Processing technology of plastic nozzle for coating mercury on semiconductor capillary tube

Abstract

The invention relates to the technical field of plastic nozzle processing, in particular to a processing technology of a plastic nozzle for mercury coating of a semiconductor capillary tube, which comprises the following steps: step 1, blank pretreatment: selecting a plastic blank to be processed for preheating treatment; 2, turning the outer diameter by a lathe, and clamping the pretreated blank on a numerical control lathe for turning the outer diameter; thirdly, the workpiece is clamped in a sequence turning mode, an inner hole is machined, and after the workpiece subjected to outer diameter turning is detached, the workpiece is clamped on a tool clamp of a horizontal machining center; and fourthly, burrs are removed. The processing technology has the effect of improving the production quality of the processing technology of the plastic nozzle in the processing process.

Description

Technical Field

[0001] This application relates to the field of plastic nozzle processing technology, and in particular to a processing technology for a plastic nozzle used for mercury coating of semiconductor capillaries. Background Technology

[0002] In semiconductor device packaging and capillary mercury coating processes, plastic nozzles, as core components for the precise delivery of micro-volume molten mercury, have stringent micron-level requirements for internal hole dimensional accuracy, coaxiality, surface finish, orifice integrity, and cleanliness. Tiny scratches, excessive roughness, coaxiality deviations, orifice burrs, or residual impurities in the internal hole can all lead to uneven mercury dripping, flow drift, and capillary blockage, directly affecting the yield and operational stability of semiconductor devices. In existing technologies, plastic nozzles are mostly processed using a single lathe machining method, where the outer diameter turning and inner hole drilling are completed in one operation on a lathe.

[0003] However, this traditional process has significant drawbacks: Firstly, lathe drilling uses ordinary twist drills, and the plasticity of the plastic material causes chips to easily adhere to the tool edge, resulting in scratches, scoring, and other defects on the inner hole surface. The surface roughness can only reach Ra1.6-Ra3.2μm, which cannot meet the requirements of high-precision applications for a Ra0.2μm level finish. Secondly, lathe drilling uses internal chip removal, and chip accumulation inside the hole can easily cause compression, leading to burrs at the hole opening. This requires an additional deburring process, which not only increases production costs but may also damage the inner hole accuracy due to secondary processing. Furthermore, the self-centering error of the tool is relatively large during single lathe machining, which can easily lead to coaxiality deviation between the inner hole and the outer diameter, affecting the nozzle's spray stability. Summary of the Invention

[0004] In order to improve the quality of the processing technology of plastic nozzles for semiconductor capillary mercury coating in the production process, this application provides a processing technology for plastic nozzles for semiconductor capillary mercury coating.

[0005] This application provides a processing technology for a plastic nozzle used in mercury coating of semiconductor capillaries, employing the following technical solution: A processing technology for a plastic nozzle for mercury coating of semiconductor capillary tubes, step one: pretreatment of blank, selecting the plastic blank to be processed and preheating it; Step 2: Turn the outer diameter on a lathe. The pre-treated blank is clamped on a CNC lathe for turning the outer diameter. Step 3: Workpiece transfer and internal hole machining. After the workpiece with the outer diameter turned is disassembled, it is clamped on the tooling fixture of the horizontal machining center. Step 4: Remove burrs; Step 5: Polishing and cleaning.

[0006] By adopting the above technical solution, the processing of plastic nozzles is divided into two independent processes: outer diameter turning and inner deep hole machining. The advantages of CNC lathes and horizontal machining centers are utilized to ensure both outer diameter accuracy and inner hole accuracy. Step-by-step positioning and datum conversion effectively reduce the cumulative machining error. At the same time, with the help of special deburring and cleaning processes, the surface finish of the inner hole, the coaxiality of the inner and outer circles, the integrity of the orifice, and the cleanliness of the finished product are significantly improved. This enables the processed plastic nozzles to meet the requirements of high precision and high stability, and solves the problems of insufficient surface finish, many burrs, poor coaxiality, and easy deformation that exist in traditional single lathe machining.

[0007] In one specific feasible implementation, the preheating temperature of the blank is 80-120℃, and the holding time is 1-2 hours.

