Light-color dust-free grinding wheel structure

By designing a grinding wheel structure with stable installation, heat dissipation and chip removal and light-color dust-free mechanism, the shortcomings of the grinding wheel structure in the prior art in terms of installation stability, heat dissipation and chip removal and light-color dust-free functions are solved, and more efficient grinding performance and longer service life are achieved.

CN222627337UActive Publication Date: 2025-03-18ZHU HAI DA XIANG MO LIAO MO JU YOU XIAN GONG SI
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Patent Information

Application Number
CN202420915684.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-29
Publication Date
2025-03-18
Estimated Expiration
2034-04-29

AI Technical Summary

Technical Problem

The existing grinding wheel structure needs to be improved in terms of installation stability and heat dissipation and chip removal effects, and usually does not have the light color and dust-free function, resulting in reduced grinding efficiency, increased dust and shortened service life.

Method used

A grinding wheel structure including a stable installation mechanism, a heat dissipation and chip exhaust mechanism and a light-colored dust-free mechanism are designed. The stable installation mechanism ensures the stable installation of the grinding wheel structure through the cooperation of guide sliders, guide slide grooves, installation studs and arc-shaped clamps. The heat dissipation and chip removal mechanism achieves efficient heat dissipation and dust removal through the design of the inner chip removal tank, heat dissipation hole and external chip removal tank. The light-color dust-free mechanism is composed of a phenolic resin layer, an adhesive layer and an epoxy resin layer. The phenol hydroxyl component is reduced during the curing process, and the resin is oxidized and blackened, and sufficient curing cross-linking is achieved.

Benefits of technology

This grinding wheel structure can ensure stable installation when used, improve structural strength and grinding performance, extend service life, and achieve efficient heat dissipation and low dust production. It has significant light color and dust-free functions.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model relates to the technical field of grinding wheel structures, in particular to a light-color dust-free grinding wheel structure which comprises a grinding wheel structure body, stable installation mechanisms are arranged on the surfaces of the grinding wheel structure body, a fixing ring and a frame body, and a light-color dust-free mechanism is arranged on the surface of the grinding wheel structure body. And heat dissipation and chip removal mechanisms are arranged on the surfaces of the grinding wheel structure body and the fixing ring. The grinding wheel structure is more convenient to operate, the structural strength of the grinding wheel structure body and the grinding material layer can be improved when the grinding wheel structure is used, efficient heat dissipation can be conducted when the grinding wheel structure is used, the phenomenon that the grinding wheel structure body and the grinding material layer are broken during working is reduced, and the service life of the grinding wheel structure is greatly prolonged; in addition, when the grinding wheel structure is used, the grinding and cutting performance of the grinding wheel structure body and the grinding material layer can be greatly improved, sufficient curing and crosslinking can be achieved, the good grinding and cutting performance is obtained, meanwhile, the grinding reaction is decomposed, and slag is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of grinding wheel structures, in particular to a light-colored and dust-free grinding wheel structure. Background Art

[0002] With the development of industry and technology within the industry, we have found that there is a great demand for light-colored and colored grinding wheels in the market. The phenolic resin currently used in resin grinding wheels generally uses urotropine as a curing agent to cure and color the grinding wheels. Generally, the post-curing temperature is high, which will cause the resin color to turn black-brown, and the phenol in the resin will also change due to hydroxyl oxidation. At present, light-colored resin grinding wheels are generally manufactured by lowering the post-curing temperature, but due to insufficient post-curing temperature, the grinding wheel itself will not be fully cured, the brittleness will increase, the grinding efficiency will be reduced, and the dust will increase. Now a light-colored and dust-free grinding wheel structure is needed.

