Chip temperature testing device

Abstract

The utility model provides a chip temperature testing device which comprises a testing jig used for testing a chip, a heat preservation cover arranged on the periphery of the testing jig in a covering mode, a lifting mechanism used for driving the heat preservation cover to ascend and descend, an air flow source used for providing heat or cold and a supporting seat, and the air flow source is communicated with the heat preservation cover. And the test fixture and the heat preservation cover are both placed on the supporting seat. According to the chip temperature testing device provided by the utility model, when the chip needs to be replaced, the heat preservation cover is lifted through the lifting mechanism, the testing jig is exposed, the airflow source still continuously provides airflow into the heat preservation cover, and the airflow blows to the testing jig, so that the contact between external air and the testing jig can be reduced, and the frosting of the testing jig is reduced. Meanwhile, heat or cold is provided through the air flow source, the temperature in the heat preservation cover can be rapidly changed, and therefore continuous testing can be achieved, and the testing efficiency is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of temperature testing, and more specifically relates to a chip temperature testing device. Background Art

[0002] Currently, the low-temperature testing equipment used in the CIS chip testing field are all refrigerators or high and low temperature test chambers. The minimum temperature requirement is a minus 40 degrees test environment. This type of testing equipment will cause the temperature of the test chamber to change suddenly when the test chamber is opened after each test. Therefore, the temperature needs to be readjusted to a low temperature state for the next test. Continuous testing is impossible, and the testing efficiency is extremely low. In addition, the test fixture is severely frosted and needs to be thawed regularly. Utility Model Content

[0003] The purpose of the embodiment of the utility model is to provide a chip temperature testing device to solve the technical problems existing in the prior art of low testing efficiency and easy frost formation on the testing fixture.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a chip temperature testing device, including a test fixture for testing the chip, a heat preservation cover arranged on the periphery of the test fixture, a lifting mechanism for driving the heat preservation cover to rise and fall, an air flow source for providing heat or cold, and a support seat, the air flow source is interconnected with the heat preservation cover, and the test fixture and the heat preservation cover are both placed on the support seat.

[0005] Optionally, a thermal insulation pad is provided on the support seat, and the test fixture and the thermal insulation cover are both placed on the thermal insulation pad.

[0006] Optionally, the lifting mechanism includes a lifting drive member fixed to the support seat and a guide assembly for guiding the heat-insulating cover, and a power output end of the lifting drive member is fixedly connected to the heat-insulating cover.

[0007] Optionally, the guide assembly includes a guide rod, a guide sleeve and a first connecting member, one end of the guide rod is fixed to the support seat, the guide sleeve is sleeved on the guide rod, one end of the first connecting member is fixedly connected to the guide sleeve, and the other end of the first connecting member is fixedly connected to the heat preservation cover.

[0008] Optionally, the lifting mechanism further includes a switch assembly, and the switch assembly is electrically connected to the lifting drive component.

[0009] Optionally, the chip temperature testing device further comprises an outer cover, which is arranged on the outer periphery of the heat preservation cover; the outer cover is provided with an avoidance hole and a chip placement hole, and the airflow pipe of the airflow source passes through the avoidance hole and is connected with the heat preservation cover.

[0010] Optionally, a thermal insulation glove is provided at the chip access hole.

[0011] Optionally, the outer cover is a transparent or translucent cover.

[0012] Optionally, the airflow source is an airflow meter.

[0013] Optionally, the chip temperature testing device further comprises a workbench, and the support seat is adjustably arranged on the workbench.

