A method and system for calculating alignment deviation of a vertical hybrid probe card

Abstract

A vertical hybrid probe card alignment deviation calculation method and system, the calculation method is characterized in that a coordinate system is established with the probe width direction as X, the thickness direction as Y and the axial length direction as Z;The method comprises the following steps: S1, establishing a projection alignment geometry model of the probe in the XOZ plane and the YOZ plane;S2, based on the geometric relationship, the inclination angle θ of the probe in the corresponding plane is calculated according to formula (1):S3, the inclination angle θ calculated in step S2 is substituted into formula (2), and the offset ΔS of the center of the probe end face relative to the center of the corresponding lower guide plate hole is calculated.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and specifically to a method and system for calculating the alignment deviation of a vertical hybrid probe card. Background Technology

[0002] A probe card is an interface between the chip under test (DUT) and the testing machine in wafer testing. It is primarily used to perform preliminary measurements of the chip's electrical performance before chip slab packaging, and to screen out defective chips before proceeding with the subsequent packaging process. Therefore, it is a key tool for chip functional verification testing and industrialization testing.

[0003] Structurally, probe cards can be divided into three types: vertical probe cards, named for the perpendicularity of the probe to the substrate. Vertical probe cards generally consist of three parts: a printed circuit board (PCB), a space transformer (MLO, MLC, or WST), and a probe head (PH). The probe head of a vertical probe card is as follows... Figure 1 As shown, the system includes several upper guide plates 1, lower guide plates 2, and a sandwich layer 3. Holes are drilled in the upper guide plates 1 and lower guide plates 2 using laser or mechanical drilling, and probes 4 are inserted into the holes to complete the needle insertion. Generally, a certain amount of shift is allowed between the holes in the upper and lower guide plates to achieve pre-bending of the probes, reducing the adverse effects caused by the stiffness of the probes 4 during testing.

[0004] With the development of chip technology, chips with higher integration and greater power consumption are gradually increasing, and traditional probe cards composed of single probes are sometimes unable to cope with complex testing requirements. In order to meet the testing requirements of different areas in the chip (such as high-density signal areas and high-current power supply areas), integrating probes of different specifications (such as different diameters and cross-sections) onto the same probe card, i.e., forming a hybrid probe card, has become an inevitable trend in the industry.

[0005] However, the design of hybrid probe cards faces a core problem that has long remained unresolved: due to the different diameters (needle diameter D) of probes of different specifications, the corresponding hole sizes (Lu, Ld) on the guide plates also need to be adjusted accordingly. This results in different probes forming different tilt angles (θ) when passing through the holes in the upper and lower guide plates, which have different sizes, thus causing their tips to produce unpredictable and inconsistent spatial offsets (ΔS), such as... Figure 2 As shown. If this alignment deviation exceeds the tolerance, it will directly cause some probes to fail to accurately contact the chip pads during testing, resulting in test failure and reduced yield.

[0006] In existing technologies, there is a lack of a universal analytical method capable of accurately predicting and optimizing this alignment deviation during the design phase. Designers typically rely on finite element simulation for rough analysis or, more often, on trial-and-error design based on personal experience. This approach is not only inefficient and costly but also makes it difficult to guarantee the alignment consistency of hybrid probe cards, becoming a bottleneck restricting the development of high-performance probe cards. Therefore, there is an urgent need in this field for a theoretical method that can provide clear, quantitative calculation and design guidance based on fundamental principles. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to overcome the deficiency of the existing technology in lacking a method for accurate analytical calculation and active optimization design of the alignment deviation of the hybrid probe head, and to provide a universal and accurate method for calculating the alignment deviation of the vertical hybrid probe head.

[0008] To achieve the above objectives, the first technical solution adopted by the present invention is: a method for calculating the alignment deviation of a vertical hybrid probe card, wherein the probe card includes at least an upper guide plate, a lower guide plate, and at least one interlayer located between the two, wherein each of the upper and lower guide plates refers to a single guide plate or a combination of multiple guide plates; the upper and lower guide plates are provided with pinholes for probes of different specifications to pass through; a coordinate system is established with the probe width direction as X, the thickness direction as Y, and the axial length direction as Z; the method includes the following steps:

[0009] S1. Establish the geometric model of probe projection alignment in the XOZ and YOZ planes: Define the line connecting the centers of the upper guide plate pinhole and the lower guide plate pinhole passing through the same vertical axis as the ideal center line, and form an inclination angle θ between the probe axis and the ideal center line; wherein, the probe diameter is D, the aperture size of the upper guide plate pinhole on the corresponding plane is Lu, the aperture size of the lower guide plate pinhole on the corresponding plane is Ld, the total thickness of the upper guide plate, the interlayer and the lower guide plate is AB, and the distance between the probe end face and the nearest guide plate surface is H;

[0010] S2. Based on geometric relationships, calculate the tilt angle θ of the probe in the corresponding plane according to formula (1):

[0011]

[0012] S3. Substitute the tilt angle θ calculated in step S2 into formula (2) to calculate the offset ΔS of the probe end face center relative to the corresponding lower guide plate hole center:

[0013]

[0014] The tilt angle θ and offset ΔS include θ_xz and ΔS_xz in the XOZ plane and θ_yz and ΔS_yz in the YOZ plane.

[0015] In the above scheme, the upper guide plate includes at least two layers of physical guide plates, and / or the lower guide plate includes at least two layers of physical guide plates;

[0016] When the upper guide plate includes at least two physical guide plates, the aperture size Lu of the pinhole in the upper guide plate is obtained by equivalently replacing the pinhole size of the at least two physical guide plates;

[0017] When the lower guide plate includes at least two physical guide plates, the aperture size Ld of the pinhole in the lower guide plate is obtained by equivalently replacing the pinhole size of the at least two physical guide plates.

[0018] The total thickness of the upper guide plate, the interlayer, and the lower guide plate is AB, which is the sum of the thicknesses of the equivalent upper guide plate, the interlayer located between the equivalent upper guide plate and the equivalent lower guide plate, and the equivalent lower guide plate.

[0019] In the above scheme, when the cross-section of the probe has different needle diameters in different directions, and / or the pinhole has different aperture sizes in different directions, the needle diameter D, aperture size Lu, and Ld in step S1 have direction specificity.

[0020] When calculating in the XOZ plane, the needle diameter D, the upper guide plate pinhole diameter Lu, and the lower guide plate pinhole diameter Ld should be the dimensions of the probe and pinhole in the X direction, respectively.

[0021] When calculating in the YOZ plane, the needle diameter D, the upper guide plate pinhole diameter Lu, and the lower guide plate pinhole diameter Ld should be the dimensions of the probe and pinhole in the Y direction, respectively.

[0022] Further optimization of the plan also includes optimization steps:

[0023] For at least two different probes, calculate their first offset ΔS_xz in the X direction;

[0024] Compare the differences between the first offset ΔS_xz of probes of different specifications;

[0025] If the difference exceeds the preset threshold, then the upper guide plate aperture Lu_x' and lower guide plate aperture Ld_x' of the probe of one specification are used as the reference and substituted into formulas (1) and (2) to calculate the required upper guide plate aperture Lu_x' and lower guide plate aperture Ld_x' of the probe of other specifications in the X direction.

[0026] Further optimization of the scheme includes the following steps:

[0027] For the at least two different types of probes, calculate their second offset ΔS_yz in the Y direction respectively;

[0028] Compare the differences between the second offset ΔS_yz of probes of different specifications;

[0029] If the difference exceeds the preset threshold, then the upper guide plate aperture Lu_y' and lower guide plate aperture Ld_y' required in the Y direction of other probe specifications are calculated by substituting θ_yz and ΔS_yz of one type of probe into formulas (1) and (2).

[0030] The optimization steps described above, which use "θ_xz and △S_xz of one type of probe as a reference" and "θ_yz and △S_yz of one type of probe as a reference", refer to using the parameters corresponding to the probe with the smallest calculated offset △S_xz and △S_yz values ​​among the at least two different types of probes as the reference.

[0031] To achieve the above objectives, the second technical solution adopted by the present invention is: a vertical hybrid probe card design system, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the alignment deviation calculation method as described in the first technical solution above.

[0032] To achieve the above objectives, the third technical solution adopted by the present invention is: a computer-readable storage medium storing a computer program thereon, wherein the computer program, when executed by a processor, implements the alignment deviation calculation method as described in the first technical solution above.

[0033] The principle of this invention is as follows: by establishing a simplified geometric model of the probe under the constraint of adjacent guide plate holes, the core equation describing the relationship between the probe tilt angle θ and the structural parameters (AB, D, Lu, Ld) is derived (Equation (1)). Furthermore, combined with the probe overhang length H, the formula for calculating the spatial offset ΔS of the probe tip is derived (Equation (2)). These two formulas constitute the theoretical basis for the calculation of alignment deviation.

