Heat dissipation device and case

Abstract

The utility model provides a heat dissipation device and a case, and relates to the technical field of computers. The heat dissipation device comprises a first wind scooper, the first wind scooper is provided with a first ventilation cavity extending in the first direction, a heating piece is contained in the first ventilation cavity, the first wind scooper is provided with a heat dissipation face, and the heat dissipation face is provided with a plurality of air outlet holes communicated with the first ventilation cavity; the cooling fan is arranged at the upstream position of the first wind scooper in the first direction, and an air blowing opening of the cooling fan faces the air outlet hole in the first direction and is located in the side, opposite to the first ventilation cavity, of the cooling face. And the air flow blown out of the air blowing opening flows in the first direction and is communicated with the air flow in the first air guide cover through the air outlet hole. The heat dissipation device is not limited by ventilation conditions and can effectively dissipate heat for the OCP card.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a heat dissipation device and a chassis. Background Art

[0002] With the advancement of technology, the power consumption of OCP cards is getting higher and higher. At present, some OCP network cards in servers use a passive heat dissipation design, which has poor heat dissipation performance. After the cooling air discharged by the fan passes through the memory channel and the CPU radiator, the wind pressure and air volume are significantly attenuated, which makes it difficult to effectively dissipate the heat generated by the OCP card. Due to insufficient heat dissipation, OCP cards often run at higher temperatures, which greatly increases the risk of failure and may also cause system crashes.

[0003] When facing the heat dissipation problem of OCP network cards, technicians increase the total area of ​​the heat sink to accelerate the transfer of heat to the external environment by utilizing a larger contact area. However, the effect of this measure may not be obvious when the ventilation conditions inside the server are not ideal or there is a lack of effective airflow guidance mechanism, and the improvement of heat dissipation efficiency is limited.

[0004] Therefore, how to provide a heat dissipation device and a chassis that can effectively dissipate heat for the OCP card under undesirable ventilation conditions is a problem that urgently needs to be solved. Utility Model Content

[0005] The purpose of the embodiments of the present application is to provide a heat dissipation device and a chassis to solve the problem that the effect of increasing the total area of ​​the heat sink is not ideal in the ventilation conditions inside the server, and the improvement of the heat dissipation efficiency is limited.

[0006] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions:

[0007] A first aspect of the present application provides a heat dissipation device, which includes: a first air guide cover, the first air guide cover is provided with a first ventilation cavity extending along a first direction, the first ventilation cavity accommodates a heat generating element, the first air guide cover is provided with a heat dissipation surface, the heat dissipation surface is provided with a plurality of air outlets connected with the first ventilation cavity; and a heat dissipation fan, the heat dissipation fan is arranged at an upstream position of the first air guide cover along the first direction, the air outlet of the heat dissipation fan is directed toward the air outlet along the first direction and the air outlet is located on the side of the heat dissipation surface opposite to the first ventilation cavity, so that the airflow blown out of the air outlet flows along the first direction and forms conduction with the airflow inside the first air guide cover through the air outlet.

[0008] In some embodiments, the heat dissipation device also includes: a second air guide cover, which is arranged adjacent to the first air guide cover upstream along the first direction, the second air guide cover is provided with a second ventilation cavity extending along the first direction, the second ventilation cavity has a second air inlet and a second air outlet corresponding to the first air inlet of the first air guide cover; wherein, the heat dissipation fan is arranged on the outer wall of the second air guide cover away from the second ventilation cavity, the air outlet of the heat dissipation fan faces the first air guide cover and the air outlet is located on the side of the heat dissipation surface opposite to the first ventilation cavity, so that the airflow blown out of the air outlet flows along the first direction and is located on the side of the heat dissipation surface opposite to the first ventilation cavity.

