Inverted built-in iridescent LED beads

Abstract

This utility model discloses a flip-chip integrated RGB LED chip, relating to the field of LED lighting technology. It includes a substrate, an RGB IC chip, at least three flip-chip LEDs, and a packaging structure. Both the RGB IC chip and the flip-chip LEDs are soldered to the surface of the substrate using a flip-chip eutectic process, and the RGB IC chip and the flip-chip LEDs are electrically connected. The packaging structure covers the RGB IC chip and the flip-chip LEDs, forming an integrated package. The flip-chip LEDs include at least three different luminous colors, with 1-6 chips of each color. The flip-chip LEDs are connected in series or parallel. The push-pull force of the flip-chip eutectic process in this invention is more than 50 times higher than that of gold wire bonding, completely avoiding the problem of dead LEDs caused by gold wire breakage.

Description

Technical Field

[0001] This utility model relates to the field of LED lighting technology, specifically to inverted built-in iridescent LED beads. Background Technology

[0002] Most existing RGB LED chips use a series connection method where an IC chip is bonded to an LED chip via gold wire. The IC chip sends signals to control the RGB LED chips to achieve color changes. However, this type of product has the following drawbacks:

[0003] The current is usually below 20mA, which cannot meet the needs of high-power scenarios; the gold wire bonding process has low stability, the outer encapsulation glue is prone to cracking after being exposed to moisture, and the stress generated by the thermal expansion and contraction of the glue can cause the gold wire to break, resulting in dead lamps; the cost of gold wire and bonding equipment is high. Utility Model Content

[0004] The purpose of this invention is to provide inverted built-in iridescent LED beads to solve the above-mentioned defects caused by the prior art.

[0005] The flip-chip integrated RGB LED chip includes a substrate, an RGB IC chip, at least three flip-chip LEDs, and a packaging structure. The RGB IC chip and the flip-chip LEDs are both soldered to the surface of the substrate using a flip-chip eutectic process, and the RGB IC chip and the flip-chip LEDs are electrically connected. The packaging structure covers the RGB IC chip and the flip-chip LEDs to form an integrated package.

[0006] Preferably, the flip-chip LED includes at least three different light-emitting colors, and the number of each color chip is 1-6. The flip-chip LEDs are connected in series or in parallel.

[0007] Preferably, the iridescent IC chip integrates a zero-reset code decoding module, an over-temperature protection module, a constant current drive module, and a data shaping output module; the constant current drive module supports 10-300mA output current adjustment, with an adjustment step of 10mA and an output current deviation ≤±5%.

[0008] Preferably, the substrate surface is provided with electrode pads, and the electrodes of the iridescent IC chip and the flip-chip LED chip are directly connected to the electrode pads through a flip-chip eutectic process, without the need for gold wire bonding.

[0009] Preferably, the encapsulation structure is made of high-temperature resistant and aging-resistant epoxy resin material, and the outer surface of the encapsulation structure is provided with a reflective layer for improving light extraction efficiency.

[0010] Preferably, the substrate is a ceramic substrate or a metal-based copper-clad laminate, the thickness of the substrate is 0.2-0.5 mm, and the volume of the integrated package does not exceed 5 mm × 5 mm × 2 mm.

[0011] Compared with existing technologies, this utility model has the following advantages: the push-pull force of the flip-chip eutectic process is more than 50 times higher than that of gold wire bonding, completely avoiding the problem of dead LEDs caused by gold wire breakage; the encapsulating adhesive has excellent anti-aging properties and is not prone to cracking after being exposed to moisture; it supports 10-300mA current adjustment, with a power range covering 5-40V, and the brightness is 20%-30% higher than traditional products, meeting the needs of high-power scenarios; it has a built-in over-temperature protection module, supports 65536 levels of grayscale dimming, and the color adjustment is smooth and delicate; it has a low standby power consumption mode, and the data transmission adopts the return-to-zero code protocol with a rate of up to 800Kbps, and there is no attenuation when cascaded. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the RGBWL iridescent structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the RGB color-changing structure of this utility model;

