Printing substrate leveling device of 3D printer
The printing substrate leveling device for 3D printers simplifies the leveling process by using a mechanism with leveling slope support blocks and screws, enabling quick adjustments for parallelism and full-format printing.
Patent Information
- Application Number
- CN202420557997.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-21
- Publication Date
- 2024-12-06
- Estimated Expiration
- 2034-03-21
AI Technical Summary
Existing 3D printing equipment requires complex and tedious manual leveling of the printing substrate, often necessitating frequent disassembly and reducing the printing area, which complicates the process and hinders full-format printing.
A printing substrate leveling device with a leveling mechanism featuring leveling slope support blocks and screws that allow for quick adjustment without disassembly, ensuring parallelism and enabling full-format printing.
The device facilitates easy and efficient leveling, maintaining parallelism without disassembly, allowing for full-width printing and reducing operational complexity and costs.
Smart Images

Figure CN222113533U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of printing substrate leveling, in particular to a printing substrate leveling device for a 3D printer. Background Art
[0002] Existing metal 3D printing equipment will be equipped with a forming cylinder, and the 3D model to be printed is printed and formed in the forming cylinder. There is a piston inside the cylinder, which includes a heating base plate and a printing base plate. The piston is driven up and down by a lift. Above the piston is the powder accumulation area and the printing area (accumulate a layer of powder and print a layer of model, the piston drops 10% of the height, and so on). The quality of the printed model has a certain relationship with the parallelism of the printing base plate (relative to the upper plane of the cylinder or the bottom of the molding chamber) (the worse the parallelism of the printing base plate, the worse the quality of the printed model), so the printing base plate needs to be leveled every time it is installed. At present, various 3D printing equipment manufacturers have different ways to level the printing substrate. There are two main ways to level the printing substrate; Method 1: Leveling, use thin shims to level the heating base plate and the printing substrate in turn. The main operation method is to install the printing substrate first, use a measuring tool to measure the height error of three points on the printing substrate relative to the floor of the molding room, then remove the printing substrate, and then put shims of corresponding height at the corresponding points, and then install the printing substrate. After the printing substrate is installed, measure whether it is parallel again. If it is not parallel, repeat the above operation until it is parallel. Method 2: Leveling, there is a leveling adapter plate between the heating base plate and the printing substrate. The role of the adapter plate replaces the role of the shim, and the rest of the operation is the same as Method 1. The above two leveling structures require frequent disassembly of the printing substrate when leveling the printing substrate, which is complicated to operate and difficult to level. In addition, the installation method of the printing substrate is to use screws from top to bottom (fixing holes are set on the corners of the printing substrate), which will reduce the printing area of the printing substrate and does not achieve true full-width printing. Utility Model Content
[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a printing substrate leveling device for a 3D printer, which is easy to use, avoids the complexity and tediousness of traditional leveling methods, and can achieve full-format printing in a true sense.
[0004] The purpose of the utility model is achieved through the following technical solutions: a printing substrate leveling device for a 3D printer, comprising a printing substrate assembly arranged in a sleeve cylinder, a leveling mechanism connected to the bottom of the printing substrate assembly, the leveling mechanism comprising a leveling plate, a top surface of the leveling plate is provided with a plurality of leveling slope support blocks, the leveling slope support blocks are connected to the leveling plate through support block screws, the printing substrate assembly comprises a leveling substrate, the leveling substrate is provided with leveling grooves at positions corresponding to the leveling slope support blocks, the side walls of the leveling substrate are provided with threaded holes at positions corresponding to the leveling grooves, the threaded holes are connected to the corresponding leveling grooves, the inner threads of the threaded holes are adapted to be equipped with leveling screws, the end of the leveling screw close to the leveling slope support block is conical, the top surface of the leveling slope support block is provided with a leveling slope, and the conical surface of the leveling screw contacts the leveling slope.
[0005] In some embodiments, three leveling slope support blocks are provided, and the three leveling slope support blocks are arranged in an isosceles triangle.
[0006] In some embodiments, a plurality of round-headed columns are fixed on the top of the adjustment plate, and a locking circular hole is formed through the position of the leveling substrate corresponding to the round-headed columns, and a locking screw is threadedly connected to one side of the locking circular hole of the leveling substrate.
[0007] In some embodiments, the leveling substrate is provided with an L-shaped groove at the position of the locking circular hole, the L-shaped groove passes through the middle of the locking circular hole, and one end of the L-shaped groove passes through one side of the leveling substrate, the locking screw is located on one side of the locking circular hole, and when the locking screw is tightened on the leveling substrate, the leveling substrate is deformed and clamps the round head column.
