Novel zinc cover plate eruption mold
By setting reinforcement ribs in the thickening area of the zinc cover ejection mold, the high loss problem caused by the thin metal layer at the left edge of the metallized film capacitor is solved, the current resistance of the capacitor and the consistency of the metal layer thickness are improved, and the capacitor is reduced The internal temperature rise solves the inconsistency of zinc steam volatility restricted by the zinc cover mold structure.
Patent Information
- Application Number
- CN202420907680.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The small-sized capacitors of existing metallized film capacitors have large losses due to heating. The main reason is that the metal layer at the left edge is too thin, resulting in poor overcurrent capability, and the corrosion of silicone oil has exacerbated mass defects, and the zinc cover mold structure limits zinc steam Volatilization makes it difficult to control the thickness of the coating.
Design a new type of zinc cover ejection mold, including the mold body, edge-retaining area, ordinary area and thickening area, and set reinforcement ribs in the thickening area to ensure that zinc is evaporated to the film surface, increase the thickness of the metal layer of the edge-retaining edge-retaining area, and improve the Current resistance and avoid thermal deformation of mold and zinc steam volatility by adjusting the reinforcement rib position.
By increasing the thickness of the metal layer, improving the current resistance of the capacitor, controlling the internal temperature rise of the capacitor, reducing losses, ensuring the consistency of the square resistance of the metal layer within the product process requirements, solving the loss problem.
Smart Images
Figure CN222349098U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of metallized films for capacitors and relates to a novel zinc cover plate spraying mould. Background Art
[0002] Metallized film capacitors are prone to large losses when they are small in size. After analysis, the reason for its large loss is the heat generated inside the capacitor. Excluding the raw material base film factor, according to Ohm's law, the main reason for the heat generation is that the metal layer at the edge of the metallized film capacitor is too thin, resulting in poor overcurrent capability. In addition, a layer of silicone oil is sprayed on the surface of the edge, and the characteristic of silicone oil is high insulation resistance. It can corrode the metal layer at the edge of the edge over time. Because the existing zinc cover plate mold itself structurally limits and blocks the volatilization of zinc vapor molecules in the edge area, the metal layer at the edge of the edge is the thinnest part of the metal layer on the entire film surface. After analysis, the metal layer near the edge is most likely to cause quality defects such as coating shedding. Due to the small size, the process is difficult to control during production evaporation. Therefore, solving the large loss of small-size film capacitors is the key issue. Summary of the invention
[0003] The purpose of the utility model is to provide a novel zinc cover plate spraying mold to solve the above problems existing in the prior art.
[0004] The purpose of the utility model can be achieved through the following technical solutions: a new type of zinc cover plate spraying mold, characterized in that it includes a mold body and a plurality of mold margin areas, a plurality of mold ordinary areas and a plurality of mold thickening areas formed on the mold body, the metallized film capacitor includes a metallized film thickening area, a metallized film ordinary area and a metallized film margin area, and the mold thickening area is provided with a plurality of reinforcing ribs.
[0005] Compared with the existing technology, this new zinc cover plate spraying mold has the following advantages:
[0006] After changing the position of the reinforcement rib to the thickened area, the zinc in this area can be completely evaporated onto the film surface during vapor deposition, and the thickness of the metal layer near the edge of the retained margin is guaranteed. After the thickness of the metal layer here increases, the current resistance is improved. After the current resistance is improved, the internal temperature rise of the capacitor is controlled, and the loss is small, which can be fully controlled within the range of product process requirements. The square resistance of the metal layer evaporated by this new structural mold zinc cover plate is consistent and the loss problem is also solved. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 It is the structural diagram of the new zinc cover plate spraying mold.
[0008] In the figure, 1. mold body; 2. mold margin area; 3. mold common area; 4. mold thickening area; 5. reinforcing ribs. DETAILED DESCRIPTION
[0009] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
[0010] like Figure 1 As shown, the novel zinc cover plate spraying mold comprises a mold body 1 and a plurality of mold margin areas 2, a plurality of mold ordinary areas 3 and a plurality of mold thickening areas 4 formed on the mold body 1; the metallized film capacitor comprises a metallized film thickening area, a metallized film ordinary area and a metallized film margin area; a plurality of reinforcing ribs 5 are arranged on the mold thickening area 4; the reinforcing ribs 5 corresponding to the metallized film margin areas on the original mold body 1 are removed, and the reinforcing ribs 5 are designed at the corresponding positions of the mold thickening areas 4; the zinc cover plate mold designed in this way will not be thermally deformed, and the consistency of zinc vapor volatilization is also good.
[0011] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.
[0012] Although the terms such as mold body 1, mold margin area 2, mold general area 3, mold thickened area 4, and reinforcing rib 5 are used more frequently in this article, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the utility model; interpreting them as any additional restrictions is contrary to the spirit of the utility model.
Claims
1. A new type of zinc cover plate spraying mold, characterized in that: The invention comprises a mold body (1) and a plurality of mold margin areas (2), a plurality of mold common areas (3) and a plurality of mold thickening areas (4) formed on the mold body (1); the metallized film capacitor comprises the metallized film thickening area, the metallized film common area and the metallized film margin area; and a plurality of reinforcing ribs (5) are provided on the mold thickening area (4).