[0034] Furthermore, to handle more complex multi-guide plate structures in practice (such as four-guide plate three-layer structures), this invention proposes an equivalent substitution principle: the multi-layer guide plate structure is equivalent to the basic two-layer model in claim 1 for calculation, thereby expanding the scope of application of the method.

[0035] For probes and pinholes that are typically rectangular in cross-section, the method of this invention can be calculated independently in the X and Y directions using the above formulas. Based on this, an optimized design process is proposed: by comparing the offset ΔS calculated from probes of different specifications, if the difference is too large, the ideal state of one type of probe can be used as a benchmark, and the optimal pinhole size required for other types of probes can be derived by using formulas (1) and (2), thereby actively adjusting the spatial position of each probe to be consistent during the design stage.

[0036] The present invention also provides a system for implementing the above-described method and a computer-readable storage medium.

[0037] The innovation of this invention is further reflected in the proposal of a complete design process from "computational analysis" to "active optimization":

[0038] 1. General calculation of geometric model: Based on formulas (1) and (2), the precise spatial position of any given probe of any given specification under any given guide plate structure can be calculated quantitatively.

[0039] 2. Model Universality Extension: For more complex multi-guide plate structures in practice (such as four-guide plate and six-guide plate), this invention creatively proposes the "equivalent replacement" principle, which calculates the multi-layer guide plate structure as equivalent to the basic two-layer model in claim 1. This makes the core method applicable to all mainstream and future probe head configurations in the industry, greatly expanding its application scope.

[0040] 3. Systematic Optimization Design: Addressing the core requirement of hybrid probe cards—alignment consistency—this invention proposes for the first time a reverse optimization process "aiming at consistency": First, the offset ΔS of probes of various specifications is calculated and compared. If the difference exceeds a threshold, then θ and ΔS of one type (usually the minimum offset or a specified specification) are used as a benchmark, and the optimal guide plate aperture dimensions (Lu, Ld) required for other probe specifications are derived using formulas. This process represents a leap from passive analysis to proactive design.

[0041] 4. Consideration of engineering details: The method of this invention explicitly supports the processing of rectangular cross-section probes and pinholes. By independently applying the above calculation and optimization process in the X and Y directions, it perfectly matches the actual engineering situation and ensures the practicality and accuracy of the solution.

[0042] Compared with the prior art, the beneficial effects of the present invention are significant and multifaceted:

[0043] 1. Achieved the transformation from experience to theory: For the first time, a complete analytical calculation tool for the alignment problem of vertical hybrid probe heads was provided. Through rigorous geometric derivation, complex engineering problems were transformed into mathematical formulas that can be solved quickly, freeing the design process from dependence on expensive simulations and fuzzy experience.

[0044] 2. A proactive optimization design methodology is provided: The "calculation-comparison-backward optimization" process proposed in this invention enables the proactive elimination of alignment differences between probes of different specifications during the design drawing stage, ensuring design accuracy from the outset. This fundamentally avoids manufacturing rework, test failures, and cost waste caused by poor alignment, significantly improving the first-version success rate.

[0045] 3. Excellent versatility and scalability: Through the principle of "equivalent replacement", the same set of core calculation methods can be seamlessly applied to everything from the simplest two-layer structure to the most complex multi-layer high-order structure, solving the problem of a unified theoretical tool for the alignment design of probe cards with different configurations in the industry, and has extremely strong universality.

[0046] 4. Provides key support for hybrid probe card technology: This invention directly addresses the core pain points of hybrid probe card design, providing indispensable theoretical basis and design guidelines for its feasibility, reliability and performance optimization. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of the basic structure of a vertical probe head involved in the prior art or this invention;

[0048] Figure 2 This is a schematic diagram showing the different tilt angles of different types of probes in existing technology;

[0049] Figure 3 This is a schematic diagram of the coordinate system (X, Y, Z) defined in an embodiment of the present invention;

[0050] Figure 4 This is a schematic diagram of the projection of the core alignment geometric model of this invention in the XOZ or YOZ plane, used to illustrate the geometric relationship between the tilt angle θ, the offset ΔS and each structural parameter;

[0051] Figure 5 This is a schematic diagram of the original structure of the multi-layer guide plate structure (taking a four-guide plate and three-layer structure as an example) in Embodiment 3 of the present invention, and a schematic diagram after equivalent replacement and transformation into a simplified two-guide plate model that can be used for calculation.

