Stacked multi-wafer storage and transmission mechanism

Abstract

The utility model provides a stacked multi-wafer storage and transmission mechanism, which comprises a driving device, a mechanical arm, a transmission chamber, process cavities, a LoadLock module and wafers, and is characterized in that the driving device is in control connection with the mechanical arm, the mechanical arm is arranged in the transmission chamber, the transmission chamber is connected with at least one process cavity through a transmission channel, and the transmission chamber is connected with the LoadLock module; and the mechanical arm controls the wafer to be conveyed between the process cavity and the LoadLock module. According to the invention, the LoadLock modules which are subjected to stacking design are re-arranged, and the original LoadLock modules which are arranged in a single layer are changed into the double-layer stacked LoadLock modules, so that the waiting time of the mechanical arm during wafer conveying work can be effectively saved, the overall wafer conveying time is shortened, and the wafer production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a stacked multi-wafer storage and transmission mechanism. Background Art

[0002] In the semiconductor manufacturing process, most of the equipment required for wafer production requires specially designed conveying devices. The wafers need to be conveyed into a specific area - LoadLock to switch from atmospheric to vacuum state in preparation for subsequent processes.

[0003] The existing single-layer wafer storage mechanism has the problem of reducing the production efficiency of a specific wafer process, which hinders the improvement of the utilization rate of the process chamber. Utility Model Content

[0004] The purpose of the utility model is to provide a stacked multi-wafer storage and transmission mechanism to improve the overall transmission efficiency of wafers, improve wafer manufacturing efficiency, and reduce the production time of each wafer.

[0005] In order to achieve the above-mentioned purpose, the utility model proposes a stacked multi-wafer storage and transmission mechanism, comprising a driving device, a robotic arm, a transmission chamber, a process chamber, a LoadLock module and a wafer, wherein the driving device is controlled and connected to the robotic arm, the robotic arm is placed in the transmission chamber, the transmission chamber is connected to at least one of the process chambers through a transmission channel, and the transmission chamber is connected to the LoadLock module; the robotic arm controls the wafer to be transmitted between the process chamber and the LoadLock module;

[0006] The LoadLock module includes a multi-layer stacked LoadLock component, which is composed of multiple LoadLock units. Each of the LoadLock units includes a LoadLock gate valve, a LoadLock chamber and a LoadLock channel. The LoadLock chamber is connected to the transfer chamber through the LoadLock channel, and the LoadLock gate valve is provided at the opening of the LoadLock chamber.

[0007] Furthermore, in the stacked multi-wafer storage and transfer mechanism, the LoadLock module is provided with two layers of the LoadLock components, and the LoadLock component is provided with two LoadLock units.

[0008] Furthermore, in the stacked multi-wafer storage and transfer mechanism, the LoadLock chamber is provided with an automatic temperature control function.

[0009] Furthermore, in the stacked multi-wafer storage and transfer mechanism, each of the LoadLock gate valves is synchronously controlled to open and close.

[0010] Furthermore, in the stacked multi-wafer storage and transfer mechanism, the transfer chamber and the process chamber are both vacuum chambers, and a vacuum treatment is performed in the LoadLock chamber.

[0011] Furthermore, in the stacked multi-wafer storage and conveying mechanism, the robotic arm includes a rotary transmission mechanism and a conveying arm, and two symmetrically extending clamping rods on the conveying arm are used to support and transport the wafers.

[0012] Compared with the prior art, the beneficial effects of the utility model are mainly reflected in: by rearranging the stacked LoadLock modules, the original single-layer LoadLock modules are changed into double-layer stacked LoadLock modules, which can effectively save the waiting time of the robot arm when performing wafer transfer work, shorten the overall wafer transfer time, and improve the wafer production efficiency. At the same time, in accordance with the structure of the LoadLock module, the structure of the robot arm is designed accordingly, so that multiple wafers can be transferred at the same time, so that the robot arm has a high-efficiency transfer mechanism with the function of up and down movement. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the stacked multi-wafer storage and transmission mechanism in the utility model;

[0014] Figure 2 for Figure 1 A front view structural diagram of

[0015] Figure 3 It is a schematic diagram of the working principle of the stacked multi-wafer storage and transmission mechanism in the utility model. DETAILED DESCRIPTION

[0016] The stacked multi-wafer storage and transfer mechanism of the present invention will be described in more detail below in conjunction with the schematic diagram, wherein the preferred embodiment of the present invention is shown, and it should be understood that those skilled in the art can modify the present invention described herein, while still achieving the advantageous effects of the present invention. Therefore, the following description should be understood as being widely known to those skilled in the art, and not as a limitation to the present invention.

[0017] In the present invention, unless otherwise specified and limited, the terms "assembly", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be a mechanical connection; it can be directly connected, or it can be connected through an intermediate medium, or the two elements can be internally connected. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0018] The present invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the accompanying drawings are in very simplified form and in non-precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0019] like Figure 1 to Figure 2 As shown, the utility model proposes a stacked multi-wafer storage and conveying mechanism, including a driving device, a robotic arm 1, a transfer chamber 2, a process chamber 3, a LoadLock module 4 and a wafer 5. The driving device is controlled and connected to the robotic arm 1, the robotic arm 1 is placed in the transfer chamber 2, the transfer chamber 2 is connected to at least one process chamber 3 through a transfer channel 6, and the transfer chamber 2 is connected to the LoadLock module 4; the robotic arm 1 controls the wafer 5 to be transferred between the process chamber 3 and the LoadLock module 4.

[0020] Specifically, the LoadLock module 4 includes a multi-layer stacked LoadLock component, which is composed of multiple LoadLock units. Each LoadLock unit includes a LoadLock gate valve 7, a LoadLock chamber 8 and a LoadLock channel 9. The LoadLock chamber 8 is connected to the transfer chamber 2 through the LoadLock channel 9, and a LoadLock gate valve 7 is provided at the opening of the LoadLock chamber 8.