[0009] In some embodiments, the heat dissipation device also includes: a heat dissipation component, the heat dissipation component includes: a heat sink, the heat sink is arranged at a mounting port corresponding to the heat dissipation surface and the heat generating element, the heat dissipation portion of the heat sink corresponds to the heat generating element and the heat dissipation portion abuts against the heat generating element, the heat dissipation portion is provided with a mesh heat dissipation hole, and a heat conductive element, the two ends of the heat conductive element respectively correspond to the heat dissipation portion and the blowing port of the heat dissipation fan and are connected to the heat dissipation portion, so as to conduct the heat of the heat dissipation portion to the blowing port.

[0010] In some embodiments, the heat dissipation portion protrudes from the heat dissipation surface to which the heat sink is connected along the second direction and abuts against the heat generating element. The heat sink is elastically fixed to the heat dissipation surface of the first air guide cover by spring bolts so that the heat sink can move relative to the heat dissipation surface along the second direction under the extrusion of the heat generating element; the second direction is perpendicular to the first direction.

[0011] In some embodiments, a surface of the heat dissipation portion close to the first ventilation cavity is an arc-shaped surface.

[0012] In some embodiments, the heat dissipation device further includes: thermal conductive mud, which is arranged in a receiving groove on the side of the heat dissipation part away from the first ventilation cavity; and a cover plate, which is adapted to and fixed in the receiving groove to confine the thermal conductive mud between the heat dissipation part and the cover plate.

[0013] In some embodiments, the bottom side height of the air outlet is the same as the height of the heat dissipation surface along the second direction, so that the air flow blown out of the air outlet flows along the first direction and sticks to the side of the heat dissipation surface opposite to the first ventilation cavity; the second direction is perpendicular to the first direction.

[0014] In some embodiments, a gradually expanding section is provided at the second air inlet of the second ventilation cavity, and the cavity diameter of the gradually expanding section gradually increases in the direction from the second air outlet to the second air inlet.

[0015] In some embodiments, the second air outlet is adapted to the first air inlet and the second air outlet is connected to the first air inlet.

[0016] A second aspect of an embodiment of the present application provides a chassis, including: the heat dissipation device as described above.

[0017] Compared with the prior art, the present application provides a heat dissipation device and a chassis, the heat dissipation device includes a first air duct and a heat dissipation fan, the heat dissipation fan is arranged at the upstream position of the first air duct along the first direction, and the heat dissipation fan blows air to the heat dissipation surface of the first air duct, so that the air flow velocity on the side of the heat dissipation surface of the first air duct opposite to the first ventilation cavity becomes faster, and the air pressure is reduced, thereby causing a pressure difference between the side of the heat dissipation surface of the first air duct close to the first ventilation cavity and the side of the heat dissipation surface away from the first ventilation cavity, and the pressure on the side of the heat dissipation surface close to the first ventilation cavity is greater than the pressure on the side of the heat dissipation surface away from the first ventilation cavity. The heat dissipation surface of the first air duct is provided with a plurality of air outlets connected to the first ventilation cavity. Due to the existence of the air pressure difference, a Bernoulli effect is formed as a whole, and the air flow in the first ventilation cavity flows from the air outlet to the side of the heat dissipation surface away from the first ventilation cavity, thereby taking away the heat of the heating element in the first ventilation cavity, and achieving the heat dissipation effect. In addition, the heat dissipation device will not be restricted by ventilation conditions and can effectively dissipate heat for the OCP card. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0019] Figure 1 A schematic diagram of the side structure of a heat dissipation device provided by the present application is shown schematically;

[0020] Figure 2 A schematic diagram of a three-dimensional structure of a heat dissipation device provided by the present application is schematically shown;

[0021] Figure 3 A partial structural diagram of a heat dissipation device provided in the present application is schematically shown.