[0014] The chip temperature testing device provided by the utility model has the beneficial effect that: compared with the prior art, the chip temperature testing device of the utility model includes a test fixture, a heat preservation cover, a lifting mechanism, an airflow source and a support seat, the test fixture is arranged on the support seat, the heat preservation cover is arranged on the periphery of the test fixture, and can be lifted and lowered by the driving of the lifting mechanism. When the chip is tested, an airflow with cold or heat is transported into the heat preservation cover by the airflow source, so that the temperature of the heat preservation cover is maintained at a predetermined temperature, and the chip is temperature tested. When the chip needs to be replaced, the heat preservation cover is raised by the lifting mechanism, the test fixture is exposed, and the airflow source still continuously provides airflow into the heat preservation cover, and the airflow blows to the test fixture, which can reduce the contact between the outside air and the test fixture and reduce the frosting of the test fixture. At the same time, by providing heat or cold through the airflow source, the temperature in the heat preservation cover can be quickly changed, so continuous testing can be performed, and the test efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A three-dimensional structural diagram of a chip temperature testing device provided by an embodiment of the utility model;

[0017] Figure 2 A partial three-dimensional structural diagram of a chip temperature testing device provided by an embodiment of the utility model (the outer cover is not shown);

[0018] Figure 3 A three-dimensional structural diagram of the lifting mechanism, heat preservation cover, test fixture and support base provided in the embodiment of the utility model;

[0019] Figure 4 for Figure 3 Exploded structure diagram of the structure.

[0020] Among them, the reference numerals in the figure are:

[0021] 1-test fixture; 2-insulation cover; 21-first part; 22-second part; 3-lifting mechanism; 31-lifting drive member; 32-second connecting member; 33-guide assembly; 331-guide rod; 332-guide sleeve; 333-first connecting member; 34-switch assembly; 341-up switch; 342-down switch; 4-support seat; 41-insulation pad; 411-positioning groove; 5-chip tray; 6-outer cover; 61-avoidance hole; 62-chip picking and placing hole; 7-airflow source; 71-airflow pipe; 72-leak-proof joint; 8-workbench; 81-connecting hole. DETAILED DESCRIPTION

[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0023] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0024] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0026] Currently, the low-temperature testing equipment used in the CIS chip testing field are all refrigerators or high and low temperature test chambers. The minimum temperature requirement is a minus 40 degrees test environment. This type of testing equipment will cause the temperature of the test chamber to change suddenly when the test chamber is opened after each test. Therefore, the temperature needs to be readjusted to a low temperature state for the next test. Continuous testing is impossible, and the testing efficiency is extremely low. In addition, the test fixture is severely frosted and needs to be thawed regularly.

[0027] In order to alleviate the above-mentioned technical problems, the utility model proposes a new chip temperature testing device. The chip temperature testing device includes a test fixture, a heat preservation cover, a lifting mechanism, an airflow source and a support seat. The test fixture is arranged on the support seat, and the airflow source is used to provide heat or cold to the heat preservation cover so that the temperature inside the heat preservation cover reaches a predetermined temperature. By setting the airflow source to provide heat or cold to the heat preservation cover, firstly, the temperature inside the heat preservation cover can be switched quickly, so continuous testing can be performed, and it is suitable for a variety of test temperatures, such as low temperature testing, normal temperature testing, high temperature testing, etc. Secondly, air can be continuously blown into the test fixture, and even when the chip is replaced, the contact between the test fixture and the outside air can be reduced, thereby reducing the "frosting" of the test fixture.

[0028] The chip temperature testing device provided in the embodiment of the utility model is now described.

[0029] Please also read Figures 1 to 4 The chip temperature testing device includes a testing fixture 1, a heat preservation cover 2, a lifting mechanism 3, an air flow source 7 and a supporting seat 4.

[0030] The test fixture 1 is used to place and test the chip. The test fixture 1 generally has a chip slot for accommodating the chip. When the chip is placed in the chip slot of the test fixture 1, the chip is connected to the probe of the test fixture 1, thereby realizing the test of the chip.

