Manufacturing device for improving consistency of millimeter wave radar antenna

Abstract

The utility model provides a manufacturing device for improving the consistency of millimeter wave radar antennas, which relates to the technical field of printed circuit board production, and comprises a cushion platform and a processing plate layer, a chute is arranged in the middle of the top end of the cushion platform, a partition plate is clamped in the middle of the top end of the cushion platform, and clamping driving motor groups are arranged on two sides in the chute at the top of the cushion platform. According to the equipment, a manufacturing mode of the millimeter wave radar antenna array is provided, the copper thickness of the antenna position is controlled to 19-23 microns by reducing the electroplating copper thickness of the antenna position, the copper thickness range and the copper thickness are reduced, and when a negative film is etched, the thickness of the negative film is reduced, so that the thickness of the negative film is reduced. The controllability of the line width / R angle is improved, the qualified rate is increased, the whole equipment realizes that the antenna position is covered by a dry film at a target position and selective electroplating is carried out, the electroplating copper thickness is not increased in the area, and the equipment is based on the machining mode and moves in multiple directions.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board production, in particular to a manufacturing device for improving the consistency of millimeter wave radar antennas. Background Art

[0002] Printed circuit boards, also known as printed circuit boards, are important electronic components. In the automotive field, vehicle-mounted millimeter-wave radars are mainly divided into 24G and 77G. Among them, 24G millimeter-wave radars are mainly used for medium and short-range measurements, with relatively low technical barriers and costs. They are widely used in automotive blind spot monitoring, lane change assistance, etc., and are the mainstream millimeter-wave radar products on the market. 77G is the most important long-range millimeter-wave radar product on the market. Its detection distance can reach 150-250 meters, and its detection accuracy is 3-5 times that of 24G radars. However, its technical barriers and costs are higher than those of 24G millimeter-wave radars. It is currently mainly used in autonomous driving, forward collision warning, etc.

[0003] At present, this type of PCB millimeter-wave radar mainly uses antenna arrays for signal transmission and reception. The design and precise production of antenna arrays require a production tolerance of ±15um (including right angles, R angles, etc.). However, after PCB etching, the antenna array is prone to the antenna R angle not meeting customer requirements, resulting in product transmission delays or failures. In addition, during the processing steps of the circuit board, the circuit board cannot be automatically clamped and flipped. If the back side needs to be processed, it needs to be removed. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a manufacturing device for improving the consistency of millimeter wave radar antennas.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a manufacturing device for improving the consistency of millimeter-wave radar antennas, including a pad and a processing plate layer, a slide groove is opened in the middle of the top of the pad, a partition is clamped in the middle of the top of the pad, clamping drive motor groups are installed on both sides of the slide groove at the top of the pad, a moving block is connected to the external thread of the output end of the clamping drive motor group, the moving block and the top of the pad are slidingly connected, the top of the moving block is threadedly connected with a folded tube, the folded tube is L-shaped, a rotating motor group is installed at the end of the folded tube, and the top rectangular array of the processing plate layer has a membrane opening.

[0006] Preferably, the end of the rotating motor group is transmission-connected with a rotating shaft, a clamp is installed at the end of the rotating shaft, and one end of the clamp is connected to a clamp frame.

[0007] Preferably, the outer annular array of the clamp head has a clamp bolt, the back of the clamp frame is provided with a hole, and the hole on the back of the clamp frame is provided with a through hole, and the through hole and the clamp bolt are adapted to each other.

[0008] Preferably, a pressure sensor is implanted on the back side of the clamp frame, compression cylinder assemblies are installed on the top and bottom of the clamp frame, and clamp plates are connected to the ends of the compression cylinder assemblies.

[0009] Preferably, a movable driving member is installed on the back side of the pad, the output end of the movable driving member is externally threadedly connected to a transverse moving plate, and the top end of the transverse moving plate is threadedly connected to a support rod.

[0010] Preferably, the support rod is L-shaped, and the end of the support rod is threadedly connected to the coating frame.

[0011] Preferably, a translation driving member is installed at the bottom of the coating frame, and the external transmission of the output end of the translation driving member is connected to the coating controller, and coating point guns are installed on both sides of the bottom of the coating controller.

