Vacuum reflow soldering tool for irregular receiving module boards

Abstract

We provide a tool for vacuum reflow soldering of irregular receiving module boards. The solution comprises a base plate 1, a pressure plate seat 2, a pressure plate cover, a small push-up block assembly 4, a small stopper assembly 5, and a rotating column locking assembly 6. The rotating column locking assembly fixes the irregular-shaped receiving module at a predetermined height, improving the robustness of the device. The small push-up block assembly and small stopper assembly enable the irregular-shaped receiving module to be positioned with high precision. The structure of this tooling allows for flexible positioning and secure fixation of irregular-shaped workpieces, and is sufficiently strong. This solves the technical problem of difficulty in positioning irregular-shaped workpieces, greatly improves production quality and consistency, and significantly reduces the costs of jig and tooling production, management, and maintenance.

Description

[Technical Field]

[0001] The present invention relates to the technical field of vacuum reflow soldering equipment, and more particularly to a tool used in vacuum reflow soldering of irregular-shaped receiver module substrates. [Background technology]

[0002] Receiver modules are key components in communication, navigation, and identification systems, and their high performance requirements ensure flight safety. The circuit board in a receiver module is the primary carrier for signal transmission in microwave products. The industry widely adopts the method of brazing high-frequency circuit boards into product housings, achieving good heat dissipation and grounding performance. Currently, manual soldering is used to braze certain types of launcher module circuit boards. However, manual soldering has several drawbacks: the quality of the manual work depends on the skill and experience of the worker, and it is difficult for unskilled workers to ensure high soldering quality. Furthermore, manual work requires individual operations, resulting in slow operation speeds and affecting production quality. Furthermore, it is difficult to ensure stable soldering quality during mass production.

[0003] Therefore, there is an urgent need to provide a tool for vacuum reflow soldering of irregular shaped receiver module substrates. Summary of the Invention

[0004] The purpose of this invention is to provide a vacuum reflow soldering tool for fixing irregular-shaped receiver modules. This tool solves the problem of difficulty in fixing irregular-shaped devices, improves production efficiency, and ensures soldering quality. The specific technical measures are as follows:

[0005] The present invention provides a vacuum reflow soldering tool for a variable-shaped receiver module board, the tool comprising: a base plate, a pressure plate seat, a pressure plate cover, a small push-up block assembly, a small stopper assembly, and a rotation column lock assembly; the bottom plate is disposed at the bottom, and a plurality of grooves are formed on the bottom plate for accommodating irregular receiving modules; the lower end of the rotary column locking assembly is attached to the bottom plate, and the upper end of the rotary column locking assembly fixes the pressure plate seat, which is used to place solder pieces and substrates; and the pressure plate cover is attached to the pressure plate seat and used to fix the substrate; The small push-up block assembly is provided on the bottom plate and is used to fix the irregular receiving module, and the small stopper assembly is provided on the bottom plate and is used to fix the irregular receiving module.

[0006] In another embodiment, the rotating column locking assembly comprises a rotating tip, a connecting nut, and a locking nut; The rotating tip is a special-shaped screw, the head of which is rectangular, and the lower end is a threaded bolt. The connecting nut is a bolt with a threaded hole, and the fixing nut has a threaded hole formed at its upper end and a bolt at its lower end.

[0007] In another embodiment, the miniature push-up block assembly includes a housing, a resilient member, and a movable protrusion; A cavity is formed inside the housing, and the cavity is used to accommodate the elastic member and the movable protrusion, one end of the movable protrusion is positioned inside the cavity and the other end protrudes outside the cavity, and the protruding portion of the movable protrusion is used to fix the irregular receiving module.

[0008] In another embodiment, the mini-stopper assembly includes a fixed end and a movable end; The fixed end is fixed to the bottom plate, and the movable end is provided on the fixed end and is used to contact the irregular receiving module.

[0009] In another embodiment, the pressure plate seat has a groove formed therein, and a plurality of screw hole portions are provided outside the groove.