[0031] The heat preservation cover 2 is arranged on the periphery of the test fixture 1, and the heat preservation cover 2 is placed on the support seat 4. The heat preservation cover 2 has an inner cavity. The heat preservation cover 2 and the support seat 4 together form a relatively independent space, and the test fixture 1 is arranged in the space. The heat preservation cover 2 has a certain heat preservation effect, which reduces the cold or heat leakage inside the heat preservation cover 2. The heat preservation cover 2 can be made of heat preservation material. Among them, the bottom of the heat preservation cover 2 is open, and the bottom cover of the heat preservation cover 2 is arranged on the support seat 4.

[0032] The test fixture 1 and the heat preservation cover 2 are both placed on the support seat 4. The heat preservation cover 2 can move relative to the support seat 4, so that the test fixture 1 can be exposed, so that the operator can replace or put the chip. The main function of the support seat 4 is to support the heat preservation cover 2 and the test fixture 1. The test fixture 1 and the heat preservation cover 2 can be placed directly on the support seat 4, without the need to use an additional connection structure to connect the test fixture 1 and the support seat 4, and without the need to connect the heat preservation cover 2 and the support seat 4. The structure is simpler and the heat preservation cover 2 is easier to move relative to the support seat 4.

[0033] The lifting mechanism 3 is used to drive the heat preservation cover 2 to rise and fall, so that the test fixture 1 can be covered in the heat preservation cover 2 or exposed to the outside, which is convenient for operators to replace chips on the test fixture 1.

[0034] The airflow source 7 can provide cooling or heat, and the airflow source 7 is interconnected with the thermal insulation cover 2. Specifically, the airflow source 7 can deliver cold air or hot air to the test fixture 1 so that the temperature inside the thermal insulation cover 2 is a predetermined temperature. For example, when a high-temperature test is required for a chip, hot air is delivered to the thermal insulation cover 2 through the airflow source 7 so that the temperature inside the thermal insulation cover 2 reaches a predetermined temperature, thereby allowing the chip to be tested at a predetermined temperature. When a low-temperature test is required for a chip, cold air is delivered to the thermal insulation cover 2 through the airflow source 7 so that the temperature inside the thermal insulation cover 2 reaches a predetermined temperature, thereby allowing the chip to be tested at a predetermined temperature.

[0035] When the chip is tested, the heat preservation cover 2 is set on the periphery of the test fixture 1, and the test fixture 1 is located in a relatively closed space. The temperature in the heat preservation cover 2 is adjusted to a predetermined temperature by blowing air from the air flow source 7, and then the chip is tested. After the test is completed, the lifting mechanism 3 raises the heat preservation cover 2, and the air flow source 7 continues to blow air, the test fixture 1 is exposed, and the operator replaces the chip, and then the lifting mechanism 3 lowers the heat preservation cover 2 to place it on the support seat 4 for the next round of testing.

[0036] The chip temperature testing device is suitable for high temperature testing, normal temperature testing and low temperature testing of the chip. The airflow source 7 can change the temperature of the blown airflow, so that the temperature in the heat preservation cover 2 is low temperature or high temperature. The low temperature can be -10 degrees to -50 degrees, and the high temperature can be 60 degrees to 100 degrees. When the chip is tested at normal temperature, the airflow source 7 can stop working or blow out normal temperature gas.

[0037] The chip temperature testing device in the above embodiment includes a test fixture 1, a heat preservation cover 2, a lifting mechanism 3, an airflow source 7 and a support seat 4. The test fixture 1 is arranged on the support seat 4, and the heat preservation cover 2 is arranged on the periphery of the test fixture 1, and can be lifted and lowered by the drive of the lifting mechanism 3. When testing the chip, an airflow with cold or heat is transported into the heat preservation cover 2 by the airflow source 7, so that the temperature of the heat preservation cover 2 is maintained at a predetermined temperature, and the chip is temperature tested. When the chip needs to be replaced, the heat preservation cover 2 is raised by the lifting mechanism 3, and the test fixture 1 is exposed. The airflow source 7 still continuously provides airflow into the heat preservation cover 2, and the airflow blows to the test fixture 1, which can reduce the contact between the outside air and the test fixture 1 and reduce the frosting of the test fixture 1. At the same time, by providing heat or cold through the airflow source 7, the temperature in the heat preservation cover 2 can be quickly changed, so continuous testing can be performed, and the test efficiency is high.

