Heat accumulating type air conditioner structure adopting semiconductor refrigeration principle

Abstract

The utility model discloses a heat accumulating type air conditioner structure adopting a semiconductor refrigeration principle, and relates to the technical field of semiconductor refrigeration, the heat accumulating type air conditioner structure adopting the semiconductor refrigeration principle is characterized in that a semiconductor refrigeration sheet is electrified, so that one surface of the semiconductor refrigeration sheet attached to a radiating fin is refrigerated, one surface of the semiconductor refrigeration sheet attached to a water tank is heated, and a cross-flow fan is driven to work; indoor air is sucked into the first containing space through the air inlet and cooled through convection heat exchange of the cooling fins, cold air is blown out from the low-temperature air through the air outlet, refrigeration is completed, heat at the hot end of the semiconductor refrigeration sheet is transmitted to the water tank, heat exchange is conducted between the heat and water in the water tank, the heat is absorbed by the water, and the heat exchange efficiency is improved. The device can be directly installed on an indoor wall of a toilet or a kitchen, holes and pipelines do not need to be additionally formed in the wall, and the device is practical, convenient to use and low in cost.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration, in particular to a heat storage type air conditioning structure adopting the semiconductor refrigeration principle. Background Art

[0002] Semiconductor refrigeration is also known as electronic refrigeration or thermoelectric refrigeration. It uses a PN junction composed of special semiconductor materials to form a thermocouple pair to produce the Peltier effect, which is a new refrigeration method using direct current cooling.

[0003] Existing semiconductor refrigeration air conditioners need to discharge the heat of the hot end to the outdoor environment during cooling work, which is easy to affect the outdoor environment. When discharging to the outdoor environment, it is usually necessary to drill holes in the wall to arrange pipelines, and the hot end of the semiconductor refrigeration air conditioner is installed outdoors, and the cold end is installed indoors. However, in a home environment, it is only convenient to install semiconductor refrigeration air conditioners in bedrooms and living rooms, because it is convenient to drill holes on the walls of the bedroom and the shell facing the outdoors, and the pipeline layout is simple. For bathrooms and kitchens, which are generally located in the middle of the room, the holes need to pass through multiple walls, which is difficult to arrange. Even if they are arranged, the pipelines are long, unsightly, and costly. Therefore, it is usually difficult to install semiconductor refrigeration air conditioners in bathrooms or kitchens. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a heat storage air conditioning structure using a semiconductor refrigeration principle to solve the problem that it is difficult to arrange pipelines in a bathroom or kitchen to install a semiconductor refrigeration air conditioner and discharge heat.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a heat storage type air conditioning structure using semiconductor refrigeration principle, comprising:

[0006] Crossflow fan;

[0007] At least one semiconductor cooling chip;

[0008] A heat sink is attached to one side of the semiconductor cooling sheet;

[0009] A water tank is attached to the other side of the semiconductor cooling sheet, the water tank is filled with water, and the water tank is provided with a water inlet and a water outlet;

[0010] The cover plate is fixed to one side of the water tank and forms a first accommodating space with the water tank. The semiconductor refrigeration plate, heat sink and cross-flow fan are all located in the first accommodating space. An air inlet and an air outlet are provided on the cover plate. The heat sink is located between the air outlet and the air inlet, and the cross-flow fan is located at the air outlet.

[0011] Preferably, the water tank has a flat rectangular structure, and comprises a cover plate and a box body with an opening, wherein the cover plate is used to close the opening of the box body, and the semiconductor refrigeration sheet is attached to the cover plate.

[0012] Preferably, the heat sink and the cover plate are made of aluminum alloy, copper or ceramic.

[0013] Preferably, the water inlet and the water outlet are opened on the box body, the water inlet is connected to the household water inlet pipeline, the water outlet is connected to the household water pipeline, and the water inlet is located above the water outlet.