[0022] Description of Figure Numbers:

[0023] 1. First air guide cover; 11. First ventilation cavity; 111. First air inlet; 12. Heat dissipation surface; 121. Air outlet; 2. Second air guide cover; 21. Second ventilation cavity; 211. Second air inlet; 212. Second air outlet; 22. Gradual expansion section; 3. Heat generating element; 4. Cooling fan; 41. Air outlet; 5. Cooling assembly; 51. Heat sink; 511. Heat dissipation part; 5111. Cooling hole; 52. Heat conducting element; 512. Receiving groove; 6. Spring bolt; 7. Thermal mud; 8. Cover plate; A. First direction; B. Second direction. DETAILED DESCRIPTION

[0024] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0025] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0026] The internal space of the server is small, the positions between the various structures are relatively compact and dense, and the ventilation conditions are not ideal. The heat dissipation effect of the heat dissipation method of increasing the total area of ​​the heat sink 51 to improve the heat dissipation efficiency is not obvious.

[0027] Embodiment 1

[0028] Reference Figure 1 -Attached Figure 3 , Embodiment 1 of the present invention proposes a heat dissipation device, which includes: a first air guide cover 1, the first air guide cover 1 is provided with a first ventilation cavity 11 extending along a first direction A, the first ventilation cavity 11 accommodates a heating element 3, the first air guide cover 1 is provided with a heat dissipation surface 12, the heat dissipation surface 12 is provided with a plurality of air outlet holes 121 connected with the first ventilation cavity 11; and a heat dissipation fan 4, the heat dissipation fan 4 is arranged at an upstream position of the first air guide cover 1 along the first direction A, the air outlet 41 of the heat dissipation fan 4 is directed toward the air outlet holes 121 along the first direction A, and the air outlet 41 is located on the side of the heat dissipation surface 12 opposite to the first ventilation cavity 11, so that the wind flow blown out by the air outlet 41 flows along the first direction A and is connected with the air flow inside the first air guide cover 1 through the air outlet holes 121.

[0029] Specifically, Figure 1-Figure 2As shown, the size of the first air guide cover 1 and the size of the first ventilation cavity 11 can be set according to the size of the heating element 3, and the shape of the first air guide cover 1 can be any shape, such as: a rectangular parallelepiped, a cube or a cylinder. The first air guide cover 1 is provided with a heat dissipation surface 12, and the heat dissipation surface 12 can be located on any side of the first air guide cover 1. The specific position of the heat dissipation surface 12 and the size of the heat dissipation surface 12 are not specifically limited here, and the number of the heat dissipation surface 12 can be one or more. The heat dissipation surface 12 is provided with a plurality of air outlet holes 121 connected to the first ventilation cavity 11, and the plurality of air outlet holes 121 are spaced and evenly distributed on the heat dissipation surface 12. The plurality of ventilation holes can also be distributed on the heat dissipation surface 12 in a non-uniformly spaced manner. The shape of the air outlet hole 121 can be any shape, such as: a triangle, a rectangle or a polygon, etc., and the size of the air outlet hole 121 can be set according to actual needs. The heat dissipation fan 4 can be specifically a centrifugal fan. The type of the heat dissipation fan 4 and the power of the heat dissipation fan 4 are not specifically limited here, and can be selected according to actual needs. When the cooling fan 4 is a centrifugal fan, the air inlet of the centrifugal fan faces away from the cooling surface 12, and the air inlet of the centrifugal fan absorbs the surrounding air to accelerate the flow of air upstream of the first air guide 1 along the first direction A. The cooling fan 4 is located upstream of the first air guide 1 along the first direction A, and the air outlet 41 of the cooling fan 4 faces the air outlet 121, and the air outlet 41 is located on the side opposite to the cooling surface 12 and the first ventilation cavity 11. The spacing between the air outlet 41 and the first air guide 1 along the first direction A, the spacing between the air outlet 41 and the cooling surface 12, and the size of the air outlet 41 can be set according to actual needs. The air outlet 41 of the cooling fan 4 can be provided with fins to evenly disperse the wind. When the heat dissipation speed needs to be increased, the air volume of the heat dissipation fan 4 is increased to speed up the flow of air on the side of the heat dissipation surface 12 away from the first ventilation cavity 11, thereby increasing the air pressure difference and causing the air flow in the first ventilation cavity 11 to be continuously squeezed from the air outlet 121 to the side of the heat dissipation surface 12 away from the first ventilation cavity 11, thereby taking away the heat of the heating element 3.