[0052] Figure 6 yes Figure 5 A schematic diagram of equivalent replacement of a pair of adjacent guide plates in the upper middle section.

[0053] In the attached diagram: 1. Upper guide plate; 2. Lower guide plate; 3. Interlayer; 4. Probe. Detailed Implementation

[0054] Example 1: A method for calculating the alignment deviation of a vertical hybrid probe card, referring to... Figure 1 , 3 -4. This embodiment is for the most basic two-guide-plate-one-sandwich structure.

[0055] The probe card includes at least an upper guide plate 1, a lower guide plate 2, and at least one interlayer 3 located between them. The upper guide plate 1 and the lower guide plate 2 are provided with pinholes for probes of different specifications to pass through. A coordinate system is established with the probe width direction as X, the thickness direction as Y, and the axial length direction as Z. Figure 3 .

[0056] The method includes the following steps:

[0057] S1. Establish the geometric model for the alignment of the probe projection in the XOZ and YOZ planes: (e.g.) Figure 4 As shown, the line connecting the centers of the upper guide plate pinhole and the lower guide plate pinhole passing through the same vertical axis is defined as the ideal center line, and the axis of the probe forms an inclination angle θ with the ideal center line; wherein, the probe diameter is D, the aperture size of the upper guide plate pinhole on the corresponding plane is Lu, the aperture size of the lower guide plate pinhole on the corresponding plane is Ld, the total thickness of the upper guide plate, the interlayer and the lower guide plate is AB, and the distance between the probe end face and the nearest guide plate surface is H;

[0058] Specifically, the thickness of both the upper and lower guide plates is 300 μm, and the thickness of the interlayer is 280 μm. Therefore, the total thickness of the adjacent upper and lower guide plates and the intermediate interlayer is AB = 300 + 280 + 300 = 880 μm. The distance between the probe end face and the surface of the lower guide plate is H = 600 μm.

[0059] Probe parameters: Probe diameter D = 80 μm. Preset corresponding upper and lower guide plate apertures Lu = Ld = 100 μm.

[0060] S2. Calculate the tilt angle θ of the probe in the corresponding plane according to formula (1):

[0061]

[0062]

[0063] Solving this equation, we can obtain the tilt angle θ≈1.3°.

[0064] S3. Substitute the tilt angle θ calculated in step S2 into formula (2) to calculate the offset ΔS of the probe end face center relative to the corresponding lower guide plate hole center:

[0065]

[0066] Substitute θ≈1.3° into formula (2) to calculate the offset ΔS:

[0067]

[0068] Therefore, the tip offset ΔS of probe A is approximately 23.6 μm.

[0069] The principle behind the above formula is: Figure 4As shown, in a spatial rectangular coordinate system, the probe is projected onto the XOZ or YOZ plane. From ∆ABC and geometric relationships, it can be seen that side AB is related to the thickness of the guide plate and the thickness of the interlayer, while side BC is related to the width of the hole, the width of the probe, and the angle between the probe and the Z-axis (i.e., ∠BAC). Furthermore, ∠BAC, side AB, and side BC are interconnected. ∠BAC is the tilt angle θ, thus allowing for geometric derivation.

[0070] Example 2: Directional Calculation and Optimization of Rectangular Cross-Section Probe

[0071] Consider two rectangular cross-section probes. Probe C: X-direction diameter D_xc = 80 μm, Y-direction diameter D_yc = 90 μm. Probe D: X-direction diameter D_xd = 100 μm, Y-direction diameter D_yd = 110 μm. The guide plate structure parameters are the same as in Example 1, H = 600 μm, AB = 880 μm.

[0072] Initial design aperture: Probe C corresponds to aperture Lu_xc=Ld_xc=100μm, Lu_yc=Ld_yc=100μm. Probe D corresponds to aperture Lu_xd=Ld_xd=110μm, Lu_yd=Ld_yd=120μm.

[0073] X-direction calculation:

[0074] Probe C: Substituting D=80, Lu=Ld=100, AB=880 into formulas (1) and (2), we can calculate θ_xc≈1.3° and ΔS_xc≈23.6μm.

[0075] Probe D: Substituting D=100, Lu=Ld=110, AB=880, we calculate θ_xd≈0.65°, ΔS_xd≈11.8μm.