[0008] By adopting the above technical solution, the internal residual stress generated in the plastic blank during molding and storage can be fully eliminated before processing, making the material structure more uniform and stable. This avoids problems such as workpiece deformation, dimensional drift, warping and twisting due to stress release during subsequent machining processes such as turning and drilling, ensuring the dimensional and shape accuracy of the workpiece throughout the entire processing flow, and improving processing consistency and finished product qualification rate.

[0009] In a specific feasible implementation, when turning the outer diameter, a carbide turning tool is used for outer diameter turning. The lathe turning parameters are set as follows: spindle speed 800-1500 rpm, feed rate 0.1-0.3 mm / r, and the outer diameter after turning is φ7.5 mm. The dimensional tolerance of the outer diameter after turning is controlled within ±0.02 mm. At the same time, a guide hole is machined at one end of the blank. The guide hole size is φ1.5 mm × 20 mm. The diameter of the guide hole is 0.1-0.25 mm smaller than the diameter of the target inner hole, and the depth is 3-5 mm. The concentricity requirement between the guide hole and the target hole is 0.05.

[0010] By adopting the above technical solutions, high-precision outer diameter dimensions and strict tolerance control provide a stable and reliable outer circle positioning reference for subsequent inner hole machining, ensuring positioning accuracy during the transition clamping process; the pre-machined guide hole can provide precise guidance for the gun drill entry, avoiding phenomena such as wobble, vibration, and edge chipping at the hole opening when the gun drill directly cuts in, reducing the difficulty of deep hole machining, while improving the straightness and coaxiality of inner hole machining, enabling subsequent gun drill to cut stably and improving the quality of inner hole forming.

[0011] In a specific feasible implementation, when the workpiece is clamped for transfer, it is calibrated using an outer diameter positioning datum, with a φ7.5mm outer diameter for positioning and coaxiality calibration to 0.008mm. The coaxiality error between the workpiece axis and the spindle axis of the horizontal machining center is ≤0.01mm. A carbide gun drill is installed, using a φ1.5mm carbide gun drill with a cone angle set to 118°, a front angle of -5° to 0°, and a rear angle of 5° to 8°. A guide sleeve is also provided, with an inner diameter of φ1.72mm and a length of 25mm. The clearance between the inner diameter of the guide sleeve and the outer diameter of the gun drill is ≤0.02mm, and the length of the guide sleeve is not less than 3 times the diameter of the gun drill.

[0012] By adopting the above technical solutions, using the precision-machined outer diameter as a unified positioning datum, clamping errors and datum conversion errors can be minimized, the coaxiality between the workpiece and the spindle can be strictly controlled, and the concentricity between the inner hole and the outer circle can be guaranteed. The high-precision gun drill and matching guide sleeve can provide stable cutting guidance and support, reduce cutting vibration and radial offset, and ensure the straightness and dimensional accuracy of deep hole machining. At the same time, the reasonable tool angle design is conducive to chip breaking, chip removal and reducing cutting resistance, thus improving machining stability.

[0013] In one specific feasible implementation, a water-based coolant is introduced when machining the inner hole. The water-based coolant has a pH value of 8.5-9.5, a viscosity of 0.8-2.0 mm² / s, a coolant pressure controlled at 0.8-1.2 MPa, and a flow rate of 15-20 L / min. The spindle speed is set to 1200-2500 rpm, and the machining command G85 is used for reaming cycle. The inner hole is φ1.72 mm in diameter and 50 mm in depth, with a feed rate of 0.1-0.2 mm / r.

[0014] By adopting the above technical solutions, high-pressure, high-flow-rate water-based coolant can directly reach the cutting area to achieve sufficient cooling, lubrication, and chip removal, effectively reducing cutting temperature, reducing tool wear, and preventing chip adhesion; G85 deep hole reaming facilitates timely chip removal and sufficient coolant entry, avoiding chip accumulation in the hole and scratching the inner wall, thereby significantly improving the surface finish and dimensional accuracy of the inner hole, and enabling the inner hole roughness to meet high precision requirements.

[0015] In a specific feasible implementation, flame deburring and dry ice deburring are used for deburring.

