Adsorption module and motion system

Abstract

The invention provides an adsorption module and a motion system, and relates to the technical field of precision equipment. The adsorption module comprises an adsorption substrate, a rotating base, a rotating shaft module, a wafer bearing table and a suction cup. The rotating base is fixedly connected with the adsorption substrate, and the rotating shaft module can rotate relative to the rotating base; the rotating shaft module can move in the axial direction of the rotating shaft module relative to the rotating base; the rotating shaft module is configured to be connected with the suction cup or the rotating base in an air pressure connection mode. The wafer bearing table is configured to be capable of adsorbing the suction cup or supporting the suction cup in an air floatation mode.

Description

Technical Field

[0001] The embodiments of the present specification relate to the technical field of precision equipment, and specifically to an adsorption module and a motion system. Background Art

[0002] The workpiece table is a key component of semiconductor equipment, which is used to drive the material for high-precision alignment or scanning. An adsorption module is provided on the workpiece table. The adsorption mechanism of the adsorption module can carry and adsorb materials. The adsorption module can cooperate with other mechanisms to adjust the position of the material in a plane or space. The adsorption module may include a rotating mechanism, and the adsorption mechanism of the adsorption module can cooperate with the rotating mechanism to realize the rotation of the material around a third direction perpendicular to the plane. The rotating mechanism is fixedly connected to the adsorption mechanism to transmit the rotational power to the adsorption mechanism. However, as a power mechanism, the rotating mechanism may still vibrate or shake when it is locked, and the vibration or shake will affect the precise position of the material carried and adsorbed by the adsorption mechanism. Summary of the invention

[0003] One or more embodiments of the present specification provide an adsorption module, which includes: an adsorption substrate, a rotating base, a rotating axis module, a wafer holding table and a suction cup; the rotating base is fixedly connected to the adsorption substrate, and the rotating axis module can rotate relative to the rotating base; the rotating axis module can be displaced in the axial direction of the rotating axis module relative to the rotating base; the rotating axis module is configured to be connected to the suction cup or the rotating base in the form of a pneumatic connection; the wafer holding table is configured to be able to adsorb the suction cup or air-float support the suction cup.

[0004] In some embodiments, the rotating axis module includes: a rotating axis, a vertical decoupling spring and a rotating top plate; the rotating top plate is connected to the rotating axis through the vertical decoupling spring, and the vertical decoupling spring is configured to enable the rotating top plate to be displaced relative to the rotating axis in the axial direction of the rotating axis, and the rotating top plate can rotate with the rotation of the rotating axis; the rotating top plate is configured to be able to adsorb the suction cup or desorb the suction cup; the rotating base is configured to be able to adsorb the rotating top plate; the wafer support platform is arranged outside the rotating top plate.

[0005] In some embodiments, the vertical decoupling reed includes a first region of a vertical decoupling reed connected to the rotating axis, a second region of a vertical decoupling reed connected to the rotating top plate, and a vertical decoupling reed deformation region connecting the first region of the vertical decoupling reed and the second region of the vertical decoupling reed; the vertical decoupling reed deformation region can be deformed so that the first region of the vertical decoupling reed and the second region of the vertical decoupling reed are located in different planes in the axial direction of the rotating axis.

[0006] In some embodiments, the rotating shaft module includes: a rotating shaft; the rotating shaft is air-floatingly connected to the rotating base; the rotating shaft can be displaced in the axial direction of the rotating shaft relative to the rotating base; and the rotating shaft is fixedly connected to the suction cup.

[0007] In some embodiments, it also includes: a limiting structure for limiting the maximum upward displacement of the suction cup in the vertical direction, the limiting structure including: a limiting rod, a limiting member arranged at the upper end of the limiting rod, and a limited member arranged on the adsorption substrate or the wafer stage; the limited member can move upward or downward relative to the limiting rod, and the limiting member limits the maximum upward displacement of the limited member.

[0008] In some embodiments, a micro-motion module is also included, and the micro-motion module includes: at least three vertical drive devices that drive a part of the adsorption substrate to move in a vertical direction of a reference plane; the at least three vertical drive devices include three vertical drive devices whose axes are not coplanar; the vertical drive device includes: a first linear drive mechanism and a second linear drive mechanism connected to the first drive part of the first linear drive mechanism, and the second drive part of the second linear drive mechanism is connected to the adsorption substrate through a drive decoupling mechanism; wherein the driving accuracy of the second linear drive mechanism is higher than the driving accuracy of the first linear drive mechanism.

[0009] In some embodiments, the vertical drive device also includes: a drive device base; a first shell of the first linear drive mechanism is connected to the drive device base, and a second shell of the second linear drive mechanism is connected to the first drive part of the first linear drive mechanism; a portion of the first shell is located on one side of a portion of the second shell; the second shell includes a second accommodating space opening upward for accommodating a portion of the second linear drive mechanism and a connecting plate extending to one side from the opening of the second accommodating space; the first drive part of the first linear drive mechanism is connected to the connecting plate; the second drive part of the second linear drive mechanism moves along the vertical direction.

[0010] In some embodiments, the vertical drive device also includes: a guide device, which is installed on the side of the second shell of the second linear drive mechanism; the guide device includes: a fixed guide rail and a movable guide rail that match each other, the fixed guide rail is connected to the drive device base, and the movable guide rail is connected to the second shell of the second linear drive mechanism; or, the guide device includes: a linear motion guide spring, one end of the linear motion guide spring is connected to the drive device base, and the other end of the linear motion guide spring is connected to the second shell of the second linear drive mechanism.

[0011] In some embodiments, the vertical drive device also includes: a drive device base, a spring mounting seat connected to the drive device base, and a first vertical guide spring; a portion of the first vertical guide spring is connected to the spring mounting seat, and another portion of the first vertical guide spring is connected to the adsorption substrate; the two sides of the first vertical guide spring are symmetrically arranged relative to a vertical plane where the movement direction of the first drive part of the first linear drive mechanism is located.

[0012] In some embodiments, the spring mounting seat is a multi-step structure, the spring mounting seat at least includes a bottom step connected to the drive device base and a top step away from the drive device base, the size of the bottom step is larger than the size of the top step; the vertical guide spring includes a first area connected to the top step of the spring mounting seat, a second area connected to the adsorption substrate and capable of deforming relative to the first area, and a third area for the drive decoupling mechanism to pass through; or, the spring mounting seat includes a mounting seat bottom plate and a spring fixing portion provided on both sides of the mounting seat bottom plate and protruding from the mounting seat bottom plate in the vertical direction; the vertical guide spring includes a mover part connected to the adsorption substrate, two guide parts respectively connected to both sides of the mover part, wherein the drive decoupling mechanism passes through the mover part, the guide part is L-shaped, and the guide part includes a first guide part extending from the mover part to one side and a second guide part extending in the vertical direction connected to the first guide part, the second guide part is connected to the spring fixing part, and the thickness of the mover part is greater than the thickness of the guide part.

[0013] In some embodiments, the vertical drive device also includes: a second vertical guide spring; the second vertical guide spring is arranged between the second shell of the second linear drive mechanism and the drive decoupling mechanism; the two sides of the second vertical guide spring are symmetrically arranged relative to a vertical plane where the movement direction of the second drive part of the second linear drive mechanism is located; the second vertical guide spring is in a straight line, L-shape or C-shape.

[0014] In some embodiments, the drive decoupling mechanism includes: a first decoupling fixed block fixedly connected to the second driving part of the second linear drive mechanism, a second decoupling fixed block fixedly connected to the adsorption substrate, an intermediate decoupling fixed block arranged between the first decoupling fixed block and the second decoupling fixed block, a first decoupling spring connecting the first decoupling fixed block and the intermediate decoupling fixed block, and a second decoupling spring connecting the second decoupling fixed block and the intermediate decoupling fixed block, the first decoupling spring and the second decoupling spring being arranged crosswise; the drive decoupling mechanism is used to decouple the movement of the adsorption substrate into deformation of the first decoupling spring and / or the second decoupling spring.

[0015] In some embodiments, it also includes: one or more first vertical measuring devices, which are connected to the adsorption substrate through a first measurement decoupling mechanism and are used to measure the position and displacement of the adsorption substrate; the first vertical measuring device includes: a vertical measuring device base, a tape mount slidably connected to the vertical measuring device base, a grating scale arranged on the tape mount, and a reading head matching the grating scale arranged in the vertical measuring device base; and also includes: second vertical measuring devices corresponding in number to the first vertical measuring devices, which are used to measure the displacement of the adsorption substrate relative to the second shell of the second linear drive mechanism.

[0016] One or more embodiments of the present specification provide a motion system, which includes: a working surface, a first air-floating guide rail arranged along a first direction on the working surface, a first air-floating guide sleeve supported by air floating on the first air-floating guide rail, a second air-floating guide sleeve connected to the first air-floating guide sleeve and arranged along a second direction, a second air-floating guide sleeve supported by air floating on the second air-floating guide rail, and an adsorption module arranged on the second air-floating guide sleeve; the first air-floating guide sleeve can move along the first air-floating guide rail, and the second air-floating guide sleeve can move along the second air-floating guide rail; the first direction intersects with the second direction; the adsorption module is the adsorption module described in any one of claims 1 to 3.

[0017] In some embodiments, it includes: the first air-floating guide rail has a first vertical mating surface and two first lateral mating surfaces, and an air film is formed between the first air-floating guide sleeve and the first vertical mating surface, and between the first air-floating guide sleeve and the two first lateral mating surfaces; the working surface has a second vertical mating surface, the second air-floating guide rail has two second lateral mating surfaces, and an air film is formed between the second air-floating guide sleeve and the second vertical mating surface, and between the second air-floating guide sleeve and the two second lateral mating surfaces; the first air-floating guide sleeve includes: a first air-floating top plate and two first air-floating blocks arranged on both sides of the first air-floating top plate; the first air-floating top plate provides a first vertical air-floating surface, and the first vertical air-floating surface can be air-floated to support Supported on the first vertical mating surface or adsorbed and fixed on the first vertical mating surface; the first air-floating block provides a first lateral air-floating surface, two of the first lateral air-floating surfaces are arranged opposite to each other, and the two first lateral air-floating surfaces are respectively air-floating supported on the two first lateral mating surfaces; the second air-floating guide sleeve includes: a second air-floating top plate and two second air-floating blocks arranged on both sides of the second air-floating top plate; the second air-floating block provides a second vertical air-floating surface, and the second vertical air-floating surface can be air-floating supported on the second vertical mating surface or adsorbed and fixed on the second vertical mating surface; the second air-floating block provides a second lateral air-floating surface, two of the second lateral air-floating surfaces are arranged opposite to each other, and the two second lateral air-floating surfaces are respectively supported on the two second lateral mating surfaces.

[0018] In some embodiments, the first lateral air-floating surface includes: a first lateral air-floating surface positive pressure area close to the first air-floating top plate, and a first lateral air-floating surface negative pressure area away from the first air-floating top plate; the second lateral air-floating surface includes: a second lateral air-floating surface positive pressure area close to the second air-floating top plate, and a second lateral air-floating surface negative pressure area away from the second air-floating top plate.

[0019] One or more embodiments of the present specification provide an adsorption module, comprising: an adsorption substrate, a rotating base, a rotating shaft, a vertical decoupling spring, a rotating top plate, a wafer support platform, and a suction cup; the rotating base is fixedly connected to the adsorption substrate, and the rotating shaft can rotate relative to the rotating base; the rotating top plate is connected to the rotating shaft through the vertical decoupling spring, and the vertical decoupling spring is configured to enable the rotating top plate to be displaced relative to the rotating shaft in the axial direction of the rotating shaft, and the rotating top plate can rotate with the rotation of the rotating shaft; the rotating top plate is configured to be able to adsorb the suction cup or desorb the suction cup; the rotating base is configured to be able to adsorb the rotating top plate; the wafer support platform is sleeved outside the rotating top plate, and the wafer support platform is configured to be able to adsorb the suction cup or air-float support the suction cup.

[0020] In some embodiments, the vertical decoupling reed includes a first region of a vertical decoupling reed connected to the rotating axis, a second region of a vertical decoupling reed connected to the rotating top plate, and a vertical decoupling reed deformation region connecting the first region of the vertical decoupling reed and the second region of the vertical decoupling reed; the vertical decoupling reed deformation region can be deformed so that the first region of the vertical decoupling reed and the second region of the vertical decoupling reed are located in different planes in the axial direction of the rotating axis.

[0021] One or more embodiments of the present specification provide an adsorption module, comprising: an adsorption substrate, a rotating base, a rotating shaft, a wafer support table and a suction cup; the rotating base is fixedly connected to the adsorption substrate, the rotating shaft can rotate relative to the rotating base, and the rotating shaft can be displaced relative to the rotating base in the axial direction of the rotating shaft; the rotating shaft is fixedly connected to the suction cup; the wafer support table is configured to be able to adsorb the suction cup or to support the suction cup with air floating.

[0022] One or more embodiments of the present specification provide an adsorption module, comprising: a rotating base, a rotating axis module, a wafer support table and a suction cup; the wafer support table is configured to be able to adsorb or desorb materials, and the suction cup is configured to be able to adsorb or desorb materials; the rotating axis module can rotate relative to the rotating base, and the rotating axis module can be displaced in the axial direction of the rotating axis module relative to the rotating base; the rotating axis module is fixedly connected to the suction cup and the rotating axis module is connected to the rotating base in the form of a pneumatic connection to allow the rotating axis module and the suction cup to be displaced in the axial direction relative to the rotating base as a whole; or the rotating axis module is located on the rotating base in the axial direction and the rotating axis module is connected to the suction cup in the form of a pneumatic connection to allow the suction cup to be displaced in the axial direction relative to the rotating axis module and the rotating base as a whole; the wafer support table is configured to be able to adsorb the suction cup or air-float support the suction cup.