[0030] The present application provides a heat dissipation device and a chassis, the heat dissipation device comprising a first air guide cover 1 and a heat dissipation fan 4, the heat dissipation fan 4 is arranged at an upstream position of the first air guide cover 1 along a first direction A, and the heat dissipation fan 4 blows air to the heat dissipation surface 12 of the first air guide cover 1, so that the airflow velocity on the side of the heat dissipation surface 12 of the first air guide cover 1 opposite to the first ventilation cavity 11 becomes faster and the air pressure is reduced, thereby causing a pressure difference between the side of the heat dissipation surface 12 of the first air guide cover 1 close to the first ventilation cavity 11 and the side of the heat dissipation surface 12 away from the first ventilation cavity 11, and the pressure on the side of the heat dissipation surface 12 close to the first ventilation cavity 11 is greater than the pressure on the side of the heat dissipation surface 12 away from the first ventilation cavity 11. The heat dissipation surface 12 of the first air guide cover 1 is provided with a plurality of air outlets 121 connected to the first ventilation cavity 11. Due to the existence of the air pressure difference, the airflow in the first ventilation cavity 11 flows from the air outlets 121 to the side of the heat dissipation surface 12 away from the first ventilation cavity 11, thereby taking away the heat of the heating element 3 in the first ventilation cavity 11, and achieving the heat dissipation effect. In addition, the heat dissipation device will not be restricted by ventilation conditions and can effectively dissipate heat for the OCP card.

[0031] In some embodiments, the heat dissipation device also includes: a second air guide cover 2, which is arranged adjacent to the upstream of the first air guide cover 1 along the first direction A, the second air guide cover 2 is provided with a second ventilation cavity 21 extending along the first direction A, the second ventilation cavity 21 has a second air inlet 211 and a second air outlet 212 corresponding to the first air inlet 111 of the first air guide cover 1; wherein, the heat dissipation fan 4 is arranged on the outer wall of the second air guide cover 2 away from the second ventilation cavity 21, the air outlet 41 of the heat dissipation fan 4 faces the first air guide cover 1 and the air outlet 41 is located on the side of the heat dissipation surface 12 opposite to the first ventilation cavity 11, so that the wind flow blown out by the air outlet 41 flows along the first direction A and is located on the side of the heat dissipation surface 12 opposite to the first ventilation cavity 11.

[0032] Specifically, Figure 1-Figure 2As shown, the shape of the second air duct 2 and the shape of the second ventilation cavity 21 can be set according to actual needs, such as: a rectangular parallelepiped, a cube or a cylinder. The size of the second air duct 2 and the size of the second air inlet 211 of the second ventilation cavity 21 can be selected according to actual needs, and no specific limitation is made here. The second air outlet 212 corresponds to the first air inlet 111 of the first air duct 1, and the size of the second air outlet 212 can be larger than the first air inlet 111 or equal to the first air inlet 111 or smaller than the first air inlet 111. The second air outlet 212 and the first air inlet 111 can be spaced apart along the first direction A, and the second air outlet 212 can also be attached to the first air inlet 111 without spacing. The heat dissipation fan 4 is arranged on the outer wall of the second air duct 2 away from the second ventilation cavity 21. The specific position of the heat dissipation fan 4 can be set at one end of the outer wall of the second ventilation cavity 21 close to the first air duct 1, and can also be set at one end of the outer wall away from the first air duct 1. The air outlet 41 of the heat dissipation fan 4 faces the first air guide cover 1, and the air outlet 41 is located on the side of the heat dissipation surface 12 opposite to the first ventilation cavity 11, so that the airflow blown out of the air outlet 41 flows along the first direction A and is located on the side of the heat dissipation surface 12 opposite to the first ventilation cavity 11. When the heat dissipation fan 4 is running, the airflow it generates is first captured by the second air guide cover 2 and concentrated into the second ventilation cavity 21. The second ventilation cavity 21 plays the role of converging and guiding the airflow, ensuring that the airflow flows more orderly and concentratedly, rather than spreading disorderly around the fan, thereby reducing airflow turbulence.

