Wafer laminating device

Abstract

The utility model relates to the field of wafer bonding, in particular to a wafer bonding device, which comprises wafers, a pressing plate and a gasket, a supporting table is arranged in a device shell, the wafers are arranged at the upper end of the supporting table, the gasket is arranged between the wafers, a mounting plate is arranged above the wafers, a telescopic column is arranged on a fixed seat, and a pressure sensor is arranged at the lower end of the telescopic column. The beneficial effects of the utility model are that by using the sensitive pressure sensors and the pressing plate and the pressing roller which are made of flexible materials, the pressing force on the wafer can be effectively controlled, thereby improving the bonding quality of the wafer; according to the device, the attaching problem of a high-warping-degree wafer is solved in a mode of applying pressure to a central area and pulling out a gasket from the edge, and the flatness of the wafer is ensured; and through cooperative use of the vacuum pump and the electromagnetic sealing valve, a vacuum environment can be created in the device shell, and improvement of the stability and quality of the laminating process is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer bonding, in particular to a wafer bonding device. Background Art

[0002] Wafer bonding is an important step in the semiconductor manufacturing process. It can combine two or more materials (or structures) into one. Direct wafer bonding (generally referred to as "wafer bonding" or "direct bonding") can combine polished semiconductor wafers together without the use of adhesives. It has a wide range of applications in integrated circuit manufacturing, micro-electromechanical systems (MEMS) packaging and multi-functional chip integration.

[0003] In the related art, during small-scale trial production or production, wafer bonding devices are mostly manually bonded. The problem with manual bonding is that the bonding environment is an atmospheric pressure environment, which will cause air to remain on the surface of the wafer bonding device, forming voids during bonding and affecting the bonding strength. When encountering a wafer with a high degree of warpage, a large amount of air will remain on the bonding surface, directly leading to the failure of the wafer bonding device. For this reason, we propose a wafer bonding device.

[0004] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer bonding device to solve the problem raised in the above background technology that in small-scale trial production or production, the wafer bonding device is mostly manual bonding. The problem with manual bonding is that the bonding environment is an atmospheric pressure environment, which will cause air to remain on the surface of the wafer bonding device, forming voids during bonding, affecting the bonding strength. When encountering a wafer with a high degree of warpage, a large amount of air will remain on the bonding surface, directly leading to the failure of the wafer bonding device.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A wafer bonding device comprises a device shell, a wafer, a pressure plate and a gasket, wherein a support platform is fixedly installed at the central position of the lower end of the inner part of the device shell, a wafer is horizontally placed at the upper end of the support platform, a gasket is arranged between the two groups of wafers, the gasket is placed at the edge of the wafer, a connecting rod is fixedly arranged on the side of the gasket away from the wafer, the connecting rod is arranged horizontally, and the right side of the connecting rod is fixedly connected to a connecting block, a mounting plate is horizontally arranged inside the device shell above the wafer, a third threaded rod is rotatably arranged inside the lower end of the mounting plate, the left side of the third threaded rod is connected to the output end of a motor, the right side of the third threaded rod is rotatably arranged in a movable sleeve, a fixed block is arranged on the side of the third threaded rod in threaded engagement, two groups of fixed seats are symmetrically installed on the fixed block, a telescopic column is installed on the fixed seat, a pressure sensor is installed at the lower end of the telescopic column, a pressure plate is installed at the lower end of the pressure sensor on the left side, and a pressure roller is installed at the lower end of the pressure sensor on the right side.

[0008] In some embodiments, a vacuum tube is installed at the upper left end of the device housing, a vacuum pump is installed on the vacuum tube, the right side of the vacuum tube is connected to the interior of the device housing, and a sealing valve is installed at the contact position between the vacuum tube and the device housing.

[0009] In some embodiments, the left and right sides of the mounting plate are connected and fixed to the mounting block, and the internal threaded engagement of the mounting block is provided with a first threaded rod, the first threaded rod rotates vertically on the inner wall of the device housing, and the upper end of the first threaded rod is connected to the output end of the motor.

[0010] In some embodiments, the interior of the connection block is threadedly engaged with the side surface of the second threaded rod, the second threaded rod is horizontally arranged on the inner wall of the device housing, and the second threaded rod includes a first threaded segment and a second threaded segment.

[0011] In some embodiments, the thread directions of the first thread segment and the second thread segment are opposite, the left side of the second threaded rod is connected to the motor, two groups of connecting blocks are symmetrically arranged on the second threaded rod, and the right side of the second threaded rod is rotatably arranged in a movable sleeve.

[0012] In some embodiments, a cabinet door is installed at the front end of the device housing, the cabinet door is sealed with the device housing, and an observation window and a control panel are installed on the cabinet door.

