Perovskite film layer flash and heating device

Abstract

The utility model belongs to perovskite material processing equipment technical field discloses a perovskite film layer flash evaporation and heating device. The utility model discloses a heating component is adopted to ITO heating plate, not only can realize the large -area even, fast heating of substrate, avoid the perovskite film layer and produce the defect because of the temperature uneven, and can carry out drying process and annealing crystallization process in the same device in proper order, need not transfer the substrate coated with perovskite film layer between different devices in the middle, can effectively shorten the process time, improve production efficiency. The substrate support mechanism is liftablely arranged in the processing chamber, the distance between the substrate and the ITO heating plate is moderate, and uniform heating is realized. The vacuumizing mechanism is used to vacuumize the processing chamber, which can provide a low-oxygen or oxygen-free environment for the substrate to avoid oxidation of the perovskite film layer.

Description

Technical Field

[0001] This utility model relates to the technical field of perovskite material processing equipment, and in particular to a perovskite film flash evaporation and heating device. Background Technology

[0002] Perovskite materials have wide applications in solar cells, light-emitting diodes, and photodetectors. The preparation and post-processing of perovskite films (such as vacuum drying and annealing crystallization) are crucial to material properties. Current technologies often employ a traditional vacuum drying followed by heating and annealing crystallization method. This involves feeding the perovskite material into a vacuum flash evaporation (VCD) device to evaporate excess solvent except for the formed perovskite film, thus drying the film. Then, traditional heating methods are used for annealing and crystallization. However, this method suffers from problems such as complex processes, poor temperature uniformity, slow heating rates, and difficulty in precise control. Furthermore, during the transfer from the vacuum drying environment to the heating and annealing environment, the substrate is exposed to air. The presence of water and oxygen in the air severely affects the perovskite film, leading to a decline in the final film quality.

[0003] Therefore, how to develop a device that can uniformly and rapidly heat perovskite materials and prevent them from being exposed to air is a technical problem that urgently needs to be solved. Utility Model Content

[0004] The purpose of this invention is to provide a perovskite film flash evaporation and heating device that can achieve uniform and rapid heating of perovskite substrates, reduce the probability of oxidation, and improve the quality of the final perovskite film.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A perovskite film flash evaporation and heating device includes: a main structure having a processing chamber within it, the processing chamber being capable of forming a sealed chamber; a substrate support mechanism vertically and elliptically disposed within the processing chamber and used to support a substrate coated with a perovskite film; an ITO heating plate disposed within the processing chamber and located below the substrate support mechanism, the ITO heating plate being used to heat the substrate to a target temperature; and a vacuum pumping mechanism communicating with the processing chamber and used to evacuate the processing chamber to achieve a target vacuum level.

[0007] Preferably, the perovskite film flash evaporation and heating device further includes a gas filling mechanism, which is connected to the processing chamber and is used to fill the processing chamber with inert gas.

[0008] Preferably, the main structure includes a box and a door, the box forming an entrance and exit, and the door being closable and installed at the entrance and exit; the substrate support mechanism is removably mounted on the box, and the substrate support mechanism has a placement position at least partially located outside the box and a heating position completely located inside the box, with the substrate support mechanism in the heating position positioned directly above the ITO heating plate.

[0009] Preferably, the perovskite film flash evaporation and heating device further includes a lifting drive mechanism, the output end of which is connected to the substrate support mechanism and is used to drive the substrate support mechanism to move up and down.

[0010] Preferably, the lifting drive mechanism includes a drive motor, a lead screw, and a nut block. The motor shaft of the drive motor is connected to one end of the lead screw and is used to drive the lead screw to rotate around its own axis. The nut block is threaded onto the lead screw and forms a lead screw and nut pair. The nut block is connected to the substrate support mechanism.

[0011] Preferably, the lifting drive mechanism is provided in two sets and is spaced apart in the first direction, and the output ends of the two sets of lifting drive mechanisms are respectively connected to the two ends of the substrate support mechanism in the first direction.

[0012] Preferably, the output end of the lifting drive mechanism is detachably connected to the substrate support mechanism. The main structure includes a housing. The substrate support mechanism in the detached state can be pulled horizontally on the housing, and the substrate support mechanism in the assembled state can be lifted vertically within the housing.