[0033] In some embodiments, the heat dissipation device also includes: a heat dissipation component 5, the heat dissipation component 5 includes: a heat sink 51, the heat sink 51 is arranged at the installation port corresponding to the heat dissipation surface 12 and the heating element 3, the heat dissipation portion 511 of the heat sink 51 corresponds to the heating element 3 and the heat dissipation portion 511 abuts against the heating element 3, the heat dissipation portion 511 is provided with a mesh heat dissipation hole 5111, and a heat conductive member 52, the two ends of the heat conductive member 52 respectively correspond to the heat dissipation portion 511 and the blowing port 41 of the cooling fan 4 and are connected to the heat dissipation portion 511, for conducting the heat of the heat dissipation portion 511 to the blowing port 41.

[0034] Specifically, Figure 1As shown, the size of the heat sink 51 can be set according to actual needs. In order to improve the heat dissipation efficiency, the heat dissipation portion 511 of the heat sink 51 can be adapted to the size of the heat dissipation portion of the heat generating element 3 as much as possible, and the shape of the heat dissipation portion 511 can be adapted to the shape of the heat dissipation portion as much as possible. The heat sink 51 can be installed on the heat dissipation surface 12 through a bolt connector or the heat sink 51 can be interference fit with the mounting opening of the heat dissipation surface 12. In order to improve the heat dissipation efficiency, the heat dissipation portion 511 abuts against the heat dissipation portion of the heat generating element 3, and the mesh heat dissipation holes 5111 provided on the heat dissipation portion 5111 can accelerate the heat dissipation to the surroundings. The size and shape of the heat dissipation holes 5111 are not specifically limited here, and can be set according to actual needs, such as circular holes, square holes or triangular holes. In order to further accelerate the heat dissipation, a heat conductor 52 is further provided. The two ends of the heat conductor 52 respectively correspond to the heat dissipation part 511 and the air outlet of the heat dissipation fan 4 and the heat conductor 52 is connected to the heat dissipation part 511. The heat conductor 52 can be connected to the blowing port 41 or can be spaced apart from the blowing port 41. The heat conductor 52 can specifically be a copper tube, a copper bar, etc. The number of heat conductors 52 can be one or more. The specific shape and specific material of the heat conductor 52 are not limited here, as long as the heat of the heat dissipation part 511 can be conducted to the blowing port 41.

[0035] In some embodiments, the heat dissipation portion 511 protrudes from the heat dissipation surface 12 to which the heat sink 51 is connected along the second direction B and abuts against the heat generating element 3. The heat sink 51 is elastically fixed to the heat dissipation surface 12 of the first air guide cover 1 by a spring bolt 6, so that the heat sink 51 can move relative to the heat dissipation surface 12 along the second direction B under the extrusion of the heat generating element 3; the second direction B is perpendicular to the first direction A.

[0036] Specifically, Figure 3 As shown, the heat dissipation portion 511 protrudes from the heat dissipation surface 12 to which the heat sink 51 is connected along the second direction B, and the distance of the heat dissipation portion 511 protruding from the heat dissipation surface 12 along the second direction B can be set in combination with the size of the first air guide cover 1 and the heating element 3. The heat sink 51 is elastically fixed to the heat dissipation surface 12 of the first air guide cover 1 by the spring bolt 6, so that the heat sink 51 can move relative to the heat dissipation surface 12 along the second direction B under the extrusion of the heating element 3. When the heating element 3 is placed in the first ventilation cavity 11, the heating portion of the heating element 3 squeezes the heat dissipation portion 511 along the second direction B, so that the heat dissipation portion 511 moves relative to the heat dissipation surface 12 along the second direction B to the side away from the first ventilation cavity 11, and the heat dissipation portion 511 abuts against the heating element 3. The above structural design can make the heat sink 51 adapt to heating elements 3 of different sizes, thereby improving the adaptability of the device.