[0013] The beneficial effects of the utility model are:

[0014] By using sensitive pressure sensors and pressure plates and rollers made of flexible materials, the downward pressure on the wafer can be effectively controlled, thereby improving the quality of wafer bonding; the design of the device allows the motor and telescopic column to be operated through the control panel, achieving highly automated operation, reducing manual intervention and improving production efficiency; the device solves the bonding problem of high-warpage wafers by applying pressure in the center area and pulling out the gasket at the edge, ensuring the flatness of the wafer; through the coordinated use of a vacuum pump and an electromagnetic sealing valve, a vacuum environment can be created inside the device casing, which helps to improve the stability and quality of the bonding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a wafer bonding device proposed by the utility model;

[0016] Figure 2 This is a front view of a wafer bonding device proposed by the utility model;

[0017] Figure 3 This is an internal top view of a wafer bonding device proposed by the utility model;

[0018] Figure 4 This is a schematic diagram of the right inner wall structure of a wafer bonding device proposed by the utility model;

[0019] Figure 5 This is a bottom view of a mounting plate of a wafer bonding device proposed by the utility model.

[0020] In the figure: 1 is the device housing, 2 is the support table, 3 is the wafer, 4 is the connecting rod, 5 is the telescopic column, 6 is the pressure sensor, 7 is the pressure plate, 8 is the pressure roller, 9 is the mounting plate, 10 is the sealing valve, 11 is the vacuum pump, 12 is the vacuum tube, 13 is the gasket, 14 is the cabinet door, 15 is the observation window, 16 is the control panel, 17 is the motor, 18 is the first threaded rod, 19 is the mounting block, 20 is the second threaded rod, 21 is the first threaded segment, 22 is the second threaded segment, 23 is the connecting block, 24 is the third threaded rod, 25 is the fixing block, and 26 is the fixing seat. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] It should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the utility model.

[0023] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] Reference Figure 1 , 3 4. A wafer bonding device comprises a device housing 1, a wafer 3, a pressing plate 7 and a gasket 13. A support table 2 is fixedly installed at the central position of the lower end of the device housing 1. A wafer 3 is horizontally placed on the upper end of the support table 2. A gasket 13 is arranged between two groups of wafers 3. The gasket 13 is placed at the edge of the wafer 3. A connecting rod 4 is fixedly arranged on the side of the gasket 13 away from the wafer 3. The connecting rod 4 is arranged horizontally. The right side of the connecting rod 4 is fixedly connected to a connecting block 23. A mounting plate 9 is horizontally arranged inside the device housing 1 above the wafer 3. A third threaded rod 24 is rotatably arranged inside the lower end of the mounting plate 9. The left side of the third threaded rod 24 is connected to the output end of the motor 17. The right side of the third threaded rod 24 is rotatably arranged in a movable sleeve. The side thread engagement of the third threaded rod 24 is arranged A fixed block 25 is provided, on which two groups of fixed seats 26 are symmetrically installed, on which a telescopic column 5 is installed, a pressure sensor 6 is installed at the lower end of the telescopic column 5, a pressing plate 7 is installed at the lower end of the left pressure sensor 6, and a pressing roller 8 is installed at the lower end of the right pressure sensor 6. The edge of the surface to be bonded of the wafer 3 is padded with a gasket 13, and the pressing plate 7 applies pressure to the central area of ​​the wafer 3 for bonding, and the gasket 13 is pulled away from the surface to be bonded, so that the wafer 3 is diffused and bonded from the central area to the surrounding areas, and then the pressing roller 8 presses the wafer 3 again, which solves the problem of poor quality of the high warpage wafer bonding device. The pressing plate 7 and the pressing roller 8 are both made of flexible materials, and the pressure sensor 6 adopts a sensitive pressure sensor to effectively control the downward pressure of the pressing plate 7 and the pressing roller 8, and the surface of the gasket 13 is smooth.

[0025] When the embodiments of the present utility model are implemented, Figure 1 , 2 As shown, a vacuum tube 12 is installed at the upper left end of the device housing 1, and a vacuum pump 11 is installed on the vacuum tube 12. The right side of the vacuum tube 12 is connected to the interior of the device housing 1. A sealing valve 10 is installed at the contact position between the vacuum tube 12 and the device housing 1. The sealing valve 10 adopts an electromagnetic sealing valve, and the interior of the device housing 1 is evacuated by the vacuum pump 11.

[0026] When the embodiments of the present utility model are implemented, Figure 1 , 4 As shown in Figure 5, the left and right sides of the mounting plate 9 are connected and fixed to the mounting block 19, and the mounting block 19 is internally threadedly engaged with a first threaded rod 18, and the first threaded rod 18 is vertically rotated on the inner wall of the device housing 1, and the upper end of the first threaded rod 18 is connected to the output end of the motor 17. The inside of the connecting block 23 is threadedly engaged with the side of the second threaded rod 20, and the second threaded rod 20 is horizontally arranged on the inner wall of the device housing 1. The second threaded rod 20 includes a first threaded segment 21 and a second threaded segment 22. By rotating the second stud rod 20, the spacing between the two groups of connecting rods 4 is changed, thereby realizing the extraction operation of the gasket 13.

