopic scale and inaccurate environmental parameter control, which cannot dynamically respond to changes and affect overall quality and stability. Summary of the invention
[0004] In view of the above existing problems, the present invention is proposed.
[0005] Therefore, the present invention provides a magnetic fixture metallization coating method to solve the problems of insufficient coating adhesion and inaccurate environmental parameter control.
[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:
[0007] In a first aspect, the present invention provides a method for metallizing a magnetic fixture, which comprises:
[0008] Clean the surface of the substrate using an ultrasonic cleaner, transfer the cleaned substrate to a low-temperature plasma device, and select argon gas for plasma activation treatment;
[0009] Prepare the precursor solution and store it under inert gas protection, and install the plasma-activated substrate into the ALD fixture;
[0010] Start ALD, set the reaction gas and cycle parameters for each cycle, and quantitatively deliver the precursor solution to the ALD reaction chamber each time to perform deposition operations;
[0011] Set the range of reaction chamber environmental parameters, use integrated temperature sensors, humidity sensors and pressure sensors to monitor the environmental parameters during the deposition process in real time, and automatically trigger adjustment measures when deviations from the reaction chamber environmental parameter range are detected;
[0012] Turning off the ALD to form a nano-coating, collecting characteristic parameters of the nano-coating, and performing low-temperature annealing on the nano-coating according to the characteristic parameters of the nano-coating to obtain a coating sample;
[0013] X-ray diffraction, scanning electron microscopy, atomic force microscopy and ellipsometry are used to analyze the microstructure and physical properties of the coating samples to form characteristic data of the coating samples;
[0014] According to the characteristic data of the coating samples and the characteristic data of the historical coating samples, it is judged whether the coating samples meet the standards. If the coating samples do not meet the standards, corrections are made until the coating samples meet the standards.
[0015] As a preferred embodiment of the metallization coating method for the magnetic fixture of the present invention, the surface of the substrate is cleaned by an ultrasonic cleaning machine, the cleaned substrate is transferred to a low-temperature plasma device, and argon gas is selected for plasma activation treatment. The specific steps are as follows:
[0016] Mixing deionized water and a surfactant in proportion to obtain a cleaning solution, and completely immersing the substrate to be treated in the cleaning solution;
[0017] Turn on the ultrasonic cleaning machine and set the frequency, power and cleaning time;
[0018] The cleaned substrate is transferred to a low-temperature plasma device, argon gas is selected for plasma activation treatment, and the argon gas flow rate, power supply power and treatment time of the plasma activation treatment are set.
[0019] As a preferred embodiment of the magnetic fixture metallization coating method of the present invention, the precursor solution is prepared and stored under the protection of an inert gas, and the plasma-activated substrate is installed in the ALD fixture. The specific steps are as follows:
[0020] Dissolving tetraethoxysilane in an organic solvent to obtain a precursor solution, and storing the solution using nitrogen as a protective gas;
[0021] The impurities in the reaction chamber are purged using nitrogen gas, and the substrate that has been subjected to plasma activation is transferred from the low-temperature plasma equipment to the loading area of the ALD, and the substrate is fixed in a fixture.
[0022] As a preferred solution of the magnetic fixture metallization coating method of the present invention, wherein: the ALD is started, the reaction gas and cycle parameters of each cycle are set, and the precursor solution is quantitatively delivered to the ALD reaction chamber each time to perform the deposition operation. The specific steps are as follows:
[0023] The reaction gases are nitrogen and oxygen;
[0024] The cycle parameters refer to the alternating injection time and pulse interval of nitrogen and oxygen in each cycle;
[0025] The precursor solution is quantitatively delivered to the ALD reaction chamber through a mass flow controller for deposition operation.
[0026] As a preferred solution of the magnetic fixture metallization coating method of the present invention, wherein: the reaction chamber environmental parameter range is set, and the environmental parameters in the deposition process are monitored in real time using an integrated temperature sensor, a humidity sensor, and a pressure sensor. When a deviation from the reaction chamber environmental parameter range is detected, adjustment measures are automatically triggered. The specific steps are as follows:
[0027] The environmental parameters refer to the temperature, relative humidity and air pressure of the reaction chamber;
[0028] Setting the range of environmental parameters of the reaction chamber according to the environmental parameters in the historical deposition process;
[0029] Deploy integrated temperature sensors, humidity sensors, and pressure sensors in the reaction chamber to monitor the environmental parameters of the ALD reaction chamber in real time;
[0030] An intelligent control device is equipped and connected to all sensors. When it is monitored that the environmental parameters during the deposition process exceed the environmental parameter range of the reaction chamber, the environmental parameters of the reaction chamber are automatically restored to the range of the environmental parameters of the reaction chamber through pre-programmed logic.