[0012] Beneficial Effects

[0013] In the utility model, before processing, the processing plate layer is clamped first, and the processing plate layer is placed in the middle position of the top of the pad, and then the clamping drive motor groups on both sides are used to control the movement of the moving blocks on both sides to the position of the processing plate layer. When the moving blocks move inward, the clamping frames installed on the sides will also move forward. When the inner walls of the clamping frames on both sides are in contact with the sides of the processing plate layer, the built-in pressure sensor will sense it and transmit a signal to the control end of the clamping drive motor group and the compression cylinder assembly through the built-in MCU. The compression cylinder assembly here includes a cylinder lifting controller, a cylinder body and a cylinder column. The clamping drive motor group will stop driving after receiving the signal. In this way, the clamping structure will not continue to move forward to prevent the clamping force from being too large. When the compression cylinder assembly receives the signal, it will control the cylinder column at the end to descend, and the upper and lower groups of cylinder columns will drive the clamping plate to clamp the processed plate layer. It should be noted that the hemispherical object on the surface of the clamping plate in the figure is also a pressure sensor. When the clamping force exceeds the limit value, a stop command will be transmitted to the compression cylinder assembly, and then the control end of the compression cylinder assembly will stop controlling the cylinder column to descend, so that the processed plate layer will be clamped. At the same time, the rotating motor group can drive the clamping frame to rotate, and the rotation of the clamping frame will drive the processed plate layer to rotate, so that the bottom can also be processed.

[0014] In the utility model, the device provides a method for manufacturing a millimeter wave radar antenna array. In the device, the copper thickness at the antenna position is controlled to be 19-23um by reducing the electroplated copper thickness at the antenna position. The extreme difference in copper thickness and the reduction in copper thickness improve the controllability of line width / R angle during negative film etching, thereby increasing the qualified rate. The entire device achieves the target position by using dry film to cover the antenna position with dry film for selective electroplating. The electroplated copper thickness is no longer increased in this area. The device is based on this processing method, and moves in multiple directions to accurately coat the corresponding position. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is the overall structure diagram of the utility model;

[0016] Figure 2 It is a rear view of the utility model;

[0017] Figure 3 It is a component structure diagram of the utility model;

[0018] Figure 4 This is a structural diagram of the clamping frame of the utility model;

[0019] Figure 5 This is a diagram of the internal structure of the clamp frame of the utility model;

[0020] Figure 6 This is a structural diagram of a coating frame of the utility model;

[0021] Figure 7 It is a schematic diagram of the antenna array of the utility model;

[0022] Figure 8 It is a schematic diagram of the dry film attachment position of the utility model.

[0023] Legend:

[0024] 1. Pad; 2. Partition; 3. Clamping drive motor unit; 4. Moving block; 5. Folding tube; 6. Rotating motor unit; 7. Rotating axis; 8. Clamping frame; 9. Coating rack; 10. Film mouth; 11. Compression cylinder assembly; 12. Processing plate layer; 13. Support rod; 14. Moving drive unit; 15. Transverse plate; 16. Clamping bolt; 17. Clamping head; 18. Perforation; 19. Translational drive unit; 20. Coating controller; 21. Coating point gun; 22. Pressure sensor; 23. Clamp. DETAILED DESCRIPTION

[0025] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments and drawings, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the protection scope of the present invention.

[0026] The specific embodiments of the present utility model are described below in conjunction with the accompanying drawings. Specific embodiment one:

[0028] Reference Figure 1-8 A manufacturing device for improving the consistency of millimeter-wave radar antennas includes a pad 1 and a processing plate layer 12. A slide groove is opened in the middle of the top of the pad 1, and a partition 2 is clamped in the middle of the top of the pad 1. Clamping drive motor groups 3 are installed on both sides of the slide groove at the top of the pad 1. The external thread of the output end of the clamping drive motor group 3 is connected with a moving block 4. The moving block 4 is slidably connected to the top of the pad 1. The top of the moving block 4 is threadedly connected with a folding tube 5. The shape of the folding tube 5 is L-shaped. A rotating motor group 6 is installed at the end of the folding tube 5. The top rectangular array of the processing plate layer 12 has a membrane opening 10.

[0029] The device is mainly used to clamp and coat the processed plate layer 12, so as to facilitate electroplating at the position requiring electroplating.

[0030] The end of the rotating motor group 6 is drivingly connected to the rotating shaft 7 , and a clamping head 17 is installed at the end of the rotating shaft 7 , and one end of the clamping head 17 is connected to the clamping frame 8 .

[0031] The outer annular array of the clamp head 17 has a clamping bolt 16, the back of the clamp frame 8 is provided with a hole, and the hole on the back of the clamp frame 8 is provided with a through hole 18, and the through hole 18 and the clamping bolt 16 are adapted to each other.