[0027] When the embodiments of the present utility model are implemented, Figure 1 , 2 As shown, the thread directions of the first thread segment 21 and the second thread segment 22 are opposite, the left side of the second threaded rod 20 is connected to the motor 17, two groups of connecting blocks 23 are symmetrically arranged on the second threaded rod 20, and the right side of the second threaded rod 20 is rotatably arranged in the movable sleeve, and a cabinet door 14 is installed at the front end of the device housing 1, and the cabinet door 14 is sealed with the device housing 1, and an observation window 15 and a control panel 16 are installed on the cabinet door 14. The pressing status of the wafer 3 can be connected in real time through the observation window 15, and the operation of each motor 17 and the telescopic column 5 can be controlled through the control panel 16 to improve the degree of automation of the device.

[0028] In this embodiment, the wafer 3 is placed horizontally on the support table 2, and the gasket 13 is placed at the edge of the wafer 3; pressure is applied to the central area of ​​the wafer 3 by the pressure plate 7 to start the bonding process; the gasket 13 is pulled away from the surface to be bonded, so that the wafer 3 is spread from the central area to the surrounding area for bonding; the pressure roller 8 further presses the wafer 3 to ensure the bonding of the entire wafer 3; a vacuum environment is created inside the device housing 1 by the vacuum pump 11 and the electromagnetic sealing valve to improve the bonding quality; the operation of the motor 17 and the telescopic column 5 is controlled by the control panel 16 to realize automated operation.

[0029] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer bonding device, comprising a device housing (1), a wafer (3), a pressing plate (7) and a gasket (13), characterized in that: A support platform (2) is fixedly installed at the central position of the lower end of the device housing (1); a wafer (3) is horizontally placed on the upper end of the support platform (2); a gasket (13) is arranged between the two groups of wafers (3); the gasket (13) is placed at the edge of the wafer (3); a connecting rod (4) is fixedly arranged on the side of the gasket (13) away from the wafer (3); the connecting rod (4) is arranged horizontally; the right side of the connecting rod (4) is fixedly connected to the connecting block (23); a mounting plate (9) is horizontally arranged above the wafer (3) inside the device housing (1); a third mounting plate (9) is rotatably arranged inside the lower end of the mounting plate (9). A threaded rod (24), the left side of the third threaded rod (24) is connected to the output end of the motor (17), the right side of the third threaded rod (24) is rotatably arranged in a movable sleeve, the side of the third threaded rod (24) is threadedly engaged with a fixing block (25), two groups of fixing seats (26) are symmetrically installed on the fixing block (25), a telescopic column (5) is installed on the fixing seat (26), a pressure sensor (6) is installed at the lower end of the telescopic column (5), a pressure plate (7) is installed at the lower end of the pressure sensor (6) on the left side, and a pressure roller (8) is installed at the lower end of the pressure sensor (6) on the right side.

2. The wafer bonding device according to claim 1, characterized in that: A vacuum tube (12) is installed at the upper left end of the device housing (1), a vacuum pump (11) is installed on the vacuum tube (12), the right side of the vacuum tube (12) is connected to the interior of the device housing (1), and a sealing valve (10) is installed at the contact position between the vacuum tube (12) and the device housing (1).

3. The wafer bonding device according to claim 1, characterized in that: The left and right sides of the mounting plate (9) are connected and fixed to a mounting block (19); a first threaded rod (18) is provided in an internal threaded engagement with the mounting block (19); the first threaded rod (18) is vertically rotated on the inner wall of the device housing (1); and the upper end of the first threaded rod (18) is connected to the output end of the motor (17).

4. The wafer bonding device according to claim 1, characterized in that: The interior of the connection block (23) is arranged to be threadedly engaged with the side surface of the second threaded rod (20); the second threaded rod (20) is horizontally arranged on the inner wall of the device housing (1); the second threaded rod (20) comprises a first threaded section (21) and a second threaded section (22).

5. The wafer bonding device according to claim 4, characterized in that: The thread directions of the first threaded section (21) and the second threaded section (22) are opposite, the left side of the second threaded rod (20) is connected to the motor (17), two groups of connecting blocks (23) are symmetrically arranged on the second threaded rod (20), and the right side of the second threaded rod (20) is rotatably arranged in a movable sleeve.

6. The wafer bonding device according to claim 1, characterized in that: A cabinet door (14) is installed at the front end of the device housing (1); the cabinet door (14) is sealed with the device housing (1); and an observation window (15) and a control panel (16) are installed on the cabinet door (14).

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