[0008] In some embodiments, the printing substrate assembly further comprises a printing substrate, a screw hole is formed at the bottom of the printing substrate, a connecting screw is passed through the bottom of the leveling substrate, and the connecting screw thread is adapted to fit in the screw hole.
[0009] The beneficial effects of the utility model are:
[0010] 1. Leveling is achieved by the cooperation of the leveling screw with a conical surface and the leveling slope of the leveling slope support block. The height change formed by rotating the leveling screw can achieve the purpose of leveling. The leveling operation can be quickly completed without disassembling or installing the printing substrate. It is easy to use and avoids the complexity and tediousness of traditional leveling methods.
[0011] 2. The leveling part and the connecting part of the leveling plate and the leveling substrate are both arranged on the side of the leveling substrate, and the printing substrate and the leveling substrate are also connected from the bottom, so that the top surface of the printing substrate is an overall plane, and full-width printing can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 This is a partial structural schematic diagram of a printing substrate leveling device of a 3D printer of the utility model;
[0013] Figure 2 This is a schematic diagram of the structure of a leveling plate in a printing substrate leveling device of a 3D printer according to the utility model;
[0014] Figure 3 It is a structural schematic diagram of a printing substrate assembly in a printing substrate leveling device of a 3D printer according to the utility model;
[0015] Figure 4 It is a structural schematic diagram of a printing substrate in a printing substrate leveling device of a 3D printer according to the utility model;
[0016] Figure 5 This is a schematic diagram of the structure of a printing substrate leveling device for a 3D printer of the utility model;
[0017] In the figure, 14-leveling plate, 15-leveling slope support block, 16-leveling base plate, 17-leveling groove, 18-threaded hole, 19-leveling screw, 20-leveling slope, 21-round head column, 22-locking round hole, 23-locking screw, 24-printing base plate, 25-screw hole, 26-connecting screw, 27-L-shaped groove. DETAILED DESCRIPTION
[0018] The technical solution of the present utility model is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present utility model is not limited to the following.
[0019] like Figures 1 to 5As shown, a printing substrate leveling device of a 3D printer includes a printing substrate assembly arranged in a sleeve cylinder, a leveling mechanism is connected to the bottom of the printing substrate assembly, the leveling mechanism includes a leveling plate 14, a top surface of the leveling plate 14 is provided with a plurality of leveling slope support blocks 15, the leveling slope support blocks 15 are connected to the leveling plate 14 through support block screws, the printing substrate assembly includes a leveling substrate 16, the leveling substrate 16 has leveling grooves 17 formed therethrough at positions corresponding to the leveling slope support blocks 15, threaded holes 18 are formed at positions corresponding to the leveling grooves 17 on the side walls of the leveling substrate 16, the threaded holes 18 are connected to the corresponding leveling grooves 17, the inner threads of the threaded holes 18 are adapted to be equipped with leveling screws 19, the end of the leveling screw 19 close to the leveling slope support block 15 is conical, the top surface of the leveling slope support block 15 is provided with a leveling slope 20, and the conical surface of the leveling screw 19 contacts the leveling The flat inclined surface 20, three leveling slope support blocks 15 are arranged in an isosceles triangle. The leveling plate 14 is installed in the sleeve cylinder of the printer by screws. The leveling slope support block 15 and the leveling screws 19 form a set of leveling components. There are three sets of leveling components. The leveling of one surface is achieved by a three-point leveling method. The specific leveling process is to install the leveling plate 14 in the printing slot 9, and then place the leveling substrate 16 on the leveling plate 14, and use a measuring tool to measure the height errors at the three leveling screws 19 in turn, and rotate the corresponding leveling screw 19 according to the measurement results. In the process of rotating the leveling screw 19, the contact position between the conical surface of the leveling screw 19 and the leveling inclined surface 20 of the leveling slope support block 15 will change, thereby driving the leveling substrate 16 to form a change in the height direction to complete the leveling operation of the printing substrate assembly.
[0020] Furthermore, if Figures 1 to 4 As shown, a plurality of round-headed columns 21 are fixed on the top of the leveling plate 14, and a locking circular hole 22 is formed through the position of the round-headed column 21 of the leveling base plate 16, and a locking screw 23 is threadedly connected to one side of the locking circular hole 22 of the leveling base plate 16, and an L-shaped groove 27 is formed through the position of the locking circular hole 22 of the leveling base plate 16, and the L-shaped groove 27 passes through the middle of the locking circular hole 22, and one end of the L-shaped groove 27 passes through one side of the leveling base plate 16, and the locking screw 23 is located on one side of the locking circular hole 22. When the locking screw 23 is tightened in the leveling When on the substrate 16, the leveling substrate 16 is deformed and clamped with the round head column 21, and the round head column 21 of the adjustment plate 14 is inserted into the locking circular hole 22. After the leveling of the leveling substrate 16 is completed by rotating the leveling screw 19, the locking screw 23 is tightened, and the L-shaped groove 27 forms a weak area in the locking circular hole 22 of the leveling substrate 16. The weak area is deformed by tightening the locking screw 23, so that the inner wall of the locking circular hole 22 is tightly attached to the round head column 21 to complete the locking, so that the leveling substrate 16 can be locked on the adjustment plate 14 to maintain stability after leveling.