[0031] As a preferred solution of the magnetic fixture metallization coating method of the present invention, wherein: the ALD is turned off to form a nano-coating, characteristic parameters of the nano-coating are collected, and the nano-coating is subjected to low-temperature annealing treatment according to the characteristic parameters of the nano-coating to obtain a coating sample. The specific steps are as follows:
[0032] After the deposition operation is completed, the ALD reaction gas supply and precursor solution delivery channel are closed;
[0033] Allow the temperature of the reaction chamber to cool down naturally;
[0034] Collect nano-coating characteristic parameters using integrated measurement instruments;
[0035] The characteristic parameters of the nano-plating layer refer to the crystal quality, uniformity, adhesion, internal stress and corrosion resistance of the nano-plating layer;
[0036] Setting nano-plating state parameters according to historical nano-plating characteristic parameters, comparing the nano-plating characteristic parameters with the nano-plating state parameters, and recording the deviation of the nano-plating characteristic parameters to form a state comparison result;
[0037] According to the state comparison result, the low-temperature annealing temperature and annealing time are set for the nano-coating, and the annealing treatment is performed to obtain a coating sample.
[0038] As a preferred solution of the magnetic fixture metallization coating method of the present invention, wherein: the microstructure and physical properties of the coating sample are analyzed by X-ray diffraction, scanning electron microscopy, atomic force microscopy and ellipsometry spectrometer to form characteristic data of the coating sample, and the specific steps are as follows:
[0039] Use X-ray diffraction to measure the coating sample, record the diffraction spectrum, analyze the crystal structure of the coating sample by the Bragg equation, and obtain the crystal plane spacing and lattice parameters of the coating sample;
[0040] The coating samples were observed by scanning electron microscopy to obtain microscopic morphology images, and the surface uniformity of the coating samples was evaluated by grayscale analysis and surface feature statistics;
[0041] The coating samples were scanned using an atomic force microscope to form an AFM image, and the roughness and flatness of the coating samples were calculated using surface profile analysis and statistical methods.
[0042] The coating samples were tested using an ellipsometer, the data on the reflectivity changing with wavelength were recorded, and the optical constants were calculated by fitting the multilayer film optical model;
[0043] The crystal plane spacing and lattice parameters of the coating sample, the uniformity of the coating sample surface, the roughness and flatness of the coating sample and the optical constants of the coating sample are integrated into the coating sample characteristic data.
[0044] As a preferred solution of the magnetic fixture metallization coating method of the present invention, wherein: the coating sample is judged whether it meets the standard according to the coating sample characteristic data and the historical coating sample characteristic data, and when the coating sample does not meet the standard, correction is performed until the coating sample meets the standard. The specific steps are as follows:
[0045] Setting performance benchmark parameters based on historical coating sample characteristic data;
[0046] Compare the characteristic data of the coating samples with the performance benchmark parameters to obtain performance comparison results;
[0047] For the performance comparison results where all the characteristic data of the coating samples meet the performance benchmark parameters, it is judged as meeting the standards. For the performance comparison results where all the characteristic data of the coating samples do not meet the performance benchmark parameters, it is judged as not meeting the standards, and the deviation of the parameters of the non-meeting coating samples is recorded to form a deviation report;
[0048] Correct the coating samples according to the deviation report until the coating samples meet the standards.
[0049] In a second aspect, the present invention provides a computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: when the computer program is executed by the processor, any step of the magnetic fixture metallization coating method as described in the first aspect of the present invention is implemented.
[0050] In a third aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein: when the computer program is executed by a processor, any step of the method for metallization coating of a magnetic fixture as described in the first aspect of the present invention is implemented.
