Heat dissipation substrate and aircraft
By setting a spoiler hole on the heat dissipation substrate, the problem of the heat dissipation needs of SIC modules in electric flying cars is solved, and the effect of efficient cooling and weight reduction is achieved, meeting the performance indicators of flying cars.
Patent Information
- Application Number
- CN202420898283.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-26
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-04-26
AI Technical Summary
The cooling requirements of SIC modules in existing electric flying cars are difficult to meet while ensuring the high integration of the power system. The thermal conductivity of the cooling oil is insufficient and cannot meet the cooling requirements for peak operating conditions.
Design a heat dissipation substrate, including a heat dissipation base plate and needle wings, with spoiler holes installed on the needle wings, and spoiler holes extend in the inlet and outlet direction of the coolant. The arrangement of needle wings and spoiler holes increases the turbulence effect and convection of the coolant The heat exchange area is improved, the cooling efficiency is improved, and the heat dissipation ability is enhanced through the gradual increase of the number of spoiler holes.
It effectively improves the peak working condition capability of the SIC module, meets the performance indicators of flying cars, and achieves weight reduction effects, improving cooling efficiency and heat exchange strength.
Smart Images
Figure CN222168387U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of SIC chip heat dissipation, in particular to a heat dissipation substrate and an aircraft. Background Art
[0002] The full name of the electric flying car (eVTOL) is electric vertical take-off and landing aircraft, also known as "flying car", which refers to an electric vertical aircraft that can take off and land in a vertical direction and fly at low altitudes. As a product of aviation electrification, eVTOL is more environmentally friendly and lighter than helicopters, and larger in size than drones. Its outstanding advantages are vertical take-off and landing, no need for airports, more intelligent, low-cost, easy to maintain, high safety, and fast commuting time. It is an inter-city fast transportation tool that flies at a low altitude of 300 meters. It is expected to become one of the practical solutions for future transportation. Application scenarios include 200 kilometers of cross-sea transportation of seafood, high-speed aerial operation of human organs, 120 kilometers of land-to-island takeaway delivery, emergency rescue, agricultural and forestry plant protection, power inspection, police aviation, etc.
[0003] Electric flying cars have now entered the prototype and small-batch mass production stages from the concept sketch stage. In the future, electric flying cars will continue to develop in the direction of large passenger capacity and long endurance, which will also put forward more stringent requirements on the performance indicators of the powertrain of electric flying cars. The SIC module is the key to the conversion of AC to DC in the entire powertrain, so the thermal management of the SIC module is extremely important.
[0004] At present, there are two main ways to dissipate heat for SIC modules in electric flying cars: forced cooling (air cooling) and liquid cooling. As higher requirements are placed on the performance of electric flying cars, liquid cooling will be more widely used as a method with better heat dissipation performance. In view of the development and design experience in electric vehicles, the liquid cooling medium is usually 50% ethylene glycol solution or cooling oil.
[0005] The advantage of using cooling oil as a coolant is that it can achieve a high degree of integration of the electric drive assembly on the electric flying car, greatly reducing the volume of the assembly and contributing to the weight reduction of the whole machine. However, the disadvantage of using cooling oil as a coolant is that its thermal conductivity is not as good as that of 50% ethylene glycol solution. Under the same peak operating conditions, cooling oil as a coolant often cannot meet the heat dissipation requirements of the SIC module. Therefore, how to ensure the high degree of integration of the power system while also meeting the heat dissipation requirements of the SIC module has become a problem that electric flying car electric drive system suppliers need to solve. Utility Model Content
[0006] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a heat dissipation substrate to solve the problems mentioned in the above background technology section.
[0007] The utility model is realized by the following technical solutions:
[0008] A heat dissipation substrate comprises a heat dissipation bottom plate, wherein a plurality of pin fins are arranged at intervals on the end surface of the heat dissipation bottom plate contacting the cooling liquid, and the pin fins are provided with a plurality of spoiler holes, and the spoiler holes are extended along the inlet and outlet direction of the cooling liquid.
[0009] Furthermore, the spoiler holes located on each of the pin-fins are arranged coplanarly along a horizontal plane.
[0010] Furthermore, a plurality of the pin fins are arranged in a non-linear manner at intervals in the inlet and outlet directions of the coolant, and the number of the spoiler holes gradually increases from the inlet direction to the outlet direction of the coolant.
[0011] Furthermore, the pin fin is cylindrical, the diameter of the pin fin is 2.3 mm ± 0.2 mm, and the height of the pin fin is 5.8 mm ± 0.2 mm.