[0013] Preferably, the housing has a guide groove structure on each of the two inner wall surfaces opposite to each other in the first direction. Each guide groove structure includes a transverse guide groove and at least two vertical guide grooves, and each vertical guide groove communicates with the transverse guide groove. The substrate support mechanism has two sets of guide rods on both sides in the first direction. Each set of guide rods includes at least two guide rods spaced apart in the second direction. When the substrate support mechanism is in the disassembled state, all the guide rods can move laterally in the transverse guide groove. When the substrate support mechanism is in the assembled state, at least two guide rods are correspondingly located in at least two vertical guide grooves and can be vertically raised and lowered.

[0014] Preferably, the top of the main structure is provided with an observation window, through which the perovskite film layer on the substrate located in the processing chamber can be observed.

[0015] Preferably, the perovskite film flash evaporation and heating device further includes a temperature detection mechanism, which is used to obtain the temperature at the ITO heating plate or the substrate; and / or, the heating area of ​​the ITO heating plate is not less than the area of ​​the substrate.

[0016] The beneficial effects of this utility model are:

[0017] This utility model provides a perovskite film flash evaporation and heating device, comprising a main structure, a substrate support mechanism, an ITO heating plate, and a vacuum mechanism. The main structure contains a processing chamber, which can form a sealed chamber. The substrate support mechanism is vertically and vertically positioned within the processing chamber to support the substrate coated with the perovskite film. The ITO heating plate is located within the processing chamber, below the substrate support mechanism, and is used to heat the substrate to the target temperature. The vacuum mechanism is connected to the processing chamber and is used to evacuate the processing chamber to achieve the target vacuum level. This perovskite film flash evaporation and heating device, by using an ITO heating plate as the heating component, not only achieves large-area uniform and rapid heating of the substrate, avoiding defects in the perovskite film due to uneven temperature, but also allows for sequential drying and annealing crystallization processes within the same device, eliminating the need to transfer the perovskite-coated substrate between different devices, effectively shortening process time and improving production efficiency. The substrate support mechanism is vertically adjustable within the processing chamber, ensuring a suitable distance between the substrate and the ITO heating plate and facilitating uniform heating. Vacuuming the processing chamber using a vacuum mechanism provides a low-oxygen or oxygen-free environment for the substrate, preventing oxidation of the perovskite film. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the perovskite film flash evaporation and heating device described in an embodiment of this utility model;

[0019] Figure 2 This is a cross-sectional view of the perovskite film flash evaporation and heating device described in this embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the perovskite film flash evaporation and heating device described in this embodiment of the present invention after the door is opened;

[0021] Figure 4 This is a schematic diagram of the box body described in an embodiment of the present utility model;

[0022] Figure 5 This is a schematic diagram of the substrate support mechanism described in an embodiment of the present utility model;

[0023] Figure 6 This is a schematic diagram of the substrate support mechanism and two lifting drive mechanisms described in an embodiment of this utility model.

[0024] In the picture:

[0025] 100. Main structure; 110. Box body; 120. Door; 130. Guide groove structure; 131. Horizontal guide groove; 132. Vertical guide groove; 140. Positioning groove structure; 101. Processing chamber; 102. Observation window;

[0026] 200. Substrate support mechanism; 210. Guide rod; 220. First plate; 230. Second plate; 240. Handle; 250. Connecting block;

[0027] 300, ITO heating plate;

[0028] 400. Lifting drive mechanism; 410. Drive motor; 420. Lead screw; 430. Nut block; 431. Insertion slot. Detailed Implementation

[0029] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar parts or parts having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0030] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0033] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0034] like Figures 1 to 6 As shown, this utility model provides a perovskite film flash evaporation and heating device, which includes a main structure 100, a substrate support mechanism 200, an ITO heating plate 300, and a vacuum mechanism (not shown in the figure). The main structure 100 has a processing chamber 101, which can form a sealed chamber. The substrate support mechanism 200 is vertically and vertically disposed within the processing chamber 101 and is used to support a substrate coated with a perovskite film. The substrate can be a glass sheet, a silicon wafer, or other flexible substrate. The ITO heating plate 300 is disposed within the processing chamber 101 and located below the substrate support mechanism 200. The ITO heating plate 300 is used to heat the substrate to a target temperature to process the perovskite film on the substrate. This processing includes, but is not limited to, drying, annealing, and crystallization. The vacuum pumping mechanism is connected to the processing chamber 101 and is used to evacuate the processing chamber 101 so that the processing chamber 101 is at the target vacuum level.