[0023] One or more embodiments of the present specification provide an adsorption module, comprising: an adsorption substrate, a rotating base, a rotating axis module, a wafer holding table and a suction cup; the rotating base is fixedly connected to the adsorption substrate, the wafer holding table is configured to be able to adsorb or desorb materials, and the suction cup is configured to be able to adsorb or desorb materials; the rotating axis module can rotate relative to the rotating base, and the rotating axis module can be displaced in the axial direction of the rotating axis module relative to the rotating base; the rotating axis module is fixedly connected to the suction cup and the rotating axis module is connected to the rotating base in the form of a pneumatic connection to allow the rotating axis module and the suction cup to be displaced in the axial direction relative to the rotating base as a whole; or the rotating axis module is located on the rotating base in the axial direction and the rotating axis module is connected to the suction cup in the form of a pneumatic connection to allow the suction cup to be displaced in the axial direction relative to the rotating axis module and the rotating base as a whole; the wafer holding table is configured to be able to adsorb the suction cup or air-float support the suction cup.

[0024] The beneficial effects that may be brought about by the embodiments of this specification include but are not limited to: (1) the adsorption mechanism such as a suction cup is carried and fixed by the wafer table to achieve precise positioning of the suction cup and the material on the suction cup; (2) after the rotation adjustment of the material is completed, the rotating shaft module can be mechanically disengaged from the suction cup and the material to prevent the shaking or vibration of the rotating shaft module relative to the rotating base from affecting the positioning accuracy of the material; (3) the rotating top plate can be moved in the axial direction relative to the rotating shaft through the vertical decoupling spring, thereby realizing the rotational power transmission and rotational power disconnection between the rotating top plate and the suction cup; (4) the rotating shaft and the rotating base can be used to rotate the rotating shaft and the rotating shaft. The air-floating connection of the rotating base realizes the axial movement of the rotating shaft, and cooperates with the wafer stage to fix and support the suction cup with air-floating; (5) The maximum upward displacement of the suction cup is limited by the limit structure to avoid the suction base or the wafer stage being too high, which may cause the suction cup to be too high and cause damage to the material or other equipment; (6) The large-stroke and high-precision drive of the complex movement of the top plate is realized through the combination of the first linear drive mechanism and the second linear drive mechanism, so that the micro-motion module can perform high-precision material posture adjustment and large-stroke material transfer; (7) The decoupling of the complex movement of the top plate is achieved by a drive decoupling mechanism corresponding to the vertical drive mechanism, so as to avoid the shear force on the first linear drive mechanism or the second linear drive mechanism caused by the complex movement of the top plate, and avoid the wear caused by direct friction between the first linear drive mechanism and the second linear drive mechanism and the top plate; (8) the second housing of the second linear drive mechanism is arranged on one side of the first housing of the first linear drive mechanism, so as to reduce the size of the micro-motion module in the vertical direction; (9) the second linear drive mechanism can be arranged on the first linear drive mechanism by extending the connecting plate in the lateral direction (10) The movement of the top plate is guided by the first vertical guide spring, and the two sides have a balanced guiding effect by the symmetrical first vertical guide spring; (11) The multi-step structure of the spring mounting seat allows the first vertical guide spring to extend a longer distance on both sides and have a larger deformation space, thereby allowing the arrangement of the first vertical guide spring with greater flexibility, so that the micro-motion module can not only achieve posture adjustment of the material, but also achieve material transfer with a large stroke; (12) The U-shaped structure of the spring mounting seat allows the first vertical guide spring to deform upward or downward.(13) Guide the movement of the drive decoupling mechanism through the second vertical guiding reed, and make the two sides have a balanced guiding effect through the symmetric second vertical guiding reeds; (14) The design of various different-shaped second vertical guiding reeds gives them different flexibilities to meet different requirements; (15) Achieve the decoupling of the top plate in two directions or even more directions through the drive decoupling mechanism, and decouple the complex movement of the top plate into the single deformation of two reeds through the first decoupling reed and the second decoupling reed; (16) Perform high-precision measurement on the top plate through the first vertical measuring device to achieve vertical large closed-loop control; (17) Realize the separate control of the first linear drive device and the second linear drive device through the combination of the first vertical measuring device with rough precision and the second vertical measuring device with high precision, which is applicable to the situation where the precision and stroke of the measuring device are insufficient; (18) Compensate the force on the structure or various reeds driven by the vertical drive mechanism through the gravity compensation device, so that the high-precision second linear drive device in the vertical drive mechanism has a smaller load, thereby obtaining more accurate vertical positioning performance; (19) Further reduce the size of the micro-motion module in the vertical direction through the setting that the rotating base is flush with the upper surface of the top plate; (20) The cooperation of the air-bearing guide rail and the air-bearing guide sleeve has high rigidity, which can improve the mode of the motion system and make the motion system more stable; (21) Adopt an air-bearing cooperation structure without flexible reeds, with a fast control response speed and a high control bandwidth, thereby improving the production rate; (22) Adopt a U-shaped guide sleeve structure to reduce the overall height of the equipment; (23) By setting a negative pressure area on the side of the air-bearing block away from the air-bearing top plate, avoid the deformation of the U-shaped guide sleeve structure into a flared shape, ensure the stability and reliability of the air-bearing block, and ensure the positioning accuracy of the motion system. It should be noted that the beneficial effects that may be produced by different embodiments are different. In different embodiments, the beneficial effects that may be produced can be any one or several combinations of the above, or any other beneficial effects that may be obtained. Brief Description of the Drawings

[0025] Figure 1 is a schematic diagram of an adsorption module shown in some embodiments of this specification.

[0026] Figure 2 is a cross-sectional schematic diagram of an adsorption module shown in some embodiments of this specification.

[0027] Figure 3 is a schematic diagram of a wafer stage of an adsorption module shown in some embodiments of this specification.

[0028] Figure 4 、 Figure 5 is a cross-sectional schematic diagram of a wafer stage of an adsorption module shown in some embodiments of this specification.

[0029] Figure 6It is a schematic diagram of a rotating base of an adsorption module according to some embodiments of the present specification.

[0030] Figure 7 It is a schematic cross-sectional view of a rotating base of an adsorption module according to some embodiments of the present specification.

[0031] Figure 8 It is a schematic diagram of a vertical decoupling reed of an adsorption module according to some embodiments of the present specification.

[0032] Fig. 9 It is a schematic cross-sectional view of a rotating top plate of an adsorption module according to some embodiments of the present specification.

[0033] Fig.10 It is a schematic diagram of an adsorption module according to other embodiments of the present specification.

[0034] Fig.11 It is a cross-sectional schematic diagram of an adsorption module shown in other embodiments of this specification.

[0035] Fig.12 It is a schematic diagram of a micro-motion module of an adsorption module according to some embodiments of the present specification.

[0036] Fig.13 It is a cross-sectional schematic diagram of the micro-motion module of the adsorption module shown in some embodiments of this specification.

[0037] Fig.14 It is a schematic diagram of a vertical driving device of a micro-motion module of an adsorption module according to some embodiments of the present specification.

[0038] Fig.15 It is a cross-sectional schematic diagram of a vertical driving device of a micro-motion module of an adsorption module according to some embodiments of the present specification.

[0039] Fig.16 It is a schematic diagram of assembling the vertical guide spring of the micro-motion module of the adsorption module according to some embodiments of this specification.

[0040] Fig.17 It is a schematic diagram of a vertical guide spring of a micro-motion module of an adsorption module according to some embodiments of the present specification.

[0041] Fig.18 It is a schematic diagram of assembling the vertical guide spring of the micro-motion module of the adsorption module according to other embodiments of this specification.

[0042] Fig.19 It is a schematic diagram of a vertical guide spring of a micro-motion module of an adsorption module according to other embodiments of this specification.

[0043] Fig. 20 It is a schematic diagram of a vertical guide spring of a micro-motion module of an adsorption module according to some other embodiments of the present specification.

[0044] Fig.21 It is a schematic diagram of the assembly of the linear motion guide spring of the vertical drive device of the micro-motion module of the adsorption module shown in some embodiments of this specification.

[0045] Fig. 22 It is a schematic diagram of the arrangement of the linear motion guide spring of the micro-motion module of the adsorption module shown in some embodiments of this specification.

[0046] Fig.23 It is a schematic diagram of the arrangement of the linear motion guide springs of the micro-motion module of the adsorption module shown in other embodiments of this specification.

[0047] Fig.24 It is a schematic diagram of a guide spring of a second linear drive mechanism of a micro-motion module of an adsorption module according to some embodiments of the present specification.

[0048] Fig.25 It is a schematic diagram of the guide spring of the second linear drive mechanism of the micro-motion module of the adsorption module shown in other embodiments of this specification.

[0049] Fig.26 It is a schematic diagram of a guide spring of a second linear drive mechanism of a micro-motion module of an adsorption module according to some other embodiments of the present specification.

[0050] Fig. 27 , Fig.28 It is a schematic diagram of a first vertical measurement device of a micro-motion module of an adsorption module according to some embodiments of the present specification.

[0051] Fig.29 It is a schematic diagram of the assembly of the second vertical measuring device of the micro-motion module of the adsorption module according to some embodiments of the present specification.

[0052] Fig.30 is a schematic diagram of a motion system according to some embodiments of the present specification.

[0053] Fig.31 Schematic diagram of a first air-floating guide rail and a second air-floating guide rail of a motion system according to some embodiments of the present specification.

[0054] Fig.32 , Fig.33 Schematic diagram of a first air-floating guide sleeve of a motion system according to some embodiments of the present specification.

[0055] Fig.34 , Fig.35Schematic diagram of a second air-floating guide sleeve of a motion system according to some embodiments of the present specification.

[0056] Fig.36 , Fig.37 It is a schematic diagram of the first air-floating guide sleeve of the motion system shown in other embodiments of this specification.

[0057] Fig.38 , Fig.39 It is a schematic diagram of a second air-floating guide sleeve of a motion system according to other embodiments of the present specification.

[0058] Markings in the figure: 100 working surface; 1 first air-floating guide rail; 2 first air-floating guide sleeve; 3 second air-floating guide rail; 4 second air-floating guide sleeve; 5 micro-motion module; 6 adsorption module; 11 first vertical mating surface; 12 first lateral mating surface; 31 second vertical mating surface; 32 second lateral mating surface; 21 first air-floating top plate; 22 first air-floating block; 211 first vertical air-floating surface; 221 first lateral air-floating surface; 41 second air-floating top plate; 42 second air-floating block; 421 second vertical air-floating surface; 422 second lateral air-floating surface; 2211 first lateral air-floating surface positive pressure area; 2212 first lateral air-floating surface negative pressure area; 4221 second lateral air-floating surface positive pressure area; 4222 second lateral air-floating surface negative pressure area; 71 first air-floating guide sleeve driving mechanism; 81 first direction measuring device; 72 second air-floating guide sleeve driving mechanism; 82 second direction measuring device; 9 Limiting structure; 90 limiting motor; 91 limiting rod; 92 limiting member; 93 limited member; 61 adsorption substrate; 62 rotating base; 620 bearing retaining ring; 63 rotating shaft; 64 vertical decoupling spring; 65 rotating top plate; 650 air pressure adjustment area; 651 central ring structure; 652 outer ring structure; 653 connecting structure; 66 wafer support platform; 661 suction cup receiving groove; 6611 negative pressure area of ​​suction cup receiving groove; 6612 positive pressure area of ​​suction cup receiving groove; 6613 negative pressure channel of wafer support platform; 6614 positive pressure channel of wafer support platform; 663 wafer support platform through hole; 67 suction cup; 631 first area of ​​vertical decoupling spring; 632 second area of ​​vertical decoupling spring; 633 deformation area of ​​vertical decoupling spring; 53 vertical driving device; 531 first linear drive mechanism; 5311 first drive unit; 5312 first housing; 532 second linear drive mechanism; 5321 second drive unit; 5322 second housing; 53221 connecting plate; 533 drive device base; 5331 drive device base bottom plate; 5332 drive device base side plate; 534 spring mounting seat; 5341 bottom step; 5342 top step; 5343 mounting seat bottom plate; 5344 spring fixing portion; 535 first vertical guide spring; 5351 first area; 5352 second area; 5353 third area; 5354 mover part; 5355 guide part; 54 drive decoupling mechanism; 541 first decoupling spring; 542 second decoupling spring; 543 first decoupling fixing block; 544 second decoupling fixing block; 545 middle decoupling fixing block; 55 guide device; 551 fixed guide rail; 552 movable guide rail; 553 linear motion guide spring; 5531 linear motion guide spring fixing portion; 5532 linear motion guide spring deformation portion; 56 second vertical guide spring; 561 first connecting structure; 562 second connecting structure; 581 first vertical measuring device;5811 first measurement decoupling mechanism; 5812 vertical measurement device base; 5813 tape mounting seat; 5814 grating ruler; 5815 reading head; 582 second vertical measurement device; 5821 capacitive sensor support; 5822 capacitive sensor; 5823 capacitive sensing sheet; 59 gravity compensation device; 510 base; 511 cover. ; DETAILED DESCRIPTION

[0059] In order to more clearly illustrate the technical solutions of the embodiments of this specification, the embodiments will be described in detail below with reference to the accompanying drawings. Obviously, the contents described below are some examples or embodiments of this specification. For ordinary technicians in this field, without paying creative work, the technical solutions or means disclosed in this specification can also be applied to other scenarios based on these technical contents.