[0014] Preferably, a plurality of first heat dissipation fins are provided on a side of the heat sink facing the cover plate, and the first heat dissipation fins are located between the air inlet and the air outlet.

[0015] Preferably, a heat insulating member is provided on the periphery of the semiconductor refrigeration plate, and the area of ​​the heat insulating member is not less than the area of ​​the heat sink and the cover plate.

[0016] Preferably, a surrounding plate is provided on the side of the cover plate facing the heat sink, and the surrounding plate, the heat insulation component and the cover plate together form a second accommodating space, the heat sink, the first heat dissipating fins and the cross-flow fan are all located in the second accommodating space, the second accommodating space is located in the first accommodating space, and the air inlet and the air outlet are both connected to the second accommodating space.

[0017] Preferably, a plurality of second heat dissipating fins are provided on a side of the cover plate facing the box body.

[0018] Preferably, thermally conductive interface materials are filled between the bonding surfaces of the semiconductor refrigeration plate, the heat sink and the cover plate.

[0019] Compared with the prior art, the utility model can achieve the following beneficial effects:

[0020] (1) By energizing the semiconductor refrigeration sheet, the side of the refrigeration sheet that contacts the heat sink is cooled, and the side of the refrigeration sheet that contacts the water tank is heated, and the cross-flow fan is driven to work, so that the indoor air is sucked into the first accommodation space through the air inlet, and the air is cooled by convection heat exchange through the heat sink. The low-temperature air is finally blown out as cold air through the air outlet to complete the refrigeration. The heat at the hot end of the semiconductor refrigeration sheet is transferred to the water tank, and the heat is exchanged with the water in the water tank. The heat is absorbed by the water, and the heat is prevented from being dissipated into the environment, thereby avoiding affecting the external environment. This device can be directly installed on the indoor wall of the bathroom or kitchen, without the need to drill holes or install pipelines on the wall. It is practical, convenient, and low-cost.

[0021] (2) After a certain period of use, when the room temperature water in the water tank rises to a certain temperature and cannot be used for heat exchange, the water in the water tank can be replaced through the water inlet and outlet. The replaced water can be stored for secondary use without causing waste of water resources. It is particularly suitable for places where water is needed, such as bathrooms or kitchens. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0023] Figure 2 For this utility model Figure 1 Schematic diagram of explosion structure;

[0024] Figure 3 This is a schematic diagram of the structure of the cover plate, box body, water inlet and water outlet of the utility model;

[0025] Figure 4 It is a schematic diagram of the structure of the enclosure, cover plate, crossflow fan, heat sink and first heat sink fin of the utility model;

[0026] Among them: 1. cover plate; 11. air inlet; 12. air outlet; 2. cross-flow fan; 3. heat sink; 31. first heat sink fin; 4. enclosure; 5. semiconductor cooling plate; 6. cover plate; 61. second heat sink fin; 7. box body; 71. water inlet; 72. water outlet; 8. thermal insulation. DETAILED DESCRIPTION

[0027] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments. However, the following embodiments are only preferred embodiments of the present invention, not all of them. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work all belong to the protection scope of the present invention. The experimental methods in the following embodiments are conventional methods unless otherwise specified. The materials, reagents, etc. used in the following embodiments are all commercially available unless otherwise specified.

[0028] like Figure 1-Figure 4 As shown, the utility model provides a heat storage type air conditioning structure using the semiconductor refrigeration principle, including a cross-flow fan 2, at least one semiconductor refrigeration sheet 5, a heat sink 3, a water tank and a cover plate 1;

[0029] The heat sink 3 is attached to one side of the semiconductor cooling sheet 5;

[0030] The water tank is attached to the other side of the semiconductor cooling sheet 5, and water (at room temperature initially) is provided in the water tank. A water inlet 71 and a water outlet 72 are provided on the water tank.

