LED car lamp with ceramic light source plate

Abstract

The utility model provides a light-emitting diode (LED) car lamp with a ceramic light source plate, which comprises a first shell and a second shell which are arranged oppositely, and a heat conducting substrate is arranged between the first shell and the second shell. Moreover, only the first side surface of the heat conduction substrate is provided with a ceramic light source plate, the ceramic light source plate is provided with at least one LED chip, and the LED chip is packaged on the ceramic light source plate in a chip scale packaging mode. The first shell is provided with a first light-passing window, and the LED chip is located in the first light-passing window. And / or the second shell is provided with a second light-passing window, and the LED chip is located in the second light-passing window. According to the utility model, ultra-thin light distribution can be realized.

Description

Technical Field

[0001] The utility model relates to the field of automobile accessories, in particular to an LED car lamp with a ceramic light source plate used in an automobile. Background Art

[0002] LED light-emitting devices are used as lamps, which have the advantages of energy saving, long service life, and high luminous brightness. They have been widely used in many types of lamps such as lighting and decoration, and LED car lights have also been widely used. Since LED car lights use LED chips as light-emitting devices, the LED chips generate a lot of heat when working. Once the temperature of the LED chips is too high, the LED chips are prone to burn out, which affects the service life of the LED car lights. For this reason, existing LED car lights usually add cooling fans to the car lights to dissipate the heat of the LED chips.

[0003] The Chinese utility model patent with announcement number CN218268873U discloses a plug-in LED headlight, which includes a heat dissipation shell; a heat dissipation fan, an LED chip assembly, and a power supply assembly are arranged in sequence from top to bottom in the heat dissipation shell; the heat dissipation shell includes a first shell and a second shell that are connected, the first shell includes a first heat dissipation part, a first light distribution part, and a first power supply part arranged in sequence along the vertical direction, and the second shell includes a second heat dissipation part, a second light distribution part, and a second power supply part arranged in sequence along the vertical direction; the first heat dissipation part and the second heat dissipation part surround a fan cavity with an air inlet at the top, and the heat dissipation fan is arranged in the fan cavity. In addition, a heat conductive substrate is arranged between the first shell and the second shell, and LED chipsets are arranged on two opposite surfaces of the heat conductive substrate.

[0004] However, since the thermally conductive substrate itself has a certain thickness, and each LED chip group is packaged on a ceramic substrate, the heat generated by the LED chip is transferred to the thermally conductive substrate through the ceramic substrate, and then dissipated through the thermally conductive substrate. This solution requires a ceramic substrate to be arranged on the surface of both sides of the thermally conductive substrate, so that the overall thickness of the thermally conductive substrate and the ceramic substrate is relatively large. Since the LED chip group is arranged on the two surfaces of the thermally conductive substrate, the greater the distance between the two groups of LED chips, the larger the dark area will be formed in the middle of the formed light spot. Therefore, the smaller the distance between the LED chips on the two sides of the thermally conductive substrate, the more ideal the formed light spot.

[0005] However, since the distance between the LED chips on both sides of the heat-conducting substrate of the existing LED car lamp is still relatively large, the demand for ultra-thin light distribution cannot be achieved, and the use in scenes with higher light spot requirements cannot be met. Summary of the invention

[0006] The utility model aims to provide an LED vehicle lamp with a ceramic light source plate which has a small thickness and good light spot quality.

[0007] In order to achieve the above-mentioned purpose, the LED car light with a ceramic light source board provided by the present invention includes a first shell and a second shell arranged opposite to each other, and a heat-conducting substrate is arranged between the first shell and the second shell; and a ceramic light source board is arranged only on the first side surface of the heat-conducting substrate, and at least one LED chip is arranged on the ceramic light source board, and the LED chip is packaged on the ceramic light source board in a chip-level packaging manner; a first light-transmitting window is arranged on the first shell, and the LED chip is located in the first light-transmitting window; and / or a second light-transmitting window is arranged on the second shell, and the LED chip is located in the second light-transmitting window.

[0008] It can be seen from the above scheme that a ceramic light source board is arranged on the surface of only one side of the thermal conductive substrate, and the LED chip is directly packaged on the ceramic light source board. Since the thickness of the ceramic light source board is very small, the distance between the LED chips formed on both sides of the ceramic light source board is very small, thereby realizing ultra-thin light distribution, so that the light spot formed by the LED car lights will not form a dark area.

[0009] A further solution is that the heat-conducting substrate is provided with a third light-transmitting window, and the LED chip is arranged in the third light-transmitting window.

