Support structure with laterally-arranged main chip and packaging structure applying support structure
By designing the bracket structure and integrated packaging solution on the side of the main chip, the high cost and complexity problems in traditional chip packaging are solved, and the efficient integrated packaging of the main chip and the secondary chip is achieved, reducing the packaging cost and improving the product Applicability and heat dissipation performance.
Patent Information
- Application Number
- CN202420543561.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-20
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-03-20
AI Technical Summary
In traditional chip packaging technology, the main chip and the secondary chip are usually packaged separately, resulting in increased costs and the packaging process is complicated, making it difficult to achieve efficient integrated packaging.
Design a side-mounted bracket structure of the main chip, including a carrier board, a main base, a secondary base, a main chip and a secondary chip. Through the combination of a grid-shaped heat dissipation bracket and a connecting arm, the integrated packaging of the main chip and the secondary chip is realized. , use graphite materials to improve heat dissipation effect, and optimize the use of fill curing agent through overflow space and through-flow holes.
It simplifies the packaging process, reduces costs, improves the product suitability and heat dissipation capabilities after packaging, and ensures stable placement of the chip and good heat dissipation effect.
Smart Images
Figure CN222190724U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip packaging, in particular to a bracket structure for side-mounting a main chip and a packaging structure using the bracket structure. Background Art
[0002] LED is a solid-state semiconductor device that can convert electrical energy into light energy. It has the advantages of low power consumption, good luminous effect, strong controllability and long service life. In the manufacturing process of LED, the driver chip needs to be packaged. In the traditional technical solution, due to the limitations of materials and packaging technology, the main chip and the auxiliary chip are usually packaged separately, which will lead to an increase in cost. In order to save costs, it is necessary to package the main chip and the auxiliary chip together, and the current packaging technology is mature. In view of this, a bracket structure with a main chip on the side and a packaging structure using the bracket structure are proposed. Utility Model Content
[0003] The utility model aims to provide a support structure with a main chip placed on the side and a packaging structure using the support structure, which can support the packaging of the main chip and the auxiliary chip together.
[0004] The above technical objectives of the utility model are achieved through the following technical solutions:
[0005] A support structure with a main chip placed on the side, comprising a carrier, a main base, a first sub-base, a second sub-base, a main chip, a first sub-chip and a second sub-chip, wherein the main base, the first sub-base and the second sub-base are arranged on the carrier, the main chip is arranged on the main base, the first sub-chip is arranged on the first sub-base, the second sub-chip is arranged on the second sub-base, the first sub-chip and the second sub-chip are arranged adjacent to each other, and the main chip is arranged on one side of the first sub-chip or the second sub-chip.
[0006] In a preferred embodiment, a main receiving groove is provided on the main base, a first secondary receiving groove is provided on the first secondary base, a second secondary receiving groove is provided on the second secondary base, the main chip is provided in the main receiving groove, the first secondary chip is provided in the first secondary receiving groove, and the second secondary chip is provided in the second secondary receiving groove.
[0007] In a preferred embodiment, a main heat dissipation bracket is provided in the main receiving groove, a first auxiliary heat dissipation bracket is provided in the first auxiliary receiving groove, and a second auxiliary heat dissipation bracket is provided in the second auxiliary receiving groove. The main heat dissipation bracket, the first auxiliary heat dissipation bracket and the second auxiliary heat dissipation bracket are arranged in a grid shape, and the grid is filled with a filling curing agent for pasting. A first heat dissipation connecting arm is provided between the main heat dissipation bracket and the first auxiliary heat dissipation bracket, and a second heat dissipation connecting arm is provided between the main heat dissipation bracket and the second auxiliary heat dissipation bracket.
[0008] In a preferred embodiment, a first overflow space is formed between the outer wall of the main heat dissipation support and the inner wall of the main receiving groove, a second overflow space is formed between the outer wall of the first auxiliary heat dissipation support and the inner wall of the first auxiliary receiving groove, and a third overflow space is formed between the outer wall of the second auxiliary heat dissipation support and the inner wall of the second auxiliary receiving groove.
[0009] In a preferred embodiment, the bottoms of the main heat dissipation support, the first auxiliary heat dissipation support and the second auxiliary heat dissipation support are provided with flow holes.
[0010] In a preferred embodiment, the main heat dissipation support, the first auxiliary heat dissipation support, the second auxiliary heat dissipation support, the first heat dissipation connecting arm and the second heat dissipation connecting arm are made of graphite.
[0011] A packaging structure comprises the support structure with the main chip side-placed.