[0014] Figure 3 This is a schematic diagram of the RGBW color-changing structure of this utility model. Detailed Implementation

[0015] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0016] like Figures 1-3As shown, the flip-chip integrated RGB LED chip includes a substrate, an RGB IC chip, at least three flip-chip LEDs, and a packaging structure. Both the RGB IC chip and the flip-chip LEDs are soldered to the substrate surface using a flip-chip eutectic process, and the RGB IC chip and the flip-chip LEDs are electrically connected. The packaging structure covers the RGB IC chip and the flip-chip LEDs, forming an integrated package. The flip-chip LEDs include at least three different emitting colors, with 1-6 chips of each color. The flip-chip LEDs are connected in series or parallel. The RGB IC chip integrates a zero-return code decoding module, an over-temperature protection module, and a constant current driver. The system includes a dynamic module and a data shaping output module. The constant current drive module supports 10-300mA output current adjustment in 10mA steps, with an output current deviation of ≤±5%. The substrate surface is provided with electrode pads. The electrodes of the iridescent IC chip and the flip-chip LED chip are directly connected to the electrode pads through a flip-chip eutectic process, eliminating the need for gold wire bonding. The packaging structure uses high-temperature resistant and anti-aging epoxy resin material. The outer surface of the packaging structure is provided with a reflective layer to improve light extraction efficiency. The substrate is a ceramic substrate or a metal-based copper-clad laminate with a thickness of 0.2-0.5mm. The volume of the integrated package does not exceed 5mm×5mm×2mm.

[0017] The substrate, serving as the supporting foundation for the entire LED chip, is made of ceramic or copper-clad laminate with a metal base. It possesses excellent thermal conductivity and electrical insulation, effectively transferring the heat generated during chip operation to the outside and preventing localized overheating from affecting LED performance. The substrate thickness is controlled between 0.2-0.5mm, ensuring structural strength without excessively increasing the overall thickness of the LED chip, meeting the requirements of small-volume packaging. Pre-defined electrode pads are formed on the substrate surface through an etching process. The size and spacing of these pads match the electrodes of the iridescent IC chip and flip-chip LED chip, providing precise connection points for flip-chip soldering.

[0018] The iridescent IC chip is soldered to the pre-set pad area of ​​the substrate using a flip-chip eutectic process. This process achieves mechanical fixation and electrical connection through a eutectic alloy (such as gold-tin alloy) between the chip electrode and the substrate pad. Compared with traditional gold wire bonding, its connection push-pull force is increased by more than 50 times, fundamentally eliminating the risk of dead LEDs caused by gold wire breakage. The iridescent IC chip integrates a complete set of functional modules: a return-to-zero code decoding module receives and decodes externally input DIN signals, converting digital signals into executable control commands; a constant current drive module outputs an adjustable current of 10-300mA based on the decoded commands, with current deviation controlled within ±5%, ensuring consistent LED chip brightness. The output current is adjusted via a built-in multi-bit current gain adjustment, with 10mA increments to meet brightness requirements in different scenarios; an over-temperature protection module monitors the chip's internal temperature in real time, automatically reducing the output current when the temperature reaches a preset protection point to prevent LED damage due to overheating and improve system reliability; and a data shaping output module shapes and optimizes the input return-to-zero code data, ensuring no data attenuation during cascade transmission and supporting series control of multiple LEDs. The return-to-zero code protocol is an encoding method for data transmission with strong anti-interference capabilities.

[0019] The number of flip-chip LEDs is set to at least three to meet the requirements of the iridescent effect. These can cover basic colors such as red, green, and blue, and can also include auxiliary colors such as white and yellow to achieve richer color combinations depending on the application scenario. Each color of LED chip can be connected in series, and the number of chips in series can be flexibly adjusted according to actual power requirements (e.g., 3, 6, etc.). The series-connected chip group is directly soldered to the corresponding pads on the substrate using a flip-chip eutectic process, forming an electrical connection with the OUT port of the iridescent IC chip. This eliminates the need for gold wire conductors, reducing luminous efficiency loss and connection failure points. The electrode structure of the flip-chip LEDs is optimized, with the bottom electrode directly contacting the substrate pads. This not only shortens the current path and reduces resistance loss but also improves heat dissipation efficiency, enabling the chip to operate stably at high currents (e.g., 300mA).