[0032] A pressure sensor 22 is implanted on the back of the clamp frame 8 , and compression cylinder assemblies 11 are installed on the top and bottom of the clamp frame 8 , and clamp plates 23 are connected to the ends of the compression cylinder assemblies 11 .

[0033] Before processing, the processing plate layer 12 is clamped first, and the processing plate layer 12 is placed in the middle position of the top of the pad 1, and then the clamping drive motor groups 3 on both sides are used to control the movement of the moving blocks 4 on both sides to the position of the processing plate layer 12. It should be noted that the clamping drive motor group 3 here includes a motor body and an output end, and is a complete electric screw structure. When the moving block 4 moves inward, the clamping frame 8 installed on the side will also move forward. When the inner walls of the clamping frames 8 on both sides are in contact with the sides of the processing plate layer 12, the built-in pressure sensor 22 will sense The built-in MCU transmits a signal to the control end of the clamping drive motor group 3 and the compression cylinder assembly 11. The compression cylinder assembly 11 includes a cylinder lifting controller, a cylinder body and a cylinder column. The clamping drive motor group 3 will stop driving after receiving the signal, so that the clamping structure will not continue to move forward to prevent the clamping force from being too large. When the compression cylinder assembly 11 receives the signal, it will control the cylinder column at the end to descend, and the upper and lower groups of cylinder columns will drive the clamping plate 23 to clamp the processing plate layer 12. It should be noted that Figure 5 The hemispherical object on the surface of the middle clamping plate 23 is also a pressure sensor 22. When the clamping force exceeds the limit value, a stop command will be transmitted to the compression cylinder assembly 11, and then the control end of the compression cylinder assembly 11 will stop controlling the cylinder column to descend, so that the processing plate layer 12 will be clamped. At the same time, the rotating motor group 6 can drive the clamping frame 8 to rotate, and the rotation of the clamping frame 8 will drive the processing plate layer 12 to rotate, so that the bottom can also be processed. Specific embodiment 2:

[0035] Reference Figure 1-8 A moving driving member 14 is installed on the back of the pad 1, and the output end of the moving driving member 14 is externally threadedly connected to a transverse plate 15, and the top of the transverse plate 15 is threadedly connected to a support rod 13.

[0036] The support rod 13 is L-shaped, and the end of the support rod 13 is threadedly connected to the coating frame 9 .

[0037] A translation drive 19 is installed at the bottom of the coating frame 9 , and the external transmission of the output end of the translation drive 19 is connected to a coating controller 20 . Coating point guns 21 are installed on both sides of the bottom of the coating controller 20 .

[0038] The structure in the coating frame 9 is used to attach a film to the processed plate layer 12. The processing structure in the coating frame 9 can be moved indirectly forward, backward, left and right, and the surface of the processed plate layer 12 can be processed over a large range. First, the moving drive member 14 is a complete screw structure that controls the movement of the transverse plate 15. The transverse plate 15 drives the coating frame 9 to move left and right when moving. The translation drive member 19 in the coating frame 9 controls the coating controller 20 to slide forward and backward. The coating controller 20 has an independent processing chip that receives the position information that needs to be coated, and then comes to the top of the antenna through multiple drives, and transmits a signal to the coating point gun 21 at the position that needs to be coated, and then the coating point gun 21 will coat the bottom position. The coating here is mainly a dry film, which is a polymer material. It can produce a polymerization reaction after being irradiated with ultraviolet rays to form a stable substance attached to the board surface. The coating point gun 21 here is an existing device and will not be described in detail here. Multiple groups of coating point guns 21 are installed on both sides of the bottom of the coating controller 20, which can coat the position next to the antenna that does not require electroplating.

[0039] In this device, the copper thickness at the antenna position is controlled to 19-23um by reducing the electroplated copper thickness at the antenna position. The extreme difference and copper thickness are reduced. During negative film etching, the controllability of the line width / R angle is improved, thereby increasing the pass rate.

[0040] at the same time Figure 8 Small and medium frame areas: Use dry film to cover the antenna position with dry film and perform selective electroplating. The thickness of electroplated copper will not be increased in this area. This equipment is based on this processing method. It moves in multiple directions and accurately coats the corresponding positions.