[0035] This perovskite film flash evaporation and heating device, employing an ITO heating plate 300 as the heating component, not only achieves large-area uniform and rapid heating of the substrate, avoiding defects in the perovskite film due to uneven temperature, but also allows for sequential drying and annealing crystallization processes within the same device, eliminating the need to transfer the perovskite-coated substrate between different devices. This effectively shortens process time and improves production efficiency. The substrate support mechanism 200 is vertically and flexibly positioned within the processing chamber 101, ensuring a suitable distance between the substrate and the ITO heating plate 300, which also facilitates uniform heating. Vacuuming the processing chamber 101 using a vacuum mechanism provides a low-oxygen or oxygen-free environment for the substrate, preventing oxidation of the perovskite film. It should be noted that users can determine the suitability of the distance between the substrate and the ITO heating plate 300 based on the heating efficiency and temperature requirements of different processes; no specific value is limited here.

[0036] In some embodiments, the main structure 100 includes a housing 110 and a door 120. The housing 110 forms an entrance / exit, and the door 120 is closable and installable at the entrance / exit. Closing the door 120 forms a sealed chamber within the main structure 100. Optionally, the main structure 100 is generally cubic in shape, with the front opening of the housing 110 forming the entrance / exit, and the door 120 rotatably mounted on the front of the housing 110 via hinges.

[0037] In one specific embodiment, the main structure 100 is made of stainless steel. In another specific embodiment, the main structure 100 is made of quartz glass. Whether the main structure 100 is made of stainless steel or quartz glass, it possesses good sealing properties and high-temperature resistance. Of course, besides stainless steel and quartz glass, the main structure 100 can also be made of other materials with good sealing properties and high-temperature resistance.

[0038] It should be noted that if the main structure 100 is made of a transparent material such as quartz glass, the heating of the perovskite film layer inside it can be directly observed through the main structure 100. If the main structure 100 is made of an opaque material such as stainless steel, in some embodiments, an observation window 102 is provided at the top of the main structure 100 to facilitate the heating of the perovskite film layer. The perovskite film layer on the substrate inside the processing chamber 101 can be observed through the observation window 102. Specifically, a window is opened at the top of the main structure 100, and at least one layer of glass is provided in the window to form the observation window 102.

[0039] The ITO heating plate 300 features high conductivity and high light transmittance. Specifically, the ITO heating plate 300 has an ITO thin film deposited on the surface of transparent conductive glass and includes electrodes. These electrodes can be connected to an external power source via wires. Precise temperature control of the ITO heating plate 300 can be achieved by adjusting the voltage applied to it using an external power controller. It should be noted that the temperature control range of the ITO heating plate 300 is from room temperature to 300°C.

[0040] The ITO heating plate 300 is disposed on the bottom surface inside the housing 110, and a clearance hole is provided on the side wall of the housing 110 for the wires of the ITO heating plate 300 to pass through. Optionally, a sealing element may be provided at the clearance hole to prevent the opening from affecting the airtightness of the sealed chamber. In some embodiments, the ITO heating plate 300 is a rectangular plate. Of course, in other embodiments, the shape of the ITO heating plate 300 may also be circular, elliptical, or other polygonal shapes as needed.

[0041] To improve the stability of the ITO heating plate 300 within the housing 110 and prevent accidental movement during transportation, continue to refer to... Figure 4As shown, a positioning groove structure 140 is provided on the bottom surface inside the housing 110. The shape of the positioning groove structure 140 is adapted to the shape of the ITO heating plate 300, and the ITO heating plate 300 is confined within the positioning groove structure 140. In one specific embodiment, the positioning groove structure 140 is formed by slotting the bottom plate of the housing 110; in another specific embodiment, a limiting frame is provided on the bottom plate of the housing 110, and the limiting frame and the bottom plate located therein enclose the positioning groove structure 140.

[0042] To precisely control the heating temperature of the ITO heating plate 300, in some embodiments, the perovskite film flash evaporation and heating device further includes a temperature detection mechanism (not shown in the figure). This temperature detection mechanism is used to acquire the temperature of the ITO heating plate 300 or the substrate. Optionally, the temperature detection mechanism includes a temperature sensor, which can be embedded within the ITO heating plate 300 to monitor its temperature in real time. Alternatively, the temperature sensor can be positioned close to the substrate support mechanism 200 to detect the temperature of the substrate in real time. The perovskite film flash evaporation and heating device also includes a control mechanism. The temperature sensor transmits the acquired temperature information to the control mechanism, which automatically adjusts the heating power of the ITO heating plate 300 according to a set value based on the acquired temperature information.