[0051] The beneficial effects of the present invention are as follows: by using an ultrasonic cleaner to clean the surface of the substrate and selecting argon gas for plasma activation treatment, a strong bonding force between the substrate and the coating is ensured, the stability and durability of the coating are improved, and the problem of insufficient adhesion of the coating is solved; by setting the environmental parameter range of the reaction chamber and using an integrated sensor to monitor the environmental parameters during the deposition process in real time, adjustment measures are automatically triggered when deviations are detected, thereby achieving highly precise control of the coating process, ensuring the uniformity and consistency of the coating, and solving the problem of inaccurate environmental parameter regulation. BRIEF DESCRIPTION OF THE DRAWINGS
[0052] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.
[0053] Figure 1 This is a flow chart of the metallization coating method for the magnetic fixture in Example 1.
[0054] Figure 2 This is a schematic diagram for determining whether the coating sample meets the standards in Example 1. DETAILED DESCRIPTION
[0055] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.
[0056] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0057] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.
[0058] Example 1, reference Figure 1 and Figure 2 , which is the first embodiment of the present invention, provides a method for metallization coating of a magnetic fixture, comprising the following steps:
[0059] S1: Use an ultrasonic cleaner to clean the surface of the substrate, transfer the cleaned substrate to a low-temperature plasma device, and select argon gas for plasma activation treatment.
[0060] The specific steps are as follows:
[0061] S1.1, deionized water and a surfactant are mixed in a ratio of 95:5 to obtain a cleaning solution, and the substrate to be treated is completely immersed in the cleaning solution;
[0062] The concentration of surfactant is 0.5% to 1% to achieve the best cleaning effect without damaging the substrate material.
[0063] The temperature of the cleaning solution is controlled within the range of 25 degrees Celsius ± 5 degrees Celsius to prevent thermal stress damage to the substrate caused by excessive temperature.
[0064] S1.2, turn on the ultrasonic cleaning machine, set the frequency to 40kHz, the power to 100W and the cleaning time to 15 minutes;
[0065] During the cleaning process, check the liquid level in the cleaning tank regularly to ensure that the liquid always covers the substrate to avoid incomplete cleaning of local areas.
[0066] S1.3. The cleaned substrate is transferred to a low-temperature plasma device, argon gas is selected for plasma activation treatment, and the argon gas flow rate of the plasma activation treatment is set to 30 sccm, the power supply power is 200 W, and the treatment time is 5 minutes.
[0067] During the substrate transfer process, dust-free gloves and special tools must be used to prevent secondary contamination.
[0068] Before processing, the vacuum degree inside the equipment should reach 10^-6Torr to provide a pure working environment and avoid impurities interfering with the plasma activation process.
[0069] S2: Prepare the precursor solution and store it under inert gas protection, and install the plasma-activated substrate into the ALD fixture.
[0070] The specific steps are as follows:
[0071] S2.1. In a clean room environment, prepare a glass container, dissolve tetraethoxysilane in an organic solvent, ensure that the temperature in the clean room environment is controlled between 20 degrees Celsius and 25 degrees Celsius, and the relative humidity is less than 30%, obtain a precursor solution, and use nitrogen as a protective gas for storage;
[0072] The glass container was sealed and connected to a nitrogen supply line to remove air through continuous flow to establish an inert atmosphere, ensure that the internal pressure was higher than the external atmospheric pressure, and prevent external air from infiltrating.
[0073] S2.2. Turn on the ALD equipment, start the internal purification program, use nitrogen to remove impurities in the reaction chamber, transfer the plasma-activated substrate from the low-temperature plasma equipment to the loading area of the ALD, and fix the substrate in the fixture. The entire process must be completed in the glove box to ensure the purity of the operating environment.
[0074] The time for removing impurities in the reaction chamber is 5 minutes. When the substrate is fixed in the fixture, ensure that the contact surface between the substrate and the fixture is flat and tightly fitted to ensure uniform distribution of temperature and pressure during the deposition process.
[0075] S3: Start ALD, set the reaction gas and cycle parameters for each cycle, and quantitatively deliver the precursor solution to the ALD reaction chamber each time to perform deposition operations.
[0076] The specific steps are as follows:
[0077] S3.1. Reactive gas refers to nitrogen with a purity of more than 99.999% and oxygen with a purity of more than 99.999%;
[0078] Nitrogen is mainly used for purging during precursor pulses to prevent cross-contamination between different precursors; oxygen is used to promote chemical reactions. The two gases need to be precisely controlled by independent mass flow controllers to ensure the consistency and stability of the injection amount each time.