[0060] It should be understood that the "system", "device", "equipment", "part" and / or "piece", "unit" and / or "module" used in this specification are a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0061] Unless otherwise specified, technical terms used in this specification to describe components, elements, etc. do not refer to the singular, but may also include the plural. Generally speaking, terms such as "include", "comprise", etc. only indicate that the steps, elements, or components that have been clearly identified are included, and these steps, elements, and components do not constitute an exclusive list, such as the method or device described may also include other steps or components.

[0062] In the description of this specification, it should be understood that the description of orientation, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc., is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In the description of this specification, unless otherwise clearly defined, the terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meaning of the above terms in this specification in combination with the specific content of the technical solution.

[0063] The workpiece stage is a key component of semiconductor equipment, which is used to drive the material to perform high-precision alignment or scanning. An adsorption module is provided on the workpiece stage. The adsorption mechanism of the adsorption module, such as a suction cup, can carry and adsorb the material. In some embodiments, the adsorption module can cooperate with other mechanisms to adjust the position of the material in a plane or space. For example, the adsorption module can cooperate with a planar motion system to realize linear motion in a first direction (for example, the x-axis direction) and / or a second direction (for example, the y-axis direction) in a plane (for example, an xy plane) to adjust the position of the adsorption module as a whole in the plane. For example, the adsorption mechanism of the adsorption module can also cooperate with a micro-motion module to realize linear motion in a third direction (for example, the z-axis direction) perpendicular to the plane to adjust the height of the material, and rotation around the first direction (for example, the Rx direction) and / or rotation around the second direction (for example, the Ry direction) to adjust the posture of the material relative to the plane (for example, pitch posture, etc.).

[0064] In some embodiments, the adsorption module may further include a rotating mechanism, and the adsorption mechanism of the adsorption module, such as a suction cup, may cooperate with a rotating mechanism (such as a rotating shaft module) to realize the rotation of the material around a third direction perpendicular to the plane (such as the Rz direction). In some embodiments, the rotating mechanism is fixedly connected to the adsorption mechanism to transmit the rotational power to the adsorption mechanism. However, as a power mechanism, the rotating mechanism may still vibrate or jitter (such as servo jitter) when the locking state is achieved through a mechanical device, an electromagnetic device or a control method, and the vibration and jitter will affect the precise position of the material carried and adsorbed by the adsorption mechanism.

[0065] Based on this, one or more embodiments of the present specification provide an adsorption module, which can transmit rotational power to an adsorption mechanism (such as a suction cup) and the material on the adsorption mechanism through a rotating shaft module, and adsorb and fix the adsorption mechanism through a wafer table when the adsorption mechanism and the material need to remain stationary, thereby maintaining the precise position of the adsorption mechanism and the material and preventing the vibration or jitter of the rotating shaft module from affecting the precise position of the material.

[0066] Figure 1 is a schematic diagram of an adsorption module according to some embodiments of this specification, Figure 2 is a cross-sectional schematic diagram of an adsorption module according to some embodiments of this specification. Figure 1 , Figure 2 As shown, in one or more embodiments of the present specification, the adsorption module 6 includes: an adsorption substrate 61 , a rotating base 62 , a rotating axis module, a wafer stage 66 and a suction cup 67 .

[0067] In some embodiments, the rotating mechanism is arranged on the adsorption substrate 61 , and the rotating mechanism may include a rotating shaft module and a rotating base 62 , wherein the rotating base 62 is fixedly connected to the adsorption substrate 61 , and the rotating shaft module can rotate relative to the rotating base 62 .

[0068] In some embodiments, the rotating mechanism may further include a rotating drive mechanism that drives the rotating shaft module to rotate relative to the rotating base 62. In some embodiments, the rotating drive mechanism may include a rotating drive mechanism stator and a rotating drive mechanism mover that rotates relative to the rotating drive mechanism stator. In some embodiments, one of the rotating drive mechanism stator and the rotating drive mechanism mover is fixedly connected to the rotating base 62, and the other of the rotating drive mechanism stator and the rotating drive mechanism mover is fixedly connected to the rotating shaft module to drive the rotating shaft module to move relative to the rotating base 62. Exemplarily, the rotating drive mechanism may be a voice coil arc motor or a torque motor.

[0069] In some embodiments, the rotating mechanism may further include a rotation measuring device for measuring the rotation angle of the rotating shaft module relative to the rotating base 62. In some embodiments, the rotation measuring device may be a grating measuring device. In some embodiments, one of the grating ruler and the reading head is connected to the rotating base 62, and the other of the grating ruler and the reading head is connected to the rotating shaft 62.

[0070] In some embodiments, the rotating shaft module may be in driving connection with the suction cup 67. The suction cup 67 is used to adsorb the material, allowing the rotating shaft module to transfer the rotational power to the material through the suction cup 67.

[0071] In some embodiments, the wafer table 66 can carry the suction cup 67 and fix the suction cup 67 by negative pressure adsorption when the suction cup 67 is in any position, so as to maintain the precise position of the suction cup 67 after rotation. For example, when the rotating shaft module drives the suction cup 67 to rotate, the wafer table 66 can be detached from the suction cup 67 to prevent the wafer table 66 from affecting the rotation of the suction cup 67. For example, when the suction cup 67 is stationary, the wafer table 66 can adsorb and fix the suction cup 67 to keep the suction cup 67 at the current position, so as to prevent the vibration or shaking of the rotating shaft module from affecting the precise position of the material on the suction cup 67.

[0072] In some embodiments, the rotating shaft module can be fixedly connected to the suction cup 67 to transmit the rotational power. In other embodiments, the rotating shaft module can be detachably connected to the suction cup 67 (for example, it can be fixed to the suction cup 67 based on operation in the working state, and can also be separated from the suction cup 67 based on operation in the working state) to operably transmit the rotational power.

[0073] In some embodiments, the wafer stage 66 is configured to be able to adsorb the suction cup 67 or air-float support the suction cup 67. Exemplarily, when the wafer stage 66 adsorbs the suction cup 67, the suction cup 67 moves downward and is supported on the wafer stage 66 to fix the position of the suction cup 67. Exemplarily, when the wafer stage 66 air-float supports the suction cup 67, the suction cup 67 moves upward, and an air film is formed between the suction cup 67 and the wafer stage 66 to prevent the wafer stage 66 from interfering with the rotation of the suction cup 67 and the material.

[0074] In some embodiments, the rotating axis module can be displaced in the axial direction (eg, z-axis direction) of the rotating axis module relative to the rotating base 62 , so that the position of the rotating axis module in the axial direction can be adaptively adjusted to provide space for the axial displacement of the suction cup 67 .

[0075] In some embodiments, the rotating axis module is configured to connect the suction cup 67 or the rotating base 62 in the form of a pneumatic connection. Exemplarily, in some embodiments, the rotating axis module is configured to connect the suction cup 67 in the form of a pneumatic connection, and the rotating axis module is configured to be rotatably connected to the rotating base 62 and to be limited in the axial direction relative to the rotating base 62. In some of these embodiments, the suction cup 67 can rise or fall relative to the rotating base 62 and the rotating axis module as a whole to cooperate with the air floating support or adsorption of the suction cup 67 by the wafer stage 66. Exemplarily, in other embodiments, the rotating axis module is configured to connect the rotating base 62 in the form of a pneumatic connection, for example, an air film is formed between the rotating axis module and the rotating base 62, the rotating axis module can rotate relative to the rotating base 62, and can also move in the axial direction relative to the rotating base 62, and the rotating axis module is configured to be fixedly connected to the suction cup 67. In these other embodiments, the suction cup 67 and the rotating axis module as a whole can rise or fall relative to the rotating base 62 to cooperate with the air floating support or adsorption of the suction cup 67 by the wafer stage 66.

[0076] See also Figures 1 to 9 As shown, in one or more embodiments of this specification, a suction module is shown that connects the rotating shaft module and the suction cup 67 in the form of air pressure. Figures 3 to 5 As shown, in some embodiments, the wafer carrier 66 (or referred to as a square mirror in some related embodiments) is provided with a suction cup receiving groove 661 for receiving the suction cup 67. The suction cup 67 is disposed in the suction cup receiving groove 661 of the wafer carrier 66. In some embodiments, the suction cup 67 can rise or fall (for example, along the suction cup receiving groove 661) in the suction cup receiving groove 661. Figure 4 , Figure 5 up and down movement in the middle).

[0077] In some embodiments, a wafer platform through hole 663 is further provided at the bottom of the suction cup receiving groove 661 of the wafer platform 66 , and the wafer platform through hole 663 is used to avoid a rotating mechanism such as a rotating shaft module.

[0078] In some embodiments, the suction cup receiving groove 661 includes a suction cup receiving groove negative pressure zone 6611 and a suction cup receiving groove positive pressure zone 6612. In some embodiments, the suction cup receiving groove negative pressure zone 6611 provides negative pressure to adsorb the suction cup 67. In some embodiments, the suction cup receiving groove positive pressure zone 6612 provides positive pressure to support the suction cup 67 by air floating. In some embodiments, the suction cup receiving groove positive pressure zone 6612 is located at the bottom surface of the groove of the suction cup receiving groove 661. In some embodiments, the suction cup receiving groove positive pressure zone 6612 is annular. In some embodiments, the suction cup receiving groove negative pressure zone 6611 is distributed inside the range of the suction cup receiving groove positive pressure zone 6612. In some embodiments, the number of suction cup receiving groove negative pressure zones 6611 can be multiple. In some embodiments, there can be spacing between multiple suction cup receiving groove negative pressure zones 6611 to form an alternating arrangement of suction cup receiving groove negative pressure zones 6611 and suction cup receiving groove positive pressure zones 6612. In some embodiments, the negative pressure area 6611 of a single suction cup receiving groove may be fan-shaped.

[0079] See also Figure 4 As shown, in some embodiments, the wafer support platform 66 is further provided with a wafer support platform negative pressure channel 6613 connected to the suction cup receiving groove negative pressure area 6611. Figure 5 As shown, in some embodiments, the wafer support platform 66 is further provided with a wafer support platform positive pressure channel 6614 connected to the positive pressure area 6612 of the suction cup receiving groove.

[0080] In some embodiments, the upper surface of the suction cup 67 is used to absorb materials. In some embodiments, the upper surface of the suction cup 67 has a suction cup adsorption surface. In some embodiments, the wafer stage 66 (e.g., the bottom of the suction cup receiving groove 661 of the wafer stage 66) has a wafer stage air flotation surface (e.g., the surface provided by the positive pressure area 6612 of the suction cup receiving groove), and the lower surface of the suction cup 67 has a suction cup air flotation matching surface corresponding to the wafer stage air flotation surface, and the suction cup air flotation matching surface of the suction cup 67 is air-floatingly supported on the wafer stage air flotation surface of the wafer stage 66.

[0081] In one or more embodiments of the present specification, the rotating shaft module may include: a rotating shaft 63, a vertical decoupling reed 64, and a rotating top plate 65. In some embodiments, the rotating top plate 65 is connected to the rotating shaft 63 through the vertical decoupling reed 64, and the vertical decoupling reed 64 is configured to enable the rotating top plate 65 to be displaced relative to the rotating shaft 63 in the axial direction of the rotating shaft 63 (for example, the z-axis direction), and the rotating top plate 65 can rotate with the rotation of the rotating shaft 63.

[0082] See also Figure 2 , Figure 6 , Figure 7As shown, in some embodiments, the rotating base 62 is configured to be able to adsorb the rotating top plate 65. In some embodiments, the rotating base 62 is an annular structure. In some embodiments, the upper surface of the rotating base 62 can be flush with the upper surface of the adsorption substrate 61 to reduce the occupation of the axial space. In some embodiments, the outer edge of the rotating base 62 forms an annular boss for fixing to the adsorption substrate 61 or mounting on the adsorption substrate 61. In some embodiments, an annular groove may be provided on the adsorption substrate 61, and the annular boss of the rotating base 62 can be mounted and fixed on the annular groove, thereby allowing the rotating base 62 and the upper surface of the adsorption substrate 61 to be flush. In some embodiments, the inner edge of the rotating base 62 is rotatably connected to the rotating shaft 63.

[0083] In some embodiments, a rotating bearing 620 may be arranged between the rotating base 62 and the rotating shaft 63. In some embodiments, a bearing retaining ring is provided on both the upper side and the lower side of the rotating bearing. Figure 2 As shown, for example, an upper bearing retaining ring is fixed to the inner edge of the rotating base 62, a lower bearing retaining ring is fixed to the outer edge of the rotating shaft 63, and the rotating bearing 620 is located between the upper bearing retaining ring and the lower bearing retaining ring. In some embodiments, the rotating bearing 620, the upper bearing retaining ring, and the lower bearing retaining ring limit the rotating shaft 63 relative to the rotating base 62 in the axial direction (for example, the z-axis direction, or for example Figure 2 The rotating base 62 is positioned in a vertical direction (in the up and down direction), which allows the rotating shaft 63 to rotate relative to the rotating base 62 and restricts the rotating base 63 from detaching from the rotating base 62 upward or downward.