[0021] Furthermore, if Figure 3 and Figure 4 As shown, the printing substrate assembly also includes a printing substrate 24, a screw hole 25 is opened at the bottom of the printing substrate 24, and a connecting screw 26 is penetrated at the bottom of the leveling substrate 16, and the connecting screw 26 is threadedly adapted in the screw hole 25. Since the printing substrate assembly is a consumable material, the model needs to be cut from the printing substrate 24, and the thickness of the printing substrate 24 needs to be consumed. Therefore, the printing substrate assembly is set as two parts, namely the leveling substrate 16 (connecting part) and the printing substrate 24 (consumable part), so as to reduce the replacement cost of the printing substrate assembly.
[0022] To sum up, the leveling part and the connecting part of the leveling plate 14 and the leveling substrate 16 are both arranged on the side of the leveling substrate 16, and the printing substrate 24 and the leveling substrate 16 are also connected from the bottom, so that the top surface of the printing substrate 24 is an overall plane, and full-format printing can be achieved.
[0023] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "two ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention; and it is known to those skilled in the art that the beneficial effects to be achieved by the present invention are only to achieve better beneficial effects under specific circumstances compared with the current implementation schemes in the prior art, rather than to directly achieve the best use effect in the industry.
[0024] The above is only a preferred embodiment of the utility model. It should be understood that the utility model is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art do not deviate from the spirit and scope of the utility model, and should be within the scope of protection of the claims attached to the utility model.
Claims
1. A printing substrate leveling device for a 3D printer, comprising a printing substrate assembly arranged in a sleeve cylinder, It is characterized in that The bottom of the printing substrate assembly is connected to a leveling mechanism, the leveling mechanism comprises a leveling plate (14), the top surface of the leveling plate (14) is provided with a plurality of leveling slope support blocks (15), the leveling slope support blocks (15) are connected to the leveling plate (14) via support block screws, the printing substrate assembly comprises a leveling substrate (16), the leveling substrate (16) is provided with leveling grooves (17) at positions corresponding to the leveling slope support blocks (15), the leveling substrate (16) A threaded hole (18) is provided at a position corresponding to the leveling groove (17) on the side wall of the support block (16); the threaded hole (18) is connected to the corresponding leveling groove (17); the inner thread of the threaded hole (18) is adapted to be equipped with a leveling screw (19); the end of the leveling screw (19) close to the leveling slope support block (15) is conical; the top surface of the leveling slope support block (15) is provided with a leveling slope (20); the conical surface of the leveling screw (19) contacts the leveling slope (20).
2. A printing substrate leveling device for a 3D printer according to claim 1, It is characterized in that Three leveling slope support blocks (15) are provided, and the three leveling slope support blocks (15) are arranged in an isosceles triangle.
3. The printing substrate leveling device of a 3D printer according to claim 1, It is characterized in that A plurality of round-headed columns (21) are fixed on the top of the adjustment plate (14); a locking circular hole (22) is formed through the leveling base plate (16) at a position corresponding to the round-headed columns (21); and a locking screw (23) is threadedly connected to one side of the locking circular hole (22) of the leveling base plate (16).
4. A printing substrate leveling device for a 3D printer according to claim 3, It is characterized in that The leveling substrate (16) is provided with an L-shaped groove (27) at the position of the locking circular hole (22); the L-shaped groove (27) passes through the middle of the locking circular hole (22), and one end of the L-shaped groove (27) passes through one side of the leveling substrate (16); the locking screw (23) is located on one side of the locking circular hole (22); when the locking screw (23) is tightened on the leveling substrate (16), the leveling substrate (16) is deformed and clamps the round head column (21).
5. A printing substrate leveling device for a 3D printer according to claim 4, It is characterized in that The printing substrate assembly also includes a printing substrate (24), a screw hole (25) is provided at the bottom of the printing substrate (24), a connecting screw (26) is passed through the bottom of the leveling substrate (16), and the connecting screw (26) is threadedly adapted in the screw hole (25).
Citation Information
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