[0012] Furthermore, the spoiler hole is a circular hole, the diameter of the spoiler hole is 0.2 mm±0.05 mm, and the distance between two adjacent spoiler holes in one pin wing is 0.88±0.05 mm.
[0013] Furthermore, the plurality of spoiler holes are linearly arranged along the height direction of the pin fins.
[0014] Furthermore, the spoiler hole is a circular hole, an elliptical hole, a rectangular hole, a semicircular hole, a semi-elliptical hole or a diamond hole.
[0015] Furthermore, it also includes a base, the base and the heat dissipation base plate are closed to each other to form a cavity for the flow of coolant, and the pin fins are located inside the cavity; the base is provided with a liquid inlet and a liquid outlet connected to the cavity.
[0016] Furthermore, the vertical spacing between the pin fin and the base is less than or equal to mm.
[0017] An aircraft comprises a heat dissipation substrate as described in any one of the above items.
[0018] The beneficial effects of the utility model are as follows: a heat dissipation substrate comprises a heat dissipation base plate, wherein the heat dissipation base plate is provided with a plurality of pin fins at intervals on the end surface contacting the coolant, and the pin fins are provided with a plurality of spoiler holes, and the spoiler holes are extended along the inlet and outlet direction of the coolant; by providing the spoiler holes, on the one hand, the turbulent effect of the coolant can be enhanced and the heat exchange intensity of the coolant can be improved, and on the other hand, the convection heat exchange area between the coolant and the pin fins is increased. This design can effectively improve the peak operating capacity of the SIC module, while meeting the performance indicators of the flying car, and the existence of the spoiler holes can also achieve the purpose of weight reduction, killing two birds with one stone. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a three-dimensional diagram of the utility model.
[0020] Figure 2 It is an exploded view of the utility model.
[0021] Figure 3 It is a central cross-sectional view of the utility model.
[0022] Figure 4 It is a three-dimensional diagram of the heat dissipation base plate of the utility model.
[0023] Figure 5 It is a side view of the heat dissipation base plate of the utility model.
[0024] Figure 6 for Figure 5 AA section view.
[0025] The above drawings include the following reference numerals:
[0026] 1. Heat dissipation base plate; 11. Pin fins; 111. Turbine holes; 2. Base; 21. Liquid inlet; 22. Liquid outlet; 23. Cavity; 24. Spacing space; 3a1. U-phase DBC; 3a2. V-phase DBC; 3a3. W-phase DBC; 4b. SIC chip. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is claimed, but merely represents selected embodiments of the utility model.
[0028] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.
[0029] Reference Figures 1 to 6As shown, a heat dissipation substrate comprises a heat dissipation base plate 1 and a base 2. The base 2 and the heat dissipation base plate 1 are closed to form a cavity 23 for the flow of coolant. The base 2 is formed with a liquid inlet 21 and a liquid outlet 22 connected to the cavity 23. The upper end surface of the heat dissipation base plate 1 is used for mounting the U-phase DBC3a1, the V-phase DBC3a2 and the W-phase DBC3a3. The SIC chip 4b is welded on the above DBCs by a silver sintering process. The UVW three-phase DBCs are respectively welded on the upper surface of the heat dissipation base plate 1 by a vacuum reflow process. The SIC chip 4b and its DBCs are encapsulated with copper terminals by a plastic encapsulation method to form a SIC module.
[0030] The coolant enters the cavity 23 through the liquid inlet 21, flows in the cavity 23 and takes away the heat of the SIC chip 4b, and finally flows out from the liquid outlet 22. With the aid of an onboard heat exchanger, the heat carried by the coolant is transferred to the surrounding air to reduce the temperature of the coolant, and then the coolant re-enters from the liquid inlet 21 under the action of the oil pump. The above process is repeated continuously to achieve continuous cooling of the SIC module.
[0031] The main improvements of the utility model are as follows: the heat dissipation base plate 1 is provided with a plurality of pin fins 11 at intervals on the end surface in contact with the coolant, and the pin fins 11 are provided with a plurality of spoiler holes 111, and the plurality of spoiler holes 111 are extended along the inlet and outlet direction of the coolant. By providing the spoiler holes 111, on the one hand, the turbulent effect of the coolant can be enhanced and the heat exchange intensity of the coolant can be improved, and on the other hand, the convection heat exchange area between the coolant and the pin fins 11 is increased. This design can effectively improve the peak operating capacity of the SIC module, meet the performance indicators of the flying car, and the existence of the spoiler holes 111 can also achieve the purpose of weight reduction, killing two birds with one stone.