[0020] The encapsulation structure utilizes high-temperature resistant and aging-resistant epoxy resin material, employing a mold injection molding process to completely encapsulate the substrate, the iridescent IC chip, and the flip-chip LED. During the curing process, the encapsulation material forms a tight protective layer, effectively isolating it from external moisture, dust, and other impurities. Simultaneously, its coefficient of thermal expansion matches that of the substrate and chip, preventing stress-induced cracking due to temperature changes. The outer surface of the encapsulation structure features a reflective layer made of a high-reflectivity material (such as titanium dioxide), which reflects light emitted from the sides and back of the LED chip back to the light-emitting direction, improving the luminous efficiency of the LED by 20%-30%. The overall volume of the encapsulated LED is controlled within 5mm × 5mm × 2mm, meeting the requirements for high-density installation.

[0021] During operation, external control signals are input to the color-changing IC chip via the DIN port. After processing by the decoding module, the constant current drive module outputs corresponding current to the flip-chip LEDs of each color, controlling their luminous intensity and color combination. When the LEDs are in standby mode, the color-changing IC chip automatically enters a low-power mode to reduce energy consumption. If a new data signal is detected input to the DIN port, it quickly exits standby mode and responds to control commands. Data is cascaded to the next LED via the DOUT port, achieving synchronous control of multiple LEDs. The data transmission rate can reach 800Kbps, ensuring the real-time performance and consistency of the color-changing effect. Through the combination of the above structure and process, the flip-chip built-in color-changing LED of this invention achieves comprehensive performance of high power output, high reliability, and high cost-effectiveness, meeting the stringent requirements for brightness, color variation, and stability in scenarios such as automotive lighting, stage lighting, and special lighting products.

[0022] Therefore, the above-disclosed embodiments are merely illustrative examples and not the only ones. All modifications within the scope of this utility model or its equivalents are included in this utility model.

Claims

1. An inverted built-in iridescent LED chip, characterized in that, The device includes a substrate, a RGB IC chip, at least three flip-chip LEDs, and a packaging structure. The RGB IC chip and the flip-chip LEDs are both soldered to the surface of the substrate using a flip-chip eutectic process, and the RGB IC chip and the flip-chip LEDs are electrically connected. The packaging structure covers the RGB IC chip and the flip-chip LEDs to form an integrated package.

2. The inverted built-in RGB LED bead according to claim 1, characterized in that, The flip-chip LED includes at least three different light-emitting colors, and the number of each color chip is 1-6. The flip-chip LEDs are connected in series or in parallel.

3. The inverted built-in RGB LED bead according to claim 2, characterized in that, The iridescent IC chip integrates a zero-code decoding module, an over-temperature protection module, a constant current drive module, and a data shaping output module; the constant current drive module supports 10-300mA output current adjustment, with an adjustment step of 10mA and an output current deviation of ≤±5%.

4. The inverted built-in RGB LED bead according to claim 3, characterized in that, The substrate surface is provided with electrode pads, and the electrodes of the iridescent IC chip and the flip-chip LED chip are directly connected to the electrode pads through a flip-chip eutectic process, without the need for gold wire bonding.

5. The inverted built-in RGB LED bead according to claim 4, characterized in that, The encapsulation structure is made of high-temperature resistant and aging-resistant epoxy resin material, and the outer surface of the encapsulation structure is provided with a reflective layer to improve light extraction efficiency.

6. The inverted built-in RGB LED bead according to claim 5, characterized in that, The substrate is a ceramic substrate or a metal-based copper-clad laminate, the thickness of the substrate is 0.2-0.5mm, and the volume of the integrated package does not exceed 5mm×5mm×2mm.

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