[0031] The cover plate 1 is fixed to one side of the water tank and forms a first accommodation space with the water tank. The semiconductor cooling sheet 5, the heat sink 3 and the cross-flow fan 2 are all located in the first accommodation space. An air inlet 11 and an air outlet 12 are provided on the cover plate 1. The heat sink 3 is located between the air outlet 12 and the air inlet 11, and the cross-flow fan 2 is located at the air outlet 12.

[0032] Here we take refrigeration as an example:

[0033] By energizing the semiconductor refrigeration sheet 5, the side thereof in contact with the heat sink 3 is cooled, and the side thereof in contact with the water tank is heated, and the cross-flow fan 2 is driven to work, so that the indoor air is sucked into the first accommodation space through the air inlet 11, and the air is cooled by convection heat exchange through the heat sink 3, and the low-temperature air is finally blown out as cold air through the air outlet 12, thereby completing the refrigeration. The heat at the hot end of the semiconductor refrigeration sheet 5 is transferred to the water tank, and the heat is exchanged with the water in the water tank, and the heat is absorbed by the water, so that the heat is prevented from being dissipated into the environment, thereby avoiding affecting the external environment. The device can be directly installed on the indoor wall of the bathroom or kitchen, without the need to drill holes or install pipelines on the wall, and is practical, convenient, and low-cost.

[0034] After being used for a certain period of time, when the room temperature water in the water tank rises to a certain temperature and cannot perform good heat exchange, the water in the water tank can be replaced through the water inlet 71 and the water outlet 72. The replaced water can be stored for secondary use without causing waste of water resources. It is particularly suitable for places where water is needed, such as bathrooms or kitchens.

[0035] like Figure 1-Figure 3 As shown, the air conditioner structure is a flat rectangular structure, the water tank includes a cover plate 6 and a box body 7 with an opening, the cover plate 6 is used to close the opening of the box body 7, and the semiconductor cooling sheet 5 is attached to the cover plate 6;

[0036] By setting up a flat rectangular air conditioning structure, the structure is relatively compact and small in size, and it is beautiful and convenient to install on the wall. The cover plate 6 can be connected to the box body 7 by welding or detachable sealing. The box body 7 can be made of non-thermal conductive materials or materials with poor thermal conductivity, so as to prevent heat from dissipating into the air as much as possible under the condition of cooling.

[0037] The heat sink 3 and the cover plate 6 are made of aluminum alloy, copper or ceramic. Since the greater the thermal conductivity of the material, the faster the heat transfer speed and the smaller the thermal resistance, the heat conduction effect can be improved by using these aluminum alloy, copper or ceramic materials with large thermal conductivity as the heat sink 3 and the cover plate 6. When the refrigeration work is done, the cover plate 6 and the water undergo natural convection heat exchange, and the heat can be absorbed by the water in the water tank.

[0038] Further, such as Figure 3As shown, the water inlet 71 and the water outlet 72 are provided on the box body 7. Specifically, the water inlet 71 is connected to the household water inlet pipeline through the water inlet pipe, and the water outlet 72 is connected to the household water pipeline (such as the toilet) through the water outlet pipe. The water inlet 71 is located above the water outlet 72, which is convenient for the water inlet into the water tank and the clean discharge of water when changing the water.

[0039] This air conditioning structure is suitable for local cooling in a small area, can work periodically, and can be easily replaced with water (usually changing the water once can maintain the cooling effect within half an hour, which can be controlled according to the size of the water tank. However, the space in the bathroom is small, and people usually use the bathroom for no more than half an hour each time, so a water tank that is too large is generally not used);