[0079] S3.2, cycle parameters refer to the alternating injection time of nitrogen and oxygen in each cycle is 0.5 seconds and 1 second respectively and the pulse interval is 1 second;
[0080] A single atomic layer is deposited in each cycle, and the cycle is stopped when the coating thickness reaches 50nm. In actual operation, the coating thickness can be set according to the specific application to adapt to different substrate materials and coating requirements.
[0081] S3.3. Deliver 20 sccm of precursor solution to the ALD reaction chamber via a mass flow controller for deposition operation.
[0082] The delivery of the precursor solution must be strictly synchronized with the injection of the reaction gas. The plasma source is started immediately after each oxygen injection, and the power is set to 150W and the duration is 1 second. After each precursor pulse, the reaction chamber should be purged with nitrogen immediately to remove unreacted precursors and by-products to prevent residues from affecting the subsequent deposition process.
[0083] S4: Setting the environmental parameter range of the reaction chamber, using the integrated temperature sensor, humidity sensor and pressure sensor to monitor the environmental parameters in the deposition process in real time, and automatically triggering adjustment measures when deviations from the environmental parameter range of the reaction chamber are detected.
[0084] The specific steps are as follows:
[0085] S4.1. Environmental parameters refer to the temperature, relative humidity and air pressure of the reaction chamber. The temperature, relative humidity and air pressure of the reaction chamber have a direct impact on the quality of the coating, so they need to be strictly controlled;
[0086] S4.2. Collect and analyze the environmental parameters of multiple batches of historical deposition processes to calculate the optimal range of each environmental parameter, and set the environmental parameter range of the reaction chamber to: temperature within the range of 25 degrees Celsius ± 2 degrees Celsius, relative humidity within the range of 30% ± 5%, and air pressure between 10^-6 Torr and 10^-7 Torr;
[0087] S4.3. Deploy integrated temperature sensors, humidity sensors, and pressure sensors in the reaction chamber to monitor the environmental parameters of the ALD reaction chamber in real time. The sensors should be selected with high precision and fast response to ensure that changes in environmental parameters can be captured in a timely and accurate manner.
[0088] Use sensors with self-calibration function and calibrate them regularly to ensure the accuracy of measurement data.
[0089] S4.4. An intelligent control device with powerful data processing capability and automatic control function is connected to all sensors. When it is detected that the environmental parameters in the deposition process exceed the environmental parameter range of the reaction chamber, the environmental parameters of the reaction chamber are automatically restored to the range of the environmental parameters of the reaction chamber through pre-programmed logic.
[0090] React quickly according to pre-programmed logic rules, for example, when the temperature is too high, start the cooling system; when the humidity is below the set value, increase the moisture supply; when the air pressure is too high, start the vacuum pump.
[0091] S5: turning off the ALD to form a nano-coating, collecting characteristic parameters of the nano-coating, and performing low-temperature annealing treatment on the nano-coating according to the characteristic parameters of the nano-coating to obtain a coating sample.
[0092] The specific steps are as follows:
[0093] S5.1. When the deposition thickness reaches 50 nm, that is, the deposition operation is completed, the ALD reaction gas supply and precursor solution delivery channel are turned off, and then the plasma source power is gradually reduced until it is completely turned off;
[0094] Automatic control is used during this process to ensure the closing sequence is correct and to avoid equipment damage and coating contamination caused by human operating errors.
[0095] Allow the temperature of the reaction chamber to cool naturally to 25 degrees Celsius;
[0096] The natural cooling process should be carried out slowly to avoid adverse effects of sudden temperature changes on the coating structure.
[0097] The entire cooling process takes about 30 minutes to 1 hour, depending on the volume and initial temperature of the reaction chamber.
[0098] To ensure uniform cooling, an inert gas (such as nitrogen) can be introduced to assist in heat dissipation, while maintaining a slightly positive pressure environment in the chamber to prevent pollutants from the outside air from entering.
[0099] S5.2. Collect nano-coating characteristic parameters using X-ray diffraction, scanning electron microscopy, atomic force microscopy, and spectroscopic ellipsometry;
[0100] These instruments should be calibrated before each measurement to ensure the accuracy and reliability of the data.