[0084] In some embodiments, the rotating shaft 63 is a hollow shaft structure. In some embodiments, the lower end of the rotating shaft 63 is disposed at the rotating base 62, the outer edge of the upper end of the rotating shaft 63 is connected to the vertical decoupling spring 64, and the inner edge of the rotating top plate 65 is connected to the vertical decoupling spring, so that the rotating power of the rotating shaft 63 is transmitted to the rotating top plate 65 through the vertical decoupling spring 64.

[0085] See also Figure 2 , Figure 8 As shown, in some embodiments, the vertical decoupling reed 64 includes a vertical decoupling reed first region 641 connected to the rotating shaft 63, a vertical decoupling reed second region 642 connected to the rotating top plate 65, and a vertical decoupling reed deformation region 643 connecting the vertical decoupling reed first region 641 and the vertical decoupling reed second region 642. In some embodiments, the vertical decoupling reed deformation region 643 can be deformed so that the vertical decoupling reed first region 641 and the vertical decoupling reed second region 642 are located in different planes in the axial direction of the rotating shaft 63. The vertical decoupling reed 64 allows the rotational power to be transmitted between the rotating shaft 63 and the rotating top plate 65, and also allows the rotating shaft 63 and the rotating top plate 65 to be displaced in the axial direction.

[0086] See also Figure 8 As shown, in some embodiments, the deformation area 643 may be provided with a plurality of arc grooves arranged in an annular shape to provide space for deformation and allow the deformation area 643 to undergo possible deformations such as stretching, twisting or bending in the axial direction (e.g., the z-axis direction). In some embodiments, the first area 641 and the second area 642 may also undergo certain deformations. In some embodiments, the deformation area 643 may have a plurality of arc grooves in an annular area, or may have more arc grooves in two concentric annular areas. In other embodiments, the deformation area 643 may also have a plurality of straight grooves in a direction intersecting with its radial direction.

[0087] See also Figure 2 , Fig. 9 As shown, in some embodiments, the rotating top plate 65 is configured to be able to adsorb the suction cup 67 or desorb the suction cup 67, so as to realize the aforementioned detachable connection between the rotating shaft module and the suction cup 67, thereby realizing the transmission connection or disconnection between the rotating power and the suction cup 67. In some embodiments, the rotating top plate 65 includes a central annular structure 651, an outer annular structure 652 sleeved outside the central annular structure 651, and one or more connecting structures 653 connecting the central annular structure 651 and the outer annular structure 652. In some embodiments, the rotating top plate 65 has an air pressure regulating area 650 that can provide negative pressure or positive pressure. In some embodiments, the air pressure regulating area 650 can be located at the outer annular structure 652, for example, arranged at one or more bosses on the outer annular structure 652. In some embodiments, an air passage connected to the air pressure regulating area 650 is opened inside the central annular structure 651 and the connecting structure 653. In some embodiments, negative pressure or positive pressure is provided to the air pressure adjustment area 650 through the air passage of the central annular structure 651 and the air passage of the connecting structure 653 to achieve adsorption or desorption of the suction cup 67 by the rotating top plate 65 .

[0088] In some embodiments, the wafer table 66 is mounted outside the rotating top plate 65 to allow both the wafer table 66 and the rotating top plate 65 to contact the lower surface of the suction cup 67, thereby allowing the wafer table 66 to adsorb the suction cup 67 or air-float support the suction cup 67, and allowing the rotating top plate 65 to adsorb the suction cup 67 or desorb the suction cup 67.

[0089] In other embodiments, the rotating top plate 65 may also be provided with an independent positive pressure area to support the suction cup 67 by air floating.

[0090] See also Figure 2As shown, in some embodiments, the rotating base 62 can absorb the rotating top plate 65, so that the rotating top plate 65 can be as far away from the suction cup 67 as possible, and the rotating top plate 65 and the suction cup 67 are disengaged to release the power transmission to the suction cup 67, reduce the scratches between the rotating top plate 65 and the suction cup 67, and avoid the impact of the scratches on the position of the material.

[0091] In some embodiments, the rotating mechanism can adjust the material in the Rz direction. During the Rz adjustment process, the material is fixed to the suction cup 67 by adsorption, and the suction cup 67 is supported by air floating on the wafer table 66. After the Rz adjustment is completed, in order to prevent the material from being affected by the rotating mechanism (for example, being affected by the servo jitter of the rotating mechanism or the vibration of the rotating mechanism), it is necessary to adsorb and fix the material and the suction cup 67 to the wafer table 66 as a whole.

[0092] Based on this, in some embodiments, when the material is subjected to Rz adjustment, the material is adsorbed on the suction cup 67, the suction cup 67 is adsorbed on the rotating top plate 65, the rotary drive mechanism drives the rotating shaft 63 to rotate relative to the rotating base 62, and the rotating shaft 63 transmits the rotational power to the rotating top plate 65 through the vertical decoupling spring 64, thereby driving the suction cup 67 to rotate with the material. At this time, the wafer support table 66 provides positive pressure gas to make the suction cup 67 air-floating and supported on the wafer support table 66, avoiding friction between the lower surface of the suction cup 67 and the wafer support table 66. In this embodiment, the movement of the suction cup 67 in the axial direction (for example, the z-axis direction) is decoupled by the vertical decoupling spring 64.

[0093] In some embodiments, after the RZ adjustment of the material is completed, the material remains adsorbed on the suction cup 67, the suction cup 67 is further adsorbed on the wafer stage 66, and the rotating top plate 65 is passed through a positive pressure gas to break the vacuum to desorb from the suction cup 66. In some embodiments, as described above, the rotating base 62 can further adsorb the rotating top plate 65 to further increase the distance between the rotating top plate 65 and the suction cup 66, and reduce the influence of the rotating top plate 65 on the suction cup 66. At this time, the suction cup 66 is mechanically disengaged from the rotating axis module as a whole, so as to prevent the servo jitter between the rotating base 62 and the rotating axis module from affecting the position accuracy of the material (for example, the accuracy in the x-axis direction and / or the y-axis direction).

[0094] See also Figure 10 to Figure 11 As shown, in one or more embodiments of this specification, another adsorption module is shown that connects the rotating shaft module and the rotating base 62 in the form of air pressure. The adsorption module has Figures 3 to 5 The wafer stage 66 and the suction cup 67 corresponding to the wafer stage 66 are shown.

[0095] In one or more embodiments of the present specification, the rotating shaft module may include: a rotating shaft 63. Fig.11As shown, in some embodiments, the rotating shaft 63 is connected to the rotating base 62 by air floating. In some embodiments, an air film is formed between the outer surface of the rotating shaft 63 and the rotating base 62. In some embodiments, an air bearing is formed between the rotating shaft 63 and the rotating base 62. In some embodiments, the rotating shaft 63 can be displaced in the axial direction of the rotating shaft 63 relative to the rotating base 62. In some embodiments, the rotating shaft 63 is fixedly connected to the suction cup 67.

[0096] In some embodiments, the inner wall of the rotating base 62 has a rotating base positive pressure area, and the rotating base positive pressure area is used to provide gas to a portion of the outer wall of the rotating shaft 63 to support the rotating shaft 63 by air floating and implement air floating guidance for the rotation of the rotating shaft 63 relative to the rotating base 62. Exemplarily, the rotating base positive pressure area can be provided with a throttle hole for providing gas. In some embodiments, an air film is provided and formed on the circumference of the rotating shaft 63 to eliminate the friction between the rotating shaft 63 and the rotating base 62. In some embodiments, positive pressure gas is provided to the rotating shaft 63 through the rotating base 62 to implement air floating guidance, so that the rotating shaft 63 can rotate relative to the rotating base 62 based on the power provided by the rotating drive mechanism, thereby providing rotational power to the suction cup 67. In some embodiments, the positive pressure gas provided by the rotating base 62 to the rotating shaft 63 is eliminated to eliminate the air flotation guide, so that a portion of the outer wall of the rotating shaft 63 contacts the rotating base 62 due to eccentricity or tilt caused by the loss of the air flotation guide, so that the rotating shaft 63 cannot rotate relative to the rotating base 62 through friction (the driving force of the rotating drive mechanism is not sufficient to overcome the friction force), thereby preventing the rotating shaft 63 from providing rotational power to the suction cup 67.

[0097] In this embodiment, when the material is subjected to Rz adjustment, the material is adsorbed on the suction cup 67, the rotating bottom 62 implements air flotation guidance on the rotating shaft 63, the rotating drive mechanism drives the rotating shaft 63 to rotate relative to the rotating base 62, and the rotating shaft 63 drives the suction cup 67 to rotate with the material. At this time, the wafer support table 66 provides positive pressure gas to make the suction cup 67 air-floating and supported on the wafer support table 66, avoiding friction between the lower surface of the suction cup 67 and the wafer support table 66. In this embodiment, the movement of the suction cup 67 in the axial direction (for example, the z-axis direction) is decoupled by the air flotation connection between the rotating shaft 63 and the rotating base 62 (for example, an air film or an air flotation bearing formed by the rotating shaft 63 and the rotating base 62).

[0098] In this embodiment, after the RZ adjustment of the material is completed, the material remains adsorbed on the suction cup 67, and the suction cup 67 is adsorbed and fixed on the wafer stage 66, so as to prevent the servo jitter between the rotating base 62 and the rotating shaft 63 from affecting the position accuracy of the material (for example, the accuracy in the x-axis direction and / or the y-axis direction). In some embodiments, the rotating base 62 can further cancel the air floating guide for the rotating shaft 63, so that the rotating shaft 63 is stationary relative to the rotating base 62 based on the friction force, thereby further reducing the influence of the servo jitter between the rotating base 62 and the rotating shaft 63 on the suction cup 67.

[0099] See also Figure 1 As shown, in one or more embodiments of the present specification, the adsorption module 6 further includes: a limiting structure 9 for limiting the position of the suction cup 67 by limiting the maximum upward displacement of the adsorption substrate 61 (e.g., one side of the adsorption substrate 61 or the entirety of the adsorption substrate 61) or the wafer stage 66 in the vertical direction (e.g., the z-axis direction). In some embodiments, the limiting structure 9 may include: a limiting rod 91, a limiting member 92 disposed at the upper end of the limiting rod 91, and a limited member 93 disposed on the adsorption substrate 61 or the wafer stage 66. In some embodiments, the limited member 93 can move upward or downward relative to the limiting rod 91, and the limiting member 92 limits the maximum upward displacement of the limited member 93.

[0100] As mentioned above, the adsorption mechanism of the adsorption module 6 can cooperate with the micro-motion module to realize linear movement in the z-axis direction to adjust the height of the material, and rotation around the Rx direction and / or rotation around the Ry direction to adjust the posture of the material relative to the plane. The limit structure 9 can limit the highest position of the adsorption substrate 61 of the adsorption module 6 in the z-axis direction (for example, limit the stroke of the first linear drive mechanism 531 described below), which can prevent the material carried by the suction cup 67 from interfering with the equipment above it, causing damage to the material or equipment.

[0101] In some embodiments, the limiting rod 91 can be arranged along the z-axis direction to provide a guide for the movement of the limited member 93. In some embodiments, the limiting rod 91 passes through the limited member 93 and allows the limited member 93 to move along the limiting rod 91 in the z-axis direction. In some embodiments, when the limited member 93 moves upward along the z-axis direction, it can abut against the limiting member 92, thereby limiting its maximum upward displacement in the z-axis direction. In some embodiments, the limited member 93 can be C-shaped, L-shaped or ring-shaped.

[0102] In some embodiments, the limited member 93 can adjust its height in the z-axis direction relative to the limiting rod 91 and be fixed. Exemplarily, the limiting structure 9 may include a limiting motor 90, which is arranged along the z-axis direction, and the limiting motor 90 may be a linear drive mechanism such as an electric push rod. In some embodiments, the driving rod of the limiting motor 90 is connected to the limiting rod 91 or the limiting rod 91 is provided. In some embodiments, the position of the limiting member 92 is adjusted by the movement of the driving rod of the limiting motor 90 to adjust the limiting range of the limiting structure 9 on the wafer support table 66 in the vertical direction.

[0103] In some embodiments, the adsorption module 6 may include a plurality of limiting structures 9. Exemplarily, the adsorption module 6 may include three limiting structures 9, and the three limiting structures 9 may be arranged at 120°.

[0104] See also Figures 12 to 29 As shown, in one or more embodiments of the present specification, the adsorption module 6 may further include a micro-motion module 5, which realizes large-stroke, high-precision displacement positioning in the z-axis direction and rotation positioning in the Rx and Ry directions through the combination of two linear drive devices with different precisions in the z-axis direction.

[0105] See also Fig.12 , Fig.13 As shown, in some embodiments, the micro-motion module 5 may include at least three vertical drive devices 53 that drive a part of the adsorption substrate 61 to move in a vertical direction (e.g., z-axis direction) of a reference plane. In some embodiments, the at least three vertical drive devices 53 include three vertical drive devices 53 whose axes are not coplanar. Exemplarily, the lower surface of the adsorption substrate 61 may include a first position, a second position, and a third position that are not colinear, and the three vertical drive devices 53 are respectively connected to the first position, the second position, and the third position. In some embodiments, the three vertical drive devices 53 may move synchronously or asynchronously to achieve displacement of the component in the z-axis direction or rotation in the Rx direction / Ry direction. In some embodiments, the component may be the adsorption substrate 61, or may be connected to other structures of the adsorption substrate 61, or directly or indirectly carry, be adsorbed on, or float on the adsorption substrate 61. In some embodiments, the three vertical drive devices 53 are arranged at an equiangular angle of 120°. In some embodiments, more vertical drive devices 53 may be further provided.

