High-temperature-resistant flexible printed board

Abstract

The utility model discloses a high-temperature-resistant flexible printed circuit board, which comprises a flexible printed circuit board, an aerogel heat insulation layer arranged on the surface of the flexible printed circuit board, and an outer protection layer arranged on the aerogel heat insulation layer. According to the high-temperature-resistant flexible printed board, the transmission requirement in a narrow space is met, and meanwhile the high-temperature-resistant capacity of the cable is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of cable assemblies, and in particular relates to a high-temperature resistant flexible printed board. Background Art

[0002] The supporting cable assembly products need to meet the high temperature resistance requirements. The existing cable high temperature resistant harnesses are composed of high temperature resistant cables (high temperature conductors), alkali-free glass fiber sleeves (externally coated with silicone), quartz fiber braided sleeves, aluminum film and other sheath materials. Such products are large in size and are usually used under relatively loose laying space conditions. In small spaces, flexible printed circuit boards are usually used as the medium for transmission and interconnection, but the flexible printed circuit boards cannot meet the needs of use under high temperatures due to the influence of the structure. Utility Model Content

[0003] In order to solve the above problems, the utility model aims to provide a high temperature resistant flexible printed circuit board.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A high temperature resistant flexible printed board comprises a flexible printed circuit board, an aerogel heat insulation layer arranged on the surface of the flexible printed circuit board, and an outer protective layer arranged on the aerogel heat insulation layer.

[0006] The aerogel thermal insulation layer is connected to the flexible printed circuit board by mounting.

[0007] The aerogel insulation layer is connected to the flexible printed circuit board via a high temperature resistant adhesive.

[0008] The outer protective layer is set as high temperature resistant cloth.

[0009] The high temperature resistant cloth is bonded to the aerogel insulation layer by applying glue.

[0010] The high temperature resistant cloth is connected to the aerogel insulation layer through a high temperature resistant adhesive.

[0011] Compared with the prior art, the utility model has the following advantages:

[0012] The utility model provides a high temperature resistant flexible printed circuit board, which solves the transmission demand in a narrow space and improves the ability of the cable to withstand high temperatures.

[0013] In the utility model, the temperature insulation performance of the aerogel insulation layer is fully utilized, and the aerogel insulation layer is bonded to the surface of the flexible printed circuit board by a high-temperature adhesive, thereby finally realizing high-temperature resistant heat insulation protection of the flexible printed circuit board.

[0014] The processability of aerogel is improved by applying glue and bonding high temperature resistant cloth on the surface of aerogel insulation layer, while ensuring that the aerogel insulation layer does not shed powder or break.

[0015] A high temperature resistant adhesive is used to realize the connection between the flexible printed circuit, the aerogel insulation layer and the high temperature resistant cloth, and no external structure is required to fix the aerogel insulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of a high temperature resistant flexible printed circuit board in the utility model;

[0018] Figure 2 This is the back temperature curve under 0.4mm thick insulation material;

[0019] Figure 3 This is the back temperature curve under 0.75mm thick insulation material;

[0020] Reference numerals: 1 - flexible printed circuit, 2 - aerogel thermal insulation layer. DETAILED DESCRIPTION

[0021] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments, but it should not be understood that the scope of the subject matter described in the present invention is limited to the following embodiments. Without departing from the above-mentioned technical ideas of the present invention, various modifications, substitutions and changes made according to the common technical knowledge and customary means in the field are included in the scope of the present invention.

[0022] Reference Figure 1 A high temperature resistant flexible printed board in the utility model comprises a flexible printed circuit board 1, an aerogel insulation layer 2 arranged on the surface of the flexible printed circuit board 1, and an outer protective layer arranged on the aerogel insulation layer 2.

[0023] The aerogel insulation layer 2 is connected to the flexible printed circuit board 1 by mounting. The aerogel insulation layer 2 is connected to the flexible printed circuit board 1 by a high temperature resistant adhesive. The ultra-low thermal conductivity of the aerogel insulation layer 2 is used as an insulation layer to provide thermal protection.

[0024] In the utility model, the temperature insulation performance of the aerogel insulation layer 2 is fully utilized, and the aerogel insulation layer 2 is bonded to the surface of the flexible printed circuit board 1 by a high-temperature adhesive, thereby finally achieving high-temperature resistant heat insulation protection for the flexible printed circuit board 1.

[0025] The outer protective layer is set as a high temperature resistant cloth. The high temperature resistant cloth is bonded to the aerogel insulation layer 2 by applying glue. The high temperature resistant cloth is connected to the aerogel insulation layer 2 by a high temperature resistant adhesive. The method of applying glue and bonding the high temperature resistant cloth on the surface of the aerogel insulation layer 2 improves the processability of the aerogel and ensures that the aerogel insulation layer 2 does not fall off or break.

[0026] The utility model provides a high temperature resistant flexible printed circuit board, which combines the small space applicability of the flexible printed circuit board 1 and the low thermal conductivity characteristic of the aerogel, and solves the circuit signal transmission demand in a small space and high temperature environment.

[0027] The high temperature resistant insulation product uses the instruments and materials in the table below to verify the back temperature, and the laying materials use 0.4mm coating and 0.75mm coating. The laying materials here refer to the total thickness of the aerogel insulation layer, high temperature resistant adhesive and high temperature resistant cloth.

[0028] Table 1 Test instruments and laying materials

[0029]

[0030] Test conditions:

[0031] 1. The constant temperature heating table is preset to 400℃;

[0032] 2. The test sample is laid flat in the center of the constant temperature heating table, and two K-type thermocouples are placed on the cable connector and the flexible area of ​​the cable inside the sheath;

[0033] 3. The digital display thermometer monitors the change of K-type thermocouple temperature over time.

[0034] Test data:

[0035] The 0.4mm coated and 0.75mm coated samples were tested for 2 minutes of heat resistance. Figure 2 and Figure 3 ,The test results are summarized in Table 2.

[0036] Table 2 Back temperature data

[0037]

[0038] Note: Electrical properties are tested after returning to room temperature.

[0039] 3. Retest samples

[0040] After the 0.4mm thick sample was heated for more than 120s, the local back temperature reached 180℃. After testing, a short circuit occurred. X-rays showed that the solder joints at the monitoring point melted and short-circuited. After 120s of continuous heating for 0.75mm, the temperature did not exceed 150℃, and the retest performance was good. Combined with the actual temperature resistance of cable products, the 0.4mm thick laying protection product should withstand a temperature of 400℃ for less than 90s, and the 0.75mm thick laying protection product should withstand a temperature of 400℃ for less than 120s.

[0041] The above is a detailed introduction to a high temperature resistant flexible printed circuit board provided by the utility model. This article uses specific examples to illustrate the structure and working principle of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A high temperature resistant flexible printed circuit board, characterized in that: It comprises a flexible printed circuit board (1), an aerogel heat insulation layer (2) arranged on the surface of the flexible printed circuit board (1), and an outer protective layer arranged on the aerogel heat insulation layer (2); The aerogel heat insulation layer (2) is connected to the flexible printed circuit board (1) by means of a mounting method; The aerogel heat insulation layer (2) is connected to the flexible printed circuit board (1) via a high temperature resistant adhesive; The outer protective layer is set as high temperature resistant cloth.

2. A high temperature resistant flexible printed circuit board according to claim 1, characterized in that: The high temperature resistant cloth is bonded to the aerogel heat insulation layer (2) by applying glue.

3. A high temperature resistant flexible printed circuit board according to claim 2, characterized in that: The high temperature resistant cloth is connected to the aerogel insulation layer (2) via a high temperature resistant adhesive.

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