[0101] S5.3. The characteristic parameters of nano-coating refer to the crystal quality, uniformity, adhesion, internal stress and corrosion resistance of nano-coating. These parameters help to fully understand the quality and performance of the coating;
[0102] S5.4. Statistically analyze the historical nano-coating characteristic parameters from multiple batches to obtain the average value and standard deviation, use them as a reference benchmark, set the nano-coating state parameters, compare the nano-coating characteristic parameters with the nano-coating state parameters, and record the deviation of the nano-coating characteristic parameters to form a state comparison result;
[0103] The nano-coating state parameters are set as follows: the interplanar spacing of the crystalline quality is 0.34nm, the uniformity deviation is less than 5%, the adhesion is greater than 10N, the internal stress is less than 100MPa, and the corrosion resistance passes the 100-hour salt spray test. Considering the specific requirements of different application scenarios, a certain fluctuation range is allowed.
[0104] S5.5. According to the state comparison results, the low-temperature annealing temperature and annealing time are set for the nano-coating, and annealing treatment is performed. The annealing treatment should be performed in a dedicated annealing furnace to ensure uniform temperature distribution and avoid local overheating or uneven cooling. After the annealing treatment is completed, the coating sample is obtained.
[0105] If the crystallization quality, uniformity, adhesion, internal stress and corrosion resistance of the nano-coating are up to standard, the annealing temperature is set at 200 degrees Celsius and the duration is 30 minutes.
[0106] If the crystallization quality, uniformity, adhesion, internal stress and corrosion resistance of the nano-coating do not meet the standards, the low-temperature annealing temperature can be increased to between 220 degrees Celsius and 250 degrees Celsius, and the annealing time can be extended to 60 minutes to 90 minutes to optimize the overall performance of the coating.
[0107] In addition, targeted adjustments can be made based on specific parameters that do not meet the standards: if the crystallization quality does not meet the standards, the annealing temperature can be appropriately increased to promote the rearrangement and optimization of the crystal structure.
[0108] If the uniformity deviation is greater than 5%, extend the annealing time to ensure uniform temperature distribution and reduce local differences.
[0109] If the adhesion is less than 10N, increase the annealing temperature and extend the annealing time to enhance the bonding strength between the coating and the substrate.
[0110] If the internal stress is greater than 100MPa, appropriately lower the annealing temperature or extend the annealing time to relieve the internal stress.
[0111] If the corrosion resistance does not meet the standard, increase the annealing temperature and extend the annealing time to improve the density and chemical stability of the coating.
[0112] S6: X-ray diffraction, scanning electron microscopy, atomic force microscopy and ellipsometry are used to analyze the microstructure and physical properties of the coating samples to form characteristic data of the coating samples.
[0113] The specific steps are as follows:
[0114] S6.1. Use X-ray diffraction to measure the coating sample, start the XRD equipment and start data acquisition, record the diffraction spectrum, analyze the crystal structure of the coating sample by the Bragg equation, and obtain the interplanar spacing and lattice parameters of the coating sample;
[0115] Fix the coated sample on the sample stage of the XRD instrument to ensure that the sample surface is perpendicular to the X-ray beam.
[0116] Select a Cu Kα radiation source (wavelength ), because its energy is suitable for lattice constant determination of most materials, and the scanning range is set to the 2θ angle interval of 10° to 80°.
[0117] S6.2. Observe the coating sample by scanning electron microscopy, perform SEM imaging on multiple sample points, obtain microscopic morphology images, and evaluate the uniformity of the coating sample surface by grayscale analysis and surface feature statistics;
[0118] The coated samples can be treated with a conductive coating to avoid charging effects that affect the imaging quality.
[0119] Adjust the working parameters of SEM, such as setting the acceleration voltage to 15 kV and the working distance to about 10 mm, to ensure image resolution and contrast.
[0120] S6.3, installing a probe on an atomic force microscope, scanning the coating sample using the atomic force microscope to form an AFM image, and calculating the roughness and flatness of the coating sample by surface profile analysis and statistical methods;
[0121] Set the scan area and resolution, e.g. 1 μm x 1 μm area with a resolution of 512 x 512 pixels.
[0122] S6.4. Calibrate the EP instrument, verify the measurement accuracy using standard samples with known optical constants, test the coating samples using ellipsometer, record the data of reflectivity variation with wavelength, and calculate the optical constants by fitting the multilayer film optical model;
[0123] Place the coated sample on the EP test platform and adjust the incident angle to usually 70° to optimize signal strength and sensitivity.