[0106] It should be noted that in one or more embodiments of the present specification, the z-axis direction may be perpendicular to the x-axis direction and the y-axis direction, the x-axis direction and the y-axis direction may be located in the xy plane, and the x-axis direction and the y-axis direction may be perpendicular or non-perpendicular. It should be noted that in one or more embodiments of the present specification, the setting of the x-axis direction and the y-axis direction is mainly used to decompose the complex rotation change or pitch change of the plane into a simple rotation compound on two axes that is easy to understand, and does not limit the plane to rotate around the x-axis direction and the y-axis direction.

[0107] See also Fig.14 , Fig.15 As shown, in some embodiments, the vertical drive device 3 may include: a first linear drive mechanism 531 and a second linear drive mechanism 532 connected to the first drive portion 5311 of the first linear drive mechanism 531, and the second drive portion 5321 of the second linear drive mechanism 532 is connected to the adsorption substrate 61 through a drive decoupling mechanism 54. In some embodiments, each vertical drive device 53 is provided with an independent drive decoupling mechanism 54, so that each vertical drive device 53 can act and decouple independently of each other, avoiding mutual interference caused by being connected to the same decoupling spring. In some embodiments, decoupling in this specification refers to converting or disassembling the complex movement of a component such as the adsorption substrate 61 into a single movement in two or more directions. It should be noted that the drive decoupling mechanism 54 corresponding to each vertical drive device 53 can have an independent decoupling direction, that is, the two or more decoupling directions of each drive decoupling mechanism 54 can be arbitrarily set without having to be parallel to the x-axis or y-axis, and the decoupling directions of different drive decoupling mechanisms 54 can be the same or different.

[0108] In some embodiments, the first linear drive device 531 may be a piezoelectric micro-stepping motor. In other embodiments, the first linear drive device 531 may be a plate-type voice coil motor, a cylinder-type voice coil motor, or a cylinder-type double-coil voice coil motor. The first linear drive device 531 is used to provide driving force in CoarseZ (i.e., coarse adjustment in the z-axis direction) / Rx / Ry directions.

[0109] In some embodiments, the second linear drive device 532 may be a piezoelectric actuator. The second linear drive device 532 is used to provide driving force in the FineZ (ie, fine adjustment in the z-axis direction) / Rx / Ry directions.

[0110] In some embodiments, the driving accuracy of the second linear driving mechanism 532 is higher than that of the first linear driving mechanism 531. For example, the first linear driving mechanism 531 may have a larger stroke and lower accuracy, and the second linear driving mechanism 532 may have a higher accuracy and a smaller stroke. The combination of the first linear driving mechanism 531 and the second linear driving mechanism 532 may realize a larger stroke and higher accuracy for the vertical driving device 53 as a whole.

[0111] In some embodiments, three or more vertical drive devices 53, a first linear drive mechanism 531 with a large stroke, and a high-precision second linear drive mechanism 532 can realize accurate positioning of the material in the Rx / Ry direction. In some embodiments, three or more first linear drive mechanisms 531 are used to realize the z / Rx / Ry pre-alignment of the material, and three or more second linear drive mechanisms 532 are used to realize the z / Rx / Ry accurate positioning and posture adjustment of the material.

[0112] In one or more embodiments of the present specification, the vertical drive device 53 further includes: a drive device base 533, and the drive device base 533 is used to accommodate and install the first linear drive mechanism 531 and the second linear drive mechanism 532. In some embodiments, the drive device base 533 may include a drive device base bottom plate 5331 and two drive device base side plates 5332 disposed on the drive device base bottom plate 5331, and there is a accommodating space for accommodating the first linear drive mechanism 531 and the second linear drive mechanism 532 between the two drive device base side plates 5332. In some embodiments, the drive device base 533 may also include a drive device base back plate disposed on the drive device base bottom plate 5331, and the two sides of the drive device base back plate are respectively connected to the two drive device base side plates 5332. In some embodiments, the first linear drive mechanism 531 may be installed on the drive device base bottom plate 5331. In some embodiments, there is a gap between the first linear drive mechanism 531 and the drive device base back plate, and the second linear drive mechanism 532 is disposed between the first linear drive mechanism 531 and the drive device base back plate. In some embodiments, the driving device base 533 can be fixed on the micro-motion module base of the micro-motion module.

[0113] In some embodiments, the first housing 5312 of the first linear drive mechanism 531 is connected to the drive device base 533 (for example, the drive device base bottom plate 5331), and the second housing 5322 of the second linear drive mechanism 532 is connected to the first drive part 5311 of the first linear drive mechanism 531, and the second housing 5322 of the second linear drive mechanism 532 is driven by the first linear drive mechanism 531 to move in the z-axis direction. In some embodiments, a portion of the first housing 5312 is located on one side of a portion of the second housing 5322. In some embodiments, the second housing of the second linear drive mechanism 532 is embedded in the drive device base 533. In some embodiments, a portion of the first housing 5312 and a portion of the second housing 5322 are staggered in the z-axis direction. Based on the overlap of the first housing 5312 and the second housing 5322 in the z-axis direction, the height of the vertical drive device 53 as a whole in the z-axis direction is reduced, thereby reducing the height of the entire adsorption module, and solving the problem of the large size of the micro-motion module caused by the direct superposition of the coarse-precision z-axis drive motor and the high-precision z-axis drive motor in the z-axis direction.

[0114] See also Fig.14 , Fig.15 As shown, in some embodiments, the second shell 5322 includes a second accommodating space that opens upward for accommodating a portion of the second linear drive mechanism 531, and a connecting plate 53221 that extends to one side from the opening of the second accommodating space. The first driving portion 5311 of the first linear drive mechanism 531 is connected to the connecting plate 53221, and the second driving portion 5321 of the second linear drive mechanism 532 moves in the vertical direction. In some embodiments, the connecting plate 53221 is arranged parallel to the bottom plate 5331 of the drive device base. In some embodiments, the connecting plate 53221 is located above the first shell 5312 of the first linear drive mechanism 531. By arranging the connecting plate 53221 extending in the lateral direction, the second shell 5322 can be arranged on one side of the first shell 5312, thereby achieving the staggering of the two in the z-axis direction. In some embodiments, see Fig.15 As shown, the second shell 5322 is L-shaped and partially surrounds the upper side of the first shell 5312 to reduce its occupied space as much as possible and realize the overall miniaturization of the vertical drive device 53.

[0115] In one or more embodiments of the present specification, the vertical drive device 53 further includes: a guide device 55, which is installed on the side of the second housing 5322 of the second linear drive mechanism 532. In some embodiments, the number of the guide devices 55 can be two, and the two guide devices 55 are respectively arranged on both sides of the second housing 5322. In some embodiments, the two guide devices 55 can be arranged symmetrically with respect to the axis of the second housing 5322. In some embodiments, the guide device 55 can be connected to the side plate 5332 of the drive device base or the back plate of the drive device base. In some embodiments, the guide device 55 can be used to guide the first drive portion 5311 of the first linear drive mechanism 531 or the second housing 5322 of the second linear drive mechanism 532. In some embodiments, the first driving portion 5311 of the first linear driving mechanism 531 drives the second linear driving mechanism 532 to move as a whole in the z-axis direction through the connecting plate 53221. Due to the possible deformation of the connecting plate 53221, it may cause the second shell 5322 to vibrate or deflect relative to the connecting plate 53221, resulting in an angle between the working direction of the second driving portion 5321 in the second shell 5322 and the z-axis direction. The setting of the guide device 55 limits the displacement of the second shell 5322 as a whole in the z-axis direction, thereby avoiding the vibration or the deflection.

[0116] See also Figure 14 to Figure 15 As shown, in some embodiments, the guide device 55 may include: a fixed guide rail 551 and a movable guide rail 552 that match each other, and the fixed guide rail 551 and the movable guide rail 552 are both arranged along the z-axis direction. In some embodiments, the fixed guide rail 551 is connected to the drive device base 533 (for example, the drive device base side plate 5332 or the drive device base back plate), and the movable guide rail 552 is connected to the second housing 5322 of the second linear drive mechanism 532. In some embodiments, the guide device 55 may be a cross roller guide rail. In some embodiments, the number of the cross roller guide rails may be two, and the two cross roller guide rails are respectively arranged on both sides of the second housing 5322 of the second linear drive mechanism 532.

[0117] See also Figure 21 to Figure 23 As shown, in other embodiments, the guide device 55 may include: a linear motion guide spring 553, one end of the linear motion guide spring 553 is connected to the drive device base 533 (for example, the drive device base side plate 5332), and the other end of the linear motion guide spring 553 is connected to the second housing 5322 of the second linear drive mechanism 532. Further, in some embodiments, the guide device 55 may include two groups of linear motion guide springs 553, and the two groups of linear motion guide springs 553 are respectively arranged on both sides of the second housing 5322 of the second linear drive 532. In some embodiments, as Fig.21 , Fig. 22 As shown, each set of linear motion guide springs 553 may include two linear motion guide springs 553, and the two linear motion guide springs 553 are arranged in sequence in the z-axis direction. Fig.23 As shown, each group of linear motion guide reeds 553 may include one linear motion guide reed 553. In other embodiments, each group of linear motion guide reeds 553 may also include more than two linear motion guide reeds 553.

[0118] In some embodiments, the linear motion guide spring 553 may include a linear motion guide spring fixing portion 5531 located on both sides thereof, and a linear motion guide spring deforming portion 5532 connecting the two linear motion guide spring fixing portions 5531, wherein the two linear motion guide spring fixing portions 5531 are respectively connected to the drive device base 533 (for example, the drive device base side plate 5332) and the second housing 5322 of the second linear drive 532, and the linear motion guide spring deforming portion 5532 can deform with the movement of the second housing 5322 relative to the drive device base 533. Since the linear motion guide spring 553 is symmetrically arranged on both sides of the second housing 5322, it can guide the second housing 5322 to move in the z-axis direction. In some embodiments, the thickness of the linear motion guide spring fixing portion 5531 is greater than the thickness of the linear motion guide spring deforming portion 5532, so that the linear motion guide spring fixing portion 5531 is easy to fix and the linear motion guide spring deforming portion 5532 is easy to deform. In some embodiments, the linear motion guide spring 553 can be integrally formed by cutting or other methods.

[0119] In one or more embodiments of this specification, see Figures 16 to 20 As shown, the vertical driving device 53 further includes: a leaf spring mounting seat 534 connected to the driving device base 533 and a first vertical guide leaf spring 535, a part of the first vertical guide leaf spring 535 is connected to the leaf spring mounting seat 534, and another part of the first vertical guide leaf spring 535 is connected to the adsorption substrate 61, and the first vertical guide leaf spring 535 is used to guide the movement of the adsorption substrate 61 relative to the leaf spring mounting seat 534 (or relative to the driving device base 533) in the CoarseZ / Rx / Ry direction. In some embodiments, the two sides of the first vertical guide leaf spring 535 are symmetrically arranged relative to a vertical plane where the movement direction of the first driving part 5311 of the first linear driving mechanism 531 is located. In some embodiments, the two sides of the first vertical guide leaf spring 535 protrude from the two sides of the leaf spring mounting seat 534 respectively to increase the area of ​​the first vertical guide leaf spring 535, thereby allowing the first vertical guide leaf spring 535 to undergo a greater deformation.

[0120] See also Fig.16FIG. 5 shows a reed mounting seat 534 in some embodiments. The reed mounting seat 534 may be a multi-step structure. The reed mounting seat 534 at least includes a bottom step 5341 connected to the drive device base 533 and a top step 5342 away from the drive device base 533. The size of the bottom step 5341 is larger than the size of the top step 5342. In some embodiments, the reed mounting seat 534 may be as follows: Fig.16 In some other embodiments, the reed mounting seat 534 may also be a multi-step structure, for example, the reed mounting seat 534 also includes a plurality of intermediate steps between the bottom step 5341 and the top step 5342. In these other embodiments, the size of the plurality of intermediate steps may decrease step by step. In some embodiments, deformation spaces are formed on both sides of the top step 5342 in the multi-step structure of the reed mounting seat, and the deformation spaces can avoid the deformation of the two sides of the first vertical guide reed 35.

[0121] In some embodiments, see Fig.16 As shown, a shunting groove is also provided in the middle of the lower surface of the spring mounting seat 534 of the multi-step structure, and the connecting plate 53221 of the second housing 5322 of the second linear drive mechanism 532 can enter the shunting groove when being driven to rise, thereby allowing the first linear drive mechanism 531 to drive the second linear drive mechanism 532 to perform a larger displacement in the z-axis direction. At the same time, the shunting groove also saves space in the z-axis direction.

[0122] See also Fig.16 , Fig.17 As shown, the first vertical guide spring 535 in some embodiments is shown, and the first vertical guide spring 535 may include a first area 5351 connected to the top step 5342 of the spring mounting seat 534, a second area 5352 connected to the adsorption substrate 61 and capable of being deformed relative to the first area 5351, and a third area 5353 for the drive decoupling mechanism 54 to pass through.

[0123] exist Figure 16-17 In the embodiment shown, as described above, the two sides of the first vertical guide spring 535 are relative to a vertical plane (eg Fig.17 The arrangement may specifically include a symmetrical arrangement relative to the vertical plane (e.g. relative to the vertical plane). Fig.17 The first area 5351, the second area 5352 and the third area 5353 are symmetrically arranged on the left and right sides of the plane indicated by the middle dotted line.