[0076] Comparing ΔS_xc (23.6μm) and ΔS_xd (11.8μm), the difference 11.8μm > 1μm (assuming a threshold), which needs optimization.

[0077] Using probe D with a smaller offset as a reference (θ_xd=0.65°, ΔS_xd=11.8μm), its parameters are substituted into formulas (1) and (2) to calculate the required aperture of probe C. The calculation shows that, to match this offset, the aperture of probe C should be adjusted to Lu_xc'=Ld_xc'=90μm.

[0078] Y-direction calculation:

[0079] Probe C: Substituting D=90, Lu=Ld=100, AB=880, we calculate θ_yc≈0.65°, ΔS_yc≈11.8μm.

[0080] Probe D: Substituting D=110, Lu=Ld=120, AB=880, we calculate θ_yd≈0.98°, ΔS_yd≈17.7μm.

[0081] Comparing ΔS_yc (11.8μm) and ΔS_yd (17.7μm), the difference of 5.9μm > 1μm, indicating that optimization is needed.

[0082] Using probe C with a smaller offset as a reference (θ_yc=0.65°, ΔS_yc=11.8μm), the required aperture of probe D is calculated. The calculation shows that the aperture of probe D should be adjusted to Lu_yd'=Ld_yd'=115μm.

[0083] Optimization results: After the above optimization, the recommended aperture for probe C is 90μm (X-direction) × 100μm (Y-direction); the recommended aperture for probe D is 110μm (X-direction) × 115μm (Y-direction). With this optimized aperture design, the final calculated offset ΔS in the X and Y directions for both probes will remain consistent.

[0084] Example 3: Equivalent calculation of multi-guide plate structure For probe head structures with more than two guide plate layers, such as the commonly used four-guide plate three-layer advanced model, this invention adopts the idea of ​​"equivalent replacement" to transform it into the basic two-guide plate model as described in claim 1 for calculation. Its core principle is that the constraint conditions of the guide plate on the probe are not changed before and after equivalence.

[0085] Reference Figures 5-6 Taking a three-layer structure with four guide plates (labeled from top to bottom as: first upper guide plate, second upper guide plate, first lower guide plate, and second lower guide plate) as an example, to calculate the overall tilt and offset of the probe in the entire structure, the equivalent replacement steps are as follows:

[0086] S31. Structural Analysis and Parameter Definition:

[0087] Identify the upper adjacent guide plate pairs (first upper guide plate and second upper guide plate) and lower adjacent guide plate pairs (first lower guide plate and second lower guide plate) that require equivalence. Define the original parameters as follows, such as... Figure 6 :

[0088] DK1 and DK2 are the apertures of the two guide plates in a pair of adjacent upper (or lower) guide plates, respectively.

[0089] Hk1 and Hk2 are the thicknesses of the two guide plates mentioned above.

[0090] Hj: The thickness of the interlayer between the two guide plates mentioned above.

[0091] S32. Calculation of equivalent parameters:

[0092] A pair of adjacent guide plates (such as the first upper guide plate and the second upper guide plate) and the interlayer between them can be equivalent to a single virtual guide plate. The parameters of this equivalent guide plate are determined by the following formula:

[0093] Equivalent aperture DKeq: The size of the equivalent guide plate aperture is the average of the two original guide plate apertures.

[0094]

[0095] Equivalent thickness Hkeq: The equivalent guide plate thickness is the sum of the thicknesses of the two original guide plates and the thickness of the intermediate interlayer.

[0096]

[0097] Center offset d: The centerline of the equivalent guide plate hole is offset relative to the centerline of the original two layers of guide plate holes. Its value is half the absolute value of the difference between the equivalent hole diameter and any original hole diameter.

[0098]

[0099] This offset d reflects the geometric relationship between the positions of the equivalent constraint points before and after.

[0100] S33. Overall Structural Equivalence and Calculation:

[0101] 1. Apply step S32 to the adjacent guide plate pairs (first and second upper guide plates) at the top to calculate the aperture Lu_eq and thickness of the "equivalent upper guide plate".

[0102] 2. Apply step S32 to the adjacent guide plate pairs at the bottom (first and second lower guide plates) to calculate the aperture Ld_eq and thickness of the "equivalent lower guide plate".