[0038] In some embodiments of the present invention, please refer to Figure 4 , a heat insulation pad 41 is arranged on the support seat 4, and the test fixture 1 and the heat preservation cover 2 are both placed on the heat insulation pad 41. The heat insulation pad 41 is made of heat insulation material, and its heat transfer coefficient is small, and heat is not easily transmitted to the outside through the heat insulation pad 41.

[0039] By providing the heat-insulating pad 41, the temperature inside the heat-insulating cover 2 can be kept in a relatively stable state, thereby preventing cold or heat from leaking from the support base 4, thereby making the test temperature relatively stable and the test result more accurate.

[0040] In some embodiments, see Figure 4 A positioning groove 411 is provided on the side of the insulation pad 41 facing the insulation cover 2. The shape of the positioning groove 411 is the same as the shape of the end of the insulation cover 2 facing the insulation pad 41 (the bottom end of the insulation cover 2), so that the bottom end of the insulation cover 2 can be embedded in the positioning groove. First, it is convenient to position the insulation cover 2 and prevent the insulation cover 2 from moving horizontally. Second, it can further improve the airtightness between the insulation cover 2 and the insulation pad 41.

[0041] Optionally, the positioning groove 411 is circular, and the bottom of the heat preservation cover 2 is also circular, so that the embedding and matching of the heat preservation cover 2 and the positioning groove 411 is simpler and not easy to be misplaced. In other embodiments, the positioning groove 411 can be square, polygonal, etc., and the heat preservation cover 2 is also directional, polygonal, etc.

[0042] In some embodiments, the cross section of the heat-insulating cover 2 is circular, square, etc.

[0043] In some embodiments, the heat preservation cover 2 includes a first part 21 and a second part 22 connected to each other, the cross section of the first part 21 is square, the cross section of the second part 22 is circular, and the end of the second part 22 away from the first part 21 is used to be placed on the support seat 4. By setting the heat preservation cover 2 as a square first part 21 and a circular second part 22, the lifting drive member 31, the guide assembly 33 and other structures are more conveniently connected to the first part 21.

[0044] In some embodiments of the present invention, please refer to Figure 3 and Figure 4 The lifting mechanism 3 includes a lifting drive member 31 fixed to the support seat 4 and a guide assembly 33 for guiding the heat preservation cover 2. The power output end of the lifting drive member 31 is fixedly connected to the heat preservation cover 2. The lifting drive member 31 has a shell and a power output end. The shell of the lifting drive member 31 is fixedly arranged relative to the power output end, and the power output end can output linear motion. The shell of the lifting drive member 31 is fixed on the support seat 4 and is close to the heat preservation cover 2, which is convenient for connecting with the heat preservation cover 2 and controlling the position of the heat preservation cover 2. The power output end of the lifting drive member 31 is fixedly connected to the heat preservation cover 2 to realize the lifting and lowering movement of the heat preservation cover 2.

[0045] By fixing the lifting drive member 31 on the support base 4, firstly, there is no need to design an additional installation position, and secondly, the distance between the lifting drive member 31 and the heat preservation cover 2 is reduced, which facilitates the connection between the power output end of the lifting drive member 31 and the heat preservation cover 2. By setting the guide assembly 33, the lifting movement of the heat preservation cover 2 can be made more stable, and the impact force on the lifting drive member 31 is smaller.

[0046] In some embodiments, the lifting drive member 31 is a mechanism such as a cylinder that can output linear motion.

[0047] In some embodiments, see Figure 4 The power output end of the lifting drive member 31 and the heat preservation cover 2 are connected to each other through the second connecting member 32. There is a certain distance between the power output end of the lifting drive member 31 and the heat preservation cover 2, and the two can be indirectly connected through the second connecting member 32. The specific structure of the second connecting member 32 is not limited here.