[0003] First, the grinding wheel structure needs to be installed before use, and the stability of the existing grinding wheel structure during installation needs to be further improved, which easily leads to the loosening of the grinding wheel structure during use, making the grinding wheel structure not convenient to operate; secondly, the surface temperature of the grinding wheel structure will increase during use, and some dust and debris will be generated. The heat dissipation and chip removal effect of the existing grinding wheel structure during use is not good enough, which reduces the structural strength of the grinding wheel structure body and the abrasive layer when the grinding wheel structure is used, increases the possibility of breakage of the grinding wheel structure body and the abrasive layer during operation, and greatly shortens the service life of the grinding wheel structure; thirdly, the resin color of the grinding wheel structure turns black-brown when it is used, and more dust is generated. The existing grinding wheel structure usually does not have the function of light color and dust-free when in use, which makes it impossible to significantly improve the grinding and cutting performance of the grinding wheel structure body and the abrasive layer when the grinding wheel structure is used, and cannot achieve sufficient curing and cross-linking, and at the same time, increases the generation of slag. Utility Model Content

[0004] The purpose of the utility model is to provide a light-colored and dust-free grinding wheel structure to solve the problems in the above-mentioned background technology that the stability of the grinding wheel structure during installation needs to be further improved, the heat dissipation and chip removal effect is not good enough, and it usually does not have the light-colored and dust-free function.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a light-colored dust-free grinding wheel structure, comprising a grinding wheel structure body, an abrasive layer is installed on the surface of the grinding wheel structure body, a frame is arranged on the surface of the grinding wheel structure body, a fixing ring is installed on the surface at the center position of the grinding wheel structure body, one end of the frame passes through the grinding wheel structure body and the frame and extends to the top of the frame, the surfaces of the grinding wheel structure body, the fixing ring and the frame are all provided with a stable mounting mechanism, the interior of the stable mounting mechanism includes a guide slider, a guide slot, a mounting stud, a fixing screw hole and an arc-shaped clamping plate, the surface of the grinding wheel structure body is provided with a light-colored dust-free mechanism, the interior of the light-colored dust-free mechanism includes a phenolic resin layer, an adhesive layer and a light-colored dust-free part, the surfaces of the grinding wheel structure body and the fixing ring are both provided with a heat dissipation and chip removal mechanism, the interior of the heat dissipation and chip removal mechanism includes an inner chip removal groove, a heat dissipation hole and a heat dissipation and chip removal part.

[0006] Preferably, the light-colored dust-free part is arranged on the surface of the grinding wheel structure body, the light-colored dust-free part is composed of a melamine layer and an epoxy resin layer, the inner wall of the grinding wheel structure body is covered with an epoxy resin layer, the surface of the grinding wheel structure body is arranged with a melamine layer, the surface of the melamine layer is bonded to the surface of the epoxy resin layer away from the grinding wheel structure body, the surface of the grinding wheel structure body is covered with a phenolic resin layer, and the surface of the phenolic resin layer is bonded to the surface of the melamine layer away from the epoxy resin layer.

[0007] Preferably, an adhesive layer is provided on the surface of the phenolic resin layer, and the surface of the adhesive layer is bonded to the surface of the phenolic resin layer away from the melamine layer. The epoxy resin layer is the first curing agent and the melamine layer is the second curing agent, which can greatly reduce the residual phenolic hydroxyl component in the resin powder during the curing process and prevent the resin from being oxidized and blackened.

[0008] Preferably, guide sliders are installed on the surface of the frame, guide grooves are opened on the inner wall of the grinding wheel structure body, the guide grooves and the surface of the guide sliders are slidably matched with each other, fixing screw holes are opened on the inner wall of the fixing ring, and the surface of the fixing ring is threadedly connected with mounting studs, one end of the mounting studs extends to the interior of the fixing ring, and the mounting studs and the inner wall of the fixing screw holes are rotatably matched with each other.

[0009] Preferably, the interior of the fixing ring is provided with an arc-shaped clamping plate for preventing the frame from being loosened, and the surface of the arc-shaped clamping plate and the surface of the mounting stud are rotationally matched with each other, and the surface of the arc-shaped clamping plate is in contact with the surface of the frame.

