Deviation correction mechanism for wafer workbench supporting seat machining

Abstract

The utility model relates to the technical field of wafer workbench supporting seat processing, and discloses a deviation correction mechanism for wafer workbench supporting seat processing, which comprises a shell, the inner wall of the shell is connected with a supporting plate in a sliding manner, the supporting plate is provided with four sliding chutes, the four sliding chutes are internally provided with sliding blocks, the sliding blocks are connected with the supporting plate in a sliding manner, the tops of the sliding blocks are fixedly connected with a push plate, and the push plate is fixedly connected with a push rod. A notch is formed in the top end of the push plate, a round rod is arranged in the notch, the round rod is fixedly connected with the push plate and sleeved with a round pipe, eight square plates are fixedly connected to the bottom of the supporting plate, every two of the eight square plates form a group, tension springs are fixedly connected to the sides, close to the sliding blocks, of the square plates, and the sliding blocks are fixedly connected to the sides, away from the square plates, of the tension springs. A guide plate is arranged on one side of the round pipe, four round holes are formed in the supporting plate, and limiting rods are arranged in the four round holes. According to the utility model, the position of the wafer workbench supporting seat can be corrected conveniently, the operation difficulty is low, and the working efficiency and the correction precision can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer worktable support seat processing, in particular to a deviation correction mechanism for wafer worktable support seat processing. Background Art

[0002] The wafer worktable support is a device used to support the wafer worktable in the laboratory. It is usually made of metal material. The wafer worktable support can help experimenters perform experimental operations such as wafer processing, testing and analysis to ensure the accuracy and stability of the experiment. In the laboratory, the wafer worktable support is one of the most important equipment. During the processing and production process, the wafer worktable support is prone to displacement due to vibrations in the production environment. In order to ensure the quality of the wafer worktable support, it needs to be corrected.

[0003] The traditional method of correcting the deviation of the wafer worktable support is mostly done manually by the staff. The staff manually positions and aligns the offset wafer worktable support, but the efficiency and accuracy of manual correction are low, which will affect the efficiency of wafer worktable support processing. Therefore, it is necessary to design a deviation correction mechanism for wafer worktable support processing to solve the above problem. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a deviation correction mechanism for processing a wafer worktable support seat.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A deviation correction mechanism for processing a wafer worktable support seat comprises a shell, the inner wall of the shell is slidably connected to a support plate, the support plate is provided with four slide grooves, the four slide grooves are provided with sliders, the sliders are slidably connected to the support plate, the top of the slider is fixedly connected to a push plate, the top of the push plate is provided with a notch, a round rod is provided in the notch, the round rod is fixedly connected to the push plate, the round rod is sleeved with a round tube, the bottom of the support plate is fixedly connected to eight square plates, the eight square plates are grouped in twos, the square plate is fixedly connected to a tension spring on the side close to the slider, the tension spring is fixedly connected to the slider on the side away from the square plate, a guide plate is provided on one side of the round tube, and four round holes are provided on the support plate. Limit rods are arranged in the four circular holes, and the limit rods are slidably connected to the support plate. Since the technical means of positioning and aligning the wafer worktable support seat by raising the wafer worktable support seat and moving the push plate close to the wafer worktable support seat is adopted, the wafer worktable support seat will be driven to move after the push plate contacts the wafer worktable support seat. The position of the wafer worktable support seat can be corrected by driving the wafer worktable support seat to move by the four push plates, which effectively solves the problem of low efficiency and accuracy of the existing method of correcting the wafer worktable support seat proposed in the background technology, thereby achieving the technical effect of facilitating the correction of the position of the wafer worktable support seat, with low operating difficulty, and being able to improve work efficiency and correction accuracy.

[0007] As a further solution of the utility model, the bottoms of the four limit rods are fixedly connected to the same base, and four mounting holes are opened on the base.

[0008] As a further solution of the utility model, the top of the base is fixedly connected to the shell, four first screw rods are passed through the shell, the first screw rod is sleeved with a first threaded sleeve, the first threaded sleeve is fixedly connected to the inner wall of the shell, one side of the first screw rod is fixedly connected to a disc, the disc is sleeved with a sleeve, the sleeve is fixedly connected to the guide plate on the side away from the first screw rod, and the first screw rod is fixedly connected to a knob on the side away from the guide plate.

[0009] As a further solution of the utility model, a motor is fixedly connected to the top of the base.

[0010] As a further solution of the utility model, the output shaft of the motor is fixedly connected to the first bevel gear, the first bevel gear is meshingly connected to the second bevel gear, the top of the second bevel gear is fixedly connected to a rotating rod, the top of the rotating rod is fixedly connected to a second screw rod, the second screw rod sleeve is provided with a second threaded sleeve, and the top of the second threaded sleeve is fixedly connected to the bottom of the support plate.

[0011] As a further solution of the utility model, the rotating rod sleeve is provided with a U-shaped plate, and the bottom of the U-shaped plate is fixedly connected to the top of the base.