[0048] In some embodiments of the present invention, please refer to Figure 3 and Figure 4The guide assembly 33 includes a guide rod 331, a guide sleeve 332 and a first connecting member 333. One end of the guide rod 331 is fixed to the support seat 4, the guide sleeve 332 is sleeved on the guide rod 331, one end of the first connecting member 333 is fixedly connected to the guide sleeve 332, and the other end of the first connecting member 333 is fixedly connected to the heat preservation cover 2. The guide rod 331 is fixedly arranged, the guide sleeve 332 is sleeved on the outer periphery of the guide rod 331, and the guide sleeve 332 can only move along the length direction of the guide rod 331 under the restriction of the guide rod 331. The guide sleeve 332 is fixedly connected to the heat preservation cover 2, so that the heat preservation cover 2 moves along the length direction of the guide rod 331 under the cooperation of the guide sleeve 332 and the guide rod 331, thereby making the lifting movement of the heat preservation cover 2 more stable.

[0049] By fixing the guide rod 331 to the support base 4, the guide assembly 33 can move with the support base 4 as a whole, which facilitates the overall movement of the support base 4, the test fixture 1, the guide assembly 33 and other structures. The first connecting member 333 can be used to connect the heat preservation cover 2 and the guide sleeve 332, and even when the heat preservation cover 2 and the guide sleeve 332 are at a certain distance, the heat preservation cover 2 and the guide sleeve 332 can be easily connected. The specific structure of the first connecting member 333 is not limited here.

[0050] In some embodiments, see Figure 4 There are two guide components 33, which are respectively arranged on opposite sides of the heat preservation cover 2, so that both sides of the heat preservation cover 2 are supported and the movement of the heat preservation cover 2 is more stable.

[0051] Optionally, the connection between the first connecting member 333 and the heat preservation cover 2 is the first connection, and the connection between the second connecting member 32 and the heat preservation cover 2 is the second connection. The heat preservation cover 2 has four outer sides, the two first connection points are located at two oppositely arranged outer sides, and the second connection point is located at the other outer side of the heat preservation cover 2. Such distribution can avoid mutual interference between the lifting drive member 31 and the guide assembly 33, and can make the lifting of the heat preservation cover 2 more stable.

[0052] In some embodiments of the present invention, please refer to Figure 4 The lifting mechanism 3 further includes a switch assembly 34, which is electrically connected to the lifting drive 31. The switch assembly 34 is used to control the start and stop and movement direction of the lifting drive 31, that is, to control the rise and fall of the heat preservation cover 2. The setting of the switch assembly 34 is convenient for the operator to control the heat preservation cover 2.

[0053] In some embodiments, the switch assembly 34 is a push switch, a toggle switch, or a touch switch.

[0054] In some embodiments, the switch assembly 34 includes a lifting switch, which can control the lifting and lowering of the heat preservation cover 2. When the heat preservation cover 2 is placed on the support seat 4, the lifting switch is pressed, and the lifting drive 31 lifts the heat preservation cover 2; when the heat preservation cover 2 is in the raised state, the lifting switch is pressed, and the lifting drive 31 lowers the heat preservation cover 2 to the support seat 4. In other words, the lifting and lowering of the heat preservation cover 2 is controlled simultaneously by a lifting switch.

[0055] In some embodiments, the switch assembly 34 includes an ascending switch 341 and a descending switch 342, wherein the ascending switch 341 is used to control the raising of the heat preservation cover 2, and the descending switch 342 is used to control the descending of the heat preservation cover 2. When the heat preservation cover 2 is placed on the support seat 4, the ascending switch 341 is pressed, and the lifting drive 31 raises the heat preservation cover 2; when the heat preservation cover 2 is in the raised state, the descending switch 342 is pressed, and the lifting drive 31 descends the heat preservation cover 2 onto the support seat 4.

