UV lamp bead structure with fluorescent agent component detection and white light supplement functions

Abstract

The utility model discloses a UV lamp bead structure with fluorescent agent component detection and white light supplement functions, which comprises a light distribution and color modulation assembly, an LED packaging support and a chip assembly, the light distribution and color modulation assembly is mounted at the upper end of the LED packaging support, the chip assembly is mounted inside the LED packaging support, the LED packaging support comprises a support shell, a deep cup opening and a bonding pad support, and the bonding pad support is mounted on the support shell. The deep cup opening is formed in the middle of the support shell, the bonding pad support is arranged in the support shell in an injection molding mode and comprises an anode bonding pad and a cathode bonding pad, the cathode bonding pad is installed at the lower end of the UV chip, and the upper end of the anode bonding pad is connected with the rear end of the gold wire. According to the utility model, by adopting the UV chip packaging structure, the light loss is effectively reduced, and the light attenuation is reduced; by dispensing the high-density fluorescent glue on the surface of the UV chip, yellowing of the lens and the glue after a long time is avoided; the deep cup opening in the LED packaging support is used for gathering light and increasing light intensity, and then the lens is used for gathering light, so that emitted light is more concentrated.

Description

Technical Field

[0001] The utility model belongs to the technical field of LEDs, and in particular relates to a UV lamp bead structure having the functions of detecting fluorescent agent components and supplementing white light. Background Art

[0002] At present, there is a lack of UV LED lamp beads that can professionally detect fluorescent agent components and have fill-in light functions in the market. The lenses of some UV lamp beads tend to turn yellow after being irradiated, resulting in poor light output, and cannot cooperate well with professional image cameras for detection and fill-in light functions at the same time. In addition, most chip welding materials are ordinary copper or iron, which have poor thermal conductivity and are prone to cause the chip temperature to be too high and short-circuit. Utility Model Content

[0003] The purpose of the utility model is to provide a UV lamp bead structure that can detect fluorescent agent components and also has white light fill function, aiming to solve the problems existing in the background technology. To achieve the above purpose, the technical solution adopted by the utility model is:

[0004] A UV lamp bead structure with fluorescent agent component detection and white light fill function includes a light distribution and color adjustment component, an LED packaging bracket and a chip component. The light distribution and color adjustment component is installed on the upper end of the LED packaging bracket, and the chip component is installed inside the LED packaging bracket.

[0005] Preferably, the light distribution and color adjustment component includes a lens and fluorescent glue. The fluorescent glue is arranged at the bottom of the lens. The lens can focus light and resist ultraviolet radiation. The fluorescent glue is used to adjust the color temperature and can resist ultraviolet radiation.

[0006] Preferably, the LED package bracket includes a bracket shell, a deep cup mouth and a solder pad bracket, the deep cup mouth is arranged in the middle of the bracket shell, and the solder pad bracket is injection-molded inside the bracket shell.

[0007] Preferably, the chip assembly includes a UV chip and a gold wire, and the front end of the gold wire is connected to the right side of the UV chip.

[0008] Preferably, the pad bracket includes a positive pad and a negative pad, the negative pad is installed at the lower end of the UV chip, and the upper end of the positive pad is connected to the rear end of the gold wire.

[0009] Preferably, the lens is mounted on the upper end of the deep cup mouth by means of fluorescent glue.

[0010] Preferably, the pad bracket is made of copper material, which can dissipate heat quickly.

[0011] Beneficial effects of the utility model:

[0012] By adopting the UV chip packaging structure, the light loss and light decay are effectively reduced; by applying high-density fluorescent glue on the surface of the UV chip, the lens and colloid are prevented from turning yellow over time; the deep cup mouth in the LED packaging bracket is used to focus and increase the light intensity, and then the lens is used to focus the light to make the emitted light more concentrated; the pad bracket is made of copper material, which has good thermal conductivity. Because the UV chip generates light and heat when it emits light, quickly conducting the heat away will increase the service life of the UV chip and significantly improve the LED brightness. When used, the heat is quickly conducted to the radiator through the pad bracket to achieve the heat dissipation function. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The overall structural diagram provided for the embodiment of the utility model;

[0014] Figure 2 An exploded view of the overall structure provided for an embodiment of the utility model;

[0015] Figure 3 It is an exploded view of the chip assembly and the pad bracket according to an embodiment of the utility model.

[0016] Figure 4 The figure is a working principle diagram of an embodiment of the utility model.

[0017] Among them, the reference numerals in the figure are:

[0018] 1. Light distribution and color adjustment components; 11. Lens; 12. Fluorescent glue; 2. LED package bracket; 21. Bracket shell; 22. Deep cup mouth; 23. Pad bracket; 231. Positive electrode pad; 232. Negative electrode pad; 3. Chip assembly; 31. UV chip; 32. Gold wire; DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a centered element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a centered element at the same time. On the contrary, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method. The terms "upper end", "lower end", "left side", "right side", "front end", "rear end" and similar expressions used herein are positional relationships with reference to the accompanying drawings.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0022] The technical solution of this patent is further described in detail below in conjunction with specific implementation methods.