[0124] In some embodiments, the first vertical guiding reed 535 has a sheet-like structure or a plate-like structure. In some embodiments, a hole penetrating through the upper and lower portions for the driving decoupling mechanism 54 to pass through, i.e., the third region 5353, is formed in the middle of the first vertical guiding reed 535. In some embodiments, two parallel strip-shaped through slots are formed in the first vertical guiding reed 535. In some embodiments, two second regions 5352 are formed between the two through slots, and the two second regions 5352 are respectively located on the left and right sides of the third region 5353. In some embodiments, an annular first region 5351 is formed outside the two through slots, and the annular first region 5351 surrounds the second region 5352 and the third region 5353.

[0125] In some embodiments, one side of the second region 5352 of the first vertical guiding reed 535 close to the third region 5353 is fixedly connected to the adsorption substrate 61. In some embodiments, the two second regions 5352 of the first vertical guiding reed 535 can bend upward along the Fig.17 arrow direction in the figure as the adsorption substrate 61 moves upward, and guide the adsorption substrate 61 through the elastic force. Further, in some embodiments, the first region 5351 of the first vertical guiding reed 535 close to the third region 5353 is fixedly connected to the reed mounting seat 534. In some embodiments, due to the bending of the second region 5352, downward deformations may occur at the left and right ends of the first region 5351 and enter the deformation spaces formed on both sides of the top step 5342.

[0126] See Fig.18 As shown, the reed mounting seat 534 in some other embodiments is shown. The reed mounting seat 534 may include a mounting seat bottom plate 5343 and reed fixing portions 5344 provided on both sides of the mounting seat bottom plate 5343 and protruding in the vertical direction from the mounting seat bottom plate 5343. In some embodiments, the reed mounting seat 534 has a U-shaped configuration, and a deformation space is formed in the middle of the reed mounting seat 534, and the deformation space can avoid the deformation of the middle portion of the first vertical guiding reed 535.

[0127] See Fig.18 、 Fig.19As shown, the first vertical guide spring piece 535 in other embodiments is shown. The first vertical guide spring piece 535 may include a mover part 5354 connected to the adsorption substrate 61 and two guide parts 5355 respectively connected to the two sides of the mover part 5354. In some embodiments, the middle part of the mover part 5354 is provided with a hole that passes through from top to bottom for the drive decoupling mechanism 54 to pass through, and the drive decoupling mechanism 54 passes through the mover part 5354. In some embodiments, the guide part 5355 is L-shaped, and the guide part 5355 includes a first guide part extending to one side of the automatic sub-part 5354 and a second guide part connected to the first guide part and extending in the vertical direction. The second guide part is directly or indirectly connected to the spring piece fixing part 5344, and the thickness of the mover part 5354 is greater than the thickness of the guide part 5355.

[0128] exist Figure 18-19 In the illustrated embodiment, as described above, the two sides of the first vertical guide spring 535 are symmetrically arranged relative to a vertical plane where the motion direction of the first driving portion 5311 of the first linear driving mechanism 531 is located. Exemplarily, the two guide portions 5355 of the vertical guide spring 535 can be symmetrically arranged relative to the vertical plane where the center of the mover portion 5354 is located.

[0129] In some embodiments, the upper surface of the mover portion 5354 of the first vertical guide spring 535 is fixedly connected to the adsorption substrate 61. In some embodiments, the mover portion 5354 can move upward or downward as the adsorption substrate 61 moves upward or downward, and guides the adsorption substrate 61 through the elastic force provided by the guide portion 5355. Further, in some embodiments, the guide portion 5355 of the first vertical guide spring 535 is away from the mover portion 5354 (for example, the side of the second guide portion extending in the vertical direction) and is fixedly connected to the spring fixing portion 5344 of the spring mounting seat 534 (for example, directly fixedly connected, or fixedly connected through a connecting structure). In some embodiments, the mover portion 5354 and a portion of the guide portion 5355 may enter the deformation space formed in the middle of the spring mounting seat 534 due to deformation.

[0130] In some embodiments, the first vertical guide spring 535 may be an integral structure, and the mover portion 5354 and the guide portion 355 may be integrally formed by cutting.

[0131] See also Fig. 20, the first vertical guide spring piece 535 in some other embodiments is shown, and the vertical guide spring piece 535 may include a mover portion 5354 connected to the adsorption substrate 61, and two guide portions 5355 respectively connected to the two sides of the mover portion 5354. In some embodiments, a hole is opened in the middle of the mover portion 5354, which is penetrated from top to bottom and is used for the drive decoupling mechanism 54 to penetrate, and the drive decoupling mechanism 54 penetrates the mover portion 5354.

[0132] exist Fig. 20 In the illustrated embodiment, the guide portion 5355 is L-shaped, and the guide portion 5355 includes a first guide portion extending to one side of the automatic sub-portion 5354 and a second guide portion extending in a vertical direction and connected to the first guide portion, the second guide portion is directly or indirectly connected to the spring fixing portion 5344 (for example, directly fixedly connected, or fixedly connected through a connecting structure), and the thickness of the movable sub-portion 5354 is greater than the thickness of the guide portion 5355.

[0133] In some embodiments, the first vertical guide spring 535 can be a split structure, and the mover portion 5354 and the guide portion 5355 can be formed separately and fixedly connected by welding, bolts, etc., thereby reducing manufacturing difficulty and cost.

[0134] In one or more embodiments of the present specification, the vertical drive device 3 further includes: a second vertical guide spring 56, the second vertical guide spring 56 is arranged between the second housing 5322 of the second linear drive mechanism 532 and the drive decoupling mechanism 54, and the second vertical guide spring 56 is used to guide the movement of the drive decoupling mechanism 54 relative to the second housing 5322 in the FineZ / Rx / Ry direction. In some embodiments, the second vertical guide spring 56 and the second housing 5322 of the second linear drive mechanism 532 can be an integrated structure or a split structure. In some embodiments, the arrangement of the second vertical guide spring 56 and the cooperation of the first vertical guide spring 535 achieve frictionless and frictionless vibration in the Rx / Ry direction, thereby achieving more accurate positioning. In some embodiments, the number of the second vertical guide springs 56 can be two, and the two second vertical guide springs 56 are symmetrically arranged relative to a vertical plane where the movement direction of the second drive part 5321 of the second linear drive mechanism 532 is located, so that the two sides thereof have a relatively balanced force relationship.

[0135] In some embodiments, the vertical drive device 53 further includes: a second vertical guide spring device, which may include a first connection structure 561, a second vertical guide spring 56, and a second connection structure 562 connected in sequence from bottom to top. In some embodiments, the first connection structure 561 is fixedly connected to the second housing 5322 of the second linear drive mechanism 532. In some embodiments, the second connection structure 562 is fixedly connected to the drive decoupling mechanism 54. In some embodiments, the drive decoupling mechanism 54 further includes a drive decoupling mechanism connection portion adapted to the shape of the second connection structure 562.

[0136] In other embodiments, the second vertical guide spring device may include a first connection structure 561 and a second vertical guide spring 562 connected in sequence from bottom to top, wherein the first connection structure 561 is fixedly connected to the second housing 5322 of the second linear drive mechanism 532, and the second vertical guide spring 56 may be directly fixedly connected to the drive decoupling mechanism 54. In some embodiments, the drive decoupling mechanism 54 further includes a drive decoupling mechanism connecting portion adapted to the shape of the second vertical guide spring 56.

[0137] See also Fig.24 As shown, in some embodiments, the first connection structure 561 includes a first connection structure horizontal portion and a first connection structure vertical portion connected to each other, wherein the first connection structure horizontal portion is fixedly connected to the second shell 5322, and the first connection structure vertical portion extends in the vertical direction and is fixedly connected to the second vertical guide spring 56. In some embodiments, the second connection structure 562 includes a second connection structure vertical portion, which connects the second vertical guide spring 56 and the drive decoupling mechanism 54. In this embodiment, see Fig.24 As shown in the dotted line portion, the second vertical guide spring piece 56 is in a straight line shape, and the guidance is implemented by elastic deformation (such as bending, twisting and / or torsion) of the second vertical guide spring piece 56 .

[0138] See also Fig.25 As shown, in other embodiments, the first connection structure 561 includes a first connection structure horizontal portion, and the first connection structure horizontal portion is fixedly connected to the second shell 5322. Fig.25As shown in the dotted line portion, the vertical guide spring 56 is L-shaped, and the guidance is implemented by elastic deformation (such as bending, twisting and / or torsion) of the vertical guide spring 56. In some embodiments, the lower end of the vertical guide spring 56 is fixedly connected to the first connecting structure 561, and the horizontal end of the vertical guide spring 56 is fixedly connected to the drive decoupling mechanism 54. In this embodiment, the side of the drive decoupling mechanism 54 is provided with a fixing groove (i.e., the drive decoupling mechanism connecting portion) corresponding to the vertical guide spring 56, and the horizontal end of the vertical guide spring 56 extends into the fixing groove and is fixed. In this embodiment, there may be a gap between the inner wall of the fixing groove and the horizontal end of the vertical guide spring 56 to allow its deformation. In some other embodiments, compared with the one-shaped structure, the L-shaped vertical guide spring 56 can be deformed in two directions, so as to have greater flexibility.

[0139] See also Fig.26 As shown, in some other embodiments, the first connection structure 561 includes a first connection structure horizontal portion and a first connection structure vertical portion connected to each other, wherein the first connection structure horizontal portion is fixedly connected to the second housing 5322, and the first connection structure vertical portion extends in the vertical direction and is fixedly connected to the second vertical guide spring 56. In some embodiments, the second connection structure 562 includes a second connection structure vertical portion, which connects the second vertical guide spring 56 and the drive decoupling mechanism 54. In this embodiment, see Fig.26 As shown in the dotted line portion, the vertical guide spring piece 56 is C-shaped, and the guidance is implemented by elastic deformation (such as bending, twisting and / or torsion) of the vertical guide spring piece 56. In some embodiments, compared with the I-shaped structure, the C-shaped vertical guide spring piece 56 can be deformed in two directions; compared with the L-shaped structure, the C-shaped vertical guide spring piece 56 has two horizontal parts that can be deformed, and thus has greater flexibility than the L-shaped structure.

[0140] In one or more embodiments of the present specification, the structure of the second vertical guide spring 56 and the structure of the drive decoupling mechanism connecting portion of the corresponding drive decoupling mechanism 54 can be selected according to actual needs (such as the need for elastic deformation or flexibility).

[0141] It should be noted that the aforementioned vertical refers to along the z-axis direction or approximately along the z-axis direction, and the aforementioned horizontal refers to being located in the xy plane or approximately located in the xy plane, and it is not strictly required to have a horizontal or vertical relationship.

[0142] In one or more embodiments of the present specification, the drive decoupling mechanism 54 is used to achieve decoupling in a third direction and / or a fourth direction, the third direction is parallel to the first direction in the reference plane, and the fourth direction is parallel to the second direction in the reference plane that intersects with the first direction. In other embodiments, the drive decoupling mechanism 54 can also be used to achieve decoupling in one or two other directions, or even more directions.

[0143] In one or more embodiments of the present specification, the drive decoupling mechanism 54 may include: a first decoupling fixed block 543 fixedly connected to the second driving portion 5321 of the second linear drive mechanism 532, a second decoupling fixed block 544 fixedly connected to the adsorption substrate 61, an intermediate decoupling fixed block 545 disposed between the first decoupling fixed block 543 and the second decoupling fixed block 544, a first decoupling spring 541 connecting the first decoupling fixed block 543 and the intermediate decoupling fixed block 545, and a second decoupling spring 542 connecting the second decoupling fixed block 544 and the intermediate decoupling fixed block 545, wherein the first decoupling spring 541 and the second decoupling spring 542 are arranged crosswise. In some embodiments, a groove may be provided on one of the first decoupling spring 541 and the second decoupling spring 542 for the other to penetrate.

[0144] In some embodiments, the driving decoupling mechanism 54 may also include a larger number of intermediate decoupling fixed blocks 545, and provide a larger number of decoupling reeds in the same direction or different directions, such as a third decoupling reed, a fourth decoupling reed, etc., to adapt to more complex movement requirements, so that the movement of the adsorption substrate 61 is smoother and the decoupling response is faster.

[0145] In some embodiments, the drive decoupling mechanism 54 is used to decouple the movement of the adsorption substrate 61 into the deformation of the first decoupling reed 541 and / or the second decoupling reed 542. The drive decoupling mechanism 54 realizes a flexible or elastic connection between the adsorption substrate 61 and the vertical drive device 53, so that the rotation change or pitch change of the adsorption substrate 61 will not affect the drive of the vertical drive device 53 in the z-axis direction. In some embodiments, multiple drive decoupling mechanisms 54 are independent of each other, and their decoupling will not be affected by the deformation of other positions. In some embodiments, the first decoupling reed 541 and the second decoupling reed 542 of the drive decoupling mechanism 54 provide deformation in two directions independently, and the deformation is the bending of a single reed in a single direction, rather than using the same reed to provide deformation in two directions in different ways, so that the decoupling ability in the two directions can be consistent, and the movement in the first direction will not be easier and the movement in the other direction will be more difficult due to the different decoupling mechanisms in the two directions.

[0146] In one or more embodiments of this specification, see Fig. 27 , Fig.28As shown, the micro-motion module also includes: one or more first vertical measuring devices 581, which are connected to the adsorption substrate 61 through a first measurement decoupling mechanism 5811, and are used to measure the position and displacement of the adsorption substrate 61. In some embodiments, the number of vertical measuring devices 581 can be three, and the three vertical measuring devices 581 are arranged at an equal angle of 120°. In some embodiments, each vertical driving device 53 is correspondingly arranged with a vertical measuring device 581.