[0010] It can be seen that when LED chips are arranged on both sides of the ceramic light source board, the LED chip on one side of the ceramic light source board can be arranged in the third light-transmitting window, so that the thermal conductive substrate will not block the light beam emitted by this part of the LED chip, thereby achieving the effect of light emission on both sides of the LED lamp. Since the LED lamp does not need to be provided with two ceramic substrates, the distance between the LED chips on both sides of the thermal conductive substrate is reduced by the thickness of one ceramic substrate, so that the distance between the LED chips on both sides of the thermal conductive substrate becomes smaller, and ultra-thin light distribution is achieved.

[0011] A preferred solution is that a plurality of first electrical contacts are arranged on the surface of the thermally conductive substrate close to the ceramic light source board, a plurality of second electrical contacts are arranged on the surface of the ceramic light source board close to the thermally conductive substrate, and the first electrical contacts are electrically connected to the second electrical contacts.

[0012] It can be seen that the thermally conductive substrate and the ceramic light source board can transmit electrical signals through the contact between the first electrical contact and the second electrical contact, for example, the thermally conductive substrate can supply power to the LED chip of the ceramic light source board.

[0013] A further solution is that the number of LED chips is more than two; a first LED chip is arranged on the first surface of the ceramic light source board facing the first shell, and a second LED chip is arranged on the second surface of the ceramic light source board facing the second shell.

[0014] A further solution is that the first LED chip is located in the first light-transmitting window, and the second LED chip is located in the second light-transmitting window.

[0015] In this way, the light emitted by the LED chips on both sides of the thermally conductive substrate will not be blocked, and the light distribution requirements can still be met when the distance between the LED chips on both sides is extremely small.

[0016] A further solution is that the number of the first LED chips is equal to the number of the second LED chips, and the first LED chips and the second LED chips are symmetrically arranged on two surfaces of the ceramic light source board.

[0017] It can be seen that the LED chips on both sides of the thermal conductive substrate are symmetrically arranged, making the light spot formed by the LED headlight more uniform.

[0018] An optional solution is that the thickness center plane of the ceramic light source plate is located on the thickness center plane of the LED vehicle lamp with the ceramic light source plate.

[0019] Since the ceramic light source board is basically arranged on only one side of the surface for heat conduction, the ceramic light source board is arranged at the thickness center of the LED lamp, which can ensure that the center of the formed light spot overlaps with the center of the LED lamp.

[0020] A further solution is that the thickness center plane of the thermal conductive substrate deviates from the thickness center plane of the LED headlight with the ceramic light source board.

[0021] It can be seen that by eccentrically arranging the heat-conducting substrate, the ceramic light source plate is formed at the thickness center of the LED lamp.

[0022] A further solution is that one of the first shell and the second shell is provided with a mounting groove, and the ceramic light source board is located in the mounting groove.

[0023] It can be seen that the ceramic light source board can be positioned through the mounting groove, which is also beneficial to the installation of the ceramic light source board.

[0024] A further solution is that the other of the first shell and the second shell is provided with a limiting protrusion, and the limiting protrusion abuts against the heat-conducting substrate.

[0025] It can be seen that the limiting protrusion abuts against the thermally conductive substrate, so that the thermally conductive substrate can be clamped by the first shell and the second shell, ensuring that the thermally conductive substrate will not shake in the LED lamp, thereby avoiding damage to the thermally conductive substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural diagram of an embodiment of the utility model.

[0027] Figure 2 It is a structural exploded view of an embodiment of the utility model.

[0028] Figure 3It is a structural diagram of the heat-conducting substrate and the ceramic light source board from a first viewing angle in an embodiment of the utility model.

[0029] Figure 4 It is a structural diagram of the heat-conducting substrate and the ceramic light source board from a second viewing angle in an embodiment of the utility model.

[0030] Figure 5 It is a structural exploded view of the heat-conducting substrate and the ceramic light source board in the embodiment of the utility model.

[0031] Figure 6 It is a structural diagram of the hidden second shell in the embodiment of the utility model.

[0032] Figure 7 It is a structural exploded view of the hidden second shell in the embodiment of the utility model.

[0033] Figure 8 It is a structural diagram of the hidden first shell in the embodiment of the utility model.

[0034] Fig. 9 It is a structural exploded view of the hidden first shell in the embodiment of the utility model.

[0035] Fig.10 It is a cross-sectional view of an embodiment of the utility model.

[0036] The present invention will be further described below with reference to the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0037] The LED car light with a ceramic light source plate provided by the utility model only has the ceramic light source plate arranged on one side surface of the heat conducting substrate, so that the distance between the LED chips on both sides of the heat conducting substrate is very small, and ultra-thin light distribution can be achieved.