[0021] Preferably, if Figure 1 to Figure 2 As shown, in this embodiment, the LoadLock module 4 is provided with two layers of LoadLock components, and the LoadLock components are provided with two LoadLock units. This structure of rearranging and designing the original LoadLock so that the original single-layer LoadLock components are transformed into double-layer stacked LoadLock components can effectively save the waiting time of the robot arm 1, and improve the production efficiency of the wafer 5 by shortening the overall transfer time of the wafer 5.

[0022] Furthermore, if Figure 1 to Figure 2As shown, the LoadLock chamber 8 is provided with an automatic temperature control function, and each LoadLock gate valve 7 is synchronously controlled to open and close, which can accurately control the wafers 5 to be simultaneously input into the LoadLock chamber 8 .

[0023] Furthermore, if Figure 1 As shown, the transfer chamber 2 and the process chamber 3 are both vacuum chambers, and the LoadLock chamber 8 is evacuated to make the pressure in the LoadLock chamber 8 consistent with the pressure in the transfer chamber 2 .

[0024] Furthermore, if Figure 1 As shown, the robot arm 1 includes a rotary transmission mechanism 11 and a conveying arm 12, and two symmetrically extending clamping rods 13 on the conveying arm 12 are used to support and transport the wafers 5. Since the conveying arm 12 simultaneously conveys two wafers 5 in two LoadLock chambers 8 in each layer of the LoadLock assembly through the two clamping rods 13, and cooperates with the rotary transmission mechanism 11 to perform vertical and horizontal rotary conveying work, the working efficiency of the robot arm 1 in conveying the wafers 5 can be effectively improved.

[0025] In addition, the structure of the present application can be directly applied to the technology of wafer storage and transmission in semiconductor integrated circuit manufacturing equipment, and is suitable for practical application in the manufacturing field of 4-inch, 6-inch, 8-inch, and 12-inch wafers 5.

[0026] The specific operations are as follows:

[0027] like Figure 3 As shown, the wafer 5 is input into the stacked LoadLock chamber 8 at the synchronously opened LoadLock gate valve 7 through an external mechanism, and the LoadLock chamber 8 is vacuumed to make the pressure of the LoadLock chamber 8 and the transfer chamber 2 equal. The robot arm 1 grabs the wafer 5 in the LoadLock chamber 8 of the working LoadLock component and transfers it to the process chamber 3. After the wafer 5 in the process chamber 3 completes the process work, the robot arm 1 transfers the completed wafer 5 in the process chamber 3 to the LoadLock chamber 8 of the idle LoadLock component, and then outputs it through the LoadLock gate valve 7. At this time, the robot arm 1 synchronously waits for the next round of wafer 5 to be transferred.

[0028] In summary, in order to avoid the shortcomings of the prior art such as slow overall wafer transfer efficiency, reduced efficiency of the transfer device and process chamber, etc. In this embodiment, the proposed stacked multi-wafer storage and transfer mechanism, by rearranging the LoadLock modules for stacking design, changes the original single-layer LoadLock modules into double-layer stacked LoadLock modules, which can effectively save the waiting time of the robot arm when performing wafer transfer work, shorten the overall transfer time of the wafer, and improve the production efficiency of the wafer. At the same time, in conjunction with the structure of the LoadLock module, the structure of the robot arm is designed accordingly, so that multiple wafers can be transferred at the same time, so that the robot arm has a high-efficiency transfer mechanism with the function of up and down movement.

[0029] The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any technician in the relevant technical field, without departing from the scope of the technical solution of the present invention, may make any equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which shall be deemed as the content of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. A stacked multi-wafer storage and transfer mechanism, characterized in that: The invention comprises a driving device, a robot arm (1), a transfer chamber (2), a process chamber (3), a LoadLock module (4) and a wafer (5), wherein the driving device is control-connected to the robot arm (1), the robot arm (1) is placed in the transfer chamber (2), the transfer chamber (2) is connected to at least one of the process chambers (3) via a transfer channel (6), and the transfer chamber (2) is connected to the LoadLock module (4); the robot arm (1) controls the wafer (5) to be transferred between the process chamber (3) and the LoadLock module (4); The LoadLock module (4) comprises a multi-layer stacked LoadLock component, the LoadLock component is composed of a plurality of LoadLock units, each of the LoadLock units comprises a LoadLock gate valve (7), a LoadLock chamber (8) and a LoadLock channel (9), the LoadLock chamber (8) is connected to the transfer chamber (2) via the LoadLock channel (9), and the LoadLock gate valve (7) is provided at the opening of the LoadLock chamber (8).

2. The stacked multi-wafer storage and transfer mechanism according to claim 1, characterized in that: The LoadLock module (4) is provided with two layers of LoadLock components, and the LoadLock component is provided with two LoadLock units.

3. The stacked multi-wafer storage and transfer mechanism according to claim 1, characterized in that: The LoadLock chamber is provided with an automatic temperature control function.

4. The stacked multi-wafer storage and transfer mechanism according to claim 1, characterized in that: Each of the LoadLock valves (7) is opened and closed synchronously.

5. The stacked multi-wafer storage and transfer mechanism according to claim 1, characterized in that: The transfer chamber (2) and the process chamber (3) are both vacuum chambers, and a vacuum treatment is performed in the LoadLock chamber (8).

6. The stacked multi-wafer storage and transfer mechanism according to claim 1, characterized in that: The mechanical arm (1) comprises a rotary transmission mechanism (11) and a conveying arm (12); two symmetrically extending clamping rods (13) on the conveying arm (12) are used to support and transport the wafer (5).

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