[0010] In another embodiment, the pressure plate cover is formed with a plurality of grooves, and the grooves are provided to correspond to the grooves formed in the pressure plate seat.

[0011] In another embodiment, the tooling further includes a pin pusher block assembly.

[0012] In another embodiment, the pin pressure block assembly includes a top portion and a fixed portion; The top portion is provided with a special nut, the fixing portion is movably connected to the top portion, and the lower end is provided with a bolt, and the fixing portion is fixed to the bottom plate by the bolt.

[0013] In another embodiment, the base plate is a rectangular parallelepiped.

[0014] In another embodiment, the tooling is used to secure an irregular receiving module.

[0015] The present invention has the following beneficial effects: This invention provides a tool for vacuum reflow soldering irregular-shaped receiver modules, which uses a small push-up block assembly and a small stopper assembly to position the irregular-shaped receiver module with high precision. A rotating column locking assembly secures the irregular-shaped receiver module at a predetermined height, improving the robustness of the device. The tool structure allows for flexible positioning and secure fixation of irregular-shaped workpieces, while maintaining sufficient strength. This solves the technical problem of difficult positioning of irregular-shaped workpieces, significantly improves production quality and consistency, and significantly reduces the costs of production, management, and maintenance of the tool. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 10 is an assembled top view of a jig for vacuum reflow soldering of an irregular receiver module. [Figure 2] FIG. 10 is an assembled side view of a jig for vacuum reflow soldering of an irregular receiving module. [Figure 3] FIG. 10 is an exploded view of a jig for vacuum reflow soldering of an irregular receiving module. [Figure 4] 1 is a three-dimensional view of a jig for vacuum reflow soldering of an irregular-shaped receiver module. [Figure 5] 1 is a schematic diagram of a rotary column locking assembly of a vacuum reflow soldering tool for an irregular receiving module. FIG. [Figure 6] 1 is a schematic diagram of a small push-up block assembly of a jig for vacuum reflow soldering of an irregular receiving module. [Figure 7] 10 is a schematic diagram of a small stopper assembly of a vacuum reflow soldering tool for an irregular receiving module. FIG. [Figure 8] 1 is a schematic diagram of a pin pressing block assembly of a vacuum reflow soldering tool for an irregular receiver module. [Figure 9] 1 shows the deformed pins of a jig for vacuum reflow soldering of a deformed receiver module. [Figure 10] 10 is a schematic diagram of a pressure plate seat of a jig for vacuum reflow soldering of an irregular receiving module. FIG. [Figure 11] FIG. 10 is a schematic diagram of a pressure plate lid of a jig for vacuum reflow soldering of an irregular receiving module. [Figure 12] 10 is a schematic diagram of the bottom plate of a vacuum reflow soldering tool for an irregular receiving module. FIG. [Explanation of symbols]

[0017] 1...Bottom plate 2…Press plate seat 3...Pressure plate lid 4...Small push-up block assembly 5...Small stopper assembly 6...Rotating column lock assembly 7...Irregular pin 8...Pin pressing block assembly 41...Housing 42...Elastic member 43…Movable protrusion 51...Fixed end 52...Movable end 61...Rotating tip 62...Connecting nut 63...Fixing nut DETAILED DESCRIPTION OF THE INVENTION

[0018] In order to clarify the purpose, technical means and advantages of the present invention, the following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings. The embodiments described below are only some of the embodiments of the present invention, but are not all of the embodiments. Other embodiments that can be made by those skilled in the art based on the present invention without requiring creative efforts are also included in the scope of protection of the present invention.

[0019] Hereinafter, the technical means of each embodiment of the present invention will be described in detail with reference to FIGS.

[0020] Example 1 SUMMARY OF THE INVENTION The purpose of the present invention is to provide a tool for vacuum reflow soldering of receiver modules, which solves the problems of slow operation speed, inconsistency, and unstable quality that occur in traditional manual soldering.

[0021] The vacuum reflow soldering tool for the variant receiving module of this embodiment includes a base plate, a small push-up block assembly, a small stopper assembly, a column lock assembly, a pin pressing block assembly, a variant pin, and a pressure plate. The pressure plate is composed of a pressure plate seat and a pressure plate cover.