[0038] See also Figure 1 and Figure 2 The LED lamp of this embodiment has a housing 10, which includes a first housing 11 and a second housing 21. The first housing 11 and the second housing 21 are arranged opposite to each other. Preferably, the first housing 11 and the second housing 21 are symmetrical in appearance. The first housing 11 and the second housing 21 are buckled together to form a cavity, and a heat-conducting substrate 40 is arranged in the cavity. Figure 2 It can be seen that the thermally conductive substrate 40 is clamped between the first housing 11 and the second housing 21 .

[0039] See also Figures 3 to 5The heat-conducting substrate 40 is a copper substrate and is a rectangle with a notch, which forms a third light-transmitting window 41 of the heat-conducting substrate 40. A ceramic light source board 50 is arranged on one side surface of the heat-conducting substrate 40, and the ceramic light source board 50 is fixed on the heat-conducting substrate 40 by welding. LED chips are arranged on two opposite surfaces of the ceramic light source board 50, for example, a first LED chip 51 is arranged on the first surface, and a second LED chip 52 is arranged on the second surface. Figure 3 and Figure 4 It can be seen that the number of the first LED chips 51 is four, and the number of the second LED chips 52 is also four, that is, the number of the first LED chips 51 is equal to the number of the second LED chips 52. In addition, the plurality of first LED chips 51 and the plurality of second LED chips 52 are symmetrically arranged on the two surfaces of the ceramic light source board 50.

[0040] In this embodiment, the number of the first LED chips 51 is four, which are arranged in a straight line and extend along the length direction of the ceramic light source board 50; the number of the second LED chips 52 is also four, which are also arranged in a straight line and extend along the length direction of the ceramic light source board 50. In addition, the first LED chip 51 and the second LED chip 52 are both packaged on the ceramic light source board 50 in a chip scale package (ChipScale Package) manner. In this way, the thickness of the first LED chip 51 and the second LED chip 52 protruding from the ceramic light source board 50 is very small, so that the distance between the first LED chip 51 and the second LED chip 52 is very small. In this embodiment, the thickness of the ceramic light source board 50 is 0.5 mm, so the distance between the first LED chip 51 and the second LED chip 52 is very small, achieving ultra-thin light distribution.

[0041] Since LED chips are arranged on both sides of the ceramic light source board 50, in order not to block the light beams emitted by the LED chips, a third light-transmitting window 41 is arranged on the heat-conducting substrate 40. Figure 5 It can be seen that the third light-transmitting window 41 is trapezoidal, and the second LED chip 52 is located in the third light-transmitting window 41. In this way, the light beam emitted by the second LED chip 52 will not be blocked by the heat-conducting substrate 40. In addition, since the first LED chip 51 is facing away from the heat-conducting substrate 40, the light beam emitted by the first LED chip 51 will not be blocked by the heat-conducting substrate 40 either.

[0042] Since LED chips are arranged on both surfaces of the ceramic light source board 50, it is only necessary to arrange the ceramic light source board 50 on one side surface of the thermal conductive substrate 40, and there is no need to arrange ceramic light source boards on both side surfaces of the thermal conductive substrate 40. Compared with the traditional solution that requires ceramic plates to be arranged on both sides of the thermal conductive substrate, the overall thickness of the thermal conductive substrate 40 and the ceramic light source board 50 of this embodiment is smaller, which can reduce the overall thickness of the LED car light.

[0043] See also Figure 6 and Figure 7 The first housing 11 is provided with a first light-transmitting window 12. Preferably, the first light-transmitting window 12 is opposite to the third light-transmitting window 41 of the thermally conductive substrate 40, and the first light-transmitting window 12 is also trapezoidal, and the area of ​​the first light-transmitting window 12 is smaller than the area of ​​the third light-transmitting window 41. In addition, the first LED chip 51 is located in the first light-transmitting window 12, so that the light beam emitted by the first LED chip 51 will not be blocked by the first housing 11.

[0044] In addition, since the heat conductive substrate 40 is sandwiched between the first housing 11 and the second housing 21, the ceramic light source board 50 is mounted on the first housing 11. Figure 7 The first housing 11 is provided with a mounting groove 13, which is roughly rectangular, and the ceramic light source board 50 is installed in the mounting groove 13. In addition, semicircular access portions 18 are provided at the four top corners of the mounting groove 13. When the ceramic light source board 50 needs to be taken out, the ceramic light source board 50 can be conveniently removed from the first housing 11 through the access portions 18.