[0012] The beneficial effects of the utility model are:

[0013] The utility model: due to the technical means of raising the wafer worktable support seat and moving the push plate close to the wafer worktable support seat to position and align it, the push plate will drive the wafer worktable support seat to move after contacting the wafer worktable support seat. The position of the wafer worktable support seat can be corrected by driving the wafer worktable support seat to move through four push plates, which effectively solves the problem of low efficiency and accuracy of the existing method of correcting the wafer worktable support seat proposed in the background technology, thereby achieving the technical effect of facilitating the correction of the position of the wafer worktable support seat, with low operating difficulty, and being able to improve work efficiency and correction accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a three-dimensional structural schematic diagram of a deviation correction mechanism for processing a wafer worktable support seat proposed by the utility model;

[0015] Figure 2 This is a schematic cross-sectional structure diagram of a deviation correction mechanism for processing a wafer worktable support seat proposed by the utility model;

[0016] Figure 3 This is a schematic diagram of the expanded structure of the second threaded sleeve of a deviation correction mechanism for processing a wafer worktable support seat proposed by the utility model;

[0017] Figure 4 The utility model is a schematic diagram of the expanded structure of a guide plate of a deviation correction mechanism for processing a wafer worktable support seat.

[0018] In the figure: 1. shell; 2. support plate; 3. slide groove; 4. slider; 5. push plate; 6. notch; 7. round rod; 8. round tube; 9. square plate; 10. tension spring; 11. guide plate; 12. round hole; 13. limit rod; 14. base; 15. mounting hole; 16. first screw rod; 17. first threaded sleeve; 18. disc; 19. sleeve; 20. motor; 21. first bevel gear; 22. second bevel gear; 23. rotating rod; 24. U-shaped plate; 25. second screw rod; 26. second threaded sleeve; 27. knob. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0021] Reference Figure 1-Figure 4 A deviation correction mechanism for processing a wafer worktable support seat comprises a shell 1, the inner wall of the shell 1 is slidably connected with a support plate 2, the support plate 2 is provided with four slide grooves 3, the four slide grooves 3 are provided with sliders 4, the sliders 4 are slidably connected with the support plate 2, the top of the slider 4 is fixedly connected with a push plate 5, the top of the push plate 5 is provided with a notch 6, a round rod 7 is provided in the notch 6, the round rod 7 is fixedly connected with the push plate 5, the round rod 7 is sleeved with a round tube 8, the bottom of the support plate 2 is fixedly connected with eight square plates 9, the eight square plates 9 are grouped in pairs, the square plate 9 is fixedly connected with a tension spring 10 on the side close to the slider 4, the tension spring 10 is fixedly connected with the slider 4 on the side away from the square plate 9, a guide plate 11 is provided on one side of the round tube 8, and four round holes 1 are provided on the support plate 2. 2, limit rods 13 are arranged in the four circular holes 12, and the limit rods 13 are slidably connected to the support plate 2. Since the technical means of raising the wafer worktable support seat and moving the push plate close to the wafer worktable support seat to position and align it is adopted, the push plate will drive the wafer worktable support seat to move after it contacts the wafer worktable support seat. The position of the wafer worktable support seat can be corrected by driving the wafer worktable support seat to move by the four push plates, which effectively solves the problem of low efficiency and accuracy of the existing method for correcting the wafer worktable support seat proposed in the background technology, thereby achieving the technical effect of facilitating the correction of the position of the wafer worktable support seat, low operating difficulty, and improving work efficiency and correction accuracy.

[0022] In this embodiment, the bottoms of the four limiting rods 13 are fixedly connected to the same base 14 , and the base 14 is provided with four mounting holes 15 .

[0023] In this embodiment, the top of the base 14 is fixedly connected to the outer shell 1, and four first screw rods 16 are passed through the outer shell 1. The first screw rods 16 are sleeved with a first threaded sleeve 17, and the first threaded sleeve 17 is fixedly connected to the inner wall of the outer shell 1. One side of the first screw rod 16 is fixedly connected to a disc 18, and the disc 18 is sleeved with a sleeve 19. The sleeve 19 is fixedly connected to the guide plate 11 on the side away from the first screw rod 16. The first screw rod 16 is fixedly connected to a knob 27 on the side away from the guide plate 11.

[0024] In this embodiment, a motor 20 is fixedly connected to the top of the base 14 .

[0025] In this embodiment, the output shaft of the motor 20 is fixedly connected to the first bevel gear 21, the first bevel gear 21 is meshingly connected to the second bevel gear 22, the top of the second bevel gear 22 is fixedly connected to the rotating rod 23, the top of the rotating rod 23 is fixedly connected to the second screw rod 25, the second screw rod 25 is sleeved with a second threaded sleeve 26, and the top of the second threaded sleeve 26 is fixedly connected to the bottom of the support plate 2.

[0026] In this embodiment, the rotating rod 23 is sleeved with a U-shaped plate 24 , and the bottom of the U-shaped plate 24 is fixedly connected to the top of the base 14 .