[0043] To ensure that the ITO heating plate 300 has a sufficient heating area to guarantee heating efficiency, the heating area of ​​the ITO heating plate 300 is set to be no less than the area of ​​the substrate.

[0044] Continue to refer to Figure 3 As shown, to facilitate the placement and removal of the substrate, the substrate support mechanism 200 is retractably mounted on the housing 110, allowing the substrate support mechanism 200 to move laterally relative to the housing 110. This results in the substrate support mechanism 200 having a placement and removal position at least partially located outside the housing 110 and a heating position completely located inside the housing 110. In the placement and removal position, the substrate support mechanism 200 allows the user to easily place and remove the substrate from it, while in the heating position, the substrate support mechanism 200 is located directly above the ITO heating plate 300 to ensure sufficient heating area and high heating efficiency.

[0045] The substrate support mechanism 200 is a substrate holder. In some embodiments, reference continues to be made to... Figure 5As shown, the substrate support mechanism 200 is a rectangular frame structure. Specifically, the substrate support mechanism 200 includes two first plates 220 spaced apart in a first direction and two second plates 230 spaced apart in a second direction, forming a rectangular frame structure. The ends of the substrate overlap the two first plates 220 and the two second plates 230, enabling the substrate support mechanism 200 to support the substrate. Designing the substrate support mechanism 200 as a rectangular frame structure offers advantages such as lightweight and flexible retraction. Of course, in other embodiments, the substrate support mechanism 200 can also be a frame structure with other shapes.

[0046] To improve the accuracy of the substrate support mechanism 200 in the second direction relative to the housing 110, a guide groove structure 130 is provided on each of the two inner wall surfaces that are opposite to each other in the first direction inside the housing 110. Each guide groove structure 130 includes a transverse guide groove 131, and two sets of guide rods 210 are provided on both sides of the substrate support mechanism 200 in the first direction. The two sets of guide rods 210 are inserted into the two transverse guide grooves 131 in a one-to-one correspondence. By moving the guide rods 210 in the transverse guide grooves 131, the movement accuracy of the substrate support mechanism 200 can be improved.

[0047] In one specific embodiment, the transverse guide groove 131 is a groove-shaped structure closed at both ends to prevent the guide rod 210 from detaching from the end of the transverse guide groove 131. In another specific embodiment, the transverse guide groove 131 is a groove-shaped structure closed at one end and open at the other end to facilitate the removal of the substrate support mechanism 200 from the housing 110 for maintenance.

[0048] In one specific embodiment, each group of guide rods 210 includes two spaced-apart guide rods 210, which are respectively connected to the front and rear ends of the substrate support mechanism 200. Of course, in other embodiments, the number of guide rods 210 in each group of guide rods 210 can be increased as needed.

[0049] To facilitate the pulling of the substrate support mechanism 200, the substrate support mechanism 200 also includes a handle 240, which is mounted on the second plate 230 and located on the side near the opening of the housing 110. The user can apply force to the substrate support mechanism 200 by gripping the handle 240. Optionally, the handle 240 is a U-shaped part.

[0050] Continue to refer to Figure 6 As shown, the perovskite film flash evaporation and heating device also includes a lifting drive mechanism 400. The output end of the lifting drive mechanism 400 is connected to the substrate support mechanism 200 and is used to drive the substrate support mechanism 200 to move up and down.

[0051] In some embodiments, the lifting drive mechanism 400 includes a drive motor 410, a lead screw 420, and a nut block 430. The motor shaft of the drive motor 410 is connected to one end of the lead screw 420 and is used to drive the lead screw 420 to rotate around its own axis. The two ends of the lead screw 420 are rotatably connected to the top plate and the bottom plate of the housing 110. The nut block 430 is threadedly connected to the lead screw 420 and forms a lead screw and nut pair. The nut block 430 is connected to the substrate support mechanism 200. Driven by the drive motor 410, the lead screw 420 can rotate around its own axis. As the lead screw 420 rotates, the nut block 430 can move along the axial direction of the lead screw 420, thereby driving the substrate support mechanism 200 to rise or fall. Of course, in other embodiments, the lifting drive mechanism 400 can also adopt a linear motor module, a cylinder, or other power mechanism that can directly output linear motion, and is not limited to the combination of a motor and a lead screw 420 and nut.