[0016] By adopting the above technical solutions, flame deburring can quickly melt the fine burrs and flash on the orifice and end face, with high processing efficiency; dry ice deburring utilizes low-temperature embrittlement and high-speed impact to remove residual burrs in small gaps and deep holes. The combination of the two methods achieves deburring without dead angles, and will not cause scratches, deformation or secondary damage to the workpiece surface, ensuring that the orifice is flat and smooth, and improving the appearance and performance of the finished product.

[0017] In one specific feasible implementation, the outer wall, inner hole, and inner cavity of the product are cleaned simultaneously during cleaning. Air is blown onto the outer wall of the finished product and air is drawn into the inner cavity. The rapidly moving airflow removes debris, impurities, and dust from the product surface and the cavity.

[0018] By adopting the above technical solution, a simultaneous cleaning method combining high-pressure air blowing on the outer wall and suction in the inner hole can be used to quickly and thoroughly remove machining debris, dust and impurities from the inside of deep holes, end face gaps and outer circular surfaces. This solves the problem that traditional cleaning methods are difficult to clean the inside of deep holes, ensures the cleanliness of the finished product, and avoids impurities affecting assembly accuracy and performance.

[0019] In one specific implementation scheme, a cleaning device is used during the cleaning process. The cleaning device includes a base box, a positioning platform is installed inside the base box, and an air jet is installed on the inner wall of the base box. The air jet is positioned above the positioning platform. The positioning platform has a positioning hole for inserting a plastic nozzle. An air extraction pipe is connected to the positioning platform and communicates with the positioning hole. An auxiliary positioning component is installed on the positioning platform. The positioning component includes a fixed rod, which is installed on the positioning platform. A telescopic sleeve is slidably installed on the fixed rod. A movable block is installed on the telescopic sleeve. A first spring is sleeved on the telescopic sleeve. A guide arc surface is provided on the movable block to guide the plastic nozzle.

[0020] By adopting the above technical solutions, the cleaning equipment can achieve rapid clamping, automatic positioning and stable clamping of plastic nozzles. The guide arc surface facilitates smooth insertion of workpieces, the positioning component ensures that the workpiece is centered and does not shift, and the air jet and air extraction structures work together to achieve synchronous airflow cleaning inside and outside. The overall structure is simple, easy to operate and reliable in positioning. It can complete efficient cleaning without damaging the surface of the workpiece, and improve the stability and efficiency of the cleaning process.

[0021] In one specific implementation scheme, a guide rod is installed on the positioning platform, and a support block is slidably installed on the guide rod. The bottom surface of the support block abuts against the positioning platform, and the top surface of the support block is separated from the positioning platform. A retaining strip is installed on the side of the support block near the positioning hole. A second spring is installed on the bottom surface of the support block. A lifting plate is connected to the end of the second spring away from the support block. The lifting plate can slide on the guide rod. A stop block is installed on the bottom surface of the lifting plate. A connecting plate is connected to the movable block. A support rod is installed on the connecting plate. The support rod abuts against the stop block, and the surface of the stop block that abuts against the support rod is cut into a bevel.

[0022] By adopting the above technical solution, the support block, lifting plate, stop block and movable block form a linkage mechanism, which automatically clamps the workpiece when it is inserted and slightly lifts the workpiece after it is inserted into place, so that a gap is formed between the end face of the workpiece and the positioning table, avoiding the end face from sticking and blocking, and ensuring that the airflow can blow the end face, outer wall and orifice of the workpiece in all directions, achieving cleaning without dead corners. At the same time, the elastic clamping structure will not damage the workpiece, improving the cleaning effect and the integrity rate of finished products.

[0023] In one specific implementation, the long side of the positioning platform has a gap with the inner wall of the base box, and the side of the positioning platform near the jet head has a chamfer.

[0024] By adopting the above technical solutions, the gap and chamfer structure can optimize the airflow direction inside the cleaning equipment, so that the airflow forms a stable circulation in the bottom box, which facilitates the rapid settling and collection of impurities and debris blown down, prevents dust splashing and secondary adhesion, improves cleaning efficiency and cleaning effect, and extends the equipment maintenance cycle.