[0010] Preferably, the heat dissipation and chip removal part is arranged on the surface of the grinding wheel structure body and the fixed ring, and the heat dissipation and chip removal part is composed of a through groove body and an external chip removal groove. The surface of the grinding wheel structure body is provided with heat dissipation holes for dissipating the surface of the grinding wheel structure body, and the heat dissipation holes are respectively located on both sides of the fixed ring.

[0011] Preferably, the surface of the abrasive layer is provided with inner chip grooves at equal intervals, and the surface of the abrasive layer is provided with outer chip grooves at equal intervals, and the outer chip grooves are connected to the outside of the abrasive layer.

[0012] Preferably, the surface of the abrasive layer is provided with through groove bodies with equal spacing, the through groove bodies are connected to the inside of the inner chip groove, the through groove bodies are connected to the inside of the outer chip groove, and the outer chip groove is connected to the surface.

[0013] Compared with the prior art, the utility model has the following beneficial effects: the light-colored and dust-free grinding wheel structure not only enables the grinding wheel structure body and the abrasive layer to be stably mounted on the surface of the frame when the grinding wheel structure is used, thereby avoiding the phenomenon of the grinding wheel structure being loosened during use, making the grinding wheel structure more convenient to operate, and enabling the grinding wheel structure to improve the structural strength of the grinding wheel structure body and the abrasive layer when in use, and to efficiently dissipate heat during use, thereby reducing the phenomenon of the grinding wheel structure body and the abrasive layer being broken during operation, thereby greatly extending the service life of the grinding wheel structure, and enabling the grinding wheel structure to significantly improve the grinding and cutting performance of the grinding wheel structure body and the abrasive layer when in use, thereby achieving sufficient curing and cross-linking, thereby obtaining good grinding and cutting performance, and at the same time, decomposing the grinding reaction and reducing the generation of slag;

[0014] 1. By providing a stable installation mechanism, the user pushes the frame body so that the frame body drives the guide slider to slide inside the guide slide groove, and the frame body is guided under the joint action of the guide slider and the guide slide groove. At this time, one end of the frame body passes through the fixing ring and extends to the inside of the fixing ring. The user rotates the installation stud on the surface of the fixing ring, and drives the installation stud to move under the thread cooperation of the installation stud and the fixing screw hole. At this time, the installation stud drives the arc-shaped clamping plate to move to fit with the surface of the frame body, and drives the arc-shaped clamping plate to move under the action of the installation stud. Under the joint action of the installation stud and the arc-shaped clamping plate, the grinding wheel structure body and the abrasive layer are installed on the surface of the frame body, thereby realizing the function of stable installation of the grinding wheel structure, so that the grinding wheel structure body and the abrasive layer can be stably installed on the surface of the frame body when in use, avoiding the phenomenon of loosening of the grinding wheel structure during use, making the grinding wheel structure more convenient to operate;

[0015] 2. By providing a heat dissipation and chip removal mechanism, the heat on the surface of the grinding wheel structure body is dissipated through the heat dissipation holes under the action of the heat dissipation holes. At this time, some debris is generated during grinding, and the debris enters the interior of the outer chip removal groove, and then enters the interior of the through-groove body through the outer chip removal groove. Subsequently, the waste chips inside the through-groove body enter the interior of the inner chip removal groove, and then are discharged from the surface of the grinding wheel structure body and the abrasive layer through the inner chip removal groove, which facilitates the chip removal of the debris and dust generated during grinding, and realizes the function of heat dissipation and chip removal of the grinding wheel structure, so that the grinding wheel structure can improve the structural strength of the grinding wheel structure body and the abrasive layer when in use, and can perform efficient heat dissipation during use, reduce the fragmentation of the grinding wheel structure body and the abrasive layer during operation, and greatly extend the service life of the grinding wheel structure;