[0022] Four automatic push-up block assemblies are installed around the four sides of the bottom plate, which can fix the position of the irregular launch module when it is inserted into the jig. The bottom plate is equipped with a column lock assembly. After placing the receiving module in the jig and installing the PCB, the pressure plate is placed on top and the column lock is rotated to connect the cover plate to the bottom plate. The pressure plate consists of a pressure plate base and a pressure plate cover, connected in between by a spring. After installing the PCB, the screws are rotated to ensure that each pressure block makes sufficient contact with the PCB, ensuring soldering quality and a passable void rate.

[0023] Compared with traditional manual soldering methods, this tool uses positioning and spring pressure to achieve high-precision vacuum reflow soldering of irregular-shaped receiver modules, which significantly improves production quality and consistency and significantly reduces tool manufacturing, management, and maintenance costs, making it highly practical.

[0024] Example 2 The purpose of this invention is to provide a vacuum reflow soldering tool for fixing irregular-shaped receiver modules. This device solves the problem of fixing irregular-shaped workpieces with difficulty, improves production efficiency, and ensures soldering quality. The specific technical measures are as follows:

[0025] The vacuum reflow soldering tool for irregular-shaped receiver module boards of the present invention comprises a base plate, a pressure plate seat, a pressure plate cover, a small push-up block assembly, a small stopper assembly, and a rotation column lock assembly. The bottom plate is disposed at the bottom, and is provided with a plurality of grooves for accommodating irregular receiving modules. The lower end of the rotary column locking assembly is attached to the bottom plate, and a pressure plate seat is fixed to its upper end. The pressure plate seat is used to place solder pieces and substrates. The pressure plate cover is attached to the pressure plate seat and is used to secure the substrate. The small push-up block assembly is mounted on the bottom plate for fixing the irregular receiving module, and the small stopper assembly is mounted on the bottom plate for fixing the irregular receiving module.

[0026] In another embodiment of the present invention, the rotary column locking assembly includes a rotary tip, a connecting nut, and a fixing nut. The rotary tip is a special thread with a rectangular head and a threaded bolt at its lower end. The connecting nut is a bolt with a threaded hole, and the fixing nut has a threaded hole at its upper end and a bolt at its lower end.

[0027] In another embodiment of the present invention, the miniature push-up block assembly includes a housing, an elastic member, and a movable protrusion. The housing has a cavity therein, and the cavity accommodates the elastic member and the movable protrusion. One end of the movable protrusion is located within the cavity, and the other end protrudes out of the cavity. The protruding portion of the movable protrusion is used to fix the irregular receiving module.

[0028] In another embodiment of the present invention, the mini-stopper assembly includes a fixed end and a movable end. The fixed end is fixed to the bottom plate, and the movable end is provided on the fixed end and is used to contact the irregular receiving module.

[0029] In another embodiment of the present invention, the pressure plate seat is provided with a groove having a different shape, and a plurality of screw holes are formed on the outer side of the groove.

[0030] In another embodiment of the present invention, the pressure plate cover is provided with a plurality of grooves, which correspond to the grooves of the pressure plate seat.

[0031] In another embodiment of the present invention, the tooling further comprises a pin pusher block assembly.

[0032] In another embodiment of the present invention, the pin pressing block assembly includes a top and a fixed part, a shaped nut is provided on the top, the fixed part is movably connected to the top, and a bolt is provided on the lower end, and the pin pressing block assembly is fixed to the bottom plate by the bolt.

[0033] In another embodiment of the present invention, the bottom plate is a rectangular body.

[0034] In another embodiment of the present invention, the tooling is used to fix an irregular-shaped receiving module.

[0035] Example 3 Implementation Procedure Step 1: Remove the entire pressure plate. The pressure plate consists of a pressure plate base and a pressure plate cover, which are connected by four screws.