[0040] Take a water tank with a size of 20cm*30cm*4cm as an example. The volume of the water tank is about 2.4L. Assuming the density of water is 1kg / m3, the mass of water is also 2.4kg. Assuming the continuous working time t of the cooling mode is 12 minutes, that is, 720 seconds (hereinafter t is calculated in seconds), the specific heat capacity of water is 4200J / kg.℃, and the initial water temperature in the water tank is T s is 25℃, and is heated to the final water temperature T by the heat of the hot surface of the refrigeration plate f is 45℃, then according to the principle of thermodynamics, the heating power required for the water in the water tank is equal to C*m*(T f -T s ) / t=Qh, substituting the above data, we can get Qh=280W. According to the maximum COP (Coefficient Of Performance, also known as the refrigeration performance coefficient, which refers to the cooling capacity per unit power consumption) of a general refrigeration module of 0.6, the water tank can meet the needs of an air conditioner with a cooling capacity of 120W to work continuously for more than 12 minutes;

[0041] For example, when it is installed on the wall of the bathroom, the water inlet 71 is connected to the household water inlet pipeline through the water inlet pipe, and the water outlet 72 is connected to the household water pipeline (such as the toilet) through the water outlet pipe. Taking summer as an example, when people go to the toilet or take a bath, since the space in the bathroom is relatively closed and small, and the temperature is high, the air conditioning structure can be used for cooling to provide a cooling effect for the bathroom. After cooling, the heated water in the water tank is discharged into the water storage tank of the toilet, which will not cause waste of water resources (the specific pipe connection is a prior art and will not be repeated here);

[0042] At the same time, it is equivalent to the existing semiconductor refrigeration air conditioner, avoiding the trouble of designing an air cooling structure or a circulating water cooling structure at the heat dissipation end for cooling and heat dissipation, further occupying less space in the bathroom, with lower costs, and can be directly replaced by normal domestic water.

[0043] like Figure 2As shown, a plurality of first heat dissipation fins 31 are provided on the side of the heat sink 3 facing the cover plate 1, and the first heat dissipation fins 31 are located between the air inlet 11 and the air outlet 12;

[0044] By setting the first heat sink fin 31, the heat exchange area can be increased. When the semiconductor refrigeration plate 5 is cooling or heating, the overall temperature of the heat sink 3 will decrease or increase, and the airflow driven by the cross-flow fan 2 will sweep the surface of the first heat sink fin 31 of the heat sink 3 to achieve heat exchange between the air and the heat sink 3.

[0045] like Figure 2 As shown, a heat insulating member 8 is provided on the periphery of the semiconductor cooling sheet 5, and the area of ​​the heat insulating member 8 is not less than the area of ​​the heat sink 3 and the cover plate 6;

[0046] By providing the heat insulating member 8, the semiconductor refrigeration sheet 5 can be relatively isolated from the external environment, thereby providing good protection for the semiconductor refrigeration sheet 5, and at the same time reducing the heat transfer between the heat sink 3 and the cover plate 6, thereby enhancing the cooling or heating performance of the air conditioning structure;

[0047] Specifically, the heat insulating member 8 may be made of porous materials with low thermal conductivity such as rubber or plastic.

[0048] like Figure 2 and Figure 4 As shown, a side of the cover plate 1 facing the heat sink 3 is provided with a surrounding plate 4, and the surrounding plate 4, the heat insulating member 8 and the cover plate 1 are enclosed to form a second accommodation space, the heat sink 3, the first heat dissipating fins 31 and the cross-flow fan 2 are all located in the second accommodation space, the second accommodation space is located in the first accommodation space, and the air inlet 11 and the air outlet 12 are both connected to the second accommodation space;

[0049] Preferably, the top surface of the heat sink 3 is flush with the air inlet 11, the crossflow fan 2 is directly opposite the air outlet 12, and the width of the heat sink 3 is adapted to the width of the air inlet 11 and the air outlet 12 (such as Figure 4 shown);

[0050] By setting the enclosure 4, the volume of the first accommodating space is reduced. The optimal situation is that the second accommodating space is just connected with the air inlet 11 and the air outlet 12. At this time, the second accommodating space is the smallest, and the flow of air in the second accommodating space is reduced to the greatest extent, which facilitates the rapid discharge of air through the air outlet 12 after being cooled or heated.