[0041] In summary:

[0042] 1. Before processing, first clamp the processing plate layer 12, place the processing plate layer 12 in the middle of the top of the pad 1, and then control the moving blocks 4 on both sides to move to the position of the processing plate layer 12 through the clamping drive motor group 3 on both sides. It should be noted that the clamping drive motor group 3 here includes the motor body and the output end, which is a complete electric screw structure. When the moving block 4 moves inward, the clamping frame 8 installed on the side will also move forward. When the inner walls of the clamping frames 8 on both sides are in contact with the sides of the processing plate layer 12, the built-in pressure sensor 22 will The clamping drive motor group 3 will stop driving after receiving the signal, so that the clamping structure will not continue to move forward to prevent the clamping force from being too large. When the compression cylinder assembly 11 receives the signal, it will control the cylinder column at the end to descend, and the upper and lower groups of cylinder columns will drive the clamping plate 23 to clamp the processing plate layer 12. It should be noted that Figure 5The hemispherical object on the surface of the middle clamping plate 23 is also a pressure sensor 22. When the clamping force exceeds the limit value, a stop command will be transmitted to the compression cylinder assembly 11, and then the control end of the compression cylinder assembly 11 will stop controlling the cylinder column to descend, so that the processing plate layer 12 will be clamped. At the same time, the rotating motor group 6 can drive the clamping frame 8 to rotate, and the rotation of the clamping frame 8 will drive the processing plate layer 12 to rotate, so that the bottom can also be processed.

[0043] 2. In this equipment, the copper thickness at the antenna position is controlled to 19-23um by reducing the electroplated copper thickness at the antenna position. The extreme difference and copper thickness are reduced. During negative film etching, the controllability of the line width / R angle is improved, thereby increasing the qualified rate.

[0044] at the same time Figure 8 Small and medium frame areas: Use dry film to cover the antenna position with dry film and perform selective electroplating. The thickness of electroplated copper will not be increased in this area. This equipment is based on this processing method. It moves in multiple directions and accurately coats the corresponding positions.

[0045] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0046] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A manufacturing device for improving the consistency of a millimeter wave radar antenna, comprising a backing platform (1) and a processing plate layer (12), characterized in that: A slide groove is provided in the middle of the top of the pad (1), and a partition (2) is clamped in the middle of the top of the pad (1). A clamping drive motor group (3) is installed on both sides of the slide groove at the top of the pad (1). The external thread connection of the output end of the clamping drive motor group (3) is connected with a moving block (4). The moving block (4) is slidably connected to the top of the pad (1). The top of the moving block (4) is threadedly connected with a folding tube (5). The folding tube (5) is L-shaped. A rotating motor group (6) is installed at the end of the folding tube (5). The top rectangular array of the processing plate layer (12) has a membrane opening (10).

2. The manufacturing device for improving the consistency of millimeter wave radar antenna according to claim 1, characterized in that: The end of the rotating motor group (6) is drivingly connected to a rotating shaft (7), a clamp (17) is installed at the end of the rotating shaft (7), and one end of the clamp (17) is connected to a clamp frame (8).

3. The manufacturing device for improving the consistency of millimeter wave radar antenna according to claim 2, characterized in that: The outer annular array of the clamp head (17) has a clamp bolt (16), the back of the clamp frame (8) has a hole, and the hole on the back of the clamp frame (8) has a through hole (18), and the through hole (18) and the clamp bolt (16) are adapted to each other.

4. The manufacturing device for improving the consistency of millimeter wave radar antenna according to claim 3, characterized in that: A pressure sensor (22) is implanted on the back of the clamp frame (8), a compression cylinder assembly (11) is installed on the top and bottom of the clamp frame (8), and a clamping plate (23) is connected to the end of the compression cylinder assembly (11).

5. The manufacturing device for improving the consistency of millimeter wave radar antenna according to claim 1, characterized in that: A movable driving member (14) is installed on the back of the pad (1), and the output end of the movable driving member (14) is externally threadedly connected to a transverse plate (15), and the top end of the transverse plate (15) is threadedly connected to a support rod (13).

6. The manufacturing device for improving the consistency of millimeter wave radar antenna according to claim 5, characterized in that: The support rod (13) is L-shaped, and the end of the support rod (13) is threadedly connected to the coating frame (9).

7. The manufacturing device for improving the consistency of millimeter wave radar antenna according to claim 6, characterized in that: A translation drive member (19) is installed at the bottom of the coating frame (9), and the external transmission of the output end of the translation drive member (19) is connected to a coating controller (20), and coating point guns (21) are installed on both sides of the bottom of the coating controller (20).

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