[0124] S6.5. Integrate the crystal plane spacing and lattice parameters of the coating sample, the uniformity of the coating sample surface, the roughness and flatness of the coating sample, and the optical constants (refractive index and extinction coefficient) of the coating sample into coating sample characteristic data, and store them in a database.
[0125] Each data should be accompanied by detailed measurement conditions and parameter settings to ensure data traceability and consistency.
[0126] Data analysis tools can be used to comprehensively evaluate various characteristic parameters and generate charts and reports to intuitively display the overall performance of the coating. The final characteristic data will provide an important basis for optimizing the coating process and improving product quality.
[0127] S7: Determine whether the coating sample meets the standard based on the coating sample characteristic data and the historical coating sample characteristic data. If the coating sample does not meet the standard, make corrections until the coating sample meets the standard.
[0128] The specific steps are as follows:
[0129] S7.1. Based on the characteristic data of historical coating samples from multiple batches, the average value and standard deviation are obtained through statistical analysis, and the performance benchmark parameters are set;
[0130] The performance benchmark parameters are set as follows: the interplanar spacing is 0.34nm, the lattice parameter of silicon dioxide is The uniformity of the surface of the coating sample is less than 5%, the roughness of the coating sample is 0.8 nm, the flatness of the coating sample is 0.5 nm, the refractive index of the coating sample is 1.6, and the extinction coefficient of the coating sample is 0.005.
[0131] A tolerance range of ±5% is set to take into account fluctuations in actual production.
[0132] S7.2. Use MATLAB to compare the coating sample characteristic data with the performance benchmark parameters to obtain performance comparison results;
[0133] Using MATLAB to compare the coating sample characteristic data with the performance benchmark parameters can ensure that each characteristic parameter can accurately match the corresponding benchmark parameter.
[0134] S7.3. For the performance comparison results where all the characteristic data of the coating samples meet the performance benchmark parameters, it is judged that they meet the standards. For the performance comparison results where all the characteristic data of the coating samples do not meet the performance benchmark parameters, it is judged that they do not meet the standards, and the deviation of the parameters of the non-standard coating samples is recorded to form a deviation report. When judging whether the standards are met, the evaluation should be carried out strictly in accordance with the set tolerance range. For the case where some parameters are close to the critical values, it is recommended to conduct a secondary verification to ensure their stability;
[0135] The deviation report of the substandard coating samples should record in detail the specific values, deviation percentages and possible influencing factors of each unqualified parameter. This report is not only used to correct the current batch, but also should be archived for future reference as a reference for future process optimization.
[0136] S7.4. Correct the corresponding parameters of the coating sample according to the deviation parameters in the deviation report until the coating sample meets the standards.
[0137] If the interplanar spacing is greater than 0.34 nm, a secondary low-temperature annealing treatment is performed.
[0138] If the lattice parameters deviate from the standard value, the coated sample is subjected to ion beam etching or chemical etching to remove part of the surface material, and then ALD deposition is performed again.
[0139] If the surface uniformity is greater than 5%, a planarization process is used to eliminate the surface height differences through physical and chemical means at the same time.
[0140] If the roughness is greater than 0.8 nm, atomic layer deposition post-treatment technology is used to reduce the surface roughness.
[0141] If the flatness is greater than 0.5 nm, apply chemical mechanical polishing to the plated sample.
[0142] If the refractive index is lower than 1.6, high refractive index elements are introduced into the coating by plasma enhanced treatment.
[0143] If the extinction coefficient is higher than 0.005, annealing treatment is performed to remove surface impurities.
[0144] This embodiment also provides a computer device, which is suitable for the metallization coating method of a magnetic fixture, including: a memory and a processor; the memory is used to store computer executable instructions, and the processor is used to execute computer executable instructions to implement the metallization coating method of a magnetic fixture as proposed in the above embodiment.
[0145] The computer device may be a terminal, and the computer device includes a processor, a memory, a communication interface, a display screen and an input device connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be achieved through WIFI, an operator network, NFC (near field communication) or other technologies. The display screen of the computer device may be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device may be a touch layer covering the display screen, or a key, trackball or touchpad provided on the housing of the computer device, or an external keyboard, touchpad or mouse, etc.