[0032] Reference Figure 5 and Figure 6 As shown, the spoiler holes 111 on each pin fin 11 are arranged in the same plane along the horizontal plane. The arrangement of the spoiler holes 111 can make part of the coolant collide with the pin fin 11 to form turbulence, and the other part of the coolant directly passes through the spoiler holes 111 in the horizontal direction, which can increase the flow rate of the coolant accordingly, thereby increasing the heat exchange rate. The horizontal direction is the inlet and outlet direction of the coolant, that is, the plane direction formed by the liquid inlet 21 and the liquid outlet 22 parallel to the base 2.
[0033] After many tests, it was found that, compared with the solution in which the spoiler holes 111 are arranged at an angle to the horizontal plane, although this solution can increase the convection heat exchange area between the coolant and the pin fins 11 accordingly, the inclined arrangement of the spoiler holes 111 will greatly reduce the flow rate of the coolant through the pin fins 11. Through experimental statistics of the solutions of the inclined and horizontal arrangements of the spoiler holes 111, it was found that the horizontal arrangement of the spoiler holes 111 along the flow direction of the coolant can maximize the cooling efficiency of the SIC module.
[0034] The pin fins 11 are arranged in a non-linear manner in the direction of the coolant inlet and outlet. Figure 4 and Figure 6 As shown, when the heat dissipation base plate 1 adopts a rectangular structure, the inlet and outlet direction of the coolant is parallel to the length direction of the heat dissipation base plate 1. The pin fins 11 form a row along the width direction of the heat dissipation base plate 1, and there are multiple rows of pin fins 11 arranged along the length direction of the heat dissipation base plate 1. The pin fins 11 of two adjacent rows are arranged in a staggered manner. Through the staggered arrangement structure of the pin fins 11, the turbulence effect of the pin fins 11 on the coolant can be improved, and the number of contacts between the coolant and the pin fins 11 can be increased, thereby improving the cooling efficiency of the SIC module.
[0035] And the number of spoiler holes 111 gradually increases from the inlet direction to the outlet direction of the coolant. That is, along the direction from U-phase DBC3a1 to V-phase DBC3a2 and finally to W-phase DBC3a3, the number of spoiler holes 111 increases. By increasing the number of spoiler holes 111, the heat dissipation capacity is gradually enhanced, so that the temperatures of the SIC chips 4b located at U-phase DBC3a1, V-phase DBC3a2, and W-phase DBC3a3 are close or the same, and the temperature equalization effect is achieved. That is, the flow resistance, flow velocity, and heat exchange area of the coolant corresponding to different heat dissipation zones under U-phase DBC3a1, V-phase DBC3a2, and W-phase DBC3a3 are adjusted, thereby ensuring that the temperature between each power module remains relatively balanced, reducing the temperature difference, and improving the heat dissipation effect.
[0036] There are two ways to gradually increase the number of spoiler holes 111 from the inlet direction to the outlet direction of the coolant. The first way is: the number of spoiler holes 111 corresponding to the pin-fins 11 in different heat dissipation zones is different, for example, the number of spoiler holes 111 of the pin-fins 11 in the heat dissipation zone corresponding to the U-phase DBC3a1 is three, the number of spoiler holes 111 of the pin-fins 11 in the heat dissipation zone corresponding to the V-phase DBC3a2 is four, and the number of spoiler holes 111 of the pin-fins 11 in the heat dissipation zone corresponding to the W-phase DBC3a3 is five. The second way is: some of the pin-fins 11 in different heat dissipation zones have spoiler holes 111, and some of the pin-fins 11 do not have spoiler holes 111. By changing the number of pin-fins 11 with spoiler holes 111 and the number of pin-fins 11 without spoiler holes 111 in different heat dissipation zones, the number of spoiler holes 111 increases gradually from the inlet direction to the outlet direction of the coolant.
[0037] The pin fin 11 is used to create a turbulent effect on the coolant, thereby enhancing the heat exchange rate. The pin fin 11 can be a cylindrical, elliptical, rectangular, semi-cylindrical, semi-elliptical or multi-prism structure. Preferably, the pin fin 11 is cylindrical, which is easy to process. The diameter of the pin fin 11 is 2.3 mm ± 0.2 mm, and the height of the pin fin 11 is 5.8 mm ± 0.2 mm.
[0038] The spoiler holes 111 may be one or more combinations of circular holes, elliptical holes, rectangular holes, semicircular holes, semielliptical holes or diamond holes, etc. The spoiler holes 111 on the same pin fin 11 may have the same or different shapes.
[0039] Preferably, the spoiler hole 111 is a circular hole, the spoiler hole 111 is centered and laterally penetrates the central axis of the cylindrical pin fin 11, the diameter of the spoiler hole 111 is 0.2 mm ± 0.05 mm, and the spacing between two adjacent spoiler holes 111 in one pin fin 11 is 0.88 ± 0.05 mm. The spoiler holes 111 with this spacing and size can maximize the cooling efficiency of the SIC module while ensuring the miniaturization of the heat dissipation substrate.