[0056] In some embodiments, a chip tray 5 is provided on the support seat 4, which can store more chips. When replacing the chip of the test fixture 1, the chip can be directly taken and placed from the chip tray 5, which is convenient to operate.

[0057] Optionally, two groups of stacked chip trays 5 are provided on the support seat 4, wherein one group of stacked chip trays 5 is used to place untested chips, and the other group of stacked chip trays 5 is used to place tested chips.

[0058] In some embodiments of the present invention, please refer to Figure 1 and Figure 3 The chip temperature testing device further comprises an outer cover 6, which is arranged on the outer periphery of the heat preservation cover 2; the outer cover 6 is provided with an avoidance hole 61 and a chip access hole 62, and the airflow pipe 71 of the airflow source 7 passes through the avoidance hole 61 and is connected with the heat preservation cover 2. The outer cover 6 is always located on the outer periphery of the heat preservation cover 2, and the setting of the avoidance hole 61 on the outer cover 6 can avoid the airflow pipe 71 of the airflow source 7, and the chip access hole 62 is used to access the chip. When the heat preservation cover 2 is raised, the operator can replace the chip through the chip access hole 62, and after replacing the chip, the heat preservation cover 2 is lowered.

[0059] By setting the outer cover 6, a relatively closed space is formed around the heat preservation cover 2. When the heat preservation cover 2 is raised and the test fixture 1 is exposed, the air around the test fixture 1 is connected to the outside air only through the chip access hole 62. At the same time, the air flow source 7 inputs gas into the heat preservation cover 2, so that the air pressure inside the outer cover 6 is greater than the outside air pressure, and the outside air is not easy to enter the inside of the outer cover 6. In this way, the test fixture 1 can be prevented from contacting with the outside air, reducing the possibility of frost on the test fixture 1. Moreover, the temperature inside the heat preservation cover 2 can be kept at a relative temperature. When the heat preservation cover 2 is raised, the air temperature around it will not change dramatically.

[0060] In some embodiments, a thermal glove is provided at the chip access hole 62, the wrist part of the thermal glove is connected to the chip access hole 62, and the remaining part of the thermal glove is located inside the cover. When replacing the chip, the operator's hand is inserted into the thermal glove, and then the operator replaces the chip while wearing the thermal glove, which can prevent hand burns or frostbite. Moreover, the provision of the thermal glove closes the chip access hole 62, so that the internal space of the outer cover 6 is in a closed state, so that the outside air cannot enter the interior of the outer cover 6, and will not contact the test fixture 1. Therefore, the test fixture 1 basically does not produce the "frosting" phenomenon, and the speed at which heat or cold leaks out is also reduced accordingly.

[0061] In some embodiments, the outer cover 6 is a transparent or translucent cover, and the operator can observe the position of the heat preservation cover 2 and the position of the test fixture 1 through the outer cover 6. Therefore, even under the shielding effect of the outer cover 6, the operator can clearly see the situation inside the outer cover 6, observe the position of the heat preservation cover 2 and accurately take and place the chip.

[0062] In some embodiments, the outer cover 6 is an acrylic cover. Acrylic has a lower cost and higher transparency, making it easier for operators to observe.

[0063] In some embodiments of the present invention, please refer to Figure 1 and Figure 2 The blowing end of the airflow source 7 is connected to an airflow tube 71, and the other end of the airflow tube 71 is connected to the heat preservation cover 2. The arrangement of the airflow tube 71 makes the placement of the airflow source 7 and the test fixture 1 more flexible. The airflow tube 71 is flexible and can be deformed to adapt to the placement of the airflow source 7 and the test fixture 1.

[0064] In some embodiments, leak-proof joints 72 are provided at both ends of the airflow tube 71, so that the airflow tube 71 is sealedly connected to the airflow source 7, and the airflow tube 71 is sealedly connected to the heat preservation cover 2 to prevent air leakage.