[0052] In some embodiments, two sets of lifting drive mechanisms 400 are provided and spaced apart in a first direction. The output ends of the two sets of lifting drive mechanisms 400 are respectively connected to the two ends of the substrate support mechanism 200 in the first direction. By providing two sets of lifting drive mechanisms 400, the stability of the substrate support mechanism 200 during the lifting process can be improved.

[0053] Given that the substrate support mechanism 200 has both lifting and pulling functions, in order to prevent the lifting and pulling functions from interfering with each other, in some embodiments, the output end of the lifting drive mechanism 400 is detachably connected to the substrate support mechanism 200. The substrate support mechanism 200 in the detached state can be pulled horizontally on the housing 110, and the substrate support mechanism 200 in the assembled state can be lifted vertically within the housing 110.

[0054] Optionally, a insertion slot 431 is provided on the side of the nut block 430 facing the opening of the housing 110. By inserting the second plate 230 of the substrate support mechanism 200 into the insertion slot 431, a detachable connection between the substrate support mechanism 200 and the output end of the lifting drive mechanism 400 is achieved. Alternatively, an insertion block 250 is protruding on the second plate 230, and the insertion block 250 is inserted into the insertion slot 431, thereby achieving a detachable connection between the substrate support mechanism 200 and the output end of the lifting drive mechanism 400.

[0055] Of course, in other embodiments, a first magnetic chuck can be provided on the substrate support mechanism 200 and a second magnetic chuck can be provided on the output end of the lifting drive mechanism 400. The magnetic attraction between the first magnetic chuck and the second magnetic chuck can achieve a detachable connection between the substrate support mechanism 200 and the output end of the lifting drive mechanism 400.

[0056] To improve the lifting accuracy of the substrate support mechanism 200, continue to refer to Figure 4 As shown, each guide groove structure 130 also includes a vertical guide groove 132, along which the guide rod 210 can move to achieve guidance. Optionally, the number of vertical guide grooves 132 included in each guide groove structure 130 is the same as the number of guide rods 210 included in each group of guide rods 210, and when the substrate support mechanism 200 is in the assembled state, at least two guide rods 210 are correspondingly arranged in at least two vertical guide grooves 132 and can be vertically raised and lowered.

[0057] Continue to refer to Figure 4 As shown, in order to ensure the continuity of action of the substrate support mechanism 200 during lifting and pulling switching, each vertical guide groove 132 is connected to the horizontal guide groove 131. When the substrate support mechanism 200 is in the disassembled state, all guide rods 210 can move laterally within the horizontal guide groove 131. When the substrate support mechanism 200 is in the assembled state, all guide rods 210 correspond exactly to one vertical guide groove 132 in the vertical direction. At this time, if the lifting drive mechanism 400 is activated, the guide rods 210 can enter the vertical guide groove 132 and move along the vertical guide groove 132.

[0058] In one specific embodiment, the guide groove structure 130 is in the shape of an inverted U, which includes a horizontal guide groove 131 and two vertical guide grooves 132, with the two vertical guide grooves 132 connected to both ends of the horizontal guide groove 131.

[0059] After the door 120 closes the opening of the housing 110, the processing chamber 101 within the main structure 100 forms a sealed chamber. A vacuum pumping mechanism is used to extract air from the sealed chamber to create a low-oxygen or oxygen-free environment, thereby preventing the perovskite material from being oxidized during heating. In some embodiments, the vacuum system includes a mechanical pump and a molecular pump. The mechanical pump is connected to the outlet of the molecular pump via a pre-pump, and the inlet of the molecular pump is connected to the sealed chamber via a high-vacuum pipeline. The mechanical pump, acting as a pre-pump, is responsible for creating working conditions for the molecular pump and removing its exhaust gas. The molecular pump, acting as the main pump, is responsible for obtaining the high vacuum. It should be noted that the specific structure and connection relationship of the mechanical pump and the molecular pump are existing technologies and will not be elaborated upon here.

[0060] In some embodiments, a vacuum mechanism can be used to maintain the vacuum level within the processing chamber 101 of the main structure 100 at 10. -3 Pa to 10 -5 Between Pa.