[0103] 3. Calculate the equivalent total thickness AB_eq between the equivalent upper and lower guide plates. AB_eq is the sum of the equivalent upper guide plate thickness, the thickness of all remaining interlayers and guide plates between the equivalent upper / lower guide plates, and the equivalent lower guide plate thickness.

[0104] 4. Substitute the Lu_eq, Ld_eq and AB_eq obtained in step S33 as new parameters into formulas (1) and (2) of claim 1, respectively, and the overall tilt angle θ_total and the total offset of the probe tip ΔS_total under the overall constraint of the probe in this four-guide plate structure can be calculated.

[0105] S34. Higher-order model extension:

[0106] For "higher-order models" with more than four guide plates, the equivalent substitution principle described above can be applied repeatedly. First, the top multi-layer guide plates are equivalent to an "equivalent upper guide plate," and the bottom multi-layer guide plates are equivalent to an "equivalent lower guide plate," and then the calculation is performed according to step S33. Generally, at this time, "adjacent guide plates" refers to the top and bottom layers in the upper guide plate group, and the top and bottom layers in the lower guide plate group.

[0107] Beneficial effects: This equivalent method provides explicit mathematical rules for simplifying complex multilayer structures into a verified basic model, enabling the core calculation method described in claim 1 to be directly applied to all practical probe head structure designs, greatly expanding the scope of application of the present invention, and providing an accurate and universal analytical tool for the optimized design of complex multilayer probe cards.

[0108] The above embodiments demonstrate that, in the special case where adjacent guide plate apertures are the same (DK1=DK2), the equivalent offset d=0. To more fully demonstrate the universality of the method of the present invention, a variation is provided below to show the calculation and significance of the offset d when adjacent guide plate apertures are different.

[0109] Example of variation:

[0110] Consider and Figure 5 The same four-guide plate three-layer structure is used, but it is assumed that the parameters of the two adjacent upper guide plates that need to be equivalent are different: the aperture of the first guide plate is DK1 = 100μm and the thickness is H_k1 = 200μm; the aperture of the second guide plate is DK2 = 120μm and the thickness is H_k2 = 180μm; the thickness of the interlayer between the two layers is H_j = 50μm.

[0111] 1. Calculate the equivalent aperture:

[0112] DK_eq=0.5×(DK1+DK2)=0.5×(100+120)=110μm

[0113] 2. Calculate the equivalent thickness:

[0114] Hk_eq=H_k1+H_j+H_k2=200+50+180=430μm

[0115] 3. Calculate the center offset d:

[0116] d=0.5×|DK_eq-DK1|= 0.5×|110-100|=5μm

[0117] This d = 5μm indicates that the center of the hole in the equivalent virtual guide plate is offset by 5μm relative to the center of the hole in the original first layer guide plate (hole diameter DK1) in the direction with a larger hole diameter.

[0118] 4. Offset d should be taken into consideration:

[0119] The purpose of this offset d is to establish the geometric benchmark for the equivalent computational model. Specifically, in constructing such a model... Figure 5 When creating the final two-layer equivalent model shown on the right, a coordinate system of the original structure (e.g., the origin of the center of the hole in the first layer guide plate) must be used as the reference. At this point, the calculated d=5μm represents the precise position coordinates of the pinhole constraint points on the equivalent upper guide plate, and their offset relative to the origin. By incorporating this coordinate information into the geometric modeling, it can be ensured that the equivalent model has the exact same constraint boundary conditions as the original multi-layer structure, thus making the overall equivalent parameters (Lu_eq, Ld_eq, AB_eq) used in subsequent calculations truly effective. After completing this step, these equivalent parameters can be substituted into formulas (1) and (2) for the final calculation.

[0120] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for calculating the alignment deviation of a vertical hybrid probe card, wherein the probe card includes at least an upper guide plate, a lower guide plate, and at least one interlayer located between the two, wherein, Each of the upper guide plate and the lower guide plate refers to a single guide plate or a combination of multiple guide plates; the upper and lower guide plates are provided with pinholes for probes of different specifications to pass through; the method is characterized by establishing a coordinate system with the probe width direction as X, the thickness direction as Y, and the axial length direction as Z; the method includes the following steps: S1. Establish the geometric model of probe projection alignment in the XOZ and YOZ planes: Define the line connecting the centers of the upper guide plate pinhole and the lower guide plate pinhole passing through the same vertical axis as the ideal center line, and form an inclination angle θ between the probe axis and the ideal center line; wherein, the probe diameter is D, the aperture size of the upper guide plate pinhole on the corresponding plane is Lu, the aperture size of the lower guide plate pinhole on the corresponding plane is Ld, the total thickness of the upper guide plate, the interlayer and the lower guide plate is AB, and the distance between the probe end face and the nearest guide plate surface is H; S2. Based on geometric relationships, calculate the tilt angle θ of the probe in the corresponding plane according to formula (1): S3. Substitute the tilt angle θ calculated in step S2 into formula (2) to calculate the offset ΔS of the probe end face center relative to the corresponding lower guide plate hole center: The tilt angle θ and offset ΔS include components θ_xz and ΔS_xz in the XOZ plane and components θ_yz and ΔS_yz in the YOZ plane.

