Optical cement unloading device

Abstract

The utility model provides an optical cement unloading device. Comprising an optical cement device plate, a plurality of sets of hole structures are arranged on the optical cement device plate, each set of hole structure sequentially comprises a first through hole, a second through hole and a third through hole, and the second through hole is located between the first through hole and the third through hole; the three through holes penetrate through the plate face of the optical cement device plate, the first through hole, the second through hole and the third through hole are formed in the same arc, and the second through hole is located in the arc. Glue can be poured into the through holes, and the optical cement workpiece is pasted on the surface of the optical cement device plate. According to the lower disc device, the structure of an optical cement device plate is improved, a workpiece is optically cement on the optical cement device plate, and the workpiece covers the position of a hole structure. And hot air only needs to be conveyed into the through hole from the other side of the optical cement during disc unloading, so that the local position, covering the through hole, of the workpiece is heated, disc unloading of the workpiece is facilitated, and deformation of the workpiece in the disc unloading process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of optical processing, in particular to an optical glue lower plate device. Background Art

[0002] For some thinner workpieces, they need to be coated with glossy glue on a glossy glue board before polishing. After polishing, the workpieces need to be uncoated.

[0003] After polishing, the surface of the workpiece is very good on the plate, but after it is removed from the plate, due to improper handling of the plate, the surface of the workpiece will be unstable and vary greatly compared to the surface on the plate. This results in the surface of the product being unqualified due to the plate, even though the surface was originally polished very well. For this reason, a light glue plate device is needed that can stabilize the front and back surfaces of the workpiece plate.

[0004] In the prior art, the structure of the optical resin board is a closed flat plate, and the optical resin workpiece is directly pasted on the optical resin board. Based on this structure, the technical solution for the workpiece lowering plate in the prior art is: 1. Use a double-sided blade to pry the edge of the workpiece to create a gap between one end of the workpiece and the optical resin board, so that the force between molecules becomes smaller and the lowering plate is achieved; 2. Use a hot air gun to bake the surface of the workpiece to deform the workpiece. When the deformation changes to a certain extent, a gap is created between the two optical resin surfaces, and the force between molecules is reduced, and the workpiece can be removed; 3. Use a wooden hammer to hit the workpiece to make it fall off the optical resin board. These lowering plate methods will cause a large change in the surface shape of the thin film before and after the lowering plate, and cannot meet the requirements after polishing. Utility Model Content

[0005] The utility model aims to provide a device for removing a light glue plate, which can solve the problem that it is inconvenient to remove a light glue workpiece after it is pasted on a light glue board.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A photoresist lower plate device comprises a photoresist device plate, on which a plurality of groups of hole structures are arranged, each group of hole structures comprises through hole one, through hole two and through hole three in sequence, through hole two is located between through hole one and through hole three; the three through holes all pass through the plate surface of the photoresist device plate, through hole one, through hole two and through hole three are arranged on the same arc, and through hole two is located on the arc; a workpiece can be pasted at the position of the hole structure.

[0008] In some embodiments of the present invention, a plurality of groups of hole structures are arranged on concentric circles.

[0009] In some embodiments of the present invention, a plurality of groups of hole structures are arranged on concentric circles of different radial sizes, and each concentric circle has a plurality of groups of hole structures.

[0010] In some embodiments of the present invention, the distance between through hole one and through hole three is not less than half of the length of the axisymmetric line segment of the optical adhesive workpiece, and not greater than the length of the axisymmetric line segment of the optical adhesive workpiece.

[0011] In some embodiments of the present invention, the optical glue workpiece is axially symmetrical, through hole one, through hole two and through hole three are located in the same straight line, and the line connecting through hole one, through hole two and through hole three and the axially symmetrical line segment of the optical glue workpiece are in the same vertical plane.

[0012] In some embodiments of the present invention, the edge of the optical adhesive device plate is chamfered.

[0013] In some embodiments of the present invention, the opening edges of through hole 1, through hole 2 and through hole 3 are chamfered.

[0014] In some embodiments of the utility model, a three-way syringe is further included, which includes a syringe and a needle installed at the end of the syringe, and the needle has three air outlets, and the arrangement direction of the three air outlets is the same as the arrangement direction of through hole one, through hole two, and through hole three.

[0015] Some embodiments of the present invention further include a hot air gun.

[0016] Compared with the prior art, the technical advantages of the utility model are:

[0017] 1. The structure of the optical glue installation board has been improved. The workpiece is optically glued to the optical glue installation board, and the workpiece covers the position of the hole structure. When unloading, it is only necessary to transport hot air from the other side of the optical glue into the through hole to heat the local position of the workpiece covering the through hole, which is convenient for unloading the workpiece and avoids deformation of the workpiece during unloading.

[0018] 2. The thickness of the optical glue device plate shall not be less than half of the longest geometric symmetry line of the optical glue workpiece, so that when hot air is transported, only the local position of the workpiece covering the through hole is heated and deformed, which solves the problem of directly heating one side of the optical glue and causing the entire workpiece to be heated and deformed.