[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. Significantly improved machining accuracy and coaxiality: This application adopts a step-by-step machining mode of precision turning the outer diameter on a lathe and gun drilling the deep hole on a machining center. The precision-turned φ7.5mm outer diameter is used as a unified positioning reference. With high-precision coaxiality calibration and positioning with a special guide sleeve, the coaxiality error between the inner hole and the outer diameter is strictly controlled within 0.015mm. This fundamentally solves the problems of large self-centering error and misalignment between the inner and outer circles in traditional single lathe machining, and greatly improves the flow uniformity, atomization effect and usage stability of the plastic nozzle.

[0026] 2. The inner hole surface finish reaches a high precision level. It adopts a carbide gun drill with a water-based coolant system and G85 reaming command. The chips can be quickly discharged without contacting, scraping or sticking to the hole wall, effectively avoiding defects such as scratches, scoring and pitting in the inner hole. The surface roughness of the inner hole is stably Ra0.2μm, which far exceeds the level of traditional process Ra1.6-Ra3.2μm. It fully meets the requirements of high-end application scenarios such as precision atomization, precision spraying, medical and electronic industries for high-precision nozzle inner hole surface finish. Attached Figure Description

[0027] Figure 1 This is a cross-sectional view of the molding nozzle according to an embodiment of this application.

[0028] Figure 2 This is a schematic diagram of a cleaning device according to an embodiment of this application.

[0029] Figure 3 This is a schematic diagram of the positioning stage according to an embodiment of this application.

[0030] Figure 4This is a schematic diagram of the positioning hole in an embodiment of this application.

[0031] Figure 5 This is a schematic diagram of an active block in an embodiment of this application.

[0032] Figure 6 This is a schematic diagram of a carrying block according to an embodiment of this application.

[0033] Reference numerals: 1. Forming nozzle; 2. Base box; 21. Positioning platform; 211. Chamfer; 212. Positioning hole; 213. Through hole; 214. Air extraction pipe; 22. Air jet head; 23. Positioning assembly; 231. Fixing rod; 232. Telescopic sleeve; 233. Movable block; 2331. Guide arc surface; 234. First spring; 235. Positioning strip; 236. Stop strip; 241. Guide rod; 242. Support block; 2421. Locking strip; 243. Second spring; 244. Lifting plate; 245. Abutment block; 246. Connecting plate; 247. Support rod. Detailed Implementation

[0034] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0035] This application discloses a processing technology for a plastic nozzle used in semiconductor capillary mercury coating, comprising the following steps: Step 1: Pre-treatment of blanks. Select the plastic blanks to be processed, such as engineering plastics like POM and PEEK, and preheat them at a temperature of 80-120℃ for 1-2 hours to eliminate internal stress and prevent deformation during processing.

[0036] Step 2: Turning the outer diameter on a lathe. The pre-treated blank is clamped on a CNC lathe, and the outer diameter is machined using a carbide cutting tool. The lathe turning parameters are set as follows: spindle speed 800-1500 rpm, feed rate 0.1-0.3 mm / r, outer diameter after turning is φ7.5 mm, and the tolerance of the outer diameter after turning is controlled within ±0.02 mm. Simultaneously, a guide hole is machined at one end of the blank. The guide hole size is φ1.5 mm × 20 mm, the diameter of the guide hole is 0.1-0.25 mm smaller than the target inner hole diameter, and the depth is 3-5 mm. The concentricity tolerance between the guide hole and the target hole is 0.05 mm, providing a positioning reference for subsequent gun drilling. Step 3: Workpiece transfer and clamping. After disassembling the workpiece that has completed outer diameter turning, clamp it onto the tooling fixture of the horizontal machining center. Calibrate using the outer diameter positioning datum, positioning with an outer diameter of φ7.5mm, and calibrating the coaxiality to 0.008mm to ensure that the coaxiality error between the workpiece axis and the spindle axis of the horizontal machining center is ≤0.01mm. At the same time, install a carbide gun drill that matches the target inner hole size. Select a φ1.5mm carbide gun drill with a cone angle set to 118°, a front angle of -5° to 0°, and a clearance angle of 5° to 8°. Equip it with a guide sleeve with an inner diameter of φ1.72mm and a length of 25mm. The clearance between the inner diameter of the guide sleeve and the outer diameter of the gun drill is ≤0.02mm, and the length of the guide sleeve is not less than 3 times the diameter of the gun drill to ensure the guiding accuracy of the gun drill machining.