[0037] In some embodiments, a surface of the heat dissipation portion 511 close to the first ventilation cavity 11 is an arc-shaped surface.

[0038] Specifically, Figure 3As shown, in order to prevent the protruding heat dissipation portion 511 from affecting the flow of air in the first ventilation cavity 11, a side of the heat dissipation portion 511 close to the first ventilation cavity 11 is set to an arc-shaped surface. Such an arc-shaped design helps the airflow to transition smoothly when passing through the heat dissipation portion 511, reduces airflow resistance and the formation of vortices, thereby avoiding the adverse effects of the edge of the protruding heat dissipation portion 511 on the flow of air in the first ventilation cavity 11.

[0039] In some embodiments, the heat dissipation device also includes: thermal conductive mud 7, which is arranged in the receiving groove 512 on the side of the heat dissipation part 511 away from the first ventilation cavity 11; a cover plate 8, which is adapted to the receiving groove 512 and fixed in the receiving groove 512 to confine the thermal conductive mud 7 between the heat dissipation part 511 and the cover plate 8.

[0040] Specifically, Figure 1 As shown, in order to further improve the heat dissipation efficiency, a receiving groove 512 is provided on the side of the heat dissipation part 511 away from the first ventilation cavity 11, and the receiving groove 512 is filled with thermal mud 7. The thermal mud 7 is a soft material with high thermal conductivity, which can fully fill the tiny gap between the heat sink 51 and the heating element 3, and is in close contact with the heating element through the heat dissipation hole 5111. This design increases the actual contact area between the heat sink 51 and the heating element 3, thereby greatly improving the efficiency of heat energy transfer. The size and shape of the cover plate 8 are adapted to the size and shape of the receiving groove 512. In order to facilitate the placement of the cover plate 8, a hand-held component is provided on the side of the cover plate 8 away from the receiving groove 512, which includes a groove, and a convex plate penetrating the groove is provided in the center of the groove for holding the cover plate 8. Among them, the shape of the groove can be set according to actual needs, such as: round, square, etc. Such a hand-held component does not take up extra space and saves space.

[0041] In some embodiments, the bottom side height of the air outlet 41 is the same as the height of the heat dissipation surface 12 along the second direction B, so that the air flow blown out of the air outlet 41 flows along the first direction A and sticks to the side of the heat dissipation surface 12 opposite to the first ventilation cavity 11; the second direction B is perpendicular to the first direction A.

[0042] Specifically, Figure 1As shown, in order to increase the pressure difference on both sides of the heat dissipation surface 12 and make the airflow in the first ventilation cavity 11 flow out from the air outlet 121 more easily, the height of the bottom side of the air outlet 41 and the height of the heat dissipation surface 12 along the second direction B are set to the same height, so that the airflow blown out of the air outlet 41 flows along the first direction A and adheres to the side of the heat dissipation surface 12 opposite to the first ventilation cavity 11. Such a design ensures that the airflow blown out from the air outlet 41 can flow smoothly along the first direction A and adhere to the side of the heat dissipation surface 12 opposite to the first ventilation cavity 11. This airflow path design increases the pressure difference on both sides of the heat dissipation surface 12, making it easier for the hot airflow in the first ventilation cavity 11 to be drawn out and discharged through the air outlet, thereby improving the heat dissipation efficiency and ensuring the effective circulation of the airflow and the rapid dissipation of heat.

[0043] In some embodiments, a gradually expanding section 22 is provided at the second air inlet 211 of the second ventilation cavity 21 , and a cavity diameter of the gradually expanding section 22 gradually increases in a direction from the second air outlet 212 to the second air inlet 211 .

