Welding packaging structure of thick film heater

By designing continuous steps on the edge of the metal substrate of the thick film heater and arranging mica sheets on the inner surface, the problem of excessive welding gap is solved, and efficient automated welding and high-quality welding packaging are achieved.

CN222154387UActive Publication Date: 2024-12-13卫民
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Patent Information

Application Number
CN202420902881.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-28
Publication Date
2024-12-13
Estimated Expiration
2034-04-28

AI Technical Summary

Technical Problem

The welding packaging structure of the existing thick film heater has too large welding gap due to the flat plate shape and parallel spacing of the metal substrate, making it difficult to achieve automated welding of the machine, resulting in low production efficiency and unstable welding quality.

Method used

The edges of the two-piece metal substrate are designed to be equipped with continuous steps, allowing a gap of 0 to 0.7 mm during welding, suitable for machine automation welding, and mica sheets are arranged on the inner surface for insulating isolation.

Benefits of technology

It realizes efficient automated welding, improves production efficiency and welding quality, and ensures the stability of welding packaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

A welding packaging structure of a thick film heater comprises two metal substrates which are parallel and opposite to each other, the edges of the two metal substrates are fixedly packaged, a thick film heating circuit is printed on the inner surface of each metal substrate, a continuous step is arranged on the whole edge of one metal substrate, and the step is opposite to the surface edge of the other metal substrate and is welded and packaged with the surface edge of the other metal substrate. According to the utility model, the design is reasonable, the continuous steps are arranged on the whole edges of the metal substrates, and the edges of the two metal substrates can be attached or keep a proper small gap during welding, so that the automatic welding of a machine can be completely carried out, the production efficiency is greatly improved, and the welding and packaging quality is high.
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Description

Technical Field

[0001] The utility model relates to a thick film heating device, in particular to a welding packaging structure of a thick film heater. Background Art

[0002] Thick film heating devices have obvious advantages in electric heating applications due to their fast heating speed, uniform temperature distribution, and high thermal efficiency. At present, many thick film heaters use two metal substrates with thick film heating circuits printed on them, which are parallel and welded at the edges to form a package. This can protect the thick film heating circuit and prevent the two metal substrates from thermal deformation due to temperature asymmetry. However, since the metal substrates are generally flat and there is a parallel gap between the two sheets, the gap between the edges of the two metal substrates during welding is too large, and machine automated welding is almost impossible. Manual welding correction is usually required, the production efficiency is not ideal, and the welding quality is not stable enough. Summary of the invention

[0003] In view of the deficiencies of the prior art, the utility model provides a welding packaging structure of a thick film heater which has a reasonable design and is convenient for automatic welding.

[0004] The utility model comprises two parallel metal substrates which are facing each other and fixedly packaged at their edges. A thick film heating circuit is printed on the inner surface of each metal substrate. The entire edge of one metal substrate is provided with continuous steps, which face the surface edge of the other metal substrate and are welded and packaged.

[0005] The utility model has a reasonable design, and a continuous step is provided on the entire edge of the metal substrate. The edges of the two metal substrates can be fitted or maintain a suitable small gap during welding, and machine automated welding can be fully performed, which greatly improves production efficiency and has high welding packaging quality.

[0006] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is the main schematic diagram of the embodiment.

[0008] Figure 2 It is the main schematic diagram of the metal substrate.

[0009] Figure 3 yes Figure 1 Enlarged schematic diagram of the AA section.

[0010] Figure 4 yes Figure 3 Another form of schematic diagram. DETAILED DESCRIPTION

[0011] like Figures 1 to 3As shown, two metal substrates 1 are parallel and face each other, and a thick film heating circuit 2 is printed on the inner surface of each metal substrate 1. A continuous step 3 is provided on the entire edge of one metal substrate 1, and the step 3 and the surface edge of the other metal substrate 1 face each other and are welded and packaged. The edges of the two metal substrates 1 can maintain a gap of 0 to 0.7 mm during welding, which is completely suitable for machine automated welding.

[0012] In this embodiment, a mica sheet 4 is arranged between the inner surfaces of the two metal substrates 1 for insulation and isolation to prevent the two thick film heating circuits 2 from conducting in contact with each other.

[0013] In fact, if Figure 4 As shown, a continuous step 3 may also be provided on the entire edge of another metal substrate 1 , and the steps 3 of the two metal substrates 1 are directly opposite and welded for packaging, which is also suitable for machine automated welding.

Claims

1. A welding package structure of a thick film heater, comprising two parallel metal substrates facing each other and fixedly packaged at their edges, each metal substrate having a thick film heating circuit printed on its inner surface, characterized by: The entire edge of a metal substrate (1) is provided with a continuous step (3), and the step (3) and the surface edge of another metal substrate (1) are directly opposed and welded for packaging.

2. The welding packaging structure of the thick film heater according to claim 1 is characterized by: The entire edge of the other metal substrate (1) is also provided with a continuous step (3), and the steps (3) of the two metal substrates (1) are directly opposite to each other and are welded and packaged.

3. The welding packaging structure of the thick film heater according to claim 1 or 2, characterized in that: A mica sheet (4) is arranged between the inner surfaces of the two metal substrates (1) for insulation and isolation.

Citation Information

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