[0051] like Figure 2 As shown, a plurality of second heat dissipation fins 61 are provided on the side of the cover plate 6 facing the box body 7. By providing the second heat dissipation fins 61, the heat dissipation area can be increased, so that the heat exchange efficiency between the cover plate 6 and the water in the water tank is higher.

[0052] The semiconductor cooling sheet 5 and the bonding surfaces of the heat sink 3 and the cover plate 6 are filled with thermal interface materials. The thermal interface materials can be thermal grease or thermal pads, so as to reduce the contact thermal resistance between them and improve the thermal conductivity effect.

[0053] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat storage air conditioning structure using semiconductor refrigeration principle, characterized in that: include: Crossflow fan (2); At least one semiconductor cooling sheet (5); The heat sink (3) is bonded to one side of the semiconductor cooling sheet (5); A water tank is attached to the other side of the semiconductor cooling sheet (5), the water tank contains water, and the water tank is provided with a water inlet (71) and a water outlet (72); The cover plate (1) is fixed to one side of the water tank and forms a first accommodation space with the water tank. The semiconductor refrigeration plate (5), the heat sink (3) and the cross-flow fan (2) are all located in the first accommodation space. The cover plate (1) is provided with an air inlet (11) and an air outlet (12). The heat sink (3) is located between the air outlet (12) and the air inlet (11), and the cross-flow fan (2) is located at the air outlet (12).

2. The heat storage air conditioning structure using semiconductor refrigeration principle according to claim 1 is characterized in that: The water tank has a flat rectangular structure, and comprises a cover plate (6) and a box body (7) with an opening. The cover plate (6) is used to close the opening of the box body (7), and the semiconductor cooling sheet (5) is fitted with the cover plate (6).

3. The heat storage type air conditioning structure using semiconductor refrigeration principle according to claim 2 is characterized in that: The heat sink (3) and the cover plate (6) are made of aluminum alloy, copper or ceramic.

4. The heat storage air conditioning structure using semiconductor refrigeration principle according to claim 2 is characterized in that: The water inlet (71) and the water outlet (72) are provided on the box body (7); the water inlet (71) is connected to a household water inlet pipeline, the water outlet (72) is connected to a household water pipeline, and the water inlet (71) is located above the water outlet (72).

5. The heat storage type air conditioning structure using semiconductor refrigeration principle according to claim 2 is characterized in that: A plurality of first heat dissipation fins (31) are provided on the side of the heat sink (3) facing the cover plate (1), and the first heat dissipation fins (31) are located between the air inlet (11) and the air outlet (12).

6. The heat storage type air conditioning structure using semiconductor refrigeration principle according to claim 5 is characterized in that: A heat insulating member (8) is provided on the periphery of the semiconductor cooling plate (5), and the area of ​​the heat insulating member (8) is not less than the area of ​​the heat sink (3) and the cover plate (6).

7. The heat storage type air conditioning structure using semiconductor refrigeration principle according to claim 6 is characterized in that: A side of the cover plate (1) facing the heat sink (3) is provided with a surrounding plate (4); the surrounding plate (4), the heat insulating member (8) and the cover plate (1) together form a second accommodation space; the heat sink (3), the first heat dissipating fins (31) and the cross-flow fan (2) are all located in the second accommodation space; the second accommodation space is located in the first accommodation space; and the air inlet (11) and the air outlet (12) are both connected to the second accommodation space.

8. The heat storage type air conditioning structure using semiconductor refrigeration principle according to claim 2 is characterized in that: A plurality of second heat dissipation fins (61) are provided on the side of the cover plate (6) facing the box body (7).

9. The heat storage type air conditioning structure using semiconductor refrigeration principle according to claim 2 is characterized in that: The semiconductor cooling sheet (5) and the bonding surfaces of the heat sink (3) and the cover plate (6) are filled with heat-conducting interface materials.

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