[0045] See also Figure 8 and Fig. 9 The second housing 21 is provided with a trapezoidal second light-transmitting window 22, and the second light-transmitting window 22 is arranged opposite to the first light-transmitting window 12, and the first light-transmitting window 12 and the second light-transmitting window 22 are completely the same in shape, size and dimension. Furthermore, the first light-transmitting window 12 and the second light-transmitting window 22 are symmetrically arranged, and the second LED chip 52 is located in the second light-transmitting window 22, so that the light beam emitted by the second LED chip 52 will not be blocked by the second housing 21.

[0046] In addition, a limiting protrusion 23 is provided on the second housing 21. Fig. 9 It can be seen that the limiting protrusion 23 protrudes from the lower surface of the second shell 21 and can abut against the thermal conductive substrate 40. The limiting protrusion 23 clamps the thermal conductive substrate 40 so that the thermal conductive substrate 40 is firmly clamped between the first shell 11 and the second shell 21.

[0047] In order to facilitate the assembly of the LED lamp, two threaded holes 14 are provided on the first housing 11, two threaded holes 24 are also provided on the second housing 21, and two mounting through holes 42 are provided on the thermal conductive substrate 40. Two screws 32 are also provided on the housing 10, and one screw 32 can pass through one threaded hole 14, one mounting through hole 42 and one threaded hole 24 in sequence. On the one hand, the screw 32 can fix the first housing 11 and the second housing 21 together, and on the other hand, the screw 32 passes through the mounting through hole 42 to realize the positioning of the thermal conductive substrate 40 in the first housing 11 and the second housing 21.

[0048] For further information, see Fig. 9 A positioning column 25 is provided on the second housing 21, and the positioning column 25 extends from the bottom wall of the second housing 21 toward the heat conducting substrate 40. A positioning hole 43 is provided on the heat conducting substrate 40, and the positioning hole 43 is arranged opposite to the positioning column 25. When the heat conducting substrate 40 is pressed into the second housing 21, the positioning column 25 can pass through the positioning hole 43, thereby realizing the positioning of the heat conducting substrate 40 in the second housing 21.

[0049] Since the first LED chip 51 and the second LED chip 52 on the ceramic light source board 50 need to be powered when working, a plurality of first electrical contacts (not shown in the figure) are provided on the surface of the thermal conductive substrate 40 close to the ceramic light source board 50, and a plurality of second electrical contacts (not shown in the figure) are provided on the surface of the ceramic light source board 50 close to the thermal conductive substrate 40. Preferably, the plurality of first electrical contacts correspond to the plurality of second electrical contacts one by one, and one first electrical contact is electrically connected to the corresponding second electrical contact. The current can be conducted to the circuit of the ceramic light source board 50 through the first electrical contacts and the second electrical contacts, and power is supplied to the first LED chip 51 and the second LED chip 52.

[0050] Furthermore, the ceramic light source board 50 has a second electrical contact only on one surface, and a via is provided on the ceramic light source board 50, in which a conductive metal is filled, and electrical connection is achieved on both sides of the ceramic light source board 50 through the conductive metal, thereby supplying power to the LED chips on both sides.

[0051] In order to ensure that the center of the light spot formed by the LED lamp is located on the axis of the LED lamp, the ceramic light source plate 50 needs to be arranged at the center of the LED lamp. Fig.10 The thickness center plane L1 of the ceramic light source plate 50 is located on the thickness center plane of the LED headlight, so that the first LED chip 51 and the second LED chip 52 are arranged symmetrically along the thickness center plane of the LED headlight.

[0052] Since the ceramic light source board 50 is only disposed on one side of the heat conductive substrate 40, when the thickness center plane L1 of the ceramic light source board 50 is located at the thickness center plane of the LED headlight, the thickness center plane L2 of the heat conductive substrate 40 will deviate from the thickness center plane of the LED headlight. This design ensures that the center of the light spot formed by the LED headlight is exactly located on the axis of the LED headlight.

[0053] In addition, a cooling fan 31, a power driving board 33, and a power plug 34 are also provided between the first shell 11 and the second shell 21. The power plug 34 is provided at one end of the power driving board 33. The power driving board 33 is connected to the thermal conductive substrate 40. The cooling fan 31 is located at one end of the thermal conductive substrate 40. After the heat generated by the LED chip is conducted to the thermal conductive substrate 40 through the ceramic light source board 50, the cooling fan 31 blows away the heat on the thermal conductive substrate 40 to achieve cooling of the thermal conductive substrate 40.