[0147] In some embodiments, the first vertical measuring device 581 includes: a vertical measuring device base 5812, a tape ruler mounting seat 5813 slidably connected to the vertical measuring device base 5812, a grating ruler 5814 disposed on the tape ruler mounting seat 5813, and a reading head 5815 disposed in the vertical measuring device base 5812 and matching the grating ruler 5814. The grating ruler 5814 and the reading head 5815 provide a position feedback signal.

[0148] In some embodiments, the first vertical measuring device 581 also includes a guide rail and slider group for guiding the tape mounting base 5813 and the grating scale 5814 thereon, wherein the guide rails in the guide rail and slider group can be fixedly connected to the vertical measuring device base 5812, and the sliders in the guide rail and slider group can be fixedly connected to the tape mounting base 5813.

[0149] In some embodiments, similar to the drive decoupling mechanism 54, the first measurement decoupling mechanism 5811 is used to perform decoupling in the Rx / Ry direction when the adsorption substrate 61 moves. In some embodiments, the first measurement decoupling mechanism 5811 may include a lower first measurement decoupling fixed block, an intermediate measurement decoupling fixed block, and a second measurement decoupling fixed block arranged in sequence from bottom to top, wherein the first measurement decoupling fixed block may be provided by a tape mounting seat 5813. In some embodiments, the first measurement decoupling mechanism 5811 also includes a first measurement decoupling reed and a second measurement decoupling reed similar to the drive decoupling mechanism 54. The structure of the first measurement decoupling mechanism 5811 may refer to the structure of the drive decoupling mechanism 54, and will not be repeated here.

[0150] In some embodiments, the first vertical measurement device 581 may also be a capacitive sensor or an eddy current sensor.

[0151] In some embodiments, the first vertical measuring device 581 directly measures the displacement of the adsorption substrate 61, and adjusts the first linear driving device 531 and the second linear driving device 532 according to the measurement data of the first vertical measuring device 581, and controls the overall driving of the vertical driving device 53 on the adsorption substrate 61 to realize a vertical large closed loop.

[0152] In one or more embodiments of the present specification, the micro-motion module further includes: a second vertical measuring device 582 corresponding in number to the first vertical measuring device 581, and the second vertical measuring device 582 is used to measure the displacement of the adsorption substrate 61 relative to the second shell 5322 of the second linear drive mechanism 532. In some embodiments, when the accuracy of the first vertical measuring device 581 is sufficient, the first vertical measuring device 581 can be used to perform independent measurements. In other embodiments, when the accuracy of the first vertical measuring device 581 is insufficient, a solution of combining the first vertical measuring device 581 with lower accuracy and the second vertical measuring device 582 with higher accuracy can be used.

[0153] In some embodiments, the second vertical measuring device 582 may be fixedly connected to the second housing 5322 of the second linear drive mechanism 532. In some embodiments, the second vertical measuring device 582 may be fixedly connected to the connecting plate 53221.

[0154] In some embodiments, see Fig.29 As shown, the second vertical measuring device 582 may include a capacitive sensor 5822 and a capacitive sensing sheet 5823. In some embodiments, the second vertical measuring device 582 may include a capacitive sensor support 5821 disposed on a second housing 5322 (e.g., a connecting plate 53221) of the second linear drive mechanism 532, the capacitive sensor 5822 is disposed on the capacitive sensor support 5821, and the capacitive sensing sheet 5823 is fixedly connected to the adsorption substrate 61.

[0155] In the measurement scheme of the low-precision first vertical measuring device 581 and the high-precision second vertical measuring device 582, the first vertical measuring device 581 is used to measure the overall first displacement of the adsorption substrate 61, and the second vertical measuring device 582 is used to measure the second displacement of the second linear drive mechanism 532 with higher precision, so as to obtain the displacement that the first linear drive mechanism 532 needs to implement based on the difference between the first displacement and the second displacement.

[0156] In one or more embodiments of the present specification, the micro-motion module further includes: one or more gravity compensation devices 59, which are connected to the adsorption substrate 61 and provide the adsorption substrate 61 with a force at least used to compensate for the gravity of the adsorption substrate 61. In some embodiments, for example, when the first linear drive device 531 adopts a piezoelectric micro-step motor and the second linear drive device 532 adopts a piezoelectric brake, the load of the vertical drive device 53 can be reduced by the gravity compensation device 59, and the load requirements of the first linear drive mechanism 531 and the second linear drive mechanism 532 of the vertical drive device 53 are reduced to avoid affecting the vertical performance. In some embodiments, for example, when the first linear drive device 531 or the second linear drive device 532 does not adopt a piezoelectric device, specifically, when the first linear drive device 531 adopts a voice coil motor, the load of the vertical drive device 53 reduced by the gravity compensation device 59 can further reduce the heat of the voice coil motor, thereby avoiding the heat affecting the vertical performance. In some embodiments, the gravity compensation device 59 can compensate for the gravity of the vertical driving components to be driven by the vertical driving device 53 (for example, the adsorption substrate 61, other structures carried by the adsorption substrate 61, such as the rotating base 62, the rotating shaft 63, the vertical decoupling spring 64, the rotating top plate 65, the wafer support table 66, the suction cup 67, etc., or the material carried on the wafer support table 66 or adsorbed on the suction cup 67, etc.), or simultaneously compensate for the gravity of the vertical driving components to be driven by the vertical driving device and the elastic reaction force generated by the deformation of various guide springs (for example, the first vertical guide spring 535 and / or the second vertical guide spring 536, etc.) during the movement, thereby reducing the load of the vertical driving device 53, which is beneficial to improving the positioning accuracy of the high-precision second linear driving device 532.

[0157] In some embodiments, the gravity compensation device 59 may be a magnetic buoyancy compensation device. In other embodiments, the gravity compensation device 59 may also be an air buoyancy compensation device. In some embodiments, the number of vertical gravity compensation devices 59 may be three, and the three vertical gravity compensation devices 59 are arranged at an equiangular angle of 120°. In some embodiments, each vertical drive device 53 is correspondingly arranged with a vertical gravity compensation device 59.

[0158] In one or more embodiments of the present specification, the micro-motion module further includes: a base 510 and a cover 511, wherein the vertical drive device 53, the vertical measuring device 581, and the gravity compensation device 59 are all installed on the base 510, and the cover 511 is disposed between the base 510 and the adsorption substrate 61. In some embodiments, the vertical drive device 53, the vertical measuring device 581, and the gravity compensation device 59 are all embedded in the accommodation space formed by the base 510, the cover 511, and the adsorption substrate 61, and the vertical measuring device 581 has a smaller vertical height due to the staggered arrangement of the first linear drive device 531 and the second linear drive device 532, and the vertical height is reduced by the fact that the rotating base 62 is flush with the upper surface of the adsorption substrate 61, so the overall structure of the micro-motion module is smaller in vertical height and has a higher degree of integration.

[0159] Fig.30 is a schematic diagram of a motion system according to some embodiments of the present specification, Fig.31 Schematic diagram of the first air-floating guide rail and the second air-floating guide rail of the motion system according to some embodiments of this specification. Fig.30 , Fig.31 As shown, in one or more embodiments of the present specification, the motion system may include: a working surface 100, a first air-floating guide rail 1 arranged along a first direction (e.g., an x-axis direction) on the working surface 100, a first air-floating guide sleeve 2 supported by air floating on the first air-floating guide rail 1, a second air-floating guide rail 3 connected to the first air-floating guide sleeve 2 and arranged along a second direction (e.g., a y-axis direction), a second air-floating guide sleeve 4 supported by air floating on the second air-floating guide rail 3, and an adsorption module 6 arranged on the second air-floating guide sleeve 4. In some embodiments, the first air-floating guide sleeve 2 can move along the first air-floating guide rail 1, and the second air-floating guide sleeve 4 can move along the second air-floating guide rail 3. In some embodiments, the first direction intersects with the second direction. In some related embodiments, the guide rail and the guide sleeve are connected by one or more flexible springs to implement guidance. Compared with the related embodiment, the cooperation between the air-floating guide rail and the air-floating guide sleeve in this embodiment allows the cooperation stiffness between the two to be improved, so as to improve the response speed of the control (i.e., improve the control bandwidth), thereby improving the yield.

[0160] In some embodiments, the motion system may include two first air-floating guide rails 1 arranged along the x-axis direction. In some embodiments, each first air-floating guide rail 1 is correspondingly provided with a first air-floating guide sleeve 2. In some embodiments, a second air-floating guide rail 3 is provided between the two first air-floating guide rails 1, and the two ends of the second air-floating guide rail 3 are respectively fixedly connected to the two first air-floating guide sleeves 2. In some embodiments, a second air-floating guide rail 3 is correspondingly provided with a second air-floating guide sleeve 4.

[0161] In some embodiments, the motion system may include a first air-floating guide sleeve drive mechanism 71, each first air-floating guide rail 1 is correspondingly provided with a first air-floating guide sleeve drive mechanism 71, and the first air-floating guide sleeve drive mechanism 71 is used to drive the first air-floating guide sleeve 2 to move along the first air-floating guide rail 1. In some embodiments, the first air-floating guide sleeve drive mechanism 71 may include a first magnetic rail and a first coil. In some embodiments, the first magnetic rail may be fixed to the working surface 100 or the first air-floating guide rail 1, and the first coil may be fixedly connected to the first air-floating guide sleeve 2.

[0162] In some embodiments, the motion system may include a second air-floating guide sleeve drive mechanism 72, which is used to drive the second air-floating guide sleeve 4 to move along the second air-floating guide rail 3. In some embodiments, the second air-floating guide sleeve drive mechanism 72 may include a second magnetic track and a second coil. In some embodiments, the second magnetic track may be fixed to the second air-floating guide rail 3, and the second coil may be fixedly connected to the second air-floating guide sleeve 4.

[0163] In some embodiments, the second air-floating guide sleeve drive mechanism 72 is located in the middle of the second air-floating guide rail 3 to balance the two sides of the second air-floating guide sleeve 4. In some embodiments, a groove for accommodating the second air-floating guide sleeve drive mechanism 72 is provided on the second air-floating guide rail 3, so that the second air-floating guide sleeve drive mechanism 72 can be at least partially arranged in the groove to reduce the height of the device in the z-axis direction. In some embodiments, due to the slotted arrangement of the second air-floating guide rail 3, the second air-floating guide sleeve drive mechanism 72 can be arranged in the groove in a lying posture, thereby further reducing the height of the device in the z-axis direction.

[0164] In some embodiments, the motion mechanism further includes: a first direction measuring device 81 for measuring the position of the first air-floating guide sleeve 2 and a second direction measuring device 82 for measuring the position of the second air-floating guide sleeve 4. In some embodiments, the first direction measuring device 81 may be a grating ruler. In some embodiments, the second direction measuring device 82 may be a grating ruler.

[0165] In some embodiments, the first air-floating guide rail 1 has a first vertical mating surface 11 and two first lateral mating surfaces 12, and an air film is formed between the first air-floating guide sleeve 2 and the first vertical mating surface 11, and between the first air-floating guide sleeve 2 and the two first lateral mating surfaces 12 to avoid contact between the first air-floating guide sleeve 2 and the first air-floating guide rail 1, thereby avoiding friction or scratches and improving operation accuracy.

[0166] As shown in FIGS. 32 and 33, in some embodiments, the first air-floating guide sleeve 2 includes: a first air-floating top plate 21 and two first air-floating blocks 22 disposed on both sides of the first air-floating top plate 21. In some embodiments, the first air-floating top plate 21 provides a first vertical air-floating surface 211, and the first vertical air-floating surface 211 can air-floatingly support on the first vertical mating surface 11 or be adsorbed and fixed to the first vertical mating surface 11. In some embodiments, the first vertical air-floating surface 211 includes a first air-floating support area capable of providing positive pressure gas and a first adsorption and fixation area capable of providing negative pressure adsorption. Air-floating support is implemented through the first air-floating support area, and adsorption and fixation are implemented through the first adsorption and fixation area. In some embodiments, the first air-floating support area and the first adsorption and fixation area are alternately arranged on the first vertical air-floating surface 211.

[0167] In some embodiments, the first air-floating block 22 provides a first lateral air-floating surface 221. The two first lateral air-floating surfaces 221 face each other, and the two first lateral air-floating surfaces 221 respectively air-floatingly support on the two first lateral mating surfaces 12. In some embodiments, the two first lateral air-floating surfaces 221 of the first air-floating guide sleeve 2 are preloaded with each other.

[0168] In some related embodiments, the air-floating guide sleeve is in a square shape, and the air-floating guide sleeve is sleeved outside the air-floating guide rail. Compared with this related embodiment, the first air-floating guide sleeve 2 in this embodiment is in an inverted U shape, canceling the air-floating structure on the lower side and reducing the overall height of the device.

[0169] In some embodiments, the working surface 100 has a second vertical mating surface 31, the second air-floating guide rail 3 has two second lateral mating surfaces 32, and air films are formed between the second air-floating guide sleeve 4 and the second vertical mating surface 31 and between the second air-floating guide sleeve 4 and the two second lateral mating surfaces 32 to avoid contact between the second air-floating guide sleeve 4 and the second air-floating guide rail 3, thereby avoiding friction or rubbing and improving the running accuracy.