[0146] The present embodiment also provides a storage medium on which a computer program is stored. When the program is executed by a processor, the method for realizing the metallization coating of a magnetic fixture as proposed in the above embodiment is realized; the storage medium can be realized by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (Static Random Access Memory, referred to as SRAM), electrically erasable programmable read-only memory (Electrically Erasable Programmable Read-Only Memory, referred to as EEPROM), erasable programmable read-only memory (Erasable Programmable Read Only Memory, referred to as EPROM), programmable read-only memory (Programmable Red-Only Memory, referred to as PROM), read-only memory (Read-Only Memory, referred to as ROM), magnetic storage, flash memory, disk or optical disk.
[0147] In summary, the present invention uses an ultrasonic cleaner to clean the surface of the substrate and selects argon gas for plasma activation treatment to ensure a strong bonding force between the substrate and the coating, improves the stability and durability of the coating, and solves the problem of insufficient adhesion of the coating. By setting the environmental parameter range of the reaction chamber and using an integrated sensor to monitor the environmental parameters during the deposition process in real time, adjustment measures are automatically triggered when deviations are detected, thereby achieving highly precise control of the coating process, ensuring the uniformity and consistency of the coating, and solving the problem of inaccurate regulation of environmental parameters.
[0148] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.
Claims
1. A method for metallizing a magnetic fixture, characterized in that: include, Clean the surface of the substrate using an ultrasonic cleaner, transfer the cleaned substrate to a low-temperature plasma device, and select argon gas for plasma activation treatment; Prepare the precursor solution and store it under inert gas protection, and install the plasma-activated substrate into the ALD fixture; Start ALD, set the reaction gas and cycle parameters for each cycle, and quantitatively deliver the precursor solution to the ALD reaction chamber each time to perform deposition operations; Set the range of reaction chamber environmental parameters, use integrated temperature sensors, humidity sensors and pressure sensors to monitor the environmental parameters during the deposition process in real time, and automatically trigger adjustment measures when deviations from the reaction chamber environmental parameter range are detected; Turning off the ALD to form a nano-coating, collecting characteristic parameters of the nano-coating, and performing low-temperature annealing on the nano-coating according to the characteristic parameters of the nano-coating to obtain a coating sample; X-ray diffraction, scanning electron microscopy, atomic force microscopy and ellipsometry are used to analyze the microstructure and physical properties of the coating samples to form characteristic data of the coating samples; According to the characteristic data of the coating samples and the characteristic data of the historical coating samples, it is judged whether the coating samples meet the standards. If the coating samples do not meet the standards, corrections are made until the coating samples meet the standards.
2. The method for metallizing and coating a magnetic fixture as claimed in claim 1, characterized in that: The substrate surface is cleaned by using an ultrasonic cleaning machine, the cleaned substrate is transferred to a low-temperature plasma device, and argon gas is selected for plasma activation treatment. The specific steps are as follows: Mixing deionized water and a surfactant in proportion to obtain a cleaning solution, and completely immersing the substrate to be treated in the cleaning solution; Turn on the ultrasonic cleaning machine and set the frequency, power and cleaning time; The cleaned substrate is transferred to a low-temperature plasma device, argon gas is selected for plasma activation treatment, and the argon gas flow rate, power supply power and treatment time of the plasma activation treatment are set.
3. The method for metallizing and coating a magnetic fixture as claimed in claim 2, characterized in that: The precursor solution is prepared and stored under the protection of an inert gas, and the plasma-activated substrate is installed in the ALD fixture. The specific steps are as follows: Dissolving tetraethoxysilane in an organic solvent to obtain a precursor solution, and storing the solution using nitrogen as a protective gas; The impurities in the reaction chamber are purged using nitrogen gas, and the substrate that has been subjected to plasma activation is transferred from the low-temperature plasma equipment to the loading area of the ALD, and the substrate is fixed in a fixture.
4. The method for metallizing and coating a magnetic fixture as claimed in claim 3, characterized in that: The ALD is started, the reaction gas and cycle parameters of each cycle are set, and the precursor solution is quantitatively delivered to the ALD reaction chamber each time to perform the deposition operation. The specific steps are as follows: The reaction gases are nitrogen and oxygen; The cycle parameters refer to the alternating injection time and pulse interval of nitrogen and oxygen in each cycle; The precursor solution is quantitatively delivered to the ALD reaction chamber through a mass flow controller for deposition operation.