[0012] Compared with the prior art, the present invention packages the main chip, the first sub-chip and the second sub-chip together, so that the packaging process is simplified and the packaging cost is reduced. At the same time, in terms of position arrangement, the main chip is placed sideways, which can conform to the conventional wiring method, so that the packaged product has better applicability. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 The utility model is a structural schematic diagram of a bracket structure with a main chip placed on the side (including a chip).
[0014] Figure 2 The utility model is a structural schematic diagram of a bracket structure with a main chip placed on the side (without the chip).
[0015] Figure 3 The utility model is a partial longitudinal section structure schematic diagram of a support structure with a main chip placed on the side.
[0016] In the picture
[0017] Carrier 1; main base 2; main receiving groove 3; main heat dissipation bracket 4; first sub-base 5; first sub-receiving groove 6; first sub-heat dissipation bracket 7; second sub-base 8; second sub-receiving groove 9; second sub-heat dissipation bracket 10; main chip 11; first sub-chip 12; second sub-chip 13; filling curing agent 14; first overflow space 15; second overflow space 16; third overflow space 17; circulation hole 18; first heat dissipation connecting arm 19; second heat dissipation connecting arm 20. DETAILED DESCRIPTION
[0018] The utility model is further described in detail below in conjunction with the accompanying drawings.
[0019] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.
[0020] like Figures 1 to 3 As shown, a support structure with a main chip 11 placed on the side includes a carrier 1, a main base 2, a first sub-base 5, a second sub-base 8, a main chip 11, a first sub-chip 12 and a second sub-chip 13, wherein the main base 2, the first sub-base 5 and the second sub-base 8 are arranged on the carrier 1, the main chip 11 is arranged on the main base 2, the first sub-chip 12 is arranged on the first sub-base 5, the second sub-chip 13 is arranged on the second sub-base 8, the first sub-chip 12 and the second sub-chip 13 are arranged adjacent to each other, and the main chip 11 is arranged on one side of the first sub-chip 12 or the second sub-chip 13.
[0021] In this embodiment, the main chip 11, the first sub-chip 12 and the second sub-chip 13 are packaged together, so that the packaging process is simplified and the packaging cost is reduced. At the same time, in terms of position arrangement, the main chip 11 is placed on the side, which can conform to the conventional wiring method, so that the packaged product has better applicability.
[0022] In order to make the placement of the chip more stable, a main receiving groove 3 is provided on the main base 2, a first secondary receiving groove 6 is provided on the first secondary base 5, and a second secondary receiving groove 9 is provided on the second secondary base 8. The main chip 11 is arranged in the main receiving groove 3, the first secondary chip 12 is arranged in the first secondary receiving groove 6, and the second secondary chip 13 is arranged in the second secondary receiving groove 9, thereby achieving stable placement of each chip.
[0023] In order to improve the heat dissipation capacity so that the heat after concentrated packaging can be quickly discharged, a main heat dissipation bracket 4 is provided in the main receiving groove 3, a first auxiliary heat dissipation bracket 7 is provided in the first auxiliary receiving groove 6, and a second auxiliary heat dissipation bracket 10 is provided in the second auxiliary receiving groove 9. The main heat dissipation bracket 4, the first auxiliary heat dissipation bracket 7 and the second auxiliary heat dissipation bracket 10 are arranged in a grid shape, and the grid is filled with a filling curing agent 14 for pasting. The filling curing agent 14 is used to paste the chip. A first heat dissipation connecting arm 19 is provided between the main heat dissipation bracket 4 and the first auxiliary heat dissipation bracket 7, and a second heat dissipation connecting arm 20 is provided between the main heat dissipation bracket 4 and the second auxiliary heat dissipation bracket 10.
[0024] Under the above structural setting, the main heat dissipation bracket 4, the first sub-heat dissipation bracket 7 and the second sub-heat dissipation bracket 10 are used to achieve heat conduction on the one hand, and to support the chip on the other hand. The grid-like setting is convenient for limiting the flow area of the filling curing agent 14 on the one hand, avoiding the filling curing agent 14 from contaminating the front side of the chip during the chip placement process, and on the other hand, the grid-like setting can achieve good heat dissipation effect.
[0025] Due to the connection between the first heat dissipation connecting arm 19 and the second heat dissipation connecting arm 20 , the structure is more integrated, which is beneficial to improving the stability of the structure.