[0061] The perovskite film flash evaporation and heating device also includes a gas filling mechanism, which is connected to the processing chamber 101 and used to fill the processing chamber 101 with inert gas. It should be noted that the inert gas can be nitrogen or argon. By introducing inert gas into the processing chamber 101 through the gas filling mechanism, the atmosphere of the heating environment within the processing chamber 101 can be controlled.

[0062] In some embodiments, the inflation mechanism includes a gas cylinder, a flow meter, and a gas distributor. The gas cylinder is filled with inert gas, and the outlet of the gas cylinder is connected to the gas distributor via a gas pipe. The flow meter is mounted on the gas pipe, and the gas distributor is placed inside the processing chamber 101 to ensure uniform gas distribution. The specific structure of the gas distributor is prior art and will not be described in detail here.

[0063] The working process of the perovskite film flash evaporation and heating device is as follows:

[0064] The first step is to coat the substrate with a perovskite precursor solution to form a perovskite film on the substrate.

[0065] The second step is to open the door 120, pull the substrate support mechanism 200 out of the box 110 to the pick-up and put-out position, place the substrate coated with the perovskite film on the substrate support mechanism 200, and push the substrate support mechanism 200 carrying the substrate back to the heating position inside the box 110.

[0066] The third step is to close the door 120, forming a sealed chamber within the main structure 100, and then activate the vacuum pumping mechanism to reduce the pressure within the sealed chamber to the target vacuum level.

[0067] Step 4: Start the ITO heating plate 300. Based on the feedback from the temperature detection mechanism, heat the substrate to the target temperature, which is between 100°C and 200°C. This will dry the perovskite precursor solution on the substrate to form a perovskite film, and then perform annealing and crystallization treatment on the perovskite film.

[0068] Step 5: After heating is complete, turn off the ITO heating plate 300 and start the cooling system to quickly reduce the temperature in the sealed chamber to room temperature. The cooling system can be an existing structure such as a fan or liquid cooling, which will not be described in detail here.

[0069] Step 6: Open the door 120, remove the substrate from the box 110, and obtain a high-quality perovskite film.

[0070] In this embodiment, the control mechanism can be a centralized or distributed controller. For example, the controller can be a single microcontroller or a combination of multiple distributed microcontrollers. The microcontroller can run a control program to control the impedance detection device 3 and the display device 5 to achieve their functions.

[0071] The following uses a specific embodiment and comparative example to compare the performance of the finally obtained perovskite film:

[0072] Example 1:

[0073] The perovskite film flash drying and annealing crystallization treatment of the perovskite layer of the perovskite solar cell is performed using the perovskite film flash drying and heating device provided by this utility model:

[0074] Specifically, a glass substrate coated with a solution of a perovskite precursor or its derivative is fixed on a substrate holder, and the processing chamber 101 is evacuated to 10... -4 A vacuum level of 10 Pa is established, and the ITO heating plate 300 is activated to heat the substrate to 150°C and maintain this temperature for 10 minutes. After heating is complete, the cooling system is activated to rapidly cool the substrate to room temperature. The substrate is then removed to obtain the perovskite film, and subsequent processing steps are performed.

[0075] Comparative Example 1:

[0076] The perovskite layer of the perovskite solar cell was subjected to flash drying and annealing crystallization treatment using conventional equipment:

[0077] Specifically, a glass substrate coated with a solution of perovskite precursor or its derived layer is flash-evaporated using a conventional VCD, with the flash-evaporation environment maintained at 10°C. -4 After applying a vacuum of Pa and flash evaporation, the substrate is removed and placed on a 150°C heating plate for 10 minutes. Once heating is complete, the perovskite film is obtained and subsequent processing steps are performed.

[0078]

[0079] The table above shows that the performance of the perovskite film obtained by using the flash evaporation and heating device of this invention is better than that of the perovskite film obtained by using conventional devices.

[0080] This perovskite film flash evaporation and heating device has the following advantages: 1. Uniform heating: The ITO heating plate 300 can achieve uniform heating over a large area, avoiding defects in the perovskite film caused by uneven temperature. 2. Precise temperature control: Through feedback from the temperature detection mechanism, the control mechanism can precisely adjust the heating temperature of the ITO heating plate 300 to meet the temperature requirements of different process stages of perovskite materials. 3. Rapid response: The ITO heating plate 300 heats up quickly, shortening process time and improving production efficiency. 4. Low-oxygen environment: It can provide a low-oxygen or oxygen-free environment to prevent oxidation of perovskite materials. 5. Multifunctionality: This device can be used for various processes such as drying and annealing crystallization of perovskite films.