[0036] Step 2: Place the irregular receiving module on the bottom plate and fix the irregular receiving module with the small push-up block assembly and the small stopper assembly.

[0037] Step 3: Place the preformed solder pieces into the module and place the substrate onto the solder pieces.

[0038] Step 4: Return the pressure plate to its original position and rotate the rotating column lock assembly to secure the pressure plate. Rotate the four screws between the pressure plate base and the pressure plate cover to ensure that the pressure mass covers the substrate evenly.

[0039] Step 5: The entire tool is placed in a vacuum reflow furnace and welded for a total of 25 minutes. After welding, the void ratio meets the requirements.

[0040] Although the preferred embodiments of the present invention have been described, those skilled in the art may make further changes and modifications to these embodiments once they have grasped the basic inventive concept. Therefore, the appended claims are intended to cover the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

Claims

1. A tool for vacuum reflow soldering of an irregular receiving module substrate, comprising: The tooling includes a bottom plate, a pressure plate seat, a pressure plate cover, a small push-up block assembly, a small stopper assembly, and a rotation column lock assembly; the bottom plate is disposed at the bottom, and a plurality of grooves are formed on the bottom plate for accommodating irregular receiving modules; the lower end of the rotary column locking assembly is attached to the bottom plate; the pressure plate seat is fixed to the upper end of the rotary column locking assembly; the pressure plate seat is used to place solder pieces and substrates; and the pressure plate cover is attached to the pressure plate seat and used to fix the substrate; A vacuum reflow soldering jig tool for an irregular receiving module board, characterized in that the small push-up block assembly is provided on the bottom plate and used to fix the irregular receiving module, and the small stopper assembly is provided on the bottom plate and used to fix the irregular receiving module.

2. The rotating column locking assembly includes a rotating tip, a connecting nut, and a locking nut; 2. The vacuum reflow soldering jig for an irregular receiving module board according to claim 1, wherein the rotating tip is an irregular screw, the head of the irregular screw is rectangular, and the lower end is a threaded bolt, the connecting nut is a bolt with a threaded hole, and the fixing nut has a threaded hole formed at its upper end and a bolt at its lower end.

3. The small push-up block assembly includes a housing, an elastic member, and a movable protrusion; 2. The vacuum reflow soldering tool for an irregular receiving module board according to claim 1, wherein a cavity is formed inside the housing, the cavity is used to accommodate the elastic member and the movable protrusion, one end of the movable protrusion is disposed inside the cavity and the other end protrudes outside the cavity, and the protruding portion of the movable protrusion is used to fix the irregular receiving module.

4. the miniature stopper assembly includes a fixed end and a movable end; 2. The vacuum reflow soldering tool for an irregular receiving module board according to claim 1, wherein the fixed end is fixed to the bottom plate, and the movable end is provided on the fixed end and is used to contact the irregular receiving module.

5. 2. The vacuum reflow soldering tool for an irregular receiving module substrate according to claim 1, wherein the pressure plate seat has an irregular groove formed therein, and a plurality of screw hole locations are provided outside the irregular groove.

6. 2. The vacuum reflow soldering tool for an irregular receiving module board as described in claim 1, characterized in that a plurality of grooves are formed in the pressure plate cover, and the grooves are arranged to correspond to the grooves formed in the pressure plate seat.

7. 2. The vacuum reflow soldering tool for a variant receiver module substrate according to claim 1, further comprising a pin pressing block assembly.

8. the pin pressure block assembly includes a top portion and a fixed portion; A vacuum reflow soldering tool for an irregular receiving module board as described in claim 7, characterized in that an irregular nut is provided on the top, the fixing part is movably connected to the top, and a bolt is provided on the lower end, and the fixing part is fixed to the bottom plate by the bolt.

9. 2. The vacuum reflow soldering tool for an irregular-shaped receiver module substrate according to claim 1, wherein the bottom plate is a rectangular parallelepiped.

10. 2. The vacuum reflow soldering tool for an irregular-shaped receiver module substrate according to claim 1, wherein the tool is used to fix the irregular-shaped receiver module.

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