[0040] The number of spoiler holes 111 is greater than or equal to three. Preferably, the number of spoiler holes 111 is five and they are arranged at equal intervals. This number can ensure that the pin fins 11 are not deformed by the impact of the coolant, and the number of spoiler holes 111 is increased to the maximum extent, so as to achieve the purpose of reducing the weight of the heat dissipation base plate 1, and to maximize the contact area between the coolant and the pin fins 11. Compared with the conventional cylindrical pin fin 11 structure without spoiler holes 111, the pin fin 11 with spoiler holes 111 designed in the utility model has an increased leakage area of 40%, thereby increasing the contact area between the coolant and the pin fin 11 by 40%, greatly enhancing the heat dissipation capacity of the heat dissipation base plate to the SIC chip 4b.
[0041] The cooling liquid in the upper space is in contact with the heat dissipation base plate 1 and the pin fins 11, and the temperature rises, forming a hot cooling liquid. The cooling liquid moving in the lower space does not directly contact the heat dissipation base plate 1 and the pin fins 11, and will maintain the original temperature, forming a cold cooling liquid. The heat dissipation base plate 1 extends toward the cavity 23 to form the above-mentioned pin fins 11; the vertical spacing space 24 between the pin fins 11 and the base 2 is less than or equal to 1mm, and the spacing space 24 refers to Figure 3 As shown in H, under the premise of ensuring the length of the pin fin 11 as much as possible, the spacing space 24 is used for mixing and heat exchange of cold coolant and hot coolant in the spacing space 24, thereby improving the cooling efficiency of the SIC module.
[0042] Preferably, the coolant is cooling oil. The advantage of cooling oil is that it can achieve a high degree of integration of the electric drive assembly on the electric flying car. By utilizing the original cooling oil circulation system of the electric flying car, there is no need to install other cooling equipment, thereby greatly reducing the volume of the assembly and contributing to the weight reduction of the entire machine.
[0043] On the other hand, the utility model provides an aircraft, comprising the above-mentioned heat dissipation substrate.
[0044] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A heat dissipation substrate, comprising a heat dissipation base plate (1), characterized in that: The heat dissipation base plate (1) is provided with a plurality of pin fins (11) at intervals on the end surface contacting the cooling liquid, and the pin fins (11) are provided with a plurality of spoiler holes (111), and the spoiler holes (111) are extended along the inlet and outlet direction of the cooling liquid.
2. A heat dissipation substrate according to claim 1, characterized in that: The spoiler holes (111) located on each of the pin fins (11) are arranged coplanarly along a horizontal plane.
3. The heat dissipation substrate according to claim 1, characterized in that: The plurality of pin fins (11) are arranged in a non-linear manner at intervals in the inlet and outlet directions of the coolant, and the number of the spoiler holes (111) gradually increases from the inlet direction to the outlet direction of the coolant.
4. The heat dissipation substrate according to claim 1, characterized in that: The pin fin (11) is cylindrical, the diameter of the pin fin (11) is 2.3 mm±0.2 mm, and the height of the pin fin (11) is 5.8 mm±0.2 mm.
5. The heat dissipation substrate according to claim 1, characterized in that: The spoiler hole (111) is a circular hole, the diameter of the spoiler hole (111) is 0.2 mm±0.05 mm, and the distance between two adjacent spoiler holes (111) on one of the pin fins (11) is 0.88±0.05 mm.
6. The heat dissipation substrate according to claim 1, characterized in that: The plurality of spoiler holes (111) are linearly arranged along the height direction of the pin fin (11).
7. The heat dissipation substrate according to claim 1, characterized in that: The spoiler hole (111) is a circular hole, an elliptical hole, a rectangular hole, a semicircular hole, a semi-elliptical hole or a diamond hole.
8. A heat dissipation substrate according to any one of claims 1 to 7, characterized in that: The invention also comprises a base (2), wherein the base (2) and the heat dissipation base plate (1) are closed to each other to form a cavity (23) for the flow of coolant, and the pin fins (11) are located inside the cavity (23); the base (2) is provided with a liquid inlet (21) and a liquid outlet (22) communicating with the cavity (23).
9. The heat dissipation substrate according to claim 8, characterized in that: The vertical spacing space (24) between the pin fin (11) and the base (2) is less than or equal to 1 mm.
10. An aircraft, characterized in that: It comprises a heat dissipation substrate as claimed in any one of claims 1 to 9.