[0027] Working principle: When using the device, the wafer worktable support seat to be processed can be placed on the support plate 2, and then the motor 20 is started, the output shaft of the motor 20 will drive the first bevel gear 21 to rotate, the first bevel gear 21 will drive the second bevel gear 22 to rotate, the second bevel gear 22 will drive the rotating rod 23 to rotate, the rotating rod 23 will rotate in the U-shaped plate 24, the rotating rod 23 will not deviate when rotating, the rotation of the rotating rod 23 will drive the second screw rod 25 to rotate, the second screw rod 25 will drive the second threaded sleeve 26 to move up, and the second threaded sleeve 26 will drive the support plate 2 to move up, the support plate 2 will drive the wafer worktable support seat to move up, the lifting of the support plate 2 will drive the push plate 5 to move up, the push plate 5 will drive the round rod 7 to move up, the round rod 7 will drive the round tube 8 to move up, when the round tube 8 contacts the guide plate 11, the round tube 8 will move along the oblique edge of the guide plate 11, then the round tube 8 will move in the direction of the wafer worktable support seat, the round tube 8 will drive the round rod 7 to move, the round rod 7 will drive the push plate 5 to move until it contacts the wafer worktable support seat, so that the wafer worktable support seat with deviation can be corrected. Positioning and correction are performed. When the push plate 5 moves, the slider 4 will also be driven to move along the slide groove 3. Then, the push plate 5 will not deviate when moving. The movement of the slider 4 will pull the tension spring 10 to stretch the tension spring 10. Then, the motor 20 can continue to work, and the support plate 2 can continue to rise, so that the height of the wafer workbench support seat can be adjusted. The round tube 8 will also move along the vertical edge of the guide plate 11. When processing wafer workbench support seats of different sizes, the knob 27 can be turned, and the knob 27 will drive the first screw rod 16 to move, and the first screw rod 16 will It will drive the movement toward the wafer worktable support seat, the first screw rod 16 will drive the disc 18 to move, the disc 18 will drive the sleeve 19 to move, the sleeve 19 will drive the guide plate 11 to move, the guide plate 11 will drive the round tube 8 to move, and the initial distance between the push plate 5 and the wafer worktable support seat can be adjusted to adapt to wafer worktable support seats of different sizes. After completing the deviation correction and processing, the output shaft of the motor 20 is reversed to make the support plate 2 descend, and the tension spring 10 will also contract, so that the push plate 5 can be moved away from the wafer worktable support seat.

[0028] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0029] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0030] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A deviation correction mechanism for wafer table support seat processing, comprising a housing (1), characterized in that: The inner wall of the shell (1) is slidably connected to a support plate (2), four slide grooves (3) are provided on the support plate (2), and a slider (4) is provided in each of the four slide grooves (3). The slider (4) is slidably connected to the support plate (2), and the top of the slider (4) is fixedly connected to a push plate (5), and a notch (6) is provided at the top of the push plate (5). A round rod (7) is provided in the notch (6), and the round rod (7) is fixedly connected to the push plate (5). A round tube (8) is sleeved on the round rod (7). Eight square plates (9) are fixedly connected to the bottom, and the eight square plates (9) are grouped in pairs. A tension spring (10) is fixedly connected to the side of the square plate (9) close to the slider (4), and the tension spring (10) is fixedly connected to the slider (4) on the side away from the square plate (9). A guide plate (11) is arranged on one side of the circular tube (8), and four circular holes (12) are opened on the support plate (2). Limit rods (13) are arranged in the four circular holes (12), and the limit rods (13) are slidably connected to the support plate (2).

2. The wafer table support seat processing deviation correction mechanism according to claim 1, characterized in that: The bottoms of the four limiting rods (13) are fixedly connected to the same base (14), and the base (14) is provided with four mounting holes (15).

3. The wafer table support seat processing deviation correction mechanism according to claim 2, characterized in that: The top of the base (14) is fixedly connected to the outer shell (1), and four first screw rods (16) are passed through the outer shell (1), and the first screw rods (16) are sleeved with a first threaded sleeve (17), and the first threaded sleeve (17) is fixedly connected to the inner wall of the outer shell (1), and one side of the first screw rod (16) is fixedly connected to a disk (18), and the disk (18) is sleeved with a sleeve (19), and the sleeve (19) is fixedly connected to the guide plate (11) on a side away from the first screw rod (16). The first screw rod (16) is fixedly connected to a knob (27) on a side away from the guide plate (11).

4. The wafer table support seat processing deviation correction mechanism according to claim 3, characterized in that: A motor (20) is fixedly connected to the top of the base (14).

5. The wafer table support seat processing deviation correction mechanism according to claim 4, characterized in that: The output shaft of the motor (20) is fixedly connected to a first bevel gear (21), the first bevel gear (21) is meshingly connected to a second bevel gear (22), the top of the second bevel gear (22) is fixedly connected to a rotating rod (23), the top of the rotating rod (23) is fixedly connected to a second screw rod (25), the second screw rod (25) is sleeved with a second threaded sleeve (26), and the top of the second threaded sleeve (26) is fixedly connected to the bottom of the support plate (2).

6. The deviation correction mechanism for wafer table support seat processing according to claim 5, characterized in that: The rotating rod (23) is sleeved with a U-shaped plate (24), and the bottom of the U-shaped plate (24) is fixedly connected to the top of the base (14).

Images