[0037] Step 4: Gun drilling to machine the internal hole. Start the horizontal machining center and perform the following operations: First, turn on the cooling and lubrication system and introduce water-based coolant. The pH value of the water-based coolant is 8.5-9.5, the viscosity is 0.8-2.0 mm² / s, the coolant pressure is controlled at 0.8-1.2 MPa, and the flow rate is 15-20 L / min to ensure that the coolant fully enters the gun drill and reaches the drill bit. Start the spindle, set the spindle speed to 1200-2500 rpm, use machining command G85 to perform reaming cycle, machine the inner hole φ1.72mm, depth 50mm, feed speed 0.1-0.2mm / r, and use the V-groove external chip removal structure of the gun drill to remove the chips out of the hole in time; After drilling to the target hole depth, turn off the spindle rotation, keep the coolant circulating for 10-15 seconds to clean up any remaining chips, and then smoothly retract the tool, avoiding friction between the gun drill and the hole wall during the retraction process. Step 5: Remove burrs. First, use flame to remove burrs, and then use dry ice to remove burrs.

[0038] Step Six: Polishing, lathe polishing.

[0039] Step 7: Cleaning. Clean the finished product after processing. Clean the outer wall, inner hole and inner hole of the finished product at the same time. By blowing air on the outer wall of the finished product and sucking air into the inner hole, the fast-moving airflow removes debris, impurities and dust from the surface of the product and inside the hole.

[0040] Step 8: Finished product inspection. The finished plastic nozzles are inspected for quality. The surface roughness of the inner hole is checked with a profilometer, the diameter is checked with an inner diameter gauge, and the orifice is observed with a microscope to ensure that the inner hole surface finish reaches Ra0.2μm, the orifice diameter tolerance is ±0.02mm, there are no visible burrs at the orifice, and the coaxiality is ≤0.015mm.

[0041] Reference Figure 1 , Figure 1A cross-sectional view of the molded nozzle 1 after being processed and shaped using a plastic nozzle for mercury coating of semiconductor capillaries.

[0042] The internal hole is machined using a gun drill. Its external chip removal structure and special cooling and lubrication system prevent chips from adhering to and scratching the inner hole wall. Combined with the high-precision cutting performance of the carbide gun drill, the surface roughness of the inner hole reaches Ra0.2μm, which meets the requirements of precision nozzles and improves the surface finish compared with traditional lathe machining.

[0043] During gun drilling, chips are discharged directly through the V-groove, preventing them from being squeezed and accumulated at the hole opening. At the same time, the guide hole design avoids edge chipping when the gun drill enters the hole, achieving burr-free machining of the hole opening, eliminating the need for subsequent deburring processes, and improving production efficiency.

[0044] By using a step-by-step positioning method involving turning the outer diameter on a lathe and drilling with a gun drill on a horizontal machining center, the inner hole machining is calibrated based on the machined outer diameter. Combined with the positioning function of the gun drill guide sleeve, the coaxiality error between the inner hole and the outer diameter is controlled within 0.015mm, which is an improvement over traditional processes and ensures the stability of nozzle spraying.

[0045] Gun drilling features stable cutting performance and reliable chip removal. Combined with pretreatment of blanks to eliminate stress, it effectively avoids deformation and tool wear during plastic processing, thereby improving the processing qualification rate.

[0046] No additional specialized equipment is required. High-precision machining can be achieved simply by using existing lathes and horizontal machining centers in conjunction with mature gun drilling technology, reducing equipment investment costs, minimizing process steps, and shortening the production cycle.

[0047] This application also discloses a cleaning device for cleaning plastic nozzles during the processing of plastic nozzles, referring to... Figure 2 and Figure 3 The cleaning equipment includes a base box 2, a positioning platform 21 is fixedly installed inside the base box 2, the long side of the positioning platform 21 is separated from the inner wall of the base box 2, a jet head 22 is fixedly installed on the inner wall of the base box 2, a jet head 22 is provided on both sides of the positioning platform 21, the jet head 22 is located above the positioning platform 21, a chamfer 211 is provided on the side of the positioning platform 21 near the jet head 22, and the jet head 22 is connected to an air source.