[0044] Specifically, Figure 1-Figure 2 As shown, in order to enable the airflow upstream of the first air guide cover 1 to more easily enter and converge into the second ventilation cavity 21 of the second air guide cover 2 when the cooling fan 4 is running, a gradually expanding section 22 is provided at the second air inlet 211 of the second ventilation cavity 21, and the cavity diameter of the gradually expanding section 22 gradually increases along the second air outlet 212 toward the second air inlet 211, and the length of the gradually expanding section 22 along the first direction A can be set according to actual needs.

[0045] In some embodiments, the second air outlet 212 is adapted to the first air inlet 111 and the second air outlet 212 is connected to the first air inlet 111 .

[0046] Specifically, Figure 2 As shown, in order to enable the airflow in the second ventilation cavity 21 to flow into the first ventilation cavity 11 along the first direction A, the second air outlet 212 is connected to the first air inlet 111 to prevent the airflow from flowing out from the gap between the second air outlet 212 and the first air inlet 111, and also prevent the turbulent airflow from appearing near the gap between the second air outlet 212 and the first air inlet 111. The second air outlet 212 and the first air inlet 111 can be connected by plugging or by bolt connectors to form a closed airflow channel. Such a design maximizes the utilization efficiency of the airflow, improves the performance of the overall heat dissipation device, ensures the continuity and directionality of the airflow, and further optimizes the heat dissipation effect.

[0047] Embodiment 2

[0048] A second aspect of an embodiment of the present application provides a chassis, including: the heat dissipation device as described above.

[0049] The second aspect of the embodiment of the present application provides a chassis, including the heat dissipation device described above, the heat dissipation device including a first air guide cover 1 and a heat dissipation fan 4, the heat dissipation fan 4 is arranged at an upstream position of the first air guide cover 1 along the first direction A, and the heat dissipation fan 4 blows air to the heat dissipation surface 12 of the first air guide cover 1, so that the airflow velocity on the side of the heat dissipation surface 12 of the first air guide cover 1 opposite to the first ventilation cavity 11 becomes faster and the air pressure is reduced, thereby causing a pressure difference between the side of the heat dissipation surface 12 of the first air guide cover 1 close to the first ventilation cavity 11 and the side of the heat dissipation surface 12 away from the first ventilation cavity 11, and the pressure on the side of the heat dissipation surface 12 close to the first ventilation cavity 11 is greater than the pressure on the side of the heat dissipation surface 12 away from the first ventilation cavity 11. The heat dissipation surface 12 of the first air guide cover 1 is provided with a plurality of air outlets 121 connected to the first ventilation cavity 11. Due to the existence of the air pressure difference, the airflow in the first ventilation cavity 11 flows from the air outlets 121 to the side of the heat dissipation surface 12 away from the first ventilation cavity 11, thereby taking away the heat of the heating element 3 in the first ventilation cavity 11, and achieving the heat dissipation effect. In addition, the chassis will not be restricted by ventilation conditions and can effectively dissipate heat for the OCP card.

[0050] It should be noted that in the description of this specification, the terms "upper", "lower", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model; the terms "connect", "install", "fixed", etc. should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0051] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0052] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A heat dissipation device, characterized in that: include: A first air guide cover (1), the first air guide cover (1) being provided with a first ventilation cavity (11) extending along a first direction (A), the first ventilation cavity (11) accommodating a heating element (3), the first air guide cover (1) being provided with a heat dissipation surface (12), the heat dissipation surface (12) being provided with a plurality of air outlet holes (121) communicating with the first ventilation cavity (11); and A cooling fan (4), wherein the cooling fan (4) is arranged at an upstream position of the first air guide cover (1) along the first direction (A), the blowing port (41) of the cooling fan (4) is directed toward the air outlet (121) along the first direction (A), and the blowing port (41) is located on the side of the cooling surface (12) opposite to the first ventilation cavity (11), so that the airflow blown out of the blowing port (41) flows along the first direction (A) and passes through the air outlet (121) to form conduction with the airflow inside the first air guide cover (1).