[0054] In addition, on the ceramic light source board 50, except for the first LED chip 51, the second LED chip 52, and the second electrical contact, the area other than the area where the first LED chip 51, the second LED chip 52, and the second electrical contact are arranged, all are thermal pads, so that the heat generated by the LED chip can be efficiently transferred from the ceramic light source board 50 to the thermal conductive substrate 40. Since the ceramic board itself also has good thermal conductivity, such a design can solve the problem of separation between thermal conduction and electrical conduction. Since the chip-level packaged LED light source does not have a thermal pad, the problem of thermal and electrical separation can only be solved by a ceramic substrate. For this reason, the traditional solution needs to add an electrical insulation layer on the thermal conductive substrate to solve the problem of separation between thermal conduction and electrical conduction, but such a design will increase thermal resistance, causing the heat generated by the chip-level packaged LED light source to accumulate and fail to exert maximum efficiency. However, this embodiment achieves the separation of thermal conduction and electrical conduction by adopting a ceramic light source board and setting a thermal pad, and electrical conduction does not affect heat dissipation.

[0055] Since the ceramic light source board 40 is only arranged on the surface of one side of the thermal conductive substrate 40 of the present embodiment, and the first LED chip 51 and the second LED chip 52 are directly packaged on the ceramic light source board 50, and since the thickness of the ceramic light source board 50 is very small, the distance between the LED chips formed on both sides of the ceramic light source board 50 is very small, thereby realizing ultra-thin light distribution, so that the light spot formed by the LED car lights will not form a dark area.

[0056] Finally, it should be emphasized that the present invention is not limited to the above-mentioned embodiments, and minor changes such as changes in the appearance of the first shell and the second shell, changes in the number of the first LED chip and the second LED chip should also be included in the protection scope of the claims of the present invention.

Claims

1. LED headlight with ceramic light source plate, including: A first shell and a second shell are arranged opposite to each other, and a heat-conducting substrate is arranged between the first shell and the second shell; Features: A ceramic light source board is arranged only on the first side surface of the heat-conducting substrate, at least one LED chip is arranged on the ceramic light source board, and the LED chip is packaged on the ceramic light source board in a chip-level packaging manner; A first light-transmitting window is provided on the first housing, and the LED chip is located in the first light-transmitting window; and / or The second shell is provided with a second light-transmitting window, and the LED chip is located in the second light-transmitting window.

2. The LED car lamp with a ceramic light source plate according to claim 1, characterized in that: The heat-conducting substrate is provided with a third light-transmitting window, and the LED chip is arranged in the third light-transmitting window.

3. The LED car lamp with a ceramic light source plate according to claim 1, characterized in that: A plurality of first electrical contacts are arranged on the surface of the thermally conductive substrate close to the ceramic light source board, and a plurality of second electrical contacts are arranged on the surface of the ceramic light source board close to the thermally conductive substrate. The first electrical contacts are electrically connected to the second electrical contacts.

4. The LED vehicle lamp with a ceramic light source plate according to any one of claims 1 to 3, characterized in that: The number of the LED chips is more than two; A first LED chip is disposed on a first surface of the ceramic light source board facing the first shell, and a second LED chip is disposed on a second surface of the ceramic light source board facing the second shell.

5. The LED vehicle lamp with a ceramic light source plate according to claim 4, characterized in that: The first LED chip is located in the first light-transmitting window, and the second LED chip is located in the second light-transmitting window.

6. The LED vehicle lamp with a ceramic light source plate according to claim 4, characterized in that: The number of the first LED chips is equal to the number of the second LED chips, and the first LED chips and the second LED chips are symmetrically arranged on two surfaces of the ceramic light source board.

7. The LED vehicle lamp with a ceramic light source plate according to claim 4, characterized in that: The thickness center plane of the ceramic light source plate is located on the thickness center plane of the LED vehicle lamp with the ceramic light source plate.

8. The LED vehicle lamp with a ceramic light source plate according to claim 7, characterized in that: The thickness center plane of the thermally conductive substrate deviates from the thickness center plane of the LED vehicle lamp with a ceramic light source plate.

9. The LED vehicle lamp with a ceramic light source plate according to any one of claims 1 to 3, characterized in that: One of the first shell and the second shell is provided with a mounting groove, and the ceramic light source board is located in the mounting groove.

10. The LED vehicle lamp with a ceramic light source plate according to claim 9, characterized in that: The other of the first shell and the second shell is provided with a limiting protrusion, and the limiting protrusion abuts against the heat-conducting substrate.

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