[0048] Reference Figure 3 and Figure 4The positioning platform 21 has a positioning hole 212 for inserting a plastic nozzle, and a through hole 213 communicating with the positioning hole 212. The diameter of the through hole 213 is smaller than the diameter of the positioning hole 212. A vacuum pipe 214 is fixedly connected to the positioning platform 21, communicating with the positioning hole 212 through the through hole 213. A vacuum pump is connected to the end of the vacuum pipe 214 away from the positioning platform 21. The vacuum pump is existing technology. A positioning component 23 for auxiliary positioning is installed on the positioning platform 21.

[0049] Reference Figure 5 and Figure 6 The positioning component 23 includes a fixed rod 231, which is fixedly mounted on the positioning platform 21. A telescopic sleeve 232 is slidably mounted on the fixed rod 231. A movable block 233 is fixedly mounted on the telescopic sleeve 232. A first spring 234 is sleeved on the telescopic sleeve 232. One end of the first spring 234 is fixedly connected to the movable block 233, and the other end is fixedly connected to the positioning platform 21. The movable block 233 has a guide arc surface 2331 for guiding the plastic nozzle. A positioning strip 235 is fixedly mounted on the positioning platform 21, and a stop strip 236 is fixedly mounted on the movable block 233 to abut against and position the positioning strip 235.

[0050] A guide rod 241 is fixedly installed on the positioning platform 21. A support block 242 is slidably installed on the guide rod 241. The bottom surface of the support block 242 abuts against the positioning platform 21, while the top surface of the support block 242 is separated from the positioning platform 21. A retaining strip 2421, made of rubber, is fixedly installed on the side of the support block 242 near the positioning hole 212. A second spring 243, made of rubber, is fixedly installed on the bottom surface of the support block 242. A lifting plate 244 is fixedly connected to the end of the second spring 243 away from the support block 242. The lifting plate 244 can slide on the guide rod 241. A stop block 245 is fixedly installed on the bottom surface of the lifting plate 244. A connecting plate 246 is fixedly connected to the movable block 233. A support rod 247 is fixedly installed on the connecting plate 246. The support rod 247 abuts against the stop block 245, and the surface where the stop block 245 abuts against the support rod 247 is beveled.

[0051] When cleaning the nozzle after processing, insert the nozzle into the positioning hole 212. During the insertion process, the nozzle will first contact and press the retaining strip 2421 on the support block 242 to achieve a clamping function. As the nozzle is further inserted, it will contact the guide arc surface 2331 on the movable block 233. Through the action of the guide arc surface 2331, the nozzle will press the movable block 233 and slide on the fixed rod 231. When the movable block 233 moves, it will drive the connecting plate 246 to move, and the connecting plate 246 will drive the support rod 247. The movement utilizes the beveled surface of the abutment block 245, causing the support rod 247 to push the lifting plate 244 upward, pressing the second spring 243 to store elastic potential energy. It's important to note that when inserting the nozzle, the nozzle and positioning strip 235 remain pressed tightly together. As the nozzle compresses the movable block 233 to store elastic potential energy in the second spring 243, the nozzle moves downward relative to the support block 242. Through the friction between the support block 242 and the nozzle, the bottom surface of the support block 242 remains in contact with the positioning table 21. When the nozzle is inserted to the bottom of the positioning hole 212, the downward pressure is released, and the second spring 243 pushes the support block 242 upward. The support block 242 clamps the nozzle, raising it, and the top surface of the support block 242 contacts the positioning table 21, creating a gap between the nozzle's end face and the positioning table 21, facilitating cleaning of the nozzle's end face.

[0052] In this embodiment, the surface of the movable block 233 that contacts the nozzle is a smooth surface, and the spring constant of the first spring 234 is less than the spring constant of the second spring 243.

[0053] The implementation principle of this application embodiment is as follows: First, the plastic blank is preheated and kept warm to eliminate residual stress inside the material, so that the blank is not easily deformed and its dimensions are stable during subsequent cutting, thus ensuring the basic accuracy of processing from the source.

[0054] Secondly, the outer diameter is precision machined and the guide hole is pre-machined using a CNC lathe. The high-precision outer diameter serves as a unified benchmark and provides precise tool entry guidance for subsequent deep hole machining, avoiding drill runout and edge chipping at the hole opening, and ensuring the coaxiality of the inner and outer circles.