[0065] In some embodiments of the present invention, the airflow source 7 is an airflow meter, which can generate cold air and hot air. Moreover, the switching time between cold air and hot air is about 10s, and the temperature switching is fast. After the low-temperature test, it can be quickly switched to the high-temperature test state. Therefore, it is more flexible, does not require preheating or precooling, and has a higher test efficiency.

[0066] In some embodiments of the present invention, please refer to Figure 1 and Figure 2The chip temperature test device further includes a workbench 8, on which the support base 4 is adjustably arranged. The volume of the airflow source 7 is generally large. In order to reduce the distance between the airflow source 7 and the heat preservation cover 2, the support base 4 is arranged on the workbench 8, and the height of the support base 4 and the test fixture 1 is increased, so that the distance between the heat preservation cover 2 and the airflow source 7 can be shortened, the length of the airflow pipe 71 is shortened, and the energy lost by the airflow during the transportation process is less.

[0067] By adjusting the position of the support base 4 on the workbench 8 , the position of the support base 4 can be adjusted, and the position of the test fixture 1 can also be adjusted accordingly, making the position setting of the support base 4 more flexible.

[0068] In some embodiments, a plurality of connection holes 81 are provided on the workbench 8, and the support seat 4 can be selectively fixed at the corresponding connection holes 81 through fixing parts. When different connection holes 81 are selected for connection, the position of the support seat 4 can be adjusted.

[0069] In some embodiments, the support base 4 is a part of the workbench 8, that is, the test fixture 1 is directly placed on the workbench 8, or a thermal insulation pad 41 is placed on the workbench 8, and the test fixture 1 is placed on the thermal insulation pad 41. In this embodiment, the support base 4 is not required, and the structure of the chip temperature test device can be simplified.

[0070] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip temperature testing device, characterized in that: The invention comprises a test fixture for testing a chip, a heat preservation cover arranged on the periphery of the test fixture, a lifting mechanism for driving the heat preservation cover to rise and fall, an air flow source for providing heat or cold, and a support seat, wherein the air flow source is connected to the heat preservation cover, and the test fixture and the heat preservation cover are both placed on the support seat.

2. The chip temperature testing device according to claim 1, characterized in that: A heat insulation pad is arranged on the support seat, and the test fixture and the heat preservation cover are both placed on the heat insulation pad.

3. The chip temperature testing device according to claim 1, characterized in that: The lifting mechanism comprises a lifting drive member fixed to the support seat and a guide assembly for guiding the heat preservation cover, and a power output end of the lifting drive member is fixedly connected to the heat preservation cover.

4. The chip temperature testing device according to claim 3, characterized in that: The guide assembly includes a guide rod, a guide sleeve and a first connecting member, one end of the guide rod is fixed to the support seat, the guide sleeve is sleeved on the guide rod, one end of the first connecting member is fixedly connected to the guide sleeve, and the other end of the first connecting member is fixedly connected to the heat preservation cover.

5. The chip temperature testing device according to claim 3, characterized in that: The lifting mechanism further includes a switch assembly, and the switch assembly is electrically connected to the lifting drive member.

6. The chip temperature testing device according to claim 1, characterized in that: The chip temperature testing device also includes an outer cover, which is arranged on the outer periphery of the heat preservation cover; the outer cover is provided with an avoidance hole and a chip placement hole, and the airflow pipe of the airflow source passes through the avoidance hole and is connected with the heat preservation cover.

7. The chip temperature testing device according to claim 6, characterized in that: A heat-insulating glove is provided at the chip taking and placing hole.

8. The chip temperature testing device according to claim 6, characterized in that: The outer cover is a transparent or translucent cover.

9. The chip temperature testing device according to any one of claims 1 to 8, characterized in that: The airflow source is an airflow meter.

10. The chip temperature testing device according to any one of claims 1 to 8, characterized in that: The chip temperature testing device also includes a workbench, and the support seat is adjustably arranged on the workbench.

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