[0170] As shown in FIGS. 34 and 35, in some embodiments, the second air-floating guide sleeve 4 includes: a second air-floating top plate 41 and two second air-floating blocks 42 disposed on both sides of the second air-floating top plate 41. In some embodiments, the second air-floating block 42 provides a second vertical air-floating surface 421, and the second vertical air-floating surface 421 can air-floatingly support on the second vertical mating surface 31 or be adsorbed and fixed to the second vertical mating surface 31. In some embodiments, the second vertical air-floating surface 421 includes a second air-floating support area capable of providing positive pressure gas and a second adsorption and fixation area capable of providing negative pressure adsorption. Air-floating support is implemented through the second air-floating support area, and adsorption and fixation are implemented through the second adsorption and fixation area. In some embodiments, the second air-floating support area and the second adsorption and fixation area are alternately arranged on the second vertical air-floating surface 421.

[0171] In some embodiments, the second air flotation block 42 provides a second lateral air flotation surface 422. The two second lateral air flotation surfaces 422 are arranged facing each other and respectively supported on two second lateral mating surfaces 32. In some embodiments, the two second lateral air flotation surfaces 422 of the second air flotation guide sleeve 4 are preloaded with each other.

[0172] In some related embodiments, the air flotation guide sleeve is in a square shape and is sleeved outside the air flotation guide rail. Compared with this related embodiment, the second air flotation guide sleeve 4 in this embodiment is in a U shape, canceling the air flotation structure on the lower side and reducing the overall height of the device.

[0173] See Fig.36 、 37 As shown in, in one or more embodiments of this specification, the first lateral air flotation surface 221 includes: a first lateral air flotation surface positive pressure area 2211 close to the first air flotation top plate 21, and a first lateral air flotation surface negative pressure area 2212 far from the first air flotation top plate 21.

[0174] In some embodiments, the first lateral air flotation surface positive pressure area 2211 is supported on the first lateral mating surface 12, and the first lateral air flotation surface negative pressure area 2212 provides an adsorption force that moves the end of the first air flotation block 22 away from the first air flotation top plate 21 toward the first lateral mating surface 12. In some embodiments, since the first lateral air flotation surface positive pressure area 2211 provides positive pressure support during the long-term operation of the device, the first air flotation block 22 receives a reaction force away from the first lateral air flotation mating surface 12 (refer to the arrow in the left direction in Fig.37 ), so the two first air flotation blocks 22 are prone to deformation in the direction away from the first lateral air flotation mating surface 12 (for example, rotating outward to form a flared opening), and the air flotation stiffness is affected, thus affecting the positioning accuracy of the motion system. By providing a force in the opposite direction (refer to the arrow in the right direction in Fig.37 ) through the first lateral air flotation surface negative pressure area 2212 at the end of the first air flotation block 22 (for example, the upper end in Fig.37 ), the occurrence of the aforementioned deformation is reduced or avoided, ensuring the stability and reliability of the two first air flotation blocks 22.

[0175] See Fig.38 、 39 As shown in, in one or more embodiments of this specification, the second lateral air flotation surface 422 includes: a second lateral air flotation surface positive pressure area 4221 close to the second air flotation top plate 41, and a second lateral air flotation surface negative pressure area 4222 far from the second air flotation top plate 41.

[0176] In some embodiments, the second lateral air-floating surface positive pressure area 4221 is supported on the second lateral mating surface 32, and the second lateral air-floating surface negative pressure area 4222 provides an adsorption force to move the second air-floating block 42 away from the end of the second air-floating top plate 41 toward the second lateral mating surface 32. In some embodiments, since the second lateral air-floating surface positive pressure area 4221 provides positive pressure support during long-term operation of the device, the second air-floating block 42 is subjected to a reaction force away from the second lateral air-floating mating surface 32 (refer to Fig.39 The two second air-floating blocks 42 are easily deformed away from the second lateral air-floating mating surface 32 (for example, rotating outward to form a bell mouth), and the air-floating stiffness is affected, thereby affecting the positioning accuracy of the motion system. Fig.39 The second lateral air bearing surface negative pressure area 4222 at the upper end of the middle portion provides a force in the opposite direction (reference Fig.39 The arrow in the right direction in the figure) can reduce or avoid the above-mentioned deformation, thereby ensuring that the two second air floating blocks 42 are stable and reliable.

[0177] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this specification. Such modifications, improvements and corrections are taught in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

Claims

1. An adsorption module, characterized in that: include: Adsorption substrate, rotating base, rotating axis module, wafer stage and suction cup; The rotating base is fixedly connected to the adsorption substrate, and the rotating shaft module can rotate relative to the rotating base; The rotating shaft module is capable of being displaced in the axial direction of the rotating shaft module relative to the rotating base; The rotating axis module is configured to be connected to the suction cup or the rotating base in the form of a pneumatic connection; The wafer stage is configured to be able to adsorb the suction cup or support the suction cup by air floating.

2. The adsorption module according to claim 1, characterized in that: The rotating shaft module comprises: a rotating shaft, a vertical decoupling spring and a rotating top plate; The rotating top plate is connected to the rotating shaft through the vertical decoupling spring, and the vertical decoupling spring is configured to enable the rotating top plate to be displaced relative to the rotating shaft in the axial direction of the rotating shaft, and the rotating top plate can rotate with the rotation of the rotating shaft; The rotating top plate is configured to be able to adsorb the suction cup or desorb the suction cup; The rotating base is configured to be able to absorb the rotating top plate; The wafer support platform is sleeved outside the rotating top plate.

3. The adsorption module according to claim 2, characterized in that: The vertical decoupling reed comprises a vertical decoupling reed first region connected to the rotating shaft, a vertical decoupling reed second region connected to the rotating top plate, and a vertical decoupling reed deformation region connecting the vertical decoupling reed first region and the vertical decoupling reed second region; The deformation region of the vertical decoupling reed can be deformed so that the first region of the vertical decoupling reed and the second region of the vertical decoupling reed are located in different planes in the axial direction of the rotation axis.

4. The adsorption module according to claim 1, characterized in that: The rotating shaft module comprises: a rotating shaft; The rotating shaft is connected to the rotating base by air floating; The rotating shaft is capable of displacement relative to the rotating base in the axial direction of the rotating shaft; The rotating shaft is fixedly connected to the suction cup.

5. The adsorption module according to any one of claims 2 to 4, characterized in that: Also includes: A limiting structure for limiting the maximum upward displacement of the suction cup in the vertical direction, the limiting structure comprising: A limiting rod, a limiting member disposed at the upper end of the limiting rod, and a limited member disposed on the adsorption substrate or the wafer stage; The limited member can move upward or downward relative to the limiting rod, and the limiting member limits the maximum upward displacement of the limited member.

6. The adsorption module according to claim 1, characterized in that: It also includes a micro-motion module, which includes: at least three vertical driving devices for driving a part of the adsorption substrate to move in a vertical direction of a reference plane; The at least three vertical drive devices include three vertical drive devices whose axes are not coplanar; The vertical driving device comprises: a first linear driving mechanism and a second linear driving mechanism connected to a first driving part of the first linear driving mechanism, wherein a second driving part of the second linear driving mechanism is connected to the adsorption substrate via a driving decoupling mechanism; Wherein, the driving accuracy of the second linear driving mechanism is higher than the driving accuracy of the first linear driving mechanism.

7. The adsorption module according to claim 6, characterized in that: The vertical drive device further comprises: a drive device base; The first housing of the first linear drive mechanism is connected to the drive device base, and the second housing of the second linear drive mechanism is connected to the first drive part of the first linear drive mechanism; A portion of the first shell is located on one side of a portion of the second shell; The second housing comprises a second accommodating space which opens upward and is used to accommodate a part of the second linear drive mechanism, and a connecting plate which extends to one side from the opening of the second accommodating space; The first driving portion of the first linear driving mechanism is connected to the connecting plate; The second driving portion of the second linear driving mechanism moves along the vertical direction.

8. The adsorption module according to claim 6, characterized in that: The vertical driving device further comprises: a driving device base, a spring mounting seat connected to the driving device base, and a first vertical guide spring; A portion of the first vertical guide spring is connected to the spring mounting seat, and another portion of the first vertical guide spring is connected to the adsorption substrate; The two sides of the first vertical guide spring are symmetrically arranged relative to a vertical plane where the movement direction of the first driving part of the first linear driving mechanism is located.

9. The adsorption module according to claim 8, characterized in that: The reed mounting seat is a multi-step structure, and the reed mounting seat at least includes a bottom step connected to the driving device base and a top step away from the driving device base, and the size of the bottom step is larger than the size of the top step; the vertical guide reed includes a first area connected to the top step of the reed mounting seat, a second area connected to the adsorption substrate and capable of being deformed relative to the first area, and a third area for the drive decoupling mechanism to pass through; Or, the spring mounting seat includes a mounting seat base plate and a spring fixing portion provided on both sides of the mounting seat base plate and protruding from the mounting seat base plate in the vertical direction; the vertical guide spring includes a movable part connected to the adsorption substrate and two guide parts respectively connected to the two sides of the movable part, wherein the drive decoupling mechanism passes through the movable part, the guide part is L-shaped, and the guide part includes a first guide part extending to one side from the movable part and a second guide part extending in the vertical direction connected to the first guide part, the second guide part is connected to the spring fixing portion, and the thickness of the movable part is greater than the thickness of the guide part.

10. The adsorption module according to claim 6, characterized in that: The vertical drive device further comprises: a second vertical guide spring; The second vertical guide spring is arranged between the second housing of the second linear drive mechanism and the drive decoupling mechanism; The two sides of the second vertical guide spring are symmetrically arranged relative to a vertical plane where the movement direction of the second driving part of the second linear driving mechanism is located; The second vertical guide spring is in a straight line shape, an L shape or a C shape.

11. The adsorption module according to claim 6, characterized in that: The drive decoupling mechanism comprises: a first decoupling fixed block fixedly connected to the second driving part of the second linear drive mechanism, a second decoupling fixed block fixedly connected to the adsorption substrate, an intermediate decoupling fixed block provided between the first decoupling fixed block and the second decoupling fixed block, a first decoupling reed connecting the first decoupling fixed block and the intermediate decoupling fixed block, and a second decoupling reed connecting the second decoupling fixed block and the intermediate decoupling fixed block, wherein the first decoupling reed and the second decoupling reed are arranged crosswise; The drive decoupling mechanism is used to decouple the movement of the adsorption substrate into the deformation of the first decoupling reed and / or the second decoupling reed.

12. The adsorption module according to claim 6, characterized in that: It also includes: one or more first vertical measuring devices, the first vertical measuring devices are connected to the adsorption substrate through a first measurement decoupling mechanism, and are used to measure the position and displacement of the adsorption substrate; The first vertical measuring device comprises: a vertical measuring device base, a tape ruler mounting seat slidably connected to the vertical measuring device base, a grating ruler arranged on the tape ruler mounting seat, and a reading head matched with the grating ruler arranged in the vertical measuring device base; It also includes: second vertical measuring devices whose number corresponds to that of the first vertical measuring devices, and the second vertical measuring devices are used to measure the displacement of the adsorption substrate relative to the second shell of the second linear driving mechanism.

13. A motion system, characterized in that: The invention comprises: a working surface, a first air-floating guide rail arranged along a first direction on the working surface, a first air-floating guide sleeve air-floatingly supported on the first air-floating guide rail, a second air-floating guide rail connected to the first air-floating guide sleeve and arranged along a second direction, a second air-floating guide sleeve air-floatingly supported on the second air-floating guide rail, and an adsorption module arranged on the second air-floating guide sleeve; The first air-floating guide sleeve can move along the first air-floating guide rail, and the second air-floating guide sleeve can move along the second air-floating guide rail; the first direction intersects with the second direction; The adsorption module is the adsorption module according to any one of claims 1 to 12.

14. The motion system according to claim 13, characterized in that include: The first air-floating guide rail has a first vertical mating surface and two first lateral mating surfaces, and an air film is formed between the first air-floating guide sleeve and the first vertical mating surface, and between the first air-floating guide sleeve and the two first lateral mating surfaces; The working surface has a second vertical mating surface, the second air-floating guide rail has two second lateral mating surfaces, and an air film is formed between the second air-floating guide sleeve and the second vertical mating surface, and between the second air-floating guide sleeve and the two second lateral mating surfaces; The first air-floating guide sleeve comprises: a first air-floating top plate and two first air-floating blocks arranged on both sides of the first air-floating top plate; The first air-floating top plate provides a first vertical air-floating surface, and the first vertical air-floating surface can be air-floatingly supported on the first vertical mating surface or adsorbed and fixed on the first vertical mating surface; The first air-floating block provides a first lateral air-floating surface, two of the first lateral air-floating surfaces are arranged facing each other, and the two first lateral air-floating surfaces are respectively air-floatingly supported on the two first lateral matching surfaces; The second air-floating guide sleeve comprises: a second air-floating top plate and two second air-floating blocks arranged on both sides of the second air-floating top plate; The second air-floating block provides a second vertical air-floating surface, and the second vertical air-floating surface can be air-floating supported on the second vertical matching surface or adsorbed and fixed on the second vertical matching surface; The second air-floating block provides a second lateral air-floating surface. Two of the second lateral air-floating surfaces are arranged facing each other. The two second lateral air-floating surfaces are supported on two of the second lateral matching surfaces respectively.

15. The motion system according to claim 14, characterized in that include: The first lateral air-floating surface comprises: a first lateral air-floating surface positive pressure area close to the first air-floating top plate, and a first lateral air-floating surface negative pressure area away from the first air-floating top plate; The second lateral air-floating surface includes: a second lateral air-floating surface positive pressure area close to the second air-floating top plate, and a second lateral air-floating surface negative pressure area away from the second air-floating top plate.

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