Heat radiating control method of computer elements, program module and computer system
A control method and computer system technology, applied in auxiliary non-electric temperature control, temperature control using electric means, electric digital data processing, etc. Methods and products do not have appropriate methods and structures
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2010-03-31
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to a heat dissipation control method for computer components, a program module and a computer system, in particular to a heat dissipation control method, a program module and a computer system for computer components that can avoid the problem of system overheating caused by overclocking. Background technique
[0002] see figure 1 Shown is a system block diagram illustrating that the frequency and voltage level of the computer components need to be set when the existing computer system overclocks the computer components. Existing computer system 9 is to specific computer components such as: when the central processing unit 90 is overclocked, in addition to setting the required frequency in the basic input output system (BIOS) program module 91, the central processing unit also needs to be set 90 voltage level (voltage level), then the frequency adjustment circuit (such as: overclocker) 92 correspondingly adjusts the frequency of ...
Examples
Embodiment Construction
[0038] For further elaborating the technical means and effects that the present invention adopts for reaching the intended invention purpose, below in conjunction with accompanying drawing and preferred embodiment, to the heat dissipation control method of the computer component that proposes according to the present invention, program module and computer system its specific Embodiments, method steps, structural features and effects thereof are described in detail below.
[0039] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. For convenience of description, in the following embodiments, similar elements are denoted by the same numerals.
[0040] It needs to be explained in advance that the concept of the heat dissipation control method for computer components of the present invention is used for the ratio of th...