[0023] like Figures 1 to 4 As shown, an embodiment of the utility model provides a UV lamp bead structure for detecting fluorescent agent components and having white light fill-in function, including a light distribution and color adjustment component 1, an LED packaging bracket 2 and a chip component 3, wherein the light distribution and color adjustment component 1 is installed at the upper end of the LED packaging bracket 2, and the chip component 3 is installed inside the LED packaging bracket 2.

[0024] In the embodiment, the light distribution and color adjustment component 1 includes a lens 11 and a fluorescent glue 12. The fluorescent glue 12 is arranged at the bottom of the lens 11. The lens 11 can focus light and resist ultraviolet radiation. The fluorescent glue 12 is used to adjust the color temperature and can resist ultraviolet radiation.

[0025] In the embodiment, the LED package bracket 2 includes a bracket shell 21 , a deep cup mouth 22 and a solder pad bracket 23 . The deep cup mouth 22 is arranged in the middle of the bracket shell 21 , and the solder pad bracket 23 is injection molded inside the bracket shell 21 .

[0026] In the embodiment, the chip assembly 3 includes a UV chip 31 and a gold wire 32 , and the front end of the gold wire 32 is connected to the right side of the UV chip 31 .

[0027] In the embodiment, the pad bracket 23 includes a positive pad 231 and a negative pad 232 . The negative pad 232 is mounted on the lower end of the UV chip 31 , and the upper end of the positive pad 231 is connected to the rear end of the gold wire 32 .

[0028] In the embodiment, the lens 11 is mounted on the upper end of the deep cup mouth 22 through the fluorescent glue 12 .

[0029] In the embodiment, the pad bracket 23 is made of copper material, which can quickly dissipate heat.

[0030] See also Figure 4 This is the working principle diagram. There is a 2.6-3.0V linear constant voltage power supply on the positive and negative lines of the pad. The current passes through the line to turn on the LED UV chip to light up (the light emitted here is in a forward wide-angle scattered light without constraints, and the UV chip package is used here. It is lit and irradiated on objects containing fluorescent agents to display purple light, and irradiated on objects without fluorescent agents to display white light. Conventional blue light chips cannot achieve this effect). After the heat generated by the UV chip is conducted out through the pad, the heat is dissipated through the heat sink to achieve chip thermal balance. At the same time, the UV light is constrained for the first time through the deep lamp cup, and the UV light is matched with the color temperature through the prepared fluorescent glue (the optical glue also plays a role in mixing light). The UV light is secondary constrained through the lens for light distribution or focusing (the lens and fluorescent light are bonded as a whole through the viscosity of the anti-UV3545A / B glue itself).

[0031] The ratio of glue and phosphor is: the color temperature is 2900-3100K at the ratio of 0.5 weight of anti-UV 3545A glue: 2 weight of anti-UV 3545B glue: 0.75 weight of YG537 phosphor: 0.064 weight of 603 phosphor: 0.05 weight of HK03 phosphor;

[0032] The color temperature is 6000-6500K when the ratio is 0.5 weight of anti-UV 3545A glue: 2 weight of anti-UV 3545B glue: 0.382 weight of YG537 phosphor: 0.014 weight of 603 phosphor: 0.05 weight of HK03 phosphor;

[0033] When the ratio is 0.5 weight of anti-UV 3545A glue: 2.2 weight of anti-UV 3545B glue: 0.412 weight of YG537 phosphor: 0.015 weight of 603 phosphor: 0.03 weight of HK03 phosphor, the color temperature is 8000-12000K.

[0034] The above implementation modes are only used to illustrate the present invention, but not to limit the present invention. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions also belong to the scope of the present invention. The scope of patent protection of the present invention should be limited by the claims.

Claims

1. A UV lamp bead structure for detecting fluorescent agent components and also for white light supplementation, characterized in that: It includes a light distribution and color adjustment component, an LED packaging bracket and a chip component, the light distribution and color adjustment component is installed at the upper end of the LED packaging bracket, and the chip component is installed inside the LED packaging bracket; the LED packaging bracket includes a bracket shell, a deep cup mouth and a pad bracket, the deep cup mouth is arranged in the middle of the bracket shell, and the pad bracket is installed inside the bracket shell; the pad bracket includes a positive electrode pad and a negative electrode pad, the negative electrode pad is installed at the lower end of the UV chip, and the upper end of the positive electrode pad is connected to the rear end of the gold wire.

2. The UV lamp bead structure for detecting fluorescent agent components and having white light supplement function according to claim 1, characterized in that: The light distribution and color adjustment component comprises a lens and fluorescent glue, and the fluorescent glue is arranged at the bottom of the lens.

3. The UV lamp bead structure for detecting fluorescent agent components and having white light supplement function according to claim 2, characterized in that: The chip assembly comprises a UV chip and a gold wire, and the front end of the gold wire is connected to the right side of the UV chip.

4. A UV lamp bead structure for detecting fluorescent agent components and having white light supplement function according to any one of claims 2-3, characterized in that: The lens is mounted on the upper end of the deep cup mouth through the fluorescent glue.

5. A UV lamp bead structure for detecting fluorescent agent components and having white light supplement function according to any one of claims 2-3, characterized in that: The pad bracket is made of copper.

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