[0016] 3. By setting up a light-colored dust-free mechanism, since the epoxy resin layer is the first curing agent and the melamine layer is the second curing agent, the phenolic hydroxyl components remaining in the resin powder can be greatly reduced during the curing process, and the resin can be prevented from being oxidized and blackened. In addition, the phenolic resin layer can be cured into a network structure, which can greatly improve the grinding and cutting performance of the grinding wheel structure body and the abrasive layer, and can achieve sufficient curing and cross-linking, thereby obtaining good grinding and cutting performance. At the same time, the grinding reaction is decomposed to reduce the generation of slag. In addition, the number average molecular weight of the thermoplastic phenolic resin layer is within a certain value, and its softening temperature can reach above 90°C, which fully improves the processing, storage and transportation stability of the modified phenolic resin powder, and can play a good role in melt-bonding abrasives during the heating process. The phenolic hydroxyl groups in the phenolic resin layer will be between 140 and 160°C. ℃, it reacts with the epoxy groups in the epoxy resin layer to form ether groups, thereby reducing the benzoquinone content. As the curing temperature reaches 160-180℃, the epoxy resin layer and the phenolic resin layer will gradually react with the melamine layer to form an effective network structure. The epoxy resin layer and the phenolic resin layer can better interact with each other without stratification during the heating, melting and curing reaction process. At the same time, it can improve the heat resistance, rigidity and wear resistance of the resin, and can also increase the softening temperature of the epoxy resin, and improve the processing, storage and transportation stability of the modified phenolic resin powder, so as to realize the light-colored and dust-free function of the grinding wheel structure, so that the grinding and cutting performance of the grinding wheel structure body and the abrasive layer can be greatly improved when the grinding wheel structure is used, and sufficient curing and cross-linking can be achieved, so as to obtain good grinding and cutting performance. At the same time, the grinding reaction is decomposed to reduce the generation of slag. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0019] Figure 3It is a schematic diagram of the cross-sectional structure of the utility model in a top view;

[0020] Figure 4 For the utility model Figure 2 A schematic diagram of the enlarged structure of the light-colored dust-free mechanism;

[0021] Figure 5 For the utility model Figure 2 Schematic diagram of the enlarged structure of the stable mounting mechanism.

[0022] In the figure: 1. Grinding wheel structure body; 101. Abrasive layer; 102. Fixed ring; 103. Frame; 2. Light-colored dust-free mechanism; 201. Phenolic resin layer; 202. Adhesive layer; 203. Light-colored dust-free part; 2031. Melamine layer; 2032. Epoxy resin layer; 3. Stable installation mechanism; 301. Guide slider; 302. Guide slide groove; 303. Mounting stud; 304. Fixed screw hole; 305. Arc-shaped splint; 4. Heat dissipation and chip removal mechanism; 401. Internal chip removal groove; 402. Heat dissipation hole; 403. Heat dissipation and chip removal part; 4031. Through groove body; 4032. External chip removal groove. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0024] The utility model provides a light-colored dust-free grinding wheel structure. Figure 1 and Figure 2 As shown, it includes a grinding wheel structure body 1, an abrasive layer 101 is installed on the surface of the grinding wheel structure body 1, a frame 103 is arranged on the surface of the grinding wheel structure body 1, a fixing ring 102 is installed on the surface at the center position of the grinding wheel structure body 1, and one end of the frame 103 penetrates the grinding wheel structure body 1 and the frame 103 and extends to the top of the frame 103.

[0025] Furthermore, if Figure 2 and Figure 5As shown, the surfaces of the grinding wheel structure body 1, the fixing ring 102 and the frame 103 are all provided with a stable mounting mechanism 3, the interior of the stable mounting mechanism 3 includes a guide slider 301, a guide slot 302, a mounting stud 303, a fixing screw hole 304 and an arc-shaped clamping plate 305, the surface of the frame 103 is all provided with a guide slider 301, the inner wall of the grinding wheel structure body 1 is provided with a guide slot 302, the guide slot 302 and the surface of the guide slider 301 are slidably matched with each other, and the inner wall of the fixing ring 102 is A fixing screw hole 304 is opened, and the surface of the fixing ring 102 is threadedly connected with a mounting stud 303, one end of the mounting stud 303 extends to the inside of the fixing ring 102, and the mounting stud 303 and the inner wall of the fixing screw hole 304 rotate with each other, and the inside of the fixing ring 102 is provided with an arc-shaped clamping plate 305 for preventing the frame 103 from loosening, and the surface of the arc-shaped clamping plate 305 and the surface of the mounting stud 303 rotate with each other, and the surface of the arc-shaped clamping plate 305 is in contact with the surface of the frame 103.