[0026] Furthermore, a first overflow space 15 is formed between the outer wall of the main heat dissipation bracket 4 and the inner wall of the main receiving groove 3, a second overflow space 16 is formed between the outer wall of the first auxiliary heat dissipation bracket 7 and the inner wall of the first auxiliary receiving groove 6, and a third overflow space 17 is formed between the outer wall of the second auxiliary heat dissipation bracket 10 and the inner wall of the second auxiliary receiving groove 9. In fact, the cross-sectional area of the chip is larger than that of the heat dissipation bracket. When the chip is placed, the filling curing agent 14 is likely to overflow the grid space of the heat dissipation bracket. After the overflow space is set, an overflow space is provided for the excess filling curing agent 14, thereby preventing the excess filling curing agent 14 from contaminating the front side of the chip.
[0027] In order to allow the filling curing agent 14 to fill the lattice space of the heat dissipation bracket, flow holes 18 are set at the bottom of the main heat dissipation bracket 4, the first auxiliary heat dissipation bracket 7 and the second auxiliary heat dissipation bracket 10. The filling curing agent 14 can flow in the flow holes 18 to completely fill the internal lattices of the heat dissipation bracket.
[0028] Furthermore, in order to achieve better heat dissipation effect, the main heat dissipation bracket 4, the first auxiliary heat dissipation bracket 7, the second auxiliary heat dissipation bracket 10, the first heat dissipation connecting arm 19 and the second heat dissipation connecting arm 20 are made of graphite, and the good thermal conductivity of graphite is used to achieve rapid transfer and dissipation of heat.
[0029] Embodiment 2:
[0030] A packaging structure includes the support structure with the main chip 11 side-placed as described in the first embodiment.
[0031] The above description of the embodiments is to facilitate the understanding and use of the present invention by ordinary technicians in the technical field. It is obvious that those familiar with the technical field can easily make various modifications to the embodiments and apply the general principles described here to other embodiments without creative work. Therefore, the present invention is not limited to the above embodiments. Improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the present invention should be within the scope of protection of the present invention.
Claims
1. A support structure with a main chip placed on the side, characterized in that: The invention comprises a carrier, a main base, a first sub-base, a second sub-base, a main chip, a first sub-chip and a second sub-chip, wherein the main base, the first sub-base and the second sub-base are arranged on the carrier, the main chip is arranged on the main base, the first sub-chip is arranged on the first sub-base, the second sub-chip is arranged on the second sub-base, the first sub-chip and the second sub-chip are arranged adjacent to each other, and the main chip is arranged on one side of the first sub-chip or the second sub-chip.
2. A support structure with a main chip placed on the side according to claim 1, characterized in that: The main base is provided with a main receiving groove, the first sub-base is provided with a first sub-receiving groove, the second sub-base is provided with a second sub-receiving groove, the main chip is arranged in the main receiving groove, the first sub-chip is arranged in the first sub-receiving groove, and the second sub-chip is arranged in the second sub-receiving groove.
3. A support structure with a main chip placed on the side according to claim 2, characterized in that: A main heat dissipation bracket is provided in the main receiving groove, a first auxiliary heat dissipation bracket is provided in the first auxiliary receiving groove, and a second auxiliary heat dissipation bracket is provided in the second auxiliary receiving groove. The main heat dissipation bracket, the first auxiliary heat dissipation bracket and the second auxiliary heat dissipation bracket are arranged in a grid shape, and the grid is filled with a filling curing agent for pasting. A first heat dissipation connecting arm is provided between the main heat dissipation bracket and the first auxiliary heat dissipation bracket, and a second heat dissipation connecting arm is provided between the main heat dissipation bracket and the second auxiliary heat dissipation bracket.
4. A support structure with a main chip placed on the side according to claim 3, characterized in that: A first overflow space is formed between the outer wall of the main heat dissipation support and the inner wall of the main receiving groove, a second overflow space is formed between the outer wall of the first auxiliary heat dissipation support and the inner wall of the first auxiliary receiving groove, and a third overflow space is formed between the outer wall of the second auxiliary heat dissipation support and the inner wall of the second auxiliary receiving groove.
5. The support structure with the main chip placed on the side according to claim 3, characterized in that: The bottoms of the main heat dissipation support, the first auxiliary heat dissipation support and the second auxiliary heat dissipation support are provided with flow holes.
6. The support structure with the main chip placed on the side according to claim 3, characterized in that: The main heat dissipation support, the first auxiliary heat dissipation support, the second auxiliary heat dissipation support, the first heat dissipation connecting arm and the second heat dissipation connecting arm are made of graphite.
7. A packaging structure, characterized in that: A support structure for placing the main chip on the side comprising any one of claims 1-6.