2. The method according to claim 1, characterized in that: The upper guide plate includes at least two layers of physical guide plates, and / or the lower guide plate includes at least two layers of physical guide plates; When the upper guide plate includes at least two physical guide plates, the aperture size Lu of the pinhole in the upper guide plate is obtained by equivalently replacing the pinhole size of the at least two physical guide plates; When the lower guide plate includes at least two physical guide plates, the aperture size Ld of the pinhole in the lower guide plate is obtained by equivalently replacing the pinhole size of the at least two physical guide plates. The total thickness of the upper guide plate, the interlayer, and the lower guide plate is AB, which is the sum of the thicknesses of the equivalent upper guide plate, the interlayer located between the equivalent upper guide plate and the equivalent lower guide plate, and the equivalent lower guide plate.

3. The method according to claim 2, characterized in that, The equivalent substitution is achieved through the following steps: A pair of adjacent physical guides and the interlayer between them can be considered as a virtual guide. The equivalent aperture DK_eq of the virtual guide plate is the average value of the apertures DK_1 and DK_2 of a pair of adjacent physical guide plates, that is: The equivalent thickness Hk_eq of the virtual guide plate is the sum of the thicknesses H_k1 and H_k2 of the pair of adjacent physical guide plates and the thickness H_j of the interlayer between them, that is: The center of the virtual guide plate hole is offset by a factor d relative to the center of any original physical guide plate hole. 。 4. The method according to claim 1, 2, or 3, characterized in that: When the cross-section of the probe has different needle diameters in different directions, and / or the pinhole has different aperture sizes in different directions, the needle diameter D, aperture size Lu, and Ld in step S1 have direction specificity. When calculating in the XOZ plane, the needle diameter D, the upper guide plate pinhole diameter Lu, and the lower guide plate pinhole diameter Ld should be the dimensions of the probe and pinhole in the X direction, respectively. When calculating in the YOZ plane, the needle diameter D, the upper guide plate pinhole diameter Lu, and the lower guide plate pinhole diameter Ld should be the dimensions of the probe and pinhole in the Y direction, respectively.

5. The method according to claim 4, characterized in that, It also includes optimization steps: For at least two different probes, calculate their first offset ΔS_xz in the X direction; Compare the differences between the first offset ΔS_xz of probes of different specifications; If the difference exceeds the preset threshold, then the upper guide plate aperture Lu_x' and lower guide plate aperture Ld_x' of the probe of one specification are used as the reference and substituted into formulas (1) and (2) to calculate the required upper guide plate aperture Lu_x' and lower guide plate aperture Ld_x' of the probe of other specifications in the X direction.

6. The method according to claim 5, characterized in that, The optimization steps also include: For the at least two different types of probes, calculate their second offset ΔS_yz in the Y direction respectively; Compare the differences between the second offset ΔS_yz of probes of different specifications; If the difference exceeds the preset threshold, then the upper guide plate aperture Lu_y' and lower guide plate aperture Ld_y' required in the Y direction of other probe specifications are calculated by substituting θ_yz and ΔS_yz of one type of probe into formulas (1) and (2).

7. The method according to claim 6, characterized in that, The optimization step of using "θ_xz and △S_xz of one type of probe as a reference" and "θ_yz and △S_yz of one type of probe as a reference" means using the parameters corresponding to the probe with the smallest calculated offset △S_xz and △S_yz values ​​among the at least two different types of probes as the reference.

8. A vertical hybrid probe card design system, comprising a memory and a processor, characterized in that, The memory stores a computer program, and when the processor executes the computer program, it implements the alignment deviation calculation method as described in any one of claims 1 to 5.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the alignment deviation calculation method as described in any one of claims 1 to 5.

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