[0026] When the user pushes the frame 103, the frame 103 drives the guide slider 301 to slide inside the guide slot 302. The frame 103 is guided by the joint action of the guide slider 301 and the guide slot 302. At this time, one end of the frame 103 passes through the fixing ring 102 and extends to the inside of the fixing ring 102. The user rotates the mounting stud 303 on the surface of the fixing ring 102, and drives the mounting stud 303 to move under the threaded cooperation between the mounting stud 303 and the fixing screw hole 304. At this time, the mounting stud 303 drives the arc-shaped clamping plate 305 to move to fit the surface of the frame 103. The arc-shaped clamping plate 305 is driven to move under the action of the mounting stud 303. Under the joint action of the mounting stud 303 and the arc-shaped clamping plate 305, the grinding wheel structure body 1 and the abrasive layer 101 are installed on the surface of the frame 103 to realize the function of stable installation of the grinding wheel structure.

[0027] Furthermore, if Figure 2 and Figure 4As shown, the surface of the grinding wheel structure body 1 is provided with a light-colored dust-free mechanism 2, the interior of the light-colored dust-free mechanism 2 includes a phenolic resin layer 201, an adhesive layer 202 and a light-colored dust-free portion 203, the light-colored dust-free portion 203 is provided on the surface of the grinding wheel structure body 1, the light-colored dust-free portion 203 is composed of a melamine layer 2031 and an epoxy resin layer 2032, the inner wall of the grinding wheel structure body 1 is covered with an epoxy resin layer 2032, the surface of the grinding wheel structure body 1 is provided with a melamine layer 2031, the surface of the melamine layer 2031 and the surface of the epoxy resin layer 2032 away from the grinding wheel structure body 1 The surface of the grinding wheel structure body 1 is covered with a phenolic resin layer 201, and the surface of the phenolic resin layer 201 is bonded to the surface of the melamine layer 2031 away from the epoxy resin layer 2032. The surface of the phenolic resin layer 201 is provided with an adhesive layer 202, and the surface of the adhesive layer 202 is bonded to the surface of the phenolic resin layer 201 away from the melamine layer 2031. The epoxy resin layer 2032 is the first curing agent, and the melamine layer 2031 is the second curing agent. The components of the phenolic hydroxyl groups remaining in the resin powder can be greatly reduced during the curing process to prevent the resin from being oxidized and blackened.

[0028] During implementation, since the epoxy resin layer 2032 is the first curing agent and the melamine layer 2031 is the second curing agent, the phenolic hydroxyl components remaining in the resin powder can be greatly reduced during the curing process, and the resin can be prevented from being oxidized and blackened. In addition, the phenolic resin layer 201 can be cured into a network structure, which can greatly improve the grinding and cutting performance of the grinding wheel structure body 1 and the abrasive layer 101, and can achieve sufficient curing and cross-linking, thereby obtaining good grinding and cutting performance. At the same time, the grinding reaction is decomposed to reduce the generation of slag. In addition, the number average molecular weight of the thermoplastic phenolic resin layer 201 is within a certain value, and its softening temperature can reach above 90°C, which fully improves the processing, storage and transportation stability of the modified phenolic resin powder, and can be well heated during the heating process. It plays the role of melt-bonded abrasive. The phenolic hydroxyl group in the phenolic resin layer 201 will react with the epoxy group in the epoxy resin layer 2032 at 140-160°C to form an ether group, thereby reducing the benzoquinone content. As the curing temperature reaches 160-180°C, the epoxy resin layer 2032 and the phenolic resin layer 201 will gradually react with the melamine layer 2031 to form an effective network structure. The epoxy resin layer 2032 and the phenolic resin layer 201 can better interact with each other without stratification during the heating, melting and curing reaction process. At the same time, the heat resistance, rigidity and wear resistance of the resin can be improved, and the softening temperature of the epoxy resin can be increased. The processing, storage and transportation stability of the modified phenolic resin powder are improved to achieve the function of light-colored and dust-free grinding wheel structure.