[0019] 3. In each group of through holes on the optical glue device board, the two side holes are centrally symmetrical with respect to the middle hole, and the sum of their distances from the middle hole is not less than half of the longest geometric symmetry line of the workpiece. This makes the workpiece evenly distributed when subjected to macroscopic forces, solving the problem of plastic deformation caused by local macroscopic forces when the workpiece is under pressure.

[0020] 4. The lower plate device as a whole can reduce the impact of the lower plate process on the workpiece surface shape and improve the product yield rate; the device is simple to operate, saves time and effort, and is suitable for wide promotion and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 This is a schematic diagram of the optical glue lower plate device of the utility model;

[0023] Figure 2 It is a structural schematic diagram of the first-view of the gluing workpiece and the gluing device board in the gluing state;

[0024] Figure 3 for Figure 2 AA structural diagram;

[0025] Figure 4 It is a structural schematic diagram of the second viewing angle of the optical glue workpiece and the optical glue device board in the pasting state;

[0026] Figure 5 for Figure 4 BB structural diagram;

[0027] In the above figure:

[0028] 1- polished workpiece, 101- polished surface of the polished workpiece, 102- polished surface of the polished workpiece, 103- the longest geometric symmetry line of the polished workpiece;

[0029] 2-optical adhesive device board, 201-optical adhesive surface of optical adhesive board, 202-optical adhesive back of optical adhesive board, 203-through hole 1, 204-through hole 2, 205-through hole 3, 206-three through holes connecting line, 207-concentric circles;

[0030] 3-Three-way syringe;

[0031] 4- Heat gun. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0033] It should be noted that when an element is referred to as being "disposed on", "connected to", or "fixed to" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element. In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance.

[0034] The utility model provides a light glue lower plate device, in particular to a lower plate device which can realize the lower plate of a thin workpiece and has consistent and stable front and rear shapes of the lower plate.

[0035] refer to Figures 1 to 5 .

[0036] The optical glue lower plate device includes an optical glue device plate 2, which is in the shape of a flat plate, and in this embodiment, is a circular plate. The optical glue device plate 2 includes an optical glue surface 201 of the optical glue plate and an optical glue back surface 202 of the optical glue plate, which correspond to the two working surfaces of the optical glue device plate 2. The optical glue workpiece includes an optical glue workpiece polishing surface 101 and an optical glue workpiece optical glue surface 102. During the workpiece processing, the optical glue workpiece optical glue surface 102 is pasted on the surface on one side of the optical glue surface 201 of the optical glue board. Ensure that there are no impurities, dirt, deep spots and scratches on the optical glue surface 102 of the optical glue workpiece and the optical glue surface 201 of the optical glue board.

[0037] A plurality of hole structures are arranged on the optical adhesive board, each hole structure includes through hole 1 203, through hole 204 and through hole 3 205 in sequence, through hole 204 is located between through hole 1 203 and through hole 3 205; the three through holes all penetrate the board surface of the optical adhesive device board, that is, penetrate the optical adhesive surface 201 of the optical adhesive board and the optical adhesive back surface 202 of the optical adhesive board, and the plurality of hole structures are arranged on the same arc, and through hole 204 is located on the arc, and through hole 1 203 and through hole 3 205 are located outside the arc. The optical adhesive workpiece 1 can be pasted at the position of the hole structure.

[0038] After photoresist, each photoresist workpiece 1 completely covers the three through holes of the same group, the middle through hole (through hole 204) is located in the middle of the photoresist workpiece 1, and the three through hole connection line 206 is consistent with the direction of the longest geometric symmetry line of the photoresist surface of the photoresist workpiece 1. Since the photoresist workpiece 1 is usually a regular symmetrical shape, taking a rectangular parallelepiped as an example, the longest geometric symmetry line 103 of the photoresist surface of the photoresist workpiece 1 refers to the axial symmetry line in the length direction of the photoresist workpiece 1. What is described here remains consistent, and the three through hole connection line 206 is parallel to the extension direction of the longest geometric symmetry line 103 of the photoresist surface of the photoresist workpiece 1, and is located in the same horizontal plane.

[0039] In some embodiments of the present invention, a plurality of groups of hole structures are arranged on a concentric circle 207 .

[0040] In some embodiments of the present invention, a plurality of groups of hole structures are arranged on concentric circles 207 of different radial sizes, and each concentric circle has a plurality of groups of hole structures.

[0041] That is, according to the number of hole structures and the size of the optical adhesive workpiece 1, the hole structures can be arranged on the same concentric circle, or on two or more concentric circles. The position of the hole structure and the number of hole structures are related to the shape and size of the optical adhesive workpiece 1. It is necessary to ensure that there is a gap between each pair of optical adhesive workpieces 1, and the gap distance is not less than 1.5 times the thickness of the optical adhesive workpiece 1. The optical adhesive workpieces 1 are symmetrically distributed on the optical adhesive device board 2 with the center of the optical adhesive device board 2, and there are no less than 4 optical adhesive workpieces 1 on each concentric circle 207.