[0081] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A perovskite film flash evaporation and heating device, characterized in that, include: The main structure (100) has a processing chamber (101) inside, which can form a sealed chamber; A substrate support mechanism (200) is provided in the processing chamber (101) in a height-reducible manner and is used to support a substrate coated with a perovskite film. ITO heating plate (300), the ITO heating plate (300) is disposed in the processing chamber (101) and located below the substrate support mechanism (200), the ITO heating plate (300) is used to heat the substrate to the target temperature; A vacuum pumping mechanism is connected to the processing chamber (101) and is used to evacuate the processing chamber (101) so that the processing chamber (101) is at a target vacuum level.

2. The perovskite film layer flashing and heating device according to claim 1, characterized in that, The perovskite film flash evaporation and heating device also includes a gas filling mechanism, which is connected to the processing chamber (101) and is used to fill the processing chamber (101) with inert gas. 3.The perovskite film layer flashing and heating device according to claim 1, wherein, The main structure (100) includes a box (110) and a door (120), the box (110) forming an entrance and exit, and the door (120) being closably installed at the entrance and exit; The substrate support mechanism (200) is removably mounted on the housing (110). The substrate support mechanism (200) has a pick-up and put-down position located at least partially outside the housing (110) and a heating position located entirely inside the housing (110). The substrate support mechanism (200) in the heating position is located directly above the ITO heating plate (300). 4.The perovskite film layer flashing and heating device according to claim 1, wherein, The perovskite film flash evaporation and heating device also includes a lifting drive mechanism (400), the output end of which is connected to the substrate support mechanism (200) and is used to drive the substrate support mechanism (200) to move up and down.

5. The perovskite film flash evaporation and heating device according to claim 4, characterized in that, The lifting drive mechanism (400) includes a drive motor (410), a lead screw (420), and a nut block (430). The motor shaft of the drive motor (410) is connected to one end of the lead screw (420) and is used to drive the lead screw (420) to rotate around its own axis. The nut block (430) is threaded onto the lead screw (420) and forms a lead screw and nut pair. The nut block (430) is connected to the substrate support mechanism (200). 6.The perovskite film layer flashing and heating device according to claim 4, characterized in that, The lifting drive mechanism (400) is provided in two sets and is spaced apart in the first direction. The output ends of the two sets of lifting drive mechanisms (400) are respectively connected to the two ends of the substrate support mechanism (200) in the first direction.

7. The perovskite film layer flashing and heating device according to claim 4, characterized in that, The output end of the lifting drive mechanism (400) is detachably connected to the substrate support mechanism (200). The main structure (100) includes a box (110). The substrate support mechanism (200) in the disassembled state can be pulled horizontally on the box (110), and the substrate support mechanism (200) in the assembled state can be lifted vertically within the box (110). 8.The perovskite film layer flashing and heating device according to claim 7, characterized in that, The housing (110) has a guide groove structure (130) on each of the two inner wall surfaces that are arranged opposite to each other in the first direction. Each guide groove structure (130) includes a horizontal guide groove (131) and at least two vertical guide grooves (132). Each vertical guide groove (132) is connected to the horizontal guide groove (131). The substrate support mechanism (200) is provided with two sets of guide rods (210) on both sides in the first direction. Each set of guide rods (210) includes at least two guide rods (210) spaced apart in the second direction. When the substrate support mechanism (200) is in the disassembled state, all the guide rods (210) can move laterally in the transverse guide groove (131). When the substrate support mechanism (200) is in the assembled state, at least two guide rods (210) are correspondingly arranged in at least two vertical guide grooves (132) and can be vertically raised and lowered. 9.The perovskite film layer flashing and heating device according to claim 1, wherein, The top of the main structure (100) is provided with an observation window (102), through which the perovskite film layer on the substrate located in the processing chamber (101) can be observed.

10. The perovskite film layer flashing and heating device according to claim 1, characterized in that, The perovskite film flash evaporation and heating device further includes a temperature detection mechanism, which is used to obtain the temperature of the ITO heating plate (300) or the substrate; And / or, the heating area of ​​the ITO heating plate (300) is not less than the area of ​​the substrate.

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