[0029] Furthermore, if Figure 3As shown, the surfaces of the grinding wheel structure body 1 and the fixed ring 102 are both provided with a heat dissipation and chip removal mechanism 4, the interior of the heat dissipation and chip removal mechanism 4 includes an inner chip removal groove 401, a heat dissipation hole 402 and a heat dissipation and chip removal portion 403, the heat dissipation and chip removal portion 403 is arranged on the surfaces of the grinding wheel structure body 1 and the fixed ring 102, the heat dissipation and chip removal portion 403 is composed of a through groove body 4031 and an outer chip removal groove 4032, the surface of the grinding wheel structure body 1 is provided with a heat dissipation hole 402 for heat dissipation treatment of the surface of the grinding wheel structure body 1, and the heat dissipation hole 402 is divided into Located on both sides of the fixed ring 102, the surface of the abrasive layer 101 is provided with inner chip grooves 401 with equal intervals, the surface of the abrasive layer 101 is provided with outer chip grooves 4032 with equal intervals, the outer chip grooves 4032 are connected to the outside of the abrasive layer 101, the surface of the abrasive layer 101 is provided with through groove bodies 4031 with equal intervals, the through groove bodies 4031 are connected to the inside of the inner chip grooves 401, the through groove bodies 4031 are connected to the inside of the outer chip grooves 4032, and the outer chip grooves 4032 are connected to the surface.

[0030] During implementation, the heat generated on the surface of the grinding wheel structure body 1 is dissipated through the heat dissipation holes 402 under the action of the heat dissipation holes 402. At this time, some debris is generated during grinding, and the debris enters the interior of the outer chip groove 4032, and then enters the interior of the through-groove body 4031 through the outer chip groove 4032. Subsequently, the waste chips inside the through-groove body 4031 enter the interior of the inner chip groove 401, and then are discharged from the surface of the grinding wheel structure body 1 and the abrasive layer 101 through the inner chip groove 401, so as to facilitate the chip removal treatment of the debris and dust generated during grinding, so as to realize the function of heat dissipation and chip removal of the grinding wheel structure.

[0031] Working principle: When in use, first place the grinding wheel structure body 1 at the designated position, the user places the frame 103 on one side of the grinding wheel structure body 1, and the user pushes the frame 103 so that the frame 103 drives the guide slider 301 to slide inside the guide slot 302, and the frame 103 is guided under the joint action of the guide slider 301 and the guide slot 302. At this time, one end of the frame 103 passes through the fixing ring 102 and extends to the inside of the fixing ring 102. The user rotates the mounting stud 303 on the surface of the fixing ring 102, and the mounting stud 303 drives the mounting screw hole 304 to engage with the thread of the fixing screw hole 304. The column 303 moves. At this time, the mounting stud 303 drives the arc-shaped clamping plate 305 to move to fit with the surface of the frame 103. The arc-shaped clamping plate 305 is driven to move under the action of the mounting stud 303. Under the joint action of the mounting stud 303 and the arc-shaped clamping plate 305, the grinding wheel structure body 1 and the abrasive layer 101 are installed on the surface of the frame 103 to achieve the function of stable installation of the grinding wheel structure, so that the grinding wheel structure body 1 and the abrasive layer 101 can be stably installed on the surface of the frame 103 when the grinding wheel structure is in use, avoiding the loosening of the grinding wheel structure during use, making the grinding wheel structure more convenient to operate.