[0042] In some embodiments of the utility model, the distance between through hole 1 203 and through hole 3 205 is not less than half of the length of the axisymmetric line segment of the optical adhesive workpiece, and is not greater than the length of the axisymmetric line segment of the optical adhesive workpiece. The apertures of through hole 1 203, through hole 204 and through hole 3 205 are not less than the thickness dimension of the optical adhesive workpiece 1. In this embodiment, the optical adhesive workpiece 1 is a rectangular parallelepiped, and the distance between through hole 1 203 and through hole 3 204 is close to equal to the length of the axis of symmetry of the length direction of the optical adhesive workpiece 1. This design can ensure that the optical adhesive workpiece 1 can be more stably attached to the surface of the optical adhesive device board 2.

[0043] In some embodiments of the present invention, the edges of the optical adhesive device board 2 are chamfered. The edges of the openings of the through hole 1 203, the through hole 204 and the through hole 3 205 are chamfered. This structure can prevent the optical adhesive device board 2 from scratching the operator.

[0044] During the unloading process of the optical glue workpiece 1, heating and ventilation are conducted into the three through holes, so that the unloading operation can be completed without damaging the workpiece.

[0045] In some embodiments of the present invention, a hot air gun 4 is further included, which is used to pass hot air to each through hole to deform the workpiece so that the optical glue workpiece 1 can be removed without damaging the optical glue workpiece 1.

[0046] For the convenience of operation, some embodiments of the present invention further include a three-way syringe 3, which includes a syringe and a needle installed at the end of the syringe. The needle has three air outlets, and the arrangement direction of the three air outlets is the same as the arrangement direction of the through hole 1 203, the through hole 204, and the through hole 3 205. When the lower plate is operated, the three air outlets can be respectively aligned with the three through holes to pump air into the three through holes. This operation can further separate the workpiece 1 at the position where the through hole is located from the optical glue device board 2.

[0047] The method of using and operating the optical glue lower plate device provided by this invention is as follows.

[0048] In some embodiments of the utility model, when the optical glue is unrolled, the hot air is delivered from through hole 1 203, through hole 204 and through hole 3 205 on the optical glue back side 202 of the optical glue board of the optical glue device board 2, so that only the local position of the optical glue workpiece 1 covering through hole 1 203, through hole 204 and through hole 3 205 is deformed by heat, and the delivery of hot air is stopped at this time. The three-way syringe 3 is used to deliver air to through hole 1 203, through hole 204 and through hole 3 205 on the optical glue back side 202 of the optical glue board of the optical glue device board 2, so that the gap between the optical glue workpiece 1 and the optical glue device board 2 at the local deformed position is enlarged, the gravitational force between molecules is reduced, and the optical glue workpiece 1 is unrolled.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for placing optical resin on a plate, characterized in that: It comprises an optical adhesive device plate, on which a plurality of groups of hole structures are arranged, each group of hole structures comprises through hole one, through hole two and through hole three in sequence, through hole two is located between through hole one and through hole three; the three through holes all pass through the plate surface of the optical adhesive device plate, through hole one, through hole two and through hole three are arranged on the same arc, and through hole two is located on the arc; the workpiece can be pasted at the position of the hole structure.

2. The optical resin unloading device according to claim 1, characterized in that: Several groups of hole structures are arranged on concentric circles.

3. The optical resin unloading device according to claim 1, characterized in that: Several groups of hole structures are arranged on concentric circles with different radial sizes, and each concentric circle has multiple groups of hole structures.

4. The optical resin unloading device according to claim 1, characterized in that: The optical adhesive workpiece is of an axisymmetric shape, through hole one, through hole two and through hole three are located on the same straight line, and the line connecting through hole one, through hole two and through hole three and the axisymmetric line segment of the optical adhesive workpiece are located on the same vertical plane.

5. The optical resin unloading device as claimed in claim 4, characterized in that: The distance between the through hole one and the through hole three is not less than half of the length of the axisymmetric line segment of the optical glue workpiece, and not greater than the length of the axisymmetric line segment of the optical glue workpiece.

6. The optical resin unloading device according to claim 1, characterized in that: The edges of the optical adhesive device board are chamfered.

7. The optical resin unloading device according to claim 1, characterized in that: The edges of through holes 1, 2 and 3 are chamfered.

8. The optical resin unloading device according to claim 1, characterized in that: It further includes a three-way syringe, which includes a syringe and a needle installed at the end of the syringe, and the needle has three air outlets, and the arrangement direction of the three air outlets is the same as the arrangement direction of through hole one, through hole two, and through hole three.

9. The optical resin unloading device according to claim 1, characterized in that: A heat gun is further included.

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