2. The heat dissipation device according to claim 1, characterized in that: Also includes: a second air guide cover (2) arranged adjacent to the first air guide cover (1) upstream along the first direction (A), the second air guide cover (2) being provided with a second ventilation cavity (21) extending along the first direction (A), the second ventilation cavity (21) having a second air inlet (211) and a second air outlet (212) corresponding to the first air inlet (111) of the first air guide cover (1); The cooling fan (4) is arranged on the outer wall of the second air guide cover (2) away from the second ventilation cavity (21), the air outlet (41) of the cooling fan (4) faces the first air guide cover (1) and the air outlet (41) is located on the side of the cooling surface (12) opposite to the first ventilation cavity (11), so that the air flow blown out by the air outlet (41) flows along the first direction (A) and is located on the side of the cooling surface (12) opposite to the first ventilation cavity (11).

3. The heat dissipation device according to claim 1, characterized in that: Also includes: A heat dissipation component (5), the heat dissipation component (5) comprising: a heat sink (51), the heat sink (51) being arranged at a mounting opening corresponding to the heat dissipation surface (12) and the heating element (3), a heat dissipation portion (511) of the heat sink (51) corresponding to the heating element (3) and the heat dissipation portion (511) being in contact with the heating element (3), the heat dissipation portion (511) being provided with mesh heat dissipation holes (5111), and A heat conducting member (52), wherein two ends of the heat conducting member (52) respectively correspond to the heat dissipation portion (511) and the air outlet (41) of the heat dissipation fan (4) and are connected to the heat dissipation portion (511), and are used for conducting heat from the heat dissipation portion (511) to the air outlet (41).

4. The heat dissipation device according to claim 3, characterized in that: The heat dissipation portion (511) protrudes from the heat dissipation surface (12) to which the heat dissipation fin (51) is connected along the second direction (B) and abuts against the heat generating element (3); the heat dissipation fin (51) is elastically fixed to the heat dissipation surface (12) of the first air guide cover (1) by means of a spring bolt (6), so that the heat dissipation fin (51) can move relative to the heat dissipation surface (12) along the second direction (B) under the pressure of the heat generating element (3); The second direction (B) is perpendicular to the first direction (A).

5. The heat dissipation device according to claim 4, characterized in that: A surface of the heat dissipation portion (511) close to the first ventilation cavity (11) is in the form of an arc-shaped surface.

6. The heat dissipation device according to claim 4, characterized in that: Also includes: Thermally conductive mud (7) is arranged in a receiving groove (512) on a side of the heat dissipation portion (511) facing away from the first ventilation cavity (11); A cover plate (8) is adapted to the receiving groove (512) and fixed in the receiving groove (512) so as to confine the thermal conductive mud (7) between the heat dissipation portion (511) and the cover plate (8).

7. The heat dissipation device according to claim 1, characterized in that: The bottom side height of the air blowing port (41) is the same as the height of the heat dissipation surface (12) along the second direction (B), so that the air flow blown out of the air blowing port (41) flows along the first direction (A) and adheres to the side of the heat dissipation surface (12) opposite to the first ventilation cavity (11); The second direction (B) is perpendicular to the first direction (A).

8. The heat dissipation device according to claim 2, characterized in that: A gradually expanding section (22) is provided at the second air inlet (211) of the second ventilation cavity (21), and the cavity diameter of the gradually expanding section (22) gradually increases in the direction from the second air outlet (212) to the second air inlet (211).

9. The heat dissipation device according to claim 2, characterized in that: The second air outlet (212) is adapted to the first air inlet (111) and the second air outlet (212) is connected to the first air inlet (111).

10. A chassis, characterized in that: include: A heat dissipation device as claimed in any one of claims 1 to 9.

Images