5. The method for metallizing and coating a magnetic fixture as claimed in claim 4, characterized in that: The reaction chamber environment parameter range is set, and the integrated temperature sensor, humidity sensor and pressure sensor are used to monitor the environment parameters in the deposition process in real time. When a deviation from the reaction chamber environment parameter range is detected, adjustment measures are automatically triggered. The specific steps are as follows: The environmental parameters refer to the temperature, relative humidity and air pressure of the reaction chamber; Setting the range of environmental parameters of the reaction chamber according to the environmental parameters in the historical deposition process; Deploy integrated temperature sensors, humidity sensors, and pressure sensors in the reaction chamber to monitor the environmental parameters of the ALD reaction chamber in real time; An intelligent control device is equipped and connected to all sensors. When it is monitored that the environmental parameters during the deposition process exceed the environmental parameter range of the reaction chamber, the environmental parameters of the reaction chamber are automatically restored to the range of the environmental parameters of the reaction chamber through pre-programmed logic.
6. The method for metallizing and coating a magnetic fixture as claimed in claim 5, characterized in that: The ALD is turned off to form a nano-coating, characteristic parameters of the nano-coating are collected, and low-temperature annealing is performed on the nano-coating according to the characteristic parameters of the nano-coating to obtain a coating sample. The specific steps are as follows: After the deposition operation is completed, the ALD reaction gas supply and precursor solution delivery channel are closed; Allow the temperature of the reaction chamber to cool down naturally; Collect nano-coating characteristic parameters using integrated measurement instruments; The characteristic parameters of the nano-plating layer refer to the crystal quality, uniformity, adhesion, internal stress and corrosion resistance of the nano-plating layer; Setting nano-plating state parameters according to historical nano-plating characteristic parameters, comparing the nano-plating characteristic parameters with the nano-plating state parameters, and recording the deviation of the nano-plating characteristic parameters to form a state comparison result; According to the state comparison result, the low-temperature annealing temperature and annealing time are set for the nano-coating, and the annealing treatment is performed to obtain a coating sample.
7. The method for metallizing and coating a magnetic fixture as claimed in claim 6, characterized in that: The X-ray diffraction, scanning electron microscope, atomic force microscope and ellipsometry spectrometer are used to analyze the microstructure and physical properties of the coating sample to form characteristic data of the coating sample. The specific steps are as follows: Use X-ray diffraction to measure the coating sample, record the diffraction spectrum, analyze the crystal structure of the coating sample by the Bragg equation, and obtain the crystal plane spacing and lattice parameters of the coating sample; The coating samples were observed by scanning electron microscopy to obtain microscopic morphology images, and the surface uniformity of the coating samples was evaluated by grayscale analysis and surface feature statistics; The coating samples were scanned using an atomic force microscope to form an AFM image, and the roughness and flatness of the coating samples were calculated using surface profile analysis and statistical methods. The coating samples were tested using an ellipsometer, the data on the reflectivity changing with wavelength were recorded, and the optical constants were calculated by fitting the multilayer film optical model; The crystal plane spacing and lattice parameters of the coating sample, the uniformity of the coating sample surface, the roughness and flatness of the coating sample and the optical constants of the coating sample are integrated into the coating sample characteristic data.
8. The method for metallizing and coating a magnetic fixture as claimed in claim 7, characterized in that: The method of judging whether the coating sample meets the standard based on the coating sample characteristic data and the historical coating sample characteristic data, and making corrections when the coating sample does not meet the standard until the coating sample meets the standard, is as follows: Setting performance benchmark parameters based on historical coating sample characteristic data; Compare the characteristic data of the coating samples with the performance benchmark parameters to obtain performance comparison results; For the performance comparison results where all the characteristic data of the coating samples meet the performance benchmark parameters, it is judged as meeting the standards. For the performance comparison results where all the characteristic data of the coating samples do not meet the performance benchmark parameters, it is judged as not meeting the standards, and the deviation of the parameters of the non-meeting coating samples is recorded to form a deviation report; Correct the coating samples according to the deviation report until the coating samples meet the standards.
9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the magnetic fixture metallization coating method according to any one of claims 1 to 8 are implemented.
10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the magnetic fixture metallization coating method according to any one of claims 1 to 8 are implemented.
Citation Information
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