[0032] Subsequently, the industrial product is ground under the action of the abrasive layer 101. When the grinding wheel structure body 1 and the abrasive layer 101 are working, the temperature of the surface of the grinding wheel structure body 1 and the abrasive layer 101 will continue to rise. At this time, under the action of the heat dissipation holes 402, the heat on the surface of the grinding wheel structure body 1 is dissipated through the heat dissipation holes 402. At this time, some debris is generated during grinding, and the debris enters the interior of the outer chip groove 4032, and then enters the interior of the through-slot body 4031 through the outer chip groove 4032. Subsequently, the through-slot body 403 1 The waste chips inside enter the inner chip groove 401, and then are discharged from the surface of the grinding wheel structure body 1 and the abrasive layer 101 through the inner chip groove 401, so that the chips and dust generated during grinding can be easily removed to realize the function of heat dissipation and chip removal of the grinding wheel structure, so that the structural strength of the grinding wheel structure body 1 and the abrasive layer 101 can be improved when the grinding wheel structure is used, and efficient heat dissipation can be performed when in use, reducing the occurrence of fragmentation of the grinding wheel structure body 1 and the abrasive layer 101 during operation, so that the service life of the grinding wheel structure is greatly extended.

[0033] Subsequently, since the epoxy resin layer 2032 is the first curing agent and the melamine layer 2031 is the second curing agent, the phenolic hydroxyl components remaining in the resin powder can be greatly reduced during the curing process, and the resin can be prevented from being oxidized and blackened. In addition, the phenolic resin layer 201 can be cured into a network structure, which can greatly improve the grinding and cutting performance of the grinding wheel structure body 1 and the abrasive layer 101, and can achieve sufficient curing and cross-linking, thereby obtaining good grinding and cutting performance. At the same time, the grinding reaction is decomposed to reduce the generation of slag. In addition, the number average molecular weight of the thermoplastic phenolic resin layer 201 is within a certain value, and its softening temperature can reach above 90°C, which fully improves the processing, storage and transportation stability of the modified phenolic resin powder, and can play a good role in melting and bonding abrasives during the heating process. The phenolic hydroxyl groups in the phenolic resin layer 201 will react with those in the epoxy resin layer 2032 at 140-160°C. The epoxy groups react to form ether groups, thereby reducing the benzoquinone content. As the curing temperature reaches 160-180°C, the epoxy resin layer 2032 and the phenolic resin layer 201 will gradually react with the melamine layer 2031 to form an effective network structure. The epoxy resin layer 2032 and the phenolic resin layer 201 can better interact with each other without stratification during the heating, melting and curing reaction process, and at the same time can improve the heat resistance, rigidity and wear resistance of the resin, and can also increase the softening temperature of the epoxy resin, and improve the processing, storage and transportation stability of the modified phenolic resin powder, so as to achieve the light-colored and dust-free function of the grinding wheel structure, so that the grinding and cutting performance of the grinding wheel structure body 1 and the abrasive layer 101 can be greatly improved when the grinding wheel structure is used, and sufficient curing and cross-linking can be achieved, so as to obtain good grinding and cutting performance. At the same time, the grinding reaction is decomposed, the generation of slag is reduced, and finally the use of the grinding wheel structure is completed.

[0034] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A light-colored, dust-free grinding wheel structure, comprising a grinding wheel structure body (1), characterized in that: An abrasive layer (101) is installed on the surface of the grinding wheel structure body (1), a frame (103) is arranged on the surface of the grinding wheel structure body (1), a fixing ring (102) is installed on the surface at the center position of the grinding wheel structure body (1), one end of the frame (103) penetrates the grinding wheel structure body (1) and the frame (103) and extends to the top of the frame (103), and the surfaces of the grinding wheel structure body (1), the fixing ring (102) and the frame (103) are all provided with a stable installation mechanism (3), and the interior of the stable installation mechanism (3) includes a guide slider (301), A guide slide groove (302), a mounting stud (303), a fixing screw hole (304) and an arc-shaped clamping plate (305); a light-colored dust-free mechanism (2) is arranged on the surface of the grinding wheel structure body (1); the interior of the light-colored dust-free mechanism (2) includes a phenolic resin layer (201), an adhesive layer (202) and a light-colored dust-free portion (203); a heat dissipation and chip removal mechanism (4) is arranged on the surface of the grinding wheel structure body (1) and the fixing ring (102); the interior of the heat dissipation and chip removal mechanism (4) includes an inner chip removal groove (401), a heat dissipation hole (402) and a heat dissipation and chip removal portion (403).