[0055] Subsequently, the precision-machined workpiece is transferred to a horizontal machining center, where the coaxiality is strictly calibrated based on the outer diameter. With the help of a high-precision carbide gun drill and a special guide sleeve, high straightness machining of deep holes is achieved. During the machining process, a combination of high-pressure water-based coolant, G85 reaming circulation, and external chip removal by the gun drill is used to ensure that the chips are discharged in time with the coolant, without scratching or sticking to the inner hole wall, thereby stabilizing the inner hole roughness at a high precision level of Ra0.2μm.

[0056] The deburring stage employs a combination of flame melting and dry ice low-temperature embrittlement impact to quickly remove surface burrs and obvious burrs, and then removes fine residual burrs from deep holes and orifices without secondary damage, ensuring a smooth and flat orifice.

[0057] During the cleaning stage, automated positioning and clamping are achieved through specialized cleaning equipment: When the nozzle is inserted into the positioning hole, it first contacts the rubber clip 2421 on the support block 242 and clamps it by relying on the elastic deformation of the rubber. As the nozzle is pressed down, the outer wall of the nozzle squeezes the guide arc surface 2331 of the movable block 233, pushing the movable block 233 to slide along the fixed rod 231 to compress the first spring 234, thereby achieving automatic centering and positioning of the nozzle.

[0058] When the movable block 233 moves, it drives the support rod 247 to move synchronously through the connecting plate 246. The support rod 247 pushes against the inclined surface of the abutment block 245, causing the lifting plate 244 to slide upward along the guide rod 241 and compress the second spring 243. When the nozzle is fully inserted into the bottom of the positioning hole 212, the downward pressure is released, and the second spring 243 releases its elastic potential energy, pushing the lifting plate 244 and the support block 242 to move upward as a whole. The support block 242 drives the nozzle to rise slightly, so that a stable gap is formed between the nozzle end face and the table surface of the positioning table 21, avoiding the end face from sticking and blocking, thus preventing cleaning.

[0059] At this time, the jet head 22 blows high-pressure airflow from both sides of the positioning platform to the outer wall and end face of the nozzle. At the same time, the suction pipe 214 sucks the inside of the positioning hole 212 through the through hole 213. The high-speed airflow blows and sucks the debris, dust and impurities on the surface, end face and deep inside the nozzle. With the help of the chamfer 211 of the positioning platform 21 and the gap structure between the side wall, the impurities settle and are collected smoothly without secondary splashing and adhesion.

[0060] The entire cleaning process relies on an elastic linkage mechanism to achieve automatic centering, automatic lifting, and flexible clamping, without scratching the nozzle surface or changing the nozzle size accuracy. At the same time, the convective airflow of external blowing and internal suction achieves all-round cleaning of deep holes, outer walls, and end faces without dead angles, ensuring that the cleanliness of the finished product meets the requirements of precision assembly.

[0061] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A processing technology for a plastic nozzle used in semiconductor capillary mercury coating, characterized in that: Includes the following steps: Step 1: Pre-treatment of blanks, select the plastic blanks to be processed and preheat them; Step 2: Turn the outer diameter on a lathe. The pre-treated blank is clamped on a CNC lathe for turning the outer diameter. Step 3: Workpiece transfer and internal hole machining. After the workpiece with the outer diameter turned is disassembled, it is clamped on the tooling fixture of the horizontal machining center. Step 4: Remove burrs; Step 5: Polishing and cleaning.

2. The processing technology of a plastic nozzle for mercury coating of semiconductor capillaries according to claim 1, characterized in that: The preheating temperature for billet preheating is 80-120℃, and the holding time is 1-2 hours.

3. The processing technology of a plastic nozzle for mercury coating of semiconductor capillaries according to claim 1, characterized in that: When turning the outer diameter, a carbide turning tool is used for outer diameter turning. The lathe turning parameters are set as follows: spindle speed 800-1500 rpm, feed rate 0.1-0.3 mm / r. The outer diameter after turning is φ7.5 mm. The dimensional tolerance of the outer diameter after turning is controlled within ±0.02 mm. A guide hole is machined at one end of the blank. The guide hole size is φ1.5 mm × 20 mm. The diameter of the guide hole is 0.1-0.25 mm smaller than the diameter of the target inner hole. The depth is 3-5 mm. The concentricity tolerance between the guide hole and the target hole is 0.05 mm.