2. A light-colored, dust-free grinding wheel structure according to claim 1, characterized in that: The light-colored dust-free portion (203) is arranged on the surface of the grinding wheel structure body (1), the light-colored dust-free portion (203) is composed of a melamine layer (2031) and an epoxy resin layer (2032), the inner wall of the grinding wheel structure body (1) is covered with the epoxy resin layer (2032), the surface of the grinding wheel structure body (1) is provided with the melamine layer (2031), the surface of the melamine layer (2031) is bonded to the surface of the epoxy resin layer (2032) on a side away from the grinding wheel structure body (1), and the surface of the grinding wheel structure body (1) is covered with a phenolic resin layer (201), and the surface of the phenolic resin layer (201) is bonded to the surface of the melamine layer (2031) on a side away from the epoxy resin layer (2032).

3. A light-colored, dust-free grinding wheel structure according to claim 2, characterized in that: The surface of the phenolic resin layer (201) is provided with an adhesive layer (202), and the surface of the adhesive layer (202) is bonded to the surface of the phenolic resin layer (201) on the side away from the melamine layer (2031). The epoxy resin layer (2032) is a first curing agent, and the melamine layer (2031) is a second curing agent. The components of the phenolic hydroxyl groups remaining in the resin powder can be greatly reduced during the curing process, thereby preventing the resin from being oxidized and blackened.

4. The light-colored, dust-free grinding wheel structure according to claim 1, characterized in that: The surface of the frame (103) is installed with a guide slider (301), the inner wall of the grinding wheel structure body (1) is provided with a guide slot (302), the guide slot (302) and the surface of the guide slider (301) are slidably matched with each other, the inner wall of the fixing ring (102) is provided with a fixing screw hole (304), the surface of the fixing ring (102) is threadedly connected with a mounting stud (303), one end of the mounting stud (303) extends to the inside of the fixing ring (102), and the mounting stud (303) and the inner wall of the fixing screw hole (304) are rotatably matched with each other.

5. The light-colored, dust-free grinding wheel structure according to claim 1, characterized in that: The interior of the fixing ring (102) is provided with an arc-shaped clamping plate (305) for preventing the frame (103) from loosening. The surface of the arc-shaped clamping plate (305) and the surface of the mounting stud (303) are rotatably matched with each other, and the surface of the arc-shaped clamping plate (305) is in contact with the surface of the frame (103).

6. The light-colored, dust-free grinding wheel structure according to claim 1, characterized in that: The heat dissipation and chip removal portion (403) is arranged on the surface of the grinding wheel structure body (1) and the fixed ring (102), and the heat dissipation and chip removal portion (403) is composed of a through groove body (4031) and an external chip removal groove (4032). The surface of the grinding wheel structure body (1) is provided with heat dissipation holes (402) for dissipating heat from the surface of the grinding wheel structure body (1), and the heat dissipation holes (402) are respectively located on both sides of the fixed ring (102).

7. The light-colored, dust-free grinding wheel structure according to claim 1, characterized in that: The surface of the abrasive layer (101) is provided with inner chip grooves (401) at equal intervals, and the surface of the abrasive layer (101) is provided with outer chip grooves (4032) at equal intervals, and the outer chip grooves (4032) are connected to the outside of the abrasive layer (101).

8. The light-colored, dust-free grinding wheel structure according to claim 1, characterized in that: The surface of the abrasive layer (101) is provided with through groove bodies (4031) at equal intervals, the through groove bodies (4031) are connected to the inside of the inner chip groove (401), the through groove bodies (4031) are connected to the inside of the outer chip groove (4032), and the outer chip groove (4032) is connected to the surface.