4. The processing technology of a plastic nozzle for mercury coating of semiconductor capillaries according to claim 3, characterized in that: When the workpiece is transferred to the next machining center, it is calibrated using the outer diameter positioning datum. The outer diameter is φ7.5mm, and the coaxiality is calibrated to 0.008mm. The coaxiality error between the workpiece axis and the spindle axis of the horizontal machining center is ≤0.01mm. A carbide gun drill is installed, using a φ1.5mm carbide gun drill with a cone angle set to 118°, a front angle of -5° to 0°, and a rear angle of 5° to 8°. A guide sleeve is also provided, with an inner diameter of φ1.72mm and a length of 25mm. The clearance between the inner diameter of the guide sleeve and the outer diameter of the gun drill is ≤0.02mm, and the length of the guide sleeve is not less than 3 times the diameter of the gun drill.

5. The processing technology of a plastic nozzle for mercury coating of semiconductor capillaries according to claim 1, characterized in that: When machining the inner hole, a water-based coolant is introduced. The pH value of the water-based coolant is 8.5-9.5, the viscosity is 0.8-2.0 mm² / s, the coolant pressure is controlled at 0.8-1.2 MPa, and the flow rate is 15-20 L / min. The spindle speed is set to 1200-2500 rpm, and the machining command G85 is used for reaming cycle. The inner hole is φ1.72 mm, the depth is 50 mm, and the feed rate is 0.1-0.2 mm / r.

6. The processing technology of a plastic nozzle for mercury coating of semiconductor capillaries according to claim 1, characterized in that: Flame deburring and dry ice deburring are used for deburring.

7. The processing technology of a plastic nozzle for mercury coating of semiconductor capillaries according to claim 1, characterized in that: During cleaning, both the outer wall and the inner hole of the product are cleaned simultaneously. By blowing air onto the outer wall of the finished product and drawing air into the inner hole, the rapidly moving airflow removes debris, impurities and dust from the product surface and inside the hole.

8. The processing technology of a plastic nozzle for mercury coating of semiconductor capillaries according to claim 7, characterized in that: The cleaning process uses cleaning equipment, which includes a base box (2), a positioning platform (21) installed inside the base box (2), and an air jet head (22) installed on the inner wall of the base box (2). The air jet head (22) is positioned above the positioning platform (21). The positioning platform (21) has a positioning hole (212) for inserting a plastic nozzle. An air extraction pipe (214) is connected to the positioning platform (21) and communicates with the positioning hole (212). (21) is equipped with a positioning component (23) for auxiliary positioning. The positioning component (23) includes a fixed rod (231), which is installed on the positioning platform (21). A telescopic sleeve (232) is slidably installed on the fixed rod (231). A movable block (233) is installed on the telescopic sleeve (232). A first spring (234) is sleeved on the telescopic sleeve (232). A guide arc surface (2331) for guiding the plastic nozzle is provided on the movable block (233).

9. The processing technology of a plastic nozzle for mercury coating of semiconductor capillaries according to claim 8, characterized in that: A guide rod (241) is installed on the positioning platform (21), and a support block (242) is slidably installed on the guide rod (241). The bottom surface of the support block (242) abuts against the positioning platform (21), and the top surface of the support block (242) is separated from the positioning platform (21). A retaining strip (2421) is installed on the side of the support block (242) near the positioning hole (212), and a second spring (243) is installed on the bottom surface of the support block (242). The second spring (243) is far from the positioning hole (212). A lifting plate (244) is connected to one end of the support block (242). The lifting plate (244) can slide on the guide rod (241). A stop block (245) is installed on the bottom surface of the lifting plate (244). A connecting plate (246) is connected to the movable block (233). A support rod (247) is installed on the connecting plate (246). The support rod (247) abuts against the stop block (245). The surface where the stop block (245) abuts against the support rod (247) is cut into a bevel.

10. The processing technology of a plastic nozzle for mercury coating of semiconductor capillaries according to claim 8, characterized in that: The long side of the positioning platform (21) has a gap with the inner wall of the bottom box (2), and the positioning platform (21) has a chamfer (211) on the side near the jet head (22).

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